TWI834475B - Pressing mechanism, testing device, and processing machine - Google Patents

Pressing mechanism, testing device, and processing machine Download PDF

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Publication number
TWI834475B
TWI834475B TW112101603A TW112101603A TWI834475B TW I834475 B TWI834475 B TW I834475B TW 112101603 A TW112101603 A TW 112101603A TW 112101603 A TW112101603 A TW 112101603A TW I834475 B TWI834475 B TW I834475B
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Taiwan
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pickup
gas
crimping
pick
component
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TW112101603A
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Chinese (zh)
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李子瑋
許家豪
王彥傑
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鴻勁精密股份有限公司
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Abstract

The pressing mechanism includes a supporter, a pick-up unit, a pressing member, and a temperature control unit. The pick-up unit is disposed on the supporter and is adapted for picking up the electronic component by its pick-up member. The pressing member is disposed on the supporter and is adapted for pressing the electronic component by its pressing portion. The pressing member has a through hole for receiving the pick-up member, and a gas channel is formed between the through hole and the pick-up member. The gas channel is adapted for the gas at a predetermined temperature to flow through, and the gas is used to exchange the heat with the pick-up member so as to control the temperature of the pick-up member. The pick-up member presses the electronic component to test the electronic component at the predetermined temperature.

Description

壓接機構、測試裝置及作業機Crimping mechanism, testing device and operating machine

本發明提供一種便於溫控電子元件及節省能源成本之壓接機構。 The invention provides a crimping mechanism that facilitates temperature control of electronic components and saves energy costs.

電子元件日後會應用於高溫環境或低溫環境,於出廠前,需以作業機之測試裝置對電子元件執行熱測作業或冷測作業,以淘汰不良品。以冷測作業為例,測試裝置包含測試器及壓接機構,測試器以供承置及測試電子元件,壓接機構位於測試器之上方,並設有壓接具以壓接電子元件,壓接具之抽氣孔供吸附移載電子元件,另於壓接具之上方設有冷媒座,冷媒座之兩端分別以冷媒輸送管連接冷媒供應設備,使冷媒供應設備將冷媒輸入至冷媒座,以溫控壓接具,壓接具將低溫傳導至電子元件,使電子元件於模擬日後應用低溫環境執行冷測作業,冷媒座再將冷媒輸出至冷媒供應設備。 Electronic components will be used in high-temperature or low-temperature environments in the future. Before leaving the factory, it is necessary to perform hot testing or cold testing on the electronic components using the testing device of the operating machine to eliminate defective products. Taking the cold test operation as an example, the test device includes a tester and a crimping mechanism. The tester is used to hold and test electronic components. The crimping mechanism is located above the tester and is equipped with a crimping tool to crimp electronic components. The air extraction hole of the connector is used for adsorbing and transferring electronic components. There is also a refrigerant seat above the crimping tool. Both ends of the refrigerant seat are connected to the refrigerant supply equipment with refrigerant delivery pipes, so that the refrigerant supply equipment can input refrigerant to the refrigerant seat. Using a temperature-controlled crimping tool, the crimping tool conducts low temperature to the electronic components, allowing the electronic components to perform cold testing operations in a low-temperature environment after simulating the future. The refrigerant seat then outputs the refrigerant to the refrigerant supply equipment.

此一方式雖可溫控壓接具,但以冷媒作為溫控之能源,不僅增加溫控能源成本,冷媒供應設備之體積大必須獨立配置,更需配置複數個轉接管及較長尺寸之冷媒輸送管等,方可將冷媒輸送至冷媒座,以致相當佔用場所空間,亦增加配置作業上之不便。 Although this method can control the temperature of the crimping tool, using refrigerant as the energy source for temperature control not only increases the cost of temperature control energy, but the refrigerant supply equipment is large and must be configured independently. It also requires multiple transfer pipes and longer sizes. Refrigerant delivery pipes, etc., are required to transport the refrigerant to the refrigerant seat, which takes up considerable space and increases the inconvenience of the installation operation.

又,冷媒供應設備之冷媒輸送管具有一定之剛性以供輸送冷媒,因而不易作較小曲弧之彎折,導致壓接機構必須於壓接具之周側預留較大之配置空間,方可裝配冷媒輸送管,進而不利壓接機構之空間配置。 In addition, the refrigerant delivery pipe of the refrigerant supply equipment has a certain degree of rigidity for transporting refrigerant, so it is not easy to bend in a small arc. As a result, the crimping mechanism must reserve a large space around the crimping tool. The refrigerant delivery pipe can be installed to facilitate the space arrangement of the crimping mechanism.

由於作業機之測試裝置以冷媒作為溫控能源,當工作人員欲將作業機搬移至不同作業場所時,即需分別拆卸、分次搬運及重新組裝校機該作業機與冷媒供應設備,造成搬運作業上之繁瑣。 Since the testing device of the working machine uses refrigerant as the temperature control energy, when the staff wants to move the working machine to different working places, they need to disassemble, transport and reassemble the working machine and the refrigerant supply equipment separately, causing transportation problems. The work is complicated.

本發明之目的一,提供一種壓接機構,包含架置器、拾取單元、壓接具及溫控單元,拾取單元裝配於架置器,並設有具拾取部件之拾取器,以拾取部件取放電子元件,壓接具裝配於架置器,並設有壓接部,以供壓接電子元件,溫控單元於壓接具設有通孔,以供置入拾取部件,而於通孔與拾取部件之間構成氣體流道,氣體流道供流動具有預設溫度之氣體,令氣體與拾取部件作熱交換,而溫控拾取部件,於拾取部件貼合電子元件,而可使電子元件於模擬日後應用溫度環境執行測試作業,不僅有效節省溫控能源成本,並可確保溫控使用效能。 One object of the present invention is to provide a crimping mechanism, which includes a mounter, a pick-up unit, a crimping tool and a temperature control unit. The pick-up unit is assembled on the mounter and is provided with a picker with a pick-up component. The electronic components are placed. The crimping tool is assembled on the mounter and is provided with a crimping part for crimping the electronic components. The temperature control unit is provided with a through hole in the crimping tool for placing the pick-up component, and in the through hole A gas flow channel is formed between the pick-up part and the gas flow channel for flowing gas with a preset temperature to allow heat exchange between the gas and the pick-up part. The temperature-controlled pick-up part is attached to the electronic component on the pick-up part, so that the electronic component can be Performing test operations in a simulated future application temperature environment not only effectively saves temperature control energy costs, but also ensures temperature control efficiency.

