CN219122089U - Crystal detection device - Google Patents

Abstract

The application discloses crystal check out test set relates to detection technical field. The crystal detection device comprises a first device body, a second device body, a temperature adjusting device and a detection device, wherein the first device body is hinged to the second device body, the first device body is provided with a first surface, the first surface is provided with a mounting hole, the temperature adjusting device is arranged in the mounting hole, the second device body is provided with a second surface, the second surface is provided with a mounting groove, the detection device is arranged in the mounting groove, the detection device is provided with a containing groove capable of containing crystals, and the first device body is covered on the second device body, the first surface is attached to the second surface, and the temperature adjusting device is in contact with the crystals.

Description

Crystal detection device

Technical Field

The application belongs to the technical field of detection, and particularly relates to crystal detection equipment.

Background

The passive crystal is a crystal source of a processor of electronic equipment, particularly in some electronic equipment (such as a smart phone) with GPS positioning requirements, not only has higher requirements on the precision and stability of the crystal, but also the frequency deviation of the same temperature point cannot be excessively large in the process of temperature rising and falling when the crystal is subjected to temperature impact. Therefore, the monomer of the passive crystal needs to be strictly checked in the production, shipment, incoming material inspection and other stages so as to ensure the quality of the final product.

The crystal check out test set that uses at present, the heating source sets up in the part of incubator generally, and the heat that the heating source produced needs to heat the local liquid in the incubator first to make heat transfer to other regions in the incubator step by step, therefore heat transfer is slower, leads to detection device's detection precision lower.

Disclosure of Invention

The embodiment of the application aims to provide crystal detection equipment, which can solve the problem that the existing crystal detection equipment has lower detection precision.

In order to solve the technical problems, the application is realized as follows:

the embodiment of the application provides crystal detection equipment, including first equipment main part, second equipment main part, temperature regulating device and detection device, first equipment main part with the second equipment main part is articulated, first equipment main part has first face, first face is equipped with the mounting hole, temperature regulating device set up in the mounting hole, the second equipment main part has the second face, the second face is equipped with the mounting groove, detection device install in the mounting groove, detection device is equipped with the holding tank that can hold the crystal first equipment main part lid in under the condition of second equipment main part, first face with the laminating of second face, temperature regulating device with the crystal contact.

In the embodiment of the application, after the crystal is placed in the accommodating groove of the detection device, the crystal is contacted with the detection device, and under the condition that the first equipment main body is covered on the second equipment main body, the first surface of the first equipment main body is attached to the second surface of the second equipment main body, at the moment, the temperature regulating device is directly contacted with the crystal, and the temperature regulating device heats or refrigerates the crystal, so that the heat transfer efficiency is higher; the detection device can be used for detecting the temperature and the frequency of the crystal in real time, and is beneficial to improving the detection precision of the detection device. Therefore, the embodiment of the application can solve the problem that the existing crystal detection equipment has lower detection precision.

Drawings

FIG. 1 is an exploded view of a crystal inspection apparatus disclosed in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a crystal inspection apparatus according to an embodiment of the present disclosure;

FIG. 3 is an exploded view of a part of the structure of a crystal inspection apparatus disclosed in an embodiment of the present application;

FIG. 4 is a partial exploded view of a part of the structure of a crystal inspection apparatus disclosed in an embodiment of the present application;

FIG. 5 is a partial schematic view of a part of the structure of a crystal inspection apparatus disclosed in an embodiment of the present application;

fig. 6 is a schematic structural view of a heat conducting member according to an embodiment of the present disclosure;

FIGS. 7-8 are schematic views of a crystal carrier according to embodiments of the present application at different viewing angles;

fig. 9 is a schematic circuit diagram of the detecting member and the crystal disclosed in the embodiment of the present application.

Reference numerals illustrate:

100-a first device body, 110-a first face, 111-a mounting hole, 111 a-a first hole section, 111 b-a second hole section, 111 c-a third hole section, 120-an operating member;

200-a second device body, 210-a second face, 211-a mounting slot, 211 a-a second through hole;

300-temperature regulating device, 310-semiconductor refrigerating element, 320-heat conducting element, 321-groove, 321 a-protruding part and 322-flange;

400-detecting device, 410-accommodating groove, 411-avoiding hole, 420-third surface, 421-crystal bearing part, 421 a-avoiding groove, 422-boss, 423-annular mounting groove, 430-detecting piece, 431-thimble, 440-crystal bearing piece, 450-resistance element;

500-control means;

600-connection assembly, 610-first connection, 620-second connection;

700-bracket;

800-base;

910-thermistor.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type and not limited to the number of objects, e.g., the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

The crystal detection device provided by the embodiment of the application is described in detail below through specific embodiments and application scenes thereof with reference to the accompanying drawings.

