TW202309525A - Test device with floating adjustment function including a fixing member, a sliding member slidably disposed in the fixing member, and a plurality of elastic members disposed between the fixing member and the sliding member - Google Patents
Test device with floating adjustment function including a fixing member, a sliding member slidably disposed in the fixing member, and a plurality of elastic members disposed between the fixing member and the sliding member Download PDFInfo
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本發明是有關於一種電子元件測試裝置,特別是指一種具浮動調整功能的測試裝置。The invention relates to a testing device for electronic components, in particular to a testing device with a floating adjustment function.
參閱圖1,為一種習知的可靠度測試裝置,包含一測試機板11、數個設置於該測試機板11上的測試插座12、數個分別插設該等測試插座12的晶片13、數個分別用以貼靠該等晶片13的測試治具14,及一固定該等測試治具14且能上下位移的位移裝置15。透過該位移裝置15帶動該等測試治具14朝向該等晶片13移動,進而使每一個測試治具14能貼靠相對應之該晶片13上,藉此進行可靠度測試。Referring to Fig. 1, it is a kind of conventional reliability testing device, comprises a
然而,由於該測試機板11、該等晶片13與該等測試治具14在製作過程中,因材質或工藝因素難免會有製造公差的情況發生,以至於元件之間會有無可預知尺寸的差異,進而造成高低落差的現象。舉例來說,第一種情況為該測試機板11或該等測試插座12之高度不一致,又或是該等晶片13之厚度不一致,導致該等晶片13之頂面無法位於同一平面上,使得當該位移裝置15帶動該等測試治具14時,無法使每一個測試治具14貼靠相對應之該晶片13,以至於某一晶片13與某一測試治具14之間形成一空隙S1;第二種情況為該等測試治具14的尺寸規格稍有誤差,導致該等測試治具14在該位移裝置15上形成高低差異,當該等測試治具14受該位移裝置15帶動而朝向該等晶片13移動貼靠時,依然會形成上述之空隙S1的情況。因此,今若要一次測試數量較多的晶片13時(例如16片、32片、64片、128片或256片),勢必會形成更多的空隙S1,導致每一測試治具14無法確實地緊密貼靠相對應之該晶片13而進行可靠度測試,大幅地影響測試準確度,故上述缺失有待改善。However, due to the manufacturing process of the
因此,本發明之目的,即在提供一種具浮動調整功能的測試裝置。Therefore, the object of the present invention is to provide a testing device with a floating adjustment function.
於是,本發明具浮動調整功能的測試裝置,包含一能供熱量傳遞的溫控單元,及至少一設置於該溫控單元上的輔助調整塊。該至少一輔助調整塊能與該溫控單元進行熱交換,並包括一固定件、一設置於該固定件內的滑動件、至少一設置於該固定件與該滑動件間的彈性件,及一穿伸該滑動件的感溫件。Therefore, the test device with float adjustment function of the present invention includes a temperature control unit capable of heat transfer, and at least one auxiliary adjustment block arranged on the temperature control unit. The at least one auxiliary adjustment block can perform heat exchange with the temperature control unit, and includes a fixing piece, a sliding piece arranged in the fixing piece, at least one elastic piece arranged between the fixing piece and the sliding piece, and A temperature-sensing element piercing the sliding element.