本發明之目的二,提供一種壓接機構,其溫控單元於壓接具之延伸塊開設至少一通氣孔,通氣孔以供氣體流道之氣體分流流出至電子元件所在之測試空間,不僅可增加氣體與電子元件之熱交換面積,並使電子元件所在之測試空間保持預設測試溫度,進而提高溫控使用效能。 The second object of the present invention is to provide a crimping mechanism, the temperature control unit of which has at least one vent hole in the extension block of the crimping tool. The vent hole is used for the gas in the gas flow channel to flow out to the test space where the electronic components are located. It can not only increase the number of The heat exchange area between gas and electronic components keeps the test space where the electronic components are located at the preset test temperature, thereby improving the efficiency of temperature control.

本發明之目的三,提供一種壓接機構,其拾取器之拾取部件具有管部,管部設有容置空間,以供裝配可作至少一方向位移之吸嘴,吸嘴能夠拾取電子元件,溫控單元於拾取部件之管部開設穿孔,穿孔相通氣體流道及容置空間,以供氣體流道之氣體經穿孔流入於拾取部件之容置空間,於吸嘴脫離電子元件時,可使拾取部件之容置空間內的氣體接觸電子元件之頂面而增加熱交換面積,進而提高溫控使用效能。 The third object of the present invention is to provide a crimping mechanism. The pickup part of the pickup has a tube part. The tube part is provided with a receiving space for assembling a suction nozzle that can be displaced in at least one direction. The suction nozzle can pick up electronic components. The temperature control unit has a perforation in the tube part of the pickup component. The perforation communicates with the gas flow channel and the accommodation space, so that the gas in the gas flow channel flows into the accommodation space of the pickup component through the perforation. When the suction nozzle is separated from the electronic component, it can be The gas in the accommodation space of the pickup component contacts the top surface of the electronic component to increase the heat exchange area, thereby improving the temperature control efficiency.

本發明之目的四,提供一種壓接機構,其拾取單元設有連接具,以供容置拾取器,並於連接具與拾取器間設有一具複數個孔之中介件,複數個孔彼此相通且構成複數個擾流路徑,以供通過氣體,使氣體沿複數個擾流路徑流動而增加與拾取器之接合部件的溫度傳導率,進而提高溫控效能。 The fourth object of the present invention is to provide a crimping mechanism, the pickup unit of which is provided with a connector for accommodating the pickup, and an intermediary member with a plurality of holes is provided between the connector and the pickup, and the plurality of holes are connected to each other. A plurality of turbulent flow paths are formed for gas to pass through, so that the gas flows along the plurality of turbulent flow paths to increase the temperature conductivity of the joint parts with the pickup, thereby improving the temperature control efficiency.

本發明之目的五,提供一種壓接機構,其拾取單元於拾取器之拾取部件的外環面設有複數個鰭片,複數個鰭片位於氣體流道,而可增加氣體與拾取部件之熱交換面積,進而提高溫度傳導效能。 The fifth object of the present invention is to provide a crimping mechanism in which the pickup unit is provided with a plurality of fins on the outer ring surface of the pickup part of the pickup. The plurality of fins are located in the gas flow channel to increase the heat between the gas and the pickup part. exchange area, thereby improving temperature conduction efficiency.

本發明之目的六,提供一種測試裝置,包含測試機構及本發明壓接機構,測試機構設有至少一測試器,以供測試電子元件;本發明壓接機構位於測試機構之上方,包含架置器、拾取單元、壓接具及溫控單元,以供取放及壓接測試器之電子元件,並能夠溫控電子元件執行測試作業。 The sixth object of the present invention is to provide a testing device, which includes a testing mechanism and a crimping mechanism of the present invention. The testing mechanism is provided with at least one tester for testing electronic components; the crimping mechanism of the present invention is located above the testing mechanism and includes a mounting The tester, pick-up unit, crimping tool and temperature control unit are used to pick up, place and crimp the electronic components of the tester, and can temperature-control the electronic components to perform testing operations.

本發明之目的七,提供一種測試裝置,其測試機構設有基板,基板設有至少一承置部,以供裝配測試器,壓接機構之溫控單元於基板設有第二供氣道,以供氣體流入承置部,而溫控電子元件,並使電子元件所在之測試空間保持預設測試溫度,進而提高溫控效能。 The seventh object of the present invention is to provide a testing device. The testing mechanism is provided with a base plate. The base plate is provided with at least one receiving portion for assembling the tester. The temperature control unit of the crimping mechanism is provided with a second air supply channel on the base plate. The gas is supplied into the supporting part to temperature-control the electronic components and maintain the preset test temperature in the test space where the electronic components are located, thus improving the temperature control efficiency.

本發明之目的八,提供一種作業機,包含機台、供料裝置、收料裝置、測試裝置、輸送裝置及中央控制裝置,供料裝置配置於機台,並設有至少一供料器,以供容置至少一待測電子元件;收料裝置配置於機台,並設有至少一收料器,以供容置至少一已測電子元件;測試裝置配置於機台,包含測試機構及本發明壓接機構,測試機構設有至少一測試器,以供測試電子元件,壓接機構位於測試機構之上方,包含架置器、拾取單元、壓接具及溫控單元,以供取放及壓接測試器之電子元件,並能夠溫控電子元件執行測試作業;輸送裝 置配置於機台,並設有至少一輸送器,以供輸送電子元件;中央控制裝置以控制及整合各裝置作動而執行自動化作業。 The eighth object of the present invention is to provide a working machine, which includes a machine platform, a feeding device, a receiving device, a testing device, a conveying device and a central control device. The feeding device is arranged on the machine platform and is provided with at least one feeder. To accommodate at least one electronic component to be tested; the receiving device is arranged on the machine and is provided with at least one receiving device for accommodating at least one electronic component to be tested; the testing device is arranged on the machine and includes a testing mechanism and In the crimping mechanism of the present invention, the testing mechanism is provided with at least one tester for testing electronic components. The crimping mechanism is located above the testing mechanism and includes a mounter, a picking unit, a crimping tool and a temperature control unit for picking and placing. and electronic components of the crimp tester, and can perform testing operations on temperature-controlled electronic components; conveyor equipment It is placed on the machine platform and is provided with at least one conveyor for conveying electronic components; the central control device controls and integrates the actions of each device to perform automated operations.

