CN116559631B - Test system of integrated circuit chip - Google Patents
Test system of integrated circuit chip Download PDFInfo
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- CN116559631B CN116559631B CN202310819120.3A CN202310819120A CN116559631B CN 116559631 B CN116559631 B CN 116559631B CN 202310819120 A CN202310819120 A CN 202310819120A CN 116559631 B CN116559631 B CN 116559631B
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- 238000012360 testing method Methods 0.000 title claims abstract description 184
- 238000002955 isolation Methods 0.000 claims abstract description 42
- 238000005192 partition Methods 0.000 claims description 7
- 206010044048 Tooth missing Diseases 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 14
- 238000001514 detection method Methods 0.000 abstract description 6
- 230000001105 regulatory effect Effects 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2862—Chambers or ovens; Tanks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a test system of an integrated circuit chip, which relates to the technical field of chip test and comprises the following components: the test box is internally and transversely provided with a baffle plate, an isolation box is vertically connected with the baffle plate and the test box, two test cavities are defined among the baffle plate, the isolation box and the test box, and two switch openings are formed in the isolation box; the chip testing device is arranged on each sliding cabinet; the switch mechanism is used for closing or opening the mounting port; the temperature adjusting mechanism comprises a temperature control device, an air supply pipe and two return air pipes; the adjusting plate is slidably arranged in the test box; the rotating mechanism comprises a driving rotating shaft and a second gear. According to the scheme, automatic switching of the circulating gas circuit of the test cavity is finally realized in the switching process of the left station and the right station of the regulating plate, loss of hot gas is reduced, and uninterrupted detection is facilitated.
Description
Technical Field
The present invention relates to the field of chip testing technologies, and in particular, to a testing system for an integrated circuit chip.
Background
The chip is a generic term of semiconductor products, after the chip is molded and before the chip is assembled on an integrated circuit, quality detection needs to be performed on the chip to meet the quality of the chip assembled on the integrated circuit, and when the chip is tested, high-temperature and low-temperature tests need to be performed to judge whether the chip is qualified after production.
In the prior art, a chip testing apparatus is disclosed. For example, application number: 2018101712641 discloses a semiconductor wide temperature test method, wherein a chip test device is also disclosed. The device comprises an elevator, a drawer type finished chip loading device, a daughter board, a finished chip testing interface board and a heat flow cover; there are 4 fixed columns on the side of the finished chip test interface board, the daughter board is fixed on 4 fixed columns, the daughter board is located above the finished chip test interface board, the finished chip test interface board and the daughter board are connected by using a flat cable or a shielding wire for resource connection, a socket for loading the finished chip is welded in the central area of the daughter board, an elevator is arranged below the socket and connected between the socket and the finished chip test interface board, a drawer type finished chip loading device is arranged in the elevator and can move up and down in the elevator, the heat flow cover is directly covered on the daughter board and is fixedly sealed, and the purpose that batch finished products can be tested at high and low temperatures only by setting the heat flow cover once is achieved without moving the heat flow cover is achieved.
When the device tests the chip, each time a single-cavity test is adopted during the chip test, after the test is completed, the temperature control equipment needs to be closed, after the temperature in the test range is completely reduced to a safe temperature after the temperature is closed, the switch equipment can be opened, when the chip enters and exits the test cavity, the waiting time is long, the temperature loss in the test range is high, and the inventor considers how to realize the isolation of the test space in the state that the temperature control equipment is not stopped, so that the heat loss in the test range is reduced to be researched.
Therefore, it is necessary to provide a test system for an integrated circuit chip to solve the above technical problems.
Disclosure of Invention
The invention provides a test system of an integrated circuit chip, which solves the problems of how to realize isolation of a test space and reduce heat loss in a test range under the condition that temperature control equipment is not stopped in the related technology.
