TWI481862B - Chip inspecting apparatus - Google Patents

Description

Wafer inspection platform

This case relates to a wafer inspection platform, in particular to a thermoelectric wafer inspection platform.

In recent years, with the rapid advancement of electronic industry process technology, various electronic components have become more and more powerful, and the size has become smaller and smaller, and the heat density has been increasing. The demand for heat management such as heat dissipation or temperature control is increasing, and even Become a bottleneck in the advancement of component technology. According to the knowledge, Intel Corporation of the United States announced that the new computer central computing processor (CPU) in the future will no longer pursue the improvement of computing clocks. The main reason is that the thermal management needs and current technologies that have been faced have reached The bottleneck that is not easy to break through. It can be seen that the development of more efficient thermal management technology is an urgent task.

Moreover, with the large-scale use of fossil energy in the modern world, the global warming effect is becoming more and more serious, causing global warming and climate anomalies. In the past, the refrigerants (refrigerants) used in refrigerators and air conditioners were mainly CFCs, but they would destroy the ozone layer, worsen the greenhouse effect and accelerate global warming. Therefore, avoid the use of cold that would destroy the ozone layer. Agents are a priority.

According to the development trend of diversified functions and miniaturization of electronic components, thermal management technology will develop in the following directions depending on the application fields: (1) It is in line with environmental protection trends, such as no noise and no need to use refrigerant; (2) In order to meet the characteristics of the photoelectric components, the temperature must be more precisely controlled; (3) can be integrated with the active heating component process, and solve the hot spot problem by On-Chip.

In the current research process, there is a solid-state thermoelectric element having two characteristics. The first characteristic is that electric energy can be generated to generate refrigeration. At this time, the solid-state thermoelectric element belongs to a thermoelectrically cooled wafer, which can occur. Thermoelectric cooling effect; the second characteristic is: acceptable thermal energy The electric energy is generated, and at this time, the solid-state thermoelectric element belongs to a thermoelectric power generation chip, which may occur as a thermoelectric conversion effect.

In the current market, the application of thermoelectric cooling effect has been seen, such as the use of thermoelectrically cooled wafers in electronic refrigerator products, that is, thermoelectrically cooled wafers to replace conventional refrigerants (refrigerants). Since the operation of the thermoelectrically cooled wafer requires refrigeration, it is not necessary to have a compressor to form a large set of equipment, and therefore the thermoelectrically cooled wafer can not only operate quietly, but also the entire equipment is relatively compact.

In addition, the thermoelectrically cooled wafer is a simple semiconductor component, so that a sufficient amount of electricity is supplied to cause the thermoelectrically cooled wafer to operate normally, thereby simplifying the operation of the wafer, so that the heat-dissipating device based on the thermoelectrically cooled wafer is not Will occupy too much volume. Therefore, in the application of the thermoelectrically cooled wafer, it is easy to set it in a small device, and the disassembly and assembly is more convenient and simple. In addition, thermoelectrically cooled wafers require little special maintenance and can be used in some adverse environments. There is no need to worry about pollution when using the refrigerant, which is very environmentally friendly.

It can be seen from the above that the application range of solid-state thermoelectric elements is extremely wide, so it has great research value. However, some foreign companies have been conducting research and development work on this aspect in many aspects, but many of them belong to the rough design, and currently The establishment of a quality control test and experimental equipment platform for thermoelectric cooling wafer specifications still lacks sufficient convincing accuracy. Therefore, when manufacturers purchase thermoelectric chips, the correctness of the wafer specification sheet attached to the supplier is still questioned.

In view of the fact that there is no fixed detection mechanism or equipment, it is an urgent problem for the industry to provide a sophisticated wafer inspection platform to meet the future demand for solid-state thermoelectric component inspection and establish a model.

The main purpose of this case is to provide a wafer inspection platform for inspection under vacuum environment. The vacuum insulation property is more accurate than the atmospheric pressure environment.

A preferred embodiment of the present invention is to provide a wafer inspection platform for detecting a thermoelectrically cooled wafer, the wafer inspection platform comprising: a body assembly comprising: a carrier And a thermal conductive structure, the connection is disposed on the carrier, and the thermoelectric cooling chip is carried on the thermal guiding structure; a cover is coupled to the housing assembly, and the housing and the housing assembly are Forming a closed space, and the heat guiding structure is received in the closed space; wherein the gas in the closed space is extracted by a vacuum pump to make the closed space in a vacuum state; a power supply device is used for Powering the thermoelectrically cooled wafer; and a temperature detector for detecting a temperature of the thermally conductive structure.

In a preferred embodiment, the thermally conductive structure includes a thermal conductive block carried on an upper surface of the thermal conduction block; wherein the thermal conduction block has a plurality of thermocouple sockets, and the temperature detection The detector includes a plurality of thermocouples, and the thermocouples are inserted into the thermocouple sockets to detect a temperature gradient of the thermal block.

In a preferred embodiment, the thermal conductive structure further includes a cooling seat having a cooling water inlet, a cooling water outlet, and a cooling water tank connected to the cooling water inlet and the cooling water outlet; The heat guiding block portion is inserted into the cooling water tank.

In a preferred embodiment, a flow control device is further included, the flow control device being coupled to the cooling water inlet and the cooling water outlet.

In a preferred embodiment, the thermal block is a copper post, and the cooling seat is a copper seat.

In a preferred embodiment, the cover includes a top cover and a ring side wall extending downward from the top cover, the ring side wall of the outer cover is detachably coupled to the carrier, and the top cover and the ring are The side wall and the carrier jointly define the enclosed space.

In a preferred embodiment, the outer cover is a heat insulating material layer, and an upper peripheral edge and a lower peripheral edge of the heat insulating material layer are detachably joined to the bearing seat and circumferentially surrounding the heat guiding structure. And the layer of insulating material and the carrier jointly define the enclosed space.

In a preferred embodiment, the carrier includes at least one bracket and a clamping mechanism. The clamping mechanism is sleeved on the at least one bracket to enable the clamping mechanism to slide on the at least one bracket.

In a preferred embodiment, the clamping mechanism includes a servo motor and an automatic clamping seat. The servo motor is coupled to the automatic clamping seat to drive the automatic clamping seat to slide on the at least one bracket. The auto-clamping pad is held by the automatic clamping block together with the thermal guiding structure.

