TWI604205B - Electronic component pressing device, electronic component pressing unit, electronic component conveying device, and electronic component inspection device - Google Patents

Description

Electronic component pressing device, electronic component pressing unit, electronic component conveying device, and electronic component inspection device

The present invention relates to an electronic component pressing device, an electronic component pressing unit, an electronic component conveying device, and an electronic component inspection device.

An electronic component inspection apparatus for inspecting electrical characteristics of electronic components such as IC (Integrated Circuit) devices has been known.

The electronic component inspection apparatus is configured to supply an electronic component from a supply tray to an inspection unit, and to perform inspection of electrical characteristics of electronic components supplied to the inspection unit, and when the inspection is completed, the electronic component is self-contained. The inspection department recycles to the recovery tray. Here, the electronic components housed in the supply tray are temporarily transferred to the transport shuttle by the supply robot, and are transported to the vicinity of the inspection unit by the transport shuttle. Then, the electronic components housed in the transport shuttle are transported to the inspection unit by the inspection robot. The inspection robot supplies the unchecked electronic components housed in the transport shuttle to the inspection unit, and further presses the electronic components against the inspection unit to ensure the electrical conduction between the electronic component and the inspection unit. Moreover, in order to inspect the electrical characteristics of the electronic component at a specific temperature, the inspection robot includes a temperature adjustment function for adjusting the temperature of the electronic component (see, for example, Patent Documents 1, 2, and 3).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-171521

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-5685

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2003-28923

In the electronic component testing device of Patent Document 1, in order to adsorb electronic components, the adsorption holes provided in the inspection robot blow fluid onto the electronic components to adjust the temperature of the electronic components. The amount and momentum of the fluid in such an electronic component testing device are not sufficient, so that there is a problem that the temperature adjustment accuracy is poor.

In the electronic component inspection device of Patent Document 2, a cooling fan is provided in the vicinity of the inspection portion, and the temperature of the electronic component is adjusted by the airflow generated by the cooling fan. In such an electronic component inspection device, there is a problem that it is difficult to perform rapid temperature adjustment.

The electronic component testing device of Patent Document 3 includes a heat sink connected to the upper surface of the contact thruster and a heater embedded in the lower surface of the contact thruster. In such an electronic component testing device, since the heater embedded in the lower surface of the contact thruster has a small contact area with the electronic component, the electronic component and the contact thruster (heat sink) The heat exchange between the two is inefficient. Therefore, there is a problem that a sufficient cooling effect cannot be exerted.

As described above, none of the electronic component testing devices of Patent Documents 1, 2, and 3 can exhibit an excellent temperature adjustment function.

An object of the present invention is to provide an electronic component pressing device, an electronic component pressing unit, an electronic component conveying device, and an electronic component inspection device that can perform temperature adjustment of an electronic component with high precision.

Such an object is achieved by the invention described below.

The electronic component pressing device of the present invention is characterized by comprising: a base; a heat exchange portion, which can exchange heat with the electronic component; The heat radiating portion is disposed between the base portion and the heat exchange portion and is thermally connected to the heat exchange portion, and the fluid ejecting portion ejects a fluid to the heat dissipating portion.

Thereby, the fluid can be ejected quickly and appropriately in the heat dissipating portion, so that an electronic component pressing device capable of accurately adjusting the temperature of the electronic component can be provided.

In the electronic component pressing device of the present invention, it is preferable that the fluid ejecting portion diffuses and ejects the fluid when viewed from a direction in which the base portion, the heat dissipating portion, and the heat exchange portion are arranged.

Thereby, on the one hand, the fluid ejecting portion can be miniaturized, and on the other hand, a sufficient fluid can be supplied to the heat dissipating portion.

In the electronic component pressing device of the present invention, preferably, the jet cross-sectional shape of the fluid ejected from the fluid ejecting portion is such that a width of the array direction is shorter than a width of a direction orthogonal to the array direction.

Thereby, the flow of the fluid toward the arrangement direction of the base portion, the heat dissipating portion, and the heat exchange portion can be suppressed, so that the fluid can be efficiently guided to the heat dissipating portion. Therefore, the cooling effect is improved.

In the electronic component pressing device of the present invention, preferably, the jet cross-sectional shape of the fluid ejected from the fluid ejecting portion is such that a width of the array direction is equal to a width of a direction orthogonal to the array direction.

Thereby, the configuration of the fluid ejecting portion is simplified.

In the electronic component pressing device of the present invention, it is preferable to include a heating portion that heats the heat exchange portion.

Thereby, the temperature control of the heat exchange unit (temperature control of the electronic component) can be performed with higher precision.

In the electronic component pressing device of the present invention, it is preferable that the heating unit is embedded in the heat exchange unit.

Thereby, the heat exchange portion can be efficiently heated.

In the electronic component pressing device of the present invention, preferably, when the electronic component pressing device has moved, the relative positional relationship between the fluid ejecting portion and the heat dissipating portion is fixed.

Thereby, regardless of the posture of the electronic component pressing device, the fluid is fixedly and stably supplied to the heat radiating portion, and therefore the cooling effect of the heat radiating portion (heat radiating effect in the heat radiating portion) is stabilized.

In the electronic component pressing device of the present invention, it is preferable that the base portion and the heat exchange portion are connected to each other via a member disposed between the base portion and the heat exchange portion, and the base portion is spaced apart from the heat dissipation portion.

Thereby, a space for arranging the heat radiating portion between the base portion and the heat exchange portion can be secured with a simple configuration. Further, heat exchange between the heat radiating portion and the base portion can be substantially prevented, and the cooling effect is improved.

In the electronic component pressing device of the present invention, it is preferable that the member has heat insulating properties.

Thereby, heat transfer from the heat exchange unit to the base via the member can be suppressed, and the cooling effect can be improved.

In the electronic component pressing device of the present invention, it is preferable that a slit is formed in the heat radiating portion, and at least a part of the member enters the slit.

Thereby, the size of the device can be reduced.

In the electronic component pressing device of the present invention, it is preferable that the heat radiating portion includes a heat sink that flows along the fluid.

Thereby, the fluid can be efficiently contacted with the fins, so that the cooling effect is improved.

In the electronic component pressing device of the present invention, it is preferable that the swinging mechanism that swings the heat exchange portion is provided on a side of the base portion opposite to the heat exchange portion.

Thereby, for example, even if the surface of the electronic component is pressed against the heat exchange portion and pressed The direction is orthogonal to the surface, and the electronic component can be uniformly pressed while following the surface. Therefore, it is possible to prevent breakage of the electronic component and the like.

The electronic component pressing unit of the present invention is characterized in that it comprises a plurality of electronic component pressing devices according to the present invention, and each of the electronic component pressing devices is configured such that the fluid ejected from the fluid ejecting portion is not guided to other electronic component pressing The arrangement of the heat sink of the device.

Thereby, it is possible to provide an electronic component pressing unit that can perform temperature adjustment of an electronic component with high precision.

In the electronic component pressing unit of the present invention, preferably, in the adjacent one of the electronic component pressing devices, the fluid ejecting portion of each of the pair of electronic component pressing devices is disposed on the pair of electronic component pressing The devices are arranged to be arranged in a direction intersecting the arrangement direction of the pair of electronic component pressing devices.

Thereby, the distance between adjacent electronic component pressing devices can be reduced.