In order to solve the above technical problems, the test system for an integrated circuit chip provided by the present invention includes:
the test box is internally and transversely provided with a baffle plate, an isolation box is vertically connected with the baffle plate and the test box, and two test cavities are defined among the baffle plate, the isolation box and the test box;
the device comprises two sliding cabinets, wherein each sliding cabinet is provided with a chip testing device, one sliding cabinet is arranged in a corresponding testing cavity and is in sliding connection with the testing box, two mounting ports are formed in the testing box, two switch ports are formed in the isolation box, and the mounting ports, the switch ports and the sliding cabinets are arranged in a one-to-one correspondence;
the switch mechanism is used for closing or opening the mounting port;
the temperature adjusting mechanism comprises a temperature control device, an air supply pipe and two air return pipes, one end of the air supply pipe is communicated with the temperature control device, the other end of the air supply pipe is communicated with the top end of the isolation box, one air return pipe is communicated with the temperature control device and a corresponding testing cavity, and the two air return pipes are symmetrically arranged relative to the isolation box;
the adjusting plate is slidably arranged in the test box and is suspended above any sliding cabinet, one end of the adjusting plate seals one return air pipe corresponding to the sliding cabinet, the other end of the adjusting plate extends into the isolation box from one switch port corresponding to the sliding cabinet, and the adjusting plate seals the switch port;
the rotating mechanism comprises a driving rotating shaft and a second gear, the driving rotating shaft is rotatably arranged in the isolation box, and the second gear is fixedly arranged on the driving rotating shaft; the bottom of the adjusting plate is provided with a plurality of teeth, and the teeth are meshed with the second gear;
the driving device is used for driving the driving rotating shaft and the second gear to rotate, so that the adjusting plate is driven to switch between the upper parts of the two sliding cabinets, and state switching of the two testing cavities is achieved.
Preferably, the switch mechanism comprises a lifting assembly and two switch plates, wherein the switch plates are slidably mounted in the test box, and one switch plate is used for closing or opening a corresponding mounting port.
Preferably, the lifting assembly comprises a motor, a driving gear, two driven gears and two screw rods, wherein the motor is mounted on the top of the test box in an embedded manner, and the shaft end of the motor is fixed with the driving gear;
one end of one screw rod penetrates through one corresponding switch plate and is in threaded connection with the switch plate; the other end of one screw rod penetrates through the test box and then is connected with a corresponding driven gear, and the driving gear is positioned between the two driven gears and meshed with each driven gear; the screw threads of the two screw rods are opposite in direction, and each screw rod and the corresponding mounting port are arranged in a staggered mode.
Preferably, the transmission ratio of the driving gear to the driven gear is 1:1.
Preferably, the test system of the integrated circuit chip further comprises a sliding rail, the sliding rail is fixedly arranged in the test cavity, and the sliding cabinet is slidably mounted in the test box through the sliding rail.
Preferably, a sliding plate is arranged on the outer wall of the sliding cabinet, the sliding plate is in sliding connection with the sliding rail, a driving screw rod is arranged in the sliding rail, and the driving screw rod sequentially penetrates through the sliding plate and the test box and then is connected with a driving shaft of a driving motor; the driving motor is arranged on the outer wall of the test box, and the driving screw rod is in threaded connection with the sliding plate.
Preferably, the driving device comprises an L-shaped toothed plate and a first gear, the outer wall of the isolation box is provided with a sliding groove structure, the L-shaped toothed plate is slidably arranged in the sliding groove structure, and the top end of the L-shaped toothed plate is connected with one switch plate;
one end of the driving rotating shaft is connected with the second gear in the isolation box, and the other end of the driving rotating shaft penetrates through the isolation box, then stretches into the sliding groove structure and is connected with the first gear; the teeth of the first gear are aligned with the teeth of the L-shaped toothed plate, and the L-shaped toothed plate is of a tooth missing structure.
Preferably, the diameter of the second gear is twice the diameter of the first gear.
Preferably, the temperature control device is installed in the test box and located at the bottom of the partition plate, the air supply pipe penetrates through the test box and is communicated with the temperature control device, and the air return pipe penetrates through the test box and is communicated with the temperature control device.
