CN218481549U - Test box for DFN semiconductor device - Google Patents
Test box for DFN semiconductor device Download PDFInfo
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- CN218481549U CN218481549U CN202222191250.0U CN202222191250U CN218481549U CN 218481549 U CN218481549 U CN 218481549U CN 202222191250 U CN202222191250 U CN 202222191250U CN 218481549 U CN218481549 U CN 218481549U
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Abstract
The utility model discloses a DFN is test box for semiconductor device, include: the box be provided with the base plate that the fixed slot was seted up at a top in the box, the DFN device that waits to detect can place in the fixed slot, the probe fixed mounting that is located this fixed slot top is in the bottom of a telescopic link, this telescopic link is installed on the roof of box, a week inside wall is provided with the fan housing of a plurality of heating rod and installs on the rear end face of box, a connecting pipe sets up respectively in the box both sides, with box and fan housing intercommunication and formation return circuit, the inside rotation axis that has a plurality of flabellum that is provided with of this fan housing, the one end of this rotation axis and the output shaft fixed connection of a motor, the both sides of box respectively are provided with a refrigeration piece, and the opposite sides of this refrigeration piece are provided with a plurality of fin. The utility model provides the high homogeneity of temperature environment to improve the accuracy of test, guaranteed the reliability of test result.
Description
Technical Field
The utility model relates to a semiconductor device tests technical field, specifically is a DFN is test box for semiconductor device.
Background
In large-scale IC and VLSI (very large scale integrated circuit) application circuits in consumer electronics fields such as portable computers, CPU circuits, micro mobile communication circuits (mobile phones, etc.), digital audio/video circuits, communication machines, digital cameras, etc., the semiconductor chips are required to be smaller and thinner in appearance.
The DFN/QFN is a new package, and belongs to a leadless package of devices, the size of the DFN/QFN is very small, and the DFN/QFN is commonly 3 × 3mm, 4 × 4mm, 5 × 5mm, and the like, the package belly of the DFN/QFN is usually provided with a grounding radiating pad, and the periphery of the DFN/QFN is provided with a conductive pad for realizing electrical connection.
With the improvement of living standard of people, the use scenes of electronic products are increasingly abundant, and higher requirements are put forward on the performance of chips. However, the heat distribution in the existing temperature testing device is not uniform, and the accuracy of the testing result is seriously influenced.
Disclosure of Invention
The utility model aims at providing a DFN is test box for semiconductor device, this DFN is test box for semiconductor device has improved ambient temperature's homogeneity to improve the accuracy of test, guaranteed the reliability of test result.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a test box for a DFN semiconductor device, comprising: the DFN device to be detected can be placed in the fixed groove, a probe positioned above the fixed groove is fixedly arranged at the bottom end of a telescopic rod, and the telescopic rod is arranged on the top wall of the box body;
the fan housing that a week circumferential direction inner wall was provided with a plurality of heating rod is installed on the rear end face of box, and a connecting pipe sets up respectively in the box both sides, with box and fan housing intercommunication and formation return circuit, the inside rotation axis that has a plurality of flabellum that is provided with of this fan housing, the one end of this rotation axis and the output shaft fixed connection of a motor, the both sides of box respectively are provided with a refrigeration piece, and the mutually opposite side of this refrigeration piece is provided with a plurality of fin.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the heating rods are arranged on the circumferential inner wall of the fan cover at equal intervals.
2. In the above scheme, the radiating fins are arranged at equal intervals.
3. In the above scheme, the front end face of the box body is provided with the door plate.
4. In the above scheme, the door panel is provided with a handle.
5. In the above scheme, the fan blades are arc fan blades.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses DFN is test box for semiconductor device, its circumference inner wall is provided with the fan housing of a plurality of heater bar and installs on the rear end face of box, a connecting pipe sets up respectively in the box both sides, communicate box and fan housing and form the return circuit, the inside rotation axis that has a plurality of flabellum that is provided with of this fan housing, the one end of this rotation axis and the output shaft fixed connection of a motor, the both sides of box respectively are provided with a refrigeration piece, the back of the body side that should refrigerate the piece is provided with a plurality of fin, through the heater bar, the refrigeration piece can be adjusted air temperature, thereby realize the test of DFN device under high temperature or low temperature environment in same device, through the connecting pipe, air and the rotation axis cooperation that has the flabellum in the box can be realized circulating, thereby the homogeneity of the inside temperature environment of box has been improved, avoid the inhomogeneous condition that influences the test result of the inside temperature of box, thereby the accuracy of test has been improved, the reliability of test result has been guaranteed.
