JP2001053342A - Thermoelectric heater and cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain satisfactory heat efficiency and durability. SOLUTION: A cooler is equipped with a thermoelectric module 10, where n-type thermoelectric semiconductor elements 12n and p-type thermoelectric semiconductor elements 12p are connected alternately electrically in series with each other by an upper electrode plate 13 and a lower electrode plate 14 and a heat-generating face H, to generate heat at current application is made by the upper electrode plate 13 and a heat-absorbing face C for absorbing heat at current application is formed by the lower electrode plate 14, a heat sink 30 for heat radiation made of aluminum whose base part 13 of 2 mm or smaller thickness T is brought into contact with the heat generating face H, a compressive spring 34 which presses the base part 1 to the side of the thermoelectric module 10, and a liquid-cooled jacket 20 which contacts with the heat-absorbing face C of the thermoelectric module 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a thermoelectric heating / cooling device, and more particularly to a thermoelectric heating / cooling device capable of obtaining good thermal efficiency and durability.

[0002]

2. Description of the Related Art Conventionally, a thermoelectric / cooling device using a thermoelectric module, which is used as a small heat insulating / refrigerator for a vehicle, a cooling device for a CPU or an LSI of a computer, etc., is well known. The thermoelectric module utilizes the fact that two kinds of metals (thermoelectric elements) are alternately and electrically connected in series by electrode members, so that heat absorption and heat radiation occur in the electrode members due to the Peltier effect. In recent years, as such a thermoelectric / cooling device, a device using a so-called skeleton-type thermoelectric module in which two types of thermoelectric elements are exposed without being supported from the outside has attracted attention.

FIG. 6 shows an example of a thermoelectric heat insulating / cooling device using such a skeleton type thermoelectric module.
It is sectional drawing which shows the contact state of the thermoelectric module and the heat transfer member which transmits the heat from this thermoelectric module. In the thermoelectric module 10 of the thermoelectric / cooling device shown in FIG. 6, an n-type thermoelectric semiconductor element 12n and a p-type thermoelectric semiconductor element 12p, which are thermoelectric elements, are fitted into and supported by a partition plate 11. Electrode members (upper electrode plate 13 and lower electrode plate 14) whose surfaces are nickel-plated are joined by soldering between end faces of these n-type thermoelectric semiconductor elements 12n and p-type thermoelectric semiconductor elements 12p. Electrode plate 13 and lower electrode plate 1
4, the n-type thermoelectric semiconductor elements 12n and the p-type thermoelectric semiconductor elements 12p are electrically connected in series alternately. A DC power supply is connected to the upper electrode plate 13 and the lower electrode plate 14 via a lead wire 15. When a current flows from this power supply, the upper electrode plate 13 and the lower electrode plate 14 Heat is absorbed on one side and heat is released on the other. The upper electrode plate 13 and the lower electrode plate 14 are disposed on planes parallel to each other, and one of them forms a heat absorbing surface C,
The other forms a heat dissipation surface H. The heat absorbing surface C of the thermoelectric module 10 is in contact with a heat transfer means such as an outer wall of a cooling chamber (not shown), and the heat radiating surface is in contact with a heat sink 30 as a heat transfer means. It is sandwiched by means. In FIG. 6, for convenience, heat is absorbed in the upper electrode plate 13 and heat is released in the lower electrode plate 14. It is also possible to cause the upper end electrode plate 13 to emit heat as a heat absorbing effect.