An electronic component conveying apparatus according to the present invention includes: a base portion; a heat exchange portion that exchanges heat with the electronic component; a holding portion that holds the electronic component; and a heat dissipation portion that is disposed at the base portion and the heat exchange portion And being thermally connected to the heat exchange unit; the fluid ejecting unit ejecting the fluid to the heat dissipating portion; and the moving mechanism moving the electronic component in a specific direction.

Thereby, it is possible to provide an electronic component conveying apparatus capable of performing temperature adjustment of an electronic component with high precision.

The electronic component inspection device of the present invention is characterized by comprising: a base; a heat exchange unit capable of exchanging heat with the electronic component; a holding portion holding the electronic component; and a heat dissipating portion disposed between the base portion and the heat exchange portion and thermally connected to the heat exchange portion; the fluid ejecting portion And ejecting a fluid to the heat dissipating portion; moving the mechanism to move the electronic component in a specific direction; and inspecting the component to perform the inspection of the electronic component.

Thereby, it is possible to provide an electronic component inspection device capable of performing temperature adjustment of an electronic component with high precision.

1‧‧‧Electronic parts inspection device

2‧‧‧Supply disk

3‧‧‧Recycling tray

4‧‧‧1st shuttle

5‧‧‧2nd transport shuttle

6‧‧‧Check socket

7‧‧‧Supply robot

8‧‧‧Recycling robot

9‧‧‧Check robot

9A‧‧‧1st frame

9B‧‧‧2nd frame

9C'‧‧‧1st unit support department

9C"‧‧‧2nd Unit Support Department

9D', 9D" ‧ ‧ lifting mechanism

10‧‧‧Control device

11‧‧‧ pedestal

21‧‧‧ recess

23‧‧‧ Track

31‧‧‧ recess

33‧‧‧ Track

41‧‧‧Base member

42, 43‧‧ ‧ handling shuttle fixture

44‧‧‧ Track

51‧‧‧Base member

52, 53‧‧‧Transporting hook fixture

54‧‧‧ Track

61‧‧‧Inspection with individual sockets

72‧‧‧Support framework

73‧‧‧Mobile framework

74‧‧‧Hand Unit Support Department

75‧‧‧Hand unit

82‧‧‧Support framework

83‧‧‧Mobile framework

84‧‧‧Hand Unit Support Department

85‧‧‧Hand unit

91, 91A, 91B, 91C, 91D‧‧‧1st unit

92‧‧‧2nd unit

93‧‧‧swing mechanism

94‧‧‧Swing body

95‧‧‧Travel equipment

96‧‧‧ Swim

97‧‧‧ leaf spring

98‧‧‧Interrupted section

99‧‧‧ Pressure adjustment equipment

100‧‧‧ IC devices

101‧‧‧Check Control Department

102‧‧‧Drive Control Department

421, 431‧‧ ‧ pocket

521, 531‧‧ ‧ pocket

721‧‧‧ Track

911‧‧‧Base

912‧‧‧Hot Exchange Department

913‧‧‧heater

914, 914A, 914B, 914C, 914D‧‧‧ radiator

915, 915A, 915B, 915C, 915D‧‧‧ spray nozzle

916‧‧‧temperature sensor

917‧‧‧ components

918‧‧‧Control Department

941‧‧‧Swing body

941a‧‧‧ recess

942‧‧‧ Rubber film

943‧‧‧Support components

943a‧‧ Air holes

944‧‧‧Cards

944a‧‧‧ convex

951‧‧‧ steel ball

981‧‧‧ suction hole

982‧‧‧Switching valve

983‧‧‧Suction equipment

984‧‧‧ gas injection equipment

985‧‧‧ valve

986‧‧‧ gas cylinder

1000‧‧‧Electronic parts inspection device

1100‧‧‧Inspection socket

1200‧‧‧Hand unit

1300‧‧‧ pole

2000‧‧ Tools

9121‧‧‧ heater assembly

9121a, 9121b‧‧ hole

9122‧‧‧Contact propeller

9141‧‧‧ Heat sink

9142‧‧‧ incision

9151‧‧‧jet

9152‧‧‧Flow

9161‧‧‧Detection Department

9171, 9172‧‧ incision

9173‧‧‧through hole

a, b, c, d‧‧‧ width

G‧‧‧Gas gas for cooling

O‧‧‧Central Department

S‧‧‧ area

S1, S2‧‧‧ space

S3‧‧‧Confined space

Fig. 1 is a plan view showing a preferred embodiment of the electronic component inspection device of the present invention.

Fig. 2 is a cross-sectional view showing the first hand unit included in the electronic component inspection device shown in Fig. 1.

Fig. 3 is a partial cross-sectional view showing the first hand unit shown in Fig. 2;

Fig. 4 is a cross-sectional view showing the swinging mechanism of the first hand unit shown in Fig. 2;

Fig. 5 is a plan view showing the vicinity of a heat radiating portion of the first hand unit shown in Fig. 2;

Fig. 6 is a perspective view showing an injection shape of a cooling gas injected from an injection nozzle included in the first hand unit shown in Fig. 2;

Fig. 7 is a perspective view showing an injection shape of a cooling gas injected from an injection nozzle included in the first hand unit shown in Fig. 2;

Fig. 8 is a cross-sectional view showing a member included in the first hand unit shown in Fig. 2;

Fig. 9 is a block diagram for explaining a control unit included in the first hand unit shown in Fig. 2;

Fig. 10 is a plan view showing the arrangement of four first hand units.

Fig. 11 is a plan view showing a modification of the arrangement of the four first hand units.

Fig. 12 is a plan view showing a modification of the arrangement of the four first hand units.

Fig. 13 is a plan view showing a modification of the arrangement of the four first hand units.

Fig. 14 is a plan view showing the inspection procedure of the electronic component inspection apparatus shown in Fig. 1 for electronic components.

Fig. 15 is a plan view showing the inspection procedure of the electronic component inspection apparatus shown in Fig. 1 for the electronic component.

Fig. 16 is a plan view showing the inspection procedure of the electronic component inspection apparatus shown in Fig. 1 for the electronic component.

Fig. 17 is a plan view showing the inspection procedure of the electronic component inspection apparatus shown in Fig. 1 for the electronic component.

Fig. 18 is a plan view showing the inspection procedure of the electronic component inspection apparatus shown in Fig. 1 for the electronic component.

Fig. 19 is a plan view showing the inspection procedure of the electronic component inspection apparatus shown in Fig. 1 for the electronic component.

Fig. 20 is a plan view showing the inspection procedure of the electronic component inspection apparatus shown in Fig. 1 for the electronic component.

Fig. 21 is a plan view showing the inspection procedure of the electronic component inspection apparatus shown in Fig. 1 for the electronic component.

Fig. 22 is a plan view showing the inspection procedure of the electronic component inspection apparatus shown in Fig. 1 for the electronic component.

Fig. 23 is a plan view showing an application example of the electronic component pressing device of the present invention.

Hereinafter, the electronic component pressing device, the electronic component pressing unit, the electronic component conveying device, and the electronic component inspection device of the present invention will be described in detail based on the embodiments shown in the drawings.