In a preferred embodiment, the carrier further includes a pressure sensing unit, the heat guiding structure is fixed on the pressure sensing unit, wherein the automatic clamping seat and the heat guiding structure jointly clamp the The pressure sensing unit reads a pressure data when the wafer is thermoelectrically cooled.

In a preferred embodiment, the carrier further includes a housing having a plurality of connecting through holes, the connecting through holes communicating with the closed space.

In a preferred embodiment, an air suction pipe of the vacuum pump is connected to one of the connection through holes to extract air from the enclosed space.

In a preferred embodiment, the thermocouples of the thermocouple device pass through the other of the connection vias to insert the thermocouple sockets of the thermally conductive structure.

In a preferred embodiment, a vacuum gauge is further included, and the vacuum gauge is connected to one of the connection through holes.

In a preferred embodiment, the two wires of the power supply device pass through one of the connection vias to electrically connect to the thermoelectrically cooled wafer.

In a preferred embodiment, a pressure relief valve member is further included, and the pressure relief valve member is coupled to one of the connection through holes.

A further preferred embodiment of the present invention is to provide a wafer inspection platform for detecting a thermoelectric power generation chip, the wafer inspection platform comprising: a body assembly comprising: a carrier; and a thermal conduction structure, the connection is disposed on The thermal conduction structure includes a first thermal conduction block and a second thermal conduction block, and the first thermal conduction block and the second thermal conduction block sandwich the thermoelectric power generation chip; a cover having a cover a top cover and a ring extending downwardly from the top cover and engaging a ring side wall of the seat body assembly, the cover is disposed on the seat body assembly to form a closed space with the seat body assembly, and the heat is formed The guiding structure is received in the closed space; wherein the gas in the closed space is extracted by a vacuum pump to make the enclosed space in a vacuum state; a thermal energy supply device is connected to the first thermal guiding block to provide thermal energy The first thermal conduction block; a temperature detector for detecting a temperature of the second thermal conduction block; and a current detector electrically connected to the thermoelectric power generation chip to detect the thermal power The current generated by the power generation chip.

In a preferred embodiment, the second thermal conductive block has a plurality of thermocouple jacks, the temperature detector includes a plurality of thermocouples, and the thermocouples are inserted into the thermocouple jacks; A temperature gradient of the second thermal block.

In a preferred embodiment, the thermal conductive structure further includes a cooling seat having a cooling water inlet, a cooling water outlet, and a cooling water tank connected to the cooling water inlet and the cooling water outlet; The second heat guiding block portion is inserted into the cooling water tank.

In a preferred embodiment, a flow control device is further included, the flow control device being coupled to the cooling water inlet and the cooling water outlet.

In a preferred embodiment, the first thermal conduction block and the second thermal conduction block are a copper post, and the cooling base is a copper seat.

In a preferred embodiment, the ring sidewall of the outer cover is detachably coupled to the carrier.

In a preferred embodiment, the carrier includes at least one bracket and a clamping mechanism. The clamping mechanism is sleeved on the at least one bracket to enable the clamping mechanism to slide on the at least one bracket.

In a preferred embodiment, the clamping mechanism includes a servo motor and an automatic clamping seat. The servo motor is coupled to the automatic clamping seat to drive the automatic clamping seat to slide on the at least one bracket. The first thermal conduction block and the second thermal conduction block are caused to sandwich the thermoelectric power generation chip.

In a preferred embodiment, the carrier further includes a pressure sensing unit, the cooling seat is fixed on the pressure sensing unit, wherein the first heat guiding block and the second heat guiding block are clamped together The pressure sensing unit reads a pressure data while holding the thermoelectric power generation chip.

In a preferred embodiment, the carrier further includes a housing having a plurality of connecting through holes, the connecting through holes communicating with the closed space.

In a preferred embodiment, an air suction pipe of the vacuum pump is connected to one of the connection through holes to extract air from the enclosed space.

In a preferred embodiment, the thermocouples of the thermocouple device pass through the other of the connection vias to insert the thermocouple sockets of the second thermal block.

In a preferred embodiment, a vacuum gauge is further included, and the vacuum gauge is connected to one of the connection through holes.

In a preferred embodiment, the two wires of the current detector pass through one of the connection vias to be electrically connected to the thermoelectric power generation chip.

In a preferred embodiment, a pressure relief valve member is further included, and the pressure relief valve member is coupled to one of the connection through holes.

A further preferred embodiment of the present invention is to provide a wafer inspection platform for detecting a thermoelectric wafer, the wafer inspection platform comprising: a body assembly comprising: a carrier; and a thermal conduction structure, the connection is disposed on the a thermal conductive structure is carried on the carrier, and the thermoelectric wafer is carried on the thermal conductive structure; a cover is disposed on the base assembly to form a closed space between the outer cover and the base assembly, and the thermal conductive structure is accommodated In the enclosed space, wherein the gas in the enclosed space is evacuated by a vacuum pump to make the enclosed space in a vacuum state; and a pyroelectric detecting device is configured to perform power supply to the thermoelectric wafer and detect the thermoelectric wafer Or a change in the temperature of the thermoelectric wafer.

In a preferred embodiment, the pyroelectric detection apparatus further includes a power supply device for supplying power to the thermoelectric chip.

In a preferred embodiment, the pyroelectric detection apparatus further includes a thermal energy supply device and a current detector; wherein the thermal energy supply device is configured to provide thermal energy to the thermoelectric chip, and the current detector is electrically connected. The thermoelectric wafer is used to detect the current generated by the thermoelectric wafer.

In a preferred embodiment, the pyroelectric detection apparatus includes a temperature detector for detecting a temperature of the thermal conduction structure.

In a preferred embodiment, the thermal conductivity structure has a plurality of thermocouple sockets, the temperature detector includes a plurality of thermocouples, and the thermocouples are inserted into the thermocouple sockets to detect the thermal conductivity. A temperature gradient of the structure.

In a preferred embodiment, the thermal conductive structure further includes a cooling base and a thermal guiding block inserted into the cooling base. The thermoelectric wafer is carried on an upper surface of the thermal guiding block, and the thermocouple sockets are Formed on a side of the ring of the thermal block.