As described above, in the thermoelectric heating / cooling apparatus using the skeleton type thermoelectric module 10, the upper electrode plate 1
Since the lower electrode plate 3 and the lower electrode plate 14 are exposed without being fixed to the substrate or the like, external members such as the outer wall of the refrigerator compartment and the heat sink 30 are directly contacted with the upper electrode plate 13 and the lower electrode plate 14. be able to. Therefore, there is an advantage that heat can be directly and efficiently exchanged between the heat absorption surface C or the heat radiation surface H of the thermoelectric module 10 and an external member. Further, since the upper electrode plate 13 and the lower electrode plate 14 are not fixed to the substrate, the upper electrode plate 13 and the lower electrode plate 14 are connected to external members in accordance with the temperature difference between the heat radiation surface H and the heat absorbing surface C. Along, the thermal strain generated in the thermoelectric semiconductor elements 12n and 12p is reduced. Therefore, the thermoelectric semiconductor elements 12n, 1
2p metal fatigue is reduced, and the thermoelectric semiconductor element 12
There is also an advantage that durability is improved as compared with a non-skeleton type thermoelectric module in which thermoelectric elements are fixed to a substrate, for example, the junction between the n, 12p and the upper electrode plate 13 or the lower electrode plate 14 is hardly released. is there.

[0005]

However, in the above-described thermoelectric heating / cooling apparatus, the heat absorbing surface C and the heat radiating surface H of the thermoelectric module 10 have the thermoelectric semiconductor elements 12n and 12p.
The upper electrode plate 13 and the lower electrode plate 1 as shown in a region K shown in FIG.
Due to a mounting error in fixing the heat sink 4, the heat absorbing surface C and the heat radiating surface H may have irregularities. Further, as in a region M shown in FIG. 6, irregularities may be generated on the heat absorption surface C and the heat radiation surface H due to a processing error of the upper electrode plate 13 and the lower electrode plate 14. And the heat absorbing surface C and the heat radiating surface H
When irregularities occur in the skeleton, there is a gap S between the heat absorbing surface C or the heat radiating surface H and the heat transfer means such as the heat sink 30, so that the thermal resistance increases, the heat conduction efficiency decreases, and the skeleton In some cases, the high efficiency of heat exchange, which is an advantage of the thermoelectric module, cannot be used. Further, when electricity is supplied, the heat dissipation surface H
Temperature difference between the heat-absorbing surface C side and the thermoelectric module 10
Inside, a stress is generated which tends to project toward the heat radiating surface H side. The thermoelectric module 10 is sandwiched between heat transfer means such as an outer wall of a cooling chamber and a heat sink 30. Since the heat transfer means resists stress, metal fatigue of the upper electrode plate 13 and the lower electrode plate 14 is reduced. , Thermoelectric semiconductor element 12n, 1
There is a possibility that the joint between the 2p and the upper electrode plate 13 and the lower electrode plate 14 may be separated.

Further, in a thermoelectric heating / cooling apparatus in which a plurality of thermoelectric modules are provided, and a heat transfer means is brought into contact with a heat absorbing surface or a heat radiating surface of these thermoelectric modules, furthermore, due to a mounting error between the thermoelectric modules, the thermoelectric module may be further damaged. There is a gap between the heat absorbing surface or the heat dissipating surface and the heat transfer means, the thermal resistance increases, the heat conduction efficiency decreases, and the cooling efficiency and the heating efficiency by the thermoelectric module may decrease. . As described above, in a thermoelectric heating / cooling device using a skeleton type thermoelectric module, further improvement in heat exchange efficiency and durability is desired.

[0007] The present invention has been made to solve the above-described problems, and has as its object to provide a thermoelectric heating / cooling apparatus capable of obtaining good heat exchange efficiency and durability.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above-mentioned object, the present invention provides a thermoelectric element in which first and second element members are electrically connected in series alternately by electrode members. The thermoelectric element, a thermoelectric module having a heat generating surface that generates heat when energized and a heat absorbing surface that absorbs heat when energized, and the electrode member that forms the heat radiating surface or the electrode member that forms the heat absorbing surface, A thermoelectric heating / cooling device comprising: a heat transfer unit that is in contact with the outside of the thermoelectric module and transfers heat of the electrode member; and a pressing unit that presses the heat transfer unit toward the thermoelectric module, The means is provided by providing a thermoelectric heating / cooling device in which a contact portion in contact with the electrode member is elastically deformable according to the shape of the heat radiating surface by being pressed by the pressing means. To achieve the above purpose.