Fig. 1 is a plan view showing a preferred embodiment of the electronic component inspection device of the present invention. Figure 2 is a cross section of the first hand unit included in the electronic component inspection apparatus shown in Figure 1. Figure. Fig. 3 is a partial cross-sectional view showing the first hand unit shown in Fig. 2; Fig. 4 is a cross-sectional view showing the swinging mechanism of the first hand unit shown in Fig. 2; Fig. 5 is a plan view showing the vicinity of a heat radiating portion of the first hand unit shown in Fig. 2; Fig. 6 and Fig. 7 are perspective views showing the injection shapes of the cooling gas injected from the injection nozzles included in the first hand unit shown in Fig. 2, respectively. Fig. 8 is a cross-sectional view showing a member included in the first hand unit shown in Fig. 2; Fig. 9 is a block diagram for explaining a control unit included in the first hand unit shown in Fig. 2; Fig. 10 is a plan view showing the arrangement of four first hand units. 11 to 13 are plan views each showing a modification of the arrangement of the four first hand units. 14 to 22 are plan views for explaining the inspection sequence of the electronic component inspection apparatus shown in Fig. 1, respectively. Fig. 23 is a plan view showing an application example of the electronic component pressing device of the present invention.

In the following description, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, a direction parallel to the X axis is referred to as "X direction", a direction parallel to the Y axis is referred to as "Y direction", and a direction parallel to the Z axis is referred to as "Z direction".

(electronic parts inspection device)

The electronic component inspection apparatus 1 shown in FIG. 1 is used for inspecting and testing, for example, an IC device (IC chip), an LCD (Liquid Crystal Display), a CIS (CMOS Image Sensor, a complementary metal oxide semiconductor image sensor). A device for electrical characteristics of electronic components. In the following, for convenience of explanation, a case where an IC device is used as a test component for inspection and testing is described as a representative, and this is referred to as "IC device 100".

The electronic component inspection device 1 includes a supply tray 2, a recovery tray 3, a first transport shuttle 4, a second transport shuttle 5, an inspection socket (inspection unit) 6, a supply robot 7, a collection robot 8, an inspection robot 9, and Control device 10 for the control of the various departments. This electronic component inspection device 1 is a device that transports the IC device 100 to the inspection socket 6 and inspects and tests the electrical characteristics of the IC device 100 from the inspection socket 6.

The electronic component inspection device 1 is configured by the supply tray 2, the recovery tray 3, the first transport shuttle 4, and the second transport shuttle 5, except for the inspection sockets 6 in the respective units. The robot 7, the collection robot 8, the inspection robot 9, and the control device 10 constitute an electronic component conveying device (the electronic component conveying device of the present invention) that carries out the conveyance of the IC device 100. The electronic component transport device is also referred to as a robot. In addition, the configuration of the electronic component conveying device of the present invention is not limited to the embodiment, and at least one of the components may be omitted as needed, and other configurations (for example, a heater, a chamber, etc.) may be added. .

Further, as shown in FIG. 1, the electronic component inspection apparatus 1 includes a pedestal 11 on which the respective units are mounted, and a safety cover (not shown) that is covered by the pedestal 11 so as to accommodate the respective parts, and is inside the safety cover ( Hereinafter, the "first region" is disposed, and the first transport shuttle 4, the second transport shuttle 5, the inspection socket 6, the supply robot 7, the recovery robot 8, and the inspection robot 9 are disposed, and are movable to the region S. The supply tray 2 and the recovery tray 3 are disposed inside and outside.

Hereinafter, each of the units will be described in detail in order.

(supply disk)

The supply tray 2 is for transporting the IC device 100 to be inspected from the area S to the tray in the area S.

(recycle tray)

The recovery tray 3 is for housing the inspected IC device 100 and transporting it from the area S to the tray outside the area S.

In the electronic component inspection apparatus 1, the recovery trays 3 of such a configuration are arranged in two in the X direction. One of the two recovery trays 3 is for accommodating the disc of the IC device 100 which is judged as "good" as a result of the inspection, and the other recovery tray 3 is for accommodating the IC device 100 which is judged as "defective" by the inspection result. . Thus, the distinction between the IC device 100 thereafter can be easily performed by separating the discs from good products and defective products.

The recovery tray 3 is provided in the +X direction with respect to the supply tray 2, and the first conveyance shuttle 4, the second conveyance shuttle 5, and the inspection socket 6 are disposed between the supply tray 2 and the recovery tray 3.

(1st transport shuttle)

The first transport shuttle 4 is configured to transport the IC device 100 transported by the supply tray 2 to the vicinity of the inspection slot 6 to the vicinity of the inspection socket 6, and to transport the inspected IC device 100 inspected by the inspection socket 6. To the transport shuttle near the recovery tray 3.

(2nd transport shuttle)

The second transport shuttle 5 has the same function and configuration as the first transport shuttle 4 described above. In other words, the second transport shuttle 5 is configured to transport the IC device 100 transported in the region S by the supply tray 2 to the vicinity of the inspection socket 6, and to check the IC device that has been inspected by the inspection socket 6. 100 transported to the transport shuttle near the recovery tray 3.

(check socket)

The inspection socket (inspection portion) 6 is a socket for inspecting and testing the electrical characteristics of the IC device 100.

The inspection socket 6 includes four inspection individual sockets 61 for arranging the IC device 100. The four inspection individual sockets 61 are arranged in a matrix in such a manner that they are arranged in the X direction and the Y direction, respectively. Further, the arrangement pitch of the four inspection individual sockets 61 is substantially equal to the arrangement pitch of the four pockets formed on each of the transport hooks 42, 43, 52, 53. Thereby, the conveyance of the IC device 100 can be smoothly performed between the conveyance hooks 42, 43, 52, 53 and the individual inspection sockets 61.

Although the individual sockets 61 for inspection are not shown, a plurality of probe pins protruding from the bottom are provided. A plurality of probe pins are respectively biased upward by a spring or the like. When the IC device 100 is disposed on the inspection individual jack 61, the plurality of probe pins are in contact with the external terminals of the configured IC device 100. Thereby, the IC device 100 is electrically connected to the control device 10 (the inspection control unit 101 described below) via the probe pin, and the IC device 100 can be inspected and tested.

Further, the inspection socket 6 is preferably detachably fixed to the pedestal 11. Thereby, the inspection socket 6 can be replaced simply according to the inspection purpose, or the inspection socket 6 adapted thereto can be replaced according to the size or shape of the IC device 100.

(supply robot)

The supply robot 7 transports the IC device 100 housed in the supply tray 2 to the robot that transports the grippers 42 and 52.

(checking robot)

The inspection robot 9 transports the IC device 100 housed in the transport hooks 42 and 52 to the inspection socket 6 and transports the inspected IC device 100 from the inspection socket 6 to the transport hooks 43 and 53. Robot. Further, the inspection robot 9 has a function of pressing the IC device 100 against the inspection socket 6 (probe pin) when the inspection socket 6 inspects the IC device 100, and applying a specific inspection pressure to the IC device 100. .

The four first hand units 91 are devices for transporting the IC device 100 between the transport hooks 42 and 43 and the inspection socket 6. The four first hand units 91 are arranged in a matrix on the lower side of the first hand unit support portion 9C' so as to be arranged in two in the X direction and the Y direction. Further, the arrangement pitch of the four first hand units 91 is matched with the four pockets 421 and 431 formed on the transport hooks 42, 43 and the four individual inspection sockets 61 provided on the inspection socket 6. Set the spacing to be approximately equal. Thereby, the conveyance of the IC device 100 can be smoothly performed between the conveyance grippers 42 and 43 and the inspection socket 6.

