TWI834475B - Pressing mechanism, testing device, and processing machine - Google Patents
Pressing mechanism, testing device, and processing machine Download PDFInfo
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- TWI834475B TWI834475B TW112101603A TW112101603A TWI834475B TW I834475 B TWI834475 B TW I834475B TW 112101603 A TW112101603 A TW 112101603A TW 112101603 A TW112101603 A TW 112101603A TW I834475 B TWI834475 B TW I834475B
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- 238000012360 testing method Methods 0.000 title claims abstract description 90
- 238000002788 crimping Methods 0.000 claims description 106
- 239000000758 substrate Substances 0.000 claims description 11
- 238000000605 extraction Methods 0.000 claims description 8
- 230000004308 accommodation Effects 0.000 claims description 7
- 239000003507 refrigerant Substances 0.000 description 21
- 238000012546 transfer Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 5
- 230000032258 transport Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
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Abstract
Description
本發明提供一種便於溫控電子元件及節省能源成本之壓接機構。 The invention provides a crimping mechanism that facilitates temperature control of electronic components and saves energy costs.
電子元件日後會應用於高溫環境或低溫環境,於出廠前,需以作業機之測試裝置對電子元件執行熱測作業或冷測作業,以淘汰不良品。以冷測作業為例,測試裝置包含測試器及壓接機構,測試器以供承置及測試電子元件,壓接機構位於測試器之上方,並設有壓接具以壓接電子元件,壓接具之抽氣孔供吸附移載電子元件,另於壓接具之上方設有冷媒座,冷媒座之兩端分別以冷媒輸送管連接冷媒供應設備,使冷媒供應設備將冷媒輸入至冷媒座,以溫控壓接具,壓接具將低溫傳導至電子元件,使電子元件於模擬日後應用低溫環境執行冷測作業,冷媒座再將冷媒輸出至冷媒供應設備。 Electronic components will be used in high-temperature or low-temperature environments in the future. Before leaving the factory, it is necessary to perform hot testing or cold testing on the electronic components using the testing device of the operating machine to eliminate defective products. Taking the cold test operation as an example, the test device includes a tester and a crimping mechanism. The tester is used to hold and test electronic components. The crimping mechanism is located above the tester and is equipped with a crimping tool to crimp electronic components. The air extraction hole of the connector is used for adsorbing and transferring electronic components. There is also a refrigerant seat above the crimping tool. Both ends of the refrigerant seat are connected to the refrigerant supply equipment with refrigerant delivery pipes, so that the refrigerant supply equipment can input refrigerant to the refrigerant seat. Using a temperature-controlled crimping tool, the crimping tool conducts low temperature to the electronic components, allowing the electronic components to perform cold testing operations in a low-temperature environment after simulating the future. The refrigerant seat then outputs the refrigerant to the refrigerant supply equipment.
此一方式雖可溫控壓接具,但以冷媒作為溫控之能源,不僅增加溫控能源成本,冷媒供應設備之體積大必須獨立配置,更需配置複數個轉接管及較長尺寸之冷媒輸送管等,方可將冷媒輸送至冷媒座,以致相當佔用場所空間,亦增加配置作業上之不便。 Although this method can control the temperature of the crimping tool, using refrigerant as the energy source for temperature control not only increases the cost of temperature control energy, but the refrigerant supply equipment is large and must be configured independently. It also requires multiple transfer pipes and longer sizes. Refrigerant delivery pipes, etc., are required to transport the refrigerant to the refrigerant seat, which takes up considerable space and increases the inconvenience of the installation operation.
又,冷媒供應設備之冷媒輸送管具有一定之剛性以供輸送冷媒,因而不易作較小曲弧之彎折,導致壓接機構必須於壓接具之周側預留較大之配置空間,方可裝配冷媒輸送管,進而不利壓接機構之空間配置。 In addition, the refrigerant delivery pipe of the refrigerant supply equipment has a certain degree of rigidity for transporting refrigerant, so it is not easy to bend in a small arc. As a result, the crimping mechanism must reserve a large space around the crimping tool. The refrigerant delivery pipe can be installed to facilitate the space arrangement of the crimping mechanism.
