200918916 九、發明說明： 【發明所屬之技術領域】 本發明尤指其提供一種於電子元件執 將其所產生之自熱作有效的冷熱交換 電可 業保持於預設的檢測溫度範_，進而件之檢測作 機墨接機狀致冷溫控裝置。 敎率之檢測 【先前技術】 了確=:ί件序:因此為 =業檢測電子元件於製作過^中，是否遭受損ί仃ϊϊί 的電子元件因本身功能有限，其於 i 爾測溫度範圍;然而隨著科技的ί步，ϊ mi的產？自熱’進而超出預設的檢測溫度範圍，因此】須 =測機之下壓治具上裝設冷熱錢器，謂電子树執行ίί 作業所產生之自齡冷熱交換，而使制作業 測溫度範圍内。 卞行κ頂《又的私 請參閱第1圖，其係本申請人先前申請之台灣發 95103072號『檢測機壓接機構之致冷裝置專 機壓接機構之顯機射〇之下歸！以端裝設下=== ，並於該下壓治具12内裝設有一致冷晶片13，致冷、 之吸^接於下壓治具i 2 ’而放熱端則具有散熱裝置 料3 ^致冷晶片1 3其P型與N型之電熱半導體材 枓1 3 1 1 3 2主要係鉍（BiSmuth)碲（Telluric)合金，雷 熱半導體材料131、13 2-端以銅質電極13 3銲接連結一 體’另知則分別以銅質電極13 4、13 5連結於直流電源之正、 負極，另具備絕緣性與導熱性之陶瓷基板2 3 6、丄3 7則分別 200918916 設於上、下方，而於直流電源通電時，電流由p型雷 料i 3 i流人㈣綱料i 3 2時，材 而於下方吸熱端產生冷卻面，上方則為放熱端，為了增加放熱端 之散熱能力，另於放熱端之上方裝設散熱裝置丄4，藉由致^晶 片13通電所產生的冷卻面，即可與熱源進行冷熱交換。反之， 若電流由N型電熱半導體材料i 32流入p型半&體材料丄3工 時，於下方為放熱端，上方則為吸熱端產生冷卻面，亦即電流方 向相反時’放熱端與吸熱端為相反倒置。 …前述，致冷裝獅可與電子元件執行檢_業職生之自熱 冷二以使電子元件的檢測能保持於預設的檢測溫度k 讀電子讀技躺發展，檢獅業之檢測溫度範圍將 會被要求的更加精軸制贿小之範_，贿酬作 =之準，度，而前述之致冷裝置因無法即時有效的^ 檢測溫度細精準控繼較小之範_，所以仍必須加以=|， 有ίΐί此·!本發明人遂以其多年從事相㈣行業的研發與製作 經驗’針對目前所面臨之問題深人研究，^ ，’終究研創出一種致冷溫控裝置，以使電 =於較小之範圍内，此即為本發明之設計宗旨双。又 置，提供—種檢峨顯麟之致冷溫控裝 晶片，並θ 其中’下壓治具_係裝設有致冷 ===出功率‘；：壓= 生之自熱作冷埶交ί 電子元件執行檢測作業所產 、 糟由値控裝置可使檢測作業即時精準控 ^丁運异_並傳輸控制訊號至電源供應器，而由電源 200918916 制於較小的檢測溫度範圍内，進而更加確保產品的檢測良率。 本發明之另一目的係提供一種檢測機壓接機構之致冷溫控裝 置，其中，該致冷溫控裝置係可同時應用於檢測機之多組壓接機 構上，而於各下壓治具組之端部分別裝設感溫器，各感溫器並可 將各電子元件之溫度訊號傳輸至控制單元，控制單元&接^各溫 度訊號後即與資料庫進行運算比對’並傳輸控制訊號至各電源^ 應器，而各別由電源供應器控制各致冷晶片之輸出功率，進而使 多組之檢測作業均可即時精準控制於較小的檢測溫度 同時確保產品的檢測良率。 【實施方式】 為使貴審查委員對本發明有進一步之深入瞭解 較佳實施例，並配合圖式說明如后： 牛 源弓區係於壓接機構2 Q上設有—可由驅動 壓工===== ΐ 致冷晶片2 3之下方吸熱=二 之上方裝=裝3 另於放熱端 *，即可與熱源進行冷熱交產生的冷卻 ，轉換益2 6，訊號轉換器2 6再連结:運：至外#之 =2 7係可與資料庫進行運算 "制 曰2 8，該電源供應器2 8係可控制輸出至供；器 董，而調整控制致冷晶片2 s^^致冷日日片2 3之電流200918916 IX. Description of the invention: [Technical field to which the invention pertains] The present invention particularly provides a method for maintaining the temperature of the hot and cold exchange that is effective for the self-heating of the electronic component to be maintained at a preset detection temperature range. The detection of the piece is used as a machine-cooled temperature control device. Detection of defect rate [previous technique] Exact =: 件 order: Therefore, the electronic component of the industry's detection electronic component is damaged. The electronic component is limited in its own function, and its temperature range is measured. However, with the advancement of technology, what is the production of mi? Self-heating 'and beyond the preset detection temperature range, therefore】 must be installed under the measuring machine, the hot and cold money device is installed on the fixture, that is, the electronic tree performs the self-age cold and heat exchange generated by the operation, and the temperature is measured. Within the scope. Please refer to Figure 1 for the private part of the κ κ , 其 其 , 95 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 103 The lower pressing fixture 13 is provided with a uniform cold chip 13 in the lower pressing fixture 12, and the cooling device is connected to the lower pressing fixture i 2 ', and the heat releasing end has a heat dissipating device material 3 ^Cold wafer 13 3 P-type and N-type electrothermal semiconductor material 枓1 3 1 1 3 2 Mainly BiSmuth T (Telluric) alloy, Thunder semiconductor