TWI639842B - Electronic component conveying device, electronic component inspection device, and electronic component pressing device - Google Patents

Abstract

The present invention provides an electronic component conveying apparatus, an electronic component inspection apparatus, and an electronic component pressing apparatus that can more accurately perform temperature control of an electronic component or can achieve higher responsiveness to temperature control.

The inspection apparatus 1 includes a heat transfer structure 30 capable of holding electronic components and capable of conducting heat, a heat dissipation structure 40 capable of dissipating heat by passing a fluid, and an inspection portion for inspecting electronic components; and the heat dissipation structure 40 A heat exchange promoting member 17 as a heat transfer member is provided between the heat transfer structure 30 and the heat transfer structure 30.

Description

Electronic component conveying device, electronic component inspection device, and electronic component pressing device

The present invention relates to an electronic component conveying device, an electronic component inspection device, and an electronic component pressing device.

For example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (integrated circuit) component has been known, and the electronic component inspection device is assembled to transport the IC component to the holding portion of the inspection unit. Electronic parts transfer device. When the IC component is inspected, the IC component held by the holding portion of the electronic component transfer device is placed on the holding portion. Further, the holding portion presses the IC element toward the holding portion. Thereby, the plurality of terminals of the IC component are respectively pressed against the plurality of probe pins provided in the holding portion, and the terminals of the IC component are in contact with the probe pins and electrically connected.

Further, there is a case where the IC element is adjusted to a desired temperature and the inspection is performed when the IC element is inspected. In this case, the member having the heat sink (heat-absorbing heat sink) is brought into contact with the IC element, and heat exchange with the IC element is performed (for example, refer to Patent Document 1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-28923

However, in the device described in Patent Document 1, since only heat is fixedly provided The structure of the device makes it difficult to perform sufficient heat exchange, that is, temperature control.

An object of the present invention is to provide an electronic component conveying apparatus, an electronic component inspection apparatus, and an electronic component pressing apparatus that can more accurately perform temperature control of an electronic component or achieve higher responsiveness to temperature control.

Such an object is achieved by the invention described below.

[Application Example 1]

An electronic component transporting apparatus according to the present invention is characterized by comprising: a heat conducting portion capable of holding an electronic component and capable of conducting heat; and a heat radiating portion capable of dissipating heat by passing a fluid; and between the heat radiating portion and the heat conducting portion It has a heat conducting member.

Thereby, temperature control of the electronic component can be performed more accurately, or higher responsiveness of temperature control can be achieved.

[Application Example 2]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat radiating portion is disposed to be in contact with or away from the heat conducting portion.

Thereby, the temperature control of the electronic component can be performed accurately, or the temperature control can be realized, and the responsiveness can be further improved.

[Application Example 3]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat transfer member is disposed in the heat transfer portion.

In this case, for example, when one of the heat conducting members is formed of a fluid, unlike the heat radiating portion, if the heat conducting member is disposed in the heat conducting portion that is fixedly disposed, the fluid pulsation or the like can be suppressed.

[Application Example 4]

In the electronic component conveying device of the present invention, preferably, the heat dissipating portion is provided The abutment drive unit of the heat transfer portion is abutted, and the contact drive unit is configured by a fluid machine.

Thereby, for example, compared with the case where the abutting drive unit is constituted by an electric device such as a motor, power consumption can be suppressed, and piping, wiring, and the like can be simplified. In addition, it contributes to the miniaturization of the abutting drive unit, that is, space saving.

[Application Example 5]

In the electronic component conveying apparatus of the present invention, preferably, the abutting drive unit includes a cylinder portion having a hollow portion, and a piston portion that slides in the hollow portion.

Thereby, for example, compared with the case where the abutting drive unit is constituted by an electric device such as a motor, power consumption can be further suppressed, and piping, wiring, and the like can be further simplified. In addition, it contributes to the miniaturization of the abutting drive unit, that is, space saving.

[Application Example 6]

In the electronic component conveying apparatus of the present invention, it is preferable that the piston portion has a larger elastic deformation rate or a plastic deformation ratio than the heat dissipating portion.

Thereby, it is possible to prevent or suppress the collision sound generated between the piston portion and the heat radiating portion or the abrasion of the heat radiating portion.

[Application Example 7]

In the electronic component conveying apparatus of the present invention, it is preferable that a member having a larger elastic deformation rate or a plastic deformation ratio than the piston portion and the heat dissipating portion is interposed between the piston portion and the heat dissipating portion.

Thereby, it is possible to prevent or suppress the collision sound or the abrasion of the piston portion which can be generated between the heat radiating portion and the piston portion and the heat radiating portion.

[Application Example 8]

In the electronic component conveying apparatus of the present invention, it is preferable that a plate member is interposed between the piston portion and the heat radiating portion.

Thereby, the collision sound generated between the piston portion and the heat dissipation portion can be prevented or suppressed Wear of the heat sink and the piston.

[Application Example 9]

In the electronic component conveying apparatus of the present invention, preferably, the heat dissipating portion is separated from the heat transfer portion and separated from the driving portion, and the leaving driving portion has an elastic member.

Thereby, the heat radiating portion can be separated from the heat transfer portion by a simple configuration.

[Application Example 10]

In the electronic component conveying apparatus of the present invention, it is preferable that the elastic member is a coil spring.

Thereby, the heat radiating portion can be separated from the heat transfer portion by a simple configuration.

[Application Example 11]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat radiating portion blows the fluid while being in contact with or away from the heat conducting portion.

Thereby, the temperature difference between the heat radiating portion and the heat conducting portion can be sufficiently ensured, and therefore, the heat radiating portion can absorb heat from the heat conducting portion in a state of being in contact with the heat conducting portion, and the heat radiation effect can be improved.

[Application Example 12]

In the electronic component conveying apparatus of the present invention, it is preferable that the stroke of the heat radiating portion when contacting or leaving the heat conducting portion is greater than 0 mm and less than 5 mm.

Thereby, the moving time of the heat radiating portion can be made as short as possible, so that rapid heat exchange between the heat radiating portion and the heat conducting portion can be performed.

[Application Example 13]

In the electronic component conveying apparatus of the present invention, it is preferable that a direction in which the heat radiating portion abuts against the heat conducting portion is a direction in which the heat conducting portion abuts on the electronic component.

Thereby, since the directions of the two are the same, for example, the configuration of the electronic component conveying device can be simplified or the control can be facilitated.

[Application Example 14]

In the electronic component conveying apparatus of the present invention, it is preferable that a direction in which the heat radiating portion is separated from the heat conducting portion is a direction opposite to a direction in which the heat conducting portion is in contact with the electronic component.

Thereby, since the directions of the two are the same, for example, the configuration of the electronic component conveying device can be simplified or the control can be facilitated.

[Application Example 15]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat transfer member is a fluid or a solid.

Thereby, the thickness of the entire heat transfer member can be suppressed, and therefore heat transfer is rapidly performed.

[Application Example 16]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat transfer member includes the first heat transfer member and the second heat transfer member.

Thereby, the heat exchange time between the heat radiating portion and the heat conducting portion can be shortened as compared with the case where the heat conducting member is omitted. Thereby, higher responsiveness to temperature control of electronic components can be achieved.

[Application Example 17]

In the electronic component conveying apparatus of the present invention, it is preferable that the first heat transfer member is a fluid and disposed on the heat transfer portion side, and the second heat transfer member is solid and disposed on the heat radiation portion side.

Thereby, the thickness of the entire heat transfer member can be suppressed, and therefore the heat transfer from the heat transfer portion to the heat radiating portion is rapidly performed.

[Application Example 18]

In the electronic component conveying apparatus of the present invention, preferably, the first heat transfer member is a thermally conductive grease, and the second heat transfer member includes indium.

Thereby, the heat dissipation portion and the heat conduction can be further shortened as compared with the case where the heat conduction member is omitted. The heat exchange time between the departments. Thereby, it is possible to achieve high responsiveness to the temperature control of the electronic component.

[Application Example 19]

In the electronic component conveying apparatus of the present invention, it is preferable that an area of the first heat transfer member is smaller than an area of the second heat transfer member.

Thereby, for example, even if the second heat transfer member crushes the first heat transfer member, the first heat transfer member can be prevented from being exposed from the second heat transfer member. Therefore, it is possible to prevent the first heat transfer member from adhering to other members and the like around the periphery.

[Application Example 20]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat radiating portion has a heat radiating member.

Thereby, heat dissipation to the heat transfer portion is easily performed via the heat dissipation member.

[Application Example 21]

In the electronic component conveying apparatus of the present invention, it is preferable that the heat radiating portion has a heat conducting member having a heat capacity larger than a heat capacity of the heat radiating member.

Thereby, the heat of the heat transfer portion can be quickly transmitted to the heat radiating member via the heat transfer member in a state where the heat radiating portion abuts against the heat transfer portion, and the heat radiation effect is improved.

[Application Example 22]

In the electronic component conveying apparatus of the present invention, it is preferable that the fluid is air.

Thereby, it is possible to prevent contamination of peripheral machines and the like by the fluid.

