CN208092198U - Cryostat for chip testing - Google Patents
Cryostat for chip testing Download PDFInfo
- Publication number
- CN208092198U CN208092198U CN201820452560.4U CN201820452560U CN208092198U CN 208092198 U CN208092198 U CN 208092198U CN 201820452560 U CN201820452560 U CN 201820452560U CN 208092198 U CN208092198 U CN 208092198U
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- China
- Prior art keywords
- heat screen
- muffler
- inlet tube
- chip
- cooling block
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
This application discloses a kind of cryostats for chip testing, including feed liquor interface tube, bleeding point, inlet tube, muffler and test window cavity, liquid helium is entered in inlet tube to enter back into the test window cavity from feed liquor interface tube and be cooled down into trip temperature, inlet tube is connect with muffler, helium is recycled by muffler to bleeding point, it is characterised in that：It is provided with heat screen, cooling block, chip carrier socket and pedestal in the test window cavity, the cooling block and chip carrier socket are arranged in heat screen, the chip carrier socket is arranged on cooling block, the junction of the inlet tube and heat screen is provided with microchannel, inlet tube is detached with heat screen and is not contacted, and the microchannel is connect with muffler, the muffler and heat screen welding, the heat screen is mounted on the pedestal, and the application has the characteristics that:It is maintained at low temperature and constant temperature, good heat-insulation effect.
Description
Technical field
The utility model is related to a kind of cryostats, especially a kind of cryostat for chip testing.
Background technology
IC chip and MEMS device need at low temperature（77K or less）The test for carrying out electric property, needs to carry
A low temperature environment has been supplied, so that the chip of standard is may be mounted at and is detected above, at present the constant temperature effect of cryostat
Poorly, not accurate to the electrical performance testing of chip.
Utility model content
The technical issues of the utility model solves is to overcome the deficiencies in the prior art, and provide one kind and being maintained at low
Temperature and constant temperature, the cryostat for chip testing of good heat-insulation effect.
Technical solution includes used by the application solves above-mentioned technical problem：A kind of cryogenic thermostat for chip testing
Device, including feed liquor interface tube, bleeding point, inlet tube, muffler and test window cavity, liquid helium from the feed liquor interface tube into
Enter into the inlet tube to enter back into the test window cavity into trip temperature cool down, the inlet tube with it is described
Muffler connection, helium is by the muffler to the described bleeding point recycling, it is characterised in that：The test window
Heat screen, cooling block, chip carrier socket and pedestal are provided in cavity, the cooling block and chip carrier socket are arranged in heat screen
Interior, the chip carrier socket is arranged on cooling block, is provided in the junction of the inlet tube and the heat screen micro-
Channel, the inlet tube is detached with heat screen not to be contacted, and the microchannel is connect with muffler, the muffler and every
Heat shielding is welded, and the heat screen is mounted on the pedestal.
Preferably, be provided on the cooling block place thermal resistance thermal resistance mounting hole, the one of the microchannel
Side is provided with the adding thermal resistance mounting hole for placing adding thermal resistance.
Preferably, a protrusion is provided on the cooling block, the protrusion is in direct contact cooling with chip.
Preferably, the chip carrier socket is DIP20 holders.
Preferably, the heat screen is gold plated copper.
Preferably, the pedestal uses glass fiber material.
The application has the characteristics that:It is maintained at low temperature and constant temperature, good heat-insulation effect.
Description of the drawings
Fig. 1 is the dimensional structure diagram of the embodiment of the present application.
Fig. 2 is the vertical view of the embodiment of the present application.
Fig. 3 is the A-A sectional views of Fig. 2 of the embodiment of the present application.
Fig. 4 is the partial enlarged view of the X of Fig. 3 of the embodiment of the present application.
Fig. 5 is the B-B sectional views of Fig. 2 of the embodiment of the present application
Fig. 6 is the partial enlarged view of the Y of Fig. 5 of the embodiment of the present application.
In figure：1 feed liquor interface tube, 2 bleeding points, 31 inlet tubes, 32 mufflers, 33 microchannels, 4 fixed seats, 51 leads electricity
Pole interface, 52 heating thermometric electrode interfaces, 6 test window cavitys, 61 heat screens, 62 cooling blocks, 63 chip carrier sockets, 71 conducting wires,
72 thermal resistance mounting holes, 73 adding thermal resistance mounting holes, 8 pedestals.
Specific implementation mode
It is described in further detail below in conjunction with the accompanying drawings and by embodiment to the application, following embodiment is to this Shen
Explanation please and the application is not limited to following embodiment.
