CN111736569A - Fault monitoring method of heat dissipation device, heat dissipation device and electronic equipment - Google Patents
Fault monitoring method of heat dissipation device, heat dissipation device and electronic equipment Download PDFInfo
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- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0208—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the configuration of the monitoring system
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Abstract
The application discloses a fault monitoring method of a heat dissipation device, the heat dissipation device and electronic equipment, and belongs to the technical field of communication. The method comprises the following steps: under the condition that the refrigeration unit works, acquiring the working time length, the first temperature and the second temperature of the refrigeration unit, wherein the working time length is the time from starting to the current moment of the refrigeration unit, the first temperature is the temperature of the hot surface of the refrigeration unit at the current moment, and the second temperature is the temperature of the cold surface of the refrigeration unit at the current moment; when the working duration is long, and the first temperature and the second temperature meet the first preset condition, the heat dissipation device is determined to be in an abnormal working state, so that the fact that the refrigeration unit in the heat dissipation device breaks down can be determined, and the fact that the heat dissipation device does not effectively dissipate heat of the electronic equipment can be determined under the condition that the refrigeration unit in the heat dissipation device breaks down.
Description
Technical Field
The application belongs to the technical field of communication, and particularly relates to a fault monitoring method for a heat dissipation device, the heat dissipation device and electronic equipment.
Background
With the increasing speed of the processor of the electronic device, the electronic device may be applied in a high load scene, for example, a user may perform a large online game, a high definition video call, and the like through the electronic device, and the application in the high load scene may cause the temperature of the electronic device to rapidly rise in a short time. Meanwhile, in order to save the battery charging time of the electronic device, the current for charging the battery is increasingly large, and therefore, the temperature of the electronic device is also rapidly increased during the charging process. When the temperature of the electronic device is high, the service life of the battery is affected, and therefore heat dissipation of the electronic device is required.
In the process of implementing the present application, the inventor finds that at least the following problems exist in the prior art: at present, an external heat dissipation device of an electronic device dissipates heat of the electronic device, the heat dissipation device can effectively dissipate heat of the electronic device when being in a normal working state, and if the heat dissipation device is in an abnormal working state, namely a refrigeration unit in the heat dissipation device is abnormal, the heat dissipation efficiency of the heat dissipation device is affected, however, whether the heat dissipation device is in the abnormal working state cannot be determined at present, so that whether the heat dissipation device effectively dissipates heat of the electronic device cannot be judged.
Content of application
An object of the embodiments of the present application is to provide a fault monitoring method for a heat dissipation device, and an electronic device, so as to solve a problem that whether the heat dissipation device is in an abnormal operating state cannot be determined at present, and thus whether the heat dissipation device can effectively dissipate heat to the electronic device cannot be determined.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a method for monitoring a fault of a heat dissipation apparatus, where the heat dissipation apparatus includes a refrigeration unit for dissipating heat of an electronic device, and the method includes:
under the condition that the refrigeration unit works, acquiring the working time length, the first temperature and the second temperature of the refrigeration unit, wherein the working time length is the time from starting to the current moment of the refrigeration unit, the first temperature is the temperature of the hot surface of the refrigeration unit at the current moment, and the second temperature is the temperature of the cold surface of the refrigeration unit at the current moment;
and under the condition that the working duration, the first temperature and the second temperature meet a first preset condition, determining that the heat dissipation device is in an abnormal working state.
In a second aspect, an embodiment of the present application provides a fault monitoring apparatus for a heat dissipation apparatus, where the heat dissipation apparatus includes a refrigeration unit for dissipating heat from an electronic device, and the heat dissipation apparatus further includes:
the device comprises an acquisition unit, a control unit and a control unit, wherein the acquisition unit is used for acquiring the working time length, the first temperature and the second temperature of the refrigeration unit under the condition that the refrigeration unit works, the working time length is the time from the starting of the refrigeration unit to the current moment, the first temperature is the temperature of the hot surface of the refrigeration unit at the current moment, and the second temperature is the temperature of the cold surface of the refrigeration unit at the current moment;
and the state determining unit is used for determining that the heat dissipation device is in an abnormal working state under the condition that the working duration, the first temperature and the second temperature meet a first preset condition.
In a third aspect, an embodiment of the present application provides an electronic device, which includes a processor, a memory, and a program or instructions stored on the memory and executable on the processor, and when executed by the processor, the program or instructions implement the steps of the method according to the first aspect.
In a fourth aspect, embodiments of the present application provide a readable storage medium, on which a program or instructions are stored, which when executed by a processor implement the steps of the method according to the first aspect.
In a fifth aspect, an embodiment of the present application provides a chip, where the chip includes a processor and a communication interface, where the communication interface is coupled to the processor, and the processor is configured to execute a program or instructions to implement the method according to the first aspect.
In the embodiment of the application, under the condition that the refrigeration unit works, the working duration, the first temperature and the second temperature of the refrigeration unit are obtained, wherein the working duration is the time from the starting of the refrigeration unit to the current moment, the first temperature is the temperature of the hot surface of the refrigeration unit at the current moment, and the second temperature is the temperature of the cold surface of the refrigeration unit at the current moment; when the working duration is long, and the first temperature and the second temperature meet the first preset condition, the heat dissipation device is determined to be in an abnormal working state, so that the fact that the refrigeration unit in the heat dissipation device breaks down can be determined, and the fact that the heat dissipation device does not effectively dissipate heat of the electronic equipment can be determined under the condition that the refrigeration unit in the heat dissipation device breaks down.
