200924326 九、發明說明： 【發明所屬之技術領域】 本發明係關於老化檢查用之插座，特別係關於可達成輕 量化與維修作業之容易化之插座及具備該插座之老化測試 基板。 【先前技術】 在半導體積體電路（電子零件）之製造步驟中，需要施行 用來使電子零件之初始不良顯在化，並施行初始故障品之 除去之筛選試驗之一種之老化（burn_in)試驗。老化試驗係 藉由在老化測試室内收容安裝複數電子零件之老化測試基 板’施加特定電壓而提供電氣的應力而施行。同時，加熱 老化測試室内之空氣，在高溫度下提供特定之熱應力，藉 此使不良之電子零件顯在化。 施行老化檢查用之檢查裝置（老化測試室）收容著複數電 子零件用之老化測試基板。在老化測試基板上，通常配置 有安裝電子零件用之複數插座。安裝於插座内之電子零件 係經由形成在插座内之端子及形成在老化測試基板上之電 極及布線圖案等而與設在老化測試室之外部之檢查裝置本 體電性連接。 在下列專利文獻1所記載之插座中，在插座内包含有兩 面形成複數彈性接點（螺旋接觸頭）之中繼基板。在插座内 安裝電子零件時，可經由前述中繼基板之前述彈性接點連 接设在電子零件之底面之BGA或LGA等外部接觸頭、與形 成於老化測試基板上之平台座部。 132751.doc 200924326 [專利文獻1]日本特開_5·1 34373號公報（第9-10頁、圖 4Α、圖 4Β) 【發明内容】 [發明所欲解決之問題] 老化測試基板可在高溫環境下重複使I因此，有必要 防止老化測試基板本身之麵曲等之變形。以往，在老化測 弋基板之底面（與女裝插座之面相反側之面），固定具有與 老化測試基板相形狀及大小之金屬材料等構成之補強 板，以防止老化測試基板之變形。 又，在包含上述構成之插座中，即使在可重複使用之中 繼基板中，使用次數增加時’發生不良之可能性也會提 尚。因此，中繼基板有必要定期地更換新基板。 在更換插座内之中繼基板之際，有必要由老化測試基板 卸下插座本體。因此，需要由老化測試室拔出整個老化測 試基板，再逐一卸下設在老化測試基板表面及背面之螺 絲。因此’有必要將老化測試基板垂直地豎起來。 但，因老化測試基板具有複數插座，故型體大且重，更 換作業至少需要2名以上之作業員，故有複雜且效率性不 佳之問題。 又，插座有必要固定於設在老化測試基板之背側之補強 板之螺絲孔，其結果，前述老化測試基板呈現具有複數插 座之構成，故有必要高度地形成各螺絲孔間之尺寸精度。 也就是說，各螺絲孔間之尺寸精度低時，便不能適切地將 插座固定於老化測試基板上。因此，在利用前述中繼基板 132751.doc 200924326 所連接之電子零件側之外部接觸頭與老化測試基板側之平 口座部之間有容易發生連接不良之問題。 本發明係用於解決上述以往之問題，其目的在於提供使 老化測試基板輕量化，並可使中繼基板之更換作業容易化 之插座及具備該插座之老化測試基板。 又，本發明之目的在於提供可一面補強老化測試基板， 面在老化測試基板上適切地安裝各個插座，使電子零件 與老化測試基板間確實連接之插座。 [解決問題之技術手段] 本發明之特徵在於包含：插座本體，其係内部保持電子 零件；及補強板，其係夾著基體基板而安裝於前述插座本 體之底面側。 又，本發明之特徵在於包含：插座本體，其係設於基體 基板且内部可保持電子零件；及連接基板，其係設於前述 電子零件與前述基體基板之間，且具備有電性連接前述電 子零件之外部接點與形成於前述基體基板之連接電極之間 之複數彈性接點； 在前述基體基板之一方之面設有前述插座本體，在另一 方之面設有補強板。 在本發明之插座中，由於以一個插座本體與一個補強板 爽入老化測試基板之兩面而加以安裝，故可使整個老化測 忒基板輕量化。因此，可使插座之卸下作業容易化。 在上述中，最好在前述插座本體與前述基體基板之間設 有前述連接基板。 132751.(J〇, 200924326 一在上述機射，可確實連接電子零㈣之料與老化測 试基板側之連接電極之間。 在上述中，最好前述補強板係固定於前述基體基板之另 一方之面，前述插座本體係在前述基體基板之一方之面 側，安裝於前述補強板。 