As shown in Figures 1 to 6, a kind of cryostat for chip testing include feed liquor interface tube 1, bleeding point 2,
Inlet tube 31, muffler 32 and test window cavity 6, liquid helium are entered in inlet tube 31 and are entered by feed liquor interface tube 1
It is cooled down into trip temperature in test window cavity 6, after the internal temperature of test window cavity 6 is cooled down, liquid helium absorbs heat and becomes
Gas, under the action of bleeding point 2, helium is recycled by the discharge of muffler 32, is provided in test window cavity 6
Heat screen 61, cooling block 62, chip carrier socket 63, conducting wire 71, thermal resistance mounting hole 72, adding thermal resistance mounting hole 73 and pedestal 8, it is cold
But block 62, chip carrier socket 63, thermal resistance mounting hole 72 and adding thermal resistance mounting hole 73 are arranged in heat screen 61, the helium of recycling
Heat screen 61 can be pre-chilled, to reduce leakage heat, a protrusion 621 is provided on cooling block 62, chip carrier socket 63 is arranged
On cooling block 62, chip carrier socket 63 is DIP20 standard carriages, and protrusion 621 is in direct contact with chip, contacts cooling reduction chip
Temperature, the thermal resistance mounting hole 72 for placing thermal resistance is provided on cooling block 62, thermal resistance is closer to test sample, temperature
Accuracy height is spent, the junction of inlet tube 31 and heat screen 61 is provided with microchannel 33, microchannel 33 is using multithread hole conductance
Design, heat transfer is quicker, and inlet tube 31 is detached with heat screen 61 and do not contacted, reduces leakage heat, reduces the usage amount of liquid helium, micro- logical
Road 33 is connect with muffler 32, and muffler 32 and heat screen 61 weld, and so that the temperature of heat screen 61 is preferably cooled down, muffler 32
Connection area between heat screen 61 is big, and heat exchange effect is good, is not contacted between heat screen 61 and cooling block 62, only by returning
The form of the vacuum brazing of tracheae 32 is attached, and reduces leakage heat, and heat screen 61 is gold plated copper screen, is set in the side of microchannel 33
Be equipped with place adding thermal resistance adding thermal resistance mounting hole 63, the temperature of liquid helium in 4.2K, but sometimes need not be so low temperature,
It just needs to heat at this time, thermal resistance measures the temperature of sample and the temperature setting of adding thermal resistance heating test window cavity 6 is closed
Road is fed back, and temperature according to demand carrys out heating temperature, and heat screen 61 is mounted on pedestal 8, so that heat screen 61 is separated with cavity, bottom
Seat 8 uses glass fiber material, has very low thermal conductivity, reduces the loss of heat, heat screen 61 and inlet tube 31 and test
Window cavity 6 is not all in direct contact, and heat screen 61 is only contacted with pedestal 8, thermal losses very little, and unique generation heat is to lead
Line 71, therefore conducting wire 71 needs to make conducting wire 71 be pre-chilled around Liang Quan on heat screen 61, leakage heat is made to be preferably minimized.
It is additionally provided with fixed seat 4, inlet tube 31 is mounted in fixed seat 4, so that cryostat is not shaken, ensure surveying
The imaging for trying the chip observed in the process is clearly.
Explanation in relation to upper and lower equal position relationships in the application is in accordance with the attached drawing of embodiment to describe.
Described in this specification above content is only to the application example explanation；Moreover, the application zero
The title that component is taken can also be different, done equivalent of all structure, feature and principles according to described in the application inventional idea or
Simple change is included in the protection domain of the application.
Claims (6)
1. a kind of cryostat for chip testing, including feed liquor interface tube, bleeding point, inlet tube, muffler and test
Window cavity, liquid helium are entered in the inlet tube from the feed liquor interface tube and are entered back into the test window cavity
Interior to be cooled down into trip temperature, the inlet tube is connect with the muffler, and helium is by the muffler to the pumping
Gas port recycles, it is characterised in that：Heat screen, cooling block, chip carrier socket and pedestal, institute are provided in the test window cavity
The cooling block and chip carrier socket stated are arranged in heat screen, and the chip carrier socket is arranged on cooling block, in the feed liquor
The junction of pipe and the heat screen is provided with microchannel, and the inlet tube is detached with heat screen not to be contacted, and described is micro-
Channel is connect with muffler, and the muffler and heat screen welding, the heat screen are mounted on the pedestal.
2. the cryostat according to claim 1 for chip testing, it is characterised in that：It is set on the cooling block
It is equipped with the thermal resistance mounting hole for placing thermal resistance, the side of the microchannel is provided with the adding thermal resistance peace for placing adding thermal resistance
Fill hole.
3. the cryostat according to claim 1 for chip testing, it is characterised in that：It is set on the cooling block
It is equipped with a protrusion, the protrusion is in direct contact cooling with chip.
4. the cryostat according to claim 1 for chip testing, it is characterised in that：The chip carrier socket is
DIP20 holders.
5. the cryostat according to claim 1 for chip testing, it is characterised in that：The heat screen is plating
Golden copper.
6. the cryostat according to claim 1 for chip testing, it is characterised in that：The pedestal uses glass
Glass fibrous material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820452560.4U CN208092198U (en) | 2018-04-02 | 2018-04-02 | Cryostat for chip testing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820452560.4U CN208092198U (en) | 2018-04-02 | 2018-04-02 | Cryostat for chip testing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208092198U true CN208092198U (en) | 2018-11-13 |
Family
ID=64057460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820452560.4U Active CN208092198U (en) | 2018-04-02 | 2018-04-02 | Cryostat for chip testing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208092198U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111692591A (en) * | 2019-02-27 | 2020-09-22 | 无锡小天鹅电器有限公司 | Flue gas generating device and drying machine |
-
2018
- 2018-04-02 CN CN201820452560.4U patent/CN208092198U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111692591A (en) * | 2019-02-27 | 2020-09-22 | 无锡小天鹅电器有限公司 | Flue gas generating device and drying machine |
| CN111692591B (en) * | 2019-02-27 | 2022-10-28 | 无锡小天鹅电器有限公司 | Flue gas generating device and drying machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhejiang saiweike Photoelectric Technology Co., Ltd Assignor: HANGZHOU SAIWEISI VACUUM TECHNOLOGY Co.,Ltd. Contract record no.: X2020980005237 Denomination of utility model: Cryostat for chip testing Granted publication date: 20181113 License type: Common License Record date: 20200821 |
|
| EE01 | Entry into force of recordation of patent licensing contract |