As shown in fig. 1 to 9, the embodiment of the present application discloses a crystal inspection apparatus, which includes a first apparatus body 100, a second apparatus body 200, a temperature adjusting device 300, and an inspection device 400, wherein the first apparatus body 100 is hinged with the second apparatus body 200, and optionally, the crystal inspection apparatus further includes a connection assembly 600, the connection assembly 600 includes a first connection member 610 and a second connection member 620, the first connection member 610 is connected with the first apparatus body 100, the second connection member 620 is connected with the second apparatus body 200, and the first connection member 610 and the second connection member 620 may be rotatably connected through a connection shaft. The first apparatus body 100 has a first surface 110, the first surface 110 is provided with a mounting hole 111, the temperature adjusting device 300 is provided in the mounting hole 111, the second apparatus body 200 has a second surface 210, the second surface 210 is provided with a mounting groove 211, the detecting device 400 is mounted in the mounting groove 211, the detecting device 400 is provided with a containing groove 410 capable of containing a crystal, optionally, when the crystal is placed in the containing groove 410, the outer circumferential surface of the crystal is attached to the inner wall of the containing groove 410, thereby limiting the crystal. When the first device body 100 is covered with the second device body 200, the first surface 110 and the second surface 210 are bonded, and the temperature control device 300 is in contact with the crystal.

In this embodiment, after the crystal is placed in the accommodating groove 410, the crystal is contacted with the detecting device 400, and when the first device main body 100 is covered on the second device main body 200, the first surface of the first device main body 100 is attached to the second surface of the second device main body 200, and at this time, the temperature adjusting device 300 is directly contacted with the crystal, and the temperature adjusting device 300 heats or cools the crystal, so that the heat transfer efficiency is higher; the detection device 400 can be used for detecting the temperature and the frequency of the crystal in real time, so that the detection accuracy of the detection device 400 is improved. Therefore, the embodiment of the application can solve the problem that the existing crystal detection equipment has lower detection precision. In addition, the crystal detection device disclosed by the application does not need to use a heating structure such as a compressor, the noise is smaller, and the volume of the whole crystal detection device is smaller.

Alternatively, the temperature adjusting device 300 may include a cooling member and a heating member separately provided, and the heating member generates heat when it is required to heat the crystal; when the temperature of the crystal needs to be reduced, the heat is dissipated through the refrigerating piece. In another embodiment, the temperature adjusting device 300 includes the semiconductor cooling element 310 and the heat conducting element 320, and the semiconductor cooling element 310 can cool and heat, which has the dual-purpose effect of one object, and is beneficial to reducing the occupied space of the temperature adjusting device 300; meanwhile, the semiconductor refrigerating element 310 has higher refrigerating and heating efficiency and larger temperature difference range. Alternatively, the heat conductive member 320 may be a metal structure, which may be made of a metal material having a high thermal conductivity such as copper, aluminum oxide, or the like, or may be made of a non-metal structure having a high thermal conductivity such as graphite, but is not particularly limited thereto. The semiconductor cooling member 310 faces the outside environment away from the heat conducting member 320, and a first end of the heat conducting member 320 is connected to the semiconductor cooling member 310, and a second end of the heat conducting member 320 is in contact with the crystal in the case that the first apparatus body 100 is covered with the second apparatus body 200. When the crystal needs to be heated, a forward current is supplied to the semiconductor cooling member 310, and at this time, the semiconductor cooling member 310 emits heat, and the heat conducting member 320 transfers the heat to the crystal, so that the temperature of the crystal increases. When the crystal needs to be cooled, reverse current is supplied to the semiconductor refrigeration member 310, the semiconductor refrigeration member 310 absorbs heat, and at this time, the heat of the crystal is transferred to the semiconductor refrigeration member 310 through the heat conducting member 320, and the semiconductor refrigeration member 310 radiates the heat to the external environment. Optionally, a heat dissipating device may be additionally provided, which faces the semiconductor refrigerator 310, so as to dissipate heat of the semiconductor refrigerator 310; further alternatively, the heat dissipating device may include a micro heat pipe and a fan, but other heat dissipating structures are of course also possible, and are not particularly limited herein.

