CN219496570U - Semiconductor device testing device - Google Patents

Abstract

The utility model discloses a semiconductor device testing device which comprises a testing box, wherein a testing cavity and a cooling cavity are formed in the testing box, the cooling cavity is positioned on the right side of the testing cavity and is communicated with the inside of the testing cavity, a through groove is formed in the inner wall of the cooling cavity, the inside of the through groove is communicated with the inside of the testing cavity, a servo motor is fixedly arranged on the left side of the testing box, and an output shaft of the servo motor penetrates through and extends to the inside of the testing cavity. According to the utility model, the semiconductor device subjected to the high-temperature test can be cooled by arranging the cooling cavity, so that the semiconductor device subjected to the high-temperature test can be quickly taken out for test checking, whether the semiconductor device can be continuously used for judging whether the heat resistance of the semiconductor device is qualified or not is judged, the test efficiency is improved, the temperature of the test cavity is monitored by arranging the temperature sensor, the set temperature can be reached by changing the temperature of the heating equipment, and the semiconductor device can be overhauled after the test is finished.

Description

Semiconductor device testing device

Technical Field

The present utility model relates to a semiconductor device testing apparatus.

Background

An insulated gate bipolar transistor is a semiconductor power device, and a testing device is generally required to test the high-temperature performance of the insulated gate bipolar transistor in the production process so as to avoid damage caused by high temperature in the later use process.

In the prior art, a semiconductor device is usually placed in an incubator to be heated, and when the temperature reaches a test temperature, the semiconductor device is taken out of the incubator and placed on a test device to be detected, wherein the test temperature is higher, the semiconductor device is directly difficult to take out, the test efficiency is affected if the semiconductor device is naturally cooled for a period of time, and meanwhile, the test result is affected if the temperature deviates inside the test device.

Disclosure of Invention

In view of the problems in the prior art, an object of the present utility model is to provide a semiconductor device testing apparatus.

In order to solve the problems, the utility model adopts the following technical scheme.

The utility model provides a semiconductor device testing arrangement, includes the test box, test chamber and cooling chamber have been seted up to the inside of test box, the cooling chamber is located the right side of test chamber and is linked together with the inside of test chamber, the logical groove has been seted up on the inner wall of test chamber, the inside of logical groove is linked together with the inside of test chamber, the left side fixed mounting of test box has servo motor, servo motor's output shaft runs through and extends to the inside of test chamber, fixedly connected with lead screw on servo motor's the output shaft, the right-hand member of lead screw runs through logical groove and rotates to be connected on the inner wall of cooling chamber, sliding connection has the carrier on the inner wall of test chamber, carrier threaded connection is on the lead screw, the top of carrier is through buckling board fixedly connected with test frame, fixedly connected with thing board of putting of equidistance on the inner wall of test frame, the left and right sides of test frame is fixedly connected with baffle, two the baffle is located the inside of test chamber and cooling chamber respectively, heating equipment and equipment are installed at the top of test box, heating equipment and the inside sensor, temperature sensor and the inside of test chamber and the inside sensor.

As a further description of the above technical solution: the right side of test box fixed mounting has control panel, firing equipment, refrigeration plant and servo motor all with control panel electric connection.

As a further description of the above technical solution: the front of the test box is fixedly connected with perspective glass, and the perspective glass is positioned on the front of the cooling cavity.

As a further description of the above technical solution: two guide rods are fixedly connected to the inner wall of the test cavity, and the bearing seat is slidably connected to the guide rods.

As a further description of the above technical solution: and the opposite sides of the two baffles are fixedly connected with sealing gaskets, and the sealing gaskets are made of heat-resistant rubber materials.

As a further description of the above technical solution: the right side of test box fixed mounting has the prompting device, prompting device and singlechip signal connection.

Compared with the prior art, the utility model has the advantages that:

the semiconductor device after the high-temperature test can be cooled by the cooling cavity, so that the semiconductor device at the high temperature can be taken out for test and check quickly, whether the semiconductor device is qualified in heat resistance can be judged by continuing to use, the test efficiency is improved, the temperature of the test cavity is monitored by the temperature sensor, the temperature of the heating equipment can be changed to reach the set temperature, and overhaul can be performed after the test is finished.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic cross-sectional elevation view of the present utility model;

FIG. 3 is an enlarged schematic view of the structure of FIG. 2A according to the present utility model;

FIG. 4 is a schematic side view of the carrier of the present utility model;

fig. 5 is a schematic diagram of the principle of the present utility model.