[Application Example 23]

An electronic component inspection apparatus according to the present invention includes: a heat transfer portion capable of holding an electronic component and capable of conducting heat; a heat dissipation portion capable of dissipating heat by passing a fluid; and an inspection portion for inspecting the electronic component; A heat transfer member is disposed between the heat radiating portion and the heat transfer portion.

Thereby, temperature control of the electronic component can be performed more accurately, or higher responsiveness of temperature control can be achieved.

[Application Example 24]

The electronic component pressing device of the present invention is characterized in that: a heat conducting portion capable of holding an electronic component and capable of conducting heat; and a heat radiating portion capable of dissipating heat by passing a fluid; and between the heat radiating portion and the heat conducting portion It has a heat conducting member.

Thereby, temperature control of the electronic component can be performed more accurately, or higher responsiveness of temperature control can be achieved.

1‧‧‧Checking device

2‧‧‧Supply Department

3‧‧‧Supply side alignment

4‧‧‧Transportation Department

5‧‧‧Inspection Department

6‧‧‧Recycling side alignment

7‧‧Recycling Department

8‧‧‧Control Department

9‧‧‧IC components

9A‧‧‧IC components

9B‧‧‧IC components

10‧‧‧Transporting device

11‧‧‧Base

12‧‧‧ Cover

13‧‧‧1st abutment member

14‧‧‧2nd abutment member

15‧‧‧heatsink

16‧‧‧heat-conducting components

17‧‧‧Heat exchange facilitating members (heat conducting members)

18‧‧‧ cushioning members

20‧‧‧Connected structure (connection)

30‧‧‧ Heat-conducting structure (heat-conducting part)

40‧‧‧Solid heat structure (heat dissipation part)

41‧‧‧ Shuttle

42‧‧‧Supply robot

43‧‧‧Check the robot

44‧‧‧Recycling robot

45‧‧‧ socket layout components

46‧‧‧Hand unit (pressing member)

47‧‧‧Base (pressing member configuration member)

48‧‧‧Cooling structure

49‧‧‧ Sealing member (cushion)

50‧‧‧Guiding components (support department)

51‧‧‧ Keeping Department

60‧‧‧Insulation components

70‧‧‧ convex members

91‧‧‧ Circuit Department

92‧‧‧Semiconductor (wafer department)

93‧‧‧ Center

111‧‧‧ base surface

131‧‧‧Edge

132‧‧‧through holes

141‧‧‧Flange

142‧‧‧ Highlights

151‧‧‧Base section

152‧‧‧ Heat sink

161‧‧ ‧ spring seat

162‧‧‧through holes

171‧‧‧1st heat conducting member

172‧‧‧2nd heat conducting member

201‧‧‧1st fluid machine

201a‧‧‧Cylinder Department

201b‧‧‧Piston Department

201c‧‧‧ diaphragm

201d‧‧‧ Hollow

201e‧‧‧flow path

202‧‧‧2nd fluid machine

203‧‧‧Intermediate components

203a‧‧‧Relay flow path

204‧‧‧Cylinder Department

204a‧‧‧ Hollow

204b‧‧‧Flow

204c‧‧‧ Sealing member (cushion)

205‧‧‧Piston Department

205a‧‧‧Reducing section

205b‧‧‧Protruding

206‧‧‧shims

207‧‧‧ pump

208‧‧‧ solenoid valve

209a‧‧‧actuating fluid

209b‧‧‧actuating fluid

301‧‧‧thermal block (thermally conductive member)

301a‧‧ ‧ spring seat

301b‧‧‧Relay flow path

302‧‧‧Abutment components

302a‧‧‧shims (SIM)

303‧‧‧Support components

303a‧‧‧Inner tube

303b‧‧‧Outer tube

303c‧‧‧Attracting the flow path

303d‧‧‧Sealing member (cushion)

303e‧‧‧Flange

304‧‧‧heater

305‧‧‧Compressed coil spring

306‧‧‧Adsorption components

307‧‧‧Injector

308‧‧‧ Temperature Adjustment Department

308a‧‧‧ thermocouple

308b‧‧‧ Platinum Sensor (Pt Sensor)

341‧‧‧Loading platform

411‧‧‧ bag body

421‧‧‧Support framework

422‧‧‧Mobile framework

423‧‧‧Hand unit

431‧‧‧Support framework

432‧‧‧Moving frame (pressing member arranging member mounting member)

433‧‧‧Frame side communication hole (connection member side communication hole)

434‧‧‧Frame side communication hole for refrigerant

441‧‧‧Support framework

442‧‧‧Mobile framework

443‧‧‧Hand unit

473‧‧‧Edge

474‧‧‧Defects Department

477‧‧‧Connected holes

478‧‧‧ corner

479‧‧‧Connecting hole for refrigerant

481‧‧‧Spray outlet

701‧‧‧ convex

911‧‧‧ upper surface

921‧‧‧ upper surface

A1‧‧‧1st area (pressing member arrangement area)

A2‧‧‧2nd area (connecting hole arrangement area)

h‧‧‧Outstanding amount

Lmax‧‧‧Maximum length (full length)

L ₁ ‧‧‧Center distance

L ₂ ‧‧‧Center distance

S‧‧‧ Itinerary

Tmax‧‧‧max thickness

Wmax‧‧‧Maximum width

W ₁ ‧‧‧Center distance

Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention.

Fig. 2 is a plan view showing an operation state of a main part of the electronic component inspection device shown in Fig. 1.

Fig. 3 is a schematic exploded perspective view showing the inspection robot of the conveying unit of the electronic component inspection device shown in Fig. 1;

Fig. 4 is a vertical sectional view showing an operation state of one hand unit which can be attached to the socket layout unit of the inspection robot shown in Fig. 3.

Fig. 5 is a vertical sectional view showing an operation state of one hand unit which can be attached to the socket layout unit of the inspection robot shown in Fig. 3.

Fig. 6 is an enlarged detailed vertical sectional view showing a state in which the hand unit shown in Figs. 4 and 5 holds an IC element.

Fig. 7 is a perspective view showing a piston portion of the hand unit shown in Figs. 4 and 5;

Fig. 8 is a horizontal cross-sectional view showing the heat sink of the hand unit shown in Figs. 4 and 5 and its periphery.

Figure 9 is a diagram showing the thermocouple and platinum sensor of the hand unit shown in Figures 4 and 5; A top view of the positional relationship of IC components.

Fig. 10 is a plan view showing a positional relationship between a first abutting member and a second abutting member among the abutting members of the hand unit shown in Figs. 4 and 5;

11(a) to 11(e) are vertical longitudinal sectional views showing a state in which the first abutting member included in the hand unit shown in Figs. 4 and 5 is deformed in accordance with the IC element.

Figure 12 is a block diagram showing the relationship between the main parts of the hand unit shown in Figures 4 and 5.

Fig. 13 is a vertical longitudinal sectional view showing a heat sink of one hand unit and its surroundings in the electronic component inspection device (second embodiment) of the present invention.

Fig. 14 is a vertical longitudinal sectional view showing a driving unit of one hand unit in the electronic component inspection device (third embodiment) of the present invention.

Hereinafter, the electronic component conveying apparatus, the electronic component inspection apparatus, and the electronic component pressing apparatus of the present invention will be described in detail based on preferred embodiments shown in the drawings.

<First embodiment>

Fig. 1 is a schematic view showing a first embodiment of an electronic component inspection device according to the present invention. Fig. 2 is a plan view showing an operation state of a main part of the electronic component inspection device shown in Fig. 1. Fig. 3 is a schematic exploded perspective view showing the inspection robot of the conveying unit of the electronic component inspection device shown in Fig. 1; 4 and 5 are vertical cross-sectional views showing an operation state of one hand unit that can be attached to the socket layout component of the inspection robot shown in Fig. 3, respectively. Fig. 6 is an enlarged detailed vertical sectional view showing a state in which the hand unit shown in Figs. 4 and 5 holds an IC element. Fig. 7 is a perspective view showing a piston portion of the hand unit shown in Figs. 4 and 5; Fig. 8 is a horizontal cross-sectional view showing the heat sink of the hand unit shown in Figs. 4 and 5 and its periphery. Fig. 9 is a plan view showing the positional relationship between the thermocouple and the platinum sensor and the IC element of the hand unit shown in Figs. 4 and 5; Figure 10 is a view showing the hand unit shown in Figures 4 and 5 A plan view showing a positional relationship between the first abutting member and the second abutting member among the abutting members. Fig. 11 is a vertical longitudinal sectional view showing a state in which the first abutting member of the hand unit shown in Figs. 4 and 5 is deformed in accordance with the IC element. Figure 12 is a block diagram showing the relationship between the main parts of the hand unit shown in Figures 4 and 5.

In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is also referred to as "X direction", and the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". 3 to 7 and FIG. 11 (the same applies to FIGS. 13 and 14), the upper side in the Z-axis direction is referred to as "upper" or "upper", and the lower side is referred to as "lower" or "lower". Moreover, the "level" as used in the specification of the present invention is not limited to a complete level, and includes a state in which it is inclined with respect to the horizontal (for example, to the extent of 5 degrees) as long as it does not hinder the conveyance of the electronic component.

