CN108931717B - High-low temperature switching test module - Google Patents
High-low temperature switching test module Download PDFInfo
- Publication number
- CN108931717B CN108931717B CN201710381665.5A CN201710381665A CN108931717B CN 108931717 B CN108931717 B CN 108931717B CN 201710381665 A CN201710381665 A CN 201710381665A CN 108931717 B CN108931717 B CN 108931717B
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- inner cavity
- heat exchange
- test
- exchange unit
- low temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
Abstract
The invention provides a high-low temperature switching test module, which comprises: the test device comprises an inner cavity, a test carrier plate, a plurality of test seats, an outer cavity, a heat exchange unit and a control unit. The inner cavity is provided with at least one air inlet channel and at least one air outlet channel, the test carrier plate is arranged in the inner cavity, and the plurality of test seats are arranged on the test carrier plate and used for placing a plurality of chips to be tested; the outer cavity body covers the upper part, the lower part and the side edges of the inner cavity body, and is provided with at least one air inlet channel and at least one air outlet channel for heating or cooling the inner cavity body; the heat exchange unit is respectively connected with the at least one air inlet channel of the inner cavity and the outer cavity; the control unit is electrically connected with the heat exchange unit; the inner cavity is internally provided with a flow guide cover which is provided with a plurality of flow guide holes for guiding the gas provided by the heat exchange unit to heat or cool the test carrier plate. Therefore, the high-low temperature test time of the chip to be tested can be greatly shortened, and the production efficiency is increased.
Description
Technical Field
The present invention relates to a high/low temperature switching test module, and more particularly, to a test module suitable for fast high/low temperature switching.
Background
Some electronic components or chip packages, such as integrated circuits, are usually mounted in a circuit formed by a plurality of main circuit components in the form of miniaturized electronic components, such as chips, to form a continuous complete circuit. In order to ensure the reliability of the integrated circuit module during use, the chip used in the integrated circuit module is mounted and is subjected to high and low temperature tests before being mounted or used. That is, the chips are operated at high and low temperatures for a long time, so that the chips which originally have defects can be quickly invalidated, and the chips with the defects are screened and eliminated.
At present, some modules for testing the chip at high and low temperatures adopt a refrigeration chip and a hot air generator to test the chip to be tested at low and high temperatures in a cavity, and because the cavity is large in size, the temperature in the cavity is not easy to change from low temperature to high temperature, the high and low temperature tests of the chip can be completed within a large amount of time, and the production efficiency is very low. In addition, the temperature change of the refrigeration chip also takes more time to be stable, so that the testing time is longer, the price of the refrigeration chip is expensive, the cost is high, the method is not ideal, and the improvement space is provided.
Based on this, the inventor, in the spirit of the active invention creation, has devised a "high/low temperature switching test module" which can solve the above problems, and finally completed the present invention through several research experiments.
Disclosure of Invention
The main objective of the present invention is to provide a high/low temperature switching test module, which can rapidly adjust and maintain the test temperature of the inner cavity, and can provide a stable and non-drifting test environment temperature and pressure for the inner cavity, thereby greatly shortening the high/low temperature test time of the chip to be tested and increasing the production efficiency. In addition, the high-low temperature switching Test module can be matched with different carriers and can be elastically configured on various types of Test classifiers (Ic Test handlers).
To achieve the above object, the high/low temperature switching test module of the present invention comprises: the test device comprises an inner cavity, a test carrier plate, a plurality of test seats, an outer cavity, a heat exchange unit and a control unit. The inner cavity is provided with at least one air inlet channel and at least one air outlet channel, the test carrier plate is arranged in the inner cavity, and the plurality of test seats are arranged on the test carrier plate and penetrate through the plurality of probes for placing a plurality of chips to be tested; the outer cavity body covers the upper part, the lower part and the side edges of the inner cavity body, and is provided with at least one air inlet channel and at least one air outlet channel for heating or cooling the inner cavity body; the heat exchange unit is respectively connected with the at least one air inlet channel of the inner cavity and the outer cavity; the control unit is electrically connected with the heat exchange unit; the inner cavity is internally provided with a flow guide cover which is provided with a plurality of flow guide holes for guiding the gas provided by the heat exchange unit to heat or cool the test carrier plate.
The flow guide holes on the flow guide cover of the inner cavity body can be respectively and correspondingly arranged above the chips to be tested, so that the testing temperature of the inner cavity body can be quickly adjusted and maintained, and the high-low temperature testing time of the chips to be tested can be greatly shortened.