由於作業機之測試裝置以冷媒作為溫控能源,當工作人員欲將作業機搬移至不同作業場所時,即需分別拆卸、分次搬運及重新組裝校機該作業機與冷媒供應設備,造成搬運作業上之繁瑣。 Since the testing device of the working machine uses refrigerant as the temperature control energy, when the staff wants to move the working machine to different working places, they need to disassemble, transport and reassemble the working machine and the refrigerant supply equipment separately, causing transportation problems. The work is complicated.
本發明之目的一,提供一種壓接機構,包含架置器、拾取單元、壓接具及溫控單元,拾取單元裝配於架置器,並設有具拾取部件之拾取器,以拾取部件取放電子元件,壓接具裝配於架置器,並設有壓接部,以供壓接電子元件,溫控單元於壓接具設有通孔,以供置入拾取部件,而於通孔與拾取部件之間構成氣體流道,氣體流道供流動具有預設溫度之氣體,令氣體與拾取部件作熱交換,而溫控拾取部件,於拾取部件貼合電子元件,而可使電子元件於模擬日後應用溫度環境執行測試作業,不僅有效節省溫控能源成本,並可確保溫控使用效能。 One object of the present invention is to provide a crimping mechanism, which includes a mounter, a pick-up unit, a crimping tool and a temperature control unit. The pick-up unit is assembled on the mounter and is provided with a picker with a pick-up component. The electronic components are placed. The crimping tool is assembled on the mounter and is provided with a crimping part for crimping the electronic components. The temperature control unit is provided with a through hole in the crimping tool for placing the pick-up component, and in the through hole A gas flow channel is formed between the pick-up part and the gas flow channel for flowing gas with a preset temperature to allow heat exchange between the gas and the pick-up part. The temperature-controlled pick-up part is attached to the electronic component on the pick-up part, so that the electronic component can be Performing test operations in a simulated future application temperature environment not only effectively saves temperature control energy costs, but also ensures temperature control efficiency.
本發明之目的二,提供一種壓接機構,其溫控單元於壓接具之延伸塊開設至少一通氣孔,通氣孔以供氣體流道之氣體分流流出至電子元件所在之測試空間,不僅可增加氣體與電子元件之熱交換面積,並使電子元件所在之測試空間保持預設測試溫度,進而提高溫控使用效能。 The second object of the present invention is to provide a crimping mechanism, the temperature control unit of which has at least one vent hole in the extension block of the crimping tool. The vent hole is used for the gas in the gas flow channel to flow out to the test space where the electronic components are located. It can not only increase the number of The heat exchange area between gas and electronic components keeps the test space where the electronic components are located at the preset test temperature, thereby improving the efficiency of temperature control.
本發明之目的三,提供一種壓接機構,其拾取器之拾取部件具有管部,管部設有容置空間,以供裝配可作至少一方向位移之吸嘴,吸嘴能夠拾取電子元件,溫控單元於拾取部件之管部開設穿孔,穿孔相通氣體流道及容置空間,以供氣體流道之氣體經穿孔流入於拾取部件之容置空間,於吸嘴脫離電子元件時,可使拾取部件之容置空間內的氣體接觸電子元件之頂面而增加熱交換面積,進而提高溫控使用效能。 The third object of the present invention is to provide a crimping mechanism. The pickup part of the pickup has a tube part. The tube part is provided with a receiving space for assembling a suction nozzle that can be displaced in at least one direction. The suction nozzle can pick up electronic components. The temperature control unit has a perforation in the tube part of the pickup component. The perforation communicates with the gas flow channel and the accommodation space, so that the gas in the gas flow channel flows into the accommodation space of the pickup component through the perforation. When the suction nozzle is separated from the electronic component, it can be The gas in the accommodation space of the pickup component contacts the top surface of the electronic component to increase the heat exchange area, thereby improving the temperature control efficiency.