Drawings
Fig. 1 is a schematic view of a first visual angle structure of the temperature testing box of the present invention;
fig. 2 is a second view structure diagram of the temperature testing box of the present invention;
FIG. 3 is a sectional front view of the DFN semiconductor device test box of the present invention;
fig. 4 is a schematic view of a local structure of the testing box for the DFN semiconductor device according to the present invention.
In the above drawings: 1. a box body; 2. a substrate; 201. fixing grooves; 3. a DFN device; 4. a probe; 5. a telescopic rod; 6. a heating rod; 7. a fan housing; 8. a connecting pipe; 9. a rotating shaft; 10. a fan blade; 11. a motor; 12. refrigerating plates; 13. a heat sink; 14. a door panel; 15. a handle; 16. and a cylinder.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly and encompass, for example, both fixed and removable coupling as well as integral coupling; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a test box for a DFN semiconductor device, comprising: the DFN device detection device comprises a box body 1, wherein a substrate 2 with a fixing groove 201 formed in the top is arranged in the box body 1, and a DFN device 3 to be detected can be placed in the fixing groove 201;
the probe 4 positioned above the fixing groove 201 is fixedly arranged at the bottom end of an expansion link 5, the expansion link 5 is arranged on the top wall of the box body 1, and the outer side of the top of the box body 1 is provided with a cylinder 16 for driving the expansion link 5;
a fan housing 7 with a plurality of heating rods 6 arranged on the circumferential inner wall is installed on the rear end face of the box body 1, a connecting pipe 8 is respectively arranged on two sides of the box body 1 to communicate the box body 1 with the fan housing 7 and form a loop, a rotating shaft 9 with a plurality of fan blades 10 is arranged in the fan housing 7, and one end of the rotating shaft 9 is fixedly connected with an output shaft of a motor 11;
two sides of the box body 1 are respectively provided with a refrigerating sheet 12, and the opposite sides of the refrigerating sheet 12 are provided with a plurality of radiating fins 13.
The heater rod 6 can heat 7 interior air in the fan housing, and the refrigeration piece 12 cools down 1 interior air of box, according to the measuring needs, selects the heater rod 6 to heat and forms high temperature environment or the refrigeration piece cooling forms low temperature environment to the realization tests the DFN chip under different temperature environment, and the heater rod 6 is not inside box 1, avoids the condition of local high temperature damage probe.
The air temperature can be adjusted through the heating rod 6 and the refrigerating sheet 12, so that the DFN device can be tested in a high-temperature environment or a low-temperature environment in the same device.
The heating rods 6 are arranged at equal intervals on the circumferential inner wall of the fan housing 7.
A door panel 14 is provided on the front end surface of the case 1.
The door panel 14 has a handle 15.
The fan blade 10 is an arc fan blade.
Example 2: a test box for a DFN semiconductor device, comprising: the DFN device detection device comprises a box body 1, wherein a base plate 2 with a fixing groove 201 formed in the top is arranged in the box body 1, a DFN device 3 to be detected can be placed in the fixing groove 201, a probe 4 positioned above the fixing groove 201 is fixedly arranged at the bottom end of a telescopic rod 5, and the telescopic rod 5 is arranged on the top wall of the box body 1;
a fan housing 7 with a plurality of heating rods 6 arranged on the circumferential inner wall is installed on the rear end face of the box body 1, a connecting pipe 8 is respectively arranged on two sides of the box body 1 to communicate the box body 1 with the fan housing 7 and form a loop, a rotating shaft 9 with a plurality of fan blades 10 is arranged in the fan housing 7, and one end of the rotating shaft 9 is fixedly connected with an output shaft of a motor 11;
the refrigerator comprises a box body 1 and is characterized in that two sides of the box body 1 are respectively provided with a refrigerating sheet 12, and a plurality of radiating fins 13 are arranged on the opposite sides of the refrigerating sheet 12.
Through the cooperation of the connecting pipe 8, the fan cover 7 and the rotating shaft 9 with the fan blades 10, the circulation of air in the box body 1 and the air in the fan cover 7 can be realized, so that the uniformity of the internal environment temperature of the box body 1 is improved, the condition that the test result is influenced by the non-uniform internal temperature of the box body 1 is avoided, the test accuracy is improved, and the reliability of the test result is ensured
The heating rods 6 are arranged at equal intervals on the circumferential inner wall of the fan housing 7.