material 131, 13 2-terminal with copper electrode 13 3 solder joints are integrated. In other words, the copper electrodes 13 4 and 13 5 are respectively connected to the positive and negative electrodes of the DC power source, and the ceramic substrates 2 3 6 and 丄 3 7 having insulating and thermal conductivity are respectively placed on the top, 200918916. Below, when the DC power is energized, the current is flown by the p-type mine i 3 i (4), when the material is i 3 2, the material generates a cooling surface at the lower end of the heat absorption end, and the upper side is the heat release end, in order to increase the heat dissipation of the heat release end. The heat sink 丄4 is installed above the heat release end, and the cooling surface generated by the energization of the wafer 13 can be exchanged with the heat source. On the other hand, if the current flows from the N-type electrothermal semiconductor material i 32 into the p-type half & body material 丄3 working time, the lower side is the heat releasing end, and the upper side is the heat absorbing end generating the cooling surface, that is, when the current direction is opposite, the radiating end is The endothermic end is reversed. ...the aforementioned, the cold-loading lion can perform inspection with the electronic components _ self-heating cold of the professional students to enable the detection of electronic components to maintain the preset detection temperature k read electronic reading technology development, inspection of the lion industry detection temperature The scope will be required to be more precise, and the bribe will be the standard, and the aforementioned cooling device will not be able to be effective immediately. Still have to be =|, there are ίΐί this! The inventor has been engaged in the research and development and production experience of the phase (4) industry for many years. 'Deeping the research on the problems facing the present, ^, 'finally researched and created a cooling temperature control device In order to make the electricity = within a small range, this is the design objective of the present invention. Also set up, provide a kind of inspection of the cold temperature control wafer, and θ where 'the lower pressure fixture _ is equipped with refrigeration === output power';: pressure = raw self-heating for cold 埶ί The electronic component performs the inspection operation, and the control device can make the detection operation accurately and accurately control the signal to the power supply, and the power supply 200918916 is made in the smaller detection temperature range. More to ensure the detection rate of the product. Another object of the present invention is to provide a refrigeration temperature control device for a pressure measuring mechanism of a detecting machine, wherein the cooling temperature control device can be simultaneously applied to a plurality of sets of crimping mechanisms of the detecting machine, and is pressed at each lower pressure. The temperature sensors are respectively arranged at the end of the group, and the temperature sensors of each electronic component can transmit the temperature signals of