CN110261695A - A kind of test device - Google Patents

A kind of test device Download PDF

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Publication number
CN110261695A
CN110261695A CN201910508009.6A CN201910508009A CN110261695A CN 110261695 A CN110261695 A CN 110261695A CN 201910508009 A CN201910508009 A CN 201910508009A CN 110261695 A CN110261695 A CN 110261695A
Authority
CN
China
Prior art keywords
tested
test
heat
temperature
briquetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910508009.6A
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Chinese (zh)
Inventor
程振
钟衍徽
任楚建
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Netcom Electronics Co Ltd
Shenzhen Longsys Electronics Co Ltd
Original Assignee
Shenzhen Netcom Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Netcom Electronics Co Ltd filed Critical Shenzhen Netcom Electronics Co Ltd
Priority to CN201910508009.6A priority Critical patent/CN110261695A/en
Publication of CN110261695A publication Critical patent/CN110261695A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/003Environmental or reliability tests
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/1927Control of temperature characterised by the use of electric means using a plurality of sensors
    • G05D23/193Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
    • G05D23/1932Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces
    • G05D23/1934Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces each space being provided with one sensor acting on one or more control means
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • G05D23/20Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/24Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element having a resistance varying with temperature, e.g. a thermistor

Abstract

This application discloses a kind of test devices, wherein the test device includes: support container, for placing element to be tested;Briquetting, for when element to be tested is tested, element to be tested to be fixed in pressing;Heat-conductive assembly connects briquetting and external heat source equipment, for providing set temperature for element to be tested when element to be tested is tested.It is tested by the above-mentioned means, testing element can be treated under different temperatures environment, and only changes the temperature of element to be tested, avoid influence of the hot environment to the performance of test device.