本發明之目的四,提供一種壓接機構,其拾取單元設有連接具,以供容置拾取器,並於連接具與拾取器間設有一具複數個孔之中介件,複數個孔彼此相通且構成複數個擾流路徑,以供通過氣體,使氣體沿複數個擾流路徑流動而增加與拾取器之接合部件的溫度傳導率,進而提高溫控效能。 The fourth object of the present invention is to provide a crimping mechanism, the pickup unit of which is provided with a connector for accommodating the pickup, and an intermediary member with a plurality of holes is provided between the connector and the pickup, and the plurality of holes are connected to each other. A plurality of turbulent flow paths are formed for gas to pass through, so that the gas flows along the plurality of turbulent flow paths to increase the temperature conductivity of the joint parts with the pickup, thereby improving the temperature control efficiency.
本發明之目的五,提供一種壓接機構,其拾取單元於拾取器之拾取部件的外環面設有複數個鰭片,複數個鰭片位於氣體流道,而可增加氣體與拾取部件之熱交換面積,進而提高溫度傳導效能。 The fifth object of the present invention is to provide a crimping mechanism in which the pickup unit is provided with a plurality of fins on the outer ring surface of the pickup part of the pickup. The plurality of fins are located in the gas flow channel to increase the heat between the gas and the pickup part. exchange area, thereby improving temperature conduction efficiency.
本發明之目的六,提供一種測試裝置,包含測試機構及本發明壓接機構,測試機構設有至少一測試器,以供測試電子元件;本發明壓接機構位於測試機構之上方,包含架置器、拾取單元、壓接具及溫控單元,以供取放及壓接測試器之電子元件,並能夠溫控電子元件執行測試作業。 The sixth object of the present invention is to provide a testing device, which includes a testing mechanism and a crimping mechanism of the present invention. The testing mechanism is provided with at least one tester for testing electronic components; the crimping mechanism of the present invention is located above the testing mechanism and includes a mounting The tester, pick-up unit, crimping tool and temperature control unit are used to pick up, place and crimp the electronic components of the tester, and can temperature-control the electronic components to perform testing operations.
本發明之目的七,提供一種測試裝置,其測試機構設有基板,基板設有至少一承置部,以供裝配測試器,壓接機構之溫控單元於基板設有第二供氣道,以供氣體流入承置部,而溫控電子元件,並使電子元件所在之測試空間保持預設測試溫度,進而提高溫控效能。 The seventh object of the present invention is to provide a testing device. The testing mechanism is provided with a base plate. The base plate is provided with at least one receiving portion for assembling the tester. The temperature control unit of the crimping mechanism is provided with a second air supply channel on the base plate. The gas is supplied into the supporting part to temperature-control the electronic components and maintain the preset test temperature in the test space where the electronic components are located, thus improving the temperature control efficiency.
本發明之目的八,提供一種作業機,包含機台、供料裝置、收料裝置、測試裝置、輸送裝置及中央控制裝置,供料裝置配置於機台,並設有至少一供料器,以供容置至少一待測電子元件;收料裝置配置於機台,並設有至少一收料器,以供容置至少一已測電子元件;測試裝置配置於機台,包含測試機構及本發明壓接機構,測試機構設有至少一測試器,以供測試電子元件,壓接機構位於測試機構之上方,包含架置器、拾取單元、壓接具及溫控單元,以供取放及壓接測試器之電子元件,並能夠溫控電子元件執行測試作業;輸送裝 置配置於機台,並設有至少一輸送器,以供輸送電子元件;中央控制裝置以控制及整合各裝置作動而執行自動化作業。 The eighth object of the present invention is to provide a working machine, which includes a machine platform, a feeding device, a receiving device, a testing device, a conveying device and a central control device. The feeding device is arranged on the machine platform and is provided with at least one feeder. To accommodate at least one electronic component to be tested; the receiving device is arranged on the machine and is provided with at least one receiving device for accommodating at least one electronic component to be tested; the testing device is arranged on the machine and includes a testing mechanism and In the crimping mechanism of the present invention, the testing mechanism is provided with at least one tester for testing electronic components. The crimping mechanism is located above the testing mechanism and includes a mounter, a picking unit, a crimping tool and a temperature control unit for picking and placing. and electronic components of the crimp tester, and can perform testing operations on temperature-controlled electronic components; conveyor equipment It is placed on the machine platform and is provided with at least one conveyor for conveying electronic components; the central control device controls and integrates the actions of each device to perform automated operations.
