CN219019394U - Temperature control device - Google Patents
Temperature control device Download PDFInfo
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- CN219019394U CN219019394U CN202223243266.8U CN202223243266U CN219019394U CN 219019394 U CN219019394 U CN 219019394U CN 202223243266 U CN202223243266 U CN 202223243266U CN 219019394 U CN219019394 U CN 219019394U
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Abstract
The utility model discloses a temperature control device which comprises a supporting base, a radiator, a heat insulation assembly, a temperature control base and a semiconductor temperature control part, wherein the supporting base is provided with a mounting groove, the radiator is mounted in the mounting groove, the heat insulation assembly is mounted on the supporting base, the heat insulation assembly is provided with a mounting cavity with two open ends, the temperature control base is mounted in the mounting cavity, the temperature control base is used for bearing a sample, the temperature control base is provided with a temperature sensor, and the semiconductor temperature control part is clamped between the temperature control base and the radiator. The temperature control device is used for bearing the stability of the temperature control base of the sample, the deformation amount is smaller after long-time cold and hot alternate use, the parallelism error of the bottom wall of the temperature control device and the bearing surface of the temperature control base is smaller, the automatic pipetting is realized by an external instrument, the condensate water generated on the temperature control base during refrigeration can be reduced, and the probability of sample pollution is reduced.
Description
Technical Field
The utility model relates to the technical fields of bioscience technology and medical equipment, in particular to a temperature control device.
Background
In the fields of bioscience technology and medical instrument technology, a temperature control device is required to perform refrigeration and heating operations, and a low-temperature or high-temperature environment is provided for a solution such as a reagent or the like, or the temperature of the solution such as the reagent or the like is controlled. In the use process of instruments such as an automatic pipetting workstation, gene sequencing and the like, low temperature and high temperature control of a sample are involved, so that the sample can be ensured to perform corresponding physical reaction and chemical reaction processes, and final sample detection is completed. The existing temperature control device has the following problems:
first: the structural stability is poor, namely, after long-term high-low temperature alternate operation, the structure is influenced by expansion caused by heat and contraction caused by cold to a certain extent, so that the parallelism between the bearing surface of the carrier plate for bearing the object and the bottom wall of the whole temperature control device is poor, and the automatic pipetting function of the instrument on the reagent is influenced;
secondly, condensed water easily appears on the carrier plate carrying the sample during refrigeration, so that the sample is also attached with water beads, and the final detection result of the sample is affected.
Disclosure of Invention
The utility model aims to provide a temperature control device which is used for carrying a temperature control base of a sample, has good stability, small deformation after long-time cold and hot alternate use, small parallelism error of the bottom wall of the temperature control device and the carrying surface of the temperature control base, is beneficial to an external instrument to realize automatic pipetting, and can reduce condensed water generated on the temperature control base during refrigeration and reduce the probability of sample pollution.
In order to achieve the technical effects, the technical scheme of the utility model is as follows:
the utility model discloses a temperature control device, which comprises: the support base is provided with a mounting groove; the radiator is arranged in the mounting groove; the heat insulation assembly is arranged on the supporting base and is provided with an installation cavity with two open ends; the temperature control base is installed in the installation cavity and is used for bearing a sample, and a temperature sensor is arranged on the temperature control base; the semiconductor temperature control piece is clamped between the temperature control base and the radiator.
In some embodiments, the temperature control device further comprises an air duct member and a fan, the air duct member is connected with the support base, the air duct member has a heat dissipation air duct, the heat dissipation air duct is connected with the mounting groove, and the fan is arranged in the heat dissipation air duct.
In some specific embodiments, the support base includes a mount, the mount is coupled to the air duct member, and the fan is mounted to the mount.
In some specific embodiments, the support base includes a sealing plate mounted on a side of the mounting slot facing away from the heat dissipation air duct.
In some embodiments, two sides of the semiconductor temperature control element, which are oppositely arranged, are provided with heat conducting glue layers, so as to be respectively adhered to the temperature control base and the radiator.
In some embodiments, the heat insulation assembly is provided with a first mounting hole, the radiator is provided with a second mounting hole corresponding to the first mounting hole, the temperature control device comprises a connecting piece, and the heat insulation assembly and the radiator are connected through the connecting piece matched in the first mounting hole and the second mounting hole.
