JP2001165525A - Thermoelectric heating/cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermoelectric heating/cooling device for appropriately securing the retention property of a sealed state by avoiding the decrease in durability caused by heat distortion due to the heat expansion and shrinkage of a thermoelectric module and sealing the thermoelectric module against the outside. SOLUTION: The thermoelectric heating/cooling device is provided with a thermoelectric module 10, a frame body 30 for accommodating the thermoelectric module 10, a cooling plate 20 that comes into contact with a heat absorption surface C of the thermoelectric module 10, and a liquid-cooled jacket 40 that comes into contact with the heat generation surface of the thermoelectric module 10. In the thermosetting heating/cooling device, the area between the cooling plate 20 and the frame body 30, and the area between a heat sink 41 of the liquid-cooled jacket 40 and the frame body 30 is sealed by an O ring 50, at the same time a compression spring 43 is arranged between a base part 42 of the liquid-cooled jacket 40 and the heat sink 41, and the thermoelectric module 10 is held between the cooling plate 20 and the heat sink 41 with the press force of the compression spring 43.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric heating / cooling apparatus provided with a thermoelectric module, and more particularly to a thermoelectric module which avoids a decrease in durability due to thermal expansion and contraction caused by thermal contraction of the thermoelectric module. It is an object of the present invention to provide a thermoelectric heating / cooling device capable of sealing against the outside and ensuring good holding of the sealed state.

[0002]

2. Description of the Related Art Conventionally, thermoelectric heating and cooling devices utilizing thermoelectric modules are well known. The thermoelectric module is configured such that a first element member and a second element member constituting a thermoelectric element pair are electrically connected in series alternately with an electrode member interposed therebetween. And a heat absorbing surface formed by the electrode member that absorbs heat. Then, a heat transfer means such as an aluminum plate or a heat pipe is brought into contact with a heat generating surface or a heat absorbing surface of the thermoelectric module,
The outside is kept warm by heat radiation from the heat dissipation surface, and the outside is cooled by heat absorption to the heat absorption surface. The heat transfer means is also brought into contact with the heat-generating surface or the heat-absorbing surface, which is not used for the purpose of keeping heat or cooling, in order to obtain good heat exchange efficiency. In particular, if the temperature of the heat generating surface is raised without contacting the heat transfer means, the heat will cause the joining of the element member and the electrode member by soldering or the like to be detached, so the heat transfer means is provided. It is necessary to. Such a thermoelectric heating / cooling device requires only a few millimeters between the heat-generating surface and the heat-absorbing surface of the thermoelectric module.
It is used as a cooling device for a PU, a cooling device for a chucking section of a freezing chucking device, and the like.

In a thermoelectric heating / cooling apparatus using such a thermoelectric module, the temperature of the heat generation side of the thermoelectric module rises due to heat radiation, and the metal electrodes and heat transfer means on the heat generation surface expand. On the other hand, the temperature decreases on the heat absorbing surface side due to an endothermic reaction, and the metal electrodes and heat transfer means on the heat absorbing surface contract. Since the heat generating surface and the heat absorbing surface of the thermoelectric module are separated from each other by only a few millimeters, a very large thermal strain occurs. Therefore, for the purpose of preventing the junction between the thermoelectric element and the metal electrode from being detached due to thermal strain, in recent years, a technique of sandwiching a thermoelectric module so as to be able to expand and contract by a heat transfer means has been proposed. Further, in the above-described thermoelectric heating / cooling device, it is necessary to minimize heat transfer between the heat absorbing surface side and the heat generating surface side. Further, in the thermoelectric module, when water droplets are formed due to dew condensation or the like due to temperature change, the metal electrodes are short-circuited.In a thermoelectric heating / cooling device using the thermoelectric module as described above, moisture from outside is applied to the thermoelectric module. It is necessary to shield and seal from the outside so as not to come into contact with the outside. Therefore, conventionally, a technique has been proposed in which a frame having low thermal conductivity such as resin is disposed between the two heat transfer means and the space between each of the two heat transfer means and the frame member is sealed. ing.

