CN117169699B - Chip high-low temperature test equipment - Google Patents
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- CN117169699B CN117169699B CN202311447783.3A CN202311447783A CN117169699B CN 117169699 B CN117169699 B CN 117169699B CN 202311447783 A CN202311447783 A CN 202311447783A CN 117169699 B CN117169699 B CN 117169699B
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- 230000007246 mechanism Effects 0.000 claims abstract description 55
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- 238000003825 pressing Methods 0.000 claims abstract description 7
- 230000005540 biological transmission Effects 0.000 claims description 35
- 230000009021 linear effect Effects 0.000 claims description 13
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- 230000008859 change Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
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- 238000010438 heat treatment Methods 0.000 description 7
- 230000001052 transient effect Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000001276 controlling effect Effects 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
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- 238000001514 detection method Methods 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
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- 238000004806 packaging method and process Methods 0.000 description 1
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Abstract
The application discloses chip high low temperature test equipment belongs to chip test technical field. The chip temperature control device mainly comprises a bottom box and a pressing mechanism, wherein the pressing mechanism is provided with a connecting table, the connecting table is suitable for being close to or far away from the bottom box, two groups of temperature control mechanisms are arranged below the connecting table, the temperature control mechanisms are used for providing different temperatures for chips, the placing mechanism is arranged on the bottom box and comprises a bottom table, a revolving rail is fixed on the bottom table, a revolving table is rotatably arranged on the revolving rail, the revolving table is suitable for rotating on the revolving rail, two groups of placing tables are arranged on the revolving table, clamping grooves are formed in the placing tables and used for placing and fixing the chips, a closed circuit connected with the chips is arranged inside the clamping grooves, and a driving assembly is connected with the revolving table. The chip high-low temperature test equipment achieves the effect of carrying out different test modes on chips with different requirements.
Description
Technical Field
The application relates to the technical field of chip testing, in particular to chip high-low temperature testing equipment.
Background
A chip is an integrated circuit, which is a silicon chip for packaging and integrating a plurality of electronic components (such as transistors, resistors, capacitors, etc.), the chip is generally manufactured by a semiconductor process, and in the production of the chip, in order to ensure that the chip can normally operate and stably work under different temperature environments, high-temperature and low-temperature test equipment is required to be adopted for testing the chip at high and low temperatures;
the utility model patent with publication number CN217425600U specifically discloses a laser chip high-low temperature test device, which comprises a semiconductor refrigerator, a heat conducting plate and an auxiliary regulating unit, wherein one end of the semiconductor refrigerator is connected with the heat conducting plate, the other end of the semiconductor refrigerator is connected with the auxiliary regulating unit, and the auxiliary regulating unit is used for regulating the temperature of the semiconductor refrigerator;
however, in the prior art, the high-low temperature detection test of the chip has two types, namely a temperature linear test and a temperature transient test, wherein the temperature transient test is used for testing the response and the performance of the chip in the temperature change process, and the temperature linear test is used for testing the stability and the performance of the chip at different temperatures;
in the above-disclosed test apparatus, the chip to be tested is mainly placed on the heat-conducting plate, and when the temperature is highest, the temperature is reduced by the semiconductor refrigerator to realize the linear change of the temperature, but the test apparatus is not suitable for simulating the transient temperature change environment, so that the test apparatus cannot be switched between the temperature linear test and the transient temperature test, and therefore, it is necessary to provide a chip high-low temperature test apparatus to solve the above-mentioned problems.
It should be noted that the above information disclosed in this background section is only for understanding the background of the present application concept and, therefore, it may contain information that does not constitute prior art.
Disclosure of Invention
Based on the above problems existing in the prior art, the problems to be solved by the present application are: the chip high-low temperature test equipment has the advantages that the effect of carrying out different test modes on chips with different requirements is achieved.
The technical scheme adopted for solving the technical problems is as follows: the utility model provides a chip high low temperature test equipment, includes the base box, presses the mechanism, should press the mechanism and have the connection platform, the connection platform is suitable for towards the base box is close to or keeps away from, two sets of temperature control mechanism, this temperature control mechanism install in the below of connection platform, temperature control mechanism is used for providing different temperatures for the chip, places the mechanism, should place the mechanism install in on the base box, place the mechanism including the bottom table, be fixed with the revolving stage on this bottom table, the revolving stage rotate install in on the revolving stage, the revolving stage is suitable for rotate on the revolving stage, two sets of place the platform install in on the revolving stage, place the draw-in groove has been seted up on the platform, the draw-in groove is used for placing and fixing the chip, the draw-in groove is inside be provided with the closed circuit that is connected with the chip to test the operating condition of chip, drive assembly with place the platform, two sets of place the platform be suitable for under drive assembly's the drive down carry out the position, and under two sets of temperature control mechanism different temperature cooperation, place the chip temperature adjustment, the temperature adjustment is in the linear effect is in the chip under the temperature control, the temperature adjustment is carried out the temperature adjustment.