Description

A kind of test device
Technical field
This application involves the field of test technology, more particularly to a kind of test device.
Background technique
In the production test link of some electronic products, it will usually test electronic product.Test device can It is related to the stability of production yield by contact.
Wherein, when the electronic product for some precisions is tested, such as chip, need to test it in different temperatures Under performance, such as high temperature test and low-temperature test.In the prior art, test device is usually put into the mode of high-low temperature chamber To carry out the high/low temperature reliability test or the test of high/low temperature volume production of chip.But this mode has a following problem: One, under the high temperature conditions, the dominant frequency of test platform is relatively low, and job stability is poor;Second, the higher cost of high-low temperature chamber.
Summary of the invention
To solve the above problems, this application provides a kind of test device, it can be under different temperatures environment to be tested Element is tested, and only changes the temperature of element to be tested, avoids influence of the hot environment to the performance of test device.
The technical solution that the application uses is: a kind of test device is provided, which includes: support container, For placing element to be tested;Briquetting, for when element to be tested is tested, element to be tested to be fixed in pressing;Thermally conductive group Part connects briquetting and external heat source equipment, for providing setting temperature for element to be tested when element to be tested is tested Degree.
Wherein, briquetting includes upper metallic briquette and lower metallic briquette;Heat-conductive assembly is set to metal block and lower metal block Between, for being provided by lower metallic briquette for element to be tested when lower metallic briquette presses element to be tested and tested Set temperature.
Wherein, heat-conductive assembly and upper metal block and lower metal block pass through thermally conductive glue connection.
Wherein, heat-conductive assembly includes metallic briquette;Heat-conductive assembly is set to the bottom of metallic briquette, in lower metal pressure When block pressing element to be tested is tested, by the pressure contact of metallic briquette element to be tested, to be mentioned for element to be tested For set temperature.
Wherein, heat-conductive assembly connects external heat source equipment by heat conductive rod or thermally conductive item.
Wherein, test device further includes first interface;Heat-conductive assembly includes the first end and second end along thermally conductive direction, the One end connects briquetting, and second end connects first interface, and can connect external heat source equipment by first interface.
Wherein, test device further include: temperature sensor is arranged, for detecting the temperature of heat-conductive assembly close to heat-conductive assembly Degree.
Wherein, between temperature sensor setting and briquetting and heat-conductive assembly.
Wherein, test device further includes second interface;Temperature sensor connects second interface, and can be connected by second interface Connect external detection equipment.
Wherein, test device further include: ejector retainner plate is set to below support container, for being placed in element to be tested When in support container, contacted with element to be tested;Test adaptor plate connects ejector retainner plate, to be tested for being connected by ejector retainner plate Element is tested with treating testing element.
Test device provided by the present application includes: support container, for placing element to be tested;Briquetting, for be measured When examination element is tested, the fixed element to be tested of pressing;Heat-conductive assembly connects briquetting and external heat source equipment, for When testing element is tested, set temperature is provided for element to be tested.By the above-mentioned means, can be direct by heat-conductive assembly Or heat indirectly is provided for element to be tested, it is tested with treating testing element under different temperatures environment, Ke Yigen Otherness adjusting is carried out according to different elements to be tested, is suitble to large-scale element test.In addition, detecting temperature by sensor Degree, the temperature that can treat testing element in real time is monitored, to carry out temperature adjusting in real time.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other Attached drawing.Wherein:
Fig. 1 is the first structure diagram of test device provided by the embodiments of the present application;
Fig. 2 is the second structural schematic diagram of test device provided by the embodiments of the present application;
Fig. 3 is the schematic diagram of heat conduction governing system provided by the embodiments of the present application;
Fig. 4 is the third structural schematic diagram of test device provided by the embodiments of the present application;
Fig. 5 is the 4th structural schematic diagram of test device provided by the embodiments of the present application;
Fig. 6 is the 5th structural schematic diagram of test device provided by the embodiments of the present application;