In the thermoelectric heating / cooling device of the present invention,
When the contact portion of the heat transfer means is pressed against the heat dissipation surface or heat absorption surface formed of the electrode member, the contact portion of the heat transfer means is deformed according to the shape of the heat dissipation surface or heat absorption surface being pressed. Contact heat sink or heat sink. Therefore, the gap generated between the contact portion of the heat transfer means and the heat radiating surface or the heat absorbing surface can be kept small, and a decrease in heat transfer efficiency due to such a gap can be prevented. Further, in the heat transfer means, since the contact portion in contact with the electrode member is formed so as to be elastically deformable according to the shape of the heat dissipation surface or heat absorption surface, even if the thermoelectric module is deformed by thermal expansion due to energization, Since the contact part is deformed accordingly, the gap between the contact part and the heat dissipation surface or heat absorption surface is kept small,
A decrease in heat transfer efficiency can be avoided. Further, since the stress in the thermoelectric module is eliminated, metal fatigue due to thermal strain and detachment of the junction are avoided.

[0010] In the thermoelectric heating / cooling apparatus according to the present invention, the contact portion of the heat transfer means may be formed of an aluminum member having a thickness in a direction substantially perpendicular to an electrode member to be contacted of 2 mm or less. it can. In the thermoelectric heating / cooling device of the present invention, the pressing means is a support member fixedly arranged on the electrode member on a side opposite to the electrode member of the heat transfer means, and the support member and the electrode member And a compression spring disposed between them.

The thermoelectric heating / cooling apparatus according to the present invention includes a plurality of the thermoelectric modules, and the heat transfer means contacts each of the plurality of thermoelectric modules to transfer the heat of the electrode members of each thermoelectric module, and The means may press the contact portions of the heat transfer means toward the respective thermoelectric modules. In the thermoelectric heating device of the present invention, by deforming the contact portion of the heat transfer means,
A mounting error between the plurality of thermoelectric modules is absorbed, and a gap between the heat transfer means and the heat radiating surface or the heat absorbing surface caused by the mounting error can be reduced to prevent a decrease in heat transfer efficiency. In this case, the heat transfer means may have a diaphragm groove at a facing portion facing between the thermoelectric modules. Thereby, the deformation of the contact portion in one thermoelectric module does not affect the contact portion with another thermoelectric module,
The contact portion of the heat transfer means is more appropriately deformed for each of the plurality of thermoelectric modules, and the gap generated between the heat transfer means and the heat radiating surface or the heat absorbing surface is surely reduced to reduce the heat transfer efficiency. Can be prevented.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a cross-sectional view showing a schematic configuration of a cooling device for cooling an antifreeze of a radiator or the like as an embodiment of the thermoelectric heating / cooling device of the present invention.

The thermoelectric heating / cooling device (cooling device) of this embodiment includes a liquid cooling jacket 20 and a liquid cooling jacket 2.
The thermoelectric module 10 includes three thermoelectric modules 10 that oppose three opposing side walls and cools the side walls, and two heat sinks 30 as heat transfer members that radiate heat generated from the thermoelectric module 10.

The liquid cooling jacket 20 is formed by drilling two passages 21 and 21 which reciprocate a plurality of times around two pairs of side walls near a pair of side walls of a thermally conductive member such as a thick aluminum plate. Both ends of the passages 21 and 21 are communicated to the outside.
After the 1 has been circulated, it is allowed to flow out again. The surface of the liquid cooling jacket 20 is covered with a thermally conductive electric insulating layer. This thermally conductive electrical insulating layer has a thickness of several tens to several hundreds μm, preferably 15 to 100 μm.
m. In addition, as a material of the heat conductive electrical insulating layer,
For example, an epoxy resin to which a heat conductive filler is added, a fluorine resin coating agent, a silicon heat conductive adhesive, or the like can be used. And this liquid cooling jacket 2
On the two side walls 0, three thermoelectric modules 10 are arranged for each side wall, that is, a total of six thermoelectric modules 10 face each other.