Further, the drive assembly includes the transfer line, the transfer line bearing install in on the base frame, the transfer line with fixed connection between the revolving stage, the transfer line is suitable for driving the revolving stage and is in rotatory on the track.
Further, the driving assembly further comprises a driving rod fixedly mounted on the connecting table, a sliding cavity matched with the transmission rod is formed in the driving rod, the driving rod is sleeved on the transmission rod, and the driving rod is suitable for reciprocating motion along the axis direction of the transmission rod.
Further, two groups of symmetrically arranged grooves are formed in the inner wall of the driving rod, a sliding block is slidably mounted in the grooves, a spring is fixed between the sliding block and the inner wall of the grooves, and the spring is used for adaptively extending or contracting the sliding block from the grooves.
Further, two groups of vertical grooves I and two groups of vertical grooves II which are symmetrically arranged are formed in the outer wall of the transmission rod, the sliding block is matched with the vertical grooves I and two groups of vertical grooves II, and the sliding block is located in the vertical grooves I.
Further, the first bottom of the vertical groove is connected with the first spiral groove and the third spiral groove, a crossing area is formed, the bottom surface of the first vertical groove is arranged along the direction from top to bottom and is an inclined surface with gradually rising height, the crossing area is provided with a telescopic groove, a first switching block and a second switching block are slidably mounted in the telescopic groove, the first switching block and the second switching block are suitable for extending or contracting from the telescopic groove, and the position of the second switching block is located below the right side of the first switching block.
Further, the first spiral groove is communicated with the second vertical groove, a first step is arranged at the intersection area of the first spiral groove and the second vertical groove, the bottom of the first vertical groove is higher than that of the first spiral groove, the first step is provided with an arc-shaped guide section, and the guide section is used for assisting the sliding block to enter the first spiral groove.
Further, the middle section of the second vertical groove is connected with a second spiral groove matched with the sliding block, the second spiral groove is communicated with the first vertical groove, a third step is arranged in the second vertical groove, the third step enables the bottom surface of the upper end portion of the second vertical groove to be lower than the bottom surface of the lower end portion of the second vertical groove, and the bottom surface of the upper end portion of the second vertical groove is flush with the bottom surface of the second spiral groove so that the sliding block is led into the second spiral groove.
Further, the third spiral groove is obliquely arranged from the crossing area to the right of the top end, the third spiral groove is communicated with the first vertical groove on the other side, and the sliding block is in three-phase fit with the spiral groove.
Further, a step five is arranged at the end part above the spiral groove three, and the bottom of the spiral groove three is higher than the bottom of the corresponding position of the vertical groove by the step five so as to prevent the sliding block from entering the spiral groove three.
The beneficial effects of this application are: the application provides a chip high low temperature test equipment under the effect of connection platform, drives temperature control mechanism and removes towards placing the chip on the platform, under temperature control mechanism's cooperation, carries out temperature linearity test to the chip, when needs switch to temperature instantaneous test, the temperature of two sets of temperature control mechanisms sets up relatively to place the chip on the platform and be close to, afterwards, when connection platform moves up, drive the actuating lever and upwards remove, and under the effect of switching block one, make slider and helicla flute three-phase contradict each other, so that the revolving stage rotates, and make two sets of place the platform and carry out the position change, thereby reach the effect of carrying out different test modes to the chip of different demands.