Alternatively, the semiconductor cooling member 310 may have a plate-shaped structure to increase a heat dissipation area, and a surface of the semiconductor cooling member 310 facing the external environment is flush with an outer surface of the first apparatus body 100, thereby improving an aesthetic appearance of the crystal inspection apparatus.

In a further alternative embodiment, the end surface of the second end of the heat conducting member 320 is provided with a groove 321, one surface of the detecting device 400 facing away from the bottom of the mounting groove 211 is a third surface 420, the third surface 420 is provided with a crystal bearing portion 421, one surface of the crystal bearing portion 421 facing away from the bottom of the mounting groove 211 is provided with an accommodating groove 410, and when the first device main body 100 is covered on the second device main body 200, the crystal bearing portion 421 is located in the groove 321, and at this time, the crystal is also necessarily located in the groove 321, and contacts with the inner wall of the groove 321 to transfer heat, so that the arrangement is beneficial to protecting the crystal; in addition, during the process of heating the crystal, the crystal is positioned in the groove 321, so that heat loss can be reduced, the heating efficiency of the crystal can be improved, and the response speed of the detection device 400 can be further improved.

When the crystal is in contact with the bottom of the groove 321 to transfer heat, then the side of the crystal facing away from the bottom of the accommodating groove 410 must be flush or convex with the side of the crystal bearing 421 facing away from the bottom of the mounting groove 211, and if the crystal is flush with the side of the crystal bearing 421 facing away from the bottom of the mounting groove 211, then the bottom of the groove 321 will be in contact with both the crystal and the crystal bearing 421, resulting in lower heat transfer efficiency; if the crystal protrudes from one surface of the crystal bearing 421 away from the bottom of the mounting groove 211, the bottom of the groove 321 is liable to be crushed; in addition, since the size of the crystal is small and only a portion of the crystal is fitted into the accommodating groove 410, this results in a smaller size of the accommodating groove 410 and a greater difficulty in setting. Therefore, optionally, the groove bottom of the groove 321 is provided with a protruding portion 321a, at this time, a surface of the crystal facing away from the groove bottom of the accommodating groove 410 may be lower than a surface of the crystal bearing portion 421 facing away from the groove bottom of the mounting groove 211, and under the condition that the first device body 100 is covered on the second device body 200, the crystal bearing portion 421 is located in the groove 321, and the protruding portion 321a contacts with the crystal, so that not only can the heat conduction efficiency be improved, but also the crystal is protected, and meanwhile, the setting difficulty of the accommodating groove 410 can be reduced.

In another alternative embodiment, the detecting device 400 includes a detecting member 430, the detecting member 430 is disposed at a bottom of the mounting groove 211, the detecting member 430 may be provided with a crystal bearing portion 421, at this time, the detecting member 430 is closer to the crystal, and when the crystal is cooled, heat generated by the operation of the detecting member 430 is easily transferred to the crystal, so as to reduce a cooling rate of the crystal. Based on this, optionally, the inspection apparatus 400 further includes a crystal carrier 440, the crystal carrier 440 is stacked with the inspection piece 430, the crystal carrier 440 is provided with a crystal carrier 421, the bottom of the accommodating groove 410 is provided with a relief hole 411, and the inspection piece 430 can contact with the crystal through the relief hole 411. At this time, the crystal bearing member 440 separates the crystal from the detecting member 430, and when the crystal is cooled, the crystal bearing member 440 can block the heat generated by the detecting member 430 from diffusing to the crystal, which is beneficial to improving the cooling rate of the crystal.

Referring to fig. 9, optionally, the detecting device 400 further includes a circuit board, on which a resistor 450 is disposed, when the crystal is placed in the accommodating groove 410 of the detecting device 400, the thermistor 910 inside the crystal is electrically connected to the circuit board through the resistor 450, and the detecting element 430 is electrically connected between the thermistor 910 and the resistor 450, at this time, the circuit board provides a reference voltage for the thermistor 910, and the voltage detected by the detecting element 430 changes along with the change of the temperature of the crystal, so as to calculate the resistance value of the thermistor 910 according to the voltage, thereby converting the resistance value into a temperature value.