該固定件固定於該溫控單元,且具有一平行該軸向方向的第一內周面、一銜接該第一內周面且垂直該軸向方向的頂抵面,及一銜接該頂抵面且沿該軸向方向朝該溫控單元延伸的第二內周面。該第一內周面圍繞界定一第一空間,該第二內周面圍繞界定一連通該第一空間的第二空間,該第二空間之內徑大於該第一空間之內徑。該滑動件設置於該固定件內而能與該固定件進行熱交換,並能相對於該固定件沿該軸向方向位移。該滑動件具有一位於該第二空間內且用以頂抵該頂抵面的定位部,及一由該定位部沿該軸向方向延伸且穿伸於該第一空間而露出於該固定件的延伸部。該延伸部形成一沿該軸向方向延伸的貫孔。該至少一彈性件設置於該第二空間內,且沿該軸向方向延伸,並具有一頂抵該滑動件的第一端,及一相反於該第一端且頂抵該固定件的第二端。該感溫件於該貫孔內沿該軸向方向延伸,且包括一遠離該定位部並用以量測溫度的感應端,及一位於該貫孔內,並連接該感應端而能帶動該感應端移動的彈性體。The fixing part is fixed on the temperature control unit, and has a first inner peripheral surface parallel to the axial direction, an abutting surface connected to the first inner peripheral surface and perpendicular to the axial direction, and an abutting surface connected to the abutting surface surface and extend along the axial direction toward the second inner peripheral surface of the temperature control unit. The first inner peripheral surface surrounds and defines a first space, the second inner peripheral surface surrounds and defines a second space connected to the first space, and the inner diameter of the second space is larger than the inner diameter of the first space. The sliding part is arranged in the fixing part and can exchange heat with the fixing part, and can be displaced along the axial direction relative to the fixing part. The sliding member has a positioning portion located in the second space and used to abut against the abutting surface, and a positioning portion extending from the positioning portion along the axial direction and passing through the first space to be exposed to the fixing member extension. The extending portion forms a through hole extending along the axial direction. The at least one elastic member is disposed in the second space, extends along the axial direction, and has a first end against the sliding member, and a first end opposite to the first end and against the fixing member. Two ends. The temperature-sensing element extends along the axial direction in the through hole, and includes an inductive end away from the positioning part for measuring temperature, and an inductive end located in the through hole and connected to the inductive end to drive the inductive end. end-moving elastic body.