In a preferred embodiment, the cooling seat has a cooling water inlet, a cooling water outlet, and a cooling water tank formed inside the cooling seat, and the cooling water inlet and the cooling water outlet communicate with the cooling water tank.

In a preferred embodiment, a flow control device is further included, and the flow control device is respectively connected to the cooling water inlet and the cooling water outlet.

In a preferred embodiment, the carrier further includes at least one bracket and a clamping The clamping mechanism is sleeved on the at least one bracket to enable the clamping mechanism to slide on the at least one bracket.

In a preferred embodiment, the carrier includes a housing having a plurality of connecting through holes that communicate with the enclosed space.

In a preferred embodiment, an air suction pipe of the vacuum pump is connected to one of the connection through holes to extract air from the enclosed space.

In a preferred embodiment, the thermocouples of the thermocouple device pass through the other of the connection vias to insert the thermocouple sockets of the thermally conductive structure.

In a preferred embodiment, a vacuum gauge is further included, and the vacuum gauge is connected to one of the connection through holes.

In a preferred embodiment, the two wires of the power supply device pass through one of the connection vias and are electrically connected to the thermoelectric chip.

In a preferred embodiment, a pressure relief valve member is further included, and the pressure relief valve member is coupled to one of the connection through holes.

A further preferred embodiment of the present invention is a wafer inspection platform for detecting a thermoelectric wafer, the wafer inspection platform comprising: a vacuum joint, comprising a packing means having a plurality of connecting through holes; a vacuum joint, Engaging the sealing means to form a closed space between the vacuum joint and the vacuum joint, the closed space accommodating a carrier and the thermoelectric wafer carried on the carrier; wherein the closed space The gas inside is evacuated by a vacuum pump to bring the enclosed space into a vacuum state; and a pyroelectric detecting device is passed through the connecting through holes to perform power supply to the thermoelectric wafer and detect a temperature change of the thermoelectric wafer; or The connection vias are performed to perform heating to the thermoelectric wafer and to detect a change in current of the thermoelectric wafer.

In a preferred embodiment, the carrier includes the sealing means, at least one bracket, and a clamping mechanism sleeved on the at least one bracket, the clamping mechanism is slidable on the at least one bracket, and the bracket At least one bracket and a clamping mechanism are disposed in the enclosed space.

In a preferred embodiment, the pyroelectric detection apparatus further includes a power supply device for supplying power to the thermoelectric chip.

In a preferred embodiment, the pyroelectric detection apparatus further includes a thermal energy supply device. And a current detector, wherein the thermal energy supply device is configured to provide thermal energy to the thermoelectric wafer, and the current detector is electrically connected to the thermoelectric wafer to detect a current generated by the thermoelectric wafer.

In a preferred embodiment, the pyroelectric detection apparatus includes a temperature detector for detecting a temperature of a thermal conduction structure.

In a preferred embodiment, the thermal conductivity structure has a plurality of thermocouple sockets, the temperature detector includes a plurality of thermocouples, and the thermocouples are inserted into the thermocouple sockets to detect the thermal conductivity. A temperature gradient of the structure.

1‧‧‧Seat assembly

10‧‧‧Hosting

101‧‧‧ bracket

102‧‧‧Clamping mechanism

103‧‧‧ Pressure sensing unit

104‧‧‧Shell

105‧‧‧Connecting through holes

106‧‧‧Servo motor

107‧‧‧Automatic clamping seat

11‧‧‧Heat guide structure

110‧‧‧thermal guide block

110a‧‧‧ thermocouple jack

111‧‧‧ Cooling seat

111a‧‧‧Cooling water inlet

111b‧‧‧Cooling water outlet

111c‧‧‧Cooling trough

111d‧‧‧O-ring

2‧‧‧ Cover

20‧‧‧Enclosed space

21‧‧‧Top cover

22‧‧‧ ring side wall

3‧‧‧Thermal detection instrument

31‧‧‧Power supply unit

315‧‧‧Wire

32‧‧‧Temperature Detector

32a‧‧‧ thermocouple

33‧‧‧vacuum pump

335‧‧‧Exhaust pipe

34‧‧‧Flow control device

35‧‧‧Vacuum pressure gauge

4‧‧‧Thermoelectric cooling chip

5‧‧‧Seat assembly

50‧‧‧Hosting

501‧‧‧ bracket

502‧‧‧Clamping mechanism

503‧‧‧ Pressure sensing unit

504‧‧‧Shell

505‧‧‧Connecting through hole

506‧‧‧Servo motor

507‧‧‧Automatic holder

51‧‧‧Heat guide structure

512‧‧‧First thermal guide block

513‧‧‧Second thermal guide block

510a‧‧‧ thermocouple jack

511‧‧‧ Cooling seat

511a‧‧‧Cooling water inlet

511b‧‧‧Cooling water outlet

511c‧‧‧Cooling trough

511d‧‧‧O-ring

513a‧‧‧ thermocouple jack

6‧‧‧ Cover

60‧‧‧closed space

61‧‧‧Top cover

62‧‧‧ ring side wall

7‧‧‧Thermal detection instrument

71‧‧‧ Thermal energy supply unit

72‧‧‧Temperature Detector

72a‧‧‧ thermocouple

73‧‧‧vacuum pump

735‧‧‧Exhaust pipe

74‧‧‧Flow control device

75‧‧‧Vacuum pressure gauge

76‧‧‧ Current Detector

8‧‧‧Thermal power generation chip

1 is a perspective view of a first embodiment of the wafer inspection platform of the present invention.

2 is a perspective view of the seat assembly and the outer cover of the first embodiment of the wafer inspection platform of the present invention.

3 is a front elevational view of the first embodiment of the wafer inspection platform of the present invention in which the housing assembly has not been clamped to the thermoelectrically cooled wafer.

4 is a front elevational view of the first embodiment of the wafer inspection platform of the present invention in which the housing assembly has been clamped to the thermoelectrically cooled wafer.

FIG. 5 is a perspective view of the second embodiment of the wafer inspection platform of the present invention.

6 is a perspective view of the seat assembly and the outer cover of the second embodiment of the wafer inspection platform of the present invention.

Figure 7 is a front elevational view of the second embodiment of the wafer inspection platform of the present invention in which the housing assembly has not been clamped to the thermoelectrically cooled wafer.

