CN203275591U - Integrated circuit high and low temperature testing device - Google Patents
Integrated circuit high and low temperature testing device Download PDFInfo
- Publication number
- CN203275591U CN203275591U CN 201320254411 CN201320254411U CN203275591U CN 203275591 U CN203275591 U CN 203275591U CN 201320254411 CN201320254411 CN 201320254411 CN 201320254411 U CN201320254411 U CN 201320254411U CN 203275591 U CN203275591 U CN 203275591U
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- integrated circuit
- low temperature
- high low
- test device
- temperature test
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Abstract
The utility model relates to an integrated circuit high and low temperature testing device comprising multiple double-ended probes. The multiple double-ended probes are arranged on the lower end of an integrated circuit. One end of each double-ended probe is connected with one of multiple pins of the integrated circuit, and the other end of each double-ended probe contacts one of multiple testing discs which are arranged on a testing circuit board positioned on the lower end of the multiple double-ended probes. The side surface of the integrated circuit is connected with a thermocouple via a heat radiating device. The upper end of the thermocouple is arranged on one semiconductor refrigeration/heating device. The upper end of the semiconductor refrigeration/heating device is provided with a heat radiating device assembly. The overall integrated circuit high and low temperature testing device is compact in structure and small in space occupation so that the weight is reduced and the cost is saved.
Description
Technical field
The utility model relates to the SIC (semiconductor integrated circuit) field, relates in particular to the high low temperature test device of integrated circuit.
Background technology
SIC (semiconductor integrated circuit) is widely used in commercial unit or electronic product, and it gathers multi-function in integral whole, and has become indispensable core component in commercial unit or electronic product.Because commercial unit or electronic product sometimes must or be worked under low-temperature environment at high-temperature very very much, therefore, SIC (semiconductor integrated circuit) must be through very high or just can be applied to commercial unit or electronic product after the low-temperature environment test passes very much.In prior art, the device of the high low temperature of measuring semiconductor integrated circuit is usually very huge, and these devices have occupied very large space, and weight is large, and expensive, is unfavorable for saving cost.
The utility model content
The utility model provides a kind of SIC (semiconductor integrated circuit) high low temperature test device, and purpose is to solve that the high low temperature test device of SIC (semiconductor integrated circuit) in prior art is huge, Heavy Weight, the problem that is unfavorable for saving space and cost.
The utility model is achieved in that
The high low temperature test device of integrated circuit comprises: some double ended probes, and some pins of one end end and an integrated circuit are connected, and the other end contacts with some test panels on the testing circuit board that is arranged on its lower end; Described integrated circuit upper side also is connected with a thermopair by a heat abstractor, described thermopair upper end and semiconductor refrigerating/heating device contacts, and described semiconductor refrigerating/heat device upper end is provided with a cooling equipment component.
Further: described heat abstractor is copper billet; Described refrigerating/heating device is semiconductor refrigerating/heat device; Described cooling equipment component comprises and setting gradually from bottom to up: the first radiating block, the second radiating block, groups of fins and fan.
Further: also be provided with a positioning block and a briquetting between device at described copper billet and described semiconductor refrigerating/heat; Described integrated circuit is arranged in the middle groove of a kickboard, described groove is provided with the through hole that passes one by one for described some double ended probes, described kickboard lower end is provided with needle mould, the described upper needle mould outside is arranged with lower frame, and described upper needle mould and described lower frame all are arranged on described testing circuit board.
Further: also comprise cover plate, be provided with cavity in the middle of described cover plate, described locating piece, briquetting, copper billet, the first radiating block, the second radiating block and groups of fins are placed in described cavity successively.
Further: the two sides of described cover plate are respectively arranged with can dismantle the hook that connects; Described lower frame both sides are respectively arranged with a bayonet socket, and described two hooks are connected to respectively in described two bayonet sockets.
Further: also comprise a mouth hanging spacing collar that is arranged on described cover plate upper end, described mouth hanging spacing collar upper end is provided with the spiral cover with its rotation location; Described fan arranged outside has the fan mount pad; Be provided with the external thread hollow tubular between described groups of fins and described fan; Described external thread hollow tubular, fan and fan mount pad are placed in the cavity that is comprised of spiral cover and mouth hanging spacing collar.
Further: be provided with two card articles on the circumference of described mouth hanging spacing collar upper end, be provided with two recesses suitable with described two card articles on the circumference of described spiral cover lower end.
Further: described spiral cover upper end is provided with handle.
Further: described test panel is for covering Copper Foil.
The beneficial effects of the utility model: integrated circuit is placed in high low temperature test device and by contacting with some contacts on the testing circuit board that is arranged on its lower end, and place thermopair and semiconductor refrigerating/heat device in proving installation, make whole proving installation in time high-temperature temperature or the cryogenic temperature of the satisfied test needs that produce of probing semiconductor refrigerating/heating device; In addition, due at semiconductor refrigerating/heat the device upper/lower terminal to be provided with respectively cooling equipment component and heat abstractor, can go out the dissipation of heat that semiconductor refrigerating/heat device produces in high low temperature test device build-in test process, guarantee the accuracy of measurement result.The high low temperature test device compact conformation of whole integrated circuit takes up room little, has alleviated weight, provides cost savings.