10:測試裝置 10:Test device

11:移載臂 11:Transfer arm

12:拾取器 12: Pickup

121:接合部件 121:Joining parts

122:拾取部件 122: Pick up parts

1221:鰭片 1221:Fins

123:管部 123:Management Department

1231:穿孔 1231:Perforation

124:容置空間 124: Accommodation space

125:吸嘴 125:Suction nozzle

126:抽氣道 126:Pumping channel

13:連接具 13: Connector

131:第一連接件 131:First connector

132:第二連接件 132:Second connector

133:承裝空間 133: Loading space

14:壓接具 14:Crimping tool

141:板體 141:Plate body

142:延伸塊 142:Extension block

1421:通氣孔 1421:Vent hole

143:壓接部 143: Crimping part

144:通孔 144:Through hole

1441:大徑段 1441: Large diameter section

145:氣體流道 145:Gas flow channel

146:第一供氣道 146:First air supply channel

1461:第一供氣段 1461: First air supply section

1462:第二供氣段 1462: Second air supply section

1463:第三供氣段 1463: The third air supply section

151:電路板 151:Circuit board

152:測試座 152:Test seat

153:基板 153:Substrate

1531:承置部 1531:Acquisition Department

1532:第二供氣道 1532: Second air supply channel

16:排氣道 16:Exhaust channel

17:中介件 17: Intermediaryware

21:電子元件 21:Electronic components

30:機台 30:Machine

40:供料裝置 40: Feeding device

50:收料裝置 50:Receiving device

60:輸送裝置 60:Conveyor device

61:第一輸送器 61: First conveyor

62:第二輸送器 62: Second conveyor

63:第三輸送器 63:Third conveyor

64:第四輸送器 64:Fourth conveyor

圖1:本發明壓接機構第一實施例之示意圖。 Figure 1: Schematic diagram of the first embodiment of the crimping mechanism of the present invention.

圖2:本發明壓接機構應用於測試裝置之示意圖。 Figure 2: Schematic diagram of the crimping mechanism of the present invention applied to a testing device.

圖3:本發明壓接機構之使用示意圖。 Figure 3: Schematic diagram of the use of the crimping mechanism of the present invention.

圖4:係圖3之局部放大示意圖。 Figure 4: This is a partially enlarged schematic diagram of Figure 3.

圖5:本發明壓接機構第二實施例之示意圖。 Figure 5: Schematic diagram of the second embodiment of the crimping mechanism of the present invention.

圖6:本發明壓接機構第三實施例之示意圖。 Figure 6: Schematic diagram of the third embodiment of the crimping mechanism of the present invention.

圖7:本發明壓接機構第四實施例之示意圖。 Figure 7: Schematic diagram of the fourth embodiment of the crimping mechanism of the present invention.

圖8:本發明壓接機構第五實施例之示意圖。 Figure 8: Schematic diagram of the fifth embodiment of the crimping mechanism of the present invention.

圖9:本發明壓接機構第六實施例之示意圖。 Figure 9: Schematic diagram of the sixth embodiment of the crimping mechanism of the present invention.

圖10:本發明測試裝置應用於作業機之示意圖。 Figure 10: Schematic diagram of the testing device of the present invention applied to a work machine.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱圖1,本發明壓接機構之第一實施例包含架置器、拾取單元、壓接具及溫控單元。 In order for the review committee to have a further understanding of the present invention, a preferred embodiment is cited and accompanied by drawings, which are described in detail below: Please refer to Figure 1. The first embodiment of the crimping mechanism of the present invention includes a mounter, Pick-up unit, crimping tool and temperature control unit.

架置器以供直接或間接地裝配拾取單元,或者裝配拾取單元及壓接具;依作業需求,架置器可為固定式或活動式,例如架置器可為固定式之機架,例如架置器可為活動式之移載臂;於本實施例,架置器為可作至少一方向 位移之移載臂11,移載臂11可由移載驅動源(圖未示出)驅動作Y-Z方向位移,以帶動拾取單元、壓接具及溫控單元同步位移。 The mounter is used to directly or indirectly assemble the pick-up unit, or assemble the pick-up unit and the crimping tool; depending on the operation requirements, the mounter can be fixed or movable, for example, the mounter can be a fixed rack, such as The mounter can be a movable transfer arm; in this embodiment, the mounter can be moved in at least one direction. The transfer arm 11 can be driven by a transfer driving source (not shown) to move in the Y-Z direction to drive the pickup unit, the crimping tool and the temperature control unit to move synchronously.

拾取單元裝配於架置器,並設有至少一拾取器,拾取器設有至少一拾取部件,以供拾取電子元件。更進一步,拾取部件之一端可成型吸嘴,以取放電子元件,或者於拾取部件之內部裝配吸嘴,以吸嘴取放電子元件。依作業需求,拾取器可直接裝配於架置器,或者於拾取器與架置器之間配置連接具,使拾取器間接裝配於架置器。 The pickup unit is assembled on the mounter and is provided with at least one pickup. The pickup is provided with at least one pickup component for picking up electronic components. Furthermore, a suction nozzle can be formed at one end of the pickup component to pick and place electronic components, or a suction nozzle can be installed inside the pickup component to use the suction nozzle to pick up and place electronic components. Depending on the operation requirements, the picker can be directly assembled to the mounter, or a connector can be configured between the picker and the mounter so that the picker can be indirectly mounted to the mounter.

於本實施例,拾取單元包含拾取器12及連接具13。 In this embodiment, the pickup unit includes a pickup 12 and a connector 13 .

拾取器12為銅材製作,並設有接合部件121及拾取部件122,接合部件121為一呈水平配置之面板,並於底面作Z方向延伸設有拾取部件122,拾取部件122之一端具有管部123,管部123之底面朝頂面凹設有容置空間124,以供裝配吸嘴125;又拾取器12於接合部件121、拾取部件122及連接具13之間設有抽氣道126,抽氣道126之一端由連接具13處連接抽氣設備(圖未示出),另一端連通拾取器12之吸嘴125,以供吸嘴125取放電子元件。 The pickup 12 is made of copper and is provided with a joint component 121 and a pickup component 122. The joint component 121 is a horizontally arranged panel, and a pickup component 122 extends in the Z direction on the bottom surface. One end of the pickup component 122 has a tube. The bottom surface of the tube part 123 is recessed toward the top surface with a receiving space 124 for assembling the suction nozzle 125; and the pickup 12 is provided with an air extraction channel 126 between the joint component 121, the pickup component 122 and the connector 13. One end of the air extraction channel 126 is connected to an air extraction device (not shown) through the connector 13 , and the other end is connected to the suction nozzle 125 of the pickup 12 for the suction nozzle 125 to pick up and place electronic components.

依作業需求,拾取器12亦可於接合部件121及拾取部件122之間設有抽氣道,抽氣道之一端由接合部件121處連接抽氣設備,另一端連通吸嘴125,使吸嘴125取放電子元件,不受限於本實施例。 Depending on the operation requirements, the pickup 12 may also be provided with an air extraction channel between the joint component 121 and the pickup component 122. One end of the air extraction channel is connected to the air extraction equipment from the joint component 121, and the other end is connected to the suction nozzle 125, so that the suction nozzle 125 can take out the air. The discharge electronic components are not limited to this embodiment.