本發明之功效在於:利用該滑動件能相對於該固定件位移的設計,再配合該至少一彈性件壓縮的機制,能矯正對於因製造公差而不處在共平面的電子元件能被該滑動件緊密貼靠,藉此進行可靠度測試。此外,藉由該溫控單元與該至少一輔助調整塊之間可透過熱傳導原理,進行熱交換以調和待測電子元件的溫度,達到符合高精準度的可靠度測試。The effect of the present invention lies in: the design that the sliding part can be displaced relative to the fixing part, combined with the compression mechanism of the at least one elastic part, can rectify the electronic components that are not in the same plane due to manufacturing tolerances. The components are closely attached to conduct reliability tests. In addition, through the heat conduction principle between the temperature control unit and the at least one auxiliary adjustment block, heat exchange is performed to adjust the temperature of the electronic component to be tested, thereby achieving high-precision reliability testing.
參閱圖2至圖4,為本發明具浮動調整功能的測試裝置之一第一實施例,適用於測試數個電子元件E。該第一實施例包含一溫控單元2,及數個設置於該溫控單元2上且分別用以貼靠該等電子元件E的輔助調整塊3。Referring to FIG. 2 to FIG. 4 , it is a first embodiment of the test device with float adjustment function of the present invention, which is suitable for testing several electronic components E. The first embodiment includes a
該溫控單元2包括一能供熱量傳遞的主體21、數個嵌設該主體21的加熱件22、數個嵌設該主體21的測溫件23,及一電連接該等加熱件22與該等測溫件23的監控件24。該主體21較佳以銅、鋁等金屬材質所製成,而有較佳的導熱能力。該等加熱件22較佳為加熱棒,但並不以此為限,亦可為加熱片。該等加熱件22用以對該主體21加熱,藉此調整該主體21的溫度。該等測溫件23較佳為熱電偶,但不以此為限,只要是溫度傳感器即可。每一測溫件23用以偵測該主體21部分區域的溫度,且據此產生一第一溫度訊息,並將該第一溫度訊息傳輸至該監控件24以顯示其溫度。該監控件24用以驅動任一加熱件22發熱,並接受來自該等測溫件23所傳輸的該等第一溫度訊息,藉此調整任一加熱件22的加熱效能,便能控制該主體21的整體溫度分佈,進而影響該等輔助調整塊3的溫度分佈,進一步達到溫度均勻化。The
該等輔助調整塊3間隔地設置於該溫控單元2上,並能與該溫控單元2進行熱交換。其中,每一輔助調整塊3具有一沿一軸向方向L往上貼靠該主體21的固定件31、一設置於該固定件31內的滑動件32、數個設置於該固定件31與該滑動件32之間的彈性件33、一穿伸於該滑動件32的感溫件34、一套設在該滑動件32上的套環件35,及數個固定該固定件31與該主體21的鎖固件36。另外需要說明的是,參閱圖5與圖6,該等輔助調整塊3呈方陣排列地設置在該主體21上,且該等輔助調整塊3之設置數量可組合成為圖5所示的4個,或圖6所示的16個為一基本單位,而後再依照其它需求排列組合成32個、64個、128個、256個等數種應用單位的數量。以沿該軸向方向L的視角觀點,每一輔助調整塊3較佳如圖5所示,具有四個圍繞該滑動件32外周圍的鎖固件36。此外,每一輔助調整塊3之形狀不以圖5所示的正方形為限制,亦可為長方形而能適用於測試長條型記憶體等元件。再者,每一輔助塊3用以接觸相對應之該電子元件E的接觸面不限制於平面狀,亦可隨著該電子元件E的表面形狀調整,例如遠離該電子元件E凹陷,或朝向該電子元件E突起等凹凸彎折狀。The
參閱圖2至圖4,每一固定件31具有一沿該軸向方向L延伸且貼靠固定在該主體21上而能進行熱交換的本體部311、一往下蓋設於該本體部311並貼靠該主體21的蓋體部312,及四個固定該本體部311與該蓋體部312的緊固部313。每一本體部311具有一平行該軸向方向L的第一內周面314、一銜接該第一內周面314且垂直該軸向方向L的頂抵面315、一銜接該頂抵面315且沿該軸向方向L朝該溫控單元2延伸的第二內周面316、一銜接該第二內周面316且垂直該軸向方向L而朝向該溫控單元2的連接面317,及一銜接該連接面317且沿該軸向方向L朝該溫控單元2延伸的第三內周面318。其中,每一固定件31之該第一內周面314圍繞界定一第一空間3101,每一固定件31之該第二內周面316圍繞界定一連通該第一空間3101的第二空間3102,每一固定件31之該第三內周面318圍繞界定出一連通該第二空間3102且供該蓋體部312容置的第三空間3103。在本第一實施例中,每一第二空間3102之內徑大於相對應之該第一空間3101之內徑,且位於該第一空間3101與相對應之該蓋體部312之間。每一第三空間3103之內徑大於相對應之該第二空間3102之內徑,且相較於該第二空間3102較鄰近該主體21。每一蓋體部312呈方形板體,且沿該軸向方向L頂抵相對應之該本體部311之連接面317,且其外周緣貼靠該第三內周面318而能與該本體部311進行熱交換。每一固定件31之該等緊固部313彼此相間隔,且沿該軸向方向L穿設該蓋體部312與該本體部311之連接面317。另外需要說明的是,該等本體部311與該等蓋體部312較佳以銅、鋁等金屬所製成,但並不以為限,只要能透過熱傳導現象而進行熱交換即可。該等緊固部313為螺絲,但不以此為限。2 to 4, each