10:測試裝置 10:Test device
11:移載臂 11:Transfer arm
12:拾取器 12: Pickup
121:接合部件 121:Joining parts
122:拾取部件 122: Pick up parts
1221:鰭片 1221:Fins
123:管部 123:Management Department
1231:穿孔 1231:Perforation
124:容置空間 124: Accommodation space
125:吸嘴 125:Suction nozzle
126:抽氣道 126:Pumping channel
13:連接具 13: Connector
131:第一連接件 131:First connector
132:第二連接件 132:Second connector
133:承裝空間 133: Loading space
14:壓接具 14:Crimping tool
141:板體 141:Plate body
142:延伸塊 142:Extension block
1421:通氣孔 1421:Vent hole
143:壓接部 143: Crimping part
144:通孔 144:Through hole
1441:大徑段 1441: Large diameter section
145:氣體流道 145:Gas flow channel
146:第一供氣道 146:First air supply channel
1461:第一供氣段 1461: First air supply section
1462:第二供氣段 1462: Second air supply section
1463:第三供氣段 1463: The third air supply section
151:電路板 151:Circuit board
152:測試座 152:Test seat
153:基板 153:Substrate
1531:承置部 1531:Acquisition Department
1532:第二供氣道 1532: Second air supply channel
16:排氣道 16:Exhaust channel
17:中介件 17: Intermediaryware
21:電子元件 21:Electronic components
30:機台 30:Machine
40:供料裝置 40: Feeding device
50:收料裝置 50:Receiving device
60:輸送裝置 60:Conveyor device
61:第一輸送器 61: First conveyor
62:第二輸送器 62: Second conveyor
63:第三輸送器 63:Third conveyor
64:第四輸送器 64:Fourth conveyor
圖1:本發明壓接機構第一實施例之示意圖。 Figure 1: Schematic diagram of the first embodiment of the crimping mechanism of the present invention.
圖2:本發明壓接機構應用於測試裝置之示意圖。 Figure 2: Schematic diagram of the crimping mechanism of the present invention applied to a testing device.
圖3:本發明壓接機構之使用示意圖。 Figure 3: Schematic diagram of the use of the crimping mechanism of the present invention.
圖4:係圖3之局部放大示意圖。 Figure 4: This is a partially enlarged schematic diagram of Figure 3.
圖5:本發明壓接機構第二實施例之示意圖。 Figure 5: Schematic diagram of the second embodiment of the crimping mechanism of the present invention.
圖6:本發明壓接機構第三實施例之示意圖。 Figure 6: Schematic diagram of the third embodiment of the crimping mechanism of the present invention.
圖7:本發明壓接機構第四實施例之示意圖。 Figure 7: Schematic diagram of the fourth embodiment of the crimping mechanism of the present invention.
圖8:本發明壓接機構第五實施例之示意圖。 Figure 8: Schematic diagram of the fifth embodiment of the crimping mechanism of the present invention.
圖9:本發明壓接機構第六實施例之示意圖。 Figure 9: Schematic diagram of the sixth embodiment of the crimping mechanism of the present invention.
圖10:本發明測試裝置應用於作業機之示意圖。 Figure 10: Schematic diagram of the testing device of the present invention applied to a work machine.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱圖1,本發明壓接機構之第一實施例包含架置器、拾取單元、壓接具及溫控單元。 In order for the review committee to have a further understanding of the present invention, a preferred embodiment is cited and accompanied by drawings, which are described in detail below: Please refer to Figure 1. The first embodiment of the crimping mechanism of the present invention includes a mounter, Pick-up unit, crimping tool and temperature control unit.