The inspection device (electronic component inspection device) 1 shown in FIG. 1 is used, for example, for an IC including a BGA (Ball Grid Array) package or an LGA (Land Grid Array) package. Display elements such as components, LCD (Liquid Crystal Display), OLED (Organic Electroluminescence Display), electronic paper, etc., CIS (CMOS Image Sensor, complementary metal oxide semiconductor image sensor), CCD ( Charge Coupled Device, charge sensor, gyro sensor, pressure sensor, etc., and electrical characteristics of electronic components including crystal oscillators, etc. A device referred to as "inspection" for short. In the following, for the sake of convenience of explanation, the case where the IC component is used as the electronic component to be inspected will be described as a representative, and this will be referred to as "IC component 9". In the present embodiment, as the configuration of the IC device 9, a circuit portion 91 having a plate shape having a terminal and a semiconductor portion (wafer portion) 92 mounted on a central portion of the circuit portion 91 are used as the configuration. An example. The semiconductor portion 92 has a smaller area than the circuit portion 91 in plan view of the IC element 9 (see FIGS. 9 and 10).

As shown in Fig. 1, the inspection apparatus 1 includes a supply unit 2, a supply side array unit 3, a conveyance unit 4, an inspection unit 5, a collection side array unit 6, a collection unit 7, and a control unit 8 that controls the respective units. Further, the inspection apparatus 1 includes a susceptor 11 that is provided with a supply unit 2, a supply-side arranging unit 3, a transport unit 4, an inspection unit 5, a collection-side arranging unit 6, and a recovery unit 7, and a cover 12 for accommodating the supply side. The aligning unit 3, the conveying unit 4, the inspection unit 5, and the collection side arranging unit 6 are placed on the susceptor 11. Further, the base surface 111 as the upper surface of the susceptor 11 is substantially horizontal, and the supply side arranging portion 3, the conveying portion 4, the inspection portion 5, and the recovery side arranging portion 6 are disposed on the base surface 111. Further, the inspection device 1 may have a heater or a chamber for heating the IC element 9 as needed.

The inspection apparatus 1 is configured such that the supply unit 2 supplies the IC element 9 to the supply side array unit 3, the supply side array unit 3 arranges the supplied IC element 9, and the transport unit 4 transports the aligned IC elements 9 to In the inspection unit 5, the inspection unit 5 inspects the transported IC device 9, and the transport unit 4 transports the IC elements 9 that have been inspected to the collection side array unit 6 and arranges them, and the collection unit 7 arranges the IC elements 9 arranged in the collection side array unit 6. Recycling. According to such an inspection apparatus 1, the supply, inspection, and recovery of the IC element 9 can be automatically performed. Further, in the inspection apparatus 1, the configuration other than the inspection unit 5, that is, the supply unit 2, the supply side array unit 3, the transport unit 4, the recovery side array unit 6, the collection unit 7, and the control unit 8 A part (etc.) constitutes a conveying device (electronic component conveying device) 10. The transport device 10 performs transport of the IC component 9 and the like.

Hereinafter, the configuration of the transport unit 4 and the inspection unit 5 will be described.

≪Transportation Department≫

As shown in FIG. 2, the transport unit 4 is a unit that transports the IC element 9 disposed on the mounting platform 341 of the supply-side arranging unit 3 to the inspection unit 5, and ends the inspection in the inspection unit 5. The IC element 9 is transferred to the recovery side array unit 6. The transport unit 4 includes a shuttle 41, a supply robot 42, an inspection robot 43, and a recovery robot 44.

-shuttle-

The shuttle 41 is for transporting the IC component 9 on the mounting platform 341 to the vicinity of the inspection unit 5 In addition, the inspected IC element 9 that has been inspected by the inspection unit 5 is transported to the shuttle in the vicinity of the collection side array unit 6. In the shuttle 41, four pockets 411 for accommodating (disposing) the IC component 9 are formed in the X direction. Further, the shuttle 41 is guided by a linear guide and can be reciprocated in the X direction by a drive source such as a linear motor.

-Supply robots -

The supply robot 42 transports the IC component 9 disposed on the mounting platform 341 to the robot of the shuttle 41. Such a supply robot 42 has a support frame 421 supported by the base 11 and a moving frame 422 supported by the support frame 421 and capable of reciprocating in the Y direction with respect to the support frame 421; and 4 hand units (holding robot) 423, which is supported by the moving frame 422. Each of the hand units 423 includes an elevating mechanism and an adsorption nozzle, and the IC element 9 can be held by suction.

- Check the robot -

The inspection robot 43 transports the IC component 9 housed in the shuttle 41 to the inspection unit 5, and transports the IC component 9 that has finished the inspection from the inspection unit 5 to the shuttle 41. The inspection robot 43 has a support frame 431 supported by the base 11 and a moving frame (pressing member arrangement member mounting member) 432 supported by the support frame 431 and reciprocally movable in the Y direction with respect to the support frame 431 And a socket layout component 45 that is mounted (supported) to the moving frame 432. The jack layout assembly 45 has a plurality of hand units 46 capable of pressing the IC component 9 as pressing members. Further, when the inspection robot 43 is inspected, the IC unit 9 can be pressed against the inspection unit 5 as a socket via each of the hand units 46. Thereby, a specific inspection pressure can be applied to the IC element 9. Further, the configuration of the socket layout component 45 will be described later.

-Recycling robots -

The collection robot 44 is a robot that transports the IC element 9 that has been inspected by the inspection unit 5 to the collection side alignment unit 6 . Such a recycling robot 44 has a support frame 441 supported by the base 11 and a moving frame 442 supported by the support frame 441 and capable of being opposed to The frame 441 is supported and moved back and forth in the Y direction; and four hand units (holding robots) 443 are supported by the moving frame 442. Each of the hand units 443 includes an elevating mechanism and an adsorption nozzle, and the IC element 9 can be held by adsorption.

The transfer unit 4 transports the IC element 9 as follows. First, the shuttle 41 moves to the left in the drawing, and the supply robot 42 transports the IC component 9 on the mounting platform 341 to the shuttle 41 (step 1). Next, the shuttle 41 moves toward the center, and the inspection robot 43 transports the IC component 9 on the shuttle 41 to the inspection unit 5 (step 2). Next, the inspection robot 43 transports the IC element 9 that has been inspected by the inspection unit 5 to the shuttle 41 (step 3). Next, the shuttle 41 moves to the right side in the drawing, and the recovery robot 44 transports the inspected IC element 9 on the shuttle 41 to the recovery side array unit 6 (step 4). By repeating such steps 1 to 4, the IC element 9 can be transported to the recovery side aligning unit 6 via the inspection unit 5.

In the above, the configuration of the transport unit 4 has been described. However, as the configuration of the transport unit 4, the IC element 9 on the mounting platform 341 can be transported to the inspection unit 5, and the IC elements 9 that have finished the inspection are arranged on the recovery side. There is no particular limitation on the movement of the department 6. For example, the shuttle 41 can be omitted, and any one of the supply robot 42, the inspection robot 43, and the collection robot 44 can be transported from the mounting platform 341 to the inspection unit 5 and from the inspection unit 5 to the collection side alignment unit 6. Transfer.

≪Inspection Department≫

The inspection unit 5 is a unit that inspects and tests the electrical characteristics of the IC element 9. As shown in FIG. 2, the inspection unit 5 has eight holding portions 51 on which the IC elements 9 are placed. A plurality of probe pins (electrode terminals) (not shown) electrically connected to terminals (electrode terminals) of the IC element 9 are provided in the holding portions 51, respectively. Each probe pin is electrically connected to the control unit 8. When the IC element 9 is inspected, one IC element 9 is placed (held) in one holding portion 51. Each of the terminals of the IC element 9 disposed in the holding portion 51 is pressed against each of the probe pins with a specific inspection pressure by the pressing of the hand unit 46 of the inspection robot 43. Thereby, each terminal of the IC element 9 is electrically connected (contacted) to each probe pin, and the IC element 9 is inspected via the probe pin. IC component 9 The inspection is performed based on the program stored in the control unit 8.

≪Control Department≫

The control unit 8 includes, for example, an inspection control unit and a drive control unit. The inspection control unit performs inspection of electrical characteristics of the IC component 9 disposed in the inspection unit 5, for example, based on a program stored in a memory (not shown). In addition, the drive control unit controls the driving of the IC unit 9 by controlling the driving of each of the supply unit 2, the supply-side arranging unit 3, the transport unit 4, the inspection unit 5, the collection-side arranging unit 6, and the recovery unit 7.

≪ Socket layout component≫

As described above, the inspection robot 43 has the socket layout assembly 45 attached to the moving frame 432 that can reciprocate in the Y direction. The socket layout unit 45 is for pressing the IC component 9 against the electronic component pressing device of the inspection unit 5.

As shown in FIG. 3, the socket layout unit 45 has the same number of holding portions 51 as the inspection unit 5, that is, has eight hand units 46 and a base (pressing member arranging member) 47 that supports and supports the hand units 46. Thereby, the eight IC elements 9 can be pressed against the inspection unit 5 at a time, and therefore, the inspection efficiency can be improved.