The four second hand units 92 are devices for transporting the IC device 100 between the transport hooks 42 and 43 and the inspection socket 6. The four second hand units 92 are arranged in a matrix on the lower side of the second hand unit support portion 9C" so as to be arranged in two in the X direction and the Y direction. Further, the four second hand units 92 are arranged. The arrangement pitch is substantially equal to the arrangement pitch of the four pockets 521 and 531 formed on the transport hooks 52 and 53 and the four individual inspection sockets 61 provided on the inspection socket 6. The transfer of the IC device 100 between the shuttle grips 52, 53 and the inspection socket 6 is performed.

In the following, the configuration of the first hand unit 91 and the second hand unit 92 will be described. However, since each of the hand units 91 and 92 has the same configuration, the first hand unit 91 will be described below as a representative. The other first hand unit 91 and each second hand unit 92 are omitted. Bright.

(1st unit)

As shown in FIGS. 2 to 9, the first hand unit 91 includes a base (base) 911, a heat exchange portion 912 that can exchange heat with the IC device 100, and a heater that heats the IC device 100 via the heat exchange portion 912 ( a heating unit 913; a heat sink (heat radiating portion) 914 thermally connected to the heat exchange portion 912; an injection nozzle (fluid ejection portion) 915 that injects a cooling gas (fluid) G to the heat sink 914 and cools the IC device 100; The temperature sensor 916 of the temperature of the IC device 100; and the control unit 918 controls the driving of the heater 913 and the injection of the cooling gas G from the injection nozzle 915 based on the detection result of the temperature sensor 916.

Further, the first hand unit 91 includes a swing mechanism 93 that swings the heat exchange unit 912, and the heat exchange unit 912 is supported and fixed to the first hand unit support unit 9C' via the swing mechanism 93. The swing mechanism 93 is configured to swing the heat exchange unit 912 with respect to the first hand unit support portion 9C' so that the IC device 100 held by the heat exchange portion 912 follows the inclination of the bottom surface of the inspection individual socket 61. The institution. By providing such a mechanism, the IC device 100 can be uniformly pressed against the surface of the individual socket 61 for inspection. Therefore, the breakage of the IC device 100 can be suppressed, and the electrical connection between the IC device 100 and the individual sockets 61 for inspection can be performed more reliably.

(swing mechanism)

The swing mechanism 93 includes a swinging body 94 and a swimming body 96 that is suspended from the swinging body 94 via the swimming device 95.

The swinging body 94 includes: a swinging swinging portion body 941; a rubber film (membrane-like elastic member) 942 for swinging the swinging portion body 941 on the surface of the swinging portion body 941; and a supporting member for supporting the rubber film 942 943. In the present embodiment, the support member 943 is divided into two portions, and the rubber film 942 is sandwiched between the two portions, and the two portions are joined by screws or the like to support the rubber film 942. The rubber film 942 supported by the support member 943 is disposed in a film shape in a direction orthogonal to the lifting direction of the first hand unit 91.

The rubber film 942 is fixed (for example, followed by) with a swinging portion body 941. Further, in the present embodiment, the rubber film 942 is fixed to the upper surface of the swing portion main body 941. However, the present invention is not limited thereto, and the rubber film 942 may be penetrated through the swing portion main body 941 or may cover the swing portion main body 941. The surface. Further, the rubber film 942 may not be followed by the swing portion body 941.

Further, in order not to cause unnecessary swing of the swing portion main body 941 to cause excessive stress on the rubber film 942, the swing body 94 includes a locking portion 944 that restricts the swing range of the swing portion main body 941. The locking portion 944 is a member for locking the swing portion body 941 to the support member 943. Further, the locking portion 944 includes a swing restricting portion.

As shown in FIG. 2, a space S1 is formed between the inner circumferential surface of the locking portion 944 and the outer circumferential surface of the swing portion main body 941. The space S1 is used to make the swing of the swinging portion body 941 possible. The space S1 is disposed such that the swing portion body 941 swings at a maximum of 0.5 degrees. Thereby, on the one hand, it is possible to ensure a sufficient swing range for the inspection of the swinging portion body 941, and on the other hand to prevent excessive swinging.

Further, a concave portion 941a extending in the vertical direction is formed on the outer circumferential surface of the swing portion main body 941, and a convex portion 944a that engages with the concave portion 941a is formed on the inner circumferential surface of the locking portion 944. Thereby, excessive rotation (swirl) of the swinging portion body 941 is prevented.

Further, a sealed space S3 is formed in the rocking body 94 by the rubber film 942 and the support member 943. Further, an air hole 943a for allowing air to enter and exit from the pressure adjusting device 99 is provided on the upper surface of the sealed space S3. When the positive pressure is supplied from the pressure adjusting device 99 to the sealed space S3, the rubber film 942 is bent downward so that the sealed space S3 is enlarged. As a result, the swinging portion main body 941 is biased downward. The swinging portion main body 941 that is biased downward is in a state of being locked to the locking portion 944.

When the swinging portion main body 941 is locked in the locking portion 944 (the sealed space S3 is pressurized), the first hand unit 91 is lowered, and the pressure applied by the pressure adjusting device 99 is pressed against the pressure. When the individual sockets 61 for inspection are used, as shown in FIG. 4, the swinging portion main body 941 is separated from the locking portion 944, and follows the inclination of the individual sockets 61 for inspection while swinging. By this, The IC device 100 is uniformly pressed against the surface (probe pin) of the individual socket 61 for inspection.

The swing mechanism 93 has been described above. As shown in FIG. 2, a plate-like base 911 is fixed to the lower surface of the swimming body 96 of the swinging mechanism 93. Further, a heat exchange portion 912 is disposed on the lower side (the -Z direction side) of the base 911, and the base 911 and the heat exchange portion 912 are connected by the four columnar members 917 disposed therebetween. Further, a heat sink 914 is disposed in a gap formed between the base 911 and the heat exchange portion 912 and formed by the member 917.

(Heat Exchange Department)

The heat exchange unit 912 holds the IC device 100 and presses the IC device 100 to the member on the inspection individual socket 61. Further, the heat exchange unit 912 is also a member that exchanges heat with the IC device 100 to be held. As shown in FIG. 2, the heat exchange unit 912 is composed of two parts. Specifically, the heat exchange unit 912 includes a heater assembly 9121 on the side of the base 911 and a contact propeller 9122 located on the lower side of the heater assembly 9121. The IC is held and pressed by the lower surface of the contact propeller 9122. Device 100. The contact propeller 9122 is detachably fixed to the heater unit 9121 by screwing, fitting, or the like. Thereby, the contact type pusher 9122 adapted to the shape or size of the IC device 100 to be inspected can be appropriately selected, and the convenience of the apparatus can be improved.

Further, the lower surface of the contact type propeller 9122 is constituted by a flat surface. Thereby, the IC device 100 can be uniformly pressed. Further, generation of a gap (a heat insulating layer composed of air) between the contact pusher 9122 and the IC device 100 can be suppressed. Therefore, the IC device 100 can be stably held by the heat exchange portion 912, and heat exchange (heat transfer) with the IC device 100 can be efficiently performed.