The detecting member 430 has a detecting portion that is in direct contact with the crystal through the escape hole 411, and at this time, the size of the escape hole 411 needs to be adapted to the detecting portion, and in the process of heating the crystal, heat of the crystal is largely transferred to the detecting member 430, thereby lowering the temperature raising efficiency of the crystal. In another alternative embodiment, the detecting member 430 includes a thimble 431, one end of the thimble 431 passes through the avoidance hole 411 to contact with the crystal, that is, the detecting portion contacts with the crystal through the thimble 431, so that the aperture of the avoidance hole 411 can be reduced, and in the process of heating the crystal, the heat transfer of the crystal to the detecting member 430 can be reduced, so that the heating efficiency of the crystal is improved; in addition, the thickness of the thimble 431 can be flexibly set. Optionally, the ejector pins 431 are elastic ejector pins, which have a certain pre-pressing amount, and when the first device body 100 is covered on the second device body 200, the crystal can move within a certain range, so as to avoid the protrusion 321a pressing the crystal to cause the crystal to be damaged.

In another embodiment, the ejector pins 431 support the crystal to form a gap between the crystal and the bottom of the accommodating groove 410, and when the crystal is heated, the heat transfer from the crystal to the crystal carrier 440 can be reduced due to the gap between the crystal and the bottom of the accommodating groove 410, so that the heating rate of the crystal is improved.

Optionally, the number of the avoidance holes 411 is at least two, and the at least two avoidance holes 411 include a first avoidance hole and a second avoidance hole, where the first avoidance hole and the second avoidance hole are respectively disposed on two opposite sides of the central axis of the accommodating groove 410, so as to improve stability of the crystal.

Further optionally, the at least two avoidance holes 411 further include a third avoidance hole and a fourth avoidance hole, and since the shape of the crystal is generally rectangular, the shape of the accommodating groove 410 is matched with the crystal, at this time, the first avoidance hole, the second avoidance hole, the third avoidance hole and the fourth avoidance hole can be arranged along the circumferential interval of the accommodating groove 410, so that the stability of the crystal is further improved.

When the depth of the groove 321 formed on the heat conductive member 320 is greater, after the crystal is positioned in the groove 321, the distance between the crystal and the semiconductor refrigeration member 310 can be reduced, so that the temperature rising and lowering rate of the crystal can be increased, based on which, if the crystal bearing 421 is in clearance fit with the groove 321, when the first device body 100 is covered with the second device body 200, the crystal bearing 421 is positioned in the groove 321, the outer circumferential surface of the crystal bearing 421 is in contact with the inner surface of the groove 321, the contact area between the two is greater, and when the crystal is heated, the heat transferred by the heat conductive member 320 will be mostly transferred to the crystal bearing 421, resulting in a lower temperature rising rate of the crystal. Therefore, optionally, the third surface 420 has a boss 422, the crystal bearing 421 is disposed on the boss 422, at least a portion of the boss 422 is located in the groove 321 when the first apparatus body 100 is covered on the second apparatus body 200, and the outer peripheral surface of the boss 422 is attached to the inner surface of the groove 321, so that on the basis of ensuring that the distance between the crystal and the semiconductor refrigeration member 310 is relatively close, the contact area between the boss 422 and the groove 321 can be reduced, which is beneficial to improving the temperature rising rate of the crystal when the crystal is heated.

Further alternatively, the third face 420 is provided with an annular mounting groove 423, the annular mounting groove 423 is disposed around the boss 422, the detecting device 400 further includes a sealing member disposed in the annular mounting groove 423, and the sealing member is in sealing engagement with the first face 110 under the condition that the first apparatus main body 100 is covered with the second apparatus main body 200, so that when heating the crystal, heat dissipation of the crystal can be effectively prevented, thereby further improving the temperature rising rate of the crystal.