FIG. 5 shows an example of a thermoelectric heating / cooling apparatus in which a thermoelectric module is sandwiched by a heat transfer means so as to expand and contract and a space between the heat transfer means and the frame is sealed. . In the thermoelectric module 10 of the thermoelectric heating / cooling device shown in FIG. 5, an n-type thermoelectric semiconductor element 12n and a p-type thermoelectric semiconductor element 12p, which are thermoelectric elements, are fitted into and supported by a partition plate 11. These n-type thermoelectric semiconductor elements 12n
The electrode members (upper electrode plate 13 and lower electrode plate 14) whose surfaces are nickel-plated are joined by soldering between the end surfaces of the p-type thermoelectric semiconductor element 12p and the upper electrode plate 13 and the lower electrode plate. 14, the n-type thermoelectric semiconductor elements 12n and the p-type thermoelectric semiconductor elements 12p are electrically connected in series alternately. An external DC power supply is connected to the upper electrode plate 13 and the lower electrode plate 14 via a lead wire. When a current flows from this power supply, the upper electrode plate 13 and the lower electrode plate Heat is absorbed on one of the fourteen sides and heat is released on the other. The upper electrode plate 13 and the lower electrode plate 14 are arranged on planes parallel to each other, and one of them forms a heat absorbing surface and the other forms a heat radiating surface.

[0005] In the thermoelectric module 10, a liquid-cooled heat sink 140 as a heat transfer means is in surface contact with the heat radiating surface, so that heat from the heat radiating surface is cooled. To the heat sink 140, a frame 30 having poor thermal conductivity surrounding the thermoelectric module 10 is fixed by screws. Further, a cooling plate 20 as a heat transfer means is arranged in the frame 30 from the side opposite to the heat sink 140, and is in contact with the heat absorbing surface of the thermoelectric module 10. The surface of the cooling plate 20 opposite to the surface in contact with the heat absorbing surface is exposed to the outside of the frame 30 to cool the outside. In addition, the cooling plate 20 has a counterbore 22 formed by cutting the peripheral edge thereof at equal intervals, and the counterbore 22 is screwed to the heat sink 140 by the pressure management screw 51. An O-ring groove 31 is formed on the surface of the frame 30 on the side of the heat sink 140, and the O-ring groove 31 is fitted in the O-ring groove 31. Further, the frame body 30 has a wall portion 32 surrounding the cooling plate 20 at a distance, and a groove-like accommodation portion 35 is formed between the peripheral wall of the cooling plate 20 and the wall portion 32. I have. The housing 35 is filled with a curable resin 36, and the space between the cooling plate 20 and the frame 30 is sealed by the curable resin 36. The curable resin 36 also covers the pressure control screw 51, and the cooling plate 20 is pressed toward the heat sink 140 by the tightening pressure of the pressure control screw 51 and the pressure of the curable resin 36. As a result, the cooling plate 20
The thermoelectric module 10 arranged between the heat sink 140 and the heat sink 140 expands and contracts in the direction of the heat radiating surface and the heat absorbing surface.
It is pinched.

In the above-described thermoelectric heating / cooling apparatus, the thermoelectric module 10 is sandwiched between the cooling plate 20 and the heat sink 140, and is arranged so as to be able to expand and contract in the direction of the heat radiating surface and the heat absorbing surface. Therefore, the upper electrode plate 13 and the lower electrode plate 14 slide along the heat transfer means while expanding or contracting in accordance with the temperature difference between the heat radiation surface side and the heat absorption surface side, and the thermal strain is reduced. Therefore, metal fatigue is reduced. Further, the seal between the heat radiating plate 20 and the frame 30 is sealed by using the O-ring 50 so that the heat sink 140 can move with respect to the frame 30 even when the heat sink 140 expands. On the other hand, the space between the cooling plate 20 and the frame 30 is sealed by the curable resin 36, and the position of the cooling plate 20 and the frame 30 is firmly fixed and held, thereby pressing the cooling plate 20 and causing the cooling plate The thermoelectric module 10 is sandwiched between the heat sink 20 and the heat sink 140 with as little space as possible, so that heat exchange is performed efficiently. As described above, in the thermoelectric heating / cooling device of the related art, the thermoelectric module 10 is not fixed to the heat transfer means, and metal fatigue caused by thermal expansion or contraction due to thermal contraction is reduced. The frame body 30 and one of the heat transfer means (the cooling plate 20 and the heat sink 140 in the conventional example of FIG. 5) can be thermally expanded and contracted by using an O-ring 50 or the like. Uses a curable resin or the like to secure the holding power of the thermoelectric module 10 by the heat transfer means.

[0007]

However, as described above, at least one of the heat transfer means and the frame is sealed with a thermosetting resin or the like to hold the thermoelectric module. In the apparatus, since the heat transfer means thermally expands and contracts, stress is generated in the curable resin, which may cause cracks and impair the sealing performance.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and it is possible to avoid a decrease in durability due to thermal strain due to thermal expansion and thermal contraction of a thermoelectric module and to connect a thermoelectric module to the outside. It is an object of the present invention to provide a thermoelectric heating / cooling device that can be sealed with respect to a sealed state and can maintain the sealed state well.