The heater assembly 9121 and the contact propeller 9122 are each formed of a material that is hard and has a high thermal conductivity. Thereby, the heat exchange unit 912 that can reliably perform the above functions is provided. The material which is hard and has a high thermal conductivity is not particularly limited, and examples thereof include various metals such as iron, nickel, cobalt, gold, platinum, silver, copper, aluminum, magnesium, titanium, and tungsten, or At least one of these alloys or intermetallic compounds, and further such metals Oxides, nitrides, carbides, and the like.

As shown in FIG. 3, a suction hole 981 is formed on the lower surface of the contact pusher 9122. Further, a suction device 983 is connected to the suction hole 981 via a switching valve 982, and a gas injection device 984 for supplying a gas having a higher thermal conductivity than the air is exchanged by the switching valve 982. A state in which the suction hole 981 is connected to the suction device 983 and a state in which the suction hole 981 is connected to the gas injection device 984.

The suction device 983 includes, for example, a pump such as a vacuum pump, and has a function of decompressing the inside of the suction hole 981. When the heat exchange portion 912 is pressed against the upper surface of the IC device 100 and the inside of the suction hole 981 is depressurized, the IC device 100 can be adsorbed and held. Thereby, the IC device 100 can be transported from the transport susceptor 42 to the inspection individual socket 61, and the IC device 100 can be transported from the inspection individual socket 61 to the transport susceptor 43.

The gas injection device 984 has a function of supplying a specific gas between the heat exchange portion 912 and the IC device 100 from the opening of the suction hole 981. A gas that supplies a gas system with a higher thermal conductivity than air (dry air). As such a gas, helium gas is particularly suitable. As described above, in order to efficiently perform heat exchange between the heat exchange portion 912 and the IC device 100, the lower surface of the contact type pusher 9122 is made flat, and the gap with the IC device 100 is suppressed, but contact type The processing accuracy of the pusher 9122 or the bending of the upper surface of the IC device 100 may cause a slight gap between the heat exchange portion 912 and the IC device 100. The air existing in the gap functions as a heat insulating layer, and there is a possibility that the heat exchange efficiency between the contact propeller 9122 and the IC device 100 is lowered. Therefore, the gas is supplied to the contact between the contact type propeller 9122 and the IC device 100 by the gas injection device 984, and the gap is filled with gas, whereby the decrease in heat exchange efficiency as described above can be suppressed.

(heater)

As shown in FIGS. 2 and 5, a heater 913 is embedded in the heater unit 921. When the heater 913 is driven, the heat of the heater 913 is transmitted to the IC device 100 via the heater assembly 9121 and the contact pusher 9122, causing the IC device 100 to heat up. So by heating The heater 913 is embedded in the heater assembly 9121, and the heat of the heater 913 can be efficiently communicated to the IC device 100.

In the heater unit 9121, two holes 9121a extending in the Y direction and opening on the side in the -Y direction are formed, and a rod-shaped heater 913 is inserted into each of the holes 9121a. Moreover, the two heaters 913 are disposed at both ends in the X direction away from the central portion of the heater unit 921. Further, although not shown, thermal grease is filled between the heater 913 and the inner peripheral surface of the hole 9121a, so that the heat of the heater 913 is efficiently transmitted to the heater unit 921. In addition, the arrangement of the heaters 913 is not limited to this as long as the IC device 100 can be heated via the heat exchange unit 912. For example, the heater unit 912 may be disposed outside the heater unit 9121, and may be disposed by a heat pipe or the like. Thermally coupled to heater assembly 9121.

The heater 913 is not particularly limited as long as the IC device 100 can be heated, and various types of, for example, an alumina heater, an aluminum nitride heater, a tantalum nitride heater, a tantalum carbide heater, and a boron nitride heater can be used. Ceramic heaters, and various cassette heaters that use electric wires such as nickel wires. Moreover, although it is difficult in terms of durability, a Peltier element can also be used. Further, the heater 913 is not limited to a rod shape, and for example, a flat surface may be used.

(temperature sensor)

As shown in FIGS. 2 and 5, a temperature sensor 916 is embedded in the heater assembly 9121. Temperature sensor 916 indirectly detects the temperature of IC device 100 by detecting the temperature of heater assembly 9121. As described above, since the heater assembly 9121 and the contact propeller 9122 are composed of a material having a high thermal conductivity, the temperature difference between the IC device 100 and the heater assembly 9121 is less, and is buried in the heater assembly 9121. The temperature sensor 916 can also sufficiently accurately detect the temperature of the IC device 100.

The heater unit 9121 is formed with a hole 9121b extending in the Y direction and opening on the side in the -Y direction side, and a temperature sensor 916 is inserted into the hole 9121b. Further, although not shown, a thermal grease is filled between the temperature sensor 916 and the inner peripheral surface of the hole 9121b. The heat of the heater assembly 9121 is communicated to the temperature sensor 916 efficiently.

In particular, the temperature detecting portion 9161 overlaps the central portion of the heater unit 9121 and the lower surface of the contact pusher 9122, and the temperature sensor 916 is disposed in the vicinity of the IC device 100, so that it can be more accurate. The temperature of the IC device 100 is detected. Further, the two heaters 913 are formed in a rod shape and disposed at both end portions of the heater unit 9121 in the X direction, whereby the heater 913 and the temperature sensor 916 can be separated as far as possible. Therefore, the reduction in the temperature detecting system of the temperature sensor 916 caused by the heat from the heater 913 can be suppressed.

Further, the temperature sensor 916 of the present embodiment is arranged to indirectly detect the temperature of the IC device 100. However, the arrangement of the IC device 100 is not particularly limited as long as the temperature of the IC device 100 can be detected. For example, it may be directly The method of detecting the temperature of the IC device 100 is constructed. Specifically, the temperature sensor 916 may be disposed in such a manner that the lower surface of the contact pusher 9122 is exposed, and the temperature sensor 916 is brought into contact with the IC device 100 when pressed. Further, in the electronic component inspection apparatus 1, the temperature detected by the temperature sensor 916 plus the specific corrected temperature may be taken as the IC device 100 in consideration of the thermal conductivity of the heater element 9121 and the contact type pusher 9122. temperature.

As described above, in the present embodiment, the temperature sensor 916 is embedded in the heater unit 9121, but instead of this, the temperature sensor 916 may be embedded in the contact propeller 9122, thus being integrated with the IC. The distance of the device 100 is also close, so that the temperature detection accuracy is improved. However, as described above, since the contact type pusher 9122 is a member appropriately selected depending on the type of the IC device 100, it is assumed that if the temperature sensor 916 is to be disposed in the contact type pusher 9122, it must be in all contact types. The temperature sensor 916 is disposed in the pusher 9122, resulting in an increase in cost. Therefore, in order to reduce the cost, it is preferable to arrange the temperature sensor 916 in the heater unit 9121 as in the present embodiment.

The temperature sensor 916 is not particularly limited as long as it can detect the temperature of the IC device 100, and a Pt sensor such as a platinum sensor, a thermocouple, a thermal resistor, or the like can be used. Further, when a thermal diode or the like is incorporated in the IC device 100, the temperature sensor 916 may be omitted, and the temperature of the IC device 100 may be detected by the thermal diode.

(heat sink)

As shown in FIG. 2, the heat sink 914 is disposed between the substrate 911 and the heater assembly 9121 (the gap formed by the member 917). The heat sink 914 is fixed to the heater unit 9121 by, for example, solder using solder or the like, and is thermally connected thereto. Since the heat conductivity of the material is excellent, the heat sink 914 can be fixed to the heater unit 9121 by using the material, and the heat connection can be efficiently performed.

