TWI641848B - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

An electronic component inspection device according to the present invention includes: a holding portion that can abut against an electronic component having a terminal, can hold an electronic component, and can heat the electronic component; and an inspection portion having a holding portion that can cool the terminal, and an electronic component The inspection is performed; and the heating period performed by the holding portion and the cooling period performed by the holding portion overlap.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

An electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (Integrated Circuit) component has been known, and an electronic component inspection device is assembled to transfer an IC component to an inspection. The electronic component transport device of the holding unit of the department. When the IC element is inspected, the IC element is placed in the holding portion, and the plurality of probes provided in the holding portion are brought into contact with the respective terminals of the IC element. There is a case where the IC element is inspected by heating or cooling the IC element to a specific temperature, and in this case, control for maintaining the temperature of the electronic component at the set temperature (target temperature) is performed.

Patent Document 1 discloses an electronic component testing device that maintains a temperature of an electronic component at a specific set temperature when an electronic component is inspected by a heat source that is provided in a holding portion and that can be heated or cooled. In the electronic component testing device described in Patent Document 1, the holding portion is heated or cooled by a heat source, and the fluid heated or cooled by the heat source flows to the plurality of probes provided in the holding portion, thereby the electronic component The temperature is maintained at the set temperature.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2009/118855

However, in the electronic component testing device described in Patent Document 1, when the electronic component is inspected, heating or cooling of the electronic component is performed only by the holding portion, so that it is difficult to maintain the temperature of the electronic component at the set temperature. For example, when the electronic component is heated and the temperature is maintained at the set temperature, if the temperature of the electronic component becomes higher than the set temperature due to heat generation of the electronic component during the inspection, it is difficult to lower the temperature of the electronic component. Similarly, when the electronic component is cooled and the temperature is maintained at the set temperature, if the temperature of the electronic component becomes lower than the set temperature, it is difficult to increase the temperature of the electronic component.

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can improve the responsiveness when cooling or heating an electronic component while maintaining the temperature of the electronic component at a set temperature.

The present invention has been made to solve at least a part of the above problems, and can be realized as the following aspects or application examples.

[Application Example 1]

An electronic component conveying apparatus according to the present invention includes: a holding portion that can abut against an electronic component having a terminal, can hold the electronic component, and can heat the electronic component; and the heating is performed by the holding portion The period may be overlapped with the cooling period performed by the holding portion that can cool the terminal.

Thereby, in the control of maintaining the temperature of the electronic component at the set temperature, the responsiveness can be improved when cooling or heating the electronic component.

Specifically, for example, in the inspection of an electronic component, the electronic component is heated by the holding portion before the inspection of the electronic component, and the temperature of the electronic component is adjusted to the set temperature.

Further, in the inspection of the electronic component, when the temperature of the electronic component is higher than the set temperature, the heating of the electronic component by the holding portion is stopped or the amount of heating is reduced. And the terminal of the electronic component is cooled by the holding part. In this case, by cooling the terminals of the electronic component, the circuit portion of the electronic component is cooled via the terminal, whereby the temperature of the electronic component can be rapidly lowered. Moreover, since the electronic component can be cooled while being heated, the temperature of the electronic component can be adjusted with high precision.

[Application Example 2]

An electronic component inspection apparatus according to the present invention includes: a holding portion that can abut against an electronic component having a terminal, can hold the electronic component, and can heat the electronic component; and an inspection portion having a terminal for cooling the terminal The holding unit inspects the electronic component, and the heating period performed by the holding portion overlaps with the cooling period performed by the holding unit.

Thereby, in the control of maintaining the temperature of the electronic component at the set temperature, the responsiveness can be improved when cooling or heating the electronic component.

Specifically, for example, before the inspection of the electronic component, the electronic component is heated by the holding portion, and the temperature of the electronic component is adjusted to the set temperature.

Further, in the inspection of the electronic component, when the temperature of the electronic component is higher than the set temperature, the heating of the electronic component by the holding portion is stopped or the amount of heating is reduced, and the terminal of the electronic component is cooled by the holding portion. In this case, by cooling the terminals of the electronic component, the circuit portion of the electronic component is cooled via the terminal, whereby the temperature of the electronic component can be rapidly lowered. Moreover, since the electronic component can be cooled while being heated, the temperature of the electronic component can be adjusted with high precision.

[Application Example 3]

In the electronic component inspection device of the present invention, preferably, the holding portion includes an electronic component mounting portion that can mount the electronic component and has a first conductive member that can be in contact with the terminal; And The electronic component mounting portion has a flow path through which at least a part of the first conductive member is disposed and through which a fluid can flow.

Thereby, the first conductive member is cooled by the fluid flowing through the flow path, and the circuit portion of the electronic component can be cooled via the terminals of the first conductive member and the electronic component.

[Application Example 4]

In the electronic component inspection device of the present invention, it is preferable that the electronic component inspection device includes a fluid ejecting portion that ejects a fluid to the first conductive member.

Thereby, the first conductive member is cooled by the fluid ejected from the fluid ejecting portion and flowing through the flow path, and the circuit portion of the electronic component can be cooled via the terminals of the first conductive member and the electronic component.

[Application 5]

In the electronic component inspection device of the present invention, preferably, the holding portion includes an electronic component mounting portion that mounts the electronic component and has a first conductive member that can be in contact with the terminal, and a flow path member And disposed on a side opposite to a surface on which the electronic component is placed on the electronic component mounting portion, and has a flow path through which a fluid can flow and a second conductive member that can contact the first conductive member; and the second At least a portion of the conductive member is disposed in the flow path.

Thereby, the second conductive member is cooled by the fluid flowing through the flow path, and the circuit portion of the electronic component can be cooled via the terminals of the second conductive member, the first conductive member, and the electronic component.

[Application Example 6]

In the electronic component inspection device of the present invention, it is preferable that the electronic component inspection device includes a fluid ejecting portion that ejects a fluid to the second conductive member.

Thereby, the second conductive member is cooled by the fluid ejected from the fluid ejecting portion and flowing through the flow path, and the circuit portion of the electronic component can be cooled via the terminals of the second conductive member, the first conductive member, and the electronic component.

[Application Example 7]

In the electronic component inspection device of the present invention, it is preferable that the holding portion has a heat radiating portion.

Thereby, the electronic component can be cooled via the heat radiating portion.

[Application Example 8]

In the electronic component inspection device of the present invention, it is preferable that the heat dissipation portion has insulation properties.

Thereby, it is possible to prevent a short circuit or the like of the electronic component due to the heat radiating portion.

[Application Example 9]

In the electronic component inspection apparatus of the present invention, preferably, the holding portion includes an electronic component mounting portion that mounts the electronic component and is disposed on the substrate, and a heat dissipation portion that is disposed across the substrate The side opposite to the above-described electronic component mounting portion.

Thereby, the electronic component can be efficiently cooled by the heat radiating portion.