[0009]

In order to achieve the above object, the present invention provides a thermoelectric element pair in which a first element member and a second element member are electrically connected in series alternately by electrode members. A thermoelectric module having a heat-absorbing surface formed by the electrode member that absorbs heat when energized and a heat-generating surface formed by the electrode member that generates heat when energized; and a state in which the heat-generating surface and the heat-radiating surface are exposed to the outside. A first heat transfer means having a frame housed in the hollow portion, a first fixed surface facing the frame, a heat absorbing contact surface facing the heat absorbing surface of the thermoelectric module, and facing the frame. A second heat transfer unit having a second fixing surface, a heat generating contact surface facing the heat generating surface of the thermoelectric module, and a first fixing surface of the first heat transmitting unit and the frame facing the first fixing surface; Between the first facing surface of the body First sealing means for sealing, and second sealing means for sealing between a second fixing surface of the second heat transfer means and a second facing surface of the frame body facing the second fixing surface. In the thermoelectric heating and cooling device comprising: the first sealing means, according to the thermal expansion and contraction of the first heat transfer means,
It is made of a material that is deformable or displaceable with respect to one of the frame and the first heat transfer means, and the second sealing means is used for thermal expansion and contraction of the second heat transfer means. Accordingly, it is made of a material that is deformable or displaceable with respect to one of the frame and the second heat transfer means, and is formed of one of the first heat transfer means and the second heat transfer means. The other of the first heat transfer means and the second heat transfer means is elastically pressed toward the thermoelectric module, and the thermoelectric module is connected to the thermoelectric module. The object is attained by providing a thermoelectric heating / cooling device characterized in that the module comprises elastic pressing means for holding the module between the first heat transfer means and the second heat transfer means at a predetermined pressure.

[0010] In the present invention, one of the first heat transfer means and the second heat transfer means is fixed at a position with respect to the frame by a fixing means, and the other of the first heat transfer means and the second heat transfer means is elastically pressed by the elastic pressing means. The thermoelectric module is pressed from one side to the thermoelectric module side, and the thermoelectric module is clamped at a predetermined pressure by the first thermoelectric heat transfer means and the second heat transfer means. Therefore, the thermoelectric module can be supported only by being sandwiched between the heat absorbing contact surface of the first heat transfer means and the heat contact surface of the second heat transfer means. Then, the thermoelectric module is supported on the first heat transfer means and the second heat transfer means without being fixed by screws or an adhesive, so that the thermoelectric module can be expanded and contracted in the vertical direction of the heat radiating surface and the heat absorbing surface. Therefore, the heat-absorbing surface and the heat-generating surface of the thermoelectric module easily expand and contract in accordance with the temperature, distortion due to thermal stress does not easily occur, and deterioration in durability due to thermal distortion is avoided. Also,
Since the first sealing member seals the space between the first heat transfer member and the frame, and the second sealing member seals the space between the second heat transfer member and the frame, the first heat transfer is performed. The thermoelectric module housed in the space formed by the member, the frame, and the second heat transfer member is sealed from the outside. Further, the first sealing means and the second sealing means may be in contact with the first sealing means.
It is made of a material that is deformable or displaceable with respect to one of the frame and the first heat transfer means in accordance with the thermal expansion and heat shrinkage of the heat transfer means and the second heat transfer means. Even if the first heat transfer means and the second heat transfer means thermally expand or contract due to heat from the heat generating surface of the thermoelectric module,
The first sealing means and the second sealing means are deformed or displaced in accordance with the thermal expansion or thermal contraction, so that the thermal stress in the sealed portion is reduced, and the sealed portion is less likely to break down. It is possible to maintain a sealed state.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings. In the present embodiment, the thermoelectric heating / cooling device of the present invention is incorporated in a refrigeration chucking device, and is applied to a thermoelectric cooling device for cooling a chucking plate. This thermoelectric cooling device cools the chucking plate of the chucking device,
Under a predetermined humidity atmosphere, an aluminum member or the like is frozen and adhered to the chucking plate and supported.