連接具13以供連接組裝該架置器及拾取器12。於本實施例,連接具13包含第一連接件131及第二連接件132,第一連接件131之頂部連接組裝移載臂11,而可由移載臂11帶動作Y-Z方向位移,第一連接件131之底部朝向頂部凹設一承裝空間133,第二連接件132之頂部裝配於第一連接件131之承裝空間133的內頂面,而底部則供裝配拾取器12之接合部件121,使拾取器12位於第一連接件131 之承裝空間133,並可隨連接具13同步作Y-Z方向位移。依作業需求,連接具13之承裝空間133更可容置壓接具14。 The connector 13 is used for connecting and assembling the mounter and the picker 12 . In this embodiment, the connector 13 includes a first connector 131 and a second connector 132. The top of the first connector 131 is connected to the assembly transfer arm 11, and can be driven by the transfer arm 11 to move in the Y-Z direction. The first connection A receiving space 133 is recessed from the bottom of the member 131 toward the top. The top of the second connecting member 132 is assembled on the inner top surface of the receiving space 133 of the first connecting member 131 , and the bottom is used for assembling the joint component 121 of the pickup 12 , so that the pickup 12 is located at the first connecting piece 131 The loading space 133 can be synchronously displaced in the Y-Z direction along with the connector 13 . According to operational requirements, the receiving space 133 of the connector 13 can further accommodate the crimping tool 14 .

依作業需求,連接具13之第一連接件131及第二連接件132亦可一體成型,或者連接具13僅配置第一連接件131,以第一連接件131供裝配拾取器12。又第一連接件131亦可不具有承裝空間,而於底部直接裝配拾取器12。第二連接件132亦可供裝配拾取器12及壓接具14,不受限於本實施例。 Depending on the operation requirements, the first connecting piece 131 and the second connecting piece 132 of the connecting tool 13 can also be integrally formed, or the connecting tool 13 is only equipped with the first connecting piece 131 and the first connecting piece 131 is used for assembling the picker 12 . In addition, the first connecting member 131 may not have a receiving space, and the pickup 12 may be directly assembled at the bottom. The second connector 132 can also be used to assemble the pickup 12 and the crimping tool 14, and is not limited to this embodiment.

壓接具14裝配於架置器,並設有至少一壓接部,以供壓接電子元件。依作業需求,壓接具14可直接裝配架置器;亦可裝配於拾取器12或連接具13,而間接裝配於架置器。於本實施例,壓接具14為塑材製作,並設有一呈水平配置之板體141,板體141之頂面組裝於拾取器12之接合部件121,而底面設有呈Z方向之延伸塊142,延伸塊142之底面於相對電子元件(圖未示出)之接腳位置設有壓接部143,壓接部143以供壓接電子元件之接腳。 The crimping tool 14 is assembled on the mounter and is provided with at least one crimping portion for crimping electronic components. Depending on the operation requirements, the crimping tool 14 can be directly assembled with the mounter; it can also be assembled with the picker 12 or the connector 13 and indirectly mounted with the mounter. In this embodiment, the crimping tool 14 is made of plastic material and is provided with a horizontally arranged plate body 141. The top surface of the plate body 141 is assembled to the joint component 121 of the pickup 12, and the bottom surface is provided with an extension in the Z direction. Block 142, the bottom surface of the extension block 142 is provided with a crimping portion 143 at a position corresponding to the pin of the electronic component (not shown), and the crimping portion 143 is used for crimping the pin of the electronic component.

溫控單元於壓接具14設有通孔,以供置入拾取器12之拾取部件122,而於通孔與拾取部件122之間構成氣體流道,氣體流道供流動具有預設溫度之氣體,以溫控拾取部件122,拾取部件122使電子元件保持預設作業溫度。更進一步,溫控單元於拾取單元設有第一供氣道,第一供氣道能夠將氣體輸送至氣體流道。 The temperature control unit is provided with a through hole in the crimping tool 14 for placing the pickup component 122 of the pickup 12, and a gas flow channel is formed between the through hole and the pickup component 122, and the gas flow channel allows the flow of gas with a preset temperature. The gas is used to temperature-control the pickup part 122, and the pickup part 122 keeps the electronic components at a preset operating temperature. Furthermore, the temperature control unit is provided with a first air supply channel in the pickup unit, and the first air supply channel can transport gas to the gas flow channel.

於本實施例,溫控單元於壓接具14設有一貫通板體141及延伸塊142之通孔144,通孔144靠近板體141頂面之一端設有大徑段1441,通孔144以供容置拾取器12之拾取部件122,而於通孔144與拾取部件122之間構成氣體流道145,氣體流道145供流動具有預設溫度之氣體(例如低溫氣體或高溫氣體)。溫控單元設有第一供氣道146,第一供氣道146於拾取器12之接合部件121及連接具13 之第一連接件131、第二連接件132分別設有相通之第一供氣段1461、第二供氣段1462及第三供氣段1463,第一供氣段1461之一端連通氣體流道145,第二供氣段1462之一端連通一氣體設備,氣體設備輸出具有預設溫度之氣體,氣體經由第一供氣道146之第一供氣段1461、第二供氣段1462及第三供氣段1463而流入氣體流道145,使具有預設溫度之氣體溫控拾取部件122,氣體流道145再由通孔144之底端排出氣體,使得排出之氣體可再溫控電子元件。 In this embodiment, the temperature control unit is provided with a through hole 144 on the crimping tool 14 that passes through the plate body 141 and the extension block 142. The through hole 144 is provided with a large diameter section 1441 at one end close to the top surface of the plate body 141. The through hole 144 is The pickup component 122 of the pickup 12 is accommodated, and a gas flow channel 145 is formed between the through hole 144 and the pickup component 122. The gas flow channel 145 is used for flowing gas with a preset temperature (such as low-temperature gas or high-temperature gas). The temperature control unit is provided with a first air supply channel 146. The first air supply channel 146 is connected to the joint component 121 and the connector 13 of the pickup 12. The first connecting piece 131 and the second connecting piece 132 are respectively provided with a first air supply section 1461, a second air supply section 1462 and a third air supply section 1463. One end of the first air supply section 1461 is connected to the gas flow channel. 145. One end of the second gas supply section 1462 is connected to a gas equipment. The gas equipment outputs gas with a preset temperature. The gas passes through the first gas supply section 1461, the second gas supply section 1462 and the third gas supply section of the first gas supply channel 146. The gas section 1463 flows into the gas flow channel 145 to control the temperature of the gas pickup component 122 with a preset temperature. The gas flow channel 145 then discharges the gas from the bottom end of the through hole 144 so that the discharged gas can temperature control electronic components.