In addition to the objects, features, and advantages described above, there are other objects, features, and advantages of the present application. The present application will be described in further detail with reference to the drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
FIG. 1 is an overall schematic diagram of a chip high and low temperature test apparatus according to the present application;
FIG. 2 is an enlarged schematic view of FIG. 1 at A;
FIG. 3 is a schematic diagram of an explosion structure of the temperature control mechanism in FIG. 2;
FIG. 4 is a schematic diagram illustrating a testing state of the temperature control mechanism in FIG. 2;
FIG. 5 is a schematic diagram of the driving assembly of FIG. 4;
FIG. 6 is a schematic view of the driving rod of FIG. 5;
FIG. 7 is a schematic view of an exploded view of the drive rod of FIG. 6;
FIG. 8 is a schematic diagram illustrating states of the first and second switching blocks in the driving assembly;
FIG. 9 is a schematic diagram illustrating a shift state of the driving assembly of FIG. 8 for controlling the rotating plate;
FIG. 10 is a schematic view of the reset state of the rotating plate of FIG. 9;
FIG. 11 is a schematic diagram showing the states of the first and second switching blocks in the driving assembly;
FIG. 12 is a diagram showing the indexing of two sets of the placement tables of FIG. 11;
wherein, each reference sign in the figure:
1. a bottom box; 11. a liquid tank; 12. a master control box;
2. a placement mechanism; 21. a placement table; 211. a clamping groove; 22. a base table; 23. turning a rail; 24. a rotary table;
3. a pressing mechanism; 31. a first motor; 32. a slide; 33. a connection station; 34. a fixed rod;
4. a temperature control mechanism; 41. a sealing plate; 42. a temperature guide plate; 421. a positioning groove; 43. a cooling circulation pipe; 44. a housing;
5. a drive assembly; 51. a driving rod; 511. a sliding chamber; 512. a groove; 52. a spring; 53. a slide block;
6. a transmission rod; 61. a first vertical groove; 611. a first step; 612. a crossover region; 613. a telescopic slot; 614. a mounting groove; 62. a second vertical groove; 621. a step III; 63. spiral groove I; 64. spiral groove II; 641. a step IV; 65. spiral groove III; 651. step five; 66. a first switching block; 67. a second switching block; 68. an electric push rod.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.
Embodiment one:
as shown in fig. 1 to 3, the present application provides a chip high-low temperature test apparatus, where the high-low temperature test of the chip is divided into a temperature transient test and a temperature linear test, where the temperature transient test is used for testing the response and performance of the chip during the temperature change, the temperature linear test is used for testing the stability and performance of the chip at different temperatures, and this embodiment specifically describes how to make the high-low temperature test apparatus suitable for testing the chip in the two test modes described above, specifically:
the high-low temperature test equipment comprises a bottom box 1 and a placing mechanism 2 arranged on the bottom box 1, wherein the upper surface of the bottom box 1 is a workbench surface;
the placing mechanism 2 consists of a turntable part and two groups of placing tables 21, wherein a clamping groove 211 is formed in the placing tables 21, the clamping groove 211 is used for placing and fixing a chip, a closed circuit connected with the chip is arranged in the clamping groove 211, and when the chip is installed in the clamping groove 211, the closed circuit is used for testing the working state of the chip;
meanwhile, the turntable part comprises a bottom table 22 and a rotating rail 23 arranged on the bottom table 22, the bottom table 22 is fixedly arranged on the bottom box 1, a turntable 24 is rotatably arranged on the rotating rail 23, two groups of placing tables 21 are fixedly arranged on two sides of the turntable 24, and the two groups of placing tables 21 are symmetrically arranged by taking the central line of the rotating rail 23 as a central axis, so that the turntable 24 is suitable for driving the two groups of placing tables 21 to rotate on the rotating rail 23;
a driving component 5 (as shown in fig. 4) is connected to the rotary table 24, in this embodiment, the driving component 5 is a second motor, and an output end of the second motor is connected to the rotary table 24, so that the rotary table 24 is driven to rotate by the second motor to adjust positions of the two groups of placing tables 21;
a liquid tank 11 is installed on the bottom tank 1, the liquid tank 11 is used for storing cooling liquid, a pressing mechanism 3 is installed on the outer wall of the liquid tank 11, the pressing mechanism 3 comprises a sliding seat 32 fixedly installed on the liquid tank 11, a first motor 31 fixedly installed at the upper end of the sliding seat 32, a screw rod (not shown in the figure) is fixed on the output end of the first motor 31, the screw rod and the sliding seat 32 are installed in a bearing manner, a connecting table 33 is slidingly installed on the sliding seat 32, the connecting table 33 is in threaded connection with the screw rod, and the screw rod is driven to rotate under the action of the first motor 31, so that the connecting table 33 is suitable for approaching or separating towards the placing table 21;