Compared with the related art, the test system of the integrated circuit chip provided by the invention has the following beneficial effects:
in the process of controlling the second gear to rotate by the driving rotating shaft, the adjusting plate is adjusted in the range of the two test cavities, after the adjusting plate is completely switched into any one of the test cavities, the upper part of the test cavity is preserved, the loss of hot gas caused by the replacement of the test piece is reduced, and when the adjusting plate is switched to the left station, the switch port of the right station is automatically opened for providing a temperature detection environment for the finished chip of the right station; the automatic switching of the circulating gas circuit of the test cavity is realized, and finally, the automatic switching of the circulating gas circuit of the test cavity is realized in the switching process of the left station and the right station of the regulating plate, the loss of hot gas is reduced, and the two sets of finished chips are conveniently and sequentially tested in the state that the temperature control device is not stopped.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a three-dimensional diagram of a test system for an integrated circuit chip provided by the present invention;
FIG. 2 is a cross-sectional view of the portion B-B shown in FIG. 1;
FIG. 3 is an elevation view of the adjustment plate of FIG. 2 moved to a left station;
FIG. 4 is a cross-sectional view of section A-A shown in FIG. 1;
FIG. 5 is a top view of the first gear shown in FIG. 4;
FIG. 6 is a system block diagram of an in-cabinet testing system provided by the present invention;
FIG. 7 is a cross-sectional view of the portion C-C shown in FIG. 4;
FIG. 8 is a schematic view of the structure of the sliding cabinet shown in FIG. 7 in a contracted state;
FIG. 9 is a schematic diagram of a testing system for an integrated circuit chip according to the present invention, wherein (a 1) is a front view of a left-hand switch board in an off state, (a 2) is a front view of the left-hand switch board in an up-moving process, (a 3) is a front view of the left-hand switch board in an on state, (b 1) is a front view of an adjusting board in a (a 1) state, (b 2) is a front view of the adjusting board in a (a 2) state, and (b 3) is a front view of the adjusting board in a (a 3) state;
fig. 10 is a schematic diagram of the state switching of the L-shaped toothed plate in fig. 9, wherein (c 1) is a front view of the L-shaped toothed plate in the state of (a 1), (c 2) is a front view of the L-shaped toothed plate after the first stage of the L-shaped toothed plate is moved up in the process of (a 1) to (a 2), (c 3) is a front view of the L-shaped toothed plate after the second stage of the L-shaped toothed plate is moved up in the process of (a 1) to (a 2), (c 4) is a front view of the L-shaped toothed plate after the second stage of the L-shaped toothed plate is moved up in the process of (a 1) to (a 2), and (c 5) is a front view of the L-shaped toothed plate after the third stage of the L-shaped toothed plate is moved up in the state of (a 3).
Reference numerals illustrate:
1. a test box; 101. a mounting port; 11. an isolation box; 102. a test chamber; 103. a switch port; 12. a partition plate;
2. a switching mechanism;
4. a sliding cabinet;
5. a temperature adjusting mechanism;
51. a temperature control device; 52. an air supply pipe; 53. an air return pipe;
6. a rotating mechanism; 63. driving the rotating shaft; 64. a second gear;
7. an adjusting plate;
21. a switch board; 22. a lifting assembly;
3. a slide rail;
31. a driving motor; 32. driving a screw rod; 33. a slide plate;
111. a sliding groove structure;
221. a motor; 222. a drive gear; 223. a driven gear; 224. a screw rod;
61. an L-shaped toothed plate; 62. a first gear.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides a test system of an integrated circuit chip.
Referring to fig. 1 to 2 in combination, in an embodiment of the invention, a testing system for an integrated circuit chip includes:
the test box 1 is internally and transversely provided with a partition plate 12, an isolation box 11 is vertically connected with the partition plate 12 and the test box 1, and two test cavities 102 are defined among the partition plate 12, the isolation box 11 and the test box 1;
the two sliding cabinets 4 are respectively provided with a chip testing device, one sliding cabinet 4 is arranged in a corresponding testing cavity 102 and is in sliding connection with the testing box 1, two mounting ports 101 are formed in the testing box 1, two switch ports 103 are formed in the isolation box 11, and the mounting ports 101, the switch ports 103 and the sliding cabinets 4 are arranged in a one-to-one correspondence;
a switch mechanism 2, wherein the switch mechanism 2 is used for closing or opening the mounting port 101;
the temperature adjusting mechanism 5 comprises a temperature control device 51, an air supply pipe 52 and two air return pipes 53, wherein one end of the air supply pipe 52 is communicated with the temperature control device 51, the other end of the air supply pipe 52 is communicated with the top end of the isolation box 11, one air return pipe 53 is communicated with the temperature control device 51 and a corresponding test cavity 102, and the two air return pipes 53 are symmetrically arranged about the isolation box 11;
the adjusting plate 7 is slidably installed in the test box 1 and is suspended above any sliding cabinet 4, one end of the adjusting plate 7 seals one return air pipe 53 corresponding to the sliding cabinet 4, the other end of the adjusting plate 7 extends into the isolation box 11 from one switch port 103 corresponding to the sliding cabinet 4, and the adjusting plate 7 seals the switch port 103;
the rotating mechanism 6 comprises a driving rotating shaft 63 and a second gear 64, the driving rotating shaft 63 is rotatably arranged in the isolation box 11, and the second gear 64 is fixedly arranged on the driving rotating shaft 63; the bottom of the adjusting plate 7 is provided with a plurality of teeth, and the teeth are meshed with the second gear 64;
the driving device is used for driving the driving shaft 63 and the second gear 64 to rotate, so as to drive the adjusting plate 7 to switch between the upper sides of the two sliding cabinets 4, thereby realizing the state switching of the two testing chambers 102.