The heat radiating fins 13 are arranged at equal intervals.
A door panel 14 is provided on the front end surface of the case 1.
The working principle is as follows: when the device is used, the heating rod 6 can heat air in the fan cover 7, the refrigerating sheet 12 cools air in the box body 1, and the heating rod 6 is selected to heat to form a high-temperature environment or the refrigerating sheet is selected to cool to form a low-temperature environment according to detection requirements, so that the DFN chip is tested in different temperature environments, the heating rod 6 is not arranged in the box body 1, the condition that a probe is damaged by local high temperature is avoided, and the normal operation of long-term detection work is ensured;
the fan blade 10 on the rotating shaft 9 is driven to rotate through the motor 11, when the fan blade 10 rotates, gas inside the box body 1 can be circulated through the connecting pipe 8 and gas inside the fan cover 7, so that the uniformity of the internal environment of the box body 1 is improved, the accuracy of a test result is improved, and the reliability of the test is guaranteed.
When the test box for the DFN semiconductor device is adopted, the fan housing with the plurality of heating rods arranged on the circumferential inner wall is installed on the rear end face of the box body, the connecting pipes are respectively arranged on two sides of the box body, the box body is communicated with the fan housing to form a loop, the inside of the fan housing is provided with the rotating shaft with the plurality of fan blades, one end of the rotating shaft is fixedly connected with the output shaft of the motor, two sides of the box body are respectively provided with the refrigerating sheet, the back sides of the refrigerating sheets are provided with the plurality of radiating fins, the air temperature can be adjusted through the heating rods and the refrigerating sheet, therefore, the DFN device can be tested in a high-temperature environment or a low-temperature environment in the same device, the air in the box body and the air in the fan housing can be circulated through the connecting pipes and the matching of the rotating shaft with the fan blades, the uniformity of the temperature distribution in the box body is improved, the condition that the test result is influenced by the inconsistency of the temperature distribution in the box body is avoided, the accuracy of the test is improved, and the reliability of the test result is ensured.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (6)
1. A test box for a DFN semiconductor device, comprising: box (1), its characterized in that: a base plate (2) with a fixed groove (201) formed in the top is arranged in the box body (1), a DFN device (3) to be detected can be placed in the fixed groove (201), a probe (4) positioned above the fixed groove (201) is fixedly arranged at the bottom end of a telescopic rod (5), and the telescopic rod (5) is arranged on the top wall of the box body (1);
the fan housing (7) with the plurality of heating rods (6) arranged on the circumferential inner wall is installed on the rear end face of the box body (1), a connecting pipe (8) is respectively arranged on two sides of the box body (1), the box body (1) is communicated with the fan housing (7) to form a loop, a rotating shaft (9) with a plurality of fan blades (10) is arranged inside the fan housing (7), one end of the rotating shaft (9) is fixedly connected with an output shaft of a motor (11), two sides of the box body (1) are respectively provided with a refrigerating sheet (12), and a plurality of radiating sheets (13) are arranged on the opposite sides of the refrigerating sheet (12).
2. The DFN semiconductor device test box according to claim 1, wherein: the heating rods (6) are arranged on the circumferential inner wall of the fan cover (7) at equal intervals.
3. The DFN semiconductor device test box according to claim 1, wherein: the radiating fins (13) are arranged at equal intervals.
4. The DFN semiconductor device test box according to claim 1, wherein: the front end face of the box body (1) is provided with a door panel (14).
5. The DFN semiconductor device test box according to claim 4, wherein: the door panel (14) has a handle (15).
6. The DFN semiconductor device test box according to claim 1, wherein: the fan blades (10) are arc-shaped fan blades.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222191250.0U CN218481549U (en) | 2022-08-19 | 2022-08-19 | Test box for DFN semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222191250.0U CN218481549U (en) | 2022-08-19 | 2022-08-19 | Test box for DFN semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218481549U true CN218481549U (en) | 2023-02-14 |
Family
ID=85165497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222191250.0U Active CN218481549U (en) | 2022-08-19 | 2022-08-19 | Test box for DFN semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218481549U (en) |
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2022
- 2022-08-19 CN CN202222191250.0U patent/CN218481549U/en active Active
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