the electronic components to the control unit, and the control unit & The control signal is transmitted to each power supply device, and the output power of each of the cooling chips is controlled by the power supply, so that the detection operations of multiple groups can be accurately and accurately controlled to a small detection temperature while ensuring good detection of the product. rate. [Embodiment] In order to enable the reviewing committee to further understand the preferred embodiment of the present invention, and to explain the following with the following description: The Niuyuan bow zone is provided on the crimping mechanism 2 Q - the drive can be pressed == === 吸 Cooling wafer 2 3 under the heat absorption = 2 above the loading = loading 3 and at the heat releasing end *, can be cooled with the heat source to produce cooling, conversion benefits 2, signal converter 2 6 and then :运:至外#之=2 7 series can be operated with the database " system 曰 2 8, the power supply 28 8 system can control the output to the supply; the device Dong, and the adjustment control cooling chip 2 s ^ ^ Cooling day 2 2 current
2 , 2t^J 可即時顯示致冷晶片23冷面之溫度。 3之顽示器2 9， 请參閱第4、5圖，當下壓桿2丄壓 卜心電子疋件31進行檢 200918916 =，$溫器2 4藉由彈簧2 5之彈力係可保持接觸於電子元件 31之表面，並將所感測到之溫度訊號傳輸至訊號轉換 訊號轉換器2 6將溫度訊號轉換後再傳輸至控制單元2°二 ,，固故定:單下’可了二電，⑴之方絲控制輸出ί t CP)故控制早兀2 7與資料庫進行比對後，會將 L致=曰應A2 8 ’以控制電源供應器2 “ 冷00片2 3之電流量⑴’而調整控制致冷 f 出功率（p)’進而#以控舰冷晶片2 3之致冷程产·本發明^ =2 =可即時且連續的將電子元件之表面溫度ς號;^至= =兀2 7，使得控制單元2 7可隨時調整控制電祕岸 ，出至致冷晶片2 3之電流量⑴，因此可不===8 2 3與電子it件執行檢測作細產生之自熱作冷 溫控裝置可使檢測作業即時精準控制 進而更加確保產品的檢測良率。 職I度範圍内’ 請參閱第6® ’本發明同時應用於檢測機 二其各下壓治具之端部係可分別裝設感溫器2 4，各 元2 7，控制單元2 7於接:=='2?傳，至控制單 庫比對，再將各致冷晶片2 3所需d 進仃運算並與資料 源供應器2 8，而各別控制各致冷°)J訊號傳輸至各電 多組之檢測作業均可即時精準^ ^輪出功率，進而使 同時4保產品的檢測良率。工制於更小的檢測溫度範圍内，而 冷晶=電預熱作業，而僅需將致 具組，而上方則為吸敎端的^吏下方為放熱端並連接於下屢治 據此，本發明於π治即致^曰1不同需求作應用。 冷晶片與電子元件執行檢測作業所 200918916 ^ /皿S ΐ可使檢測作業即時精準控制於較小的檢測溫度範圍 =，產品的檢測良率’實為—雜實用性及進步性之設 二j見有_之產品及刊物公開，從而允符發明專利申請要 仵，犮依法提出申請。 【圖式簡單說明】 第1圖.係為巾請第95刪72號『檢峨壓接機構之致冷裝置』 專利案壓接機構之示意圖。 第3圖 第4圖 第5圖 第2圖.係為巾請第95删72號『檢纖壓接機構之致冷裝置』 專利案壓接機構之致冷晶片之示意圖。 本發明壓接機構之示意圖。 本發明壓接機構致冷溫控裝置之架構圖。 本發明壓接機構致冷溫控裝置之控制流程圖。 ^ 6圖：本發明應用於多組壓接機構致冷溫控裝置之控制流程圖。 【主要元件符號說明】 習式部份： 12:下壓治具 13 2 :半導體材料 13 5 :電極 10:壓接機構 11:下壓桿 13·致冷晶片 131:半導體材料 1 3 3 :電極 1 3 4 :電極 13 6 :陶瓷基板13 7 :陶瓷基板 14:散熱裝置 本發明部份： 壓接機構 2 1 下壓桿 2 2 :下壓治具組 致冷晶片 24 感溫器 2 5 :彈簧 訊號轉換器 27 控制單元 2 8 :電源供應器 顯示器 3 0 散熱裝置 3 1 :電子元件 2 0 23 26 292, 2t^J can instantly display the temperature of the cold surface of the cooled wafer 23. 3 Redirector 2 9, please refer to Figures 4 and 5, when the lower pressure bar 2 is pressed and the electronic core 31 is inspected for 200918916 =, the $2 thermostat 2 4 can be kept in contact by the elastic force of the spring 2 5 The surface of the electronic component 31 transmits the sensed temperature signal to the signal conversion signal converter. The temperature signal is converted and then transmitted to the control unit 2° 2, which is determined to be: (1) The square wire control output ί t CP) Therefore, after the control is compared with the database, L = 曰 should be A2 8 ' to control the power supply 2 "Cold 00 piece 2 3 current amount (1) 'And adjust the control cooling f output power (p) 'and then # to control the cold film