Figure 8 is a front elevational view of the second embodiment of the wafer inspection platform of the present invention having the holder assembly clamped to the thermoelectrically cooled wafer.

The following examples are intended to illustrate the contents of the present invention and are not intended to limit the present case. It should be noted that, in the following embodiments and drawings, components not related to the present case have been omitted and are not shown; For the sake of easy understanding, the size ratio between some components is exaggerated, which is different from the actual product.

First, regarding thermoelectric wafers, they can be further classified into thermoelectric cooling wafers and thermoelectric power generation wafers depending on the application and characteristics thereof. The principle of the thermoelectrically cooled wafer is that when an N-type semiconductor material and a P-type semiconductor material are combined into a galvanic pair and a direct current is applied, energy transfer occurs, and a temperature drop occurs to achieve refrigeration. Effect: The principle of the thermoelectric power generation chip is that when an N-type semiconductor material and a P-type semiconductor material are combined into a galvanic pair, a direct current can be generated if a temperature difference is formed between the N-type semiconductor material and the P-type semiconductor. The wafer inspection platform of the present invention can be used to detect any of the thermoelectrically cooled wafer and the thermoelectric generation wafer.

Since the device parts of the wafer inspection platform for detecting the thermoelectrically cooled wafer and the thermoelectric power generation wafer are different, for the sake of convenience, the following description will be directed to the wafer inspection platform for detecting the thermoelectrically cooled wafer and the detection of the thermoelectric generation wafer. The wafer inspection platform is divided into two embodiments for explanation.

First, please refer to FIG. 1 and FIG. 2 first. FIG. 1 is a perspective view of the first embodiment of the wafer inspection platform of the present invention. 2 is an exploded perspective view of the seat assembly and the outer cover of the first embodiment of the wafer inspection platform of the present invention. In the first embodiment, the wafer inspection platform is used to detect the thermoelectrically cooled wafer 4, which includes a body assembly 1, a cover 2, and a pyroelectric detection instrument 3. The base assembly 1 includes a carrier 10 and a thermal conductive structure 11 . The thermal conductive structure 11 is connected to the carrier 10 , and the thermoelectric cooled wafer 4 to be detected is placed on the thermal conductive structure 11 . . The outer cover 2 is joined to the seat body assembly 1 such that a closed space 20 is formed between the outer cover 2 and the seat body assembly 1. The thermoelectric detection device 3 includes a power supply device 31 and a temperature detector 32, which will be described in detail later.

Therefore, in order to enable the wafer detecting platform to form the closed space 20, the outer cover 2 of the present embodiment includes a top cover 21 and a ring side wall 22 extending downward from the top cover 21, and the ring side wall 22 of the outer cover 2 can be folded. The grounding member 10 is joined to the ground so that the top cover 21, the ring side wall 22 and the carrier 10 can collectively define the enclosed space 20. Alternatively, it may be changed that the outer cover 2 is a heat insulating material layer (not shown), and an upper peripheral edge and a lower peripheral edge of the heat insulating material layer are detachably joined to the carrier 10 and circumferentially surrounded by heat. The structure 11 is guided such that the layer of insulating material and the carrier 10 together define an enclosed space 20.

Specifically, in this embodiment, the seat assembly 1 is a vacuum joint, and the outer cover 2 is a vacuum joint. Before the detection, the gas in the closed space 20 is vacuum pumped. 33 is withdrawn, so that the enclosed space 20 is in a vacuum state. With this arrangement, when the thermoelectrically cooled wafer 4 in a vacuum state is detected, the heat insulating property in the vacuum can prevent the heat energy from being lost to the outside due to gas convection during the test of the pyroelectric wafer 4, As a result, the wafer inspection platform is more capable of obtaining accurate measurement data, thereby improving detection accuracy.

The thermal conductive structure 11 includes a thermal conduction block 110. The thermoelectric cooling wafer 4 is carried on an upper surface of the thermal conduction block 110, and when the thermoelectric cooling wafer 4 receives a current supplied from the power supply device 31, the thermoelectricity The opposite surfaces of the cooled wafer 4 respectively exhibit relatively high temperature and low temperature phenomena; in the present embodiment, the upper surface of the thermoelectrically cooled wafer 4 is a cold end, and the lower surface of the thermoelectrically cooled wafer 4 is a hot end. Furthermore, the thermocouple block 110 has a plurality of thermocouple jacks 110a on the ring side wall 22, and the temperature detector 32 includes a plurality of thermocouples 32a, whereby the thermocouple 32a is adapted to be inserted into the thermocouple jack 110a. A temperature gradient of the thermal block 110 is detected. As a result, the temperature of the upper surface of the thermal conductive block 110 and the lower surface temperature of the thermoelectrically cooled wafer 4 can be further inferred.

In order to make the heat conduction of the thermal conductive structure 11 more rapid and obvious, the thermal conductive block 110 in this embodiment is a metal post made of a heat conductive material. Preferably, the thermal conductive block 110 is a good thermal conductivity. A copper column.

Further, the heat guiding structure 11 further includes a cooling seat 111 having a cooling water inlet 111a, a cooling water outlet 111b, and a cooling water tank 111c communicating with the cooling water inlet 111a and the cooling water outlet 111b. The heat guiding block 110 is partially inserted into the cooling water tank 111c to take away the heat energy of the heat guiding structure 11 by the water flow to achieve the purpose of cooling. In addition, in order to prevent the water from overflowing from the gap between the heat conducting block 110 and the cooling water tank 111c, an O-ring 111d is additionally provided in the embodiment, and the O-ring 111d is sleeved on the heat guiding block 110. Engaged with the cooling seat 111 to achieve the sealing effect. Similarly, similar to the material used for the thermal guide block 110, the cooling seat 111 in this embodiment is made of a heat conductive material. Preferably, the cooling base 111 is a copper seat having good thermal conductivity.

In more detail, the wafer inspection platform further includes a flow control device 34, which The quantity control device 34 is connected to the cooling water inlet 111a and the cooling water outlet 111b of the cooling seat 111. The flow control device 34 supplies a relatively low temperature water and passes through the cooling water inlet 111a to enter the cooling water tank 111c. A part of the heat energy of the cooling seat 111 is absorbed to become a relatively high-temperature water, and then discharged through the cooling water outlet 111b. It should be noted that water is used as the cooling liquid for the convenience of description. Of course, other liquids may be used for the cooling, which is not limited herein.