該等滑動件32分別設置於該等固定件31內,且能與該等固定件31進行熱交換。每一滑動件32能與相對應之該固定件31沿該軸向方向L產生相對位移,且具有一位於該第二空間3102內且用以頂抵該頂抵面315的定位部321、一由該定位部321沿該軸向方向L延伸而呈柱狀的延伸部322,及一連接該延伸部322遠離該定位部321之一端且用以貼靠相對應之該電子元件E的導熱膠部323。其中,每一定位部321朝向該蓋體部312的端面向內凹陷形成數個沿該軸向方向L延伸的放置孔3201。每一延伸部322用以貼靠相對應之該固定件31之第一內周面314,且穿伸於相對應之該第一空間3101而露出於該固定件31遠離該溫控單元2之一端,並在中央處形成一沿該軸向方向L延伸的貫孔3202。每一導熱膠部323較佳以石墨所製成軟性片狀而能與相對應之該延伸部322進行熱交換,且具彈性而能塑性變形,並形成一連通相對應之該貫孔3202的通孔3203。另外需要說明的是,該等定位部321與該等延伸部322較佳以銅、鋁等金屬所製成,但並不以為限,只要能透過熱傳導現象而進行熱交換即可。以該軸向方向L的視角觀點下,每一滑動件32之該等放置孔3201會如圖5所示地圍繞該通孔3203,進而也會圍繞該貫孔3202。The
在其他實施例中,每一滑動件32不以該導熱膠部323的設置為必要,可針對不同的使用環境調整,使該延伸部322之一端直接貼靠相對應之該電子元件E,藉此進行熱交換。In other embodiments, the setting of the heat-conducting
每一輔助調整塊3之該等彈性件33較佳為彈簧,且設置於該第二空間3102內,並分別設置於該定位部321之該等放置孔3201。每一彈性件33沿該軸向方向L延伸,且具有一頂抵相對應之該定位部321的第一端331,及一相反於該第一端331且頂抵相對應之該蓋體部312,且位於該第一端331上方的第二端332。在本第一實施例中,該等第一端331分別設置於該等放置孔3201內。由於每一輔助調整塊3之該等放置孔3201呈方陣狀排列,以至於該等彈性件33能均勻地支撐於該固定件31與該滑動件32。The
該等感溫件34電連接該監控件24,並分別量測該等電子元件E的溫度。每一感溫件34位於相對應之該滑動件32的貫孔3202與該導熱膠部323之通孔3203內沿該軸向方向L延伸,且具有一連接該監控件24的連接端341、一沿該軸向方向L遠離該定位部321並用以量測相對應之該電子元件E之溫度而產生一第二溫度訊息的感應端342,及一位於該貫孔3202內,並連接該感應端342而能帶動該感應端342移動的彈性體343。在本實施例中,該感應端342為探針、該彈性體343為彈簧,但並不以此為限。其中,該等感溫件34能分別將該等第二溫度訊息傳輸至該監控件24顯示,而該監控件24能對應該等第二溫度訊息而調整任一加熱件22的加熱效能。The
該等套環件35分別套固在該等延伸部322上,用以承接由該等固定件31與該等滑動件32之間滴落的潤滑油。每一套環件35沿該軸向方向L與相對應之該固定件31相間隔,且具有一套設相對應之該延伸部322的第一環部351,及一由該第一環部351朝向該固定件31延伸並與該延伸部322相間隔的第二環部352。其中,該第一環部351、該第二環部352與該延伸部322之外周圍相配合界定一開口朝向該固定件31,並用以承接潤滑油等工作流體的承接槽350。The
參閱圖2與圖5,每一輔助調整塊3之該等鎖固件36彼此間隔呈方陣排列,並沿該軸向方向L穿設該溫控單元2之主體21該及相對應之該本體部311。其中,每一鎖固件36為螺絲,但不以此為限。2 and 5, the locking
在本第一實施例中,該等加熱件22其中兩個是沿該軸向方向L位於一個輔助調整塊3的上方,而該等測溫件23其中一個位於兩個加熱件22之間並沿該軸向方向L位於該輔助調整塊3的正上方,藉此即時地導熱至該調整輔助塊3,並能較準確地偵測該輔助調整塊3的溫度。然而,本第一實施例並不以此分佈狀況為限,實際情況可依照不同的需求進行調整。In this first embodiment, two of the
參閱圖4與圖7,本第一實施例使用時,會配合一供該溫控單元2鎖接的冷卻裝置4使用,藉此對該等電子元件E進行預燒預冷的可靠度測試或其它效能測試。該等電子元件E可為SSD卡、系統單晶片、FPGA晶片、或5G通訊晶片等晶片,亦可為應用於低溫狀態的車用IC或基地台晶片,但本第一實施例並不以上述態樣為限。其中,該等電子元件E分別設置於一測試機板5上的數個測試插座6。該測試機板5可供電於每一測試插座6,進而驅動相對應之該電子元件E運作,以利後續的可靠度測試。假設該等測試插座6沿該軸向方向L的高度稍有誤差,讓位於圖7中左側的該電子元件E會比右側的該電子元件E還高,使其頂面不處在一個平面S3上,當然實際情況並不以此條件為限。此外,圖7之該等電子元件E的數量僅為舉例說明,實際上可應需求調整。Referring to FIG. 4 and FIG. 7, when the first embodiment is used, it will be used in conjunction with a