Drawings
Fig. 1 is a block diagram illustrating a heat dissipation device according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram illustrating a variation rate of a difference between a first temperature and a second temperature in a normal operating state and an abnormal operating state of a heat dissipation device provided in an embodiment of the present application;
fig. 3 is a schematic diagram of a temperature change rate of a device to be cooled in a normal operating state and an abnormal operating state of a heat dissipation apparatus according to an embodiment of the present application;
FIG. 4 is a flowchart illustrating steps of a method for monitoring a heat dissipation device for faults in accordance with an embodiment of the present disclosure;
fig. 5 is a schematic hardware structure diagram of an electronic device implementing an embodiment of the present application;
fig. 6 is a schematic hardware structure diagram of another electronic device for implementing the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The following describes in detail a fault monitoring method of a heat dissipation apparatus according to an embodiment of the present application with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a block diagram of a heat dissipation apparatus provided in an embodiment of the present application, where the heat dissipation apparatus is disposed in an electronic device or disposed independently of the electronic device, a refrigeration unit in the heat dissipation apparatus is used to dissipate heat of the electronic device, and the electronic device and the heat dissipation apparatus may communicate with each other in a wired or wireless manner. The heat dissipating double-fuselage includes: the control module, first temperature sensing unit, refrigeration unit, second temperature sensing unit, fan, trouble suggestion unit, the refrigeration unit can be the semiconductor refrigeration spare. The control module comprises an acquisition unit and a state determination unit, wherein the first thermosensitive unit can detect a first temperature of a hot surface of the refrigeration unit and convert the first temperature into a first electric signal; and the second temperature sensing unit can detect a second temperature of the cold surface of the refrigeration unit and convert the second temperature into a second electric signal.
The device comprises an acquisition unit, a control unit and a control unit, wherein the acquisition unit is used for acquiring the working time length, the first temperature and the second temperature of the refrigeration unit under the condition that the refrigeration unit works, the working time length is the time from the starting of the refrigeration unit to the current moment, the first temperature is the temperature of the hot surface of the refrigeration unit at the current moment, and the second temperature is the temperature of the cold surface of the refrigeration unit at the current moment;
and the state determining unit is used for determining that the heat dissipation device is in an abnormal working state under the condition that the working duration, the first temperature and the second temperature meet the first preset condition.
In this application, the acquiring unit may acquire the first electric signal from the first thermosensitive unit, acquire the first temperature from the first electric signal, and acquire the second electric signal from the second thermosensitive unit, acquire the second temperature from the second electric signal.
Wherein the first preset condition may include: the working time is less than or equal to a first preset time, and the change rate of the difference value between the first temperature and the second temperature is less than or equal to a first preset change rate. The first preset change rate is determined according to a preset reference temperature difference change rate, and the preset reference temperature difference change rate is the change rate of the temperature difference between the first temperature of the hot surface and the second temperature of the cold surface when the heat dissipation device is in a normal working state. For example, when the product of the preset reference temperature difference change rate and 10% is taken as the first preset change rate, and the preset reference temperature difference change rate is equal to K, the second preset condition is equal to 0.1K.
Referring to fig. 2, fig. 2 is a schematic diagram illustrating a variation rate of a difference between a first temperature and a second temperature of a heat dissipation device in a normal operating state and an abnormal operating state according to an embodiment of the present application, where a vertical axis represents a difference between the first temperature of a hot surface and the second temperature of a cold surface, and a horizontal axis represents time. When the heat dissipation device starts to work and is in a normal working state, the difference value between the corresponding first temperature and the corresponding second temperature is delta T0 (at the moment, T is equal to 0); at time T1, corresponding to a temperature difference Δ T1, a rate of change in the difference between the first temperature of the hot side and the second temperature of the cold side, such as the solid line shown in fig. 2, over a time period between 0 and T1, during which the difference between the first temperature of the hot side and the second temperature of the cold side increases with increasing time; during the time period greater than t1, the difference between the first temperature of the hot side and the second temperature of the cold side approaches a horizontal straight line, i.e., during the time period greater than t1, the difference between the first temperature of the hot side and the second temperature of the cold side is maintained at a substantially constant value.
It should be noted that, the probability of failure of the heat dissipation device is low in the previous use process, and the preset reference temperature difference change rate can be determined according to the relationship between the time change of the difference value between the first temperature of the hot surface and the second temperature of the cold surface in the previous use process. When a refrigeration unit in the heat dissipation device is abnormal, for example, a change rate of a difference value between a first temperature of a hot surface and a second temperature of a cold surface is shown by a dotted line in fig. 2, and as shown in fig. 3, fig. 3 is a schematic diagram of a temperature change rate of a device to be cooled in a normal operating state and an abnormal operating state of the heat dissipation device provided in an embodiment of the present application, a vertical axis represents a temperature of the device to be cooled of the electronic device, a horizontal axis represents time, and a coordinate system of fig. 3 and a coordinate system of fig. 2 are the same coordinate system. A solid line in fig. 3 shows a time-dependent change in temperature of the device to be cooled when the heat sink abnormally operates, and a dotted line in fig. 3 shows a time-dependent change in temperature of the device to be cooled when the heat sink normally operates. In conjunction with the dotted line in fig. 2 and the dotted line in fig. 3, the time inflection point corresponding to the dotted line in fig. 3 is greater than the time inflection point corresponding to the dotted line in fig. 2, and therefore, when an abnormality occurs, the inventors regard the time inflection point corresponding to the dotted line in fig. 2 as a basis for determining the first preset time period. As shown in fig. 2, the time period between 0 and t1 is taken as the first preset time period, so that in the case that the operating time period of the refrigeration unit is less than or equal to the first preset time period, the heat sink is determined to be in the abnormal operating state in the case that the operating time period, the first temperature and the second temperature satisfy the first preset condition, that is, in the case that the operating time period is less than or equal to the first preset time period, and the change rate of the difference value between the first temperature and the second temperature is less than or equal to the first preset change rate, the heat sink is determined to be in the abnormal operating state.