[Application Example 10]

In the electronic component inspection device of the present invention, it is preferable that the electronic component inspection device includes a fluid ejecting portion that ejects a fluid to the heat dissipating portion.

Thereby, the heat dissipation amount of the heat radiating portion is increased, and the cooling ability of the electronic component is enhanced.

[Application Example 11]

In the electronic component inspection device of the present invention, preferably, the holding portion heats the electronic component.

Thereby, when the temperature of the electronic component is lower than the set temperature, the temperature of the electronic component can be rapidly increased.

[Application Example 12]

In the electronic component inspection device of the present invention, preferably, based on the above electronic component At least one of the heating and the cooling is performed on the contact temperature information.

When the electronic component is heated during the inspection, the junction temperature becomes higher than the temperature of the surface of the electronic component, but the junction temperature can be adjusted to the set temperature, so that the inspection can be performed under more appropriate temperature conditions. .

1‧‧‧Checking device

2‧‧‧Supply Department

3‧‧‧Supply side alignment

4‧‧‧Transportation Department

5‧‧‧Inspection Department

6‧‧‧Recycling side alignment

7‧‧Recycling Department

8‧‧‧Control Department

9‧‧‧IC components

10‧‧‧Transporting device

11‧‧‧Abutment

12‧‧‧ Cover

16‧‧‧Substrate

41‧‧‧Transport shuttle

42‧‧‧Supply robot

43‧‧‧Check the robot

44‧‧‧Recycling robot

51‧‧‧ Keeping Department

52‧‧‧Loading Department

53‧‧‧Flow components

91‧‧‧ Body Department

92‧‧‧ terminals

111‧‧‧Foundation

131‧‧‧Solenoid valve

132‧‧‧ pump

133‧‧‧ solenoid valve

134‧‧‧ pump

135‧‧‧ solenoid valve

136‧‧‧ check valve

141‧‧‧ tube body

142‧‧‧ tube body

151‧‧‧ coil spring

171‧‧‧jet nozzle

172‧‧‧jet nozzle

173‧‧‧ radiator

174‧‧‧jet nozzle

175‧‧‧ radiator

181‧‧‧heater

210‧‧‧ cylinder

211‧‧‧Cylinder tube

212‧‧‧ tube body

213‧‧‧ front board

214‧‧‧Piston

215‧‧‧ gas inlet

220‧‧‧Component suction cup

230‧‧‧Link block

231‧‧‧vacuum guide path

240‧‧‧heat block

241‧‧‧heater

243‧‧‧temperature sensor

250‧‧‧Contact thrusters

260‧‧‧sucking tube

270‧‧‧Adsorption pad

290‧‧‧The Ministry of Cooling

291‧‧‧ radiator

292‧‧‧jet nozzle

293‧‧‧ components

341‧‧‧mounting table

411‧‧‧ Groove

421‧‧‧Support box

422‧‧‧ moving box

423‧‧‧Hand unit

431‧‧‧Support box

432‧‧‧ moving box

433‧‧‧Hand unit

441‧‧‧Support box

442‧‧‧ moving box

443‧‧‧Hand unit

521‧‧‧through holes

522‧‧‧Probe

531‧‧‧through hole

532‧‧‧ probe

1421‧‧‧1st body

1422‧‧‧2nd body

1721‧‧‧ spray holes

1731‧‧‧ base

1732‧‧‧ Heat sink

1741‧‧‧ spray holes

1751‧‧‧ base

1752‧‧‧ Heat sink

D1‧‧‧Room 1

Room D2‧‧‧

G‧‧‧Air

P1‧‧‧ link

P2‧‧‧Links

X‧‧‧ axis (direction)

Y‧‧‧ axis (direction)

Z‧‧‧ axis (direction)

Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention.

Fig. 2 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1;

Fig. 3 is a cross-sectional view showing the hand unit of the conveying unit of the electronic component inspection device shown in Fig. 1;

Fig. 4 is a cross-sectional view showing a holding portion of an inspection portion of the electronic component inspection device shown in Fig. 1;

Fig. 5 is a block diagram showing the main part of the electronic component inspection apparatus shown in Fig. 1.

Fig. 6 is a cross-sectional view showing a holding portion of an inspection unit according to a second embodiment of the electronic component inspection device of the present invention.

Fig. 7 is a cross-sectional view showing a holding portion of an inspection unit according to a third embodiment of the electronic component inspection device of the present invention.

Fig. 8 is a cross-sectional view showing a holding portion of an inspection portion according to a fourth embodiment of the electronic component inspection device of the present invention.

Fig. 9 is a cross-sectional view showing a holding portion of an inspection unit according to a fifth embodiment of the electronic component inspection device of the present invention.

Fig. 10 is a block diagram showing the principal part of a sixth embodiment of the electronic component inspection device of the present invention.

Hereinafter, the electronic of the present invention will be described in detail based on the embodiment shown in the accompanying drawings. The parts transfer device and the electronic component inspection device will be described.

<First embodiment>

Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a view showing a conveying unit and an inspection unit of the electronic component inspection device shown in Fig. 1; Fig. 3 is a cross-sectional view showing the hand unit of the conveying unit of the electronic component inspection device shown in Fig. 1; Fig. 4 is a cross-sectional view showing a holding portion of an inspection portion of the electronic component inspection device shown in Fig. 1; Fig. 5 is a block diagram showing the main part of the electronic component inspection apparatus shown in Fig. 1.

In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is also referred to as "X-direction", the direction parallel to the Y-axis is also referred to as "Y-direction", and the direction parallel to the Z-axis is also referred to as "Z-direction". Further, the upstream side of the transport direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Further, the "level" in the specification of the present application is not limited to a complete level, and includes a state of being slightly inclined (for example, less than about 5 degrees) with respect to the horizontal as long as it does not interfere with the conveyance of the electronic component.

In addition, the upper side in FIGS. 3 and 4 is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower" (the same applies to the other embodiments). Moreover, in FIG. 3, one of the plurality of hand units of the conveyance unit is shown.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is, for example, a device for inspecting and testing electrical characteristics of an electronic component including the following components (hereinafter referred to as "inspection"), and the above components are IC components such as BGA (Ball Grid Array) package or LGA (Land Grid Array) package, LCD (Liquid Crystal Display), OLED (Organic Electroluminescence Display) Display elements such as light-emitting displays), electronic paper, CIS (CMOS (Complementary Metal Oxide Semiconductor) Image Sensor, CMOS image sensor), CCD (Charge Coupled) Device, charge coupled device), acceleration sensor, gyro sensor, pressure sensor and other sensors, including various oscillators including crystal oscillators. In the following, for the sake of convenience of explanation, the case where the IC component is used as the electronic component to be inspected will be described as a representative, and this will be referred to as "IC component 9".