FIG. 1 is a partial cross-sectional front view showing a schematic configuration of an embodiment of a thermoelectric heating / cooling device (thermoelectric cooling device) of the present invention, and FIG. 2 is an enlarged view of a main part of a cross-sectional portion of FIG. is there.
As shown in FIG. 1, the thermoelectric cooling device 1 of the present embodiment includes a thermoelectric module 10 having a heat absorbing surface C that absorbs heat when energized and a heat generating surface H that generates heat when energized,
0 having a heat absorbing surface C and a heat radiating surface H exposed to the outside, and a first heat absorbing contact surface 20c that contacts the heat absorbing surface C of the thermoelectric module 10 housed in the frame 30. It has a cooling plate 20 as heat transfer means and a liquid cooling jacket 40 as second heat transfer means. The liquid cooling jacket 40 includes a heat sink 41, and the heat sink 41 has a heat generating contact surface 40 h that contacts the heat generating surface of the thermoelectric module 10 housed in the frame 30.

As shown in FIG. 2, a thermoelectric module 10 includes a partition plate 11 having a through hole, an n-type thermoelectric semiconductor element 12n as a first member constituting a thermoelectric element pair, and a p-type as a second member. Type thermoelectric semiconductor element 12p, and an upper electrode plate 13 and a lower electrode plate 14 as electrode members which are made of a copper plate or the like and electrically connect the n-type thermoelectric semiconductor element 12n and the p-type thermoelectric semiconductor element 12p. I have. n-type thermoelectric semiconductor element 12n and p-type thermoelectric semiconductor element 12p
Have the same diameter and the same coaxial length, and have a partition plate 1
One through-hole is fixed to the partition plate 11 at a substantially central position in the longitudinal direction at a substantially right angle. The n-type thermoelectric semiconductor elements 12n and the p-type thermoelectric semiconductor elements 12p are arranged alternately, and are adjacent to thermoelectric semiconductor elements of different types. The partition plate 11 is an electrically insulating plate member, and for example, a glass epoxy plate or the like can be used. In addition, a semiconductor single crystal such as bismuth tellurium can be used for the n-type thermoelectric semiconductor element 12n and the p-type thermoelectric semiconductor element 12p.

Then, one p-type thermoelectric semiconductor element 12p
And one n-type thermoelectric semiconductor element 12n is paired, and for each pair, an upper electrode plate 13 is provided between the upper end face of the p-type thermoelectric semiconductor element 12p and the upper end face of the n-type thermoelectric semiconductor element 12n. It is erected. The upper electrode plate 13 is provided on each upper end surface of the p-type thermoelectric semiconductor element 12p and the n-type thermoelectric semiconductor element 12n.
Joined by solder. All of the upper electrode plates 13 are arranged on one plane parallel to the partition plate 11, and the upper surface of the upper electrode plate 13 (the surface on the opposite side to the partition plate 11) is used. A heat absorbing surface C including a surface is formed. Also, the lower end surface of the n-type thermoelectric semiconductor element 12n of each pair of the p-type thermoelectric semiconductor element 12p and the n-type thermoelectric semiconductor element 12n and a different pair of p-type thermoelectric semiconductors adjacent to the n-type thermoelectric semiconductor element The lower electrode plate 14 is provided between the lower end surface of the element 12p and the lower surface. The lower electrode plate 14 is soldered to each lower end surface of the p-type thermoelectric semiconductor element 12p and the n-type thermoelectric semiconductor element 12n.
The lower electrode plate 14 is connected to the upper electrode plate 13 with respect to the partition plate 11.
On the other side parallel to the partition plate 11 on the opposite side to the lower surface of the lower electrode plate 14 (the partition plate 1).
(A surface opposite to 1) forms a heat dissipation surface H including a lower surface of the lower electrode plate 14.

A nickel layer is formed on the surfaces of the upper electrode plate 13 and the lower electrode plate 14 by plating. The nickel layer functions as a diffusion preventing layer for preventing molecules such as copper constituting the electrode from diffusing into the thermoelectric semiconductor elements (p-type thermoelectric semiconductor element 12p and n-type thermoelectric semiconductor element 12n). The n-type thermoelectric semiconductor elements 12n and the p-type thermoelectric semiconductor elements 12p are alternately and electrically connected in series by the upper electrode plate 13 and the lower electrode plate 14, and the upper and lower electrodes located at both ends of the series connection are connected. Lead wires (not shown) are connected to the electrode plate 13 and the lower electrode plate 14.

FIG. 3 shows the thermoelectric cooling device of the present embodiment in FIG.
FIG. 2 is a cross-sectional view taken along a line II of FIG. As shown in FIG. 3, in the thermoelectric cooling device of the present embodiment, two thermoelectric modules 10 described above are used, and the lead wires at each end of these thermoelectric modules 10 are electrically connected in series. ing. And these thermoelectric modules 10
Is housed in a substantially rectangular cylindrical frame 30 having a hollow portion fitted in the axial direction with the heat radiation surface H and the heat absorption surface C exposed toward the end surface of the frame 30.