In some specific embodiments, an elastic member is disposed in the first mounting hole, the connecting member is a connecting bolt, the elastic member is sleeved on the connecting bolt, one end of the elastic member is abutted against the bolt head of the connecting bolt, and the other end of the elastic member is abutted against the step surface in the first mounting hole.
In some embodiments, the insulation assembly comprises an insulation sleeve and a thermal sleeve, the insulation sleeve being externally sleeved to the thermal sleeve; the temperature control base comprises a stopping part and a plugging part, wherein the stopping part is abutted to the end face of the heat preservation sleeve, and the plugging part is inserted into the heat preservation sleeve and abutted to the semiconductor temperature control piece.
In some embodiments, the support base comprises: a temperature control base; the heat insulation assembly comprises two temperature control supports, wherein the two temperature control supports are arranged on the two sides of the heat radiator at intervals, the two temperature control supports are arranged on the temperature control base at intervals and are respectively positioned on the two sides of the heat radiator, and one side, away from the temperature control base, of the two temperature control supports is abutted to the heat insulation assembly.
In some embodiments, one of the temperature control base and the temperature control support is provided with a positioning hole, and the other is provided with a positioning column matched with the positioning hole.
The temperature control device has the beneficial effects that: because the heat insulation assembly is installed on the supporting base, and the temperature control base is installed in the installation cavity formed by the heat insulation assembly, the heat insulation assembly is adopted as a bridge in the embodiment, the temperature control base and the supporting base are connected, the structure is stable, the deformation caused by expansion caused by heat and contraction caused by cold is small, the parallelism between the bearing surface of the temperature control base and the bottom surface of the supporting base is ensured, and therefore, the automatic pipetting of an external instrument is facilitated. Meanwhile, the heat insulation assembly formed by the low-heat-conductivity material wraps the periphery of the temperature control base, so that the contact area between the temperature control base and air is greatly reduced, condensed water generated on the temperature control base during refrigeration is reduced, and the probability of sample pollution is reduced.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
FIG. 1 is a schematic diagram of a temperature control device according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of another direction of a temperature control device according to an embodiment of the present utility model;
FIG. 3 is an exploded view of a temperature control device according to an embodiment of the present utility model;
FIG. 4 is a cross-sectional view of a temperature control device of the present utility model.
Reference numerals:
1. a support base; 101. a mounting groove; 11. a mounting base; 12. a sealing plate; 13. a temperature control base; 131. positioning holes; 14. a temperature control support; 141. positioning columns;
2. a heat sink; 201. a second mounting hole;
3. a thermal insulation assembly; 301. a first mounting hole; 302. a mounting cavity; 31. a heat insulating sleeve; 32. a thermal insulation sleeve;
4. a temperature control base; 41. a stop portion; 42. a plug-in part;
5. a temperature sensor; 6. a semiconductor temperature control member; 7. an air duct member; 71. a heat dissipation air duct;
8. a fan; 9. a heat conducting adhesive layer; 10. a connecting piece; 20. an elastic member.
Detailed Description
In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the utility model more clear, the technical scheme of the utility model is further described below by a specific embodiment in combination with the attached drawings.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly, for distinguishing between the descriptive features, and not sequentially, and not lightly. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The specific structure of the temperature control device according to the embodiment of the present utility model is described below with reference to fig. 1 to 4.
The utility model discloses a temperature control device, as shown in fig. 1-2, the temperature control device of the embodiment comprises a support base 1, a radiator 2, a heat insulation component 3, a temperature control base 4 and a semiconductor temperature control piece 6, wherein the support base 1 is provided with a mounting groove 101, the radiator 2 is mounted in the mounting groove 101, the heat insulation component 3 is mounted on the support base 1, the heat insulation component 3 is provided with a mounting cavity 302 with two open ends, the temperature control base 4 is mounted in the mounting cavity 302, the temperature control base 4 is used for bearing a sample, the temperature control base 4 is provided with a temperature sensor 5, and the semiconductor temperature control piece 6 is clamped between the temperature control base 4 and the radiator 2.