As shown in FIGS. 3 and 4, the IC element 9 has a main body portion 91 and a plurality of terminals (electrodes) 92 provided outside the main body portion 91. Each of the terminals 92 is electrically connected to a circuit portion inside the main body portion 91. The shape of the main body portion 91 and each of the terminals 92 is not particularly limited. However, in the present embodiment, the main body portion 91 is formed in a plate shape, and in the thickness direction thereof (in the state in which the IC element 9 is held by the holding portion 51) When viewed in the Z direction), it is formed into a quadrangular shape. Further, in the present embodiment, the quadrilateral is a square or a rectangle. Further, the arrangement of the terminals 92 is not particularly limited, but in the present embodiment, they are arranged in a matrix.

As shown in Fig. 1, the inspection apparatus 1 includes a supply unit 2, a supply side array unit 3, a conveyance unit 4, an inspection unit 5, a collection side array unit 6, a collection unit 7, and a control unit 8 that controls the respective units. Further, the inspection apparatus 1 includes a base 11, which is provided with a supply unit 2, a supply side array unit 3, a transport unit 4, an inspection unit 5, a collection side array unit 6, and a recovery unit 7, and a cover unit 12 for housing supply The side array portion 3, the transport portion 4, the inspection portion 5, and the recovery side array portion 6 are covered on the base 11. In addition, the base surface 111 which is the upper surface of the base 11 is substantially horizontal, and the supply side arrangement part 3, the conveyance part 4, the inspection part 5, and the collection side arrangement part 6 are arrange|positioned by this base surface 111. Further, the inspection device 1 may have a heater, a chamber, or the like for heating the IC element 9, as needed.

The inspection apparatus 1 is configured such that the supply unit 2 supplies the IC element 9 to the supply side array unit 3, the supplied IC element 9 is arranged in the supply side array unit 3, and the transport unit 4 arranges the IC elements 9 The inspection unit 5 inspects the IC unit 9 that has been transported, and the transport unit 4 transports the IC elements 9 that have been inspected to the recovery side array unit 6, and the collection unit 7 collects and recycles them. The IC element 9 of the side alignment portion 6. According to such an inspection apparatus 1, the supply, inspection, and recovery of the IC element 9 can be automatically performed. Furthermore, in the inspection device 1 In the configuration other than the inspection unit 5, that is, the supply unit 2, the supply side array unit 3, the transport unit 4, the collection side array unit 6, the collection unit 7, and the control unit 8, etc., the transport device (electronic Part transfer device) 10. The transport device 10 performs transport of the IC component 9 and the like.

Hereinafter, the configuration of the transport unit 4 and the inspection unit will be described.

≪Transportation Department≫

As shown in FIG. 2, the transport unit 4 transports the IC component 9 disposed on the mounting table 341 of the supply-side arranging unit 3 to the inspection unit 5, and transports the IC component 9 that has been inspected by the inspection unit 5 to the collection unit. The unit of the side alignment portion 6. The transport unit 4 includes a transport shuttle 41, a supply robot 42, an inspection robot 43, and a recovery robot 44.

- Handling shuttle -

The transport shuttle 41 is configured to transport the IC component 9 on the mounting table 341 to the vicinity of the inspection unit 5, and to transport the IC component 9 that has been inspected by the inspection unit 5 to the vicinity of the collection side alignment portion 6. The shuttle. The transport shuttles 41 are arranged in the X direction to form four recesses 411 for accommodating the IC elements 9. Further, the transport shuttle 41 is guided by a linear motion guide, and can be reciprocated in the X direction by a drive source such as a linear motor.

-Supply robots -

The supply robot 42 transports the IC component 9 placed on the mounting table 341 to the robot of the transport shuttle 41. The supply robot 42 has a support frame 421 supported by the base 11, a moving frame 422 supported by the support frame 421 and reciprocally movable in the Y direction with respect to the support frame 421, and 4 hand units supported by the moving frame 422. (holding robot) 423. Each of the hand units 423 includes an elevating mechanism and an adsorption nozzle, and can be held by the adsorption of the IC element 9.

- Check the robot -

The inspection robot 43 transports the IC component 9 accommodated in the transport shuttle 41 to the inspection unit 5, and transports the IC component 9 that has been inspected from the inspection unit 5 to the transport shuttle 41. Further, the inspection robot 43 can also press the IC element 9 against the inspection unit 5 at the time of inspection, and apply a specific inspection pressure to the IC element 9. Such an inspection robot 43 has a support frame supported on the base 11 431. A moving frame 432 supported by the support frame 431 and reciprocally movable in the Y direction with respect to the support frame 431, and four hand units (holding robots) (holding portions) 433 supported by the moving frame 432. The arrangement of each hand unit 433 is not particularly limited, and the arrangement of the drawings is an example.

Each of the hand units 433 includes an elevating mechanism, a suction pipe 260 and a suction pad 270 (see FIG. 3), and can be held (adsorbed and held) by adsorbing the IC element 9. Each of the hand units 433 is the same, and therefore, one of them will be described below.

The hand unit 433 is detachably fixed to the moving frame 432 by, for example, screwing or the like.

As shown in FIG. 3, the hand unit 433 has a cylinder 210 fixed to the moving frame 432 and a component suction cup 220 coupled to the front end of the cylinder 210.

The cylinder 210 has a cylinder tube 211 that is fixed to the moving frame 432. The cylinder tube 211 has a bottomed tubular body 212 and an opening front plate 213 that blocks the pipe body 212. In the cylinder chamber formed by the pipe body 212 and the front plate 213, a piston can be disposed to move in the Z direction. 214. The cylinder chamber is divided by a piston 214 into a first chamber D1 located on the upper side and a second chamber D2 located on the lower side.

The piston 214 is lifted upward by the coil spring 151 described below. When the cylinder 210 is not actuated, the surface of the piston 214 on the first chamber D1 side is located at a position abutting against the bottom surface of the pipe body 212 (hereinafter, referred to as For the top position).

Further, a gas introduction port 215 is formed at an end portion of the pipe main body 212 on the first chamber D1 side, and a connection port P1 is attached to the gas introduction port 215. Further, the connection port P1 is connected to an electro-pneumatic regulator (not shown). When the air conditioner supplies air to the first chamber D1, the piston 214 is elastic against the coil spring 151 from the uppermost end position by the pressure of the air. Force to move down. By setting the pressure in the first chamber D1 to a specific pressure, the IC element 9 disposed in the holding portion 51 can be pressed with an appropriate pressure. Therefore, the conduction between the IC element 9 and the holding portion 51 can be surely achieved, and the breakage of the IC element 9 can be suppressed. Furthermore, the drive of the electric air conditioner is controlled by the control unit 8.

The component chuck 220 disposed on the lower side of the cylinder 210 as described above has a joint block 230, which is fixed to the lower end of the piston 214; a member 293 and a heat sink (heat dissipation portion) 291, which are disposed on the lower side of the connecting block 230, and a heating block 240 disposed on the lower side of the member 293 and the heat sink 291; And a contact thruster 250 disposed on a lower side of the heating block 240. Further, the radiator 291 is provided with an injection nozzle (fluid injection portion) 292 that ejects air (fluid) G as a cooling gas. Further, the cooling unit 290 that cools the IC element 9 is configured by the injection nozzle 292 and the heat sink 291.