Fig. 7 is the 6th structural schematic diagram of test device provided by the embodiments of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete Site preparation description.It is understood that specific embodiment described herein is only used for explaining the application, rather than to the limit of the application It is fixed.It also should be noted that illustrating only part relevant to the application for ease of description, in attached drawing and not all knot Structure.Based on the embodiment in the application, obtained by those of ordinary skill in the art without making creative efforts Every other embodiment, shall fall in the protection scope of this application.
Term " first ", " second " in the application etc. be for distinguishing different objects, rather than it is specific suitable for describing Sequence.In addition, term " includes " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as comprising The process, method, system, product or equipment of a series of steps or units are not limited to listed step or unit, and It is optionally further comprising the step of not listing or unit, or optionally further comprising for these process, methods, product or equipment Intrinsic other step or units.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and Implicitly understand, embodiment described herein can be combined with other embodiments.
Refering to fig. 1, Fig. 1 is the first structure diagram of test device provided by the embodiments of the present application, the test device 10 Including support container 11, briquetting 12 and heat-conductive assembly 13.
Wherein, support container 11 is for placing element 20 to be tested;Briquetting 12 is used for when element to be tested is tested, The fixed element 20 to be tested of pressing;Heat-conductive assembly 13 connects briquetting 12 and external heat source equipment, for element 20 to be tested into When row test, set temperature is provided for element 20 to be tested.
Wherein, it can be connected by heat conductive rod or thermally conductive item between heat-conductive assembly 13 and external heat source equipment, it is therein Heat conductive rod or thermally conductive item are using the good material production of heating conduction, such as heat pipe.
Optionally, in one embodiment, heat-conductive assembly 13 can be and to be measured when briquetting 12 presses fixed element 20 to be tested Examination element 20 directly contacts, and provides set temperature for element 20 to be tested.In another embodiment, heat-conductive assembly 13 can be in briquetting When element 20 to be tested is fixed in 12 pressings, with by the briquetting 12 and 20 mediate contact of element to be tested, set temperature is passed through Briquetting 12 is conducted to element 20 to be tested.
Wherein, heat-conductive assembly 13 using have Thermal conductivity material make, specifically can using thermal coefficient compared with High material, thermal coefficient refer under the conditions of steady heat transfer, the material of 1m thickness, the temperature difference of both side surface be 1 degree (K, DEG C), 1 hour, the heat transmitted by 1 square metre of area, unit are as follows: watt/( meter Du) (DEG C generation can be used herein for K in W/ (mK) For).For example, heat-conductive assembly 13 can be the metal materials such as aluminium, copper, silver, it is also possible to the nonmetallic materials such as diamond, silicon, when So, it is also possible to the synthetic material formed by the above-mentioned good combination of materials of a variety of heating conductions, such as alloy.
Wherein, briquetting 12 can also be made of the material with Thermal conductivity, can generally use metal, such as Aluminium, copper etc..
Specifically, in the present embodiment, support container 11 includes an accommodation groove 11a, for placing element 20 to be tested, Briquetting 12 includes a protrusion 12a.When element 20 to be tested is placed in accommodation groove 11a, and briquetting 12 presses element to be tested When 20, protrusion 12a is located in accommodation groove 11a.
Optionally, in the present embodiment, the setting of heat-conductive assembly 13 is specifically located at protrusion on the lower surface of briquetting 12 On the lower surface of 12a, when briquetting 12 presses element 20 to be tested, heat-conductive assembly 13 be located at element 20 to be tested and briquetting 12 it Between.
Wherein, between heat-conductive assembly 13 and briquetting 12 can by thermally conductive glue connection, specifically can be heat conductive silica gel or Heat-conducting silicone grease.
Referring to Fig.2, Fig. 2 is the second structural schematic diagram of test device provided by the embodiments of the present application, the test device 10 Including support container 11, briquetting 12, heat-conductive assembly 13 and temperature sensor 14.
Wherein, support container 11 is for placing element 20 to be tested;Briquetting 12 is used for when element to be tested is tested, The fixed element 20 to be tested of pressing;Heat-conductive assembly 13 connects briquetting 12 and external heat source equipment, for element 20 to be tested into When row test, set temperature is provided for element 20 to be tested;Temperature sensor 14 is arranged close to heat-conductive assembly 13, leads for detecting The temperature of hot component 13.
In the present embodiment, support container 11 includes an accommodation groove 11a, for placing element 20 to be tested, briquetting 12 Including a protrusion 12a.It, should when element 20 to be tested is placed in accommodation groove 11a, and briquetting 12 presses element 20 to be tested Protrusion 12a is located in accommodation groove 11a.