The air guide sleeve of the inner cavity body can be provided with at least one partition plate, the at least one partition plate can be used for guiding the gas provided by the heat exchange unit to enter the inner cavity body from the at least one air inlet channel and then to be exhausted from the at least one exhaust channel after passing through the plurality of air guide holes, and the gas provided by the heat exchange unit can be ensured to enter the inner cavity body. That is, the gas provided by the heat exchange unit firstly enters one side of the at least one partition plate, passes through the plurality of flow guide holes of the flow guide cover and then is discharged from the other side of the at least one partition plate.
The outer cavity may include an upper cavity and a lower cavity, the upper cavity may have at least one air inlet channel and at least one air outlet channel, and the lower cavity may have at least one air inlet channel and at least one air outlet channel, that is, the upper cavity and the lower cavity have independent air inlet and exhaust respectively.
The flow guide holes on the flow guide cover of the lower cavity body can be respectively and correspondingly arranged below the chips to be tested, so that the test temperature of the inner cavity body can be quickly adjusted and maintained, and the high-low temperature test time of the chips to be tested can be greatly shortened.
The air guide sleeve of the lower cavity body can be provided with at least one partition plate, the at least one partition plate can be used for guiding the gas provided by the heat exchange unit to enter the lower cavity body from the at least one gas inlet channel and then to be exhausted from the at least one exhaust channel after passing through the plurality of air guide holes, and therefore the gas provided by the heat exchange unit can enter the lower cavity body and the adjacent area of the test carrier plate. That is, the gas provided by the heat exchange unit firstly enters one side of the at least one partition plate, passes through the plurality of flow guide holes of the flow guide cover and then is discharged from the other side of the at least one partition plate.
The upper cavity can prop against the outer side of the inner cavity through the plurality of fins to carry out heat exchange, so that the contact area of the upper cavity and the inner cavity can be increased, and the upper cavity and the inner cavity can carry out heat exchange quickly.
The upper cavity body can be provided with an air inlet and two air outlets, the air inlet is positioned in the center of the test carrier plate, and the two air outlet channels are respectively positioned at two end sides of the test carrier plate, so that heat exchange can be rapidly carried out.
The lower cavity body can be provided with an air inlet and two air outlets, the air inlet is positioned in the center of the test carrier plate, and the two air outlet channels are respectively positioned at two end sides of the test carrier plate, so that heat exchange can be rapidly carried out.
The upper cavity body can be driven by a pressure cylinder to slide up and down and is used for being closed or separated from the lower cavity body.
Drawings
Fig. 1 is a schematic diagram of a high-temperature and low-temperature switching test module according to a preferred embodiment of the invention.
FIG. 2 is a cross-sectional view of a high/low temperature switching test module according to a preferred embodiment of the invention.
Fig. 3 is a cross-sectional view of a high-temperature and low-temperature switching test module according to a preferred embodiment of the invention.
[ notation ] to show
5 upper base 6 lower base
20 inner cavity 21 air inlet channel
22 exhaust passage 25 dome
26 baffle 27 diversion hole
30 test carrier 32 test socket
34 chip 40 outer cavity to be tested
41 upper cavity 42 fin
46 lower cavity 47 air guide sleeve
48 baffle 49 diversion hole
50 heat exchange unit 60 control unit
322 probe 411 air intake passage
412 exhaust passage 461 intake passage
462 exhaust passage
Detailed Description
Fig. 1, fig. 2 and fig. 3 are a schematic diagram of a high-low temperature switching test module and two cross-sectional views with different viewing angles according to a preferred embodiment of the invention. The high and low temperature switching test module of the embodiment comprises: an inner chamber 20, an outer chamber 40 having an upper chamber 41 and a lower chamber 46, a test carrier 30, a plurality of test sockets 32, a heat exchange unit 50, and a control unit 60. The test carrier 30 is separated to form an upper cavity 41, a lower cavity 46 and an inner cavity 20, the inner cavity 20 has at least one air inlet channel 21 and at least one air outlet channel 22, a plurality of test sockets 32 are disposed on the test carrier 30 and penetrate through a plurality of probes 322 for placing a plurality of chips 34 to be tested; the outer cavity 40 composed of the upper cavity 41 and the lower cavity 46 covers the upper part, the lower part and the side of the inner cavity 20, and the upper cavity 41 and the lower cavity 46 respectively have at least one air inlet channel 411, 461 and at least one air outlet channel 412, 462 for heating or cooling the inner cavity 20.
