CN212006296U - TEC heat dissipation assembly for direct-insertion type multi-element area array detector - Google Patents
TEC heat dissipation assembly for direct-insertion type multi-element area array detector Download PDFInfo
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- CN212006296U CN212006296U CN202020222994.2U CN202020222994U CN212006296U CN 212006296 U CN212006296 U CN 212006296U CN 202020222994 U CN202020222994 U CN 202020222994U CN 212006296 U CN212006296 U CN 212006296U
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Abstract
The patent discloses a TEC radiator unit for cut straightly many units of area array detector. The detector works in a space vacuum environment, and the TEC heat dissipation assembly controls the temperature of the direct-insert type multi-element area array detector by utilizing heat conduction. The patent component comprises a thermoelectric cooler (TEC), a heat conduction copper sheet, an indium sheet, a metal flexible pressing frame and a metal supporting frame. The heat dissipation assembly is characterized in that the indium sheet is combined with the TEC and the heat conduction copper sheet by utilizing good plasticity, ductility and heat conductivity of the indium sheet, and the heat dissipation assembly is elaborately designed to jointly form the heat dissipation assembly with small thermal resistance, compact structure and accurate temperature control; the specially designed flexible metal pressure frame unloads large stress through low-rigidity elastic deformation of the flexible part of the pressure frame, and protects the multielement area array detector from deforming, losing efficacy or damaging under pressure. The device is particularly suitable for vacuum environment, aerospace field and small space occasion requiring precise temperature control.
Description
Technical Field
The patent discloses a TEC radiator unit for cut straightly many units of area array detectors, specially adapted vacuum environment, space flight field, need the little space occasion of accurate accuse temperature. The engineering guidance force is strong.
Background
With the development of science and technology, photoelectric detectors are increasingly used in precision electronic devices for distance measurement, speed measurement, imaging and the like. The photoelectric detector needs proper self and environment temperature during working, noise is increased due to large-range fluctuation of the temperature, electrical performance is reduced, and the technical indexes of the detector cannot meet established requirements. When the temperature exceeds a certain value, the life of the detector can be reduced and even damaged. The multielement area array detector has a narrow working temperature range, and puts high requirements on thermal control, works in a space vacuum environment, and utilizes heat conduction to cool the detector, so that one of the main heat dissipation means is provided. The thermoelectric cooler (TEC), the heat conduction copper sheet, the indium sheet and the metal flexible pressure frame which are contained by the patent component establish a reliable heat conduction path, the thermal resistance is small, the fixation is reliable, no extra large stress is caused to the multielement area array detector, the whole structure space utilization rate is high, the structure is compact, and the thermoelectric cooler is particularly suitable for the vacuum environment, the aerospace field and small space occasions needing precise temperature control. The engineering practice is strong.
Disclosure of Invention
The technical problem that this patent will be solved lies in overcoming prior art's defect, provides a but thermal resistance is little, compact structure, accurate temperature control's radiator unit.
The utility model provides a TEC radiator unit for cut straightly many unit area array detector, including heat insulating gasket 1, thermoelectric cooler TEC2, indium piece 3, heat conduction copper sheet 4, the flexible pressure frame of metal 5, metal support frame 6, its characterized in that:
the heat insulation gasket 1 is fixed between the multi-element area array detector 8 and the PCB7 through screws, the thermoelectric refrigerator TEC2 is adhered to the middle part of the bottom surface of the multi-element area array detector 8, the assembly formed in the way is installed on the left side of the metal support frame 6 through screws, the heat conduction copper sheet 4 is installed on the left side of the metal support frame 6 through screws, and the installation surface of the metal support frame 6 connected with the heat conduction copper sheet 4 is installed in a heat conduction mode with the low-temperature control surface. The indium sheet 3 is attached between the thermoelectric cooler TEC2 and the heat conducting copper sheet 4, the cold surface of the thermoelectric cooler TEC2 is attached to the middle part of the bottom surface of the multi-element area array detector 8, and the hot surface of the thermoelectric cooler TEC2 is attached to the indium sheet. The metal flexible pressing frame 5 is arranged from the right side of the metal supporting frame 6, the indium sheet 3 is pressed and thinned due to pressure generated in the screw fastening process, the metal flexible pressing frame 5 generates low-rigidity elastic deformation, and after the screws are fastened in place, the heat insulation gasket 1, the thermoelectric refrigerator TEC2, the indium sheet 3, the heat conduction copper sheet 4, the metal flexible pressing frame 5 and the multi-element area array detector 8 are fastened on the metal supporting frame 6 together to form a complete assembly.
The thickness of the heat insulation gasket 1 is not less than 2mm, and after the multielement area array detector is required to be installed in place, pins of the multielement area array detector can be exposed out of the back face of the PCB by 1-2 mm.
When the thermoelectric cooler TEC2 works, the temperature difference between the cold surface and the hot surface is not less than 20 ℃, and the power consumption is about 20W.
