CN212992803U

CN212992803U - Heat radiator

Info

Publication number: CN212992803U
Application number: CN202020713540.5U
Authority: CN
Inventors: 蔡爱军; 刘徐
Original assignee: Suzhou Sonic Dynamics Testing Equipment Co ltd
Current assignee: Suzhou Sonic Dynamics Testing Equipment Co ltd
Priority date: 2020-04-30
Filing date: 2020-04-30
Publication date: 2021-04-16
Anticipated expiration: 2030-04-30

Abstract

The utility model discloses a heat dissipation device, which comprises a substrate and an installation space positioned on the substrate, wherein a heat dissipation part is arranged on the substrate; a plurality of radiating pipes are inserted in the substrate, and cooling media are filled in the radiating pipes. The utility model discloses can improve the efficiency of heat exchange.

Description

Heat radiator

Technical Field

The utility model particularly relates to a heat dissipation device.

Background

In order to ensure the working performance of power devices and the like in the prior art, a heat dissipation device needs to be arranged to improve the efficiency of heat exchange between the power devices and the outside. The heat sink comprises a base plate and fins vertically arranged on the base plate, and when the heat sink is used for assisting heat exchange of the power device, the heat exchange efficiency is improved mainly by using the heat conduction performance of the fins. However, when the power device is located inside a casing with a small space, heat is concentrated, and thus the heat dissipation requirement of the power device cannot be satisfied only by means of heat conduction through the fins.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to provide a heat abstractor, it can improve the efficiency of heat exchange.

In order to solve the above technical problem, the present invention provides a heat dissipation device, which includes a substrate and an installation space located on the substrate, wherein a heat dissipation portion is disposed on the substrate; a plurality of radiating pipes are inserted in the substrate, and cooling media are filled in the radiating pipes.

Furthermore, one end of the radiating pipe extends out of the substrate and is connected with the radiating part.

Further, the free end of the radiating pipe is lower than the radiating part connected with the radiating pipe.

Furthermore, the substrate is provided with a groove for embedding the radiating pipe.

The heat dissipation part comprises a first heat dissipation part, a second heat dissipation part and a third heat dissipation part, wherein the first heat dissipation part and the second heat dissipation part are both positioned on the upper surface of the substrate, and the third heat dissipation part is positioned on the lower surface of the substrate; the mounting space is located between the first heat sink member and the second heat sink member.

Further, the height of the first heat sink member is higher than the height of the second heat sink member.

Further, the third heat dissipation part comprises a plurality of heat dissipation units.

Furthermore, the heat dissipation part is clamped with the substrate, and heat conducting glue is arranged at the joint of the heat dissipation part and the substrate.

Furthermore, the surface of the heat dissipation part is coated with heat-conducting silica gel.

Further, the refrigerant is a refrigerant.

The utility model has the advantages that:

the liquid refrigerant can be vaporized into a gas state after absorbing heat, the vaporized refrigerant moves towards the cold end of the radiating pipe, and meanwhile, the refrigerant positioned at the cold end of the radiating pipe flows towards the hot end of the radiating pipe, so that the liquid refrigerant absorbs heat to be vaporized, and the circulation is carried out to realize cooling by utilizing vaporization heat absorption of the refrigerant;

utilize the cooperation of radiating part and cooling tube to improve the efficiency of heat exchange, inlay the cooling tube simultaneously and establish the volume that can reduce heat abstractor in the base plate to occupation space when can reducing its installation.

Drawings

Fig. 1 is a front view of the present invention;

fig. 2 is a top view of the present invention;

FIG. 3 is a schematic view of the heat pipe of the present invention;

fig. 4 is a schematic view of the heat dissipation unit of the present invention.

The reference numbers in the figures illustrate: 1. a substrate; 11. a groove; 2. an installation space; 3. a radiating pipe; 31. a cold end; 32. a hot end; 41. a first heat sink portion; 42. a second heat sink member; 43. a third heat sink portion; 431. and a heat dissipation unit.