架置器以供直接或間接地裝配拾取單元,或者裝配拾取單元及壓接具;依作業需求,架置器可為固定式或活動式,例如架置器可為固定式之機架,例如架置器可為活動式之移載臂;於本實施例,架置器為可作至少一方向
位移之移載臂11,移載臂11可由移載驅動源(圖未示出)驅動作Y-Z方向位移,以帶動拾取單元、壓接具及溫控單元同步位移。
The mounter is used to directly or indirectly assemble the pick-up unit, or assemble the pick-up unit and the crimping tool; depending on the operation requirements, the mounter can be fixed or movable, for example, the mounter can be a fixed rack, such as The mounter can be a movable transfer arm; in this embodiment, the mounter can be moved in at least one direction.
The
拾取單元裝配於架置器,並設有至少一拾取器,拾取器設有至少一拾取部件,以供拾取電子元件。更進一步,拾取部件之一端可成型吸嘴,以取放電子元件,或者於拾取部件之內部裝配吸嘴,以吸嘴取放電子元件。依作業需求,拾取器可直接裝配於架置器,或者於拾取器與架置器之間配置連接具,使拾取器間接裝配於架置器。 The pickup unit is assembled on the mounter and is provided with at least one pickup. The pickup is provided with at least one pickup component for picking up electronic components. Furthermore, a suction nozzle can be formed at one end of the pickup component to pick and place electronic components, or a suction nozzle can be installed inside the pickup component to use the suction nozzle to pick up and place electronic components. Depending on the operation requirements, the picker can be directly assembled to the mounter, or a connector can be configured between the picker and the mounter so that the picker can be indirectly mounted to the mounter.
於本實施例,拾取單元包含拾取器12及連接具13。
In this embodiment, the pickup unit includes a
拾取器12為銅材製作,並設有接合部件121及拾取部件122,接合部件121為一呈水平配置之面板,並於底面作Z方向延伸設有拾取部件122,拾取部件122之一端具有管部123,管部123之底面朝頂面凹設有容置空間124,以供裝配吸嘴125;又拾取器12於接合部件121、拾取部件122及連接具13之間設有抽氣道126,抽氣道126之一端由連接具13處連接抽氣設備(圖未示出),另一端連通拾取器12之吸嘴125,以供吸嘴125取放電子元件。
The
依作業需求,拾取器12亦可於接合部件121及拾取部件122之間設有抽氣道,抽氣道之一端由接合部件121處連接抽氣設備,另一端連通吸嘴125,使吸嘴125取放電子元件,不受限於本實施例。
Depending on the operation requirements, the
連接具13以供連接組裝該架置器及拾取器12。於本實施例,連接具13包含第一連接件131及第二連接件132,第一連接件131之頂部連接組裝移載臂11,而可由移載臂11帶動作Y-Z方向位移,第一連接件131之底部朝向頂部凹設一承裝空間133,第二連接件132之頂部裝配於第一連接件131之承裝空間133的內頂面,而底部則供裝配拾取器12之接合部件121,使拾取器12位於第一連接件131
之承裝空間133,並可隨連接具13同步作Y-Z方向位移。依作業需求,連接具13之承裝空間133更可容置壓接具14。
The
依作業需求,連接具13之第一連接件131及第二連接件132亦可一體成型,或者連接具13僅配置第一連接件131,以第一連接件131供裝配拾取器12。又第一連接件131亦可不具有承裝空間,而於底部直接裝配拾取器12。第二連接件132亦可供裝配拾取器12及壓接具14,不受限於本實施例。
Depending on the operation requirements, the first connecting
壓接具14裝配於架置器,並設有至少一壓接部,以供壓接電子元件。依作業需求,壓接具14可直接裝配架置器;亦可裝配於拾取器12或連接具13,而間接裝配於架置器。於本實施例,壓接具14為塑材製作,並設有一呈水平配置之板體141,板體141之頂面組裝於拾取器12之接合部件121,而底面設有呈Z方向之延伸塊142,延伸塊142之底面於相對電子元件(圖未示出)之接腳位置設有壓接部143,壓接部143以供壓接電子元件之接腳。
The crimping