FIG. 2 is a perspective view showing a thermoelectric module used in the cooling device of the present embodiment. As shown in FIG. 2, the thermoelectric module 10 includes a partition plate 11 having a through hole, an n-type thermoelectric semiconductor element 12n as a first member constituting the thermoelectric element, and a p-type thermoelectric element 12n as a second member.
Type thermoelectric semiconductor element 12p, and an upper electrode plate 13 and a lower electrode plate 14 as electrode members which are made of a copper plate or the like and electrically connect the n-type thermoelectric semiconductor element 12n and the p-type thermoelectric semiconductor element 12p. I have. n-type thermoelectric semiconductor element 12
The n-type and p-type thermoelectric semiconductor elements 12p have a columnar shape having the same diameter and the same coaxial length as each other, and penetrate through holes of the partition plate 11 and are fixed to the partition plate 11 at substantially center positions in the longitudinal direction at substantially right angles. Have been. The n-type thermoelectric semiconductor elements 12n and the p-type thermoelectric semiconductor elements 12p are arranged alternately, and are adjacent to thermoelectric semiconductor elements of different types. The partition plate 11 is an electrically insulating plate member, and for example, a glass epoxy plate or the like can be used. The partition plate 11 can be elastically deformed in the penetrating direction of the n-type and p-type semiconductor elements 12n and 12p, so that it can be disposed in both the liquid cooling jacket 20 and the heat sink 30 with as little gap as possible. It is preferable from the point of view. For the n-type thermoelectric semiconductor element 12n and the p-type thermoelectric semiconductor element 12p, a semiconductor single crystal such as bismuth tellurium can be used.

Then, one p-type thermoelectric semiconductor element 12p
And one n-type thermoelectric semiconductor element 12n is paired, and for each pair, an upper electrode plate 13 is provided between the upper end face of the p-type thermoelectric semiconductor element 12p and the upper end face of the n-type thermoelectric semiconductor element 12n. It is erected. The upper electrode plate 13 is provided on each upper end surface of the p-type thermoelectric semiconductor element 12p and the n-type thermoelectric semiconductor element 12n.
Joined by solder. All of the upper electrode plates 13 are arranged on one plane parallel to the partition plate 11, and the upper surface of the upper electrode plate 13 (the surface on the opposite side to the partition plate 11) is used. A heat absorbing surface C including a surface is formed. The heat absorbing surface C is disposed to face the liquid cooling jacket 10. A lower electrode plate is provided between the lower end surface of the n-type thermoelectric semiconductor element 12n of each pair and the lower end surface of a different pair of p-type thermoelectric semiconductor elements 12p adjacent to the n-type thermoelectric semiconductor element. 14 are installed. The lower electrode plate 13 is soldered to each lower end surface of the p-type thermoelectric semiconductor element 12p and the n-type thermoelectric semiconductor element 12n. The lower electrode plate 14 is disposed on another plane parallel to the partition plate 11 on a side opposite to the upper electrode plate 13 with respect to the partition plate 11, and a lower surface of the lower electrode plate 14 ( This lower 14 electrode plate 14 is formed by the surface opposite to the partition plate 11).
The heat radiating surface H including the lower surface is formed. Heat dissipation surface H
Are in contact with the heat sink 30. Upper electrode plate 13
A nickel layer is formed on the surface of the lower electrode plate 14 by plating. In the nickel layer, molecules such as copper constituting an electrode are formed of a thermoelectric semiconductor element (p-type thermoelectric semiconductor element 1).
It functions as a diffusion prevention layer for preventing diffusion into the 2p and n-type thermoelectric semiconductor elements 12n).

The upper electrode plate 13 and the lower electrode plate 1
4, the n-type thermoelectric semiconductor elements 12n and the p-type thermoelectric semiconductor elements 12p are alternately and electrically connected in series. Lead wires 15 are connected to the upper electrode plate 13 and the lower electrode plate 14 located at both ends of the series connection, and a current is supplied from a power source via the leads 15 in a predetermined direction. Then, heat is absorbed in the upper electrode plate 13 and heat is generated in the lower electrode plate 14 due to the Peltier effect. By supplying a current in the opposite direction, it is possible to cause the lower electrode plate 14 to generate an endothermic effect and the upper electrode plate 13 to generate a heat generating effect.