The frame 30 is made of plastic, and as shown in FIGS. 1 and 3, grooves (first and second grooves) 31 for an O-ring are formed on both end surfaces so as to go around the end surface. Have been. An O-ring 50 is fitted into these O-ring grooves 31 as a first sealing member and a second sealing member. As shown in FIG. 3, a plurality of support protrusions 32 are formed on the inner peripheral surface of the frame 30 so as to protrude along the axial direction. The frame 30 is formed with two liquid passages 55 (see FIG. 4) and two lead wire passages (not shown) that connect the hollow portion and the outside, and two thermoelectric modules. Of the ten lead wires, the lead wires that do not communicate with each other are exposed to the outside through the lead passage, and are connected to an external power supply. The lead wire passage is sealed with resin after the lead wire is exposed to the outside.

The cooling plate 20 is formed by covering one end surface of a plate-shaped member made of aluminum with a thermally conductive electric insulating layer, and having the one end surface (first fixed surface) side of the frame member 30 side. Body 30
, And covers one end side of the hollow portion of the frame 30.
The position of the cooling plate 20 in the forward and backward directions with respect to the frame 30 is fixed by bolts 25 as fixing means. The thickness of the thermally conductive electrical insulating layer of the cooling plate 20 is several tens to several hundreds μm, preferably 15 to 100 μm. Further, as the material of the thermally conductive electric insulating layer, for example, a material obtained by adding a thermally conductive filler to an epoxy resin, a fluorine resin coating agent, a silicon-based thermally conductive adhesive, or the like can be used. The chucking plate G of the freezing chucking portion is screwed to the cooling plate 20 from the side opposite to the thermoelectric module 10 and the frame 30.

The liquid cooling jacket 40 includes a heat sink 41 having fins therein and a cooling liquid passage 41a between the fins, and a base 42 fixed to the frame 30.
And a compression spring 43 as an elastic pressing means disposed between the heat sink 41 and the base 42. The surface of the heat sink 41 is covered with a thermally conductive electrical insulating layer. This thermally conductive electrical insulation layer
The thickness is several tens to several hundreds μm, preferably 15 to 100 μm. Further, as a material of the thermal conductive electric insulating layer, for example, a material obtained by adding a thermal conductive filler to an epoxy resin,
Fluororesin coating agents, silicon-based heat conductive adhesives and the like can be used. The heat sink 41 is housed in the frame 30, and both ends of the passage 41 a of the heat sink 41 communicate with the liquid passage 55 of the frame 30, respectively.

The base portion 42 is a substantially plate-shaped member, one surface (second fixing surface) of which is in contact with the frame 30 with the frame 30 side, and the hollow portion of the frame 30 is connected to the cooling plate 20. Covers from the opposite side. The O-ring 50 is fastened to the frame 30 by bolts 25 together with the cooling plate 20, and the O-ring 50 fitted in the O-ring groove 31 formed on the end surface of the frame 30 is in contact with the cooling plate 20 and the base 42, respectively. Sandwiched between the frame 30 and the cooling plate 20 and between the frame 30 and the base 42
And the frame 30 are sealed. Also, the base 42
A plurality of spring grooves (elastic member supporting portions) 42a are formed in one surface of the frame body 30 side in the thickness direction. The compression spring 43 is housed in the spring groove 42a. The compression spring 43 is disposed between the heat sink 41 and the base 42 at substantially equal intervals, and one end of the compression spring 43 is supported by the spring groove 42 a of the base 42, so that the heat sink 41 is connected to the thermoelectric module 10. Elastically. The heat sink 41 and the liquid cooling plate 20 hold the thermoelectric module 10 at a predetermined pressure. As a result, the one end surface of the cooling plate 20 on the side of the frame 30 is a heat absorbing contact surface 20c which comes into contact with the heat absorbing surface C of the thermoelectric module 10, and the surface of the heat sink 41 opposite to the base 42 is the thermoelectric module. The heat dissipating contact surface 40h is in contact with the heat dissipating surface H of No. 10. A silicone grease layer is formed between the two thermoelectric modules 10 and the cooling plate 20 and between the thermoelectric module 10 and the heat sink 41, and is formed between the thermoelectric module and the cooling plate 20 and the heat sink 41. The heat conduction efficiency is not reduced between the two.