It should be noted that, the process of the heat dissipation device for dissipating heat from the electronic device is as follows: the back of electronic equipment is transmitted to the inside heat of electronic equipment, dispels the heat to electronic equipment's back by the cold side of refrigeration unit, passes to the fan with the heat through the hot side of refrigeration unit, in transmitting the atmosphere with the heat by the air outlet of fan to the realization dispels the heat to electronic equipment. Therefore, when the heat dissipation device fails, that is, when the refrigeration unit in the diffusion device fails, the electronic device cannot be effectively dissipated, and the temperature of the cold surface of the refrigeration unit cannot be lowered, but rather, the temperature of the cold surface rises due to the contact of the cold surface with the back surface of the electronic device, and even the temperature of the cold surface exceeds the temperature of the hot surface, so that the rate of change of the temperature difference corresponding to the failure of the heat dissipation device is, for example, a dotted line shown in fig. 2.
In view of the relationship that the difference between the first temperature of the hot side of the refrigeration unit and the second temperature of the cold side of the refrigeration unit changes with time (shown by a solid line in fig. 2) when the heat dissipation apparatus is in a normal operating state, in an actual application process of the heat dissipation apparatus, it can be determined whether the heat dissipation apparatus is in an abnormal operating state according to the change rate of the difference between the first temperature of the hot side of the refrigeration unit and the second temperature of the cold side of the refrigeration unit within a first time period.
Therefore, in the application, the heat dissipation device is determined to be in the abnormal working state under the condition that the working duration, the first temperature and the second temperature meet the first preset condition, so that the refrigeration unit in the heat dissipation device can be determined to be in a fault, and the problem that whether the heat dissipation device is in the abnormal working state currently or not in the prior art is solved. Also, through the heat dissipation device provided by the application, whether the heat dissipation device effectively dissipates heat of the electronic equipment can be judged.
Optionally, the state determining unit is specifically configured to determine that the heat dissipation device is in an abnormal operating state when the operating duration, the first temperature, and the second temperature satisfy a first preset condition, and the third temperature satisfies a second preset condition,
the third temperature is the temperature of a device to be cooled at the current moment, the cooling unit dissipates heat of the device to be cooled of the electronic equipment, and the second preset condition includes that the change rate of the third temperature is greater than the second preset change rate.
As shown in fig. 3, in the event of a failure of the heat dissipation device, the temperature change rate of the device to be cooled of the electronic device is higher than the temperature change rate of the heat dissipation device during normal operation. Therefore, in order to prevent the problem that when the first thermosensitive unit and/or the second thermosensitive unit is/are failed, the detected temperature error is large, and thus misjudgment is caused (that is, in the case that the heat sink is not abnormal, the heat sink is judged to be abnormal). In order to improve the accuracy of the judgment result, that is, to more accurately judge whether the heat dissipation device is currently in the abnormal working state, the working duration, the first temperature and the second temperature meet the first preset condition, and the third temperature meets the second preset condition, the heat dissipation device is determined to be in the abnormal working state, that is, the temperature change rate of the third temperature of the to-be-cooled device of the electronic equipment is obtained from the electronic equipment under the condition that the working duration, the first temperature and the second temperature meet the first preset condition, and the heat dissipation device is determined to be currently in the abnormal working state under the condition that the change rate of the third temperature is greater than the second preset change rate. Namely, the temperature difference change rate and the current temperature change rate of the to-be-cooled device of the electronic equipment are considered at the same time, so that whether the heat dissipation device is in an abnormal working state or not is judged, and the accuracy of a judgment result is improved.
The second preset change rate may be equal to a preset multiple multiplied by a preset reference temperature change rate, that is, when the working length, the first temperature and the second temperature satisfy the first preset condition, and the change rate of the third temperature is greater than a product of the preset multiple and the preset reference temperature change rate, it is determined whether the heat dissipation device is in an abnormal working state. Referring to fig. 3, the preset reference temperature change rate is as shown by a solid line in fig. 3, and within a first preset time period or less, if the heat dissipation device is in an abnormal operating state, the change rate of the temperature of the device to be cooled of the electronic device is higher than the change rate of the temperature of the device to be cooled when the heat dissipation device is in a normal operating state, so that when the operating time period is not greater than the first preset time period and the heat dissipation device is in the normal operating state, the change rate of the temperature of the device to be cooled is taken as the preset reference temperature change rate. For example, when the preset multiple is equal to 1, that is, the second preset condition includes that the change rate of the third temperature is greater than the preset reference temperature change rate.