因此,壓接機構之溫控單元以具有預設溫度之氣體作為溫控能源,不僅可有效節省成本,氣體設備之體積小,而可便利配置於作業機,並縮短供氣輸送管之長度,及利於場所空間配置,以及便利搬移作業機及氣體設備,進而提高配置作業上之便利性。 Therefore, the temperature control unit of the crimping mechanism uses gas with a preset temperature as the temperature control energy, which not only effectively saves costs, but also makes the gas equipment small in size and can be conveniently installed on the operating machine and shortens the length of the gas supply pipe. It is also beneficial to the space configuration of the site, as well as the transportation of operating machines and gas equipment, thereby improving the convenience of configuration operations.

溫控單元之第一供氣道146連接氣體之供氣輸送管,供氣輸送管毋需保持剛性,可作較小曲弧之變折,以利縮減佔用拾取器12之周側空間,進而利於壓接機構之空間配置。 The first air supply channel 146 of the temperature control unit is connected to the gas supply conveying pipe. The air supply conveying pipe does not need to remain rigid and can be bent into a smaller arc to facilitate reducing the space occupied by the pickup 12, thereby facilitating Spatial configuration of the crimping mechanism.

依作業需求,溫控單元可於壓接具14設有排氣道,排氣道一端相通氣體流道145,另一端相通外部或氣體設備,亦無不可。 Depending on the operation requirements, the temperature control unit can be provided with an exhaust channel on the crimping tool 14. One end of the exhaust channel is connected to the gas flow channel 145, and the other end is connected to external or gas equipment.

依作業需求,壓接機構可於拾取器12、連接具13或壓接具14配置至少一加熱件(圖未示出),以供配合調節氣體之預設溫度。另可於拾取器12或壓接具14配置至少一感測器(圖未示出),以感測溫度。 Depending on the operation requirements, the crimping mechanism can be equipped with at least one heating element (not shown) on the pickup 12, the connecting tool 13 or the crimping tool 14 to coordinately adjust the preset temperature of the gas. In addition, at least one sensor (not shown) can be configured on the pickup 12 or the crimping tool 14 to sense temperature.

請參閱圖2~4,本發明壓接機構應用於測試裝置10,測試裝置10包含測試機構及壓接機構,測試機構設有至少一測試器,以供測試電子元件,於本實施例,測試器設有電性連接之電路板151及測試座152,測試座152以供承置及測試電子元件,另測試機構設有基板153,基板153設有至少一承置部1531 ,以供裝配測試器之測試座152。本發明壓接機構配置於測試機構之上方,並以拾取器12之抽氣道126經吸嘴125而吸附拾取一具接腳之電子元件21,電子元件21之頂面貼合於拾取器12之拾取部件122的管部123,並位於壓接具14之二壓接部143間,且使接腳凸伸位於壓接部143之下方,以便電性連接測試座152之接點;於拾取器12之吸嘴125拾取電子元件21後,壓接機構之移載臂11帶動拾取器12及連接具13位移至測試座152之上方。 Please refer to Figures 2 to 4. The crimping mechanism of the present invention is applied to the test device 10. The test device 10 includes a testing mechanism and a crimping mechanism. The testing mechanism is equipped with at least one tester for testing electronic components. In this embodiment, the test The device is provided with an electrically connected circuit board 151 and a test socket 152. The test socket 152 is used to hold and test electronic components. The test mechanism is also provided with a substrate 153. The substrate 153 is provided with at least one receiving portion 1531. , for assembling the test socket 152 of the tester. The crimping mechanism of the present invention is arranged above the testing mechanism, and uses the suction channel 126 of the pickup 12 to suck and pick up an electronic component 21 with pins through the suction nozzle 125. The top surface of the electronic component 21 is attached to the pickup 12 The tube part 123 of the pickup component 122 is located between the two crimping parts 143 of the crimping tool 14, and the pins are extended below the crimping parts 143 to electrically connect the contacts of the test socket 152; in the pickup After the suction nozzle 125 picks up the electronic component 21 , the transfer arm 11 of the crimping mechanism drives the pickup 12 and the connector 13 to move above the test seat 152 .

移載臂11帶動連接具13、拾取器12、壓接具14及電子元件21同步作Z方向向下位移,令拾取器12將電子元件21移入測試座152,電子元件21之接腳電性連接測試座152之接點,連接具13之第一連接件131罩置於基板153之頂面,並使第一連接件131的承裝空間133、基板153的承置部1531與測試座152之間構成一測試空間,以避免氣體任意流散,而可使電子元件21於具有預設溫度氣體之測試空間執行測試作業。第一連接件131之底面與基板153之頂面具有適當間隙而形成一排氣道16,以供排出氣體。 The transfer arm 11 drives the connector 13, the pickup 12, the crimping tool 14 and the electronic component 21 to simultaneously move downward in the Z direction, causing the pickup 12 to move the electronic component 21 into the test seat 152. The pins of the electronic component 21 are electrically Connect the contacts of the test socket 152, the first connector 131 of the connector 13 is placed on the top surface of the base plate 153, and the receiving space 133 of the first connector 131, the receiving portion 1531 of the base plate 153 and the test socket 152 are connected. A test space is formed between them to avoid random dispersion of gas, so that the electronic component 21 can perform testing operations in the test space with gas at a preset temperature. There is an appropriate gap between the bottom surface of the first connecting member 131 and the top surface of the base plate 153 to form an exhaust channel 16 for exhausting gas.

依作業需求,若測試機構未配置基板153,壓接機構之連接具13亦可與測試座152間具有適當間隙而形成一排氣道16,以供排出氣體,不受限本實施例。 Depending on the operation requirements, if the test mechanism is not equipped with the substrate 153, the connector 13 of the crimping mechanism can also have an appropriate gap with the test seat 152 to form an exhaust channel 16 for exhausting gas, which is not limited to this embodiment.