FIG. 4 is a diagram showing the thermoelectric cooling device according to the present embodiment shown in FIG.
5 is a sectional view taken along the line KK in FIG. As shown in FIG. 4, two coolant joints 60 are provided outside the frame body 30.
The coolant is sent from one of the joints 60 to the passage 41a (see FIG. 2) of the heat sink 41 via the liquid passage 55 of the frame 30, and the frame 30 is
Is discharged from the other joint 60 through another liquid passage 55. A hollow cylindrical communication pipe 56 is inserted into each of the two liquid passages 55 of the frame body 30 through an elastic sealing material 58. A groove is formed, and an O-ring 57 is incorporated in the groove.One end of each of the ends of the communication tube 56 where the O-ring 57 is incorporated is inserted into the joint 60, and the other end is connected to the heat sink 41. The cooling liquid protrudes from the frame body 30 so as to communicate with the passage 41a through the joint 41. With such a configuration, the coolant flows from one joint 60 to the other joint 60 without leaking to the outside.

Next, the operation of the thermoelectric cooling device of this embodiment will be described. In the cooling device 1 of the present embodiment, an electric current is supplied from an external power supply to the lead wires of the thermoelectric module 10, and the cooling liquid is sent into the passage 41 a of the heat sink 41 via the joint 60. Then, the heat absorbing surface C of the thermoelectric module 10 absorbs heat by the Peltier effect, and the chucking plate G of the freezing chucking device is cooled via the cooling plate 20 that contacts the heat absorbing surface C. Further, the heat generating surface H of the thermoelectric module 10 generates heat, and this heat is cooled by the coolant flowing in the passage 41 a of the heat sink 41.

At this time, since the compression spring 43 presses the heat sink 41 toward the thermoelectric module 10, the thermoelectric module 10 comes into contact with the cooling plate 20 and the heat sink 41 at a predetermined contact pressure. Accordingly, heat is absorbed from the cooling plate 20 to the heat absorbing surface C of the thermoelectric module 10 with good efficiency, and heat is radiated from the heat generating surface H of the thermoelectric module 10 to the heat sink 41 with good efficiency. An exchange takes place. The heat absorbing surface C of the thermoelectric module 10
Is cooled, and the heat generating surface H is heated for heat generation. The thermoelectric module 10 is supported only by being sandwiched between the heat sink 41 and the cooling plate 20 by the pressing force from the compression spring 43, and is not directly fixed by screws or an adhesive. The heat-absorbing surface C can contract along the cooling plate 20, and the heat-generating surface H can expand along the heat sink 41. On the other hand, when the temperature is returned after the energization ends, the heat absorbing surface expands and the heat generating surface H contracts, and then returns to the original state. Therefore, generation of strain due to thermal stress on the heat generating surface H and the heat absorbing surface C is avoided, and a decrease in durability due to thermal strain is prevented.

The cooling plate 20 is also cooled and contracts, and the heat from the heat generating surface H is applied to the liquid cooling jacket 40 by the heat sink 4.
1 and is inflated. The space between the cooling plate 20 and the frame 30 and between the base portion 42 of the liquid cooling jacket 40 and the frame 30 are sealed by an O-ring 50. Even if expanded or contracted, O
The ring 50 is elastically deformed in accordance with these expansions and contractions, and the sealed state is maintained. Further, the O-ring 50 is disposed so as to be fitted in the groove 31 for the O-ring.
By moving in the groove 31 for the ring, or by moving the respective parts of the cooling plate 20 and the liquid cooling jacket 40 with respect to the O-ring 50, the thermal expansion and contraction of the cooling plate 20 and the cooling jacket 40 are prevented. Thermal stress in the sealing portion is reduced. Therefore, destruction of the sealing portion is unlikely to occur,
It is possible to maintain a good sealing state. Further, the space between the cooling plate 20 and the frame body 30 and the space between the frame body 30 and the liquid cooling jacket 40 are sealed by the O-ring 50, and the lead wire passage of the frame body 30 is sealed by resin. Therefore, the thermoelectric module 10 is sealed from the outside by these. Therefore, the cooling plate 20, the frame body 30,
Moisture and foreign matter do not enter the thermoelectric module 10 from the outside of the liquid cooling jacket 40, and a short circuit between the electrode members due to condensation or foreign matter is avoided.

As described above, in the present embodiment, both the space between the frame 30 and the cooling plate 20 and the space between the frame 30 and the liquid cooling jacket 40 are sealed by the O-ring 50 so that the cooling plate 20 is sealed. Of the sealing portion due to expansion and contraction of the liquid cooling jacket 40 and the compression spring 43.
Thereby, the contact pressure between the thermoelectric module 10 and the cooling plate 20 and the contact pressure between the thermoelectric module 10 and the heat sink 41 of the liquid cooling jacket 41 can be secured, and good heat exchange efficiency can be obtained.