Referring to fig. 6, in this embodiment, the chip testing device includes a PLC control module, a temperature sensor, a tester module, and a chip socket module;
the chip socket module is used for installing a plurality of integrated circuit chips (finished chips);
the temperature sensor is used for detecting the ambient temperature of the finished chips in the sliding cabinet 4;
the tester module is in signal connection with the chip socket module and is used for detecting the working performance of the finished chip.
The PLC control module is in signal connection with the temperature sensor and the tester module; when the temperature sensor detects that the ambient temperature in the sliding cabinet 4 reaches a preset temperature value, the PLC control module is used for starting the tester module.
As a preferable mode of the present embodiment, the chip-socket module is built-in with a pressure detecting unit for detecting whether a finished chip is mounted.
Specifically, after the finished chip is mounted to the chip socket module on the slide case 4; the finished chips are driven to be conveyed into the test cavity 102 from the mounting port 101 through the sliding cabinet 4; closing the corresponding mounting port 101, simulating the high-low temperature environment in the test cavity 102, and detecting the electrical performance of the finished chip through the tester module after the simulation and test of the set temperature, so as to finally obtain test data.
The temperature control device 51 inputs a heat source air flow or a cold source air flow into the test cavity 102 through the air supply pipe 52, so as to realize high and low temperature environment simulation of the integrated circuit chip in the test cavity 102.
The temperature control device 51 is internally provided with a refrigerating mechanism and a heating mechanism, and the refrigerating mechanism adopts a compressor special for a low-temperature test box and provides support for a low-temperature test environment at 0 to minus 50 ℃; the heating mechanism adopts special electric heating equipment of a high-temperature test box, and provides support for a high-temperature test environment at 0 to +80 ℃.
As shown in fig. 2, in this embodiment, the adjusting plate 7 is located within the testing cavity 102 of the right station, and the switch opening 103 of the right station is in a closed state; the switch 103 of the left station is in an open state, the test cavity 102 of the left station is in a passage state, and can normally supply air (hot air or cold air) for the high and low temperature test environment adjustment of the chip to provide support.
Referring to fig. 2 and fig. 3 in combination, in the process of controlling the rotation of the second gear 64 by the driving shaft 63, the adjusting plate 7 adjusts in the range of two test chambers 102, after the two test chambers 102 are completely switched into any one of the test chambers 102, the hot air in the upper part of the test chamber 102 is saved, the hot air loss caused by the replacement of the wafer after the test is reduced, and when the adjusting plate 7 is switched to the left station, the switch port 103 of the right station is automatically opened for providing a temperature detection environment for the finished chips in the right station; the automatic switching of the circulating gas circuit of the test cavity 102 is realized, and finally, the automatic switching of the circulating gas circuit of the test cavity 102 is realized in the switching process of the left station and the right station of the regulating plate 7, the loss of hot gas is reduced, and the two sets of finished chips are conveniently and sequentially tested in the state that the temperature control device 51 is not stopped.
Referring to fig. 1 and 4 in combination, the switch mechanism 2 includes a lifting assembly 22 and two switch plates 21, wherein the switch plates 21 are slidably mounted in the test box 1, and one switch plate 21 is used for closing or opening a corresponding one of the mounting ports 101. The lifting assembly 22 drives the two switch plates 21 to lift and lower one by one respectively so as to close one of the mounting ports 101 and open the other mounting port 101.
In an embodiment, the lifting assembly 22 may be a hydraulic telescopic cylinder for driving the switch board 21 to lift; the lifting assembly 22 may also be a telescopic cylinder.
Referring to fig. 4, in another embodiment, the lifting assembly 22 may include a motor 221, a driving gear 222, two driven gears 223, and two screw rods 224, where the motor 221 is mounted on the top of the test box 1 in a inlaid manner, and the shaft end of the motor 221 is fixed to the driving gear 222;
one end of one screw 224 penetrates through the corresponding one switch plate 21 and is in threaded connection with the switch plate 21; the other end of one screw 224 penetrates through the test box 1 and then is connected with a corresponding driven gear 223, and the driving gear 222 is positioned between the two driven gears 223 and meshed with each driven gear 223; the screw threads of the two screw rods 224 are opposite in direction, and each screw rod 224 is arranged in a staggered manner with a corresponding mounting port 101.