3 is a front view of the first embodiment of the wafer inspection platform of the present invention, which has not yet clamped the thermoelectrically cooled wafer; FIG. 4 is a block assembly of the first embodiment of the wafer inspection platform of the present invention. Front view of the cold wafer. The carrier 10 further includes at least one bracket 101 and a clamping mechanism 102. The clamping mechanism 102 is sleeved on the at least one bracket 101 so that the clamping mechanism 102 can slide on the at least one bracket 101, and the bracket 101 and The clamping mechanism 102 is disposed within the enclosed space 20. The clamping mechanism 102 includes a servo motor 106 and an automatic clamping seat 107. The servo motor 106 is coupled to the automatic clamping base 107 to drive the automatic clamping base 107 to slide on the at least one bracket 101. As shown in FIG. 3, at this time, the seat assembly 1 has not yet clamped the thermoelectrically cooled wafer 4, one side of the thermoelectrically cooled wafer 4 is placed on the thermal conductive block 110, and the other side of the thermoelectrically cooled wafer 4 is exposed. in the air.

As shown in FIG. 4, after the servo motor 106 drives the automatic clamping base 107 to slide on the at least one bracket 101 toward the thermoelectric cooling wafer 4, the automatic clamping seat 107 and the thermal guiding block 110 are clamped together. The thermoelectrically cooled wafer 4 is held. The advantage of sandwiching the thermoelectrically cooled wafer 4 with the body assembly 1 is that the thermoelectrically cooled wafer 4 is closely attached to the thermal conduction block 110, thus ensuring that the heat of the thermoelectrically cooled wafer 4 can be stably and uniformly transmitted. To the thermal block 110.

In the above, the carrier 10 further includes a pressure sensing unit 103, and the thermal conductive structure 11 is fixed on the pressure sensing unit 103. The thermostated wafer 107 is sandwiched between the automatic clamping base 107 and the thermal conductive structure 11 At this time, the pressure sensing unit 103 reads out a pressure data, so that the thermoelectrically cooled wafer 4 can be subjected to various pressure parameter-related detections.

Referring to FIG. 1 to FIG. 4 together, the carrier 10 includes a housing 104 which is a blocking means for blocking/opening the closed space 20 from exchange with outside air. The housing 104 has a plurality of connecting through holes 105. The connection through hole 105 communicates with the closed space 20. Wherein, an exhaust pipe 335 of the vacuum pump 33 is connected to one of the connection through holes 105 to be in the enclosed space 20 The air is drawn out. Furthermore, the thermocouple 32a of the temperature detector 32 passes through the other of the connection vias 105 to be inserted into the thermocouple socket 110a of the thermally conductive structure 11. In addition, the two wires 315 of the power supply device 31 pass through one of the connection vias 105 to be electrically connected to the thermoelectrically cooled wafer 4.

In addition, the wafer inspection platform further includes a vacuum pressure gauge 35 and a pressure relief valve member (not shown), and the vacuum pressure gauge 35 is connected to the connection through hole 105 to measure the pressure in the enclosed space 20. The pressure relief valve member is connected to the connection through hole 105, and when the outer cover 2 is to be removed, the outside air can be introduced into the closed space 20 through the pressure relief valve member to release the vacuum state.

5 is a perspective view of the second embodiment of the wafer inspection platform of the present invention Exploded map. In the present embodiment, the wafer inspection platform is used to detect the thermoelectric power generation chip 8. Similar to the first embodiment, the wafer inspection platform of the second embodiment includes a body assembly 5, a cover 6 and a pyroelectric detection device 7. . The base assembly 5 includes a carrier 50 and a thermal conductive structure 51. The thermal conductive structure 51 is connected to the carrier 50, and the thermoelectric power generation chip 8 to be detected is sandwiched by the thermal conductive structure 51. The outer cover 6 is joined to the seat assembly 5 such that a closed space 60 is formed between the outer cover 6 and the seat assembly 5. The thermoelectric detection device 7 includes a thermal energy supply device 71, a temperature detector 72, and a current detector 76, the respective functions of which will be described later.

In detail, in order to form the wafer detecting platform into the closed space 60, the outer cover 6 of the present embodiment includes a top cover 61 and a ring side wall 62 extending downward from the top cover 61. The ring side wall 62 of the outer cover 6 can be disengagedly engaged. The carrier 50 is such that the top cover 61, the ring side wall 62 and the carrier 50 together define an enclosed space 60.

The carrier 50 includes a casing 504 having a plurality of connecting through holes 505. The connecting through holes 505 are connected to the closed space 60. Therefore, an exhaust pipe 735 of a vacuum pump 73 is connected to one of the connecting through holes 505. The air in the enclosed space 60 is drawn out.

Specifically, in this embodiment, the seat assembly 5 is a vacuum joint, and the outer cover 6 is a vacuum joint. Before the test, the gas in the closed space 60 is vacuum pumped. 73 is withdrawn to bring the enclosed space 60 into a vacuum state. Thereby, when the thermoelectric power generation chip 8 in a vacuum state is detected, it can be insulated by the vacuum. The test can avoid the loss of thermal energy to the outside due to gas convection, so that the wafer inspection platform can accurately measure the measurement data of the thermoelectric power generation chip 8, thereby improving the detection accuracy.

In detail, the thermal guiding structure 51 includes a first thermal guiding block 512 and a second thermal guiding block 513. The thermoelectric power generation chip 8 is carried on an upper surface of the second thermal conduction block 513, and the first thermal conduction block 512 is movable, and the thermoelectric power generation chip 8 can be interposed with the second thermal conduction block 513. The first thermal conduction block 512 receives the thermal energy supplied from the thermal energy supply device 71 to conduct the thermal energy to the thermoelectric power generation chip 8, thereby being electrically connected to the current detector 76 of the thermoelectric power generation chip 8, thereby detecting The current generated by the thermoelectric generation chip 8 was measured.