The socket layout unit 45 is configured such that the direction in which the IC element 9 is pressed is set to the Z-axis direction and is viewed from the direction, the longitudinal direction of the susceptor 47 is set to the X direction, and the width direction orthogonal to the longitudinal direction is set. It is attached to the moving frame 432 for use in the Y direction. Here, the method of attaching the socket layout unit 45 to the moving frame 432 is not particularly limited, and examples thereof include a method of fixing by screws. In the case of the method of fixing using screws, the socket layout assembly 45 is mounted to be mounted freely on the moving frame 432. Thereby, the socket layout assembly 45 can be easily replaced.

Further, the socket layout unit 45 is replaced with, for example, the type or size of the IC element 9, and is replaced by a different number or arrangement of the hand units 46 depending on the type of inspection or the like.

In the configuration shown in FIG. 3, the socket layout unit 45 has eight hand units 46 arranged in the same matrix as the holding portion 51 of the inspection unit 5, that is, arranged in two columns in the Y direction, and It is a matrix of 4 rows in the X direction. Moreover, in the arrangement of 2 columns and 4 rows, there is also a socket layout component 45 in which the hand units 46 adjacent in the X direction are spaced apart from each other, that is, the distance between the centers is different.

Further, in addition to the arrangement of two rows and four rows, in the socket layout unit 45, for example, four hand units 46 are arranged in two rows in the X direction and two rows in the Y direction, and six hand units are provided. 46 is arranged in a matrix of 2 columns in the Y direction and 3 rows in the X direction, and 12 hand units 46 are arranged in a matrix of 2 rows in the Y direction and 6 rows in the X direction, 16 The hand unit 46 is arranged in a matrix of two rows in the Y direction and eight rows in the X direction, and the four hand units 46 are arranged in a matrix of one row in the Y direction and four rows in the X direction. The eight hand units 46 are arranged in a matrix of one row in the Y direction and eight rows in the X direction.

As shown in FIG. 3, the base 47 is a member of the socket layout assembly 45 which is attached to the moving frame 432 from the lower side.

The susceptor 47 is formed of a horizontally long plate member along the X direction, and is formed in a rectangular shape in plan view, and is used in common regardless of the arrangement number or arrangement of the hand unit 46. Thereby, the commonality of the parts can be achieved, so that the cost of manufacturing the socket layout component 45 is reduced.

Moreover, the pedestal 47 is preset in the design of the socket layout component 45 regardless of the number or arrangement of the hand units 46, that is, it is determined that the hand unit is allowed to be disposed relative to the pedestal 47 when viewed from the pedestal 47. The largest area of 46 is the first area (pressing member arrangement area) A1 (see Fig. 3). In FIG. 3, hatching is indicated in the first area A1. Further, in the first region A1, the number of arrangement or arrangement of the hand units 46 can be freely selected, and therefore, the degree of freedom in designing the socket layout unit 45 is improved.

One of the defect portions 474 is disposed at equal intervals on the edge portion 473 of one side (the right side in FIG. 3) of the susceptor 47 in the Y direction. This defect portion 474 is used, for example, as a part of a wiring path of a cable connected to each hand unit 46.

The maximum length (full length) Lmax of the susceptor 47 is preferably 100 mm or more and 400 mm or less, more preferably 200 mm or more and 300 mm or less. The maximum width Wmax of the susceptor 47 is preferably It is 50 mm or more and 200 mm or less, more preferably 100 mm or more and 200 mm or less. The maximum thickness Tmax of the susceptor 47 is preferably 4 mm or more and 10 mm or less, more preferably 6 mm or more and 8 mm or less.

The constituent material of the susceptor 47 is not particularly limited, and for example, various metal materials such as aluminum or aluminum alloy can be used.

As shown in FIGS. 4 and 5, the hand unit 46 has a connection structure (connection portion) 20 that connects the hand unit 46 to the base 47, and a heat transfer structure (heat transfer portion) 30 that is connected to the structure. The lower side of the 20 is supported by the connecting structure 20 and the heat radiating structure (heat radiating portion) 40 is movable between the connecting structure 20 and the heat conducting structure 30 in the vertical direction. Further, in FIGS. 4 and 5, one hand unit 46 is typically depicted.

The connection structure 20 has a first fluid device 201, a second fluid device 202 located below the first fluid device 201, and an intermediate member 203 between the first fluid device 201 and the second fluid device 202. .

The first fluid machine 201 is a device that is pressed against and separated from the inspection unit 5 of the IC element 9. The first fluid machine 201 has a cylinder portion 201a, a piston portion 201b, and a diaphragm 201c.

The cylinder portion 201a has a hollow portion 201d that houses the diaphragm 201c, and a flow path 201e that communicates with the hollow portion 201d and through which the operating fluid 209a that deforms the diaphragm 201c passes.

The piston portion 201b protrudes downward from the hollow portion 201d of the cylinder portion 201a, and is coupled to the cylinder portion 201a via the diaphragm 201c.

When the operating fluid 209a from the pump (not shown) flows into the hollow portion 201d via the flow path 201e, the pressure in the hollow portion 201d rises and the diaphragm 201c is deformed. Thereby, the piston portion 201b can be pressed downward together with the member located below the piston portion 201b, that is, the intermediate member 203, the second fluid device 202, the heat dissipation structure 40, the heat transfer structure 30, and the like. The IC element 9 held by the heat transfer structure 30 can be pressed against the inspection portion 5. In addition, in FIGS. 4 and 5, the piston portion 201b is pressed downward.

When the operating fluid 209a flows out from the hollow portion 201d via the flow path 201e and is discharged, the pressure in the hollow portion 201d is reduced, and the diaphragm 201c is deformed in the opposite direction. Thereby, the piston portion 201b can be lifted upward together with the member located below the piston portion 201b, so that the IC component 9 held by the heat transfer structure 30 can be separated from the inspection portion 5.

The second fluid machine 202 functions as a device that causes the heat dissipation structure 40 to abut against the abutment drive unit of the heat transfer structure 30 . The abutting drive unit is configured by a fluid machine. For example, compared with a case where the abutting drive unit is constituted by an electric device such as a motor, power consumption can be suppressed, and piping, wiring, and the like can be simplified. In addition, it contributes to the miniaturization of the drive unit, that is, the space saving, and as a result, the hand unit 46 itself becomes a small person.

As shown in FIGS. 4 and 5 , the second fluid device 202 includes (including) a cylinder portion 204 , a piston portion 205 , and a gasket portion 206 .

The cylinder portion 204 has a flat shape and has a hollow portion 204a for sliding the piston portion 205, and a flow path 204b communicating with the hollow portion 204a and allowing the movable fluid 209b for sliding the piston portion 205 to pass therethrough. As a result, since the second fluid machine 202 is thin, it contributes to downsizing of the hand unit 46.

The hollow portion 204a is open to the lower surface of the cylinder portion 204. Thereby, the piston portion 205 can protrude downward. By this protrusion, as shown in FIG. 5, the heat dissipation structure 40 can be pressed and abutted against the heat transfer structure 30.

The flow path 204b is open to the upper surface of the cylinder portion 204, and communicates with the relay flow path 203a of the intermediate member 203. Further, a sealing member (pad) 204c that maintains airtightness with the relay flow path 203a is provided in the flow path 204b.

As shown in Fig. 7, the piston portion 205 is constituted by a member having a disk shape. A reduced diameter portion 205a whose outer diameter is reduced in diameter is formed on the outer peripheral portion of the piston portion 205. Further, a ring-shaped spacer portion 206 is fitted to the reduced diameter portion 205a (see FIGS. 4 and 5). Thereby, the piston portion 205 can slide together with the spacer portion 206, and the hollow portion 204a can be maintained regardless of the sliding and stopping. Air tightness.

Two projecting portions 205b that protrude upward and are disposed apart from each other in the radial direction of the piston portion 205 are formed at a central portion of the upper surface of the piston portion 205. The flow path 204b is opened between the two protruding portions 205b. As a result, as shown in FIG. 7, the operating fluid 209b flowing in through the flow path 204b can sequentially pass from the two protruding portions 205b to the outer peripheral side of each protruding portion 205b. By the flow of the actuating fluid 209b, the upper surface of the piston portion 205 can be appropriately pressed as evenly as possible, so that the piston portion 205 can be slid downward and easily protrude.

Further, the relay flow path 203a of the intermediate member 203 is connected to the frame side communication hole of the moving frame 432 (the mounting member side via the communication hole 477 (see FIG. 3) of the base 47 on the side opposite to the flow path 204b of the cylinder portion 204. The hole 433 (see FIG. 3) is connected to the pump 207. Thereby, the operating fluid 209b can be supplied to the piston portion 205 side.

As shown in FIGS. 4 and 5, a solenoid valve 208 is provided between the pump 207 and the communication hole 477 of the base 47. Thereby, the supply of the switchable actuating fluid 209b and the supply of the actuating fluid 209b are stopped. Further, when the supply of the operating fluid 209b is stopped, the hollow portion 204a of the cylinder portion 204 is opened to the atmosphere via the electromagnetic valve 208. Thereby, the heat dissipation structure 40 is released from the pressing force of the piston portion 205, and the heat dissipation structure 40 is separated from the heat conduction structure 30 by the pressing force of the compression coil spring 305 described below.