Specifically, the setting of heat-conductive assembly 13 is specifically located on the lower surface of protrusion 12a on the lower surface of briquetting 12, When briquetting 12 presses element 20 to be tested, heat-conductive assembly 13 is between element 20 to be tested and briquetting 12.
Specifically, between the setting of temperature sensor 14 and briquetting 12 and heat-conductive assembly 13.
Wherein, briquetting 12, temperature sensor 14, can be by thermally conductive glue connection between heat-conductive assembly 13, specifically can be with It is heat conductive silica gel or heat-conducting silicone grease.
It is the schematic diagram of heat conduction governing system provided by the embodiments of the present application refering to Fig. 3, Fig. 3.Wherein, the heat conduction governing system System 30 includes controller 15, external heat source equipment 16, heat-conductive assembly 13 and temperature sensor 14.13 He of heat-conductive assembly therein Temperature sensor 14 is such as the heat-conductive assembly 13 and temperature sensor 14 in the test device 10 in above-described embodiment, this is no longer superfluous It states.
In specific workflow, controller 15 controls external heat source equipment 16 and provides an initial temperature to thermally conductive group Part 13.In the test process of element to be tested, the temperature of 14 real-time detection heat-conductive assembly 13 of temperature sensor, and will test Temperature value is sent to controller 15.The temperature value that controller 15 is further detected according to temperature sensor 14 is to external heat resource equipment 16 are controlled, to adjust the heat of the output of external heat source equipment 16.
Wherein, which can specifically be made of temperature-sensitive material, for example, by using with temperature coefficient Material production.Positive temperature coefficient of resistance (PTC, Positive Temperature Coefficient) refers to the electricity of material Resistance value can be rising with temperature rise, if the resistance-temperature characteristic of a substance can be used as engineer application, generally require its resistance value with Temperature has a greater change, that is, temperature coefficient is larger.Temperature coefficient is bigger, represents the resistance under identical temperature change It is increased more.Negative temperature coefficient (NTC, Negative Temperature Coefficient) refers to an object in certain temperature It spends in range, physical property (such as resistance) is increased with temperature and reduced.Semiconductor, insulator resistance value all in temperature It rises and declines.
Specifically, first electrode, temperature-sensitive material, the second electrode of lamination can be set, then in first electrode and Apply different voltage in second electrode and form voltage difference, then detects the electric current between first electrode and second electrode, determine The resistance of the temperature-sensitive material.Then according to the temperature resistance curve of the material, temperature.
It is the third structural schematic diagram of test device provided by the embodiments of the present application, the test device 10 refering to Fig. 4, Fig. 4 Including support container 11, briquetting 12 and heat-conductive assembly 13.
Wherein, support container 11 is for placing element 20 to be tested;Briquetting 12 is used for when element to be tested is tested, The fixed element 20 to be tested of pressing;Heat-conductive assembly 13 connects briquetting 12 and external heat source equipment, for element 20 to be tested into When row test, set temperature is provided for element 20 to be tested.
In the present embodiment, briquetting 12 includes upper metallic briquette 121 and lower metallic briquette 122;Heat-conductive assembly 13 is set to Between upper metal block 121 and lower metal block 122, for leading to when lower metallic briquette 122 presses element 20 to be tested and tested Crossing down metallic briquette 122 is that element 20 to be tested provides set temperature.
Specifically, support container 11 includes an accommodation groove, for placing element 20 to be tested, lower metallic briquette 122 Lower surface includes a protrusion, should when element 20 to be tested is placed in accommodation groove, and briquetting 12 presses element 20 to be tested Protrusion is located in the accommodation groove.Further, the upper surface of the lower metallic briquette 122 includes a groove, upper metallic briquette 121 Lower surface includes another protrusion, when upper metallic briquette 121 and lower metallic briquette 122 are coupled, upper 121 following table of metallic briquette The protrusion in face is placed in the groove of lower 122 upper surface of metallic briquette, and accommodates heat-conductive assembly 13 between the two.
Wherein, heat-conductive assembly 13 and upper metal block 121 and lower metal block 122 specifically can be and led by thermally conductive glue connection Hot silica gel or heat-conducting silicone grease.
It is the 4th structural schematic diagram of test device provided by the embodiments of the present application, the test device 10 refering to Fig. 5, Fig. 5 Including support container 11, briquetting 12, heat-conductive assembly 13 and temperature sensor 14.
Wherein, support container 11 is for placing element 20 to be tested;Briquetting 12 is used for when element to be tested is tested, The fixed element 20 to be tested of pressing;Heat-conductive assembly 13 connects briquetting 12 and external heat source equipment, for element 20 to be tested into When row test, set temperature is provided for element 20 to be tested.