meanwhile, a fixed rod 34 is arranged on the connecting table 33, a temperature control mechanism 4 is connected and arranged on the end part, close to the placing table 21, of the fixed rod 34, the temperature control mechanism 4 is positioned right above the placing table 21, and the temperature control mechanism 4 is used for providing different temperatures for chips;
the temperature control mechanism 4 comprises a sealing plate 41 and a shell 44 connected with the sealing plate 41, wherein a temperature guide plate 42 is arranged on the sealing plate 41, and a positioning groove 421 matched with the clamping groove 211 is formed in the temperature guide plate 42, so that a chip is clamped and fixed under the cooperation of the temperature guide plate 42 and the placing table 21, and a test space is provided for the chip;
meanwhile, a heating element (not shown in the figure) is connected to the temperature-guiding plate 42, in this application, the heating element may be an electric furnace, a hot plate or other heating devices, so as to conduct heat to the temperature-guiding plate 42, so that the temperature of the temperature-guiding plate 42 is increased, and a cooling circulation pipe 43 is connected to one side of the temperature-guiding plate 42, and the cooling circulation pipe 43 is connected to the liquid tank 11, so that the cooling liquid circulates through the cooling circulation pipe 43 and passes through the temperature-guiding plate 42, thereby realizing the temperature reduction of the temperature-guiding plate 42 and further realizing the temperature control of the temperature-guiding plate 42;
a master control box 12 is installed on one side of the bottom box 1, a PLC control system and a data acquisition system are arranged in the master control box 12, wherein the PLC control system is electrically connected with the first motor 31 and the second motor, and is electrically connected with the heating element and the cooling circulation pipe 43 to control the temperature change on the temperature guide plate 42, and meanwhile, the data acquisition system is connected with a closed circuit in the clamping groove 211 to collect and analyze the data of the state of the chip in the clamping groove 211;
in summary, when the temperature linear test is performed on the chips, the chips are placed on the two sets of placement tables 21 and are communicated with the closed circuit in the card slot 211, and meanwhile, the PLC control system controls the heating element and the cooling circulation pipe 43 so that the temperature on the temperature guide plate 42 is in the lowest temperature state (or the highest temperature state);
then the first motor 31 is controlled by the PLC control system to drive the temperature control mechanism 4 to move towards the placing table 21, so that the temperature control mechanism 4 clamps and fixes the chip on the placing table 21, at the moment, the PLC control system controls the heating element to drive the temperature on the temperature guide plate 42 to rise (or linearly fall) in a linear state so as to provide a simulated temperature change working environment for the chip, and in the process that the temperature on the temperature guide plate 42 changes linearly, the data acquisition system acquires and analyzes the working state of the chip so as to evaluate the stability and performance of the chip at different temperatures;
when the chip is subjected to temperature transient test, the chip is placed on one group of placing tables 21 and is communicated with a closed circuit in the clamping groove 211, meanwhile, the PLC control system controls the heating element and the cooling circulating pipe 43 to enable the temperature control mechanism 4 above the placing table 21 with the chip placed to be in the lowest temperature state, and the other group of temperature control mechanisms 4 are kept in the highest temperature state all the time;
then the PLC control system enables the temperature control mechanism 4 to move towards the placing table 21 through the first motor 31, clamps and fixes the chip, and meanwhile, the temperature of the temperature control mechanism 4 is kept in the lowest state, and meanwhile, the data acquisition system acquires and analyzes the working state of the chip;
after the testing of the working state of the chip at the lowest temperature is finished, the temperature control mechanism 4 is driven by the first motor 31 to separate from the placing table 21, meanwhile, the PLC control system drives the rotating table 24 to rotate by controlling the second motor, so that the positions of the two groups of placing tables 21 are interchanged, and after the process is finished, the first motor 31 is driven at the same time, the temperature control mechanism 4 at the highest temperature is driven to move towards the placing table 21, and the working state of the chip at the highest temperature is subjected to information acquisition by the data acquisition system, so that the response and the performance of the chip in the temperature change process are evaluated;
in summary, through setting up two sets of platforms 21 of placing, carry out the centre gripping to the chip and place, drive assembly 5 is suitable for driving revolving stage 24 rotatory simultaneously to place the platform 21 to two sets of transposition, and under the effect of two sets of temperature control mechanism 4, realize the temperature instantaneous test or the temperature linear test to the chip.