於冷測作業,壓接機構之第一供氣道146接收氣體設備輸入之低溫氣體,低溫氣體經第一流道段1461、第二流道段1462及第三流道段1463而流入於拾取器12之拾取部件122與壓接具14之延伸塊142間的氣體流道145,亦即由氣體流道145一端之入口端流入低溫氣體,使低溫氣體直接與拾取部件122作熱交換,而提高溫度傳導率,以利迅速溫控拾取部件122呈預設低溫狀態,由於拾取部件122之管部123貼合電子元件21之頂面,而可將低溫傳導至電子元件21,使電子元 件21於模擬日後低溫環境執行冷測作業。又電子元件21位於壓接具14之通孔144端部,亦即位於氣體流道145另一端之出口端,氣體流道145流出之低溫氣體會流經電子元件21而作熱交換,亦可輔助降低電子元件21之溫度,低溫氣體再流動至一由測試座152、基板153的承置部1531及第一連接件131的承裝空間133所構成之測試空間,以避免氣體任意迅速流散,使測試空間具有低溫氣體,而可使電子元件21位於具有低溫氣體之測試空間執行冷測作業;之後測試空間的低溫氣體由第一連接件131與基板153間之排氣道16排出。 During the cold test operation, the first air supply channel 146 of the crimping mechanism receives the low-temperature gas input from the gas equipment. The low-temperature gas flows into the pickup 12 through the first flow channel section 1461, the second flow channel section 1462, and the third flow channel section 1463. The gas flow channel 145 between the pick-up part 122 and the extension block 142 of the crimping tool 14, that is, the low-temperature gas flows in from the inlet end of one end of the gas flow channel 145, so that the low-temperature gas directly exchanges heat with the pick-up part 122, thereby increasing the temperature. conductivity to facilitate rapid temperature control of the pick-up component 122 to a preset low temperature state. Since the tube portion 123 of the pick-up component 122 is in contact with the top surface of the electronic component 21, the low temperature can be conducted to the electronic component 21, making the electronic component Part 21 performs cold testing operations in a simulated low-temperature environment in the future. In addition, the electronic component 21 is located at the end of the through hole 144 of the crimping tool 14, that is, at the outlet end of the other end of the gas flow channel 145. The low-temperature gas flowing out of the gas flow channel 145 will flow through the electronic component 21 for heat exchange. To assist in lowering the temperature of the electronic component 21, the low-temperature gas then flows to a test space composed of the test seat 152, the receiving portion 1531 of the substrate 153, and the receiving space 133 of the first connector 131 to avoid any rapid dispersion of the gas. By providing the test space with low-temperature gas, the electronic component 21 can be placed in the test space with low-temperature gas to perform cold testing operations; then, the low-temperature gas in the test space is discharged from the exhaust channel 16 between the first connector 131 and the substrate 153 .

請參閱圖5,本發明壓接機構之第二實施例的設計大致相同第一實施例,其差異在於壓接具14之延伸塊142開設至少一通氣孔1421,通氣孔1421以供氣體流道145之氣體分流流出至電子元件21所在之空間(例如測試空間),以增加氣體與電子元件21之熱交換面積,並可更加迅速使電子元件21所在之空間保持預設測試溫度。 Please refer to Figure 5. The design of the second embodiment of the crimping mechanism of the present invention is basically the same as that of the first embodiment. The difference is that the extension block 142 of the crimping tool 14 is provided with at least one vent hole 1421, and the vent hole 1421 is used for the gas flow channel 145. The gas flows out separately to the space where the electronic component 21 is located (such as the test space) to increase the heat exchange area between the gas and the electronic component 21 and to maintain the preset test temperature in the space where the electronic component 21 is located more quickly.

請參閱圖6,本發明壓接機構之第三實施例的設計大致相同第一實施例,其差異在於溫控單元於拾取部件122之管部123開設至少一穿孔1231,穿孔1231相通氣體流道145及容置空間124。更進一步,吸嘴125可由吸嘴驅動器(圖未示出)驅動作至少一方向(例如Z方向)位移。因此,溫控單元之氣體流道145的低溫氣體可經由拾取部件122之穿孔1231流入於容置空間124,使容置空間124具有低溫氣體,利用容置空間124內之低溫氣體與電子元件21之頂面作熱交換而增加溫度傳導率,進而提高溫控效能。再者,當溫控單元以吸嘴驅動器驅動吸嘴125作Z方向向上位移而脫離電子元件21之頂面時,令拾取部件122之容置空間124內的低溫氣體直接接觸電子元件21之頂面,而可更增加熱交換面積,進而更加提高溫控效能。 Please refer to Figure 6. The design of the third embodiment of the crimping mechanism of the present invention is basically the same as that of the first embodiment. The difference is that the temperature control unit opens at least one through hole 1231 in the tube portion 123 of the pickup component 122. The through hole 1231 communicates with the gas flow channel. 145 and accommodation space 124. Furthermore, the suction nozzle 125 can be driven by a suction nozzle driver (not shown) to displace in at least one direction (eg, Z direction). Therefore, the low-temperature gas in the gas flow channel 145 of the temperature control unit can flow into the accommodating space 124 through the perforation 1231 of the pickup component 122, so that the accommodating space 124 has low-temperature gas, and the low-temperature gas in the accommodating space 124 can be used with the electronic components 21 The top surface performs heat exchange to increase the temperature conductivity, thereby improving the temperature control efficiency. Furthermore, when the temperature control unit uses the nozzle driver to drive the suction nozzle 125 to move upward in the Z direction and away from the top surface of the electronic component 21 , the low-temperature gas in the accommodation space 124 of the pickup component 122 directly contacts the top of the electronic component 21 surface, which can further increase the heat exchange area, thereby further improving the temperature control efficiency.

請參閱圖7,本發明壓接機構之第四實施例的設計大致相同第一實施例,其差異在於拾取單元於拾取器12之拾取部件122的外環面設有至少一鰭片1221;於本實施例,拾取器12於拾取部件122之外環面且相對應通孔144之大徑段1441的位置設有複數個鰭片1221,以增加拾取部件122與氣體流道145內之氣體的熱交換面積。 Please refer to Figure 7. The design of the fourth embodiment of the crimping mechanism of the present invention is basically the same as that of the first embodiment. The difference is that the pickup unit is provided with at least one fin 1221 on the outer ring surface of the pickup component 122 of the pickup 12; In this embodiment, the pickup 12 is provided with a plurality of fins 1221 on the outer annular surface of the pickup component 122 and at positions corresponding to the large-diameter section 1441 of the through hole 144 to increase the flow of gas between the pickup component 122 and the gas flow channel 145 . heat exchange area.