The connecting block 230 is coupled to the moving frame 432 via the coil spring 151. That is, the connecting block 230 is elastically suspended by the coil spring 151 with respect to the moving frame 432. Moreover, as described above, the coil spring 151 presses the piston 214 to the uppermost position via the coupling block 230. Further, the connecting block 230 is formed with a through hole that is open to the central portion and the side surface of the lower surface thereof, and the through hole functions as the vacuum guiding path 231. Further, a coupling port P2 is attached to one end of the vacuum guiding path 231. Further, the connection port P2 is connected to a pump for sucking air and a pump for discharging air (none of which are shown). Furthermore, the drive of the pump is controlled by the control unit 8.

Further, an upper end of a plurality of columnar members 293 having excellent heat insulating properties is joined and fixed to the lower surface of the connecting block 230, and a heating block 240 is coupled and fixed to the lower end of the plurality of columnar members 293. A contact pusher 250 is detachably coupled to the lower surface of the 240. The contact pusher 250 is a portion that presses (abuts) the IC element 9 when the hand unit 433 presses the IC element 9 when the IC element 9 is inspected, and presses the IC element 9. Furthermore, when the IC component 9 is inspected, the hand unit 433 can press the IC component 9 regardless of whether the IC component 9 is held or not, and whether the IC component 9 is held or not. The setting of pressing the IC element 9 in the unsuspended state can be appropriately performed.

Further, a heat sink 291 is disposed in a space formed by the member 293 (a space between the heating block 240 and the connection block 230). Further, the heat sink 291 is thermally connected by, for example, using solder or the like and fixed to the heating block 240. Further, the heat sink 291 is provided in the connection block 230 in a non-contact manner. In other words, a gap is formed between the heat sink 291 and the connecting block 230. Thereby, the heat exchange between the heat sink 291 and the connecting block 230 is suppressed, and the heat dissipation effect of the heat sink 291 If it improves. The size of the gap can be simply controlled by adjusting the height of the member 293.

Further, the injection nozzles 292 are arranged side by side of the radiator 291, and are configured to eject the air G to the radiator 291. That is, the following pump 132 that ejects air (compressed air) is connected to the injection nozzle 292. The drive of the pump 132 is controlled by the control unit 8. By blowing the air G to the heat sink 291, the IC element 9 can be cooled via the heating block 240 and the contact thruster 250. Further, since the spray nozzle 292 is fixed to the joint block 230 via the fixing tool, the relative position to the heat sink 291 is kept constant. Therefore, the air G can be stably ejected toward the radiator 291, thereby stably cooling the radiator 291.

Further, it is preferable that the injection nozzle 292 is configured to diffusely spray (radially jet) the air G. Thereby, the size of the injection nozzle 292 can be reduced, and the cooling gas G can be blown over a wider range of the radiator 291. Moreover, it is preferable that the injection cross-sectional shape of the air G ejected from the ejection nozzle 292 is set to a shape in which the diffusion in the Z direction is suppressed from the diffusion in the XY plane direction. Thereby, the air G can be supplied to the radiator 291 efficiently.

Further, by setting the fluid injected from the injection nozzle 292 to air, the processing can be simplified, and the cost can be reduced. Further, for example, by using air cooled by a refrigerating cooler or the like, the cooling performance of the IC element 9 can be improved. In addition, the fluid to be ejected from the injection nozzle 292 is not limited to air, and for example, a gas such as nitrogen gas, argon gas, carbon dioxide gas, a fluorine-based gas, or various insulating gases including such a mixed gas may be used. Further, a temperature adjustment unit that adjusts the temperature of the air (fluid) injected from the injection nozzle 292 may be provided.

A receiving hole that penetrates the vacuum guiding path 231 is formed in a central portion of the heat sink 291, the heating block 240, and the contact pusher 250, and a suction pipe 260 is disposed in the receiving hole. An adsorption pad (adsorption hole) 270 is fixed to the front end of the suction pipe 260. Further, the pump is driven to suck air so that the inside of the suction pipe 260 is in a negative pressure state, whereby the IC member 9 can be held (adsorbed and held) by the adsorption pad 270. Also, driving the pump to supply air, The negative pressure state in the suction pipe 260 is released, whereby the IC component 9 being held by the adsorption pad 270 can be released. Further, the heating block 240 and the heater 241 are disposed between the heat sink 291 and the adsorption pad 270 and the contact thruster 250.

The heat sink 291, the heating block 240, and the contact thruster 250 respectively comprise a material that is hard and has a high thermal conductivity. The material which is hard and has high thermal conductivity is not particularly limited, and examples thereof include various metals such as iron, nickel, cobalt, gold, platinum, silver, copper, aluminum, magnesium, titanium, and tungsten, or at least one of them. Alloys or intermetallic compounds, and further oxides, nitrides, carbides, and the like of such metals.

In the heating block 240, two rod-shaped heaters (heating portions) 241 are buried. The driving of the heater 241 is controlled by the control unit 8. When the heater 241 generates heat, the heat is conducted to the IC element 9 via the heating block 240 and the contact pusher 250, and the temperature of the IC element 9 rises. Thereby, the electrical characteristics of the IC component 9 in a high temperature environment can be inspected.

The two heaters 241 extend in the Y direction, and are disposed at both end portions in the X direction while avoiding the suction pipe 260 at the center portion of the heating block 240. The heater 241 is not particularly limited as long as the IC element 9 can be heated, and for example, an alumina heater, an aluminum nitride heater, a tantalum nitride heater, a tantalum carbide heater, or a boron nitride heater can be used. Various ceramic heaters, various types of heaters using electric heating wires such as nichrome wires, and the like. Further, the heater 241 is not limited to a rod shape, and for example, a flat surface may be used. In addition, the heating unit is not limited to the heater 241, and examples thereof include a Peltier element and the like.

Further, a temperature sensor 243 is embedded in the heating block 240. The temperature sensor 243 indirectly detects the temperature of the IC element 9 by detecting (detecting) the temperature of the heating block 240. The detection result of the temperature sensor 243, that is, the signal output from the temperature sensor 243 is input to the control unit 8, and the control unit 8 grasps the temperature detected by the temperature sensor 243. Furthermore, as described above, the heating block 240 and the contact thruster 250 comprise a material having a high thermal conductivity, so that the temperature difference between the IC component 9 and the heating block 240 is small, and the temperature sensor 243 is embedded in the heating block 240, The temperature of the IC component 9 can also be detected very accurately.