首先,當施加一標準測試壓力後,該溫控單元2會帶動該等輔助調整塊3朝向該測試機板5位移,直到位於左側的該輔助調整塊3之滑動件32先觸抵相對應之該電子元件E;位於右側的該輔助調整塊3則與相對應之該電子元件E,因製造公差的關係使該電子元件E之頂面不處在該平面S3而不與另一個電子元件E處於共平面的關係,使得該輔助調整塊3之滑動件32尚未貼靠該電子元件E而如圖7上圖所示。First, when a standard test pressure is applied, the
接者,當該溫控單元2持續位移,直到位於左側的該輔助調整塊3之該固定件31如圖7下圖所示地接觸到一限高塊61而停止。整個移動過程中,由於位於左側的該輔助調整塊3之該滑動件32早已先貼靠該電子元件E,故會在該溫控單元2移動過程中,被迫改變與該固定件31間的相對位置,讓該滑動件32之定位部321朝向該固定件31之蓋體部312移動,並壓縮該等彈性件33而使該滑動件32之一端維持在該平面S3上,而能密切且緊貼於相對應之該電子元件E。相反地,位於右側的該輔助調整塊3之滑動件32能因該等彈性件33彈伸作用,在被常態性地彈伸出一個固定行程的狀態下持續地受該溫控單元2帶動而往下位移,直到該輔助調整塊3之滑動件32貼靠於相對應之該電子元件E為止。當然,此時若位於左側的該輔助調整塊3尚未貼靠該限高塊61,則該溫控單元2將持續位移,並能稍微壓縮位於右側之該輔助調整塊3的該等彈性件33,直到位於左側的該輔助調整塊3接觸該限高塊61為止。Then, when the
最後,當該等滑動件32分別觸抵該等電子元件E,便能透過繞傳導的方式,進行熱交換,藉此控制該等電子元件E的溫度,以便於預燒預冷的可靠度測試。其中,圖7省略該溫控單元2的部分構件,例如該監控件24,以利於簡化圖示。Finally, when the sliding
特別需要說明的是,為了測試晶片在長時間的高溫中是否能順利運作,會執行預燒的可靠度測試。故該第一實施例會配合該冷卻裝置4以冷卻該等電子元件E的溫度,避免該等電子元件E溫度過高而失去測試準確度。其中,由於該溫控單元2位於該冷卻裝置4與該等電子元件E之間,作為調和溫度的機制,緩和該等電子元件E的熱量傳遞,以避免該等電子元件E被該冷卻裝置4排熱過度而使溫度大幅下降的情況發生。再者,為了測試晶片在長時間冷浸泡是否能順利運作,或在低溫裝置是否能正常開機工作,會執行預冷的可靠度測試,透過該第一實施例之該溫控裝置以調節該等電子元件E的溫度,避免該等電子元件E溫度過低而失去測試準確度。其中,該溫控裝置作為調和溫度的機制,緩和該冷卻裝置4的冷卻能力,以避免該等電子元件E被該冷卻裝置4排熱過度而使溫度大幅下降的情況發生。因此,不論是預燒或預冷的可靠度測試,該溫控單元2皆作用以調和溫度,以緩和熱量傳遞,更能精準地使該等電子元件E保持特定的低溫或高溫,以增加測試準確性。It should be noted that, in order to test whether the chip can operate smoothly at high temperature for a long time, a burn-in reliability test will be performed. Therefore, the first embodiment cooperates with the
另外需要說明的是,透過該等導熱膠部323具彈性的設計,能使其觸抵該等電子元件E時產生塑性變形,使得該等導熱膠部323能緊密貼靠於因封裝過程中扭曲變形的該等電子元件E,藉此進行熱交換傳導作用。再者,由於該等滑動件32會分別在該等固定件31內位移,以至於需要添加潤滑油在每一延伸部322與相對應之該第一內周面314之間,藉此減少摩擦力與因熱漲冷縮的關係而相互卡住等情況發生而增加位移順暢度,而為了防止潤滑油從該等輔助調整塊3中滴落於該等電子元件E,該第一實施例即能透過該等承接槽350的設計,以承接並收集滴落的潤滑油,避免該等電子元件E受到汙染。再者,每一感溫件34藉由該彈性體343的設置,使得該感應端342在未受壓的情況下能持續地向外露出,而便於感測溫度。當該感應端342接觸到相對應之該電子元件E時,便能推動該彈性體343壓縮以確保該滑動件32能與該電子元件E完全密接,同時亦可作為緩衝措施以避免該感應端342壓毀。In addition, it should be noted that, through the elastic design of the thermally conductive
參閱圖8與圖9,為本發明具浮動調整功能的測試裝置之一第二實施例,與該第一實施例的差異之處為:該等固定件31之該等本體部311相互銜接為一體,該等蓋體部312相互銜接為一體。由於該等本體部311銜接為一體而能相互提供限位力,以至於該第二實施例之該等鎖固件36能如圖9所示地固定該等固定件31,便能大幅地減少該等緊固部313與該等鎖固件36的設置,藉此大量減少製作成本花費與組裝時間。另外,在其他實施例中,該等本體部311其中數個銜接為一體,以符合不同的需求。Referring to Fig. 8 and Fig. 9, it is a second embodiment of the test device with floating adjustment function of the present invention, the difference from the first embodiment is: the