Detailed Description

The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.

Referring to fig. 1-4, an embodiment of a heat dissipation apparatus of the present invention includes a substrate 1 and an installation space 2 located on the substrate 1, wherein the installation space 2 is for facilitating the fixing and assembling of a power device. Be provided with the radiating part on the base plate 1, 1 interpolation of base plate is equipped with a plurality of cooling tubes 3 simultaneously, and the cooling tube 3 intussuseption is filled with the refrigerant. The heat dissipation part on the substrate 1 has high thermal conductivity, so that it can accelerate the heat exchange efficiency between the power device and the outside, and increase the heat dissipation speed.

The refrigerant filled in the radiating pipe 3 comprises a hot end 32 and a cold end 31, and in the heat exchange process, when the refrigerant is positioned at the hot end 32, the state of the refrigerant is gaseous; when the refrigerant is at the far end, the state of the refrigerant is liquid. The liquid refrigerant can be vaporized into a gaseous state after absorbing the heat generated by the power device, the vaporized refrigerant moves towards the cold end 31 of the radiating pipe 3, and meanwhile, the refrigerant positioned at the cold end 31 of the radiating pipe 3 also flows towards the hot end 32 of the radiating pipe 3, so that the liquid refrigerant absorbs the heat of the substrate 1 and the power device to be vaporized, and the circulation is performed to realize cooling by utilizing the vaporization heat absorption of the refrigerant. In this embodiment, the refrigerant is a refrigerant capable of absorbing heat.

Utilize the cooperation of radiating part and cooling tube 3 can improve the efficiency of heat exchange, inlay the cooling tube 3 simultaneously and establish the volume that can reduce heat abstractor in base plate 1 to occupation space when can reducing its installation. In order to facilitate the radiating pipe 3 to be embedded in the substrate 1, the substrate 1 comprises a base body and a covering part, the radiating pipe 3 is arranged on the upper surface of the base body, then the covering part is covered above the radiating pipe 3 and the base body, and the base body and the covering part are fixed through fastening screws and/or heat conducting glue, so that the radiating pipe 3 is embedded in the substrate 1.

One end of the radiating pipe 3 is protruded from one side of the base plate 1, and the protruded end of the radiating pipe 3 is connected with the radiating part. In this embodiment, the end of the heat pipe 3 extending from the substrate 1 is a cold end 31, and the end inserted into the substrate 1 is a hot end 32. One end of the radiating pipe 3 extends out of the base plate 1, so that the refrigerant can flow in the radiating pipe 3 conveniently, and the heat exchange efficiency of the radiating pipe 3 can be further improved.

The free end of the radiating pipe 3 is located below the radiating portion connected thereto, i.e., the end of the radiating pipe 3 protruding from the inside of the base plate 1 has a height lower than that of the radiating portion connected thereto, so that the power device is mounted above the radiating pipe 3. In addition, the base plate 1 is formed with a groove 11, and the groove 11 is used for embedding the heat dissipation pipe 3. The groove 11 is used to facilitate the restriction of the direction in which the radiating pipe 3 is embedded inside the base plate 1, so as to reduce the position deviation and dislocation of the radiating pipe 3 during the sealing process.

The heat dissipation part comprises a first heat dissipation part 41, a second heat dissipation part 42 and a third heat dissipation part 43, wherein the first heat dissipation part 41 and the second heat dissipation part 42 are arranged on the upper surface of the substrate 1, and the third heat dissipation part 43 is arranged on the lower surface of the substrate 1; while the mounting space 2 is located between the first heat sink member 41 and the second heat sink member 42. The first heat sink portion 41, the second heat sink portion 42, and the third heat sink portion 43, which are dispersedly disposed, can improve the heat exchange efficiency of the heat sink. The third heat sink portion 43 located at the lower surface of the substrate 1 can increase the gap between the substrate 1 and the case, thereby facilitating the flow of air under the substrate 1, and thus can increase the speed of heat exchange of the heat sink. In order to save the installation space 2, the first heat dissipation part 41, the second heat dissipation part 42 and the installation space 2 on the upper surface of the substrate 1 can be provided with electric elements, so that the electric elements in the shell can be reasonably arranged, and the whole size of the equipment can be reduced.