The heat conductivity of the indium sheet 3 is about 90W/m.k at normal temperature.
The heat conductivity of the heat-conducting copper sheet 4 is about 380W/m.k at normal temperature.
The elastic modulus of the metal flexible pressure frame 5 is 69GPa, the specific rigidity is 2.6, the middle part is provided with two crossed arms, the other parts are hollow, the cross section structure of the crossed arms is rectangular, and the two crossed arms are flexibly designed at 4 positions and are respectively positioned at two ends of the two crossed arms. The flexible portion also has a rectangular cross section, and the area thereof is 1/3-1/2 of the non-flexible portion.
The elastic modulus of the metal support frame 6 is 45GPa, the specific rigidity is 2.5, and the metal support frame is provided with mounting threaded holes of a multielement area array detector 8, a PCB7, a heat conducting copper sheet 4 and a metal flexible pressure frame 5.
And the PCB7 is provided with a mounting hole of a multi-element area array detector 8 pin.
The beneficial characteristics of this patent lie in:
1. the indium sheet is combined with the TEC and the heat conduction copper sheet by utilizing good plasticity, ductility and heat conductivity of the indium sheet, and the indium sheet and the TEC are well designed to jointly form a heat dissipation assembly with small thermal resistance, compact structure and accurate temperature control;
2. the specially designed flexible metal pressure frame unloads large stress through low-rigidity elastic deformation of the flexible part of the pressure frame, and protects the multielement area array detector from deforming, losing efficacy or damaging under pressure.
Drawings
FIG. 1 is a cross-sectional view of a TEC heat sink assembly for an in-line multi-element area array probe;
FIG. 2 is an exploded view of a TEC heat sink assembly for an in-line multi-element area array probe, wherein (1) is an exploded right view and (2) is an exploded left view;
fig. 3 is an assembly diagram of a TEC heat sink assembly for an in-line multi-element area array probe, in which (1) is an assembly right view and (2) is an assembly left view.
Detailed Description
The following describes in detail an embodiment of the method of the present patent with reference to fig. 1, 2 and 3.
In 8 pins of the multi-element area array detector are directly inserted into reserved jacks of the PCB7, in order to reduce unnecessary conduction heat exchange, a heat insulation gasket 1 is additionally arranged between the multi-element area array detector 8 and a PCB7, the thickness of the heat insulation gasket is not less than 2mm, and after the multi-element area array detector 8 needs to be installed in place, the pins of the multi-element area array detector can be exposed out of 1-2 mm of the back of the PCB. The middle part of the PCB7 is hollowed out to expose the bottom surface of the multi-element area array detector 8, and the hollowed-out size needs to ensure that the hole edge distance of the pin holes of the multi-element area array detector 1 is not less than 3 mm. Placing the PCB7 on the upper layer, pasting the TEC2 on the hollowed part of the PCB, leading out the electric wire of the carding TEC2, and directly contacting the cold surface of the TEC2 with the bottom surface of the multi-element area array detector 8. The indium sheet 3 is attached to the hot surface of the TEC2, and the indium sheet 3 has good plasticity and ductility and high heat conductivity coefficient. The heat conduction copper sheet 5 is arranged on the metal support frame 6 through screws, the middle of the metal support frame 6 is designed to be hollowed, and the hollowed area is slightly larger than the distribution area of the pins of the multi-element area array detector 8. And then the metal support frame 6 assembly is fixed with the multi-element area array detector 8, the PCB7, the TEC2 and the indium sheet 3 assembly into a whole through screws. The flexible metal pressing frame 5 is arranged from the right side of the metal supporting frame 6, two crossed arms are arranged in the middle of the flexible metal pressing frame 5, the rest parts of the flexible metal pressing frame are hollow, the cross sections of the crossed arms are rectangular, and the two crossed arms are flexibly designed at 4 positions and are respectively positioned at two ends of the two crossed arms. The flexible portion also has a rectangular cross section, and the area thereof is 1/3-1/2 of the non-flexible portion. In the process that the flexible metal pressure frame 5 is pressed by the screws, the pressing force generated by the crossed arms is transmitted to the bottom surfaces of the heat-conducting copper sheet 4, the indium sheet 3, the TEC2 and the multielement area array detector 8 and keeps balance with the reaction force generated by the bottom surface of the multielement area array detector 8, so that the TEC2, the indium sheet 3 and the heat-conducting copper sheet 4 are stably clamped in the middle to form a heat conduction path, and the heat on the bottom surface of the multielement area array detector 8 is transmitted to the low-temperature control surface of the metal support frame 6. The multi-element area array detector 8 is a precise device, and in order to prevent the multi-element area array detector 8 from deforming or even being damaged due to too large pressure generated by the flexible metal pressing frame 5, the heat dissipation assembly unloads large pressure into small pressure through good plasticity and ductility of the indium sheet 3 and low-rigidity elastic deformation of the flexible part of the flexible metal pressing frame 5, so that the multi-element area array detector 8 is protected from deforming, losing efficacy or damaging under the pressure. The heat dissipation assembly has the advantages of large stress during unloading and installation, accurate temperature control, small thermal resistance and compact overall structure.