FIG. 3 is a diagram showing a cooling device according to this embodiment.
3 is a sectional view taken along line AA of FIG. In the present embodiment, as shown in FIG. 3, three thermoelectric modules 10 are electrically connected in series, and as shown in FIG. 1, three thermoelectric modules 10 are connected in series, respectively. The heat absorbing surface C is
The two side walls of the liquid cooling jacket 20 are arranged to contact different side walls. Then, the heat dissipation surfaces H of the two sets of three thermoelectric modules connected in series
, One heat sink 30 is in contact with each set. The liquid cooling jacket 20 and the thermoelectric module 1
0 is housed in the hollow portion of the frame 40, and the lead wire 1
5 is exposed to the outside from a lead wire through hole formed in the frame body 40. After exposing the lead wire 15 to the outside, the through hole is sealed with the curable resin 42 so that the inside of the frame body 40 can obtain good moisture resistance.

The two heat sinks 30 are both made of aluminum. These heat sinks 30 have a long plate shape with a thickness (T shown in FIG. 1) of 2 mm or less, and a heat conductive electrical insulating layer is laminated on one surface in a direction perpendicular to the thickness T. A base 31 is provided. This thermally conductive electrical insulating layer has a thickness of several tens to several hundreds μm, preferably 15 to 100 μm.
１００100 μm. Further, as the material of the thermally conductive electric insulating layer, for example, a material obtained by adding a thermally conductive filler to an epoxy resin, a fluorine resin coating agent, a silicon-based thermally conductive adhesive, or the like can be used. And the base part 3
The periphery of the surface on the side of the first electrical insulating layer is in contact with the end face of the frame body 40. In addition, the heat radiation surface H of the thermoelectric module 10 is in surface contact with each of the three portions (contact portions) in the longitudinal direction of the inner portion that is not the peripheral portion of the surface on the side of the electric insulating layer. FIG. 4 is a cross-sectional view taken along line BB of FIG. 1 showing the cooling device of the present embodiment. As shown in FIG. 4, the base portion 31 is a thin plate-like fin that is vertically erected from each of three regions 31 a, 31 b, and 31 c in the longitudinal direction of the surface on the side opposite to the electric insulating layer. 32 and a rod-shaped spring attachment portion 33. The spring mounting portion 33 has four corners and a substantially central portion 2 in each region.
The spring mounting portion 3 is formed at six locations.
A helix spring 34 is wound around 3. Base 3
As shown in FIG. 1, each of the regions 1 is separated from the surroundings by a diaphragm groove 36.

The fins 32 and the spring mounting portions 33 of the heat sink 30 are covered by a cover member 35 from the opposite side of the base 31. The cover member 35 is screwed to the base 31 with small screws 51. The lid member 35 is
It is screwed to the frame 40 by the large screw 52, and is fixed to the upper electrode plate 13 and the lower electrode 14 at a position opposite to the heat sink 30 and opposite to the upper electrode plate 13 and the lower electrode 14, and is supported. It functions as a member.

Further, the two heat sinks 30 of the frame 40 are
An O-ring groove 43 is formed on each of the surfaces of the opposing surfaces so as to go around the outer peripheral edge.
The ring 44 is fitted into the frame 40 and the heat sink 30.
Is sealed between. The O-ring 37 is also fitted between the outer peripheral edge of the lid member 35 and the heat sink 30 to seal the space between the lid member 35 and the heat sink 35.

FIG. 5 is an explanatory view schematically showing a contact state between the heat sink 30 and the thermoelectric module 10. FIG.
As shown in (1), irregularities (region K) due to processing errors and irregularities (region M) due to mounting errors of the upper and lower electrode plates 13 and 14 are formed on the heat radiation surface H and the cooling surface C of each thermoelectric module 10. Existing. When the cover member 35 functions as a support member, the helix spring 34 disposed between the cover member 35 and the base 31 functions as a pressing unit, and the base 31 is connected to the thermoelectric module 10. Press to the side. Therefore, the base 31 is deformed according to the shape of the thermoelectric module 10, and one of the thermoelectric modules 10 is deformed.
The heat dissipation surface H of each sheet is in contact with the heat dissipation surface H, and the gap between the heat dissipation surface H of the thermoelectric module 10 and the base 31 is minimized. At this time, the base portion 31 is
, And the displacement of the position in each thermoelectric module 10 is easily absorbed by the diaphragm groove 36,
It does not affect the adjacent thermoelectric module 10.