Firstly, it should be noted that, in the actual working process, after the semiconductor temperature control element 6 is electrified with direct current, a certain temperature difference is formed between the upper and lower surfaces of the semiconductor temperature control element 6, and heat is transferred between the temperature control base 4 and the radiator 2, so as to realize the heating or refrigerating process of the temperature control base 4. The temperature change direction of the temperature control base 4 can be changed by changing the direction of the current of the semiconductor temperature control element 6, and the specific temperature of the temperature control base 4 can be stably controlled by changing the magnitude of the current of the semiconductor temperature control element 6 and receiving feedback of the temperature sensor 5.
It can be understood that, since the heat insulation component 3 is installed on the support base 1, and the temperature control base 4 is installed in the installation cavity 302 formed by the heat insulation component 3, that is, in this embodiment, the heat insulation component 3 is used as a bridge to connect the temperature control base 4 with the support base 1, the structure is stable, the deformation caused by expansion with heat and contraction with cold is small, and the parallelism between the bearing surface of the temperature control base 4 and the bottom surface of the support base 1 is ensured, so that the automatic pipetting of an external instrument is facilitated. Meanwhile, the heat insulation component 3 made of low-heat-conductivity materials wraps the periphery of the temperature control base 4, so that the contact area between the temperature control base 4 and air is greatly reduced, condensed water generated on the temperature control base 4 during refrigeration is reduced, and the probability of sample pollution is reduced.
In some embodiments, as shown in fig. 3-4, the temperature control device further includes a duct member 7 and a fan 8, the duct member 7 is connected to the support base 1, and the duct member 7 has a heat dissipation duct 71, the heat dissipation duct 71 is connected to the mounting groove 101, and the fan 8 is disposed in the heat dissipation duct 71. It can be understood that the air cooling mode of arranging the fan 8 in the heat dissipation air duct 71 can rapidly take away the heat of the radiator 2, so as to enhance the refrigeration performance. When the temperature control device is arranged in the instrument, air can only enter from the other side of the mounting groove 101 under the drive of the fan 8, heat of the radiator 2 can be rapidly taken away when passing through the radiator 2, and then the heat is transferred out of the radiating air duct 71, so that the heat is transferred to the outside of the instrument, and the heat dissipation performance of the temperature control device is improved, and the temperature control performance is enhanced. In the actual working process, different air duct members 7 can be replaced according to the different sizes of the devices installed by the temperature control device, so that the heat dissipation air duct 71 can be ensured to be communicated with the external environment.
In some embodiments, as shown in fig. 3, the support base 1 includes a mounting base 11, the mounting base 11 is connected to the duct member 7, and the fan 8 is mounted to the mounting base 11. It will be appreciated that, compared to directly fixing the fan 8 in the heat dissipation channel of the air duct member 7, the mounting seat 11 is adopted as a supporting structure of the fan 8, so that on one hand, the fan 8 can be conveniently mounted, and on the other hand, the mounting stability of the fan 8 can be ensured. It should be noted that, in the embodiment of the present utility model, the fan 8 may be mounted on the mounting base 11 by a screw, or may be mounted on the mounting base 11 by a buckle or other structure, which is not limited herein by the specific connection structure between the fan 8 and the mounting base 11.
In some specific embodiments, as shown in fig. 3, the support base 1 includes a sealing plate 12, and the sealing plate 12 is mounted on a side of the mounting groove 101 facing away from the heat dissipation air channel 71. It will be appreciated that the sealing plate 12 can prevent air from directly entering the heat dissipation air duct 71 without passing through the heat sink 2, so as to ensure that when the fan 8 is started, the heat sink 2 can dissipate heat as soon as possible, thereby improving the heat dissipation performance of the temperature control device to enhance the temperature control performance.
In some embodiments, as shown in fig. 3, two sides of the semiconductor temperature control 6 opposite to each other are provided with a thermal conductive adhesive layer 9 to be adhered to the temperature control base 4 and the heat sink 2, respectively. Therefore, the heat of the semiconductor temperature control element 6 can be stably transferred to the temperature control base 4 and the radiator 2, so that the heat radiation performance of the temperature control device is improved to enhance the temperature control performance. In the embodiment of the present utility model, the heat conductive adhesive layer 9 may be selected from heat conductive silicone grease or other adhesive layers capable of realizing rapid heat transfer.