As described above, the base 47 is provided with a communication hole 477. In the present embodiment, as shown in FIG. 3, eight communication holes 477 are provided. Further, the communication holes 477 are respectively disposed at four corners of the susceptor 47, that is, in the vicinity of the four corner portions 478. This arrangement region is a second region (a communication hole arrangement region) A2 different from the first region A1 in a plan view of the susceptor 47. In this manner, the susceptor 47 is divided into the first area A1 and the second area A2. In the first region A1, a structure such as a heater, a vacuum chuck, or a variable mechanism is present in the hand unit 46 itself or in the vicinity thereof, so that it is difficult to form the communication hole 477. However, by setting the second region A2, it is possible to easily ensure the formation of the communication hole 477.

Further, by arranging the communication holes 477 in the vicinity of the corner portion 478 of the susceptor 47, The base 47 is located as far as possible in the second region A2 of the end, and the operation of preventing the re-pipering becomes complicated when the hand unit 46 is attached to and detached from the base 47.

In each of the second regions A2, the two communication holes 477 are arranged along the longitudinal direction of the susceptor 47, that is, in the X direction. Thereby, the first area A1 can be secured as wide as possible, and therefore, the degree of freedom in designing the socket layout unit 45 by selecting the number or arrangement of the hand units 46 is further improved.

With the above arrangement, the communication holes 477 in the susceptor 47 are arranged in four in the X direction and two in the Y direction. Further, the distance L ₁ between the centers of the nearest communication holes 477 located in the X direction is preferably 240 mm ± 20 mm, more preferably 240 mm ± 5 mm (refer to Fig. 3). The distance L ₂ between the centers of the most distant communication holes 477 located in the X direction is preferably 260 mm ± 20 mm, more preferably 260 mm ± 5 mm (refer to Fig. 3). The distance W ₁ between the centers of the communication holes 477 located in the Y direction is preferably 93.5 mm ± 20 mm, more preferably 93.5 mm ± 5 mm. With such a numerical range, the pedestal 47 is more versatile regardless of the number of configurations or the configuration of the hand unit 46.

Further, the base 47 is provided with a sealing member (pad) 49 capable of maintaining the airtightness of the communication hole 477 and the frame-side communication hole 433 in a state where the socket layout unit 45 is attached to the moving frame 432. Each of the sealing members 49 is formed in a ring shape in a plan view of the susceptor 47, and is disposed concentrically with the corresponding communication hole 477 so as to surround the corresponding communication hole 477. Thereby, leakage of the refrigerant from the socket layout assembly 45 and the moving frame 432 can be prevented.

The constituent material of the sealing member 49 is not particularly limited, and for example, various rubber materials such as an anthrone rubber can be used.

As shown in FIGS. 4 and 5 , the heat transfer structure 30 is connected to the lower side of the connection structure 20 via the following guide member (support portion) 50 . The heat conductive structure 30 can hold the IC component 9 and can conduct heat to the IC component 9 in the held state.

As shown in FIGS. 4 to 6, the heat transfer structure 30 has a heat transfer block (heat transfer member) 301, an abutment member 302 that can abut against the IC component 9, and a support member 303 that makes the abutment member 302 is supported by the thermal block 301.

The heat transfer block 301 is made of, for example, a metal material such as aluminum, and has a heater 304 built therein. When the heater 304 generates heat, its heat can be transmitted to the IC element 9 abutting against the abutting member 302 via the support member 303. Thereby, the IC component 9 can be heated to a specific temperature suitable for inspection.

Further, as the heater 304, for example, a rod-shaped ceramic heater can be used.

Further, between the heat transfer block 301 and the heat dissipation structure 40, a compression coil spring 305 which is a plurality of elastic members is provided in a compressed state. The compression coil springs 305 are preferably disposed at equal intervals around the center portion of the heat transfer block 301 when viewed from the direction in which the IC element 9 is pressed.

On the upper surface of the heat conducting block 301, a spring seat 301a for inserting and supporting the lower end portion of each compression coil spring 305 is recessed. On the other hand, on the lower surface of the heat transfer member 16 of the heat dissipation structure 40, a spring seat 161 into which the upper end portion of the compression coil spring 305 is inserted and supported is recessed at a position opposed to each of the spring seats 301a. By providing such spring seats 301a and 161, the compression coil spring 305 can be stably expanded and contracted. When the compression coil spring 305 is extended, the heat dissipation structure 40 can be separated from the heat conduction structure 30 by the pressing force at this time. In this manner, the compression coil spring 305 functions to separate the heat dissipation structure 40 from the heat transfer structure 30 and away from the drive unit.

The support member 303 has an inner cylindrical portion 303a and an outer cylindrical portion 303b that protrude downward and are concentrically arranged.

An adsorption member 306 capable of adsorbing the IC element 9 is attached to the inner tubular portion 303a by fitting. The adsorption member 306 is composed of a cylindrical body having elasticity and is a bellows-like member.

Further, the support member 303 is provided with a suction flow path 303c that sucks the adsorption member 306, and the heat transfer block 301 is provided with a relay flow path 301b that communicates with the suction flow path 303c. Further, the relay flow path 301b is connected to the injector 307. The absorbing member 306 is actuated by the ejector 307 The inside is attracted to be in a vacuum state, and therefore, the IC element 9 can be adsorbed and held. Further, when vacuum destruction is performed by the ejector 307, the adsorption with respect to the IC element 9 is released. Further, a sealing member (pad) 303d that maintains airtightness with the relay flow path 301b is provided in the suction flow path 303c.

As shown in FIG. 6, the contact member 302 has a first abutting member 13 that abuts against the upper surface 921 of the semiconductor portion 92 of the IC element 9, and a second abutting member 14 that abuts against the IC element. The upper surface 911 of the circuit portion 91 of 9.

The first abutting member 13 is formed of a plastically deformable metal foil and abuts against the lower end of the cylindrical portion 303b outside the supporting member 303. Thereby, the first abutting member 13 can face the upper surface 921 of the semiconductor portion 92 of the IC component 9 and can abut against the upper surface 921.

Further, as shown in FIG. 11(a), the first contact member 13 is formed with minute irregularities, that is, a waveform. On the other hand, on the upper surface 921 of the semiconductor portion 92, minute irregularities which are inevitably generated in manufacturing are also formed. The uneven shape is of course different from the uneven shape of the first abutting member 13.

Further, as shown in FIG. 11(b), the state of the first contact member 13 and the IC element 9 (hereinafter referred to as the "IC element 9A") is shown in FIG. When the upper surface 921 of the portion 92 abuts, the first abutting member 13 can be easily plastically deformed so as to conform to the uneven shape of the upper surface 921 by its own unevenness, and therefore the contact area with the upper surface 921 is increased. Then, as shown in FIG. 11(c), the first abutting member 13 is separated from the IC element 9A. At this time, the first abutting member 13 is separated in a state in which the plastic deformation of the uneven surface of the upper surface 921 of the IC element 9A is maintained. Then, as the IC element 9A progresses, as shown in FIG. 11(d), the first abutting member 13 becomes an IC element 9 different from the above (hereinafter, the IC element 9 is referred to as an "IC element". 9B") The state of the arrival. As shown in FIG. 11(e), when the first contact member 13 is brought into contact with the upper surface 921 of the semiconductor portion 92 of the IC element 9B, the first contact member 13 can be patterned by its own unevenness. The manner of the uneven shape of the upper surface 921 of the IC element 9B is easily plastically deformed, and therefore, contact with the upper surface 921 The area is increased.

In this manner, the first abutting member 13 can sufficiently contact the upper surface 921 regardless of the uneven shape of the upper surface 921 of the semiconductor portion 92 of the IC element 9. Thereby, heat exchange between the first contact member 13 and the IC element 9 is appropriately performed, and therefore temperature control (temperature adjustment) such as heating of the IC element 9 can be performed more accurately. Further, heat exchange is rapidly performed, and therefore, higher responsiveness of temperature control can be achieved.

The metal material constituting the first abutting member 13 is not particularly limited, and for example, a material containing indium is preferably used. Thereby, the first abutting member 13 is easily plastically deformed. In addition, it is a durability that can prevent the first abutting member 13 from being damaged by repeated plastic deformation.

As described above, the first contact member 13 is formed with minute irregularities in advance. The method for forming the unevenness is not particularly limited, and for example, a method of wrinkle processing is used.

The thickness of the first abutting member 13 is, for example, preferably 0.1 mm or more and 0.5 mm or less, more preferably 0.1 mm or more and 0.2 mm or less. Further, when the thickness of the first abutting member 13 is 0.2 mm, the difference between the unevenness of the first abutting member 13, that is, the difference from the uppermost point of the convex portion to the lowest point of the concave portion is preferably set to, for example, 0.3 mm. about.

Further, as shown in FIG. 6, the first abutting member 13 is attached to the outer tubular portion 303b by bending and plastically deforming the edge portion 131 toward the outer peripheral side of the outer tubular portion 303b.

As shown in FIG. 10, a through hole 132 is formed in a central portion of the first abutting member 13. The adsorption member 306 can protrude further toward the IC element 9 in the direction in which the IC element 9 is pressed, that is, below the first abutting member 13 (see FIGS. 4 and 5). By this, first, the IC element 9 is sucked and sucked toward the hand unit 46 side, and then the IC element 9 and the first contact member 13 can be stably brought into contact with each other.