The motor 221 drives the driving gear 222 to rotate, so that the driven gears 223 on two sides are conveniently and synchronously driven to rotate in the same direction, the two screw rods 224 rotate in the same direction, and the two switch plates 21 are respectively driven to rise and fall, so that the adjustment of the two switch plates 21 is synchronously controlled by single power.
Each screw 224 and a corresponding mounting port 101 are arranged in a staggered manner, that is, the screw 224 is located at one side of the mounting port 101, and the screw 224 does not block the sliding of the sliding cabinet 4 corresponding to the mounting port 101 or the sliding of the sliding cabinet 4 out of the mounting port 101.
In the present embodiment, the transmission ratio of the driving gear 222 to the driven gear 223 is 1:1.
The driving gear 222 conveniently and synchronously drives the two driven gears 223 to rotate, the rotation speed and the rotation direction are the same, and the stability of the two switch plates 21 in one rise and one fall is ensured.
Referring to fig. 4 again, the testing system of the integrated circuit chip further includes a sliding rail 3, the sliding rail 3 is fixedly disposed in the testing cavity 102, and the sliding cabinet 4 is slidably mounted in the testing box 1 through the sliding rail 3.
The sliding cabinet 4 can guarantee the stability of sliding support of the sliding cabinet 4 on the test box 1.
Referring to fig. 7 and 8 in combination, a sliding plate 33 is disposed on an outer wall of the sliding cabinet 4, the sliding plate 33 is slidably connected with the sliding rail 3, a driving screw 32 is disposed in the sliding rail 3, and the driving screw 32 sequentially penetrates through the sliding plate 33 and the testing box 1 and then is connected with a driving shaft of a driving motor 31; the driving motor 31 is mounted on the outer wall of the test box 1, and the driving screw 32 is in threaded connection with the sliding plate 33.
Through driving motor 31 and lead screw structure, the convenient drive smooth cabinet 4 is automatic stretches into or stretches out the mounting port 101, reduces manual operation's step, simple operation.
In one embodiment, the driving shaft 63 may be directly driven by a motor.
In another embodiment, the driving shaft 63 may be driven synchronously while being lifted by the switch board 21.
Specifically, referring to fig. 5, 4 and 3 in combination, the driving device includes an L-shaped toothed plate 61 and a first gear 62, a sliding groove structure 111 is disposed on an outer wall of the isolation box 11, the L-shaped toothed plate 61 is slidably mounted in the sliding groove structure 111, and a top end of the L-shaped toothed plate 61 is connected to one of the switch plates 21;
one end of the driving rotating shaft 63 is connected with the second gear 64 in the isolation box 11, and the other end of the driving rotating shaft 63 penetrates through the isolation box 11, then stretches into the sliding groove structure 111, and is connected with the first gear 62; wherein, the teeth of the first gear 62 are aligned with the teeth of the L-shaped toothed plate 61, and the L-shaped toothed plate 61 has a tooth missing structure.
Preferably, the diameter of the second gear 64 is twice the diameter of the first gear 62.
The two switch plates 21 can move synchronously towards the opening side of the switch plates 21 while being adjusted in a lifting mode, so that the position switching and the air inlet direction switching of the two switch plates 21 are finally realized in the switching process of the switch states of the two switch plates 21.
Referring to fig. 10, in the present embodiment, the upward movement process of the L-shaped toothed plate 61 is divided into three sections:
referring to fig. 10 (c 1) and (c 2), the first section of the L-shaped toothed plate 61 moves upward, the L-shaped toothed plate 61 and the first gear 62 are in a non-engaged state before the upward movement, and after the upward movement, the L-shaped toothed plate 61 is aligned with the first gear 62 and starts to engage;
referring to fig. 10 (c 2), (c 3) and (c 4), the second section of the L-shaped toothed plate 61 moves upward, and the L-shaped toothed plate 61 is in engagement with the first gear 62; in the process of upward movement, the L-shaped toothed plate 61 drives the first gear 62 to rotate, and the first gear 62 drives the second gear 64 to rotate through the driving rotating shaft 63, so as to control the adjusting plate 7 to move left;
referring to fig. 10 (c 4) and (c 5), the third section of the L-shaped toothed plate 61 is moved upward, and before the upward movement, the L-shaped toothed plate 61 is aligned with the first gear 62 and is about to be separated; after the upward movement, the L-shaped toothed plate 61 is in a non-meshed state with the first gear 62.
The specific adjustment principles of the switch board 21 and the adjustment board 7 refer to the working principles of the present invention hereinafter, and will not be described in detail herein.