In some embodiments, the heat insulation assembly 3 is provided with a first mounting hole 301, the radiator 2 is provided with a second mounting hole 201 corresponding to the first mounting hole 301, the temperature control device comprises a connecting piece 10, and the heat insulation assembly 3 and the radiator 2 are connected through the connecting piece 10 matched in the first mounting hole 301 and the second mounting hole 201. Thereby, the connection stability of the heat insulating assembly 3 and the heat sink 2 can be ensured, thereby indirectly ensuring stable contact of the temperature control base 4 and the heat sink 2.
In some specific embodiments, as shown in fig. 4, the elastic member 20 is disposed in the first mounting hole 301, the connecting member 10 is a connecting bolt, the elastic member 20 is sleeved on the connecting bolt, one end of the elastic member 20 abuts against the bolt head of the connecting bolt, and the other end abuts against the step surface in the first mounting hole 301. It will be appreciated that the elastic member 20 has three functions, first: functioning to connect the heat insulation assembly 3 and the radiator 2; second,: after the heat insulation assembly 3 and the radiator 2 are connected by using the connecting bolts, the temperature control base 4 can extrude the semiconductor temperature control piece 6, and the compressed elastic piece 20 can provide elastic pressure when the connecting bolts are installed so that the pressure born by the semiconductor temperature control piece 6 is moderate, and the phenomenon that the semiconductor temperature control piece 6 is crushed is avoided; third,: the connecting bolt adds between elastic component 20 fixed mode and makes control by temperature change base 4 and the semiconductor temperature control piece 6, and the radiator 2 is flexible connection with the connection between the semiconductor temperature control piece 6, avoids temperature control device to carry out high low temperature alternately after long-time, and its structure receives expend with heat and contract with cold to influence and take place deformation for heat conduction glue film 9 drops in the bonding surface, thereby influences the transmission of heat between control by temperature change base 4 and radiator 2, finally influences the control by temperature change performance.
In some embodiments, as shown in fig. 4, the insulation assembly 3 includes an insulation sleeve 31 and an insulation sleeve 32, the insulation sleeve 31 being sheathed over the insulation sleeve 32; the temperature control base 4 comprises a stopping part 41 and a plugging part 42, wherein the stopping part 41 is abutted against the end face of the heat preservation sleeve 32, and the plugging part 42 is inserted into the heat preservation sleeve 32 and abutted against the semiconductor temperature control 6. It can be understood that the heat insulation sleeve 31 made of low heat conductivity material wraps the periphery of the abutting portion 41, and the heat insulation sleeve 32 with low heat conductivity wraps the periphery of the inserting portion 42, so that the contact area between the temperature control base 4 and air is greatly reduced, and therefore, condensed water generated during refrigeration is reduced, and the probability of sample pollution is reduced.
In some embodiments, the support base 1 includes two temperature control bases 13 and two temperature control supports 14, the two temperature control supports 14 are disposed at intervals on the temperature control base 13 and are respectively located on two sides of the radiator 2, and one side of the two temperature control supports 14 away from the temperature control base 13 is abutted to the heat insulation component 3. It can be appreciated that the temperature control base 13 and the temperature control support 14 are detachable structures, the structure of the support base 1 can be adjusted according to the size of the radiator 2 in the actual working process, the radiator 2 can be ensured to be stably installed in the installation groove 101, the temperature control support 14 can stably support the heat insulation assembly 3, and the influence on the temperature control base 13 and the temperature control support 14 in the temperature change process of the temperature control base 4 is ensured to be smaller
In some embodiments, as shown in fig. 3, one of the temperature-controlled base 13 and the temperature-controlled support 14 is provided with a positioning hole 131, and the other is provided with a positioning post 141 matching the positioning hole 131. It can be appreciated that the positioning connection manner of the positioning column 141 and the positioning hole 131 can be adopted to conveniently connect the temperature control base 13 and the temperature control support 14, and the positioning of the temperature control support 14 relative to the temperature control base 13 can be quickly realized. Of course, in order to ensure the connection stability of the temperature control base 13 and the temperature control support 14, in other embodiments of the present utility model, besides the connection structure of the positioning hole 131 and the positioning post 141, the temperature control base 13 and the temperature control support 14 may be connected by adopting a structure such as a screw, a pin, or a buckle.