As shown in FIGS. 6 and 10 , the first abutting member 13 is entirely surrounded by the tubular second abutting member 14 , that is, disposed inside the second abutting member 14 . Thereby, the edge portion 131 of the first abutting member 13 is sandwiched between the outer peripheral portion of the outer tubular portion 303b of the support member 303 and the second abutting member. Within 14 weeks between the weeks. Therefore, the first abutting member 13 is prevented from coming off. Further, the first abutting member 13 made of a metal foil can be protected by the second abutting member 14.

As described above, the second abutting member 14 abuts against the member of the upper surface 911 of the circuit portion 91 of the IC component 9. The second abutting member 14 has a tubular shape and has a flange portion 141 whose outer diameter is increased in diameter at the proximal end portion thereof. The flange portion 141 is supported and fixed with respect to the support member 303 by a method such as screwing.

As shown in FIG. 6 , the second abutting member 14 has a protruding portion 142 that protrudes more than the first abutting member 13 in the direction in which the IC element 9 is pressed. The IC element 9 has a portion of the thickness of the individual body of the circuit portion 91 and a total thickness of the two portions of the circuit portion 91 and the semiconductor portion 92. Therefore, the first abutting member 13 and the second abutting member 14 cannot abut on the same plane with respect to the IC element 9, and therefore the protruding portion 142 that protrudes more than the first abutting member 13 bears the contact with the circuit portion 91. .

The amount of protrusion h of the protruding portion 142 can be adjusted by using a shim piece (SIM) 302a formed of a plate member, that is, can be adjusted by a so-called "shielding sheet adjustment". Thereby, since the amount of protrusion h can be adjusted according to the thickness of the semiconductor portion 92, the protruding portion 142 can abut against the circuit portion 91 regardless of the thickness of the semiconductor portion 92.

Further, the shimming adjustment is to prepare a plurality of shims 302a having different thicknesses, and the desired amount of protrusion h can be appropriately selected from these. Further, the selected shims 302a are interposed between the flange portion 141 of the second abutting member 14 and the flange portion 303e of the outer diameter of the support member 303. In the configuration shown in Fig. 6, as an example, two shims 302a having different thicknesses are interposed.

Further, the second abutting member 14 has a length in the Z direction, that is, a thickness thicker than the thickness of the first abutting member 13. Thereby, for example, when the inspection of the IC element 9 is performed by the inspection unit 5, the circuit portion 91 of the IC element 9 can be sufficiently pressed against the inspection portion 5, and the circuit portion 91 and the inspection portion 5 can be electrically connected. Therefore, an accurate inspection can be performed.

Further, since the second abutting member 14 is in contact with the circuit portion 91, the second abutting is preferable. The member 14 is composed of an insulating material, that is, a resin material. The resin material is not particularly limited, and for example, polyamidoximine or polyether ether ketone can be used. By using such a material as a constituent material, a short circuit between the second abutting member 14 and the circuit portion 91 can be prevented.

As described above, in the inspection of the IC element 9, the IC element 9 is heated by the heater 304. In this case, the IC component 9 must be adjusted to a temperature suitable for inspection. As shown in FIGS. 4 and 5, the temperature adjustment unit 308 for temperature adjustment is provided in the heat transfer structure 30.

The temperature adjustment unit 308 includes a thermocouple 308a as a first temperature detecting unit and a platinum sensor (Pt sensor) 308b as a second temperature detecting unit. As shown in FIG. 12, the thermocouple 308a and the platinum sensor 308b are electrically connected to the control unit 8, respectively.

As shown in FIG. 6, the thermocouple 308a is embedded in the outer tubular portion 303b of the support member 303, and is disposed close to the first abutting member 13 side. This arrangement position becomes a position closer to the IC element 9 than the arrangement position of the platinum sensor 308b. Thereby, the thermocouple 308a can be positioned as close as possible to the IC element 9, and the temperature of the cylindrical portion 303b which is similar to the temperature of the IC element 9 can be detected. Therefore, temperature control of the IC element 9 can be performed more accurately, and higher responsiveness of temperature control can be achieved.

Further, the thermocouple 308a is formed by joining two different kinds of metals different from the metal material constituting the support member 303 or the first abutting member 13, and the temperature difference between the two contacts of the different metals is used. A temperature sensor that produces a phenomenon of thermoelectromotive force (Seebeck effect). Since the thermocouple 308a having such a configuration is extremely smaller than the platinum sensor 308b, it can be easily disposed at a desired portion regardless of the arrangement position.

On the other hand, the platinum sensor 308b is embedded in the heat conducting block 301. The platinum sensor 308b is generally less deteriorated over time than the thermocouple 308a, and therefore, temperature detection can be performed stably for a long period of time.

As the arrangement position of the platinum sensor 308b, as shown in FIG. 9, it is preferable that the position of the center 93 of the IC element 9 is located at the position of the thermocouple 308a and the platinum feeling in a plan view from the pressing direction of the IC element 9. The mode setting between the positions of the detector 308b. Thereby, the IC element can be secured The temperature detection range of piece 9 is as wide as possible.

Further, the control unit 8 can determine whether or not the detected value detected by the thermocouple 308a can be used based on the detected value detected by the platinum sensor 308b (see FIG. 12). As described above, the platinum sensor 308b is generally less deteriorated over time than the thermocouple 308a, and therefore, temperature detection can be stably performed for a long period of time. Therefore, when the inspection apparatus 1 is continuously used for a long period of time, and the temperature of the IC element 9 at this time is, for example, 50 degrees, there is a case where the platinum sensor 308b detects 52 degrees and the thermocouple 308a detects 25 degrees. . Such a detected value deviates, and in the case where the deviation exceeds a threshold (e.g., 5 degrees), it can be considered that the thermocouple 308a is degraded, prompting the rapid replacement of the thermocouple 308a. Thereby, the detection temperature can be ensured, and the inspection accuracy of the IC component 9 can be prevented from being lowered. Further, the inspection for preventing the decrease in the accuracy of such inspection may be performed periodically (for example, once every six months).

As another use of the platinum sensor 308b, the control unit 8 can correct the detected value detected by the thermocouple 308a based on the detected value detected by the thermocouple 308a and the detected value detected by the platinum sensor 308b (refer to Figure 12). For example, as described above, when the detected value in the thermocouple 308a deviates from the detected value in the platinum sensor 308b, the correction such as offsetting the deviation can be performed with respect to the detected value in the thermocouple 308a. Thereby, it is also possible to prevent the inspection accuracy of the IC component 9 from being lowered.

Further, in the present embodiment, the temperature adjustment unit 308 includes the thermocouple 308a and the platinum sensor 308b. However, the present invention is not limited thereto, and the platinum sensor 308b may be omitted.

Further, after heating of the IC element 9, it is necessary to cool the IC element 9. Therefore, a heat dissipation structure 40 that promotes heat dissipation to the heat transfer structure 30 is disposed between the heat transfer structure 30 and the connection structure 20 .

As shown in FIGS. 4 and 5 , the heat dissipation structure 40 includes a heat sink 15 as a heat dissipation member and a heat transfer member 16 disposed to be in contact with the heat sink 15 . The heat dissipation structure 40 can be moved up and down between a first position (see FIG. 4 ) in a state in which the heat-conducting structure 30 is separated from a second position (see FIG. 5 ) that is in contact with the heat-conducting structure 30 .

Further, in the hand unit 46, the second fluid device 202 is responsible for the lowering of the heat dissipation structure 40 from the first position to the second position. On the other hand, the compression coil spring 305 is responsible for the rise of the heat dissipation structure 40 from the second position to the first position.

Further, since the heat dissipation structure 40 is separated from the heat transfer structure 30 at the first position, the heat transfer from the heat transfer structure 30 during the operation of the heater 304 is blocked (or suppressed). Thereby, the temperature difference between the heat dissipation structure 40 and the heat transfer structure 30 becomes larger than the temperature difference in the case where the heat dissipation structure 40 and the heat transfer structure 30 are in contact with each other, for example.

When the heat dissipation structure 40 is moved from the first position to the second position, the heat dissipation structure 40 is in contact with the heat transfer structure 30. Thereby, the heat of the heat transfer structure 30 is quickly taken by the heat dissipation structure 40, and heat dissipation to the heat transfer structure 30 is promoted. As a result, the IC element 9 is cooled.

Further, when the IC element 9 is heated, when the heat dissipation structure 40 is moved to the first position again, the IC element 9 can be quickly heated.

In this way, the heat dissipation structure 40 can abut or separate from the heat conduction structure 30, whereby the temperature control of the IC element 9 can be performed more accurately. Further, before the heat dissipation structure 40 is moved to the second position, the temperature difference between the heat dissipation structure 40 and the heat transfer structure 30 can be sufficiently ensured in advance at the first position, so that the heat transfer structure 30 can be quickly performed at the second position. Endothermic. Thereby, higher responsiveness of temperature control can be achieved.

Further, the determination of whether the heat dissipation structure 40 is located at the first position or the second position is based on the detection results of the thermocouple 308a and the platinum sensor 308b, and is controlled by the control unit 8 to control the actuation of the electromagnetic valve 208 ( Refer to Figure 12).