Further, as shown in FIG. 5, the heat sink 914 has a plurality of fins 9141. The plurality of fins 9141 are respectively extended in the X direction and arranged at equal intervals in the Y direction orthogonal thereto. By providing the heat sink 9141, the surface area of the heat sink 914 is increased, and the heat dissipation effect is improved. Further, the configuration of the heat sink 914 (in particular, the shape of the heat sink 9141) is not particularly limited as long as the heat of the heater assembly 9121 can be dissipated, and for example, a plurality of columnar fins may be arranged in a matrix. Or a zigzag configuration.

Further, the heat sink 914 is provided in a non-contact manner on the base 911. In other words, a gap is formed between the heat sink 914 and the substrate 911. Thereby, heat exchange between the heat sink 914 and the substrate 911 is suppressed, so that the heat dissipation effect of the heat sink 914 is improved. The size of the gap described above can be simply controlled by adjusting the height of the member 917.

(jet nozzle)

As shown in FIG. 2, the injection nozzle 915 is located on the +X direction side with respect to the heat sink 914, and is disposed side by side with the heat sink 914. The injection nozzle 915 includes a flow path 9152 of the cooling gas G and an injection port 9151 connected to the flow path 9152. Further, in the flow path 9152, a gas cylinder (not shown) is connected via a valve 985, and a gas for cooling is filled in a gas cylinder (not shown). When the valve 985 is opened, the cooling gas G is injected from the injection port 9151 to the radiator 914. In this way, the heat sink 914 is cooled by the cooling gas G, whereby the IC device 100 is cooled via the heat exchange portion 912. Thereby, the IC device can be cooled simply 100.

Further, the injection nozzle 915 is formed in a columnar shape extending in the direction in which the base 911, the heat sink 914, and the heat exchange portion 912 are arranged (the Z-axis direction in the natural state in which the swing mechanism 93 does not function), and is cooled from the injection port 9151. Gas G diffusion jet (jetted radially). Thereby, on the one hand, the injection nozzle 915 can be miniaturized, and on the other hand, the injected cooling gas G and the heat sink 914 are brought into contact with each other in a wide range. Therefore, the heat sink 914 can be effectively cooled, and the size of the first hand unit 91 can be reduced. Further, as described below, the four first hand units 91 can be arranged at a narrow pitch.

Further, in the present embodiment, the injection nozzle 915 is located on one end side (+X direction side) of the extending direction of the fin 9141 with respect to the heat sink 914, and the cooling gas G is ejected from the position to the radiator 914. In other words, the heat sink 914 includes a fin 9141 that flows along the cooling gas G. Therefore, the cooling gas G can be efficiently introduced between the adjacent fins 9141, so that the function of cooling the heat sink 914 is improved.

Further, the injection nozzle 915 is fixed to the base 911 via a fixture, and the relative position of the injection nozzle 915 and the radiator 914 is fixedly held. Therefore, the cooling gas G can be stably injected to the radiator 914, and the radiator 914 can be stably cooled. In particular, in the present embodiment, the heat sink 914 and the heat exchange unit 912 are collectively oscillated by the swing mechanism 93, and the posture thereof is irregularly changed. Therefore, the relative positions of the spray nozzle 915 and the heat sink 914 are not fixedly maintained. Then, the heat sink 914 cannot be stably cooled.

Moreover, as shown in FIG. 6, the injection cross-sectional shape of the cooling gas G injected from the injection port 9151 can be formed in a shape which suppresses the spread in the Z direction. That is, it is possible to form a shape in which the width a in the Z direction is smaller than the width b in the direction orthogonal to the Z direction. Therefore, the cooling gas G can be efficiently supplied to the heat sink 914. However, the shape of the jet cross section of the cooling gas G is not limited thereto, and as shown in FIG. 7, the width a and the width b may be substantially equal. Compared with the case of FIG. 6, the shape of the injection port 9151 is simplified by forming the injection cross-sectional shape of the cooling gas G into the shape of FIG.

The injection nozzle 915 has been described above. Further, the cooling gas G is not particularly limited as long as it can cool the radiator 914, but is preferably a compressed gas (a gas compressed at a pressure greater than a large pressure (for example, about 10 times the atmospheric pressure)). Thereby, the heat sink 914 can be efficiently cooled. Further, the cooling gas G may be laminar or turbulent, but is preferably turbulent. Since the turbulent flow conveys heat and diffuses more efficiently than the laminar flow, the cooling gas G is turbulently flowed and ejected to the radiator 914, whereby the cooling of the radiator 914 can be performed more efficiently. Here, the above-mentioned "turbulent flow" refers to a flow of a Reynolds number having a larger critical Reynolds number, and the term "laminar flow" refers to a flow having a Reynolds number smaller than a critical Reynolds number.

Further, the cooling gas G is not particularly limited, but air is preferably used, for example. Thereby, the handling becomes simple and the cooling cost can be reduced. Further, as the cooling gas G, it is preferable to use a gas having a higher thermal conductivity than air such as hydrogen gas or helium gas. In this case, the gas is more expensive than the air, so the cooling cost is increased as compared with the case of the air, but the cooling performance is improved. That is, the cooling of the IC device 100 can be performed at a higher speed by using hydrogen gas, helium gas or the like. A refrigerating cooler (freezer dryer) is used, and the cooled compressed gas is used, whereby the cooling performance can be further improved.

(member)

As shown in FIG. 2, the member 917 is located between the substrate 911 and the heat exchange portion 912, and a space in which the heat sink 914 is disposed is formed between the members. Further, as shown in FIG. 5, the member 917 is formed in a columnar shape and disposed at four corners (outer peripheral edge portion) of the heater unit 921. Further, a slit 9142 is formed at four corners of the heat sink 914, and at least a portion of the member 917 enters each slit 9142. Thereby, the heat sink 914 can be disposed over a wider range of the upper surface of the heater assembly 9121. Therefore, the cooling effect of the IC device 100 is improved.

Further, the member 917 is made of, for example, a resin material and has heat insulating properties. Since the member 917 has heat insulating properties, heat exchange between the heater assembly 9121 and the substrate 911 via the member 917 can be suppressed, so that heating and cooling of the IC device 100 can be efficiently performed, respectively. again In the present specification, the term "heat insulating property" as used herein specifically means a thermal conductivity of 2 W/(m.k) or less.

Further, as shown in FIGS. 5 and 8, a central portion (except for both end portions) in the height direction of the member 917 is formed to face the pair of slits 9171 and 9172 via the central axis. The bottom surfaces of the slits 9171 and 9172 are formed by flat surfaces that are parallel to each other. By the slits 9171 and 9172, the width c of the slits 9171 and 9172 of the member 917 in the opposing direction is shorter than the width d of the direction orthogonal thereto. Further, the member 917 is fixed to the base 911 and the heater unit 9121 so that the slits 9171 and 9172 are arranged in the Y direction. Thereby, the width (=c) of the member 917 in the direction orthogonal to the flow direction of the cooling gas G in the plan view of the XY plane is smaller than the width (=d) in the direction of the flow direction, and the no-cuts 9171, 9172 In contrast, the amount of the cooling gas G blocked by the member 917 can be reduced. Therefore, the effect of cooling the heat sink 914 is improved.