In the cooling apparatus according to the present embodiment having the above-described configuration, the thermoelectric module 10 is energized from an external power supply through the lead wire 15 so that the thermoelectric module 10
The liquid cooling jacket 20 which is in contact with the heat absorbing surface C is cooled,
Liquid such as antifreeze flowing through the passage 21 of the liquid cooling jacket 20 is cooled. In addition, cold water flows through a gap between the fins 32 of the heat sink 30 and the spring attachment portions 33, and the fins 32 of the heat sink 30 that have been heated by heat radiation from the heat radiation surface H of the thermoelectric jacket 10 are cooled.

At this time, the heat radiation surface H of the thermoelectric module 10
The gap between the thermoelectric module 10 and the heat sink 30 can be reduced as much as possible.
Thermal resistance between the thermoelectric module 1 and the thermoelectric module 1
Heat is transferred from 0 to the base 31 with high efficiency, and heat exchange is performed. Further, in the present embodiment, the partition plate 11 is elastically deformable in the penetrating direction of the n-type and p-type semiconductor elements 12 n and 12 p as the partition plate 11. Pressed toward the liquid cooling jacket 20 side, the gap between the lower electrode plate 14 and the liquid cooling jacket 20 is also reduced, and heat absorption from the liquid cooling jacket 20 to the cooling surface C of the thermoelectric module 10 is performed with high efficiency. . Then, at the time of energization, a stress is generated in the thermoelectric module 10 that tends to project toward the heat radiating surface H due to a temperature difference between the heat radiating surface H side and the heat absorbing surface C side. In the present embodiment, the helical spring 34 slightly expands and contracts in response to this stress,
The stress generated in the thermoelectric module 10 is reduced. Therefore, metal fatigue due to thermal strain and detachment of the junction between the upper and lower electrode plates 13 and 14 and the n-type thermoelectric semiconductor element 12n or the p-type thermoelectric semiconductor element 12p are unlikely to occur, and high durability can be obtained. .

It should be noted that the present invention is not limited to the above embodiment, and the shape, size, material, manufacturing procedure, and the like of each member can be appropriately changed without departing from the spirit of the present invention. is there. For example, in the above embodiment,
As the thermoelectric module 10, thermoelectric semiconductor elements 12n, 1
Although 2p is supported by the partition plate 11, a thermoelectric module without a partition plate may be used. In the above-described embodiment, the base portion 31 of the heat sink 30 is made of aluminum having a thickness of 2 mm or less to be elastically deformable. However, the present invention is not limited to this. For example, a material having more elasticity may be used. It may be used to form a thick base portion. Further, the present invention provides a plurality of thermoelectric modules 10 and one heat sink 3.
In the case of exchanging heat between the thermoelectric module and the heat transfer member such as the liquid cooling jacket 20, it is particularly useful in that the error in the position of each thermoelectric module can be absorbed. This is also useful in the case of exchanging heat with heat, since it is possible to avoid the generation of a gap between them and to obtain high heat exchange efficiency and durability.

In the above-described embodiment, a liquid-cooling type in which cold water is circulated between the fins 32 of the heat sink 30 is used as a heat radiating device for the heat radiating surface H of the thermoelectric module, but is not limited to this. Alternatively, an air-cooling type in which air is sent between the fins by a fan may be used. In the above-described embodiment, the pressing means is constituted by the cover member 35 as the support member and the helical spring 34 as the compression spring. However, the pressing means is not limited to this. The base 31 may be pressed by the liquid pressure of a liquid such as flowing cold water, or the base 31 may be pressed by the pressure of the gas in the case of air cooling or the like.