Embodiment two:
in the first embodiment, the position switching manner of the placement mechanism 2 switches the positions of the two groups of placement tables 21 by using the second motor, but in actual use, the PLC control system is required to drive the second motor to switch the positions of the two groups of placement tables 21, and in this process, the placement tables 21 need to be adjusted by using external driving forces such as the motor, so that the high-low temperature test equipment has high cost;
to solve the above-described problems, the present embodiment specifically describes how to control the rotation of the rotation table 24 to switch the positions of the chips on the two sets of placing tables 21 during the process of driving the connection table 33 to move up and down by the first motor 31, specifically:
as shown in fig. 4 to 5, in the present embodiment, the driving assembly 5 is composed of a driving rod 51 and a transmission rod 6, and the driving rod 51 and the transmission rod 6 are both in a column shape, wherein the driving rod 51 is fixed on the connection table 33 and is located on the same side as the fixing rod 34, so that the first motor 31 is adapted to drive the driving rod 51 to reciprocate;
the driving rod 51 is provided with a sliding cavity 511 which is matched with the outer diameter of the transmission rod 6, so that the driving rod 51 is sleeved on the transmission rod 6 and the driving rod 51 is suitable for reciprocating motion along the axial direction of the transmission rod 6;
the bottom end bearing of the transmission rod 6 is arranged on the bottom table 22, and the transmission rod 6 is fixedly connected with the rotary table 24, so that the transmission rod 6 is suitable for rotating by taking the central axis of the rotary table 24 as the center and driving the rotary table 24 to rotate on the rotary rail 23, and the positions of two groups of placing tables 21 on the transmission rod are adjusted by the rotation of the rotary table 24;
simultaneously, two groups of first vertical grooves 61 and two groups of second vertical grooves 62 (as shown in fig. 6) are respectively formed in the vertical direction of four points on the outer wall of the transmission rod 6, the two groups of first vertical grooves 61 (or the two groups of second vertical grooves 62) are symmetrically arranged, two groups of mutually symmetrical sliding units are arranged on the inner wall of a sliding cavity 511 of the driving rod 51, each sliding unit comprises a groove 512 formed on the inner wall of the sliding cavity 511, a sliding block 53 slidably arranged on the groove 512, and a spring 52 is fixed between the sliding block 53 and the inner wall of the groove 512;
when the sliding block 53 is acted by external force, the sliding block 53 is suitable for extruding the spring 52, so that the sliding block 53 moves towards the inside of the groove 512, and when the external force applied to the sliding block 53 is eliminated, the spring 52 is suitable for ejecting the sliding block 53 towards the outside of the groove 512 under the action of the elastic force, so that the sliding block 53 is suitable for self-adaptive extension or contraction;
the sliding block 53 is matched with the first vertical groove 61 and the second vertical groove 62, and the sliding block 53 is positioned in the first vertical groove 61 and extrudes the first vertical groove 61 under the action of the spring 52 so as to prevent the driving rod 51 from being separated from the driving rod 6;
as shown in fig. 6-7, the first vertical groove 61 and the second vertical groove 62 are disposed along the outer wall of the transmission rod 6, and the length of the first vertical groove 61 is longer than that of the second vertical groove 62, and meanwhile, the bottom end of the first vertical groove 61 is connected with the first spiral groove 63 and the third spiral groove 65, and forms an intersection area 612;
a telescopic groove 613 is formed in the crossing region 612, a first switching block 66 and a second switching block 67 positioned at the lower end of the first switching block 66 are slidably mounted in the telescopic groove 613, wherein the first switching block 66 is used for controlling the opening and closing of the first spiral groove 63, the second switching block 67 is used for controlling the opening and closing of the third spiral groove 65, and the second switching block 67 is positioned below the right side of the first switching block 66;
two groups of mounting grooves 614 are formed in the telescopic groove 613, and electric push rods 68 are mounted in the two groups of mounting grooves 614, wherein the electric push rods 68 are miniature electric push rods in the prior art, and detailed structures are not repeated here;
the output end of the electric push rod 68 close to the upper end of the telescopic groove 613 is connected with the first switching block 66, so that the first switching block 66 is suitable for being driven by the electric push rod 68 to retract inwards or outwards extend towards the telescopic groove 613, the output end of the electric push rod 68 close to the lower end of the telescopic groove 613 is connected with the second switching block 67, and the functions are the same, meanwhile, the two groups of electric push rods 68 are connected with a PLC control system, and the two groups of electric push rods 68 are controlled by the PLC control system to realize the control of opening or closing of the spiral groove 63 and the spiral groove 65;
in the present embodiment, the bottom of the spiral groove one 63 is equal to the bottom of the spiral groove three 65, when the switching block one 66 and the switching block two 67 are in the retracted position, the outer surfaces of the switching block one 66 and the switching block two 67 are flush with the bottom of the spiral groove one 63 (or the spiral groove three 65), when the switching block one 66 and the switching block two 67 are in the extended position, the outer surfaces of the switching block one 66 and the switching block two 67 are flush with the outer surface of the transmission rod 6, and in the initial state, the switching block one 66 is in the retracted position, and the switching block two 67 is in the extended position;
when the chip is required to be subjected to temperature linear test, the chip is first mounted in the clamping groove 211 in the placement table 21, and the specific embodiment can refer to the first embodiment, and the first switching block 66 is at the same height as the bottom of the first spiral groove 63;
then, the temperature adjustment of the temperature control mechanism 4 can refer to the first embodiment, and will not be described herein;
meanwhile, the first motor 31 drives the temperature control mechanism 4 to move towards the placing table 21 and press and seal the chip on the placing table 21, and in the process, the driving rod 51 is also driven by the first motor 31 to move downwards, so that the sliding block 53 moves along the first vertical groove 61 towards the bottom end of the first vertical groove 61, enters the bottom of the crossing region 612 and is positioned at the left side of the second switching block 67.