In the present embodiment, briquetting 12 includes upper metallic briquette 121 and lower metallic briquette 122;Heat-conductive assembly 13 is set to Between upper metal block 121 and lower metal block 122, for leading to when lower metallic briquette 122 presses element 20 to be tested and tested Crossing down metallic briquette 122 is that element 20 to be tested provides set temperature.
Wherein, which can be set between upper metallic briquette 121 and heat-conductive assembly 13, also can be set Between heat-conductive assembly 13 and lower metallic briquette 122.
It is the 5th structural schematic diagram of test device provided by the embodiments of the present application, the test device 10 refering to Fig. 6, Fig. 6 Including support container 11, briquetting 12, heat-conductive assembly 13 and temperature sensor 14.
Wherein, support container 11 is for placing element 20 to be tested;Briquetting 12 is used for when element to be tested is tested, The fixed element 20 to be tested of pressing;Heat-conductive assembly 13 connects briquetting 12 and external heat source equipment, for element 20 to be tested into When row test, set temperature is provided for element 20 to be tested.
In the present embodiment, briquetting 12 includes upper metallic briquette 121 and lower metallic briquette 122;Heat-conductive assembly 13 is set to Between upper metal block 121 and lower metal block 122, for leading to when lower metallic briquette 122 presses element 20 to be tested and tested Crossing down metallic briquette 122 is that element 20 to be tested provides set temperature.
Specifically, support container 11 includes an accommodation groove, for placing element 20 to be tested, lower metallic briquette 122 Lower surface includes a protrusion, should when element 20 to be tested is placed in accommodation groove, and briquetting 12 presses element 20 to be tested Protrusion is located in the accommodation groove.Further, the upper surface of the lower metallic briquette 122 includes a groove, upper metallic briquette 121 Lower surface includes another protrusion, when upper metallic briquette 121 and lower metallic briquette 122 are coupled, upper 121 following table of metallic briquette The protrusion in face is placed in the groove of lower 122 upper surface of metallic briquette, and accommodates heat-conductive assembly 13 between the two.
Wherein, the width of the protrusion of lower metallic briquette 122 is less than the width of the accommodation groove of support container 11, so that lower metal In the region other than protrusion, some is corresponding with the accommodation groove of support container 11 for the lower surface of briquetting 122, can incite somebody to action The region and the side wall of the protrusion is arranged in temperature sensor 14.
In addition, the test device that embodiments herein provides can also include first interface (not shown) and second interface (not shown);Heat-conductive assembly 13 includes the first end and second end along thermally conductive direction, and first end connects briquetting 12, second end connection First interface, and external heat source equipment can be connected by the first interface.In addition temperature sensor 14 connects second interface, and External detection equipment can be connected by second interface.
It is to be appreciated that not limiting first interface, second interface and thermally conductive group corresponding in embodiments herein The outlet direction of part 13 and temperature sensor 14.For example, first interface, second interface and corresponding heat-conductive assembly 13 and temperature The outlet direction of degree sensor 14 can be two sides or the back side edge of test device.
It is the 6th structural schematic diagram of test device provided by the embodiments of the present application, the test device 70 refering to Fig. 7, Fig. 7 Including test adaptor plate 71 and test bench (not indicating).
Wherein, which includes ejector retainner plate 721, support container 722, temperature sensor 723, lower metallic briquette 724, leads Hot component 725, upper metallic briquette 726.Heat-conductive assembly 725 is set by a heat conductive rod or thermally conductive 725a connection external heat source It is standby.
Wherein, heat-conductive assembly 725 is set between metallic briquette 726 and lower metallic briquette 724, can pass through heat-conducting glue Connection.Temperature sensor 723 is set to the lower surface or side of lower metallic briquette 724, for detecting its temperature.
Test device provided in this embodiment includes: support container, for placing element to be tested;Briquetting, for When testing element is tested, the fixed element to be tested of pressing;Heat-conductive assembly connects briquetting and external heat source equipment, is used for When element to be tested is tested, set temperature is provided for element to be tested.By the above-mentioned means, can be straight by heat-conductive assembly It connects or indirectly provides heat for element to be tested, tested with treating testing element under different temperatures environment, it can be with Otherness adjusting is carried out according to different elements to be tested, is suitble to large-scale element test.In addition, detecting temperature by sensor Degree, the temperature that can treat testing element in real time is monitored, to carry out temperature adjusting in real time.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all according to this Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other Technical field similarly includes in the scope of patent protection of the application.