of the cold film 2 3 cold production · the invention ^ = 2 = can immediately and continuously the surface temperature of the electronic components ;; ^ to ==兀2 7, so that the control unit 27 can adjust the current of the control bank to the amount of current (1) of the cooling chip 23 at any time, so that the detection of the electronic component can be performed finely. The hot-cooling temperature control device enables accurate and timely control of the inspection operation and further ensures the detection yield of the product. Within the range of 1 degree 'Please refer to section 6® 'This issue At the same time, it can be applied to the end of each of the lower pressing fixtures of the testing machine 2. The temperature sensor 24 can be installed separately, and the control unit 27 can be connected to: =='2? to control the single library ratio. Yes, the test operations of each of the refrigerating wafers 2 and the data source supply unit 2, and the respective control of each of the cooling units) can be transmitted to each electric multi-group. ^ Turns out the power, which in turn enables the detection yield of the product at the same time. The system is built in a smaller detection temperature range, while the cold crystal = electric preheating operation, and only the set is required, while the upper part is sucking The lower end of the end is the exothermic end and is connected to the lower iterative basis. The present invention is applied to the different needs of the π 治 即 曰 。 。 。 。 。 。 。 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 2009 Instant and precise control over a small detection temperature range =, the product's detection yield 'actually--------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Apply in accordance with the law. [Simple description of the diagram] Figure 1. For the towel, please delete the 95th No. 72 "Check the crimping mechanism "Cryogenic device" schematic diagram of the patented crimping mechanism. Fig. 3, Fig. 4, Fig. 5, Fig. 2, is the towel, please delete the 95th, 72nd, "The cooling device for the fiber inspection and crimping mechanism" Patented crimping mechanism Schematic diagram of the cold-rolled wafer. Schematic diagram of the crimping mechanism of the present invention. The structural diagram of the refrigeration temperature control device of the crimping mechanism of the present invention. Control flow chart of the refrigeration temperature control device of the crimping mechanism of the present invention. Control flow chart for cooling and temperature control devices of multiple sets of crimping mechanisms. [Explanation of main component symbols] Conventional part: 12: Lower press fixture 13 2 : Semiconductor material 13 5 : Electrode 10: Crimp mechanism 11: Lower pressing rod 13·cooling wafer 131: semiconductor material 1 3 3 : electrode 1 3 4 : electrode 13 6 : ceramic substrate 13 7 : ceramic substrate 14 : heat sink device part of the invention: crimping mechanism 2 1 pressing rod 2 2: Pressing the fixture group to cool the wafer 24 Thermostat 2 5 : Spring signal converter 27 Control unit 2 8 : Power supply monitor 3 0 Heat sink 3 1 : Electronic components 2 0 23 26 29