Furthermore, the second thermal conduction block 513 has a plurality of thermocouple sockets 513a, and the temperature detector 72 includes a plurality of thermocouples 72a. The thermocouples 72a are adapted to be inserted into the thermocouple sockets 513a to detect the second thermal conduction. A temperature gradient of block 513, and by the temperature gradient, determines whether a steady state is reached between the thermoelectric power generation chip 8 and the first thermal conduction block 512 and a second thermal conduction block 513. If the steady state is not reached, the tester has to wait a while to perform the test, so the test operation of the wafer inspection platform is temporarily suspended; if the steady state is reached, the tester can immediately perform the test using the wafer inspection platform. By the above-mentioned judging action, the accuracy of the detection can be more strictly maintained.

Similar to the first embodiment, in the second embodiment, in order to make the heat conduction of the thermal conductive structure heat conducting structure 11 faster and more obvious, the first thermal conductive block 512 and the second thermal conductive block 513 are made of a heat conductive material. Preferably, the first thermal conductive block 512 and the second thermal conductive block 513 are a copper pillar having good thermal conductivity.

In more detail, the wafer inspection platform further includes a flow control device 74 connected to the cooling water inlet 511a of the cooling seat 511 and the cooling water outlet 511b; wherein the flow control device 74 supplies a relatively low temperature water, After passing through the cooling water inlet 511a, it enters the cooling water tank 511c, thereby absorbing a part of the heat energy of the cooling seat 511, and becomes a relatively high-temperature water, and then discharged through the cooling water outlet 511b. It should be noted that water is used as the cooling liquid for the convenience of description. Of course, other liquids may be used for the cooling, which is not limited herein.

7 is a front view of the second embodiment of the wafer inspection platform of the present invention, which has not yet clamped the thermoelectric power generation wafer; FIG. 8 is a block diagram of the second embodiment of the wafer inspection platform of the present invention. The assembly has been clamped to the front view of the thermoelectric power generation wafer. The carrier 50 further includes at least one bracket 501 and a clamping mechanism 502. The clamping mechanism 502 is sleeved on the at least one bracket 501, so that the clamping mechanism 502 can slide on the at least one bracket 501, and the bracket 501 and The clamping mechanism 502 is disposed within the enclosed space 60. The clamping mechanism 502 includes a servo motor 506 and an automatic clamping seat 507. The servo motor 506 is coupled to the automatic clamping seat 507 to drive the automatic clamping seat 507 to slide on the at least one bracket 501. As shown in FIG. 7, at this time, the seat assembly 5 is not yet clamped to the thermoelectric power generation chip 8, one side of the thermoelectric power generation chip 8 is placed on the second heat conduction block 513, and the other side of the thermoelectric power generation chip 8 is exposed to the air. in.

As shown in FIG. 8, the servo motor 506 drives the automatic clamping seat 507 to slide over the at least one bracket 501 toward the thermoelectric power generating chip 8 for a distance, so that the first thermal guiding block 512 and the second thermal guiding block 513 can be obtained. The thermoelectric power generation chips 8 are collectively held. The advantage of having the body assembly 5 sandwich the thermoelectric power generation chip 8 is that the thermoelectric power generation chip 8 is closely attached to the second heat conduction block 513, thus ensuring that the heat of the thermoelectric power generation chip 8 can be stably and uniformly transmitted to The second thermal conduction block 513.

In the above, the carrier 50 further includes a pressure sensing unit 503, and the thermal conductive structure 51 is disposed on the pressure sensing unit 503, wherein the first thermal conduction block 512 and the second thermal conduction block 513 jointly clamp the thermoelectric power generation chip. At 8 o'clock, the pressure sensing unit 103 reads out a pressure data, so that various tests relating to the pressure parameters can be performed on the thermoelectric power generation chip 8.

Referring to FIG. 5 to FIG. 8 together, the carrier 50 includes a housing 504 which is a blocking means for blocking/opening the enclosed space 60 from exchanging outside air. The housing 504 has a plurality of connecting through holes 505. The connecting through hole 505 is in communication with the closed space 60. An exhaust pipe 735 of the vacuum pump 73 is connected to one of the connection through holes 505 to extract the air in the enclosed space 60. Furthermore, the thermocouple 72a of the temperature detector 72 passes through the other of the connection vias 505 to be inserted into the thermocouple socket 510a of the thermally conductive structure 51. In addition, the two wires 765 of the current detector 76 pass through one of the connection vias 505 to be electrically connected to the thermoelectric power generation chip 8.

In addition, the wafer inspection platform further includes a vacuum pressure gauge 75 and a pressure relief valve member (not shown). The vacuum pressure gauge 75 is connected to the connection through hole 505 to measure the pressure in the enclosed space 60. The pressure relief valve member is connected to the connection through hole 505, and when the outer cover 6 is to be removed, the outside air can be introduced into the closed space 20 through the pressure relief valve member to release the vacuum state.

In summary, the wafer inspection platform of this case is capable of performing heat in a vacuum environment. The detection of the electrically cooled wafer and the thermoelectric power generation wafer, thereby minimizing the influence of thermal energy dissipation and reducing the error rate, so that the detection result will be closer to the actual wafer property, and thus a high-accuracy detection specification can be established.

However, the above is only the preferred embodiment of the present case, and it is not intended to limit the scope of patent protection in this case. Therefore, the equivalent changes in the case of the present specification and the contents of the drawings are all included in the scope of protection of the case. Combined with Chen Ming.

1‧‧‧Seat assembly

10‧‧‧Hosting

103‧‧‧ Pressure sensing unit

104‧‧‧Shell

105‧‧‧Connecting through holes

11‧‧‧Heat guide structure

110‧‧‧thermal guide block

110a‧‧‧ thermocouple jack

111‧‧‧ Cooling seat

111a‧‧‧Cooling water inlet

111b‧‧‧Cooling water outlet

111d‧‧‧ O-ring

2‧‧‧ Cover

20‧‧‧ Closed space

21‧‧‧Top cover

twenty two‧‧‧ Ring side wall

3‧‧‧Thermal detection instrument

31‧‧‧Power supply unit

315‧‧‧Wire

32‧‧‧Temperature Detector

32a‧‧‧ thermocouple

33‧‧‧vacuum pump

335‧‧‧Exhaust pipe

34‧‧‧Flow control device

35‧‧‧Vacuum pressure gauge

4‧‧‧Thermoelectric cooling chip

Claims (47)