It should be noted that the present invention is not limited to the above-described embodiment, and the shape, size, material, manufacturing procedure, and the like of each member can be appropriately changed without departing from the spirit of the present invention. is there. For example, in the above embodiment,
The groove 31 for the O-ring is provided in the frame 30, but is not limited to this. For example, the base of the cooling plate 20 or the liquid cooling jacket 40 may be used instead of or together with the frame 30. You may arrange | position to the base part 42. Further, in the above-described embodiment, the cooling plate 20 and the base 42 are attached to the frame 3
0, and is sealed by an O-ring 50 between the end face and the end face. However, the present invention is not limited to this. For example, at least one of the cooling plate 20 and the base portion 42 may have a frame. The frame 30 is housed in the hollow portion of the body 30.
May be confronted with the inner peripheral surface, and the space between the opposing surfaces may be sealed with an O-ring 50.

Further, in the above embodiment, the frame 3
0 and the cooling plate 20, a first elastic sealing member that seals between the frame 30 and the cooling plate 20, and the frame 30 and the base 42 that are sandwiched between the frame 30 and the base 42. The O-ring 50 is used as the second elastic seal member for sealing the space between the base portion 42 and the base member 42.
The frame 30 and the cooling plate 20 can move the heat-absorbing contact surface of the cooling plate 20 and the heat-generating contact surface of the base 42 with respect to the surface direction.
Any material can be used as long as it can seal the space between the base and the base portion 42. In the above-described embodiment, the compression spring 43 is used as an elastic pressing means for elastically pressing the heat sink 41 toward the thermoelectric module 10 and holding the thermoelectric module 10 between the heat sink 41 and the cooling plate 20 at a predetermined pressure. However, the present invention is not limited to this, and may be an elastic member other than a compression spring such as a disc spring or a means having an elastic mechanism. The heat generating contact surface 40h may be configured to be pressed by the liquid pressure in the heat sink 41, or a liquid or a compressed gas may flow between the heat sink 41 and the base portion 42 to press the heat sink 41 toward the thermoelectric module 10 by this pressure. You may make it. In the above embodiment, the first heat transfer means (the cooling plate 2
0) is fixed to advance and retreat with respect to the frame 30 by fixing means (bolts 25), and the second heat transfer means (liquid cooling jacket 4) is fixed.
0) The heat sink 41 is pressed toward the thermoelectric module 10 by elastic pressing means (compression spring 43). This is more suitable when the present invention is used as a cooling device because the heat absorbing surface C of the thermoelectric module 10 and the first heat transfer member (cooling plate 20) are in surface contact with each other over the entire surface. However, according to the present invention, the second heat transfer means is fixed to the fixing means (bolt 2).
5) fixing the advancing and retreating with respect to the frame 30, and the first heat transfer means is fixed to the base 30 and the cooling plate 2
0, and the elastic pressing means is a heat absorbing contact surface of the first heat transfer means such as disposing a compression spring 43 between the base portion of the first heat transfer element and the cooling plate 20. To the thermoelectric module 10 side. By doing so, there is no need to provide an elastic pressing means or the like between the heat generating surface H of the thermoelectric module and the second heat transfer member, and this configuration, which can use the heat generated by the thermoelectric module 10 with high efficiency, is a thermoelectric module. It is suitable when the cooling device is used as a heat retaining device or a heating device.

In the above-described embodiment, the liquid cooling jacket 41 having the heat sink 40 is used as the second heat transfer means. However, the present invention is not limited to this. An air-cooling type cooling unit including an air-cooling heat sink composed of fins standing on the opposite side of the thermoelectric module 10 from the plate portion, and a blowing unit for sending cool air to the fins, and other cooling units may also be used. Further, instead of the liquid cooling jacket, a wall member or the like constituting a heat insulation chamber is used as the second heat transfer means, and the thermoelectric module 10
The heat generated from the heat generating surface H may be used.

In the above-described embodiment, as the thermoelectric module 10, the semiconductor elements 12n and 12p
Is used, but the present invention is not limited to this. There is no partition plate and the semiconductor element 12
n and 12p may be supported by the electrode plates 13 and 14.