Referring to fig. 2 again, the temperature control device 51 is installed in the test box 1 and located at the bottom of the partition 12, the air supply pipe 52 penetrates through the test box 1 and is in communication with the temperature control device 51, and the air return pipe 53 penetrates through the test box 1 and is in communication with the temperature control device 51.
The above structure is convenient for the temperature control device 51 to be integrally installed in the test box 1.
In this embodiment, the front surface of the test box 1 is further provided with a cabinet door structure, and the cabinet door structure is aligned to the installation range of the temperature control device 51, so as to facilitate the overhaul and maintenance of the temperature control device 51.
Referring to fig. 2 again, in the present embodiment, a plurality of through holes (not shown) are formed in the bottom wall of the sliding cabinet 4. To allow a test air flow to pass up and down through the interior of the slide case 4 so that the air flow can be rapidly distributed within the test chamber 102.
In an alternative implementation of this embodiment, a water cooling device may also be installed below the sliding cabinet 4. The water cooling equipment is used for carrying out quick water cooling on the range of the sliding cabinet 4 under the closing state of the adjusting plate 7, so that the chip is taken out after the sliding cabinet 4 is cooled down after passing the temperature test (used for using the high-temperature test environment of the chip).
In a preferred mode of this embodiment, the return air duct 53 is provided with a filtering device (a high temperature resistant dust removing filtering structure) for filtering dust particles in the air.
The working principle of the test system of the integrated circuit chip provided by the invention is as follows:
the finished chip is inserted into the chip socket module in the sliding cabinet 4, the chip socket module is connected into the tester module through the PLC control module, the temperature sensor is used for monitoring the environmental temperature of the finished chip in real time, temperature data are transmitted to the PLC control module, and whether the temperature data reach the preset test temperature and time is judged through the PLC control module;
when the preset temperature and time are reached, the PLC control module controls the tester module to start the power-on test on the finished chip on the chip socket module, and whether the finished chip can normally run after the temperature test is carried out is judged.
By definition, the left side of the test chamber 102 is the left station and the right side of the test chamber 102 is the right station.
Referring to fig. 9 (a 1), (b 1) and fig. 10 (c 1), when the test system of the integrated circuit chip is in the first use state (initial state):
finished chips are installed in the sliding cabinet 4 of the left station, finished chips can also be installed in the sliding cabinet 4 of the right station (and the sliding cabinet 4 of the right station is located in the corresponding testing cavity 102).
Relative left station:
the switch board 21 is in a state of closing the mounting port 101, the test chamber 102, the isolation box 11, the air supply pipe 52 and the air return pipe 53 are in a passage state, and allow circulation of hot air (or cold air) for testing the integrated circuit chip in the state that the mounting port 101 is closed;
relative right station:
the switch board 21 is in a state of opening the mounting port 101, the adjusting board 7 is isolated from the test cavity 102, the return air pipe 53 is in a closed state, the corresponding switch port 103 is in a closed state, the adjusting board 7 divides the test cavity 102 into an upper part and a lower part, the upper part is sealed and preserved by hot air, and the lower part of hot air can be discharged and cooled through the opened mounting port 101 for cooling, exhausting and changing chips of the integrated circuit chip in the opened state of the mounting port 101;
wherein the first gear 62 is located at the top of the L-shaped toothed plate 61, and both are in a non-engaged state.
When the temperature control device 51 is started, the air supply pipe 52 circulates and supplies air (hot air or cold air used for testing) to the left position within the testing cavity 102 through the inside of the isolation box 11 and the switch opening 103 of the left position, so as to provide a detection environment of a preset temperature for testing the finished chip at the left position.