Description of drawings
The exploded view of the high low temperature test device of integrated circuit that Fig. 1 provides for the utility model;
Upper and lower exploded view take integrated circuit as the interface in the high low temperature test device of integrated circuit that Fig. 2 provides for the utility model;
General assembly drawing in the high low temperature test device of integrated circuit that Fig. 3 provides for the utility model;
Fig. 4 is a part of enlarged drawing in Fig. 1;
Fig. 5 is the enlarged drawing of locating piece;
Fig. 6 is another part enlarged drawing in Fig. 1.
Embodiment
In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
With reference to figure 1, integrated circuit 1 some pins 11 are arranged, these some pins 11 be connected integrated circuit 1 below lower needle mould 27 on an end of some double ended probes 3 connect; The other end of some double ended probes 3 contacts with some test panels 251, and described some test panels 251 are the Copper Foils that cover on testing circuit board 25.In the upper end of integrated circuit 1, be provided with heat abstractor 31.Heat abstractor 31 upper center be placed with can detecting temperature thermopair 32.Thermopair 32 upper ends (namely heat abstractor 31 upper ends) are provided with semiconductor refrigerating/heat device 33.Semiconductor refrigerating/heating device 33 can heat, and also can freeze, and therefore can produce the needed temperature of testing integrated circuits 1.Therefore semiconductor refrigerating/heat device 33 can produce heat in the course of the work, is provided with cooling equipment component in semiconductor refrigerating/heat device 33 upper ends.That is to say, in order to guarantee 33 normal operations of semiconductor refrigerating/heat device, need to cooling equipment component and heat abstractor 31 be set respectively at the two ends up and down of semiconductor refrigerating/heat device 33.Therefore, in the high low temperature test device of integrated circuit, integrated circuit 1 is placed in high low temperature test device, its pin connects by the some test panels 251 on testing needle 3 and the testing circuit board 25 that is connected its lower end; And place thermopair 32 and semiconductor refrigerating/heat device 33 in proving installation, make whole proving installation can produce the required high-temperature temperature of testing integrated circuits 1 or cryogenic temperature.In addition, due at semiconductor refrigerating/heat device to be provided with cooling equipment component and heat abstractor 31 in two ends Shang Xia 33, can go out the dissipation of heat that semiconductor refrigerating/heat device 33 produces in high low temperature test device build-in test process, guarantee the accuracy of measurement result.The high low temperature test device compact conformation of whole integrated circuit takes up room little, has alleviated weight, provides cost savings.
With reference to figure 1, in the utility model, described heat abstractor 31 is insulator, and semiconductor refrigerating/heat device 33.Described cooling equipment component comprises and setting gradually from bottom to up: the first radiating block 10, the second radiating block 9, groups of fins 34 and fan 22.The first radiating block 10, the second radiating block 9, groups of fins 34 form by copper.Because copper has good heat dissipation effect, cheap advantage selects it to reduce costs.
With reference to figure 1 and Fig. 4 and Fig. 5.With reference to figure 1, between heat abstractor 31 and integrated circuit 1, also be disposed with location briquetting 35 and heat radiation briquetting 36.With reference to figure 4, integrated circuit 1 is placed in the interior groove 21 of kickboard 2.Be provided with the through hole 211 that passes one by one for double ended probes 3 on groove 21.Kickboard 2 lower ends are provided with lower needle mould 27, and double ended probes 3 is arranged in probe positioning hole between lower needle mould 27 and upper needle mould 26.And needle mould 27 outsides are arranged with lower frame 5 down.The lower surface of lower frame 5 and lower needle mould 27 is arranged on testing circuit board 25.Therefore, the lower end of double ended probes 3 can contact with the test panel 251 on testing circuit board 25.With reference to figure 5, be provided with cavity 351 in the middle of location briquetting 35, empty avoiding integrated circuit 1 when being used for the compression verification probe.
With reference to figure 1 and Fig. 2.With reference to figure 1, the utility model also is provided with cover plate 13, be provided with cavity (not shown) in the middle of cover plate 13, location briquetting 35, heat radiation briquetting 36, collets 31, the first radiating block 10, the second radiating block 9, groups of fins 34 are placed in cavity successively, and structure display gets very compact like this.
With reference to figure 1, cover plate 13 both sides are respectively arranged with hook 18, and hook 18 removably connects by bolt and cover plate 13.With reference to figure 2, lower frame 5 two ends are respectively arranged with and link up with 18 two suitable bayonet sockets 51, and hook 18 inserts in two bayonet sockets 51, realizes that the high low temperature test device of whole integrated circuit assembles fully.
With reference to figure 1 and Fig. 6, cover plate 13 is provided with mouth hanging spacing collar 14, is provided with two card articles 141 on the upper end circumference of mouth hanging spacing collar 14.Mouth hanging spacing collar 14 upper ends are provided with spiral cover 15.