參閱圖10與圖11,為本發明具浮動調整功能的測試裝置之一第三實施例,與該第一實施例的差異之處為:每一固定件31具有一沿一軸向方向L延伸且固定於該溫控單元2上的本體部311,及一位於該定位部321下方且往上蓋設於該本體部311,並可供該延伸部322穿伸的蓋體部312。每一本體部311具有圍繞該定位部321的該第二內周面316,且形成該第二空間3102以供該定位部321滑動設置。每一蓋體部312具有貼靠該延伸部322之外周圍的該第一內周面314,及位於該定位部321下方且供該定位部321抵靠的該頂抵面315。每一固定件31之該等緊固部313往上穿設鎖固該本體部311與該蓋體部312。每一滑動件32之定位部321貼靠該第二內周面316,該延伸部322貼靠該第一內周面314,藉此進行熱傳導。每一彈性件33之該第一端331頂抵該定位部321,該第二端332頂抵該本體部311之內壁面。另外需要說明的是,當該蓋體部312鎖固於該本體部311時,該頂抵面315部分銜接該第二內周面316。Referring to Fig. 10 and Fig. 11, it is a third embodiment of the test device with float adjustment function according to the present invention. The difference from the first embodiment is that each fixing
該第三實施例在組裝步驟上與該第一實施例不相同,可先將該等固定件31鎖固於該主體21上,接著將該等滑動件32分別設置於該第二空間3102內,即可將該等蓋體部312分別鎖固該等固定件31上,使該等滑動件32不會脫離該等固定件31,便能完成組裝。因此,藉由該等本體部311與該等蓋體部312間的空間配置關係,僅需要拆除該等蓋體部312,即可在不更動該等固定件31與該主體21的情況下,進行該等滑動件32的替換,進一步提升組裝效率。The third embodiment is different from the first embodiment in terms of assembling steps. Firstly, the fixing
參閱圖12與圖13,為本發明具浮動調整功能的測試裝置之一第四實施例,與該第三實施例的差異之處為:每一本體部311還具有一銜接該第二內周面316且垂直該軸向方向L而用以供該等彈性件33設置的連接面317,及一銜接該連接面317且沿該軸向方向L朝該溫控單元2延伸,且圍繞界定出一連通該第二空間3102之第三空間3103的第三內周面318。其中,每一連接面317朝向相對應之該定位部321,每一第三空間3103之內徑,小於相對應之該第二空間3102之內徑。每一滑動件32還具有一由該定位部321沿該軸向方向L遠離該延伸部322延伸,且能在該第三空間3103內滑動並接觸該第三內周面318的凸伸部324。由於該凸伸部324之外周為與該第三內周面318滑動地接觸,以至於能進一步地提升該固定件31與該滑動件32之間的熱交換作用。Referring to Fig. 12 and Fig. 13, it is a fourth embodiment of the test device with floating adjustment function according to the present invention. A
綜上所述,本發明具浮動調整功能的測試裝置透過該等滑動件32能相對於該等固定件31位移的設計,再配合該等彈性件33壓縮及該等導熱膠部323塑性變形的機制,能矯正對於不處在該平面S3的該等電子元件E同時進行可靠度測試,並能在不破壞該等電子元件E的情況下與其接觸。此外,藉由該溫控單元2與該等輔助調整塊3之間可透過熱傳導原理,進行熱交換以調和該等電子元件E的溫度,達到高精準度的可靠度測試,故確實能達成本發明之目的。To sum up, the test device with floating adjustment function of the present invention adopts the design that the sliding
惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。But what is described above is only an embodiment of the present invention, and should not limit the scope of the present invention. All simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the patent specification are still within the scope of the present invention. Within the scope covered by the patent of the present invention.