The reference numerals in the figures illustrate:

1. a test box; 2. a test chamber; 3. a cooling chamber; 4. a through groove; 5. a servo motor; 6. a bearing seat; 7. a test rack; 8. a storage plate; 9. a baffle; 10. a heating device; 11. a refrigeration device; 12. a temperature sensor; 13. a single chip microcomputer; 14. a control panel; 15. perspective glass; 16. a guide rod; 17. a sealing gasket; 18. a prompter.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model;

referring to fig. 1-5, a semiconductor device testing apparatus includes a testing box 1, a testing cavity 2 and a cooling cavity 3 are provided in the testing box 1, the cooling cavity 3 is located on the right side of the testing cavity 2 and is communicated with the interior of the testing cavity 2, a through groove 4 is provided on the inner wall of the cooling cavity 3, the interior of the through groove 4 is communicated with the interior of the testing cavity 2, a servo motor 5 is fixedly installed on the left side of the testing box 1, an output shaft of the servo motor 5 penetrates and extends to the interior of the testing cavity 2, a screw is fixedly connected on the output shaft of the servo motor 5, the right end of the screw penetrates through the groove 4 and is rotatably connected on the inner wall of the cooling cavity 3, a bearing seat 6 is slidingly connected on the inner wall of the testing cavity 2, the bearing seat 6 is in threaded connection on the screw, the top of bearing seat 6 is through bending plate fixedly connected with test frame 7, fixedly connected with thing board 8 of putting that the equidistance was arranged on the inner wall of test frame 7, the equal fixedly connected with baffle 9 in left and right sides of test frame 7, two baffles 9 are located the inside of test chamber 2 and cooling chamber 3 respectively, heating equipment 10 and refrigeration plant 11 are installed at the top of test box 1, heating equipment 10 and refrigeration plant 11 are linked together with the inside of test chamber 2 and cooling chamber 3 respectively, fixedly mounted has temperature sensor 12 on the inner wall of test chamber 2, the internal integration of test box 1 has singlechip 13, temperature sensor 12 and heating equipment 10 all with singlechip 13 signal connection, the right side fixed mounting of test box 1 has the suggestion 18, suggestion 18 and singlechip 13 signal connection.

When the high-temperature aging test is needed to be carried out on the semiconductor device, a user opens the box door to expose the test cavity 2, at the moment, the user places a plurality of groups of semiconductor devices on different object placing plates 8 respectively, then closes the box door, at the moment, the right baffle 9 is attached to the inner wall of the cooling cavity 3 to enable the test cavity 2 to form a seal, the user adjusts the temperature of the heating device 10 to the test temperature, the internal temperature of the test cavity 2 starts to rise, the temperature sensor 12 monitors the internal temperature of the test cavity 2 in real time and transmits signals to the singlechip 13, the singlechip 13 compares the numerical value with the set numerical value to check whether the set temperature is reached, if the deviation exists between the singlechip 13 and the set temperature, the power of the heating device 10 is changed until the internal temperature of the test cavity 2 reaches the set value, meanwhile, the singlechip 13 controls the prompter 18 to conduct power-on work, the prompter 18 prompts the user to examine and repair the equipment or the device after the test is completed, after the set value is reached, the servo motor 5 is controlled to conduct power-on work, the servo motor 5 drives the synchronous rotation connected to the screw seat 6 fixedly connected with the servo motor, the screw is moved to the right, the semiconductor device is continuously cooled down until the inner wall of the lead screw is cooled down, the semiconductor device is cooled, the semiconductor device can be cooled, and the semiconductor device can be continuously cooled until the semiconductor device is cooled by the inner wall is cooled by the lead screw 3, and the semiconductor device is continuously cooled, and the semiconductor device is cooled by the lead screw 3 is continuously cooled, and the semiconductor device is cooled by the inner side 3, and the device is subjected to whether the test device is cooled, and the device is subjected to the cooling is subjected to the cooling.

The semiconductor device after the high-temperature test can be cooled by arranging the cooling cavity 3 so that the semiconductor device at the high temperature can be quickly taken out for test checking, whether the semiconductor device can be continuously used for judging whether the heat resistance of the semiconductor device is qualified or not is judged, the test efficiency is improved, the temperature of the test cavity 2 is monitored by arranging the temperature sensor 12, the temperature of the heating equipment 10 can be changed to reach the set temperature, and the semiconductor device can be overhauled after the test is finished.