In another alternative embodiment, a side of the crystal bearing portion 421 away from the bottom of the mounting groove 211 is provided with a relief groove 421a, one end of the relief groove 421a is communicated with the accommodating groove 410, and the other end of the relief groove 421a extends to the outer peripheral surface of the crystal bearing portion 421. Because of the small size of the crystal, a special tool, such as tweezers, is required to be used to take the crystal, so the avoiding groove 421a is provided to facilitate avoiding the tool. Alternatively, the number of the avoidance grooves 421a may be at least two, and each avoidance groove 421a may be disposed on a different side of the accommodating groove 410, so as to facilitate multi-angle crystal placement.

The mounting hole 111 may be a hole having a constant cross-sectional area. In yet another alternative embodiment, the mounting hole 111 includes a first hole section 111a and a second hole section 111b which are connected, the cross-sectional area of the second hole section 111b is larger than that of the first hole section 111a, the semiconductor refrigeration member 310 is disposed in the first hole section 111a, and the heat conducting member 320 is disposed in the second hole section 111b, so that the size of the semiconductor refrigeration member 310 can be increased, thereby improving heating and refrigeration efficiency.

In a further alternative embodiment, the mounting hole 111 further includes a third hole section 111c respectively connected to the first hole section 111a and the second hole section 111b, the third hole section 111c is connected between the first hole section 111a and the second hole section 111b, the cross-sectional areas of the second hole section 111b, the third hole section 111c and the first hole section 111a are sequentially reduced, the first end of the heat conducting member 320 has a flange 322, the flange 322 is disposed on the third hole section 111c, and an end surface of the first end of the heat conducting member 320 is attached to the semiconductor refrigerating member 310, so that a contact area between the heat conducting member 320 and the semiconductor refrigerating member 310 is increased to improve heat conducting efficiency of the heat conducting member 320.

In an alternative embodiment, the bottom of the mounting groove 211 is provided with a second through hole 211a, the crystal detection apparatus further includes a control device 500, the control device 500 may be used to control the working state of the temperature adjustment device 300, such as the heating state and the cooling state, the control device 500 is electrically connected to the temperature adjustment device 300, the control device 500 is disposed on a side of the second apparatus main body 200 facing away from the first apparatus main body 100, and the control device 500 is electrically connected to the detection device 400 through the second through hole 211 a. When the crystal needs to be heated, the control device 500 controls the temperature adjusting device 300 to be in a heating state; when the crystal needs to be cooled, the control device 500 controls the temperature adjusting device 300 to be in a refrigerating state, and in this process, the control device 500 can adjust the working state of the temperature adjusting device 300 according to the detection result of the detection device 400. Of course, the control device 500 may supply power to the detection device 400 and the temperature adjustment device 300, and the like, and is not particularly limited herein.

Optionally, the first device body 100 includes an operating member 120, where a first end of the first device body 100 is hinged to the second device body 200, the operating member 120 is located at an end of the first device body 100 away from the first end, where the moment arm of the first device body 100 is longer, and the first device body 100 can be driven to rotate by a smaller force.

Optionally, the crystal inspection apparatus further includes a bracket 700 and a base 800, the bracket 700 is connected between the base 800 and the second apparatus body 200, and the bracket 700 includes a first bracket body and a second bracket body that are disposed opposite to each other, so as to avoid the control device 500, so that heat dissipation of the control device 500 is facilitated, and meanwhile, stability of the second apparatus body 200 can be improved.

In the specific detection process of the crystal detection equipment, the crystal detection equipment is connected to a computer through a USB and is connected with a frequency meter through a radio frequency line; then, the first device body 100 is opened, the crystal is put into the accommodation groove 410, and the first device body 100 is covered to the second device body 200; then, setting a to-be-tested item in control software, clicking a button for starting testing, and automatically detecting by crystal detection equipment; and finally, after the detection is finished, outputting a detection result by the crystal detection equipment.

The electronic device disclosed in the embodiments of the present application may be a smart phone, a tablet computer, an electronic book reader, a wearable device (e.g., a smart watch), an electronic game machine, or the like, and the embodiments of the present application do not limit specific types of electronic devices.

The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.

Claims (10)

1. The utility model provides a crystal detection equipment, its characterized in that includes first equipment main part (100), second equipment main part (200), temperature regulating device (300) and detection device (400), first equipment main part (100) with second equipment main part (200) are articulated, first equipment main part (100) have first face (110), first face is equipped with mounting hole (111), temperature regulating device (300) set up in mounting hole (111), second equipment main part (200) have second face (210), second face (210) are equipped with mounting groove (211), detection device (400) install in mounting groove (211), detection device (400) are equipped with holding tank (410) that can hold the crystal,

when the first device body (100) is covered with the second device body (200), the first surface (110) is bonded to the second surface (210), and the temperature control device (300) is in contact with the crystal.