In the above-described embodiment, the cooling device is configured to cool the liquid passing through the liquid cooling jacket 20 by bringing the liquid cooling jacket 20 into contact with the heat absorbing surface C of the thermoelectric module 10. It can also be a device. For example, a refrigerator that transfers heat from the outer wall of the refrigerator compartment directly to the heat absorption surface C of the thermoelectric module 10 or through a heat transfer unit, or a cooling device that cools a CPU or an LSI of a computer can be used. Further, instead of a cooling device, a heating / cooling device capable of switching between cooling and heating by automatic control or manually, such as a heat keeping device or a heating device such as a heat keeping cabinet for keeping the inside of the compartment warm by heat from the heat radiating surface H. You can also. Nothing is attached to the heat absorbing surface C side or the heat radiating surface H side, and a member to be heated or a member to be cooled may be appropriately attached and used.

[0028]

As described above, according to the thermoelectric heating / cooling device of the present invention, high heat exchange efficiency and high durability can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a schematic configuration of a cooling device as one embodiment of a thermoelectric heating / cooling device of the present invention.

FIG. 2 is a perspective view showing a thermoelectric module used in the cooling device diagram of FIG. 1;

FIG. 3 is a cross-sectional view taken along line AA of FIG. 1 showing the cooling device of FIG. 1;

FIG. 4 is a sectional view taken along line BB of FIG. 1 showing the cooling device of FIG. 1;

FIG. 5 is an explanatory view schematically showing a contact state between a heat sink and a thermoelectric module of the cooling device of FIG. 1;

FIG. 6 is a schematic cross-sectional view showing a thermoelectric module and a heat transfer member for transmitting heat from the thermoelectric module in a thermoelectric heating / cooling device according to the related art.

[Explanation of symbols]

 Reference Signs List 10 thermoelectric module 11 partition plate 12n n-type thermoelectric semiconductor element 12p p-type thermoelectric semiconductor element 13 upper electrode plate 14 lower electrode plate 15 lead wire 20 liquid cooling jacket 21 passage 30 heat sink 31 base 32 fin 33 spring attachment portion 34 vine Spiral spring 35 Lid member 36 Diaphragm groove 37 O-ring 40 Frame 42 Curable resin 43 O-ring groove 44 O-ring 51 Small screw 52 Large screw

Claims (5)

[Claims] A first element member and a second element member constituting a thermoelectric element are alternately and electrically connected in series by an electrode member, and the heat generation surface which generates heat when energized and the heat absorption when energized by the thermoelectric element. A thermoelectric module having a heat-absorbing surface formed thereon, and the electrode member forming the heat-dissipating surface or the electrode member forming the heat-absorbing surface being in contact with the outside of the thermoelectric module to transfer heat of the electrode member. A thermoelectric heating / cooling device comprising: a heat transfer unit; and a pressing unit configured to press the heat transfer unit toward the thermoelectric module. The heat transfer unit includes a contact unit that contacts the electrode member.
By the pressing by the pressing means, it is possible to elastically deform according to the shape of the heat dissipation surface,
Cooling system. 2. The contact portion of the heat transfer means is formed of an aluminum member having a thickness in a direction substantially perpendicular to the electrode member of 2 mm or less.
The thermoelectric heating / cooling device according to 1. 3. A supporting member fixedly arranged on the electrode member on a side opposite to the electrode member with respect to the heat transfer means, and a pressing member disposed between the supporting member and the electrode member. And a compression spring provided.
Or the thermoelectric heating / cooling device according to claim 2. 4. A plurality of said thermoelectric modules, wherein said heat transfer means contacts each of said plurality of thermoelectric modules and transfers heat of said electrode members of each thermoelectric module, and said pressing means includes The thermoelectric heating / cooling device according to claim 1, wherein the contact portion is pressed toward each of the thermoelectric modules. 5. The thermoelectric heating / cooling device according to claim 4, wherein the heat transfer means has a diaphragm groove at a facing portion facing between the thermoelectric modules.