2:溫控單元 21:主體 22:加熱件 23:測溫件 24:監控件 3:輔助調整塊 31:固定件 3101:第一空間 3102:第二空間 3103:第三空間 311:本體部 312:蓋體部 313:緊固部 314:第一內周面 315:頂抵面 316:第二內周面 317:連接面 318:第三內周面 32:滑動件 3201:放置孔 3202:貫孔 3203:通孔 321:定位部 322:延伸部 323:導熱膠部 324:凸伸部 33:彈性件 331:第一端 332:第二端 34:感溫件 341:連接端 342:感應端 343:彈性體 35:套環件 350:承接槽 351:第一環部 352:第二環部 36:鎖固件 4:冷卻裝置 5:測試機板 6:測試插座 61:限高塊 E:電子元件 L:軸向方向 S3:平面 2: Temperature control unit 21: Subject 22: heating element 23: Temperature measuring piece 24: Monitoring parts 3: Auxiliary adjustment block 31:Fixer 3101: the first space 3102: second space 3103: The third space 311: Body Department 312: cover body 313: fastening part 314: the first inner peripheral surface 315: top contact surface 316: the second inner peripheral surface 317: connection surface 318: The third inner peripheral surface 32: Slider 3201: place hole 3202: through hole 3203: Through hole 321: Positioning Department 322: Extension 323: Thermal Adhesive Department 324: protruding part 33: Elastic parts 331: first end 332: second end 34: Temperature sensing part 341: connection end 342: sensing end 343:Elastomer 35: Collar piece 350: receiving groove 351: First ring department 352: The second ring 36: Locking piece 4: cooling device 5: Test board 6: Test socket 61: height limit block E: electronic components L: axial direction S3: plane
本發明之其它的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是一側視示意圖,說明一種習知的可靠度測試裝置; 圖2是一側視角度的示意圖,說明本發明具浮動調整功能的測試裝置之一第一實施例; 圖3是一側視角度的剖視分解示意圖,說明該第一實施例之一個輔助調整塊; 圖4是一側視角度的剖視示意圖,配合圖3說明該輔助調整塊之構件間的關係; 圖5與圖6皆是仰視圖,分別說明該第一實施例之不同數量的調整輔助塊設置於一主體的情況; 圖7是一側視角度的示意圖,說明該第一實施例之運作情況; 圖8是一側視角度的示意圖,說明本發明具浮動調整功能的測試裝置之一第二實施例; 圖9是一仰視圖,配合圖8說明該第二實施例之結構; 圖10是一側視角度的剖視示意圖,說明本發明具浮動調整功能的測試裝置之一第三實施例; 圖11是一仰視圖,配合圖10說明該第三實施例之結構; 圖12是一不完整的側視剖視圖,說明本發明具浮動調整功能的測試裝至之一第四實施例;及 圖13是一仰視圖,配合圖12說明該第四實施例之結構。 Other features and effects of the present invention will be clearly presented in the implementation manner with reference to the drawings, wherein: Fig. 1 is a schematic side view illustrating a known reliability testing device; Fig. 2 is a schematic diagram of a side view, illustrating a first embodiment of a test device with a floating adjustment function according to the present invention; Fig. 3 is a cross-sectional exploded schematic diagram of a side view, illustrating an auxiliary adjustment block of the first embodiment; Fig. 4 is a schematic cross-sectional view of a side view angle, in conjunction with Fig. 3 to illustrate the relationship between the components of the auxiliary adjustment block; Fig. 5 and Fig. 6 are bottom views, respectively illustrating the situation that different numbers of adjustment auxiliary blocks of the first embodiment are arranged on a main body; Fig. 7 is a schematic diagram of a side view, illustrating the operation of the first embodiment; Fig. 8 is a schematic diagram of a side view, illustrating a second embodiment of a test device with a floating adjustment function according to the present invention; Fig. 9 is a bottom view, which illustrates the structure of the second embodiment in conjunction with Fig. 8; 10 is a schematic cross-sectional view from a side view, illustrating a third embodiment of the test device with a floating adjustment function of the present invention; Fig. 11 is a bottom view, cooperating with Fig. 10 to illustrate the structure of the third embodiment; Fig. 12 is an incomplete side sectional view illustrating a fourth embodiment of the test device with float adjustment function of the present invention; and Fig. 13 is a bottom view illustrating the structure of the fourth embodiment in conjunction with Fig. 12 .
2:溫控單元 2: Temperature control unit
21:主體 21: Subject
22:加熱件 22: heating element
23:測溫件 23: Temperature measuring piece
24:監控件 24: Monitoring parts
3:輔助調整塊 3: Auxiliary adjustment block
31:固定件 31:Fixer
311:本體部 311: Body Department
312:蓋體部 312: cover body
32:滑動件 32: Slider
322:延伸部 322: Extension
323:導熱膠部 323: Thermal Adhesive Department
34:感溫件 34: Temperature sensing part
341:感應端 341: sensing end
35:套環件 35: Collar piece
36:鎖固件 36: Locking piece
61:限高塊 61: height limit block
E:電子元件 E: electronic components
L:軸向方向 L: axial direction
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