Claims (10)

1. a kind of test device, which is characterized in that the test device includes:
Support container, for placing element to be tested;
Briquetting, for when the element to be tested is tested, the element to be tested to be fixed in pressing;
Heat-conductive assembly connects the briquetting and external heat source equipment, for being described when the element to be tested is tested Element to be tested provides set temperature.
2. test device according to claim 1, which is characterized in that
The briquetting includes upper metallic briquette and lower metallic briquette;
The heat-conductive assembly is set between the upper metal block and the lower metal block, for pressing in the lower metallic briquette When the element to be tested is tested, the set temperature is provided for the element to be tested by the lower metallic briquette.
3. test device according to claim 2, which is characterized in that
The heat-conductive assembly and the upper metal block and the lower metal block pass through thermally conductive glue connection.
4. test device according to claim 1, which is characterized in that
The heat-conductive assembly includes metallic briquette;
The heat-conductive assembly is set to the bottom of the metallic briquette, for pressing the member to be tested in the lower metallic briquette When part is tested, by the pressure contact of the metallic briquette element to be tested, to be provided for the element to be tested The set temperature.
5. test device according to claim 1, which is characterized in that
The heat-conductive assembly connects the external heat source equipment by heat conductive rod or thermally conductive item.
6. test device according to claim 1, which is characterized in that
The test device further includes first interface;
The heat-conductive assembly includes the first end and second end along thermally conductive direction, and the first end connects the briquetting, and described the Two ends connect the first interface, and can connect the external heat source equipment by the first interface.
7. test device according to claim 1, which is characterized in that
The test device further include:
Temperature sensor is arranged, for detecting the temperature of the heat-conductive assembly close to the heat-conductive assembly.
8. test device according to claim 7, which is characterized in that
Between the temperature sensor setting and the briquetting and the heat-conductive assembly.
9. test device according to claim 7, which is characterized in that
The test device further includes second interface;
The temperature sensor connects the second interface, and can connect external detection equipment by the second interface.
10. test device according to claim 1, which is characterized in that
The test device further include:
Ejector retainner plate is set to below the support container, for when the element to be tested is placed in the support container, It is contacted with the element to be tested;
Test adaptor plate connects the ejector retainner plate, for connecting the element to be tested by the ejector retainner plate, with to it is described to Testing element is tested.
CN201910508009.6A 2019-06-12 2019-06-12 A kind of test device Pending CN110261695A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112710872A (en) * 2019-10-24 2021-04-27 珠海格力电器股份有限公司 Loader for chip testing device and chip testing device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1853111A (en) * 2003-08-18 2006-10-25 株式会社爱德万测试 Temperature control device and temperature control method
CN101650374A (en) * 2008-08-12 2010-02-17 中茂电子(深圳)有限公司 Semiconductor component test base provided with temperature-changing device and test machine platform
CN101750558A (en) * 2008-11-27 2010-06-23 松下电器产业株式会社 Electronic component tester
CN203689187U (en) * 2014-01-10 2014-07-02 科达半导体有限公司 Temperature control device for detecting semiconductor device
CN205353328U (en) * 2016-05-04 2016-06-29 厦门大学 A control by temperature change heating device that is used for multichannel LED life -span to accelerate and online test
CN109116879A (en) * 2018-10-19 2019-01-01 苏州华兴源创科技股份有限公司 A kind of temperature controller
CN109459683A (en) * 2018-12-26 2019-03-12 上海捷策创电子科技有限公司 A kind of apparatus for testing chip

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1853111A (en) * 2003-08-18 2006-10-25 株式会社爱德万测试 Temperature control device and temperature control method
CN101650374A (en) * 2008-08-12 2010-02-17 中茂电子(深圳)有限公司 Semiconductor component test base provided with temperature-changing device and test machine platform
CN101750558A (en) * 2008-11-27 2010-06-23 松下电器产业株式会社 Electronic component tester
CN203689187U (en) * 2014-01-10 2014-07-02 科达半导体有限公司 Temperature control device for detecting semiconductor device
CN205353328U (en) * 2016-05-04 2016-06-29 厦门大学 A control by temperature change heating device that is used for multichannel LED life -span to accelerate and online test
CN109116879A (en) * 2018-10-19 2019-01-01 苏州华兴源创科技股份有限公司 A kind of temperature controller
CN109459683A (en) * 2018-12-26 2019-03-12 上海捷策创电子科技有限公司 A kind of apparatus for testing chip

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
周文英 等: "《聚合物基导热复合材料》", 30 June 2017 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112710872A (en) * 2019-10-24 2021-04-27 珠海格力电器股份有限公司 Loader for chip testing device and chip testing device

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