Optionally, the first preset condition includes:
the working time is longer than a first preset time, and the difference value between the first temperature and the second temperature is smaller than or equal to a preset value.
For example, referring to fig. 2, if the heat dissipation device is in an abnormal operating state when the operation time is longer than the first preset time period, in this case, a difference between a first temperature of a hot surface of the refrigeration unit and a second temperature of a cold surface of the refrigeration unit is almost changed, and therefore, if the operation time is longer than the first preset time period, and if the difference between the first temperature and the second temperature is less than or equal to a preset value, it may be determined that the heat dissipation device is in the abnormal operating state, that is, if the operation time is longer than the first preset time period, and the difference between the first temperature and the second temperature is less than or equal to the preset value, it may be determined that the heat dissipation device is in the abnormal operating state.
The preset value may be determined according to a difference between a first temperature of the hot side of the refrigeration unit and a second temperature of the cold side of the refrigeration unit in a time period longer than a first preset time period when the heat dissipation device is in a normal working state, for example, 30% of the difference is used as the preset value.
The state determining unit is specifically configured to determine that the heat dissipation device is in an abnormal working state under the condition that the working length, the first temperature and the second temperature meet a first preset condition, and the temperature change rate meets a third preset condition, where the temperature change rate is a change rate of the temperature of the device to be cooled at the current moment, and the third preset condition includes that the temperature change rate is greater than the third preset change rate; alternatively, the first and second electrodes may be,
and under the conditions that the working duration, the first temperature and the second temperature meet a first preset condition and the fourth temperature meets a fourth preset condition, determining that the heat dissipation device is in an abnormal working state, wherein the fourth temperature is the temperature of the device to be cooled at the current moment, and the fourth preset condition comprises that the fourth temperature is higher than the preset temperature.
In this embodiment, referring to fig. 2 and 3, in a time period greater than t1 and less than or equal to t2, it may be determined that the heat dissipation device is in an abnormal operating state when a difference between the first temperature and the second temperature is less than or equal to a preset value, and a temperature change rate of the device to be cooled is greater than a third preset change rate.
In a time period longer than t2 when the operation is performed, it may be determined that the heat dissipation device is in an abnormal operation state when a difference between the first temperature and the second temperature is less than or equal to a preset value and the fourth temperature is greater than the preset temperature.
The third preset rate of change may be determined according to a rate of change of the temperature of the device to be cooled shown by a solid line in fig. 3, for example, the rate of change of the temperature of the device to be cooled shown by a solid line in fig. 3 (that is, a slope when a slope of a curve in fig. 3 is not equal to 0 is taken as the third preset rate of change), that is, the heat dissipation apparatus is determined to be in an abnormal operating state in a time period greater than t1 and less than or equal to t2, while taking into consideration a temperature difference between the hot surface and the cold surface and a temperature rate of change of the device to be cooled.
And determining that the heat dissipation device is in an abnormal working state in a time period of which the working length is greater than t2 and simultaneously considering the temperature difference between the hot surface and the cold surface and the temperature of the device to be dissipated.
In this embodiment, the temperature difference between the hot surface and the cold surface and the temperature change rate of the device to be cooled are considered at the same time, or the temperature difference between the hot surface and the cold surface and the temperature of the device to be cooled are considered at the same time, and it is determined that the heat dissipation device is in the abnormal working state, so that the accuracy of the determination result can be further improved.
Alternatively, referring to fig. 1, the state determination unit specifically includes a counting subunit and a determination subunit,
the counting subunit is used for accumulating the counting times by 1 to obtain new counting times under the condition that the working length, the first temperature and the second temperature meet a first preset condition, wherein the initial value of the counting times is equal to zero;
and the determining subunit is used for determining that the heat dissipation device is in an abnormal working state under the condition that the new counting number is greater than the preset counting number, wherein the preset counting number is greater than 1. .
In this embodiment, in order to further ensure the accuracy of the determination result, the counted times are accumulated by 1 to obtain new counted times under the condition that the working duration and the first temperature and the second temperature meet the first preset condition. If the new statistical frequency is not equal to the preset statistical frequency, repeatedly judging whether the working time length, the first temperature and the second temperature meet the first preset condition, continuously accumulating the current statistical frequency by 1 to obtain the new statistical frequency under the condition that the working time length, the first temperature and the second temperature meet the first preset condition, and if the new statistical frequency is greater than the preset statistical frequency, determining that the heat dissipation device is in an abnormal working state.
Optionally, referring to fig. 1, the heat dissipation device further includes:
the stopping unit is used for controlling the refrigeration unit to stop working;
and the sending unit is used for sending prompt information to the electronic equipment or sending prompt information to the heat dissipation device, wherein the prompt information is used for indicating that the heat dissipation device fails.
Wherein the stopping unit and the sending unit may be included in the control module shown in fig. 1.
In this embodiment, when it is determined that the heat dissipation device is currently in an abnormal operating state, the stop unit controls the heat dissipation device to stop operating (for example, controls the refrigeration unit to stop operating, and controls the first thermosensitive unit and the second thermosensitive unit to stop operating), and the sending unit sends a prompt message to the electronic device, so that the electronic device displays and/or plays the prompt message in a voice mode, where the prompt message is used to indicate that the heat dissipation device has failed, so as to avoid a safety accident caused by the fact that the heat dissipation device is still in an operating state when the heat dissipation device fails. And the sending unit sends prompt information to the electronic equipment, and the prompt information is displayed and/or played in voice on the electronic equipment, so that a user can find the problem that the heat dissipation device fails in time, a new heat dissipation device can be replaced in time, and effective heat dissipation of the electronic equipment is guaranteed.