In the present embodiment, the inner cavity 20 has two inlet channels 21 and four outlet channels 22, the two inlet channels 21 of the inner cavity 20 are close to the middle of the test carrier board 30, and the four outlet channels 22 are respectively located at two end sides of the test carrier board 30. In addition, the upper chamber 41 has an inlet channel 411 and two outlet channels 412, as shown in fig. 2, the inlet channel 411 of the upper chamber 41 is located at the center of the test carrier plate 30, and the two outlet channels 412 are located at two ends of the test carrier plate 30. In addition, the lower chamber 46 has an inlet channel 461 and two outlet channels 462, as shown in fig. 2, the inlet channel 461 of the lower chamber 46 is located at the center of the test carrier board 30, and the two outlet channels 462 are located at the two ends of the test carrier board 30 respectively.
As shown in fig. 1, the heat exchange unit 50 is connected to the two air inlet passages 21 of the inner chamber 20, the air inlet passage 411 of the upper chamber 41, and the air inlet passage 461 of the lower chamber 46, respectively; the control unit 60 is electrically connected to the heat exchange unit 50. When the gas with specific temperature and pressure is respectively filled into the inner cavity 20 and the outer cavity 40 composed of the upper cavity 41 and the lower cavity 46 through the heat exchange unit 50, since the outer cavity 40 covers the upper part, the lower part and the side of the inner cavity 20, the temperature change of the inner cavity 20 can be quickly heat exchanged through the outer cavity 40, and the inner cavity 20 can be ensured to reach and maintain the temperature set by the control unit 60. The present embodiment can complete the temperature transformation between the inner cavity 20 and the outer cavity 40 in a short time, so that the time of instantaneous temperature conversion can be greatly shortened when the chip 34 to be tested is switched between high temperature and low temperature, and the testing efficiency can be increased.
In addition, as shown in fig. 2 and 3, the inner cavity 20 has a diversion cover 25 having a plurality of diversion holes 27 thereon, and the diversion holes 27 are respectively disposed above the chips 34 to be tested, so that the diversion holes 27 can guide the gas provided by the heat exchange unit 50 to heat or cool the chips 34 to be tested on the test carrier 30 through the two gas inlet channels 21. In addition, the lower chamber 46 of the outer chamber 40 also has a flow guide cover 47 having a plurality of flow guide holes 49 thereon, and the flow guide holes 49 can guide the gas supplied from the heat exchange unit 50 to heat or cool the test carrier plate 30 through the gas inlet passage 461.
In addition, as shown in fig. 3, the baffle 25 of the inner chamber 20 has at least one partition 26, and the partition 26 can guide the gas provided by the heat exchange unit 50 to enter the inner chamber 20 through the two inlet channels 21, and then to be discharged from the four outlet channels 22 after passing through the plurality of guiding holes 27, that is, the gas provided by the heat exchange unit 50 first enters one side of the partition 26, passes through the plurality of guiding holes 27 of the baffle 25, and then is discharged from the other side of the partition 26, thereby allowing the gas provided by the heat exchange unit 50 to exert the maximum heat transfer effect. Also, because the baffle 47 of the lower chamber 46 of the outer chamber 40 also has at least one partition 48, the gas provided by the heat exchange unit 50 can be guided to enter the lower chamber 46 through the air inlet 461, pass through the plurality of baffle holes 49 and then be discharged from the air outlet 462, that is, the gas provided by the heat exchange unit 50 firstly enters one side of the partition 48, passes through the plurality of baffle holes 49 of the baffle 47 and then is discharged from the other side of the partition 48, thereby enabling the gas provided by the heat exchange unit 50 to exert the maximum heat transfer effect.
In addition, referring to fig. 1 and fig. 3, the upper cavity 41 of the outer cavity 40 is supported against the outer side of the inner cavity 20 through the plurality of fins 42 for heat exchange, so that the contact area between the upper cavity 41 and the inner cavity 20 can be increased, the heat exchange between the upper cavity 41 and the inner cavity 20 can be performed rapidly, and the temperature uniformity of the inner cavity 20 can also be ensured. Because the inner cavity 20 and the upper cavity 41 are assembled on an upper base 5, and the lower cavity 46 is assembled on a lower base 6, the upper base 5 is driven by a pressure cylinder (not shown) for being sealed with or separated from the lower base 6, that is, the inner cavity 20, the upper cavity 41 and the lower cavity 46 are driven by the pressure cylinder to be sealed or separated from each other up and down, after the inner cavity 20 is sealed with the outer cavity 40, the inner cavity 20 and the outer cavity 40 are in a sealed state, and gas with specific temperature is respectively filled into the inner cavity 20 and the outer cavity 40, so as to perform high and low temperature tests on the chip 34 to be tested.