In the present embodiment, in the temperature sensor 243, the detecting portion which is a portion for detecting (sensing) the temperature is located at the central portion of the heating block 240, and thus the distance from the IC element is reduced. Therefore, the temperature of the IC element 9 can be detected more accurately. Further, by setting the two heaters 241 in a rod shape and disposed at both end portions of the heating block 240 in the X direction, the heater 241 and the temperature sensor 243 can be moved as far as possible. Therefore, the temperature sensor 243 is less susceptible to heat from the heater 241.

The temperature sensor 243 is not particularly limited as long as the temperature of the IC element 9 can be detected. For example, a Pt sensor such as a platinum sensor, a thermocouple, a thermal resistor, or the like can be used. Further, when the IC element 9 has a built-in thermosensitive diode or the like, the temperature sensor 243 may be omitted, and the temperature of the IC element 9 may be detected by the thermosensitive diode.

Further, the temperature sensor 243 of the present embodiment is arranged to indirectly detect the temperature of the IC element 9, but the arrangement is not particularly limited as long as the temperature of the IC element 9 can be detected, for example, It can be constructed directly by detecting the temperature of the IC element 9. Specifically, the temperature sensor 243 may also be disposed to be exposed on the lower surface of the component chuck 220 so as to be in contact with the IC component 9 when pressed. Further, in the inspection apparatus 1, in consideration of the thermal resistance of the heating block 240 and the contact thruster 250, the temperature detected by the temperature sensor 243 may be added to the temperature of the specific correction as the temperature of the IC element 9. .

In the present embodiment, the temperature sensor 243 is embedded in the heating block 240. However, the temperature sensor 243 may be embedded in the contact thruster 250. In this case, the distance from the IC element 9 is also close. Temperature detection accuracy is improved. However, since the contact pusher 250 is appropriately selected depending on the type and size of the IC component 9, it is assumed that the temperature sensor 243 is disposed in the contact pusher 250, and the temperature sensor must be disposed in all the contact thrusters 250 to be replaced. 243, will lead to increased costs. Therefore, in order to reduce the cost, it is preferable to arrange the temperature sensor 243 in the heating block 240 as in the present embodiment.

According to the hand unit 433, the temperature of the IC element 9 can be maintained at a specific temperature by heating by the heater 241 of the IC element 9 and cooling by the air G. Within the range (for example, set temperature ± 2 ° C or so). In particular, the temperature rise by the self-heating of the IC element 9 can be quickly eliminated by the air G, and the temperature of the IC element 9 under inspection can be kept substantially constant, and the IC element 9 can be more accurately performed. an examination.

-Recycling robots -

The collection robot 44 is a robot that transports the IC element 9 that has been inspected by the inspection unit 5 to the collection side alignment unit 6. The recovery robot 44 has a support frame 441 supported by the base 11, a moving frame 442 supported by the support frame 441 and reciprocally movable in the Y direction with respect to the support frame 441, and 4 hand units supported by the moving frame 442. (holding robot) 443. Each of the hand units 443 includes an elevating mechanism and an adsorption nozzle, and can be held by the adsorption of the IC element 9.

The transfer unit 4 transports the IC element 9 as follows. First, the transport shuttle 41 moves to the left side in the drawing, and the supply robot 42 transports the IC component 9 on the mounting table 341 to the transport shuttle 41 (step 1). Then, the transport shuttle 41 moves toward the center, and the inspection robot 43 transports the IC component 9 on the transport shuttle 41 to the inspection unit 5 (step 2). Next, the inspection robot 43 transports the IC component 9 that has been inspected by the inspection unit 5 to the transport shuttle 41 (step 3). Then, the transport shuttle 41 moves to the right side in the drawing, and the recovery robot 44 transports the inspected IC component 9 on the transport shuttle 41 to the recovery side array unit 6 (step 4). By repeating the above steps 1 to 4, the IC element 9 can be transported to the recovery side aligning unit 6 via the inspection unit 5.

In the above, the configuration of the transport unit 4 has been described. However, as the configuration of the transport unit 4, the IC element 9 on the mounting table 341 can be transported to the inspection unit 5, and the IC element 9 that has been inspected can be aligned to the recovery side. 6 Transfer is not particularly limited. For example, the transfer robot 41 may be omitted, and any one of the supply robot 42, the inspection robot 43, and the collection robot 44 may be transported from the mounting table 341 to the inspection unit 5 and from the inspection unit 5 to the collection side. Department 6 transfer.

≪Inspection Department≫

The inspection unit 5 is a unit that inspects and tests the electrical characteristics of the IC element 9. Figure 2 As shown in the figure, the inspection unit 5 has four holding portions 51 on which the IC elements 9 are arranged. When the IC element 9 is inspected, one IC element 9 is placed (held) in one holding portion 51. Since each of the holding portions 51 is the same, one of them will be described below.

As shown in FIG. 4, the holding portion 51 is detachably provided on the substrate 16, and has a mounting portion (electronic component mounting portion) 52 on which the IC component 9 can be placed. In the mounting portion 52, a through hole (flow path) 521 through which air (fluid) G flows is formed in the X direction. The through hole 521 is formed in a size such that a portion between both end portions is larger than both end portions.

Further, a plurality of probes (first conductive members) 522 electrically connectable (contactable) to the plurality of terminals 92 of the IC element 9 are provided on the mounting portion 52. A part of each probe 522, that is, an intermediate portion of each probe 522 is disposed in the through hole 521. Further, each probe 522 is electrically connected to the control unit 8.

The IC element 9 disposed in the holding portion 51, that is, the respective terminals 92 of the IC device 9 placed on the mounting portion 52 are pressed against the respective probes by specific inspection by the pressing of the hand unit 433 of the inspection robot 43 522. Thereby, each terminal 92 of the IC element 9 is electrically connected (contacted) to each probe 522, and the IC element 9 is inspected via the probe. The inspection of the IC component 9 is performed based on the program stored in the control section 8.

Further, in the vicinity of the left end portion of FIG. 4 of the through hole 521 of the mounting portion 52 on the substrate 16, the inside of the through hole 521, that is, the probe 522 is sprayed (supplied) as a cooling gas. An injection nozzle (fluid injection portion) 171 of air (fluid) G. The following pump 134 that discharges air (compressed air) is connected to the injection nozzle 171. The drive of the pump 134 is controlled by the control unit 8.

When the air G is ejected from the ejection nozzle 171, the air G flows through the through hole 521, and the air G is blown to the respective probes 522, whereby the probes 522 are cooled and can pass through the respective probes 522 and IC elements 9. Each of the terminals 92 cools the circuit portion inside the IC element 9. In this case, the circuit portion can be cooled without passing through the main body portion 91 of the IC element 9, so that the circuit portion can be efficiently cooled. Moreover, when the body portion 91 is warped, the hand unit 433 and the body portion 91 Since the contact area is reduced, the cooling efficiency by the hand unit 433 is lowered. However, even in the cooling by the holding portion 51, even if the main body portion 91 is warped, the IC element 9 can be efficiently cooled.