When the temperature linear test of the chip is completed (as shown in fig. 8), the tested chip needs to be replaced at this time, so that under the action of the driving rod 51, the driving rod 6 is driven to rotate, and the rotary table 24 is indirectly caused to rotate, specifically:
as shown in fig. 6 and 8-9, the first spiral groove 63 is inclined from the crossing area 612 to the right of the top end, and the first spiral groove 63 is matched with the sliding block 53;
a first step 611 is arranged at the joint of the bottom end of the first vertical groove 61 and the crossing area 612, the first step 611 enables the bottom of the first vertical groove 61 to be higher than the bottom of the first spiral groove 63, the first step 611 is provided with an arc-shaped guide section which is used for assisting the sliding block 53 to enter the first spiral groove 63, the first spiral groove 63 is arranged around one quarter of the outer wall of the transmission rod 6, and the upper end port of the first spiral groove 63 is communicated with the second vertical groove 62;
at this time, the sliding block 53 is located in the crossing area 612, and the first switching block 66 is in a level state with the bottom of the first spiral groove 63, so that the sliding block 53 is suitable for entering the first spiral groove 63;
then the PLC control system drives the first motor 31 to enable the driving rod 51 to move towards the upper side of the transmission rod 6, and guides the sliding block 53 under the action of the step one 611, so that the sliding block 53 enters the spiral groove one 63, the inner wall of the sliding block 53 is abutted against the inner wall of the spiral groove one 63, and meanwhile, the driving rod 6 is driven to rotate and the placing table 21 on the rotating table 24 is driven to rotate under the driving of the first motor 31 (as shown in fig. 9);
when the sliding block 53 enters the second vertical groove 62, the transmission rod 6 stops rotating, and the sliding block 53 moves in the second vertical groove 62, so that the position of the rotary table 24 is fixed, and the first spiral groove 63 is arranged around one quarter of the outer wall of the transmission rod 6, so that the transmission rod 6 can only drive the rotary table 24 to rotate one quarter of the rotation, and the chip on the placing table 21 can be replaced at the moment.
After the replacement of the chip on the placement stage 21 is completed, the position of the turntable 24 needs to be reset at this time, and specifically:
as shown in fig. 6 and 10, a second spiral groove 64 is connected to the middle section of the second vertical groove 62, the second spiral groove 64 is adapted to the sliding block 53, the second spiral groove 64 is located at the upper end of the first spiral groove 63, the second spiral groove 64 is inclined from the top end of the transmission rod 6 to the left end of the bottom end, is communicated with the first vertical groove 61, and is also arranged around one quarter of the circle of the outer wall of the transmission rod 6;
and a step three 621 is provided in the second vertical groove 62, the step three 621 making the bottom surface of the upper end portion of the second vertical groove 62 lower than the bottom surface of the lower end portion of the second vertical groove 62, and the bottom surface of the upper end portion of the second vertical groove 62 is flush with the bottom surface of the second spiral groove 64 for guiding the slider 53 into the second spiral groove 64;
when the first motor 31 drives the sliding block 53 to move to the upper end position of the second vertical groove 62, the position of the rotary table 24 is required to be reset at the moment, the PLC control system controls the first motor 31 to drive the sliding block 53 on the driving rod 51 to move along the second vertical groove 62, the sliding block 53 is guided into the second spiral groove 64 under the action of the third step 621, and meanwhile, the sliding block 53 is abutted into the second spiral groove 64 under the action of the first motor 31 and drives the transmission rod 6 to rotate, and meanwhile, the rotary table 24 is driven to rotate along the rotary rail 23;
when the sliding block 53 leaves the spiral groove II 64 and enters the vertical groove I61, the rotating table 24 is in a reset state, so that the rotating table 24 is reset;
meanwhile, at the junction of the spiral groove two 64 and the vertical groove one 61, a step four 641 (shown in a partial enlarged view in a first small drawing in fig. 6) is arranged at the end part of the spiral groove two 64, the step four 641 makes the bottom surface of the spiral groove two 64 higher than the bottom surface of the corresponding position of the vertical groove one 61, and the step four 641 is used for preventing the sliding block 53 from entering the spiral groove two 64 when moving in the vertical groove one 61;
therefore, through the matching of the first vertical groove 61, the second adjacent vertical groove 62 and the first spiral groove 63, the temperature linearity test of the chip is realized, and the reset operation is carried out through the second spiral groove 64;
in the present embodiment, the bottom surface of the first vertical groove 61 is provided with a slope having a gradually rising height along the top-to-bottom direction so as to guide the slider 53 into the intersection area 612.