溫控單元於壓接具14設有通孔,以供置入拾取器12之拾取部件122,而於通孔與拾取部件122之間構成氣體流道,氣體流道供流動具有預設溫度之氣體,以溫控拾取部件122,拾取部件122使電子元件保持預設作業溫度。更進一步,溫控單元於拾取單元設有第一供氣道,第一供氣道能夠將氣體輸送至氣體流道。
The temperature control unit is provided with a through hole in the crimping
於本實施例,溫控單元於壓接具14設有一貫通板體141及延伸塊142之通孔144,通孔144靠近板體141頂面之一端設有大徑段1441,通孔144以供容置拾取器12之拾取部件122,而於通孔144與拾取部件122之間構成氣體流道145,氣體流道145供流動具有預設溫度之氣體(例如低溫氣體或高溫氣體)。溫控單元設有第一供氣道146,第一供氣道146於拾取器12之接合部件121及連接具13
之第一連接件131、第二連接件132分別設有相通之第一供氣段1461、第二供氣段1462及第三供氣段1463,第一供氣段1461之一端連通氣體流道145,第二供氣段1462之一端連通一氣體設備,氣體設備輸出具有預設溫度之氣體,氣體經由第一供氣道146之第一供氣段1461、第二供氣段1462及第三供氣段1463而流入氣體流道145,使具有預設溫度之氣體溫控拾取部件122,氣體流道145再由通孔144之底端排出氣體,使得排出之氣體可再溫控電子元件。
In this embodiment, the temperature control unit is provided with a through
因此,壓接機構之溫控單元以具有預設溫度之氣體作為溫控能源,不僅可有效節省成本,氣體設備之體積小,而可便利配置於作業機,並縮短供氣輸送管之長度,及利於場所空間配置,以及便利搬移作業機及氣體設備,進而提高配置作業上之便利性。 Therefore, the temperature control unit of the crimping mechanism uses gas with a preset temperature as the temperature control energy, which not only effectively saves costs, but also makes the gas equipment small in size and can be conveniently installed on the operating machine and shortens the length of the gas supply pipe. It is also beneficial to the space configuration of the site, as well as the transportation of operating machines and gas equipment, thereby improving the convenience of configuration operations.
溫控單元之第一供氣道146連接氣體之供氣輸送管,供氣輸送管毋需保持剛性,可作較小曲弧之變折,以利縮減佔用拾取器12之周側空間,進而利於壓接機構之空間配置。
The first
依作業需求,溫控單元可於壓接具14設有排氣道,排氣道一端相通氣體流道145,另一端相通外部或氣體設備,亦無不可。
Depending on the operation requirements, the temperature control unit can be provided with an exhaust channel on the crimping
依作業需求,壓接機構可於拾取器12、連接具13或壓接具14配置至少一加熱件(圖未示出),以供配合調節氣體之預設溫度。另可於拾取器12或壓接具14配置至少一感測器(圖未示出),以感測溫度。
Depending on the operation requirements, the crimping mechanism can be equipped with at least one heating element (not shown) on the
請參閱圖2~4,本發明壓接機構應用於測試裝置10,測試裝置10包含測試機構及壓接機構,測試機構設有至少一測試器,以供測試電子元件,於本實施例,測試器設有電性連接之電路板151及測試座152,測試座152以供承置及測試電子元件,另測試機構設有基板153,基板153設有至少一承置部1531
,以供裝配測試器之測試座152。本發明壓接機構配置於測試機構之上方,並以拾取器12之抽氣道126經吸嘴125而吸附拾取一具接腳之電子元件21,電子元件21之頂面貼合於拾取器12之拾取部件122的管部123,並位於壓接具14之二壓接部143間,且使接腳凸伸位於壓接部143之下方,以便電性連接測試座152之接點;於拾取器12之吸嘴125拾取電子元件21後,壓接機構之移載臂11帶動拾取器12及連接具13位移至測試座152之上方。
Please refer to Figures 2 to 4. The crimping mechanism of the present invention is applied to the
移載臂11帶動連接具13、拾取器12、壓接具14及電子元件21同步作Z方向向下位移,令拾取器12將電子元件21移入測試座152,電子元件21之接腳電性連接測試座152之接點,連接具13之第一連接件131罩置於基板153之頂面,並使第一連接件131的承裝空間133、基板153的承置部1531與測試座152之間構成一測試空間,以避免氣體任意流散,而可使電子元件21於具有預設溫度氣體之測試空間執行測試作業。第一連接件131之底面與基板153之頂面具有適當間隙而形成一排氣道16,以供排出氣體。