A wafer inspection platform for detecting a thermoelectrically cooled wafer, the wafer inspection platform comprising: a body assembly comprising: a carrier, including at least one bracket and a clamping mechanism, the clamping mechanism being sleeved on the at least one a bracket for allowing the clamping mechanism to slide on the at least one bracket; wherein the clamping mechanism comprises a servo motor and an automatic clamping seat, the servo motor is coupled to the automatic clamping seat to drive the automatic clamping Sliding on the at least one bracket, wherein the automatic clamping seat and the heat guiding structure jointly clamp the thermoelectric cooling wafer; and a heat guiding structure, the connection is disposed on the carrier, and the thermoelectric The cold-wafer is carried on the heat-conducting structure; an outer cover is coupled to the seat body assembly to form a closed space between the outer cover and the seat body assembly, and the heat-conducting structure is received in the closed space; Wherein, the gas in the enclosed space is extracted by a vacuum pump to make the enclosed space in a vacuum state; a power supply device for supplying power to the thermoelectrically cooled chip; and a temperature detector for detecting the heat A temperature of a structure. The wafer inspection platform of claim 1, wherein the thermal conduction structure comprises a thermal conduction block carried on an upper surface of the thermal conduction block; wherein the thermal conduction block has a plurality of thermoelectrics The thermocouple includes a plurality of thermocouples, and the thermocouples are inserted into the thermocouple jacks to detect a temperature gradient of the thermal block. The wafer inspection platform of claim 2, wherein the thermal conductivity structure further comprises a cooling seat having a cooling water inlet, a cooling water outlet, and a cooling water inlet and the cooling water outlet. a cooling water tank; wherein the heat guiding block portion is inserted into the cooling water tank. The wafer inspection platform of claim 3, further comprising a flow control device coupled to the cooling water inlet and the cooling water outlet. The wafer inspection platform of claim 4, wherein the thermal conduction block is a copper post, and the cooling base is a copper seat. The wafer inspection platform of claim 1, wherein the outer cover comprises a top cover and a ring side wall extending downward from the top cover, the ring side wall of the outer cover being detachably coupled to the load And the top cover, the side wall of the ring and the carrier jointly define the enclosed space. The wafer inspection platform of claim 1, wherein the outer cover is a heat insulating material layer, and an upper peripheral edge and a lower peripheral edge of the thermal insulation material layer are detachably joined to the carrier and circumferentially Surrounding the thermally conductive structure, the layer of thermally insulating material and the carrier jointly define the enclosed space. The wafer inspection platform of claim 1, wherein the carrier further comprises a pressure sensing unit, the heat guiding structure is fixed on the pressure sensing unit, wherein the automatic clamping seat is The pressure sensing unit reads a pressure data when the thermal conductive structure collectively clamps the thermoelectrically cooled wafer. The wafer inspection platform of claim 2, wherein the carrier further comprises a housing having a plurality of connection through holes, the connection through holes being connected to the closed space. The wafer inspection platform of claim 9, wherein an air suction pipe of the vacuum pump is connected to one of the connection through holes to extract air in the enclosed space. The wafer inspection platform of claim 9, wherein the thermocouples of the thermocouple device pass through the other of the connection vias to insert the thermocouple sockets of the thermal conduction structure. . The wafer inspection platform of claim 9, further comprising a vacuum pressure gauge connected to the one of the connection through holes. The wafer inspection platform of claim 9, wherein the two wires of the power supply device pass through one of the connection vias to electrically connect to the thermoelectrically cooled wafer. The wafer inspection platform of claim 9, further comprising a pressure relief valve member connected to the one of the connection through holes. A wafer inspection platform for detecting a thermoelectric power generation chip, the wafer inspection platform comprising: a body assembly comprising: a carrier, including at least one bracket and a clamping mechanism, the clamping mechanism being sleeved on the at least one a bracket, wherein the clamping mechanism is slidable on the at least one bracket; wherein the clamping mechanism comprises a servo motor and an automatic clamping seat, the servo motor is coupled to the automatic clamping seat to drive the automatic clamping Sliding on the at least one bracket, wherein the first thermal conductive block and the second thermal conductive block jointly clamp the thermoelectric power generation wafer; and a thermal conductive structure, the connection is disposed on the carrier, the thermal conduction Structure includes a first heat a guiding block and a second thermal guiding block, wherein the first thermal guiding block and the second thermal guiding block sandwich the thermoelectric power generation chip; a cover having a top cover and extending downward from the top cover and engaging the same a ring side wall of the seat assembly, the cover is disposed on the seat body assembly to form a closed space with the seat body assembly, and the heat guiding structure is received in the closed space; wherein the closed The gas in the space is extracted by a vacuum pump to make the enclosed space in a vacuum state; a thermal energy supply device is connected to the first thermal conduction block to provide thermal energy to the first thermal conduction block; a temperature detector, And detecting a temperature of the second thermal conduction block; and a current detector electrically connected to the thermoelectric power generation chip to detect a current generated by the thermoelectric power generation chip. The wafer inspection platform of claim 15, wherein the second thermal conduction block has a plurality of thermocouple sockets, the temperature detector comprises a plurality of thermocouples, and the thermocouples are interposed in the thermocouples a jack; thereby detecting a temperature gradient of the second thermal block. The wafer inspection platform of claim 16, wherein the thermal conduction structure further comprises a cooling seat having a cooling water inlet, a cooling water outlet, and the cooling water inlet and the cooling water outlet. a cooling water tank; wherein the second heat guiding block portion is inserted into the cooling water tank. The wafer inspection platform of claim 17, further comprising a flow control device coupled to the cooling water inlet and the cooling water outlet. The wafer inspection platform of claim 18, wherein the first thermal conduction block and the second thermal conduction block are a copper post, and the cooling base is a copper seat. The wafer inspection platform of claim 15, wherein the ring sidewall of the outer cover is detachably coupled to the carrier. The wafer inspection platform of claim 15 , wherein the carrier further comprises a pressure sensing unit, the cooling seat is fixed on the pressure sensing unit; wherein the first thermal conduction block and the The pressure sensing unit reads a pressure data when the second thermal conduction block collectively clamps the thermoelectric power generation chip. The wafer inspection platform of claim 16, wherein the carrier further comprises a housing