Therefore, the present embodiment can rapidly adjust and maintain the testing temperature of the inner cavity 20, and can provide a stable and not easily drifting testing environment temperature and pressure for the inner cavity 20, thereby greatly shortening the testing time of the high and low temperature of the chip 34 to be tested and increasing the production efficiency. In addition, the high-low temperature switching Test module can be matched with different carriers and can be elastically configured on various types of Test classifiers (Ic Test handlers).
Claims (7)
1. A high-low temperature switching test module comprising:
an inner cavity with at least one air inlet channel and at least one air outlet channel;
a test carrier plate arranged in the inner cavity;
the test bases are arranged on the test carrier plate and used for placing a plurality of chips to be tested;
the outer cavity body coats the upper part, the lower part and the side edge of the inner cavity body, is provided with at least one air inlet channel and at least one air exhaust channel and is used for heating or cooling the inner cavity body;
the heat exchange unit is respectively connected with the at least one air inlet channel of the inner cavity and the at least one air inlet channel of the outer cavity; and
a control unit electrically connected to the heat exchange unit;
the inner cavity is internally provided with a flow guide cover which is provided with a plurality of flow guide holes, and the flow guide holes are respectively and correspondingly arranged above the chips to be tested and used for guiding the gas provided by the heat exchange unit to heat or cool the test carrier plate; the lower cavity body is provided with a flow guide cover which is provided with a plurality of flow guide holes for guiding the gas provided by the heat exchange unit to heat or cool the test carrier plate.
2. The switching test module according to claim 1, wherein the air guide sleeve has at least one partition for guiding the gas provided by the heat exchange unit to enter the inner chamber from the at least one inlet channel, pass through the plurality of air guide holes and then exit from the at least one outlet channel.
3. The switching test module according to claim 1, wherein the air guide sleeve has at least one partition plate for guiding the gas provided by the heat exchange unit to enter the lower chamber from the at least one inlet channel, pass through the plurality of air guide holes and then exit from the at least one outlet channel.
4. The high-low temperature switching test module according to claim 1, wherein the upper chamber is supported against the outside of the inner chamber by a plurality of fins for heat exchange.
5. The high and low temperature switching test module according to claim 1, wherein the upper chamber has an inlet and two exhausts, the inlet is located at the center of the test carrier, and the two exhausts are located at two ends of the test carrier respectively.
6. The high and low temperature switching test module according to claim 1, wherein the lower chamber has an inlet and two outlets, the inlet is located at the center of the test carrier, and the two outlets are located at two ends of the test carrier.
7. The high and low temperature switching test module according to claim 1, wherein the upper chamber is driven by a pressure cylinder for sealing with or separating from the lower chamber.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710381665.5A CN108931717B (en) | 2017-05-25 | 2017-05-25 | High-low temperature switching test module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710381665.5A CN108931717B (en) | 2017-05-25 | 2017-05-25 | High-low temperature switching test module |
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| CN108931717A CN108931717A (en) | 2018-12-04 |
| CN108931717B true CN108931717B (en) | 2021-10-08 |
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| CN110133469A (en) * | 2019-05-31 | 2019-08-16 | 德淮半导体有限公司 | Semiconductor testing apparatus and its working method |
| CN111721440A (en) * | 2020-05-28 | 2020-09-29 | 武汉华工正源光子技术有限公司 | High-low temperature test system of optical module |
| CN113432835B (en) * | 2021-06-03 | 2023-06-13 | 厦门特仪科技有限公司 | Multi-cavity high-low temperature testing device and system with same |
| CN113777466A (en) * | 2021-07-29 | 2021-12-10 | 杭州长川科技股份有限公司 | Testing device |
| CN113640648A (en) * | 2021-07-31 | 2021-11-12 | 深圳市优界科技有限公司 | High-low temperature heat flow instrument for chip reliability test |
| CN114690024B (en) * | 2022-05-31 | 2022-08-26 | 广东东博自动化设备有限公司 | Full-automatic chip testing machine |
| CN116559631B (en) * | 2023-07-05 | 2023-08-29 | 深圳诺信微科技有限公司 | Test system of integrated circuit chip |
| CN117169699B (en) * | 2023-11-02 | 2024-01-26 | 安盈半导体技术(常州)有限公司 | Chip high-low temperature test equipment |
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| CN108931717A (en) | 2018-12-04 |
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