The
依作業需求,若測試機構未配置基板153,壓接機構之連接具13亦可與測試座152間具有適當間隙而形成一排氣道16,以供排出氣體,不受限本實施例。
Depending on the operation requirements, if the test mechanism is not equipped with the
於冷測作業,壓接機構之第一供氣道146接收氣體設備輸入之低溫氣體,低溫氣體經第一流道段1461、第二流道段1462及第三流道段1463而流入於拾取器12之拾取部件122與壓接具14之延伸塊142間的氣體流道145,亦即由氣體流道145一端之入口端流入低溫氣體,使低溫氣體直接與拾取部件122作熱交換,而提高溫度傳導率,以利迅速溫控拾取部件122呈預設低溫狀態,由於拾取部件122之管部123貼合電子元件21之頂面,而可將低溫傳導至電子元件21,使電子元
件21於模擬日後低溫環境執行冷測作業。又電子元件21位於壓接具14之通孔144端部,亦即位於氣體流道145另一端之出口端,氣體流道145流出之低溫氣體會流經電子元件21而作熱交換,亦可輔助降低電子元件21之溫度,低溫氣體再流動至一由測試座152、基板153的承置部1531及第一連接件131的承裝空間133所構成之測試空間,以避免氣體任意迅速流散,使測試空間具有低溫氣體,而可使電子元件21位於具有低溫氣體之測試空間執行冷測作業;之後測試空間的低溫氣體由第一連接件131與基板153間之排氣道16排出。
During the cold test operation, the first
請參閱圖5,本發明壓接機構之第二實施例的設計大致相同第一實施例,其差異在於壓接具14之延伸塊142開設至少一通氣孔1421,通氣孔1421以供氣體流道145之氣體分流流出至電子元件21所在之空間(例如測試空間),以增加氣體與電子元件21之熱交換面積,並可更加迅速使電子元件21所在之空間保持預設測試溫度。
Please refer to Figure 5. The design of the second embodiment of the crimping mechanism of the present invention is basically the same as that of the first embodiment. The difference is that the
請參閱圖6,本發明壓接機構之第三實施例的設計大致相同第一實施例,其差異在於溫控單元於拾取部件122之管部123開設至少一穿孔1231,穿孔1231相通氣體流道145及容置空間124。更進一步,吸嘴125可由吸嘴驅動器(圖未示出)驅動作至少一方向(例如Z方向)位移。因此,溫控單元之氣體流道145的低溫氣體可經由拾取部件122之穿孔1231流入於容置空間124,使容置空間124具有低溫氣體,利用容置空間124內之低溫氣體與電子元件21之頂面作熱交換而增加溫度傳導率,進而提高溫控效能。再者,當溫控單元以吸嘴驅動器驅動吸嘴125作Z方向向上位移而脫離電子元件21之頂面時,令拾取部件122之容置空間124內的低溫氣體直接接觸電子元件21之頂面,而可更增加熱交換面積,進而更加提高溫控效能。
Please refer to Figure 6. The design of the third embodiment of the crimping mechanism of the present invention is basically the same as that of the first embodiment. The difference is that the temperature control unit opens at least one through
請參閱圖7,本發明壓接機構之第四實施例的設計大致相同第一實施例,其差異在於拾取單元於拾取器12之拾取部件122的外環面設有至少一鰭片1221;於本實施例,拾取器12於拾取部件122之外環面且相對應通孔144之大徑段1441的位置設有複數個鰭片1221,以增加拾取部件122與氣體流道145內之氣體的熱交換面積。
Please refer to Figure 7. The design of the fourth embodiment of the crimping mechanism of the present invention is basically the same as that of the first embodiment. The difference is that the pickup unit is provided with at least one
請參閱圖8,本發明壓接機構之第五實施例的設計大致相同第一實施例,其差異在於溫控單元於連接具13與拾取器12間配置有至少一中介件17,中介件17開設複數個彼此相通之孔,複數個孔之間構成擾流路徑,複數個孔相通第一供氣道146。於本實施例,溫控單元可於連接具13之第一連接件131與拾取器12之接合部件121間設置中介件17,中介件17為發泡金屬,其具有複數個彼此相通之孔,複數個孔之間構成擾流路徑,第一供氣道146之第二流道段1462的氣體可流入中介件17之彼此相通的孔,並沿擾流路徑流入拾取器12之第一流道段1461,再由第一流道段1461流入氣體流道145,由於氣體於中介件17之擾流路徑流動,而可增加氣體與拾取器12之接合部件121的熱交換面積,進而更加提高溫控拾取器12之使用效能。