As shown in fig. 6 and fig. 11-12, when the chip needs to be subjected to temperature instantaneous detection, the placement mode of the chip and the temperature control mode of the temperature control mechanism 4 can be specifically referred to the first embodiment, and redundant description is omitted herein;
after the above steps are completed, the PLC control system drives the temperature control mechanism 4 to approach the placement table 21 to clamp the chip, at this time, the driving rod 51 drives the slider 53 to slide along the first vertical groove 61, and the second switching block 67 is switched to a contracted state, so that the outer surface of the second switching block 67 is flush with the third spiral groove 65;
after the chip is tested in the lowest temperature state (or in the highest temperature state), the positions of the two sets of placement tables 21 need to be exchanged so that the chip is tested in the highest temperature state (or in the lowest temperature state), specifically:
simultaneously, the third spiral groove 65 is obliquely arranged from the crossing area 612 towards the right end of the top end, and the third spiral groove 65 is matched with the sliding block 53, so that the sliding block 53 is suitable for sliding in the third spiral groove 65;
the other port of the spiral groove III 65 is led into the other group of vertical grooves I61, the inclination angle of the spiral groove I63 is smaller, so that the vertical distance between the two ends of the spiral groove I63 is smaller, and the temperature loss caused by the over-high opening position of the temperature control mechanism 4 is prevented;
firstly, the first switching block 66 extends out of the telescopic groove 613 by regulating and controlling the electric push rod 68 corresponding to the first switching block 66 through the PLC control system, so that the first switching block 66 seals the first spiral groove 63, and the sliding block 53 is suitable for entering the third spiral groove 65;
then the PLC control system drives the sliding block 53 to move upwards through the first motor 31, guides the sliding block 53 into the spiral groove III 65 under the action of the first switching block 66, and simultaneously drives the transmission rod 6 to rotate under the continuous driving of the first motor 31 and the cooperation of the sliding block 53 and the spiral groove III 65, and indirectly drives the placing table 21 on the rotary table 24 to rotate;
simultaneously, the third spiral groove 65 is arranged around the upper half circle of the outer wall of the transmission rod 6, so that the rotary table 24 rotates for half circle, and the positions of the two groups of placing tables 21 are exchanged, thereby realizing the purpose of exchanging the positions of the two groups of placing tables 21;
a step five 651 (shown in a partial enlarged view in fig. 12) is arranged on the end part above the spiral groove three 65 at the junction of the spiral groove three 65 and the vertical groove one 61, and the step five 651 makes the bottom of the spiral groove three 65 higher than the bottom of the corresponding position of the vertical groove one 61 so as to prevent the sliding block 53 from entering the spiral groove three 65 when moving in the vertical groove one 61;
thus, through the cooperation of the two groups of vertical grooves one 61 and the spiral groove three 65, the position switching of the placing table 21 is realized, so that the instantaneous temperature test of the chip is performed.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (10)
1. A chip high and low temperature test apparatus comprising:
a bottom case (1);
a pressing mechanism (3), wherein the pressing mechanism (3) is provided with a connecting table (33), and the connecting table (33) is suitable for approaching to or separating from the bottom box (1);
placement mechanism (2), this placement mechanism (2) install in on base box (1), its characterized in that: the placement mechanism (2) includes:
a base table (22), a rotating rail (23) being fixed to the base table (22);
a rotary table (24), the rotary table (24) being rotatably mounted on the rotary rail (23), the rotary table (24) being adapted to rotate on the rotary rail (23);
two groups of placing tables (21), wherein the two groups of placing tables (21) are arranged on the rotary table (24), clamping grooves (211) are formed in the placing tables (21), the clamping grooves (211) are used for placing and fixing chips, and closed circuits connected with the chips are arranged inside the clamping grooves (211) so as to test the working states of the chips;
a fixing rod (34), wherein the fixing rod (34) is installed on the connecting table (33);
two groups of temperature control mechanisms (4), wherein the temperature control mechanisms (4) are positioned right above the placing table (21), and the two groups of temperature control mechanisms (4) are arranged on the end part, close to the placing table (21), of the fixed rod (34);
a drive assembly (5), the drive assembly (5) being connected to the rotary table (24);
wherein: the two groups of placing tables (21) are suitable for position exchange under the drive of the driving assembly (5), and under the cooperation of different temperatures of the two groups of temperature control mechanisms (4), the temperature of the chip is tested instantaneously, or the two groups of placing tables (21) are fixed in position, and under the effect of temperature linear adjustment of the temperature control mechanisms (4), the temperature of the chip is tested linearly.