請參閱圖8,本發明壓接機構之第五實施例的設計大致相同第一實施例,其差異在於溫控單元於連接具13與拾取器12間配置有至少一中介件17,中介件17開設複數個彼此相通之孔,複數個孔之間構成擾流路徑,複數個孔相通第一供氣道146。於本實施例,溫控單元可於連接具13之第一連接件131與拾取器12之接合部件121間設置中介件17,中介件17為發泡金屬,其具有複數個彼此相通之孔,複數個孔之間構成擾流路徑,第一供氣道146之第二流道段1462的氣體可流入中介件17之彼此相通的孔,並沿擾流路徑流入拾取器12之第一流道段1461,再由第一流道段1461流入氣體流道145,由於氣體於中介件17之擾流路徑流動,而可增加氣體與拾取器12之接合部件121的熱交換面積,進而更加提高溫控拾取器12之使用效能。 Please refer to Figure 8. The design of the fifth embodiment of the crimping mechanism of the present invention is basically the same as that of the first embodiment. The difference is that the temperature control unit is equipped with at least one intermediary member 17 between the connector 13 and the pickup 12. The intermediary member 17 A plurality of holes that communicate with each other are opened, and a spoiler path is formed between the plurality of holes, and the plurality of holes communicate with the first air supply channel 146 . In this embodiment, the temperature control unit can be provided with an intermediary member 17 between the first connecting member 131 of the connector 13 and the joint component 121 of the pickup 12. The intermediary member 17 is made of foam metal and has a plurality of holes that communicate with each other. A spoiler path is formed between the plurality of holes. The gas in the second flow channel section 1462 of the first air supply channel 146 can flow into the interconnected holes of the intermediary member 17 and flow into the first flow channel section 1461 of the pickup 12 along the spoiler path. , and then flows into the gas flow channel 145 from the first flow channel section 1461. Since the gas flows in the turbulent flow path of the intermediary member 17, the heat exchange area between the gas and the joint component 121 of the pickup 12 can be increased, thereby further improving the temperature control pickup. 12 usage efficiency.

請參閱圖9,本發明壓接機構之第六實施例的設計大致相同第一實施例,其差異在於壓接機構之溫控單元於測試機構之基板153設有第二供氣道1532,以供氣體流入承置部1531及測試座152之內部,而可直接溫控電子元件21,進而提高溫控效能。 Please refer to Figure 9. The design of the sixth embodiment of the crimping mechanism of the present invention is basically the same as that of the first embodiment. The difference is that the temperature control unit of the crimping mechanism is provided with a second air supply channel 1532 on the substrate 153 of the testing mechanism. The gas flows into the inside of the receiving part 1531 and the test seat 152, and can directly temperature control the electronic component 21, thereby improving the temperature control efficiency.

請參閱圖1~4及圖10,本發明壓接機構應用於電子元件作業機,作業機包含機台30、供料裝置40、收料裝置50、測試裝置10、輸送裝置60及中央控制裝置(圖未示出);供料裝置40裝配於機台30,並設有至少一供料器,以容納 至少一待測之電子元件;收料裝置50裝配於機台30,並設有至少一收料器,以容納至少一已測之電子元件;測試裝置10配置於機台30,包含測試機構及本發明之壓接機構,測試機構設有至少一測試器,以供測試電子元件,壓接機構以供取放及壓接測試器之電子元件,並能夠溫控電子元件執行測試作業;於本實施例,測試器設有電性連接之電路板151及具傳輸件(如探針)之測試座152,測試座152以供承置及測試電子元件,另於機台30設有基板153,以供裝配測試座152;輸送裝置60裝配於機台30,並設有至少一輸送器,以輸送電子元件;於本實施例,輸送裝置60設有第一輸送器61,以於供料裝置40之供料器取出待測電子元件,並將待測電子元件移載至第二輸送器62,第二輸送器62將待測電子元件載送至測試裝置10之側方,測試裝置10之壓接機構以移載臂11將連接具13、拾取器12及壓接具14移載至第二輸送器62之上方,並以拾取器12將第二輸送器62之待測電子元件移載至測試座152而執行測試作業,以及將已測電子元件移載至第三輸送器63而載出,第四輸送器64於第三輸送器63取出已測電子元件,並輸送至收料裝置50之收料器處而分類收置;中央控制裝置(圖未示出)用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 Please refer to Figures 1 to 4 and 10. The crimping mechanism of the present invention is applied to an electronic component working machine. The working machine includes a machine table 30, a feeding device 40, a receiving device 50, a testing device 10, a conveying device 60 and a central control device. (not shown in the figure); the feeding device 40 is assembled on the machine 30 and is provided with at least one feeder to accommodate At least one electronic component to be tested; the receiving device 50 is assembled on the machine 30 and is provided with at least one receiving device to accommodate at least one electronic component that has been tested; the testing device 10 is configured on the machine 30 and includes a testing mechanism and In the crimping mechanism of the present invention, the testing mechanism is provided with at least one tester for testing electronic components. The crimping mechanism is used for picking up, placing and crimping the electronic components of the tester, and can temperature-control the electronic components to perform testing operations; in this invention In the embodiment, the tester is provided with an electrically connected circuit board 151 and a test socket 152 with transmission parts (such as probes). The test socket 152 is used to hold and test electronic components. In addition, a substrate 153 is provided on the machine 30. For assembling the test seat 152; the conveying device 60 is assembled on the machine 30 and is provided with at least one conveyor for conveying electronic components; in this embodiment, the conveying device 60 is provided with a first conveyor 61 for feeding the feeding device The feeder 40 takes out the electronic components to be tested and transfers the electronic components to be tested to the second conveyor 62. The second conveyor 62 carries the electronic components to be tested to the side of the testing device 10. The crimping mechanism uses the transfer arm 11 to transfer the connector 13, the picker 12 and the crimping tool 14 to above the second conveyor 62, and uses the picker 12 to transfer the electronic components to be tested on the second conveyor 62. Go to the test seat 152 to perform the test operation, and transfer the tested electronic components to the third conveyor 63 for loading. The fourth conveyor 64 takes out the tested electronic components from the third conveyor 63 and transports them to the receiving device. 50 pieces of materials are sorted and stored at the receiving device; the central control device (not shown) is used to control and integrate the actions of each device to perform automated operations and achieve practical benefits of improving operating efficiency.