Please refer to Figure 8. The design of the fifth embodiment of the crimping mechanism of the present invention is basically the same as that of the first embodiment. The difference is that the temperature control unit is equipped with at least one intermediary member 17 between the
請參閱圖9,本發明壓接機構之第六實施例的設計大致相同第一實施例,其差異在於壓接機構之溫控單元於測試機構之基板153設有第二供氣道1532,以供氣體流入承置部1531及測試座152之內部,而可直接溫控電子元件21,進而提高溫控效能。
Please refer to Figure 9. The design of the sixth embodiment of the crimping mechanism of the present invention is basically the same as that of the first embodiment. The difference is that the temperature control unit of the crimping mechanism is provided with a second
請參閱圖1~4及圖10,本發明壓接機構應用於電子元件作業機,作業機包含機台30、供料裝置40、收料裝置50、測試裝置10、輸送裝置60及中央控制裝置(圖未示出);供料裝置40裝配於機台30,並設有至少一供料器,以容納
至少一待測之電子元件;收料裝置50裝配於機台30,並設有至少一收料器,以容納至少一已測之電子元件;測試裝置10配置於機台30,包含測試機構及本發明之壓接機構,測試機構設有至少一測試器,以供測試電子元件,壓接機構以供取放及壓接測試器之電子元件,並能夠溫控電子元件執行測試作業;於本實施例,測試器設有電性連接之電路板151及具傳輸件(如探針)之測試座152,測試座152以供承置及測試電子元件,另於機台30設有基板153,以供裝配測試座152;輸送裝置60裝配於機台30,並設有至少一輸送器,以輸送電子元件;於本實施例,輸送裝置60設有第一輸送器61,以於供料裝置40之供料器取出待測電子元件,並將待測電子元件移載至第二輸送器62,第二輸送器62將待測電子元件載送至測試裝置10之側方,測試裝置10之壓接機構以移載臂11將連接具13、拾取器12及壓接具14移載至第二輸送器62之上方,並以拾取器12將第二輸送器62之待測電子元件移載至測試座152而執行測試作業,以及將已測電子元件移載至第三輸送器63而載出,第四輸送器64於第三輸送器63取出已測電子元件,並輸送至收料裝置50之收料器處而分類收置;中央控制裝置(圖未示出)用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。
Please refer to Figures 1 to 4 and 10. The crimping mechanism of the present invention is applied to an electronic component working machine. The working machine includes a machine table 30, a
12:拾取器 12: Pickup
122:拾取部件 122: Pick up parts
123:管部 123:Management Department
125:吸嘴 125:Suction nozzle
131:第一連接件 131:First connector
133:承裝空間 133: Loading space
14:壓接具 14:Crimping tool
142:延伸塊 142:Extension block
145:氣體流道 145:Gas flow channel
1461:第一供氣段 1461: First air supply section
1463:第三供氣段 1463: The third air supply section
152:測試座 152:Test seat
153:基板 153:Substrate
1531:承置部 1531:Acquisition Department
16:排氣道 16:Exhaust channel
21:電子元件 21:Electronic components
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US9582749B2 (en) | 2013-03-04 | 2017-02-28 | Hello Inc. | Wearable device with adjacent magnets magnetized in different directions |
Patent Citations (1)
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US9582749B2 (en) | 2013-03-04 | 2017-02-28 | Hello Inc. | Wearable device with adjacent magnets magnetized in different directions |
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