(Control Department)

As shown in FIG. 9, the control unit 918 is configured to control the driving of the heater 913 and the injection nozzle 915 (ie, the valve 985) based on the temperature of the IC device 100 detected by the temperature sensor 916. The temperature of IC device 100 is maintained at a particular temperature range (eg, set temperature ± 2 ° C). By performing such control, the inspection of the IC device 100 at the set temperature can be performed. In particular, the temperature rise caused by the self-heating of the IC device 100 can be eliminated, and the temperature of the IC device 100 under inspection can be kept substantially constant, so that the IC device 100 can be inspected with higher precision.

For example, after the IC device 100 is pressed to the individual inspection port 61 by the specific inspection pressure by the first hand unit 91, the control unit 918 drives the heater 913 and detects it by the temperature sensor 916. The temperature of the IC device 100 is such that the IC device 100 is heated to a set temperature (for example, 100 ° C). If the temperature of the IC device 100 is stable near the set temperature, the IC device 100 is driven to start the inspection. Then, the control unit 918 performs feedback control according to the temperature of the IC device 100 to maintain the temperature of the IC device 100 at the set temperature. near.

Specifically, when the IC device 100 exceeds the set temperature by self-heating, the control unit 918 stops the driving of the heater 913, and opens the valve 985 to inject the cooling gas G from the injection nozzle 915. On the other hand, when the temperature of the IC device 100 is lowered to the set temperature by the cooling of the cooling gas G, the control unit 918 closes the valve 985, stops the injection of the cooling gas G, and drives the heater 913. By performing such feedback control, the temperature of the IC device 100 under inspection can be stabilized near the set temperature.

Further, the method of controlling the heater 913 and the injection nozzle 915 as the control unit 918 is not limited to the method of switching the driving of the heater 913 and the injection of the cooling gas G as described above. For example, in the inspection, when the IC device 100 exceeds the set temperature in a state where the heater 913 is always driven, the control of the injection cooling gas G may be performed. Further, in the state in which the driving of the heater 913 and the injection of the cooling gas G are always performed, the control may be performed such that the output of the heater 913 or the cooling is changed depending on the temperature of the IC device 100. Specifically, as the temperature of the IC device 100 rises, the output of the heater 913 decreases, and the amount of injection of the cooling gas G increases. By simultaneously performing the driving of the heater 913 and the ejection of the cooling gas G, it is possible to prevent an excessive and rapid temperature change of the IC device 100, and it is possible to suppress the temperature swing of the IC device 100 to be small.

The configuration of the first hand unit 91 has been described in detail above. The arrangement of the four first hand units 91 in the inspection robot 9 also has a feature. Therefore, the arrangement of the four first hand units 91 will be described next. Furthermore, the same is true for the four second hand units 92.

As shown in FIG. 10, the four first hand units 91 (91A to 91D) are arranged in a matrix shape so as to be arranged in two in the X direction and the Y direction. Further, between the two first hand units 91A and 91B arranged in the X direction in the +Y direction, the injection nozzle 915A included in the first hand unit 91A and the injection nozzle 915B included in the first hand unit 91B are disposed. . Further, the injection nozzles 915A and 915B are arranged in the Y-axis direction (arrangement with the first hand units 91A and 91B). Configured in the direction of the cross. Further, the injection nozzle 915A is located further toward the +Y direction side than the center portion O. Conversely, the injection nozzle 915B is located further toward the -Y direction side than the center portion O, and the first hand unit 91A, 91B is opposed to the center portion. O is arranged point-symmetrically.

Similarly, in the first hand units 91C and 91D arranged in the X direction on the -Y direction side, the injection nozzles 915C included in the first hand unit 91C and the first one are disposed between the first hand units 91C and 91D. The injection nozzle 915D included in the hand unit 91D. Further, the injection nozzles 915C and 915D are arranged in the Y-axis direction. Further, the injection nozzle 915C is located further toward the +Y direction side than the center portion O. On the contrary, the injection nozzle 915D is located further toward the -Y direction side than the center portion O, and the first hand units 91C and 91D are opposed to the center portion O. The points are symmetrically arranged.

By forming such an arrangement, the following effects can be exerted. First, the cooling gas G injected from the injection nozzle 915A is not guided to the radiator 914 of the first hand unit 91B (not in contact therewith), and similarly, the cooling gas G injected from the injection nozzle 915B is not The heat sink 914 is guided to the first hand unit 91A (not in contact therewith). Similarly, the cooling gas G injected from the injection nozzle 915C is not guided to the radiator 914 of the first hand unit 91D, and similarly, the cooling gas G injected from the injection nozzle 915D is not guided to the first hand unit. 91C radiator 914. Therefore, the unexpected cooling of the heat sink 914 in each of the first hand units 91 can be prevented, and the temperature control of the IC device 100 can be performed independently and with high precision. Secondly, the injection nozzles 915A and 915B and the injection nozzles 915C and 915D are arranged in the Y-axis direction, respectively, and the distance between the first hand units 91A and 91B and the first hand units 91C and 91D can be shortened, respectively. The distance between them. Therefore, the narrow pitch of the first hand unit 91 can be achieved.

Further, in addition to the present embodiment, as the arrangement of the first hand unit 91 capable of exhibiting at least the above-described first effect, the arrangement shown in FIGS. 11 to 13 may be employed.

In Fig. 11, the first hand unit 91A is disposed between the first hand units 91A and 91B in the X direction, and the injection nozzles 915B of the first hand unit 91B are arranged in the +X direction. The injection nozzle 915D of the first hand unit 91D is disposed between the first hand units 91B and 91D, and is arranged between the first hand units 91C and 91D in the X direction on the −Y direction side, and the first hand unit is disposed. The jet nozzle 915C of the 91C is arranged between the first hand units 91A and 91D in the Y direction on the −X direction side, and the injection nozzle 915A of the first hand unit 91A is disposed.

In addition, in FIG. 12, the injection nozzles 915A to 915D of the first hand units 91A to 91D are disposed in the center portion between the four first hand units 91A to 91D, and the injection nozzles 915A to 915D are sprayed toward the outside. .

In addition, in the first hand unit 91A, the injection nozzle 915A is disposed on the -X direction side of the heat sink 914A, and is located in the first hand unit 91B on the +X direction side of the first hand unit 91A, and the injection nozzle is provided. The 915B is disposed on the +X direction side of the heat sink 914B. Further, in the first hand unit 91C, the injection nozzle 915C is disposed on the left side of the heat sink 914C, and is located in the first hand unit 91D on the +X direction side of the first hand unit 91C, and the injection nozzle 915D is disposed on the heat sink 914D + X direction side. Further, a blocking portion 98 that blocks the cooling gas G is disposed between the first hand units 91A and 91C located on the −X direction side and the first hand units 91B and 91D located on the +X direction side.

(recycling robot)

The recovery robot 8 is a robot for transporting the inspected IC device 100 accommodated in the transport hooks 43 and 53 to the recovery tray 3.

Here, in the IC device 100 that has been inspected and stored in the transporting gripper 43 (53), there are defective products that have passed the inspection and defective products that fail the inspection. Therefore, as described above, the good product is housed in one recovery tray 3, and the defective product is accommodated in the other recovery tray 3.