It should be noted that the sending unit may also send a prompt message to a fault prompting unit in the heat sink, so that the fault prompting unit plays the prompt message in voice, thereby prompting the user that the heat sink is faulty.
Based on fig. 1, the present application provides a fault monitoring method for a heat dissipation device. Referring to fig. 4, fig. 4 is a flowchart illustrating steps of a method for monitoring a fault of a heat dissipation device provided in an embodiment of the present application, where the method may be applied to the heat dissipation device shown in fig. 1 or an electronic device. The method may comprise the steps of:
It should be noted that when the method is applied to an electronic device, as shown in fig. 1, the electronic device may obtain the operating time, the first temperature, and the second temperature of the refrigeration unit through communication interaction with a control module in the heat dissipation device, so that the heat dissipation device is determined to be in an abnormal operating state under the condition that the operating time, the first temperature, and the second temperature satisfy a first preset condition.
In the method for monitoring the fault of the heat dissipation device provided by this embodiment, under the condition that the refrigeration unit works, the working duration, the first temperature and the second temperature of the refrigeration unit are obtained, where the working duration is the time elapsed from the start of the refrigeration unit to the current time, the first temperature is the temperature of the hot side of the refrigeration unit at the current time, and the second temperature is the temperature of the cold side of the refrigeration unit at the current time; and under the conditions that the working duration is long, and the first temperature and the second temperature meet the first preset condition, determining that the heat dissipation device is in an abnormal working state, so that the fault of a refrigeration unit in the heat dissipation device can be determined.
Optionally, the first preset condition includes:
the working time is less than or equal to a first preset time, and the change rate of the difference value between the first temperature and the second temperature is less than or equal to a first preset change rate.
Optionally, determining that the heat dissipation device is in an abnormal working state under the condition that the working duration, the first temperature and the second temperature meet a first preset condition, includes:
when the working time, the first temperature and the second temperature meet the first preset condition, and the third temperature meets the second preset condition, the heat dissipation device is determined to be in an abnormal working state,
the third temperature is the temperature of a device to be cooled at the current moment, the cooling unit dissipates heat of the device to be cooled of the electronic equipment, and the second preset condition includes that the change rate of the third temperature is greater than the second preset change rate.
As shown in fig. 3, in the event of a failure of the heat dissipation device, the temperature change rate of the device to be cooled of the electronic device is higher than the temperature change rate of the heat dissipation device during normal operation. Therefore, in order to prevent the problem that when the first thermosensitive unit and/or the second thermosensitive unit is/are failed, the detected temperature error is large, and thus misjudgment is caused (that is, in the case that the heat sink is not abnormal, the heat sink is judged to be abnormal). In order to improve the accuracy of the judgment result, that is, to more accurately judge whether the heat dissipation device is currently in the abnormal working state, the working duration, the first temperature and the second temperature meet the first preset condition, and the third temperature meets the second preset condition, the heat dissipation device is determined to be in the abnormal working state, that is, the temperature change rate of the third temperature of the to-be-cooled device of the electronic equipment is obtained from the electronic equipment under the condition that the working duration, the first temperature and the second temperature meet the first preset condition, and the heat dissipation device is determined to be currently in the abnormal working state under the condition that the change rate of the third temperature is greater than the second preset change rate. Namely, the temperature difference change rate and the current temperature change rate of the to-be-cooled device of the electronic equipment are considered at the same time, so that whether the heat dissipation device is in an abnormal working state or not is judged, and the accuracy of a judgment result is improved.
Optionally, the first preset condition includes:
the working time is longer than a first preset time, and the difference value between the first temperature and the second temperature is smaller than or equal to a preset value.
Optionally, determining that the heat dissipation device is in an abnormal working state under the condition that the working duration, the first temperature and the second temperature meet a first preset condition, includes:
under the condition that the working duration, the first temperature and the second temperature meet a first preset condition and the temperature change rate meets a third preset condition, determining that the heat dissipation device is in an abnormal working state, wherein the temperature change rate is the change rate of the temperature of a device to be refrigerated at the current moment, and the third preset condition comprises that the temperature change rate is greater than the third preset change rate; alternatively, the first and second electrodes may be,
and under the conditions that the working duration, the first temperature and the second temperature meet a first preset condition and the fourth temperature meets a fourth preset condition, determining that the heat dissipation device is in an abnormal working state, wherein the fourth temperature is the temperature of the device to be cooled at the current moment, and the fourth preset condition comprises that the fourth temperature is higher than the preset temperature.
The third preset rate of change may be determined according to a rate of change of the temperature of the device to be cooled shown by a solid line in fig. 3, for example, the rate of change of the temperature of the device to be cooled shown by a solid line in fig. 3 (that is, a slope when a slope of a curve in fig. 3 is not equal to 0 is taken as the third preset rate of change), that is, the heat dissipation apparatus is determined to be in an abnormal operating state in a time period greater than t1 and less than or equal to t2, while taking into consideration a temperature difference between the hot surface and the cold surface and a temperature rate of change of the device to be cooled.