Claims (8)
1. The utility model provides a TEC radiator unit for many unit area array of formula detector cut straightly, includes thermal-insulated gasket (1), thermoelectric cooler TEC (2), indium piece (3), heat conduction copper sheet (4), metal flexibility pressure frame (5), metal support frame (6), its characterized in that:
the heat insulation gasket (1) is fixed between the multi-element area array detector (8) and the PCB (7) through screws, the thermoelectric refrigerator TEC (2) is adhered to the middle part of the bottom surface of the multi-element area array detector (8), the assembly formed in the way is installed on the left side of the metal support frame (6) through screws, the heat conduction copper sheet (4) is installed on the left side of the metal support frame (6) through screws, and the installation surface of the metal support frame (6) connected with the heat conduction copper sheet (4) is installed with the low-temperature control surface in a heat conduction way; the indium sheet (3) is attached between the thermoelectric refrigerator TEC (2) and the heat conducting copper sheet (4), the cold surface of the thermoelectric refrigerator TEC (2) is attached to the middle part of the bottom surface of the multi-element area array detector (8), and the indium sheet is attached to the hot surface of the thermoelectric refrigerator TEC (2); the metal flexible pressing frame (5) is installed from the right side of the metal supporting frame (6), the indium sheet (3) is pressed to be thinned due to pressure generated in the screw fastening process, the metal flexible pressing frame (5) generates low-rigidity elastic deformation, and after the screws are fastened in place, the heat insulation gasket (1), the thermoelectric refrigerator TEC (2), the indium sheet (3), the heat conduction copper sheet (4), the metal flexible pressing frame (5) and the multi-element area array detector (8) are fastened on the metal supporting frame (6) together to form a complete assembly.
2. The TEC heat sink assembly of claim 1, wherein the TEC heat sink assembly comprises: the thickness of the heat insulation gasket (1) is not less than 2mm, and the pins of the heat insulation gasket are exposed out of the back face of the PCB by 1-2 mm after the multielement area array detector is installed in place.
3. The TEC heat sink assembly of claim 1, wherein the TEC heat sink assembly comprises: the thermoelectric cooler TEC (2) consumes 20W of power when working, and the temperature difference between the cold surface and the hot surface is not less than 20 ℃.
4. The TEC heat sink assembly of claim 1, wherein the TEC heat sink assembly comprises: the heat conductivity of the indium sheet (3) at normal temperature is 90W/m.k.
5. The TEC heat sink assembly of claim 1, wherein the TEC heat sink assembly comprises: the heat conductivity of the heat-conducting copper sheet (4) is 380W/m.k at normal temperature.
6. The TEC heat sink assembly of claim 1, wherein the TEC heat sink assembly comprises: the elastic modulus of the metal flexible pressure frame (5) is 69GPa, the specific stiffness is 2.6, the middle part is provided with two crossed arms, the rest parts are hollow, the cross-section structure of the crossed arms is rectangular, the two crossed arms are flexibly designed at 4 positions and are respectively positioned at two ends of the two crossed arms, the cross section of the flexible part is also rectangular, and the area of the flexible part is 1/3-1/2 of the non-flexible part.
7. The TEC heat sink assembly of claim 1, wherein the TEC heat sink assembly comprises: the elastic modulus of the metal support frame (6) is 45GPa, the specific rigidity is 2.5, and the metal support frame is provided with mounting threaded holes of a multi-element area array detector (8), a PCB (7), a heat-conducting copper sheet (4) and a metal flexible pressure frame (5).
8. The TEC heat sink assembly of claim 1, wherein the TEC heat sink assembly comprises: the PCB (7) is provided with a mounting hole for a multi-element area array detector (8) pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020222994.2U CN212006296U (en) | 2020-02-28 | 2020-02-28 | TEC heat dissipation assembly for direct-insertion type multi-element area array detector |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020222994.2U CN212006296U (en) | 2020-02-28 | 2020-02-28 | TEC heat dissipation assembly for direct-insertion type multi-element area array detector |
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| CN212006296U true CN212006296U (en) | 2020-11-24 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111219907A (en) * | 2020-02-28 | 2020-06-02 | 中国科学院上海技术物理研究所 | TEC heat dissipation assembly for direct-insert type multi-element area array detector |
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2020
- 2020-02-28 CN CN202020222994.2U patent/CN212006296U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111219907A (en) * | 2020-02-28 | 2020-06-02 | 中国科学院上海技术物理研究所 | TEC heat dissipation assembly for direct-insert type multi-element area array detector |
| CN111219907B (en) * | 2020-02-28 | 2024-03-26 | 中国科学院上海技术物理研究所 | TEC heat dissipation assembly for direct-insert type multi-element area array detector |
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