Further, the cooling of the IC element 9 by the holding portion 51 and the heating of the IC element 9 by the hand unit 433 can be performed independently of each other. In other words, the cooling period in which the IC element 9 is actively cooled by the holding portion 51 (the period in which the air G is ejected from the ejection nozzle 171) and the heating period in which the IC element 9 is actively heated by the hand unit 433 can be used. (during the period in which the heater 241 is being driven) overlaps, or may not be overlapped.

Further, by setting the fluid injected from the injection nozzle 171 as air, the processing can be simplified, and the cost can be reduced. Further, for example, by using air cooled by a refrigerating cooler or the like, the cooling performance of the IC element 9 can be improved. However, the fluid to be ejected from the injection nozzle 171 is not limited to air, and for example, nitrogen, argon gas, carbon dioxide, a fluorine-based gas, or a gas such as various insulating gases including a mixed gas thereof may be applied. Further, a temperature adjustment unit that adjusts the temperature of the air (fluid) injected from the injection nozzle 171 may be provided.

In addition, instead of the injection nozzle 171, for example, a connection 埠 (not shown) may be provided in the holding portion 51, and the following tubular body 142 may be connected to the connection 埠, and the air G may be ejected from the connection 埠 into the through hole 521.

≪Control Department≫

The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit performs inspection of electrical characteristics of the IC component 9 disposed in the inspection unit 5, for example, based on a program stored in a memory (not shown). In addition, for example, the drive control unit controls the driving of each of the supply unit 2, the supply-side arranging unit 3, the transport unit 4, the inspection unit 5, the collection-side arranging unit 6, and the collection unit 7, and the IC element 9 is transported. Moreover, the control unit 8 also performs temperature control of the IC element 9.

Next, the temperature control of the IC element 9 will be described. Also, for the temperature control The mechanism for ejecting the air G to the radiator 291 and the mechanism for ejecting the air G into the through hole 521 will be described. However, a mechanism relating to one of the injection nozzles 292 and 171 will be described as a representative.

As shown in Fig. 5, the inspection apparatus 1 has a pump (fluid supply unit) 132 that ejects air G, supplies air G to the injection nozzle 292, a pipe body 141 that connects the pump 132 to the injection nozzle 292, and a pump (fluid supply) a portion 134 that supplies air G to the injection nozzle 171; and a tube body 142 that connects the pump 134 to the injection nozzle 171. The inner cavities of the tubes 141 and 142 are respectively flow paths through which the air G flows. Further, a solenoid valve (valve) 131 that opens and closes the flow path is provided in the middle of the pipe body 141. Further, a solenoid valve (valve) 133 that opens and closes the flow path is provided in the middle of the pipe body 142. Further, the driving of the solenoid valves 131 and 133 is controlled by the control unit 8, respectively.

In the inspection apparatus 1, the temperature of the IC element 9 is detected by the temperature sensor 243, and based on the detection result, the temperature of the IC element 9 is set to a specific set temperature (target temperature) suitable for inspection. Perform temperature control.

The solenoid valves 131 and 133 are closed before the inspection of the IC component 9. Then, the heater 241 is driven to heat the IC element 9, and the output of the heater 241 is adjusted to adjust the temperature of the IC element 9 to the set temperature. Further, when the temperature of the IC element 9 detected by the temperature sensor 243 is higher than the threshold Tmax which is the upper limit of the allowable range of the set temperature, the output of the heater 241 can be reduced or stopped. At the same time, the solenoid valve 131 can be opened, and the air G is ejected from the injection nozzle 292. When the air G is ejected from the ejection nozzle 292, the air G is blown to the heat sink 291, and the IC element 9 is cooled via the heat sink 291, the heating block 240, and the contact pusher 250. As a result, the temperature of the IC element 9 is controlled so as to become the set temperature.

In the inspection of the IC element 9, there is a case where the IC element 9 self-heats by energization of the IC element 9, and becomes higher than the set temperature. Therefore, the temperature of the IC element 9 detected by the temperature sensor 243 is higher than the threshold value which is the upper limit of the allowable range of the set temperature. In the case of Tmax, the output of the heater 241 is reduced or stopped, and the solenoid valves 131 and 133 are opened, respectively, and the air G is ejected from the injection nozzles 292 and 171. Further, when the ejection of the air G from the ejection nozzle 171 is sufficient, the ejection of the air G from the ejection nozzle 292 may not be performed.

The air G is ejected from the injection nozzle 292, and the air G is blown to the radiator 291, and the IC element 9 is cooled via the radiator 291, the heating block 240, and the contact thruster 250. In this case, the circuit portion is cooled via the body portion 91 of the IC component 9.

Further, the air G is ejected from the injection nozzle 171, and the air G flows through the through hole 521, and the air G is blown to the probes 522, and the circuits of the IC elements 9 are passed through the respective terminals 522 of the probe 522 and the IC element 9. The department was cooled.

As a result, the temperature of the IC element 9 is controlled so as to become the set temperature.

As described above, according to the inspection apparatus 1, the mechanism for heating the IC element 9 is provided in the hand unit 433, and the mechanism for cooling the IC element 9 is provided in the holding portion 51, so that compared with the case where cooling and heating are performed at one portion, In the temperature control of the IC element 9, the cooling responsiveness and the heat responsiveness of the IC element 9 can be improved, respectively.

Further, by cooling the terminal 92 of the IC element 9, the circuit portion of the IC element 9 is cooled via the terminal 92, whereby the temperature of the IC element 9 can be rapidly lowered.

Further, since the IC element 9 can be cooled while being heated, the temperature of the IC element 9 can be adjusted with high precision.

<Second embodiment>

Fig. 6 is a cross-sectional view showing a holding portion of an inspection unit according to a second embodiment of the electronic component inspection device of the present invention.

In the following, the second embodiment will be described with the exception of the first embodiment, and the description of the same matters will be omitted.

As shown in FIG. 6, in the inspection apparatus 1 of the second embodiment, the holding portion 51 includes a placing portion 52 and a flow path member 53 disposed on the surface of the mounting portion 52 on which the IC element 9 is placed. On the opposite side, it is detachably disposed on the substrate 16. Further, the placing portion 52 is detachably provided on the flow path member 53.

In the flow path member 53, a through hole (flow path) 531 through which the air G can flow is formed in the X direction. The through hole 531 is formed in a size such that a portion between both end portions is larger than both end portions.

Further, the flow path member 53 is provided with a plurality of probes (second conductive members) 532 electrically connectable (contactable) to the plurality of probes 522. Furthermore, each of the probes 532 and the probes 522 may be electrically connected to each other, for example, or may be electrically connected when the hand unit 433 presses the IC component 9.

One of the probes 532, that is, the intermediate portion of each of the probes 532 is disposed in the through hole 531. Further, each probe 532 is electrically connected to the control unit 8.

Further, the injection nozzle 171 is provided in the vicinity of the end portion on the left side in FIG. 6 of the through hole 531 of the flow path member 53 on the substrate 16, and the air is injected from the injection nozzle 171 into the through hole 531, that is, each probe 532. .