Referring to fig. 9 (a 1) to (a 2) and (b 1) to (b 2), after the testing of the finished chips at the left station is completed, the motor 221 is started, the driving gear 222 rotates clockwise, the driven gears 223 rotate counterclockwise, the screws 224 rotate counterclockwise, the switch plate 21 at the left station moves upward, and the switch plate 21 at the right station moves downward;
as shown in (c 1) to (c 2) of fig. 10, during adjustment of the two switch plates 21, the L-shaped toothed plate 61 moves upward and the toothed portion gradually approaches the first gear 62, enabling switching of the stations of the adjustment plate 7 to be started only when both of the mounting ports 101 are in the closed state;
as shown in (c 2) to (c 3) in fig. 10, when the L-shaped toothed plate 61 continues to move upwards, the toothed portion of the L-shaped toothed plate 61 starts to drive the first gear 62, the driving shaft 63 and the second gear 64 to rotate anticlockwise, and the second gear 64 drives the adjusting plate 7 to move leftwards through the engaged toothed teeth (during the left movement of the adjusting plate 7, the adjusting plate completely passes through the isolation box 11; the return air pipe 53 blocked at the two switch ports 103, and the right station is automatically opened);
referring to fig. 9 (a 2), (b 2) and fig. 10 (c 3), when the test system of the integrated circuit chip is in a transition state:
relative left station:
the switch plate 21 is in a state of closing the mounting port 101, the corresponding switch port 103 is in a closed state, the test chamber 102, the isolation box 11 and the air supply pipe 52 are in a non-communication state, and the circulation of hot air (or cold air) is not allowed, so that the test area is switched under the closed state of the mounting port 101;
relative right station:
the switch plate 21 is in a state of closing the mounting port 101, the corresponding switch port 103 is in a closed state, the test chamber 102, the isolation box 11 and the air supply pipe 52 are in a non-communication state, and the circulation of hot air (or cold air) is not allowed, so that the test area is switched under the closed state of the mounting port 101;
wherein the first gear 62 is located at the tooth portion of the L-shaped toothed plate 61, and both are in a meshed state.
Referring to fig. 9 (a 2) to (a 3) and (b 2) to (b 3), when the motor 221 continues to drive the two switch plates 21 to rise and fall, the adjusting plate 7 continues to move left;
as shown in (c 3) to (c 4) of fig. 10, when the L-shaped toothed plate 61 moves up and gradually separates from the first gear 62, the adjusting plate 7 moves left and plugs the test cavity 102 of the left station, and controls the switch opening 103 of the right station to be opened automatically;
as shown in (c 4) to (c 5) of fig. 10, while the L-shaped toothed plate 61 continues to move upward, the toothed portion of the L-shaped toothed plate 61 is completely separated from the first gear 62, and the switch plate 21 of the left station opens the switch port 103 of the left station;
referring to fig. 10 (c 2), (c 3) and (c 4), the adjusting plate 7 is in a moving adjusting state, and both the switch ports 103 are in a closed state, so that the adjusting plate 7 does not leak air to the outside of the apparatus during switching;
referring to fig. 9 (a 3), (b 3) and fig. 10 (c 5), when the testing system of the integrated circuit chip is in the second use state:
relative left station:
the switch board 21 is in a state of opening the mounting port 101, the adjusting board 7 is isolated from the test cavity 102, the return air pipe 53 is in a closed state, the corresponding switch port 103 is in a closed state, the test cavity 102 is divided into an upper part and a lower part, the upper part is sealed and preserved, and the lower part of hot air can be discharged and cooled through the opened mounting port 101 for cooling, exhausting and changing chips of the integrated circuit chip in the opened state of the mounting port 101;
relative right station:
the switch board 21 is in a state of closing the mounting port 101, the switch port 103 is in an open state, the test chamber 102, the isolation box 11, the air supply pipe 52 and the air return pipe 53 are in a passage state, and allow circulation of hot air (or cold air) for testing the integrated circuit chip in the state that the mounting port 101 is closed;
wherein the first gear 62 is located at the bottom of the L-shaped toothed plate 61, and both are in a non-engaged state.
In the process of switching the adjusting plate 7 from the right station to the left station, the adjusting plate 7 separates the testing cavity 102 of the left station into an upper part and a lower part, the hot air (cold air) of the upper part is in a closed storage state, and the hot air (cold air) of the lower part is in an open state, so that the preservation of the hot air of the upper part in the testing cavity 102 is realized, and the hot air loss caused by film changing after testing is reduced.
When the adjusting plate 7 is completely switched, the switch opening 103 is opened and communicated towards the testing cavity 102 of the right station, and is used for providing a temperature detection environment for the finished chip of the right station; the automatic switching of the switch port 103 from the left station circulating air path to the right station circulating air path is realized.
Finally, the two switch plates 21 complete the switching of the isolating stations of the adjusting plate 7 in the one-on-one-off adjustment process, and the direction of the circulating gas path of the switch port 103 is automatically switched while the switching is performed.
After the switch board 21 of the left station is opened, the adjusting board 7 cuts off the testing cavity 102 of the left station for protection, reduces the loss of hot air in the range of the testing cavity 102 of the left station, and can complete the test of two sets of finished chips in sequence in the state that the temperature control device 51 is not stopped.
The test system of the integrated circuit chip can be provided with two groups, one group is specially used for refrigeration test, and the other group is specially used for heating test, so that the refrigeration and heating modes of the equipment do not need to be switched, and the operation without shutdown is convenient.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the specification and drawings of the present invention or direct/indirect application in other related technical fields are included in the scope of the present invention.