The above-described embodiment is a thermoelectric cooling device for cooling a chucking portion of a freezing chucking device. However, the present invention is not limited to this, and the inside of a room can be directly cooled by a cooling plate 20 or further through heat transfer means. It may be a refrigerator for cooling, or a cooling device for cooling a CPU or an LSI of a computer for cooling indoor gas. In addition, a heat retaining device or a heating device such as a heat retaining container that keeps the inside of the refrigerator hot by the heat from the heat radiating surface H, or a heating / cooling device that can switch between cooling and heating by automatic control or manually can be used.

[0031]

As described above, according to the thermoelectric heating and cooling device of the present invention, the first sealing member allows the heat absorbing contact surface of the first heat transfer means to extend between the surface direction and the frame. Movably sealed between the first heat transfer means and the frame;
The sealing member seals the space between the second heat transfer means and the frame so that the heat-generating contact surface of the second heat transfer means can move in the direction of the surface and between the frames. One of the heat-absorbing contact surface of the first heat transfer means and the heat-generating contact surface of the second heat transfer means is elastically pressed toward the thermoelectric module side, and the first and second heat transfer means and the second heat transfer means receive thermoelectric force. Since the module is clamped at a predetermined pressure, the thermoelectric module is sealed from the outside while avoiding a decrease in the durability of the sealing member due to thermal expansion and contraction of the first heat transfer member and the second heat transfer member. In addition, the sealed state of the thermoelectric module can be maintained well.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional front view showing a schematic configuration of an embodiment of a thermoelectric heating / cooling device of the present invention.

FIG. 2 is an enlarged view of a main part of a cross section of the thermoelectric heating / cooling device of FIG.

FIG. 3 is a cross-sectional view of the thermoelectric heating / cooling device of FIG. 1 taken along a line II of FIG. 1;

FIG. 4 is a sectional view taken along the line KK of FIG. 3;

FIG. 5 is a cross-sectional view showing a schematic configuration of an example of a conventional thermoelectric heating / cooling device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 thermoelectric module 11 partition plate 12 n n-type thermoelectric semiconductor element 12 p p-type thermoelectric semiconductor element 13 upper electrode plate 14 lower electrode plate 20 cooling plate 20 c heat absorbing contact surface 30 frame 31 groove 40 liquid cooling jacket 40 h heat generating contact surface 41 heat sink 42 Base 43 Compression spring 50 O-ring

Claims (2)

[Claims] A first element member and a second element member that constitute a thermoelectric element pair are alternately and electrically connected in series by an electrode member, and a heat absorbing surface of the electrode member that absorbs heat when energized and generates heat when energized. A thermoelectric module having a heat generating surface formed by an electrode member; a frame housing the thermoelectric module in a hollow portion with the heat generating surface and the heat radiating surface exposed to the outside; 1 fixing surface, first heat transfer means having a heat absorbing contact surface facing the heat absorbing surface of the thermoelectric module, second fixing surface facing the frame, and heat generation facing the heat generating surface of the thermoelectric module. A second heat transfer unit having a contact surface, and a first seal for sealing between a first fixing surface of the first heat transfer unit and a first facing surface of the frame body facing the first fixing surface. Means, and a second one of said second heat transfer means. A thermoelectric heating / cooling device comprising: a second sealing unit that seals between a fixed surface and a second facing surface of the frame body facing the second fixed surface; (1) It is made of a material that is deformable or displaceable with respect to one of the frame and the first heat transfer means in accordance with the thermal expansion and contraction of the heat transfer means. A material that is deformable or displaceable with respect to one of the frame and the second heat transfer means in accordance with thermal expansion and contraction of the second heat transfer means; One of the transmission means and the second heat transmission means, a fixing means for fixing a position in the forward / backward direction with respect to the frame, and the other of the first heat transmission means and the second heat transmission means, The thermoelectric module is elastically pressed to the thermoelectric module side, and the thermoelectric module is connected to the first heat transfer module. Thermoelectric heating and cooling device, characterized in that the means and the second heat transfer means and an elastic pushing means for clamping at a predetermined pressure. 2. The first fixing surface of the frame body and the first fixing surface.
At least one of the heat-absorbing contact surfaces of the heat transfer means is provided with a first groove surrounding the hollow portion of the frame or an extension thereof, and the second fixing surface of the frame and At least one of the heat contact surfaces of the second heat transfer means is provided with a second groove surrounding the hollow portion of the frame or an extension thereof, and the first sealing member is An elastic resin member fitted in the first groove so as to go around the inside of the first groove; and the second sealing member is fitted in the second groove so as to go around the inside of the second groove. The thermoelectric heating / cooling device according to claim 1, wherein the thermoelectric heating / cooling device is an elastic resin member.