When the air G is ejected from the ejection nozzle 171, the air G flows through the through hole 531, and the air G is blown to the respective probes 532, whereby the probes 532 are cooled, and the probes 532 and the probes 522 can be passed through the probes 532 and the probes 522. And the respective terminals 92 of the IC component 9 cool the circuit portion inside the IC component 9.

According to the second embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

<Third embodiment>

Fig. 7 is a cross-sectional view showing a holding portion of an inspection unit according to a third embodiment of the electronic component inspection device of the present invention.

In the following, the third embodiment will be described, but the differences from the above-described first embodiment will be mainly described, and the description of the same matters will be omitted.

As shown in Fig. 7, in the inspection apparatus 1 of the third embodiment, the holding unit 51 has a load. The placing portion 52 is detachably provided on the substrate 16 and the heat sink (heat radiating portion) 173 is disposed on the opposite side of the mounting portion 52 with the substrate 16 interposed therebetween. The heat sink 173 has a plate-like base portion 1731 which is detachably provided on the substrate 16 and a plurality of heat sinks 1732 which protrude downward from the base portion 1731, that is, on the side opposite to the substrate 16.

Further, an insulating sheet may be provided between the heat sink 173 and the substrate 16.

Further, an injection nozzle (fluid ejection portion) 172 that ejects air G to each of the fins 1732 of the heat sink 173 is provided in the vicinity of the heat sink 173 on the surface of the substrate 16 on which the heat sink 173 is provided. A plurality of injection holes 1721 for injecting air G are formed in the injection nozzle 172.

When the air G is ejected from the respective ejection holes 1721 of the ejection nozzles 172, the air G is blown to the respective fins 1732 of the heat sink 173, and can be passed through the heat sink 173, the substrate 16, the mounting portion 52, and the terminals 92 of the IC component 9. The circuit portion inside the IC element 9 is cooled.

According to the third embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

Furthermore, the third embodiment can also be applied to the first embodiment and the second embodiment. In other words, the first embodiment and the second embodiment may further include a configuration of the third embodiment.

<Fourth embodiment>

Fig. 8 is a cross-sectional view showing a holding portion of an inspection portion according to a fourth embodiment of the electronic component inspection device of the present invention.

In the following, the fourth embodiment will be described, but the differences from the first embodiment will be mainly described, and the description of the same matters will be omitted.

As shown in FIG. 8, in the inspection apparatus 1 of the fourth embodiment, the holding portion 51 has a mounting portion 52 detachably provided on the substrate 16, and a heat sink (heat radiating portion) 175 which is provided on the load. Position 52.

The heat sink 175 has a plate-like base portion 1751 and a plurality of fins 1752 which protrude upward from the base portion 1751, that is, on the side opposite to the substrate 16. In the heat sink 175, the A portion of the base portion 1751 where the fins 1752 are not provided is disposed in the mounting portion 52, and each of the fins 1752 is disposed on the right side of FIG. 8 of the mounting portion 52. Further, each probe 522 is provided on the mounting portion 52 and the base portion 1751 of the heat sink 175.

Further, the heat sink 175 has insulation properties. Thereby, each of the probes 522 can be prevented from being short-circuited in the heat sink 175. The constituent material of the heat sink 175 is not particularly limited as long as it has insulating properties, and examples thereof include various ceramics and various resin materials.

Further, an injection nozzle (fluid ejection portion) 174 that ejects air G to each of the fins 1752 is provided in the vicinity of the fins 1752 of the heat sink 175 on the surface of the substrate 16 on which the mounting portion 52 is provided. A plurality of injection holes 1741 for injecting air G are formed in the injection nozzle 174.

When the air G is ejected from the respective ejection holes 1741 of the ejection nozzle 174, the air G is blown to the respective fins 1752 of the heat sink 175, and the circuit inside the IC element 9 can be cooled via the heat sink 175 and the terminals 92 of the IC component 9. unit.

According to the fourth embodiment described above, the same effects as those of the first embodiment described above can be exhibited.

<Fifth Embodiment>

Fig. 9 is a cross-sectional view showing a holding portion of an inspection unit according to a fifth embodiment of the electronic component inspection device of the present invention.

In the following, the fifth embodiment will be described, but the differences from the second embodiment will be mainly described, and the description of the same matters will be omitted.

As shown in FIG. 9, in the inspection apparatus 1 of the fifth embodiment, the holding portion 51 has a mounting portion 52 and a flow path member 53 disposed on the opposite side of the mounting portion 52 on which the IC element 9 is placed. The side is detachably provided on the substrate 16; and a heat sink (heat radiating portion) 175 is provided in the flow path member 53. Further, the placing portion 52 is detachably provided on the flow path member 53.

The heat sink 175 has a plate-like base portion 1751 and a plurality of fins 1752 which protrude upward from the base portion 1751, that is, on the side opposite to the substrate 16. In the heat sink 175, a portion of the base portion 1751 where the heat sinks 1752 are not disposed is disposed in the flow path member 53 for heat dissipation. The sheet 1752 is disposed on the right side of FIG. 9 of the flow path member 53. Further, each probe 532 is provided in the flow path member 53 and the base portion 1751 of the heat sink 175.

Further, the heat sink 175 has insulation properties. Thereby, each of the probes 532 can be prevented from being short-circuited in the heat sink 175. The constituent material of the heat sink 175 is not particularly limited as long as it has insulating properties, and examples thereof include various ceramics and various resin materials.

Further, an injection nozzle (fluid ejection portion) 174 that ejects air G to each of the fins 1752 is provided in the vicinity of the fins 1752 of the heat sink 175 on the surface of the substrate 16 on which the flow path member 53 is provided. A plurality of injection holes 1741 for injecting air G are formed in the injection nozzle 174.

When the air G is ejected from the respective ejection holes 1741 of the ejection nozzle 174, the air G is blown to the respective fins 1752 of the heat sink 175, and the circuit inside the IC element 9 can be cooled via the heat sink 175 and the terminals 92 of the IC component 9. unit.

According to the fifth embodiment as described above, the same effects as those of the second embodiment described above can be exhibited.

<Sixth embodiment>

Fig. 10 is a block diagram showing the principal part of a sixth embodiment of the electronic component inspection device of the present invention.

In the following, the sixth embodiment will be described, but the description will be focused on the differences from the above-described first embodiment, and the description of the same matters will be omitted.

As shown in Fig. 10, the inspection apparatus 1 of the sixth embodiment includes a pump 132 that discharges air G, supplies air G to the injection nozzle 292, a pipe body 141 that connects the pump 132 to the injection nozzle 292, and a pump 134. Air G is supplied to the injection nozzle 171; a pipe body 142 that connects the pump 134 to the injection nozzle 171; and a heater (heating portion) 181. The inner cavities of the tubes 141 and 142 are respectively flow paths through which the air G flows.