(control device)

The control device 10 includes a drive control unit 102 and an inspection control unit 101. The drive control unit 102 controls, for example, the movement of the supply tray 2, the recovery tray 3, the first transport shuttle 4, and the second transport shuttle 5, or the mechanical drive of the supply robot 7, the collection robot 8, and the inspection robot 9. The inspection control unit 101 performs inspection of the electrical characteristics of the IC device 100 disposed on the inspection socket 6 (inspection individual socket 61) based on a program stored in a memory (not shown). Furthermore, the control unit 918 may be incorporated in the drive control unit 102.

The configuration of the electronic component inspection device 1 has been described above.

In the above description, the configuration of the inspection robot 9 included in the robot is described in the electronic component pressing device of the present invention. The electronic component pressing device of the present invention can also be applied to, for example, an electronic component inspection device 1000 that is operated by hand.

The electronic component inspection apparatus 1000 shown in FIG. 23 includes an inspection socket 1100, a hand unit (electronic component pressing device) 1200, and a lever 1300 of the operating hand unit 1200. The hand unit 1200 and the first hand unit 91 have the same configuration in which the suction device 983 and the switching valve 982 are omitted. Therefore, the detailed description of the hand unit 1200 is omitted.

The electronic component inspection device 1000 is a device that performs inspection of the IC device 100 by hand. Specifically, first, the operator arranges the IC device 100 in the inspection socket 1100. Next, when the operator operates the lever 1300, the hand unit 1200 is lowered to press the IC device 100 against the inspection socket 1100. Next, the IC device 100 is inspected while maintaining the temperature of the IC device 100 at a specific temperature by the hand unit 1200. When the inspection is completed, the operator operates the lever 1300 to raise the hand unit 1200. Then, the IC device 100 that has been inspected is recovered, and the new IC device 100 is placed in the inspection socket 1100.

As described above, the electronic component pressing device, the electronic component pressing unit, the electronic component conveying device, and the electronic component inspection device according to the present invention have been described. However, the present invention is not limited thereto, and the configuration of each component may be replaced by Any constitutor with the same function. Further, in the present invention, any other constituents may be added.

Further, in the above-described embodiment, the configuration in which the gas is used as the fluid ejected from the ejection nozzle has been described. However, the fluid is not limited to the gas, and may be, for example, a mist-like liquid.

In the above embodiment, a total of four first hands including the X direction × the Y direction = 2 × 2 are included. The number of the first unit is not particularly limited, and may be one or two. For example, a total of eight in the X direction × Y direction = 4 × 2 may be arranged. The composition of the 1 hand unit. The same is true for the second hand unit.

9B‧‧‧2nd frame

9C'‧‧‧1st unit support department

9D'‧‧‧ Lifting mechanism

91‧‧‧1st unit

94‧‧‧Swing body

93‧‧‧swing mechanism

95‧‧‧Travel equipment

96‧‧‧ Swim

97‧‧‧ leaf spring

99‧‧‧ Pressure adjustment equipment

100‧‧‧ IC devices

911‧‧‧Base

912‧‧‧Hot Exchange Department

913‧‧‧heater

914‧‧‧ radiator

915‧‧‧jet nozzle

916‧‧‧temperature sensor

917‧‧‧ components

941‧‧‧Swing body

941a‧‧‧ recess

942‧‧‧ Rubber film

943‧‧‧Support components

943a‧‧ Air holes

944‧‧‧Cards

944a‧‧‧ convex

951‧‧‧ steel ball

981‧‧‧ suction hole

985‧‧‧ valve

986‧‧‧ gas cylinder

9121‧‧‧ heater assembly

9121a, 9121b‧‧ hole

9122‧‧‧Contact propeller

9141‧‧‧ Heat sink

9151‧‧‧jet

9152‧‧‧Flow

9161‧‧‧Detection Department

G‧‧‧Gas gas for cooling

S1, S2‧‧‧ space

S3‧‧‧Confined space

Claims (18)

An electronic component pressing device, comprising: a base; a heat exchange unit capable of exchanging heat with an electronic component; and a heat dissipating portion disposed between the base portion and the heat exchange portion and connected to the heat exchange portion; And a fluid ejecting portion that ejects a fluid to the heat dissipating portion. The electronic component pressing device according to claim 1, wherein the fluid ejecting portion diffuses and ejects the fluid when viewed from a direction in which the base portion, the heat dissipating portion, and the heat exchange portion are arranged. The electronic component pressing device according to claim 2, wherein the jet cross-sectional shape of the fluid ejected from the fluid ejecting portion is such that a width of the array direction is shorter than a width of a direction orthogonal to the array direction. The electronic component pressing device according to claim 2, wherein the jet cross-sectional shape of the fluid ejected from the fluid ejecting portion is such that a width of the array direction is equal to a width of a direction orthogonal to the array direction. The electronic component pressing device according to any one of claims 1 to 4, comprising a heating portion that heats the heat exchange portion. The electronic component pressing device of claim 5, wherein the heating portion is embedded in the heat exchange portion. The electronic component pressing device according to any one of claims 1 to 4, wherein a relative positional relationship between the fluid ejecting portion and the heat dissipating portion is fixed even when the electronic component pressing device has moved. The electronic component pressing device of any one of claims 1 to 4, wherein The base portion and the heat exchange portion are connected to each other via a member disposed between the base portion and the heat exchange portion, and the base portion is spaced apart from the heat dissipation portion. The electronic component pressing device of claim 8, wherein the member has heat insulating properties. The electronic component pressing device according to claim 8, wherein the heat dissipating portion is formed with a slit, and at least a part of the member enters the slit. The electronic component pressing device according to any one of claims 1 to 4, wherein the heat dissipating portion includes a fin along a flow direction of the fluid. The electronic component pressing device according to any one of claims 1 to 4, wherein a swinging mechanism for swinging the heat exchange portion is included on a side of the base opposite to the heat exchange portion. The electronic component pressing device according to claim 2, wherein the fluid ejecting portion is disposed in plural, and the fluid is ejected from the fluid ejecting portions in a different direction. The electronic component pressing device according to claim 2, wherein the fluid ejecting portion is disposed in plural, and a direction in which the fluid is ejected from each of the fluid ejecting portions is opposite. An electronic component pressing unit, comprising: a plurality of electronic component pressing devices according to any one of claims 1 to 14, wherein each of the electronic component pressing devices is not sprayed by the fluid ejecting from the fluid ejection portion It is arranged to be guided to the heat radiating portion of the other electronic component pressing device. The electronic component pressing unit of claim 15, wherein one of the adjacent ones of the electronic component pressing devices is The fluid ejecting unit of each of the pair of electronic component pressing devices is disposed between the pair of electronic component pressing devices and arranged in a direction intersecting with an arrangement direction of the pair of electronic component pressing devices. An electronic component conveying apparatus comprising: a base; a heat exchange unit capable of exchanging heat with the electronic component; a holding portion holding the electronic component; and a heat dissipating portion disposed between the base portion and the heat exchange portion And connecting to the heat exchange unit; the fluid ejecting unit ejecting the fluid to the heat dissipating portion; and the moving mechanism moving the electronic component in a specific direction. An electronic component inspection device, comprising: a base; a heat exchange portion that exchanges heat with the electronic component; a holding portion that holds the electronic component; and a heat dissipation portion that is disposed between the base portion and the heat exchange portion And connected to the heat exchange unit; the fluid ejecting unit ejecting a fluid to the heat dissipating portion; the moving mechanism moving the electronic component in a specific direction; and the inspecting unit performing the inspection of the electronic component.