And determining that the heat dissipation device is in an abnormal working state in a time period of which the working length is greater than t2 and simultaneously considering the temperature difference between the hot surface and the cold surface and the temperature of the device to be dissipated.
In this embodiment, the temperature difference between the hot surface and the cold surface and the temperature change rate of the device to be cooled are considered at the same time, or the temperature difference between the hot surface and the cold surface and the temperature of the device to be cooled are considered at the same time, and it is determined that the heat dissipation device is in the abnormal working state, so that the accuracy of the determination result can be further improved.
Optionally, determining that the heat dissipation device is in an abnormal working state under the condition that the working duration, the first temperature and the second temperature meet a first preset condition, includes:
under the condition that the working duration, the first temperature and the second temperature meet a first preset condition, accumulating the counting times by 1 to obtain new counting times, wherein the initial value of the counting times is equal to zero;
determining that the heat dissipation device is in an abnormal working state, including:
and under the condition that the new counting number is greater than the preset counting number, determining that the heat dissipation device is in an abnormal working state, wherein the preset counting number is greater than 1.
Optionally, after determining that the heat dissipation device is in an abnormal operating state, the method further includes:
and controlling the refrigeration unit to stop working, and sending prompt information to the electronic equipment or sending prompt information to the heat dissipation device, wherein the prompt information is used for indicating that the refrigeration unit breaks down.
The fault monitoring device of the heat dissipation device in the embodiment of the present application may be a device, or may be a component, an integrated circuit, or a chip in a terminal. The device can be mobile electronic equipment or non-mobile electronic equipment. By way of example, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm top computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and the non-mobile electronic device may be a server, a Network Attached Storage (NAS), a Personal Computer (PC), a Television (TV), a teller machine or a self-service machine, and the like, and the embodiments of the present application are not particularly limited.
The fault monitoring device of the heat dissipation device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android (Android) operating system, an ios operating system, or other possible operating systems, and embodiments of the present application are not limited specifically.
The fault monitoring device for the heat dissipation device provided in the embodiment of the present application can implement each process implemented by the fault monitoring device for the heat dissipation device in the method embodiment of fig. 4, and is not described here again to avoid repetition.
Optionally, an electronic device is further provided in an embodiment of the present application, as shown in fig. 5, fig. 5 is a schematic diagram of a hardware structure of an electronic device implementing the embodiment of the present application. The electronic device 500 includes a processor 501, a memory 502, and a program or an instruction stored in the memory 502 and executable on the processor 501, where the program or the instruction implements the processes of the exposure adjustment method embodiment when executed by the processor 501, and can achieve the same technical effects, and the details are not repeated here to avoid repetition.
It should be noted that the electronic devices in the embodiments of the present application include the mobile electronic devices and the non-mobile electronic devices described above.
Fig. 6 is a schematic hardware structure diagram of another electronic device for implementing the embodiment of the present application.
The electronic device 600 includes, but is not limited to: a radio frequency unit 601, a network module 602, an audio output unit 603, an input unit 604, a sensor 605, a display unit 606, a user input unit 607, an interface unit 608, a memory 609, a processor 610, and the like.
Those skilled in the art will appreciate that the electronic device 600 may further comprise a power source (e.g., a battery) for supplying power to the various components, and the power source may be logically connected to the processor 610 through a power management system, so as to implement functions of managing charging, discharging, and power consumption through the power management system. The electronic device structure shown in fig. 6 does not constitute a limitation of the electronic device, and the electronic device may include more or less components than those shown, or combine some components, or arrange different components, and thus, the description is omitted here.
The processor 610 is configured to, when the refrigeration unit operates, obtain an operating time length of the refrigeration unit, a first temperature and a second temperature, where the operating time length is an elapsed time from starting the refrigeration unit to a current time, the first temperature is a temperature of a hot side of the refrigeration unit at the current time, and the second temperature is a temperature of a cold side of the refrigeration unit at the current time;
and determining that the heat dissipation device is in an abnormal working state under the condition that the working duration, the first temperature and the second temperature meet a first preset condition.
Under the condition that the refrigeration unit works, acquiring the working time length, the first temperature and the second temperature of the refrigeration unit, wherein the working time length is the time from starting to the current moment of the refrigeration unit, the first temperature is the temperature of the hot surface of the refrigeration unit at the current moment, and the second temperature is the temperature of the cold surface of the refrigeration unit at the current moment; and determining that the heat dissipation device is in an abnormal working state under the condition that the working duration, the first temperature and the second temperature meet a first preset condition. That is, the method provided in this embodiment may determine that the refrigeration unit in the heat dissipation device is faulty.
The first preset condition includes:
the working time is less than or equal to a first preset time, and the change rate of the difference value between the first temperature and the second temperature is less than or equal to a first preset change rate.
The processor 610 is further configured to determine that the heat dissipation device is in an abnormal operating state when the operating duration, the first temperature and the second temperature satisfy a first preset condition, and the third temperature satisfies a second preset condition,
the third temperature is the temperature of a device to be cooled at the current moment, the cooling unit dissipates heat of the device to be cooled of the electronic equipment, and the second preset condition includes that the change rate of the third temperature is greater than the second preset change rate.