Examples:
as shown in fig. 1 to 4, the temperature control device of the present embodiment includes a support base 1, a radiator 2, a heat insulation assembly 3, a temperature control base 4, a semiconductor temperature control member 6, an air duct member 7 and a fan 8,
the support base 1 comprises an installation seat 11, a sealing plate 12, a temperature control base 13 and two temperature control supports 14, wherein the two temperature control supports 14 are arranged on the temperature control base 13 at intervals and are limited to be provided with an installation groove 101, the installation seat 11 is connected to one side of the temperature control support 14 through bolts, the sealing plate 12 is connected to one side of the temperature control support 14 through bolts, the radiator 2 is installed in the installation groove 101, the fan 8 is installed on the installation seat 11, the air duct piece 7 is connected to the installation seat 11 through bolts, and the air duct piece 7 is internally limited to be communicated with the installation groove 101 by a heat dissipation air duct 71. The heat insulation assembly 3 comprises a heat insulation sleeve 31 and a heat insulation sleeve 32, wherein the heat insulation sleeve 31 is sleeved outside the heat insulation sleeve 32, the heat insulation sleeve 31 is provided with a first mounting hole 301, a second mounting hole 201 which is correspondingly arranged with the first mounting hole 301 is formed in the radiator 2, and the heat insulation sleeve 31 and the radiator 2 are connected through connecting bolts which are matched in the first mounting hole 301 and the second mounting hole 201. The first mounting hole 301 is further internally provided with an elastic piece 20, the elastic piece 20 is sleeved on the connecting bolt, one end of the elastic piece 20 is abutted against the bolt head of the connecting bolt, and the other end is abutted against the step surface in the first mounting hole 301. The temperature control base 4 comprises a stopping part 41 and an inserting part 42, the stopping part 41 is abutted against the end face of the heat insulation sleeve 32, the inserting part 42 is inserted into the heat insulation sleeve 32, and heat conducting adhesive layers 9 are arranged on two sides of the semiconductor temperature control 6, which are oppositely arranged, so as to be respectively adhered to the inserting part 42 and the radiator 2. The temperature control base 4 is provided with a temperature sensor 5.
The temperature control device of this embodiment has the following advantages:
first: the heat insulation assembly 3 is used as a bridge to connect the temperature control base 4 and the support base 1, the structure is stable, the deformation caused by expansion with heat and contraction with cold is small, the parallelism between the bearing surface of the temperature control base 4 and the bottom surface of the support base 1 is ensured, and therefore the automatic pipetting of external instruments is facilitated;
second,: the heat insulation component 3 formed by the low heat conduction material wraps the periphery of the temperature control base 4, so that the contact area between the temperature control base 4 and air is greatly reduced, condensed water generated on the temperature control base 4 during refrigeration is reduced, and the probability of sample pollution is reduced;
third,: the heat of the radiator 2 can be rapidly taken away by adopting an air cooling mode of arranging the fan 8 in the heat dissipation air duct 71, and the refrigerating performance is enhanced. Air enters from the other side of the mounting groove 101 under the drive of the fan 8, heat of the radiator 2 can be rapidly taken away when the air passes through the radiator 2, and then the air is transferred out of the radiating air duct 71, so that the radiating performance of the temperature control device is improved, and the temperature control performance is enhanced;
fourth,: the connecting bolt adds between elastic component 20 fixed mode and makes control by temperature change base 4 and the semiconductor temperature control piece 6, and the radiator 2 is flexible connection with the connection between the semiconductor temperature control piece 6, avoids temperature control device to carry out high low temperature alternately after long-time, and its structure receives expend with heat and contract with cold to influence and take place deformation for heat conduction glue film 9 drops in the bonding surface, thereby influences the transmission of heat between control by temperature change base 4 and radiator 2, finally influences the control by temperature change performance.
In the description of the present specification, reference to the term "some embodiments," "other embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely exemplary of the present utility model, and those skilled in the art should not be considered as limiting the utility model, since modifications may be made in the specific embodiments and application scope of the utility model in light of the teachings of the present utility model.