2. The chip high and low temperature test apparatus according to claim 1, wherein: the driving assembly (5) comprises a transmission rod (6), the transmission rod (6) is installed on the base table (22) through a bearing, the transmission rod (6) is fixedly connected with the rotary table (24), and the transmission rod (6) is suitable for driving the rotary table (24) to rotate on the rotary rail (23).
3. The chip high and low temperature test apparatus according to claim 2, wherein: the driving assembly (5) further comprises a driving rod (51), the driving rod (51) is fixedly installed on the connecting table (33), a sliding cavity (511) matched with the transmission rod (6) is formed in the driving rod (51), the driving rod (51) is sleeved on the transmission rod (6), and the driving rod (51) is suitable for reciprocating motion along the axis direction of the transmission rod (6).
4. A chip high and low temperature test apparatus according to claim 3, wherein: two groups of symmetrically arranged grooves (512) are formed in the inner wall of the driving rod (51), and sliding blocks (53) are slidably arranged in the grooves (512);
a spring (52) is fixed between the sliding block (53) and the inner wall of the groove (512), and the spring (52) is used for adaptively extending or contracting the sliding block (53) from the groove (512).
5. The chip high and low temperature test apparatus according to claim 4, wherein: two groups of vertical grooves I (61) and two groups of vertical grooves II (62) which are symmetrically arranged are formed in the outer wall of the transmission rod (6), the sliding block (53) is matched with the vertical grooves I (61) and the vertical grooves II (62), and the sliding block (53) is positioned in the vertical grooves I (61).
6. The chip high and low temperature test apparatus according to claim 5, wherein: the bottom end of the first vertical groove (61) is connected with a first spiral groove (63) and a third spiral groove (65) and forms an intersection area (612), and the bottom surface of the first vertical groove (61) is arranged in an inclined plane with gradually rising height along the direction from top to bottom;
the cross region (612) is provided with a telescopic groove (613), a first switching block (66) and a second switching block (67) are slidably mounted in the telescopic groove (613), the first switching block (66) and the second switching block (67) are suitable for extending or contracting from the telescopic groove (613), and the position of the second switching block (67) is located below the right side of the first switching block (66).
7. The chip high and low temperature test apparatus according to claim 6, wherein: the first spiral groove (63) is communicated with the second vertical groove (62);
the first spiral groove (63) and the crossing area (612) are provided with a first step (611), the first step (611) is used for enabling the bottom of the first vertical groove (61) to be higher than the bottom of the first spiral groove (63), the first step (611) is provided with an arc-shaped guide section, and the guide section is used for assisting the sliding block (53) to enter the first spiral groove (63).
8. The chip high and low temperature test apparatus according to claim 7, wherein: the middle section of the second vertical groove (62) is connected with a second spiral groove (64) which is matched with the sliding block (53), and the second spiral groove (64) is communicated with the first vertical groove (61);
a third step (621) is arranged in the second vertical groove (62), the third step (621) enables the bottom surface of the upper end portion of the second vertical groove (62) to be lower than the bottom surface of the lower end portion of the second vertical groove, and the bottom surface of the upper end portion of the second vertical groove (62) is flush with the bottom surface of the second spiral groove (64) so that the sliding block (53) is led into the second spiral groove (64).
9. The chip high and low temperature test apparatus according to claim 8, wherein: the spiral groove III (65) is obliquely arranged from the crossing area (612) towards the right end of the top, the spiral groove III (65) is communicated with the vertical groove I (61) on the other side, and the sliding block (53) is matched with the spiral groove III (65).
10. The chip high and low temperature test apparatus according to claim 9, wherein: the end above the spiral groove III (65) is provided with a step V (651), and the step V (651) enables the bottom of the spiral groove III (65) to be higher than the bottom of the corresponding position of the vertical groove I (61) so as to prevent the sliding block (53) from entering the spiral groove III (65).
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| CN202311447783.3A CN117169699B (en) | 2023-11-02 | 2023-11-02 | Chip high-low temperature test equipment |
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| CN202311447783.3A CN117169699B (en) | 2023-11-02 | 2023-11-02 | Chip high-low temperature test equipment |
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| CN117169699A (en) | 2023-12-05 |
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Denomination of invention: A chip high and low temperature testing equipment Granted publication date: 20240126 Pledgee: Bank of Nanjing Co.,Ltd. Changzhou Branch Pledgor: Anying Semiconductor Technology (Changzhou) Co.,Ltd. Registration number: Y2024980017574 |