Under the condition that the heat dissipation device breaks down, the temperature change rate of a to-be-cooled device of the electronic equipment is higher than that of the heat dissipation device in normal work. Therefore, in order to prevent the problem that when the first thermosensitive unit and/or the second thermosensitive unit is/are failed, the detected temperature error is large, and thus misjudgment is caused (that is, in the case that the heat sink is not abnormal, the heat sink is judged to be abnormal). In order to improve the accuracy of the judgment result, that is, to more accurately judge whether the heat dissipation device is currently in the abnormal working state, the working duration, the first temperature and the second temperature meet the first preset condition, and the third temperature meets the second preset condition, the heat dissipation device is determined to be in the abnormal working state, that is, the temperature change rate of the third temperature of the to-be-cooled device of the electronic equipment is obtained from the electronic equipment under the condition that the working duration, the first temperature and the second temperature meet the first preset condition, and the heat dissipation device is determined to be currently in the abnormal working state under the condition that the change rate of the third temperature is greater than the second preset change rate. Namely, the temperature difference change rate and the current temperature change rate of the to-be-cooled device of the electronic equipment are considered at the same time, so that whether the heat dissipation device is in an abnormal working state or not is judged, and the accuracy of a judgment result is improved.
The first preset condition includes:
the working time is longer than a first preset time, and the difference value between the first temperature and the second temperature is smaller than or equal to a preset value.
The processor 610 is further configured to determine that the heat dissipation device is in an abnormal working state under the condition that the working length, the first temperature and the second temperature meet a first preset condition, and the temperature change rate meets a third preset condition, where the temperature change rate is a change rate of the temperature of the device to be cooled at the current moment, and the third preset condition includes that the temperature change rate is greater than the third preset change rate; alternatively, the first and second electrodes may be,
and under the conditions that the working duration, the first temperature and the second temperature meet a first preset condition and the fourth temperature meets a fourth preset condition, determining that the heat dissipation device is in an abnormal working state, wherein the fourth temperature is the temperature of the device to be cooled at the current moment, and the fourth preset condition comprises that the fourth temperature is higher than the preset temperature.
The processor 610 is further configured to, when the working duration and the first temperature and the second temperature meet a first preset condition, add 1 to the counted number to obtain a new counted number, where an initial value of the counted number is equal to zero;
and under the condition that the new counting number is greater than the preset counting number, determining that the heat dissipation device is in an abnormal working state, wherein the preset counting number is greater than 1.
The processor 610 is further configured to control the refrigeration unit to stop working, and send a prompt message to the electronic device or send a prompt message to the heat dissipation device, where the prompt message is used to indicate that the refrigeration unit fails.
The embodiment of the present application further provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or the instruction is executed by a processor, the process of the embodiment of the fault monitoring method for a heat dissipation device is implemented, and the same technical effect can be achieved, and in order to avoid repetition, details are not repeated here.
The processor is the processor in the electronic device in the above embodiment. Readable storage media, including computer-readable storage media, such as Read-Only Memory (ROM), random-access Memory (RAM), magnetic or optical disks, etc.
It should be understood that in the embodiment of the present application, the input Unit 604 may include a Graphics Processing Unit (GPU) 6041 and a microphone 6042, and the graphics processing Unit 6041 processes image data of a still picture or a video obtained by an image capturing apparatus (such as a camera) in a video capturing mode or an image capturing mode. The display unit 606 may include a display panel 6061, and the display panel 6061 may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like. The user input unit 607 includes a touch panel 6071 and other input devices 6072. A touch panel 6071, also referred to as a touch screen. The touch panel 6071 may include two parts of a touch detection device and a touch controller. Other input devices 6072 may include, but are not limited to, a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which are not described in detail herein. The memory 609 may be used to store software programs as well as various data including, but not limited to, application programs and an operating system. The processor 610 may integrate an application processor, which primarily handles operating systems, user interfaces, applications, etc., and a modem processor, which primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 610.
The embodiment of the present application further provides a chip, where the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is configured to execute a program or an instruction to implement each process of the above-mentioned fault monitoring method for a heat dissipation device, and can achieve the same technical effect, and the details are not repeated here to avoid repetition.
It should be understood that the chips mentioned in the embodiments of the present application may also be referred to as system-on-chip, system-on-chip or system-on-chip, etc.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present application.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (15)
1. A method of fault monitoring of a heat sink, the heat sink including a refrigeration unit for dissipating heat from an electronic device, the method comprising:
under the condition that the refrigeration unit works, acquiring the working time length, the first temperature and the second temperature of the refrigeration unit, wherein the working time length is the time from starting to the current moment of the refrigeration unit, the first temperature is the temperature of the hot surface of the refrigeration unit at the current moment, and the second temperature is the temperature of the cold surface of the refrigeration unit at the current moment;
and under the condition that the working duration, the first temperature and the second temperature meet a first preset condition, determining that the heat dissipation device is in an abnormal working state.
2. The method according to claim 1, wherein the first preset condition comprises:
the working time is less than or equal to a first preset time, and the change rate of the difference value between the first temperature and the second temperature is less than or equal to a first preset change rate.
3. The method of claim 2, wherein determining that the heat sink is in an abnormal operating state in the case that the operating duration, the first temperature, and the second temperature satisfy a first preset condition comprises:
determining that the heat dissipation device is in an abnormal working state under the condition that the working duration, the first temperature and the second temperature meet the first preset condition and the third temperature meets the second preset condition,
the third temperature is the temperature of a device to be cooled at the current moment, the cooling unit dissipates heat of the device to be cooled of the electronic equipment, and the second preset condition includes that the change rate of the third temperature is greater than a second preset change rate.