Claims (10)
1. Temperature control device, its characterized in that includes:
a support base (1), the support base (1) having a mounting groove (101);
a radiator (2), wherein the radiator (2) is mounted on the mounting groove (101);
the heat insulation assembly (3), the heat insulation assembly (3) is installed on the supporting base (1), and the heat insulation assembly (3) is provided with an installation cavity (302) with two open ends;
the temperature control base (4), the temperature control base (4) is installed in the installation cavity (302), the temperature control base (4) is used for bearing a sample, and a temperature sensor (5) is arranged on the temperature control base (4);
the semiconductor temperature control piece (6), semiconductor temperature control piece (6) presss from both sides and establishes between control by temperature change base (4) and radiator (2).
2. The temperature control device according to claim 1, further comprising an air duct member (7) and a fan (8), wherein the air duct member (7) is connected with the support base (1), and the air duct member (7) has a heat dissipation air duct (71), the heat dissipation air duct (71) is connected with the mounting groove (101), and the fan (8) is provided in the heat dissipation air duct (71).
3. Temperature control device according to claim 2, characterized in that the support base (1) comprises a mounting seat (11), the mounting seat (11) is connected to the air duct element (7), and the fan (8) is mounted to the mounting seat (11).
4. Temperature control device according to claim 2, characterized in that the support base (1) comprises a closing plate (12), which closing plate (12) is mounted on the side of the mounting groove (101) facing away from the heat dissipation air duct (71).
5. The temperature control device according to any one of claims 1 to 4, characterized in that heat conducting glue layers (9) are arranged on two opposite sides of the semiconductor temperature control element (6) so as to be respectively bonded with the temperature control base (4) and the radiator (2).
6. The temperature control device according to any one of claims 1-4, characterized in that a first mounting hole (301) is formed in the heat insulation assembly (3), a second mounting hole (201) corresponding to the first mounting hole (301) is formed in the radiator (2), the temperature control device comprises a connecting piece (10), and the heat insulation assembly (3) and the radiator (2) are connected through the connecting piece (10) matched in the first mounting hole (301) and the second mounting hole (201).
7. The temperature control device according to claim 6, wherein an elastic member (20) is arranged in the first mounting hole (301), the connecting member (10) is a connecting bolt, the elastic member (20) is sleeved on the connecting bolt, one end of the elastic member (20) is abutted against a bolt head of the connecting bolt, and the other end is abutted against a step surface in the first mounting hole (301).
8. The temperature control device according to any one of claims 1-4, characterized in that the heat insulation assembly (3) comprises a heat insulation sleeve (31) and a heat preservation sleeve (32), the heat insulation sleeve (31) being sheathed on the heat preservation sleeve (32);
the temperature control base (4) comprises a stopping part (41) and a plugging part (42), the stopping part (41) is abutted to the end face of the heat preservation sleeve (32), and the plugging part (42) is inserted into the heat preservation sleeve (32) and is abutted to the semiconductor temperature control piece (6).
9. Temperature control device according to any of claims 1-4, characterized in that the support base (1) comprises:
a temperature control base (13);
the heat insulation device comprises two temperature control supports (14), wherein the two temperature control supports (14) are arranged at intervals, the two temperature control supports (14) are arranged on the two sides of the heat radiator (2) respectively, and one side, deviating from the temperature control base (13), of the two temperature control supports (14) is abutted to the heat insulation assembly (3).
10. The temperature control device according to claim 9, wherein one of the temperature control base (13) and the temperature control support (14) is provided with a positioning hole (131), and the other is provided with a positioning column (141) matched with the positioning hole (131).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223243266.8U CN219019394U (en) | 2022-12-05 | 2022-12-05 | Temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223243266.8U CN219019394U (en) | 2022-12-05 | 2022-12-05 | Temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219019394U true CN219019394U (en) | 2023-05-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223243266.8U Active CN219019394U (en) | 2022-12-05 | 2022-12-05 | Temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219019394U (en) |
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2022
- 2022-12-05 CN CN202223243266.8U patent/CN219019394U/en active Active
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