Please refer to fig. 1, wherein: the right side of the test box 1 is fixedly provided with a control panel 14, and the heating equipment 10, the refrigerating equipment 11 and the servo motor 5 are electrically connected with the control panel 14.

The arrangement of the control panel 14 can make the user operate the device more simply and quickly, so as to reduce the steps required by the user to operate, thereby improving the burn-in test efficiency of the semiconductor device.

Please refer to fig. 1, wherein: the front of the test box 1 is fixedly connected with a perspective glass 15, and the perspective glass 15 is positioned on the front of the cooling cavity 3.

After the semiconductor device enters the cooling cavity 3, a user can directly observe the internal condition of the cooling cavity 3 through the perspective glass 15, so that the state of the semiconductor device can be known in time.

Please refer to fig. 4, wherein: two guide rods 16 are fixedly connected to the inner wall of the test cavity 2, and the bearing seat 6 is slidably connected to the guide rods 16.

The guide rod 16 can limit the bearing seat 6, so that the bearing seat 6 always keeps stable movement in the horizontal direction.

Please refer to fig. 2 and 3, wherein: the opposite sides of the two baffles 9 are fixedly connected with sealing gaskets 17, and the sealing gaskets 17 are made of heat-resistant rubber materials.

When the baffle plate 9 moves, the sealing gasket 17 made of rubber material can further improve the sealing effect of the baffle plate 9, and the influence of gas overflow on the testing or cooling effect is avoided.

The above description is only of the preferred embodiments of the present utility model; the scope of the utility model is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present utility model, and the technical solution and the improvement thereof are all covered by the protection scope of the present utility model.

Claims (6)

1. A semiconductor device testing apparatus comprising a test box (1), characterized in that: the utility model discloses a refrigerating device, including test box (1), cooling chamber (3), test chamber (2) and cooling chamber (3) have been seted up to the inside of test box (1), cooling chamber (3) are located the right side of test chamber (2) and are linked together with the inside of test chamber (2), logical groove (4) have been seted up on the inner wall of cooling chamber (3), the inside of logical groove (4) is linked together with the inside of test chamber (2), the left side fixed mounting of test box (1) has servo motor (5), the output shaft of servo motor (5) runs through and extends to the inside of test chamber (2), fixedly connected with lead screw on the output shaft of servo motor (5), the right-hand member of lead screw runs through logical groove (4) and rotates to be connected on the inner wall of cooling chamber (3), sliding connection has carrier (6) on the inner wall of test chamber (2), carrier (6) threaded connection is on the lead screw, the top of carrier (6) is linked together with test frame (7) through the bending fixedly, fixedly connected with servo motor (5) on the inner wall of test frame (7) has fixed connection to have flap (8), install in the cooling device (9) in the equal distance between two sides of test box (3) and cooling device (9) respectively, the heating device (10) and the refrigerating device (11) are respectively communicated with the inside of the test cavity (2) and the inside of the cooling cavity (3), a temperature sensor (12) is fixedly installed on the inner wall of the test cavity (2), a singlechip (13) is integrated in the test box (1), and the temperature sensor (12) and the heating device (10) are connected with the singlechip (13) through signals.

2. A semiconductor device testing apparatus according to claim 1, wherein: the right side of the test box (1) is fixedly provided with a control panel (14), and the heating equipment (10), the refrigerating equipment (11) and the servo motor (5) are electrically connected with the control panel (14).

3. A semiconductor device testing apparatus according to claim 1, wherein: the front of the test box (1) is fixedly connected with a perspective glass (15), and the perspective glass (15) is positioned on the front of the cooling cavity (3).

4. A semiconductor device testing apparatus according to claim 1, wherein: two guide rods (16) are fixedly connected to the inner wall of the test cavity (2), and the bearing seat (6) is slidably connected to the guide rods (16).

5. A semiconductor device testing apparatus according to claim 1, wherein: and the opposite sides of the two baffles (9) are fixedly connected with sealing gaskets (17), and the sealing gaskets (17) are made of heat-resistant rubber materials.

6. A semiconductor device testing apparatus according to claim 1, wherein: the right side of the test box (1) is fixedly provided with a prompter (18), and the prompter (18) is in signal connection with the singlechip (13).