12:拾取器 12: Pickup

122:拾取部件 122: Pick up parts

123:管部 123:Management Department

125:吸嘴 125:Suction nozzle

131:第一連接件 131:First connector

133:承裝空間 133: Loading space

14:壓接具 14:Crimping tool

142:延伸塊 142:Extension block

145:氣體流道 145:Gas flow channel

1461:第一供氣段 1461: First air supply section

1463:第三供氣段 1463: The third air supply section

152:測試座 152:Test seat

153:基板 153:Substrate

1531:承置部 1531:Acquisition Department

16:排氣道 16:Exhaust channel

21:電子元件 21:Electronic components

Claims (15)

一種壓接機構,包含:架置器;拾取單元:裝配於該架置器,並設有至少一拾取器,該拾取器設有至少一拾取部件,以供拾取電子元件;壓接具:裝配於該架置器,並設有至少一壓接部,以供壓接該電子元件;溫控單元:於該壓接具設有通孔,以供置入該拾取器之該拾取部件,而於該通孔與該拾取部件之間構成氣體流道,該氣體流道供流動具有預設溫度之氣體,以溫控該拾取部件,該拾取部件可使該電子元件保持預設作業溫度。 A crimping mechanism, including: a mounter; a pick-up unit: assembled on the mounter and provided with at least one pick-up, the pick-up is provided with at least one pick-up component for picking up electronic components; a crimping tool: assembly The holder is provided with at least one crimping portion for crimping the electronic component; the temperature control unit is provided with a through hole on the crimping tool for inserting the pickup component of the pickup, and A gas flow channel is formed between the through hole and the pick-up component, and the gas flow channel is used to flow gas with a preset temperature to temperature-control the pick-up component. The pick-up component can maintain the preset operating temperature of the electronic component. 如請求項1所述之壓接機構,其該溫控單元於該壓接具之延伸塊開設至少一通氣孔,該通氣孔以供該氣體流道之該氣體分流流出至該電子元件所在之空間。 As for the crimping mechanism described in claim 1, the temperature control unit has at least one vent hole in the extension block of the crimping tool, and the vent hole is used to allow the gas in the gas flow channel to flow out to the space where the electronic component is located. . 如請求項1所述之壓接機構,其該拾取器之該拾取部件設有管部,該管部設有容置空間,以供裝配吸嘴,該吸嘴連通抽氣道而能夠拾取該電子元件。 As for the crimping mechanism according to claim 1, the pickup part of the pickup is provided with a tube part, and the tube part is provided with a receiving space for assembling a suction nozzle, and the suction nozzle is connected to the air extraction channel to be able to pick up the electronics. element. 如請求項3所述之壓接機構,其該溫控單元於該拾取部件之該管部開設至少一穿孔,該穿孔相通該氣體流道及該容置空間。 As for the crimping mechanism described in claim 3, the temperature control unit has at least one perforation in the tube part of the pickup component, and the perforation communicates with the gas flow channel and the accommodation space. 如請求項4所述之壓接機構,其該吸嘴可作至少一方向位移。 As for the crimping mechanism described in claim 4, the suction nozzle can be displaced in at least one direction. 如請求項1所述之壓接機構,其該拾取單元更包含連接具,該連接具以供連接該架置器及該拾取器。 According to the crimping mechanism of claim 1, the pickup unit further includes a connector for connecting the mounter and the pickup. 如請求項6所述之壓接機構,其該連接具與該拾取器之間配置有至 少一中介件,該中介件開設複數個彼此相通之孔,該複數個孔之間形成擾流路徑,以供流通該氣體。 The crimping mechanism according to claim 6, wherein there is between the connector and the pickup There is an intermediary member, and the intermediary member is provided with a plurality of holes that communicate with each other, and a turbulent flow path is formed between the plurality of holes for the circulation of the gas. 如請求項1至7中任一項所述之壓接機構,其該溫控單元於該拾取單元設有第一供氣道,該第一供氣道能夠將該氣體輸送至該氣體流道。 The crimping mechanism according to any one of claims 1 to 7, wherein the temperature control unit is provided with a first air supply channel in the pickup unit, and the first air supply channel can deliver the gas to the gas flow channel. 如請求項1至7中任一項所述之壓接機構,其該拾取單元於該拾取部件之外環面設有至少一鰭片。 The crimping mechanism according to any one of claims 1 to 7, wherein the pickup unit is provided with at least one fin on the outer annular surface of the pickup component. 如請求項1至7中任一項所述之壓接機構,其該架置器可作至少一方向位移。 For the crimping mechanism according to any one of claims 1 to 7, the mounter can be displaced in at least one direction. 一種測試裝置,包含:測試機構:設有至少一測試器,以供測試電子元件;至少一如請求項1所述之壓接機構:以供取放及壓接該測試器之該電子元件,並能夠溫控該電子元件。 A testing device, including: a testing mechanism: equipped with at least one tester for testing electronic components; at least one crimping mechanism as described in claim 1: for picking up, placing and crimping the electronic components of the tester, And can temperature control the electronic component. 如請求項11所述之測試裝置,其該測試機構設有基板,該基板設有至少一承置部,以供裝配該測試器。 The test device of claim 11, wherein the test mechanism is provided with a base plate, and the base plate is provided with at least one receiving portion for assembling the tester. 如請求項12所述之測試裝置,其該壓接機構之溫控單元於該基板設有第二供氣道,以供氣體流入該承置部,而溫控該電子元件。 As for the test device described in claim 12, the temperature control unit of the crimping mechanism is provided with a second air supply channel on the substrate to allow gas to flow into the receiving portion and temperature control the electronic component. 如請求項12或13所述之測試裝置,其該壓接機構之拾取單元更包含連接具,該連接具以供連接組裝架置器及拾取器,該連接具與該基板之間構成排氣道,以供排出氣體。 As claimed in claim 12 or 13, the pickup unit of the crimping mechanism further includes a connector for connecting the assembly mounter and the pickup, and an exhaust gas is formed between the connector and the substrate. channel for exhausting gas. 一種作業機,包含:機台;供料裝置:配置於該機台,並設有至少一供料器,以供容置至少一待測電子元件; 收料裝置:配置於該機台,並設有至少一收料器,以供容置至少一已測電子元件;至少一如請求項11所述之測試裝置:配置於該機台;輸送裝置:配置於該機台,並設有至少一輸送器,以供輸送電子元件;中央控制裝置:以控制及整合各裝置作動而執行自動化作業。 An operating machine, including: a machine platform; a feeding device: configured on the machine platform and provided with at least one feeder for accommodating at least one electronic component to be tested; Receiving device: disposed on the machine, and provided with at least one receiving device for accommodating at least one tested electronic component; at least one testing device as described in claim 11: disposed on the machine; conveying device : Configured on the machine and equipped with at least one conveyor for conveying electronic components; central control device: to control and integrate the actions of each device to perform automated operations.
TW112101603A 2023-01-13 Pressing mechanism, testing device, and processing machine TWI834475B (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9582749B2 (en) 2013-03-04 2017-02-28 Hello Inc. Wearable device with adjacent magnets magnetized in different directions

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9582749B2 (en) 2013-03-04 2017-02-28 Hello Inc. Wearable device with adjacent magnets magnetized in different directions

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