The above is only preferred embodiment of the present utility model, not in order to limiting the utility model, all any modifications of doing within spirit of the present utility model and principle, is equal to and replaces and improvement etc., all should wrap in the utility model scope.
Claims (9)
1. the high low temperature test device of integrated circuit, is characterized in that, comprising: some double ended probes, and some pins of one end end and an integrated circuit are connected, and the other end contacts with some test panels on the testing circuit board that is arranged on its lower end; Described integrated circuit upper side also is connected with a thermopair by a heat abstractor, described thermopair upper end and semiconductor refrigerating/heating device contacts, and described semiconductor refrigerating/heat device upper end is provided with a cooling equipment component.
2. the high low temperature test device of integrated circuit as claimed in claim 1, it is characterized in that: described heat abstractor is copper billet; Described refrigerating/heating device is semiconductor refrigerating/heat device; Described cooling equipment component comprises and setting gradually from bottom to up: the first radiating block, the second radiating block, groups of fins and fan.
3. the high low temperature test device of integrated circuit as claimed in claim 2 is characterized in that: also be provided with a positioning block and a briquetting between device at described copper billet and described semiconductor refrigerating/heat; Described integrated circuit is arranged in the middle groove of a kickboard, described groove is provided with the through hole that passes one by one for described some double ended probes, described kickboard lower end is provided with needle mould, the described upper needle mould outside is arranged with lower frame, and described upper needle mould and described lower frame all are arranged on described testing circuit board.
4. the high low temperature test device of integrated circuit as claimed in claim 3, it is characterized in that: also comprise cover plate, be provided with cavity in the middle of described cover plate, described locating piece, briquetting, copper billet, the first radiating block, the second radiating block and groups of fins are placed in described cavity successively.
5. the high low temperature test device of integrated circuit as claimed in claim 4 is characterized in that: the two sides of described cover plate are respectively arranged with can dismantle the hook that connects; Described lower frame both sides are respectively arranged with a bayonet socket, and described two hooks are connected to respectively in described two bayonet sockets.
6. the high low temperature test device of integrated circuit as claimed in claim 4 is characterized in that: also comprise a mouth hanging spacing collar that is arranged on described cover plate upper end, described mouth hanging spacing collar upper end is provided with the spiral cover with its rotation location; Described fan arranged outside has the fan mount pad; Be provided with the external thread hollow tubular between described groups of fins and described fan; Described external thread hollow tubular, fan and fan mount pad are placed in the cavity that is comprised of spiral cover and mouth hanging spacing collar.
7. the high low temperature test device of integrated circuit as claimed in claim 6 is characterized in that: be provided with two card articles on the circumference of described mouth hanging spacing collar upper end, be provided with two recesses suitable with described two card articles on the circumference of described spiral cover lower end.
8. the high low temperature test device of integrated circuit as described in claim 6 or 7 is characterized in that: described spiral cover upper end is provided with handle.
9. the high low temperature test device of integrated circuit described in any one in claim 1-7, it is characterized in that: described test panel is the Copper Foil that covers on testing circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320254411 CN203275591U (en) | 2013-05-09 | 2013-05-09 | Integrated circuit high and low temperature testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320254411 CN203275591U (en) | 2013-05-09 | 2013-05-09 | Integrated circuit high and low temperature testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203275591U true CN203275591U (en) | 2013-11-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320254411 Expired - Fee Related CN203275591U (en) | 2013-05-09 | 2013-05-09 | Integrated circuit high and low temperature testing device |
Country Status (1)
| Country | Link |
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| CN (1) | CN203275591U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105466965A (en) * | 2014-09-10 | 2016-04-06 | 神讯电脑(昆山)有限公司 | Heat dissipating effect testing apparatus of heat dissipating module |
| CN108152704A (en) * | 2017-12-08 | 2018-06-12 | 宁波芯路通讯科技有限公司 | A kind of integrated circuit high/low temperature test device |
| CN112595921A (en) * | 2021-03-02 | 2021-04-02 | 天津金海通半导体设备股份有限公司 | High-low temperature testing device and method for electronic element |
-
2013
- 2013-05-09 CN CN 201320254411 patent/CN203275591U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105466965A (en) * | 2014-09-10 | 2016-04-06 | 神讯电脑(昆山)有限公司 | Heat dissipating effect testing apparatus of heat dissipating module |
| CN108152704A (en) * | 2017-12-08 | 2018-06-12 | 宁波芯路通讯科技有限公司 | A kind of integrated circuit high/low temperature test device |
| CN112595921A (en) * | 2021-03-02 | 2021-04-02 | 天津金海通半导体设备股份有限公司 | High-low temperature testing device and method for electronic element |
| CN112595921B (en) * | 2021-03-02 | 2021-05-18 | 天津金海通半导体设备股份有限公司 | High-low temperature testing device and method for electronic element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131106 Termination date: 20210509 |
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| CF01 | Termination of patent right due to non-payment of annual fee |