The first heat sink member 41 has a height higher than that of the second heat sink member 42 so as to properly arrange the electric components mounted on the first and second

heat sink members

41 and 42. In the present embodiment, the first heat sink 41 is used for mounting the functional module, and the second heat sink 42 is used for mounting the driver board for controlling the functional module.

The third heat dissipation part 43 includes a plurality of heat dissipation units 431, and the heat dissipation units 431 with the same specification are spliced to form the third heat dissipation part 43 with a required size, so that the processing of the third heat dissipation part 43 is facilitated, and the processing efficiency can be improved.

The heat dissipation part is clamped and fixed with the substrate 1, the end parts of the first heat dissipation part 41, the second heat dissipation part 42 and the third heat dissipation part 43 are respectively provided with a fixture block in a protruding manner, and meanwhile, the upper surface and the lower surface of the substrate 1 are respectively provided with a clamping groove for embedding the fixture block. The fitting of the fixture block and the engaging groove can facilitate the assembly of the heat sink member, and the accuracy of the positions of the first heat sink member 41, the second heat sink member 42, and the third heat sink member 43 can be ensured. In order to ensure the strength and stability of the heat dissipation device in the using process, the joints of the first heat dissipation part 41, the second heat dissipation part 42 and the third heat dissipation part 43 and the substrate 1 are coated with heat conduction glue, and the heat conduction glue can increase the stability of the first heat dissipation part 41, the second heat dissipation part 42 and the third heat dissipation part 43 when being clamped and connected and reduce the precision of the positions of the heat dissipation parts after the assembly and when in use; meanwhile, the heat-conducting glue can also improve the heat exchange efficiency between the substrate 1 and the heat dissipation part.

The surface of the heat dissipation part is coated with heat-conducting silica gel which has high bonding performance and super-strong heat-conducting performance; meanwhile, the heat-conducting silica gel is subjected to condensation reaction through moisture in the air to release low molecules to cause crosslinking and curing, and is vulcanized into a high-performance elastomer, so that the damage to an electrical element arranged above the heat dissipation part can be reduced, and the heat-conducting silica gel has a certain protection effect on the electrical element.

The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.

Claims

1. A heat dissipation device is characterized by comprising a substrate and an installation space positioned on the substrate, wherein a heat dissipation part is arranged on the substrate; a plurality of radiating pipes are inserted in the substrate, and refrigerants are filled in the radiating pipes; the heat dissipation part comprises a first heat dissipation part, a second heat dissipation part and a third heat dissipation part, wherein the first heat dissipation part and the second heat dissipation part are both positioned on the upper surface of the substrate, and the third heat dissipation part is positioned on the lower surface of the substrate; the mounting space is located between the first heat sink member and the second heat sink member.

2. The heat dissipating device of claim 1, wherein one end of said heat dissipating tube extends from said base plate and is connected to said heat dissipating portion.

3. The heat dissipating device of claim 2, wherein the free end of said heat dissipating pipe is lower than said heat dissipating portion connected thereto.

4. The heat dissipating device of claim 1, wherein the base plate has a groove for receiving the heat dissipating tube.

5. The heat sink of claim 1, wherein the first heat sink piece has a height higher than a height of the second heat sink piece.

6. The heat dissipating device of claim 1, wherein the third heat sink piece comprises a plurality of heat dissipating units.

7. The heat dissipation device of claim 1, wherein the heat dissipation portion is engaged with the substrate, and a heat conductive adhesive is disposed at a joint of the heat dissipation portion and the substrate.

8. The heat dissipating device of claim 1, wherein a surface of the heat dissipating portion is coated with a thermally conductive silicone.

9. The heat dissipating device of claim 1, wherein the refrigerant is a refrigerant.