2. The crystal inspection apparatus according to claim 1, wherein the temperature adjusting device (300) includes a semiconductor cooling member (310) and a heat conducting member (320), a surface of the semiconductor cooling member (310) facing away from the heat conducting member (320) faces the outside environment, a first end of the heat conducting member (320) is connected to the semiconductor cooling member (310),

the second end of the heat conducting member (320) is in contact with the crystal with the first device body (100) being covered with the second device body (200).

3. The crystal inspection apparatus according to claim 2, wherein an end face of the second end of the heat conductive member (320) is provided with a groove (321), a groove bottom of the groove (321) is provided with a protrusion (321 a), a face of the inspection device (400) facing away from the groove bottom of the mounting groove (211) is a third face (420), the third face (420) is provided with a crystal bearing portion (421), a face of the crystal bearing portion (421) facing away from the groove bottom of the mounting groove (211) is provided with the accommodation groove (410),

the crystal bearing portion (421) is located in the groove (321) with the first device body (100) being covered with the second device body (200), and the protruding portion (321 a) is in contact with the crystal.

4. A crystal inspection apparatus according to claim 3, characterized in that the inspection device (400) comprises an inspection piece (430) and a crystal carrier (440), the crystal carrier (440) is superposed with the inspection piece (430), the inspection piece (430) is disposed at the bottom of the mounting groove (211), the crystal carrier (440) is provided with the crystal carrier (421), the bottom of the accommodating groove (410) is provided with a relief hole (411), and the inspection piece (430) can be contacted with the crystal through the relief hole (411).

5. The crystal inspection apparatus as claimed in claim 4, wherein the inspection member (430) includes a thimble (431), an end of the thimble (431) is passed through the escape hole (411) to contact the crystal,

the thimble (431) is an elastic thimble; and/or the number of the groups of groups,

the thimble (431) supports the crystal so that a gap is formed between the crystal and the bottom of the accommodation groove (410).

6. The crystal inspection apparatus according to claim 3, wherein the third face (420) has a boss (422), the crystal bearing portion (421) is provided to the boss (422),

when the first device body (100) is covered on the second device body (200), at least part of the boss (422) is positioned in the groove (321), and the outer peripheral surface of the boss (422) is attached to the inner surface of the groove (321).

7. The crystal inspection apparatus as set forth in claim 6 wherein the third face (420) is provided with an annular mounting groove (423), the annular mounting groove (423) being disposed around the boss (422), the inspection device (400) further comprising a seal disposed within the annular mounting groove (423),

the seal is in sealing engagement with the first face (110) when the first device body (100) is covered with the second device body (200).

8. A crystal inspection apparatus according to claim 3, wherein a side of the crystal carrying portion (421) facing away from the bottom of the mounting groove (211) is provided with a relief groove (421 a), one end of the relief groove (421 a) is communicated with the accommodating groove (410), and the other end of the relief groove (421 a) extends to the outer peripheral surface of the crystal carrying portion (421).

9. The crystal inspection apparatus according to claim 2, wherein the mounting hole (111) includes a first hole section (111 a) and a second hole section (111 b) that are communicated, a cross-sectional area of the second hole section (111 b) is larger than that of the first hole section (111 a), the semiconductor cooling member (310) is provided in the first hole section (111 a), and the heat conductive member (320) is provided in the second hole section (111 b).

10. The crystal inspection apparatus according to claim 9, wherein the mounting hole (111) further includes a third hole section (111 c) communicating with the first hole section (111 a) and the second hole section (111 b), respectively, the third hole section (111 c) being connected between the first hole section (111 a) and the second hole section (111 b), the cross-sectional areas of the second hole section (111 b), the third hole section (111 c) and the first hole section (111 a) being sequentially reduced, the first end of the heat conductive member (320) having a flange (322), the flange (322) being provided to the third hole section (111 c), an end face of the first end of the heat conductive member (320) being provided in contact with the semiconductor cooling member (310).

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