Moreover, the stroke S when the heat dissipation structure 40 abuts or separates from the heat transfer structure 30, that is, the movement distance of the heat dissipation structure 40 between the first position and the second position is preferably greater than 0 mm and less than 5 mm. Preferably, it is 0.2 mm or more and 1 mm or less. Thereby, the movement time of the heat dissipation structure 40 can be made as short as possible, so that rapid heat exchange between the heat dissipation structure 40 and the heat transfer structure 30 can be performed.

The heat sink 15 included in the heat dissipation structure 40 has a base portion 151 and a plurality of fins 152 integrally formed upward from the base portion 151. Further, a plurality of fins 152 are disposed at intervals. The heat sink 15 is made of, for example, a metal material such as aluminum or stainless steel. Thereby, heat dissipation to the heat transfer structure 30 is easily performed via the heat sink 15 in a state where the heat dissipation structure 40 is at the second position.

In the hand unit 46, the heat radiating structure 40 is in the state of at least the first position and the second position, and the refrigerant is blown from the plurality of discharge ports 481 of the cooling structure 48 to the radiator 15 (refer to the figure). 4). Thereby, the refrigerant can pass through the fins 152 to further promote heat dissipation in the heat sink 15. Therefore, the temperature difference between the heat dissipation structure 40 and the heat transfer structure 30 can be sufficiently ensured, and heat absorption to the heat transfer structure 30 can be performed more quickly at the second position.

In addition, it is preferable that the cooling structure 48 is disposed such that the refrigerant is ejected from the central portion in the width direction of the susceptor 47, that is, from the inside to the outside (in the configuration shown in FIG. 4, from the inside to the front of the paper). Thereby, it is possible to prevent the refrigerant that is cooled by the IC element 9 held by one of the hand units 46 from being blown by the IC element 9 held by the other hand unit 46.

In addition, the cooling structure 48 of the eight hand units 46 is connected to the refrigerant communication hole 479 formed in one of the second regions A2 of the susceptor 47 via a branch (not shown). Figure 3) Connection. Further, in a state in which the socket layout unit 45 is attached to the moving frame 432, the refrigerant communication hole 479 communicates with the refrigerant frame side communication hole 434 formed in the moving frame 432. The refrigerant frame side communication hole 434 is connected to a refrigerant supply source (not shown) that supplies a refrigerant on the upstream side. Thereby, the cooling structure 48 can receive the supply of the refrigerant from the refrigerant supply source, and discharge the refrigerant.

As shown in FIG. 3, in the susceptor 47, in a mounted state in which the socket layout unit 45 is attached to the moving frame 432, a sealing member 49 for maintaining the airtightness of the communication hole 479 for the refrigerant and the frame side communication hole 434 for the refrigerant is provided. . The sealing member 49 is substantially the same as the other sealing member 49, and is disposed to surround the refrigerant communication hole 479.

The refrigerant to be ejected as the cooling structure 48 is not particularly limited, and for example, a fluid such as compressed air can be used. When compressed air is used as the refrigerant, it is possible to prevent contamination of surrounding equipment and the like by the discharged refrigerant.

Further, the cooling structure 48 is configured to discharge the refrigerant, but is not limited thereto. For example, the cooling structure may be configured by a cooling fan.

As described above, the second fluid device 202 is responsible for the lowering of the heat dissipation structure 40 from the first position to the second position. The lower surface of the piston portion 205 of the second fluid machine 202 collides with at least one fin 152 of the heat sink 15 when the heat radiating structure 40 is pressed. Therefore, it is preferable that the piston portion 205 is larger than the heat sink 15 in terms of elastic deformation rate or plastic deformation rate. Thereby, the collision sound generated at the time of collision or the abrasion of the piston portion 205 can be prevented or suppressed.

When the heat sink 15 is formed of various metal materials, for example, the piston portion 205 is preferably made of various rubber materials such as urethane rubber. Further, in the case where the heat sink 15 is made of stainless steel which is one of metal materials, it is preferable that the piston portion 205 is made of aluminum.

On the lower surface of the base portion 151 of the heat sink 15, the heat conductive member 16 is fixed by, for example, screwing. The heat conductive member 16 is composed of a plate member or a block member which is thicker than the base portion 151. Moreover, the heat capacity of the heat conducting member 16 is greater than the heat capacity of the heat sink 15. Thereby, in the state in which the heat dissipation structure 40 is located at the second position, the heat of the heat transfer structure 30 can be quickly transmitted to the heat sink 15 via the heat transfer member 16, and the heat radiation effect can be improved. Further, as a constituent material of the heat transfer member 16, for example, the same constituent material as that of the heat sink 15 can be used.

As described above, the heat dissipation structure 40 abuts on the heat transfer structure 30 at the second position, and transfers heat from the heat transfer structure 30, that is, exchanges heat with the heat transfer structure 30. In this case, it is preferred to further promote heat exchange. Therefore, as shown in FIGS. 4 to 6, the heat exchange promoting member (heat transfer member) 17 for further promoting heat exchange is disposed on the heat transfer block 301 of the heat transfer structure 30.

As shown in FIG. 6, the heat exchange promoting member 17 has the first heat conductive grease as a fluid. The heat transfer member 171 and the second heat transfer member 172 which is a solid indium.

The first heat transfer member 171 is formed in a layered manner on the upper surface of the heat transfer block 301. In addition, the second heat transfer member 172 has a plate shape and is disposed in contact with the first heat transfer member 171 on the heat dissipation structure 40 side. Thereby, the thickness of the entire heat exchange promoting member 17 can be suppressed, and therefore the heat transfer from the heat transfer structure 30 to the heat dissipation structure 40 is rapidly performed.

In addition, the thickness of the first heat transfer member 171 is the same as or thinner than the thickness of the second heat transfer member 172. For example, the thickness of the second heat transfer member 172 is preferably 0.2 times or more and 1 time or less, more preferably 0.5. More than double and 0.9 times or less.

By providing the heat exchange promoting member 17 as described above, the heat exchange time between the heat radiating structure 40 and the heat conducting structure 30 can be shortened as compared with the case where the heat exchange promoting member 17 is omitted. Thereby, higher responsiveness to the temperature control of the IC element 9 can be achieved.

Further, since the second heat transfer member 172 is made of indium, it is easy to be plastically deformed. Therefore, for example, even when the heat dissipation structure 16 is formed on the lower surface of the heat dissipation structure 16 with minute irregularities, when the heat dissipation structure moves to the second position, the second heat conduction member 172 can be easily plastically deformed in accordance with the uneven shape. Therefore, the contact area with the heat conductive member 16 is increased. This increase in the contact area contributes to an improvement in thermal conductivity from the heat transfer structure 30 to the heat dissipation structure 40.

As shown in FIG. 6, the area (area in plan view) of the first heat transfer member 171 is smaller than the area of the second heat transfer member 172 (area in plan view). When the heat dissipation structure 40 is moved to the second position, the first heat transfer member 171 can be prevented from being exposed from the second heat transfer member 172 even if the second heat transfer member 172 crushes the first heat transfer member 171. Therefore, it is possible to prevent the first heat transfer member 171 from adhering to other members such as the compression coil spring 305.

In addition, the area of the first heat transfer member 171 is preferably 0.5 times or more and 0.95 times or less, more preferably 0.8 times or more and 0.9 times or less the area of the second heat transfer member 172.

Further, in the heat exchange promoting member 17, the second heat transfer member 172 may be omitted. In this case, it is preferable that the first heat conductive member as the heat conductive grease is surrounded by the frame-shaped member. 171.

As shown in FIGS. 4 and 5 , the connection structure 20 and the heat transfer structure 30 are coupled to each other via the guide member 50 . Further, the heat transfer member 16 of the heat dissipation structure 40 is formed with a through hole 162 through which the guide member 50 penetrates. Thereby, the heat dissipation structure 40 is slidably supported and guided between the first position and the second position via the guide member 50.

Further, the direction in which the heat dissipation structure 40 abuts on the heat transfer structure 30 by the guidance of the guide member 50 is a direction in which the heat transfer structure 30 abuts against the IC element 9.

On the other hand, the direction in which the heat dissipation structure 40 is separated from the heat transfer structure 30 by the guidance of the guide member 50 is opposite to the direction in which the heat transfer structure 30 abuts on the IC element 9.

Further, the guide member 50 is provided such that the upper end portion thereof is fixed to the cylinder portion 204 of the second fluid device 202 of the connection structure 20, and the lower end portion is fixed to the heat transfer block 301 of the heat transfer structure 30. Thereby, the heat dissipation structure 40 can be stably slid.

As shown in FIG. 8, in the plan view from the direction in which the IC element 9 is pressed, the guide members 50 are disposed at equal intervals around the heat sink 15 so as to surround the heat sink 15 at equal intervals. With this configuration, the sliding of the heat dissipation structure 40 is smoothly performed.

Further, the four guiding members 50 are disposed on the circumference around the heat sink 15 in the configuration shown in FIG. 8, but are not limited thereto. For example, the arrangement of the four guiding members 50 may be a rectangle having the apex of each of the guiding members 50. In other words, when a straight line centering on the heat sink 15 is assumed in a plan view, the four guide members 50 may be arranged in line symmetry with respect to the straight line.

Further, the number of the guide members 50 is four in the configuration shown in Fig. 8. However, the number of the guide members 50 is not limited thereto. For example, two, three or five or more may be used.