having a plurality of connection through holes, the connection through holes being connected to the closed space. The wafer inspection platform of claim 15, wherein an evacuation pipe of the vacuum pump Connecting to one of the connection through holes to extract air from the enclosed space. The wafer inspection platform of claim 15, wherein the thermocouples of the thermocouple device pass through the other of the connection vias to insert the thermoelectrics of the second thermal conduction block. Even jack. The wafer inspection platform of claim 15, further comprising a vacuum pressure gauge connected to the one of the connection through holes. The wafer inspection platform of claim 15, wherein the two wires of the current detector pass through one of the connection vias to be electrically connected to the thermoelectric power generation chip. The wafer inspection platform of claim 15 further comprising a pressure relief valve member connected to the one of the connection through holes. A wafer inspection platform for detecting a thermoelectric wafer, the wafer inspection platform comprising: a body assembly comprising: a carrier, including at least one bracket and a clamping mechanism, the clamping mechanism being sleeved on the at least one bracket So that the clamping mechanism can slide on the at least one bracket; wherein the clamping mechanism comprises a servo motor and an automatic clamping seat, the servo motor is coupled to the automatic clamping seat to drive the automatic clamping seat Sliding on the at least one bracket, wherein the first thermal conductive block and the second thermal conductive block jointly sandwich the thermoelectric power generation wafer; and a thermal conductive structure, the connection is disposed on the carrier, and the thermoelectric wafer The heat-conducting structure is disposed in the closed space, and the heat-conducting structure is received in the closed space, wherein the heat-conducting structure is disposed in the closed space; The gas in the enclosed space is evacuated by a vacuum pump to bring the enclosed space into a vacuum state; and a pyroelectric detecting device is configured to perform power supply to the thermoelectric wafer and detect a temperature change of the thermoelectric wafer; or Heating the wafer to perform and to detect the pyroelectric current change of the thermoelectric wafer. The wafer inspection platform of claim 28, wherein the pyroelectric detection apparatus further comprises a power supply device for supplying power to the thermoelectric chip. The wafer inspection platform of claim 28, wherein the pyroelectric detection apparatus further comprises a thermal energy supply device and a current detector; wherein the thermal energy supply device is configured to provide thermal energy to the thermoelectric wafer, A current detector is electrically connected to the thermoelectric chip to detect the heat The current generated by the electric wafer. The wafer inspection platform of claim 29 or 30, wherein the pyroelectric detection apparatus comprises a temperature detector for detecting a temperature of the thermal conduction structure. The wafer inspection platform of claim 31, wherein the thermal conductivity structure has a plurality of thermocouple sockets, the temperature detector comprises a plurality of thermocouples, and the thermocouples are inserted in the thermocouple sockets In order to detect a temperature gradient of the thermal conduction structure. The wafer inspection platform of claim 32, wherein the thermal conduction structure further comprises a cooling seat and a thermal guiding block inserted in the cooling seat, the thermoelectric wafer being carried on an upper surface of the thermal guiding block, And the thermocouple sockets are formed on a side of the ring of the thermal block. The wafer inspection platform of claim 33, wherein the cooling seat has a cooling water inlet, a cooling water outlet, and a cooling water tank formed inside the cooling seat, and the cooling water inlet and the cooling water outlet are connected. In the cooling water tank. The wafer inspection platform of claim 34, further comprising a flow control device coupled to the cooling water inlet and the cooling water outlet, respectively. The wafer inspection platform of claim 32, wherein the carrier further comprises at least one bracket and a clamping mechanism, the clamping mechanism is sleeved on the at least one bracket, so that the clamping mechanism can be Sliding on at least one of the brackets. The wafer inspection platform of claim 32, wherein the carrier comprises a housing having a plurality of connection through holes, the connection through holes communicating with the enclosed space. The wafer inspection platform of claim 37, wherein an exhaust pipe of the vacuum pump is connected to one of the connection through holes to extract air in the enclosed space. The wafer inspection platform of claim 37, wherein the thermocouple device A thermocouple is passed through the other of the connection vias to insert the thermocouple sockets of the thermally conductive structure. The wafer inspection platform of claim 37, further comprising a vacuum pressure gauge connected to the one of the connection through holes. The wafer inspection platform of claim 37, wherein the two wires of the power supply device pass through one of the connection vias and are electrically connected to the thermoelectric chip. The wafer inspection platform of claim 37, further comprising a pressure relief valve member connected to the one of the connection through holes. A wafer inspection platform for detecting a thermoelectric wafer, the wafer inspection platform comprising: a vacuum joint, comprising a packing means having a plurality of connecting through holes; a vacuum engaging member coupled to the blocking means to enable the Forming a closed space between the vacuum joint and the vacuum joint, the closed space accommodating a carrier and the thermoelectric wafer carried on the carrier; wherein the carrier comprises the sealing means, at least one bracket and a sleeve a clamping mechanism disposed on the at least one bracket, the clamping mechanism is slidable on the at least one bracket, and the at least one bracket and a clamping mechanism are disposed in the closed space; wherein, the enclosed space The gas is evacuated by a vacuum pump to bring the enclosed space into a vacuum state; and a pyroelectric detecting device passes through the connecting through holes to perform power supply to the thermoelectric wafer and detects a temperature change of the thermoelectric wafer; or The connection vias are configured to perform heating to the thermoelectric wafer and to detect changes in current of the thermoelectric wafer. The wafer inspection platform of claim 43, wherein the pyroelectric detection apparatus further comprises a power supply device for supplying power to the thermoelectric chip. The wafer inspection platform of claim 43, wherein the pyroelectric detection apparatus further comprises a thermal energy supply device and a current detector; wherein the thermal energy supply device is configured to provide thermal energy to the thermoelectric wafer, the current The detector is electrically connected to the thermoelectric chip to detect the current generated by the thermoelectric chip. The wafer inspection platform of claim 44 or claim 45, wherein the pyroelectric detection apparatus comprises a temperature detector for detecting a temperature of a thermal conduction structure. The wafer inspection platform of claim 46, wherein the thermal conductivity structure has a plurality of thermocouple sockets, the temperature detector comprises a plurality of thermocouples, and the thermocouples are interposed in the thermocouple sockets In order to detect a temperature gradient of the thermal conduction structure.