Further, a solenoid valve 131 that opens and closes the flow path is provided in the middle of the pipe body 141.

Further, in the middle of the pipe body 142, a three-way solenoid valve (valve) 135 is provided, and the pipe body 142 is borrowed. The electromagnetic valve 135 is branched into the first tubular body 1421 and the second tubular body 1422, and then merged again. That is, the first pipe body 1421 and the second pipe body 1422 are connected in parallel. The inner cavity of the first pipe body 1421 is a first flow path through which the air G flows, and the inner cavity of the second pipe body 1422 is a second flow path through which the air G flows. Further, the solenoid valve 135 has a function of connecting a flow path from the pump 134 toward the injection nozzle 171 to either of the first flow path and the second flow path.

Further, a check valve 136 is provided in the middle of the second pipe body 1422, and only the air G from the pump 134 toward the injection nozzle 171 flows in the second pipe body 1422.

Further, the heater 181 heats the air G flowing between the solenoid valve 135 of the second pipe body 1422 and the check valve 136. On the other hand, the first pipe body 1421 bypasses the heater 181, and the air G flowing through the first pipe body 1421 is not heated by the heater 181.

Further, the driving of the heater 181 and the electromagnetic valves 131 and 135 is controlled by the control unit 8, respectively.

In the inspection apparatus 1, by the energization control of the electromagnetic valve 135, it is possible to select which of the first tube body 1421 and the second tube body 1422 the air G flows, whereby the holding portion can be selected. 51 is cooling or heating the IC element 9 disposed in the holding portion 51.

That is, when the air G flows through the first pipe body 1421, the air G is ejected from the injection nozzle 171. Then, the air G flows through the through holes 521, and the air G is blown to the respective probes 522, whereby the probes 522 are cooled, and the IC elements 9 can be cooled via the respective terminals 522 and the terminals 92 of the IC elements 9. The internal circuit part.

When the heater 181 is driven to flow the air G through the second tube 1422, the air G flowing through the second tube 1422 is heated by the heater 181, and the heated air G is ejected from the ejection nozzle 171. . Then, the air G flows through the through holes 521, and the air G is blown to the respective probes 522, whereby the probes 522 are heated, and the IC elements 9 can be heated via the respective terminals 522 of the probes 522 and the IC elements 9. The internal circuit part.

Thereby, the temperature control of the IC element 9 can be performed easily and with high precision.

According to the sixth embodiment as described above, the first embodiment can be exhibited. The same effect.

Furthermore, the sixth embodiment can also be applied to the second to fifth embodiments.

<Seventh embodiment>

In the following, the seventh embodiment will be described with the exception of the first embodiment, and the description of the same matters will be omitted.

In the inspection apparatus 1 of the seventh embodiment, heating and cooling of the IC element 9 are performed based on the information of the junction temperature (Tj) of the IC element 9. The junction temperature refers to the temperature inside the IC element 9, and is, for example, the temperature of the connection between the wire inside the IC component 9 and the member constituting the component.

Since the junction temperature of the IC device 9 is difficult to be measured, in the present embodiment, the inspection device 1 detects the temperature of the surface of the IC component 9 by the temperature sensor 243, based on the temperature of the surface of the IC component 9. And known materials such as thermal resistance and heat loss of the IC component 9, and calculate the junction temperature (information on the junction temperature). Then, the junction temperature of the IC element 9 is regarded as the temperature of the IC element 9. In other words, the inspection apparatus 1 performs temperature control such that the junction temperature of the IC element 9 becomes the set temperature. In the temperature control, as in the first embodiment, the heater 241 is driven to heat the IC element 9, or the air is ejected from the ejection nozzle 292, or the air is ejected from the ejection nozzle 171.

When the IC element 9 generates heat during the inspection, the junction temperature becomes higher than the temperature of the surface of the IC element 9, but the temperature is controlled based on the junction temperature of the IC element 9 as described above, and the junction temperature is adjusted to The temperature is set so that the inspection can be performed under appropriate temperature conditions.

According to the seventh embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

Further, in the present embodiment, the IC element 9 is heated and cooled based on the information on the junction temperature of the IC element 9. However, the present invention is not limited thereto, and may be configured based on the IC element 9. Information on the junction temperature, heating and cooling of the IC component 9 Any of them.

Further, the seventh embodiment can also be applied to the second to sixth embodiments.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above based on the embodiments shown in the drawings, the present invention is not limited thereto, and the configuration of each unit may be replaced with any configuration having the same function. Further, any other constituents may be added to the present invention.

Further, the present invention may be a combination of any two or more of the above-described configurations (features).

Claims (12)

An electronic component conveying apparatus comprising: a holding portion that abuts on an electronic component having a terminal and holds the electronic component, and that can heat the electronic component; and the heating period by the holding portion The cooling period during which the holding portion of the terminal can be cooled when the electronic component is placed can be overlapped. An electronic component inspection device comprising: a holding portion that abuts on an electronic component having a terminal and holds the electronic component, and can heat the electronic component; and an inspection portion that has an electronic component mounted thereon The electronic component is inspected by cooling the holding portion of the terminal, and the heating period by the holding portion and the cooling period by the holding portion are overlapped. The electronic component inspection device according to claim 2, wherein the holding portion includes an electronic component mounting portion on which the electronic component is placed, and a first conductive member that is in contact with the terminal; and the electronic component The placing portion has a flow path through which at least a part of the first conductive member is disposed and through which a fluid can flow. An electronic component inspection device according to claim 3, comprising a fluid ejecting portion that ejects a fluid to the first conductive member. The electronic component inspection device according to claim 2, wherein the holding portion includes: an electronic component mounting portion that mounts the electronic component and has a first conductive member that is in contact with the terminal; and a flow path member that is disposed in the electronic component mounting portion a side of the electronic component mounting portion on the opposite side of the surface on which the electronic component is placed, having a flow path through which the fluid can flow and the first conductive a second conductive member that is in contact with the member; and at least a portion of the second conductive member is disposed in the flow path. An electronic component inspection device according to claim 5, comprising a fluid ejecting portion that ejects a fluid to the second conductive member. The electronic component inspection device of claim 2, wherein the holding portion has a heat dissipation portion. The electronic component inspection apparatus of claim 7, wherein the heat dissipation portion has insulation properties. The electronic component inspection device according to claim 2, wherein the holding portion includes: an electronic component mounting portion that mounts the electronic component and is disposed on the substrate; and a heat dissipation portion that is disposed between the electronic component and the substrate The opposite side of the part placement. The electronic component inspection device according to any one of claims 7 to 9, comprising a fluid ejecting portion that ejects a fluid to the heat dissipating portion. The electronic component inspection apparatus according to any one of claims 2 to 9, wherein the holding portion heats the electronic component. The electronic component inspection apparatus according to any one of claims 2 to 9, wherein at least one of the heating and the cooling is performed based on information on a junction temperature of the electronic component.