The cross-sectional shape of the guiding member 50 is preferably circular (see FIG. 8), but is not limited thereto, and may be, for example, an elliptical shape or a polygonal shape.

In addition, since the heat dissipation structure 40 is fixed to the guiding member 50 of the heat conductive structure 30 Since it slides up, it is preferable to prevent the heat from the heat-conducting structure 30 from being transmitted via the guide member 50. In the hand unit 46, the guiding member 50 is constituted by a heat insulating member, and is smaller in heat capacity than the heat conducting block 301 of the heat conductive structure 30. The material is not particularly limited. For example, a resin material can be used. Particularly, among the resin materials, polyamidolimine or polyether ether ketone is preferably used.

By such a heat insulating guide member 50, heat from the heat transfer structure 30 can be prevented from being transmitted to the heat dissipation structure 40 via the guide member 50. Thereby, temperature control of the IC element 9 can be performed more accurately, and higher responsiveness of temperature control can also be achieved.

Any of the melamine or polyether ether ketone constituting the guiding member 50 is excellent in slidability or abrasion resistance. Thereby, even if the heat dissipation structure 40 slides over the guide member 50, deterioration of the guide member 50 by friction can be prevented, and durability is excellent.

Further, the guide member 50 is preferably made of a resin material, but is not limited thereto. For example, it may be made of ceramic. Further, the guide member 50 may be formed of a metal material. In this case, it is preferable that the guide member 50 is a hollow body.

<Second embodiment>

Fig. 13 is a vertical longitudinal sectional view showing a heat sink of one hand unit and its surroundings in the electronic component inspection device (second embodiment) of the present invention.

In the following, the second embodiment of the electronic component conveying apparatus, the electronic component inspection apparatus, and the electronic component pressing apparatus of the present invention will be described with reference to the drawings, and the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the configuration of the heat sink is different.

As shown in FIG. 13, in the present embodiment, a cushioning member 18 is interposed between the piston portion 205 of the second fluid device 202 and the heat sink 15 of the heat dissipation structure 40.

The cushioning member 18 is composed of a plate member having a larger elastic deformation rate or a plastic deformation ratio than the piston portion 205 and the heat sink 15. Moreover, the buffer members 18 are fixed together with the heat dissipation of the heat sink 15 The upper end of the sheet 152. Thereby, the collision sound generated when the piston portion 205 collides with the cushioning member 18 or the abrasion of the piston portion 205 can be prevented or suppressed.

When the cushion member 18 and the heat sink 15 are formed of various metal materials, for example, the cushion member 18 is preferably made of various rubber materials such as urethane rubber. Further, when the cushion member 18 and the heat sink 15 are made of stainless steel which is one of metal materials, it is preferable that the cushion member 18 is made of aluminum.

<Third embodiment>

Fig. 14 is a vertical longitudinal sectional view showing a driving unit of one hand unit in the electronic component inspection device (third embodiment) of the present invention.

In the following, the third embodiment of the electronic component conveying apparatus, the electronic component inspection apparatus, and the electronic component pressing apparatus of the present invention will be described with reference to the drawings, and the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted.

This embodiment is the same as the above-described first embodiment except that the structure of the compression coil spring that separates the heat dissipation structure from the heat transfer structure is removed.

As shown in Fig. 14, in the present embodiment, the heat insulating member 60 and the convex member 70 are provided between the spring seat 161 of the heat transfer member 16 and the compression coil spring 305.

The heat insulating member 60 is a plate-shaped member and can be configured, for example, from the same constituent material as the guiding member 50. Thereby, heat from the heat transfer structure 30 can be prevented from being transmitted to the heat dissipation structure 40 via the compression coil spring 305.

Further, the convex member 70 has a convex portion 701 that protrudes convexly toward the compression coil spring 305 side. The upper end portion of the compression coil spring 305 is fitted to the convex portion 701. Thereby, the compression coil spring 305 can be stably expanded and contracted in the spring seat 161, and therefore, the heat dissipation structure 40 can be quickly separated from the heat transfer structure 30.

Further, in the hand unit 46, one of the heat insulating member 60 and the convex member 70 may be omitted. For example, in the case where the heat insulating member 60 is omitted, it is preferable that the convex member 70 has Thermal insulation. Thereby, the convex member 70 can prevent heat from the heat transfer structure 30 from being transmitted to the heat dissipation structure 40 via the compression coil spring 305. Further, the heat insulating member 60 is omitted, and the configuration of the hand unit 46 can be made simple.

In the above, the embodiments of the electronic component conveying device, the electronic component inspection device, and the electronic component pressing device of the present invention have been described. However, the present invention is not limited thereto, and constitutes an electronic component conveying device, an electronic component inspection device, and an electronic device. Each part of the component pressing device can be replaced with any component that can perform the same function. Further, any constituent may be added.

Further, the electronic component conveying device, the electronic component inspection device, and the electronic component pressing device of the present invention may be formed by combining two or more of the configurations (features) of any of the above embodiments.

In addition, in the above-described embodiments, the holding portion of the hand unit is configured to suck and hold air to hold and hold the electronic component. However, the present invention is not limited thereto. For example, the holding portion can be held by sandwiching the electronic component.

Further, when more than 16 (for example, 32) IC elements are inspected at a time, the inspection can be performed by arranging four socket layout components shown in FIG.

Claims (24)

An electronic component transporting apparatus characterized by comprising: a heat conducting portion capable of holding an electronic component and capable of conducting heat; and a heat radiating portion capable of dissipating heat by passing a fluid; and having between the heat radiating portion and the heat conducting portion A thermally conductive member that promotes heat exchange between the two. The electronic component transporting apparatus of claim 1, wherein the heat radiating portion is disposed to be in contact with or away from the heat conducting portion. The electronic component transport apparatus of claim 2, wherein the heat conductive member is disposed in the heat transfer portion. The electronic component conveying device according to claim 2 or 3, comprising: a contact driving portion that abuts the heat dissipating portion against the heat transfer portion, and the abutting driving portion is constituted by a fluid machine. The electronic component transporting apparatus of claim 4, wherein the abutting drive unit includes a cylinder portion having a hollow portion, and a piston portion sliding in the hollow portion. The electronic component transporting apparatus of claim 5, wherein the piston portion has a larger elastic deformation rate or a plastic deformation ratio than the heat radiating portion. The electronic component transport apparatus according to claim 5, wherein a member having a larger elastic deformation rate or a plastic deformation ratio than the piston portion and the heat radiating portion is interposed between the piston portion and the heat radiating portion. The electronic component transporting apparatus of claim 5, wherein a plate member is interposed between the piston portion and the heat radiating portion. The electronic component transport apparatus according to claim 2 or 3, wherein the heat radiating portion is separated from the heat radiating portion and separated from the driving portion, and the leaving driving portion has an elastic member. The electronic component transporting device of claim 9, wherein the elastic member is a coil spring. The electronic component transport apparatus according to claim 2 or 3, wherein the heat radiating portion is blown with the fluid while being in contact with or away from the heat conducting portion. The electronic component transporting apparatus according to claim 2 or 3, wherein the stroke of the heat dissipating portion when abutting or leaving with respect to the heat conducting portion is greater than 0 mm and less than 5 mm. The electronic component transport apparatus according to claim 2 or 3, wherein a direction in which the heat radiating portion abuts on the heat conducting portion is a direction in which the heat conducting portion abuts on the electronic component. The electronic component transport apparatus according to claim 12, wherein the direction in which the heat radiating portion is separated from the heat conducting portion is opposite to a direction in which the heat conducting portion is in contact with the electronic component. The electronic component transport device of any one of claims 1 to 3, wherein the heat conductive member is fluid or solid. The electronic component conveying apparatus according to any one of claims 1 to 3, wherein the heat transfer member comprises a first heat transfer member and a second heat transfer member. The electronic component conveying apparatus according to claim 16, wherein the first heat transfer member is a fluid and is disposed on the heat transfer portion side, and the second heat transfer member is solid and disposed on the heat radiation portion side. The electronic component transport device of claim 16, wherein the first heat transfer member is a heat transfer grease, and the second heat transfer member comprises indium. The electronic component transport apparatus of claim 16, wherein an area of the first heat transfer member is smaller than an area of the second heat transfer member. The electronic component transporting apparatus according to any one of claims 1 to 3, wherein the heat radiating portion has a heat radiating member. The electronic component transport device of claim 20, wherein the heat dissipating portion has a heat conducting member having a heat capacity greater than a heat capacity of the heat dissipating member. The electronic component conveying apparatus according to any one of claims 1 to 3, wherein the fluid is air. An electronic component inspection apparatus characterized by comprising: a heat conduction portion capable of holding an electronic component and capable of conducting heat; a heat dissipation portion capable of dissipating heat by passing a fluid; and an inspection portion for inspecting the electronic component; A heat conducting member that promotes heat exchange between the heat radiating portion and the heat conducting portion is provided. An electronic component pressing device, comprising: a heat conducting portion capable of holding an electronic component and capable of conducting heat; and a heat dissipating portion capable of dissipating heat by passing a fluid; and having between the heat dissipating portion and the heat conducting portion A thermally conductive member that promotes heat exchange between the two.