4. The method according to claim 1, wherein the first preset condition comprises:
the working time is longer than a first preset time, and the difference value between the first temperature and the second temperature is smaller than or equal to a preset value.
5. The method of claim 4, wherein determining that the heat sink is in an abnormal operating state in the case that the operating duration, the first temperature, and the second temperature satisfy a first preset condition comprises:
determining that the heat dissipation device is in an abnormal working state under the condition that the working duration, the first temperature and the second temperature meet the first preset condition and the temperature change rate meets a third preset condition, wherein the temperature change rate is the change rate of the temperature of a device to be refrigerated at the current moment, and the third preset condition comprises that the temperature change rate is greater than a third preset change rate; alternatively, the first and second electrodes may be,
and under the condition that the working duration, the first temperature and the second temperature meet the first preset condition and the fourth temperature meets the fourth preset condition, determining that the heat dissipation device is in an abnormal working state, wherein the fourth temperature is the temperature of a device to be cooled at the current moment, and the fourth preset condition comprises that the fourth temperature is higher than the preset temperature.
6. The method according to claim 1, wherein the determining that the heat dissipation device is in an abnormal operating state in the case that the operating duration, the first temperature and the second temperature satisfy a first preset condition comprises:
under the condition that the working duration, the first temperature and the second temperature meet a first preset condition, accumulating the counting times by 1 to obtain new counting times, wherein the initial value of the counting times is equal to zero;
the determining that the heat dissipation device is in an abnormal working state includes:
and under the condition that the new counting number is greater than the preset counting number, determining that the heat dissipation device is in an abnormal working state, wherein the preset counting number is greater than 1.
7. The method of claim 1, further comprising, after said determining that said heat sink is in an abnormal operating state:
and controlling the refrigeration unit to stop working, and sending prompt information to the electronic equipment or sending the prompt information to the heat dissipation device, wherein the prompt information is used for indicating that the refrigeration unit breaks down.
8. A heat dissipation device, comprising a refrigeration unit for dissipating heat from an electronic device, the heat dissipation device further comprising:
the device comprises an acquisition unit, a control unit and a control unit, wherein the acquisition unit is used for acquiring the working time length, the first temperature and the second temperature of the refrigeration unit under the condition that the refrigeration unit works, the working time length is the time from the starting of the refrigeration unit to the current moment, the first temperature is the temperature of the hot surface of the refrigeration unit at the current moment, and the second temperature is the temperature of the cold surface of the refrigeration unit at the current moment;
and the state determining unit is used for determining that the heat dissipation device is in an abnormal working state under the condition that the working duration, the first temperature and the second temperature meet a first preset condition.
9. The apparatus of claim 8, wherein the first preset condition comprises:
the working time is less than or equal to a first preset time, and the change rate of the difference value between the first temperature and the second temperature is less than or equal to a first preset change rate.
10. The device according to claim 9, wherein the state determination unit is specifically configured to determine that the heat dissipation device is in an abnormal operating state when the operating duration, the first temperature, and the second temperature satisfy the first preset condition, and a third temperature satisfies a second preset condition,
the third temperature is the temperature of a device to be cooled at the current moment, the cooling unit dissipates heat of the device to be cooled of the electronic equipment, and the second preset condition includes that the change rate of the third temperature is greater than a second preset change rate.
11. The apparatus of claim 8, wherein the first preset condition comprises:
the working time is longer than a first preset time, and the difference value between the first temperature and the second temperature is smaller than or equal to a preset value.
12. The apparatus according to claim 11, wherein the state determining unit is specifically configured to determine that the heat dissipating apparatus is in an abnormal operating state when the operating duration, the first temperature, and the second temperature satisfy the first preset condition, and a temperature change rate satisfies a third preset condition, where the temperature change rate is a change rate of a temperature of a device to be cooled at a current time, and the third preset condition includes that the temperature change rate is greater than a third preset change rate; alternatively, the first and second electrodes may be,
and under the condition that the working duration, the first temperature and the second temperature meet the first preset condition and the fourth temperature meets the fourth preset condition, determining that the heat dissipation device is in an abnormal working state, wherein the fourth temperature is the temperature of a device to be cooled at the current moment, and the fourth preset condition comprises that the fourth temperature is higher than the preset temperature.
13. The apparatus according to claim 8, wherein the state determination unit comprises in particular a counting subunit and a determining subunit,
the counting subunit is configured to, when the working duration, the first temperature, and the second temperature satisfy a first preset condition, add 1 to the counted number of times to obtain a new counted number of times, where an initial value of the counted number of times is equal to zero;
the determining subunit is configured to determine that the heat dissipation device is in an abnormal working state when the new statistical number is greater than a preset statistical number, where the preset statistical number is greater than 1.
14. The apparatus of claim 8, further comprising:
the stopping unit is used for controlling the refrigeration unit to stop working;
and the sending unit is used for sending prompt information to the electronic equipment or sending the prompt information to the heat dissipation device, wherein the prompt information is used for indicating that the heat dissipation device fails.
15. An electronic device, comprising: memory, a processor and a computer program stored on the memory and executable on the processor, the computer program, when executed by the processor, implementing the steps of the method of fault monitoring of a heat sink according to any of claims 1 to 7.
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Application publication date: 20201002 |