Claims (6)
1. A system for testing an integrated circuit chip, comprising:
the test box is internally and transversely provided with a baffle plate, an isolation box is vertically connected with the baffle plate and the test box, and two test cavities are defined among the baffle plate, the isolation box and the test box;
the device comprises two sliding cabinets, wherein each sliding cabinet is provided with a chip testing device, one sliding cabinet is arranged in a corresponding testing cavity and is in sliding connection with the testing box, two mounting ports are formed in the testing box, two switch ports are formed in the isolation box, and the mounting ports, the switch ports and the sliding cabinets are arranged in a one-to-one correspondence;
the switch mechanism is used for closing or opening the mounting port;
the temperature adjusting mechanism comprises a temperature control device, an air supply pipe and two air return pipes, one end of the air supply pipe is communicated with the temperature control device, the other end of the air supply pipe is communicated with the top end of the isolation box, one air return pipe is communicated with the temperature control device and a corresponding testing cavity, and the two air return pipes are symmetrically arranged relative to the isolation box;
the adjusting plate is slidably arranged in the test box and is suspended above any sliding cabinet, one end of the adjusting plate seals one return air pipe corresponding to the sliding cabinet, the other end of the adjusting plate extends into the isolation box from one switch port corresponding to the sliding cabinet, and the adjusting plate seals the switch port;
the rotating mechanism comprises a driving rotating shaft and a second gear, the driving rotating shaft is rotatably arranged in the isolation box, and the second gear is fixedly arranged on the driving rotating shaft; the bottom of the adjusting plate is provided with a plurality of teeth, and the teeth are meshed with the second gear;
the driving device is used for driving the driving rotating shaft and the second gear to rotate, so that the adjusting plate is driven to switch between the upper parts of the two sliding cabinets, and the state switching of the two testing cavities is realized;
the switch mechanism comprises a lifting assembly and two switch plates, wherein the switch plates are slidably arranged in the test box, and one switch plate is used for closing or opening a corresponding mounting port;
the lifting assembly comprises a motor, a driving gear, two driven gears and two screw rods, wherein the motor is embedded and installed at the top of the test box, and the shaft end of the motor is fixed with the driving gear;
one end of one screw rod penetrates through one corresponding switch plate and is in threaded connection with the switch plate; the other end of one screw rod penetrates through the test box and then is connected with a corresponding driven gear, and the driving gear is positioned between the two driven gears and meshed with each driven gear; the screw threads of the two screw rods are opposite in direction, and each screw rod and a corresponding mounting port are arranged in a staggered manner;
the driving device comprises an L-shaped toothed plate and a first gear, the outer wall of the isolation box is provided with a sliding groove structure, the L-shaped toothed plate is slidably arranged in the sliding groove structure, and the top end of the L-shaped toothed plate is connected with one switch plate;
one end of the driving rotating shaft is connected with the second gear in the isolation box, and the other end of the driving rotating shaft penetrates through the isolation box, then stretches into the sliding groove structure and is connected with the first gear; the teeth of the first gear are aligned with the teeth of the L-shaped toothed plate, and the L-shaped toothed plate is of a tooth missing structure.
2. The integrated circuit chip testing system of claim 1, wherein a transmission ratio of the driving gear to the driven gear is 1:1.
3. The system of claim 2, further comprising a slide rail, wherein the slide rail is fixedly disposed in the test cavity, and wherein the slide cabinet is slidably mounted in the test box via the slide rail.
4. The integrated circuit chip test system according to claim 3, wherein a slide plate is arranged on the outer wall of the slide cabinet, the slide plate is in sliding connection with the slide rail, a driving screw rod is arranged in the slide rail, and the driving screw rod penetrates through the slide plate and the test box in sequence and then is connected with a driving shaft of a driving motor; the driving motor is arranged on the outer wall of the test box, and the driving screw rod is in threaded connection with the sliding plate.
5. The integrated circuit chip testing system of claim 4, wherein the diameter of the second gear is twice the diameter of the first gear.
6. The integrated circuit chip testing system of claim 5, wherein the temperature control device is mounted in the test box and located at the bottom of the partition, the air supply pipe extends through the test box and communicates with the temperature control device, and the air return pipe extends through the test box and communicates with the temperature control device.
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| CN117169699B (en) * | 2023-11-02 | 2024-01-26 | 安盈半导体技术(常州)有限公司 | Chip high-low temperature test equipment |
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