在上述機構中，不必由基體基板卸下補強板，可僅卸下 插座本體側，可使内部之中繼基板之更換作業較為容易。 、 具體上，前述插座本體、前述基體基板及前述補強板係 被第2螺絲固定成一體，且僅前述補強板係被第1螺絲固定 於前述基體基板。 例如，前述插座本體係包含：台座，其係固定於前述基 體基板之方之面，及框體，其係升降自如地支撐於前述 台座上且内部保持電子零件。 又，也可採用在前述基體基板與補強板之間設有絕緣片 體之構成。 又，本發明之老化測試基板之特徵在於：在一塊基體基 板上設有複數前述中任一項之插座。 在本發明中，可一面裴載複數插座，一面實現輕量之老 化測試基板。 【實施方式】 [發明之效果] 在本發明中’可提供使老化測試基板輕量化，並可使内 部之中繼基板之更換作業容易化之插座。 又’提供可使電子零件與老化測試基板間確實連接之插 132751.doc -9- 200924326 座。 圖1係表示作為本發明之實施型態之插座與老化測試美 板之一部分之立體圖，圖2係表示由異於圖丨之方向所視= 情形之插座與老化測試基板之一部分之分解立體圖，圖3 係表示除去框體之情形之插座與老化測試基板之概略之剖 面圖，圖4係表示構成連接基板之導引構件與中繼模式之 立體圖，圖5係放大表示中繼基板之一部分之剖面圖，圖6 係中繼基板之平面圖。 圖1所示之插座10係用於在連接面（底面）保持固定多數 外部連接電極（外部接觸頭）配置成例如矩陣狀（格子狀或棋 盤目狀）或平面「口」形狀之半導體等之電子零件1(參照圖 3)。此種插座10係設於老化測試基板1〇〇上作為老化試驗 用之夾具。複數插座10例如係以矩陣狀排列於一塊老化測 試基板（基板）1〇〇上。電子零件i保持固定於插座1〇之内 部，在此狀態下設置於老化試驗裝置（老化測試室）内，以 施行特定之老化試驗。 又，形成於刖述電子零件1之連接面1A之外部接觸頭2， 例如可使用如圖3所示之平面狀接觸頭（Lga : Land Grid Array)、或球狀接觸頭（BGA . Ball Grid Array)、針狀接觸 頭（PGA : Pin Grid Array)等，以下，例示使用球狀接觸頭 2a之情形而予以說明。 如圖1所示’插座10具有台座20、及向Z方向升降自如地 設置在前述台座20上之框體30。如圖3及圖4所示，在台座 20之底部21C設有由中繼基板40與導引構件50所構成之連 132751.doc •10· 200924326 接基板CB。又，如圖2及圖3所示，在插座10之底面（圖示 Z2)側，具有補強板60及絕緣片體（絕緣構件）7〇。在本實施 型態中，台座20與框體30形成插座10之本體（插座本體）， 前述補強板60及絕緣片體70係設置成與前述插座本體之底 面（台座20之底面）側對向。 在老化測试基板（基體基板）1〇〇之一方之面（上面）安裝有 構成前述插座本體之台座20，在老化測試基板100之另一 方之面（下面）固定補強板6〇及絕緣片體7〇。台座2〇與補強 板60如後所述’以互相對向之關係固定於前述老化測試基 板100之兩面。 台座20與框體30係利用在高溫環境下也不容易變形之材 料，例如金屬材料或陶瓷等所形成。 如圖1所示，框體30具有向板厚（z)方向將内部挖空成略 四角形狀之裝填口 3 1。框體30係藉由未圖示之施力構件向 圖不Z1方向接受施力之狀態升降自如地安裝於前述台座 20因此’由圖示上方之初始位置向圖示Z2方向推壓框體 30時，即可向接近於台座20之方向下壓框體30，解除前述 推壓時，可藉由前述施力構件上推框體3 0，回到下壓前之 初始位置。 在則述台座20之内部，設有向圖示Z2方向加壓電子零件 1之推壓構件22。如圖1所示，前述推壓構件22係配置於前 述框體30之裝填口31内。 有關前述推壓構件22之詳細予以省略’在框體3〇位於圖 不Z2方向之初始位置時，前述推壓構件22位於電子零件1 132751.doc • 11 - 200924326 之正上方而可向圖示22方向加壓。又，在框體3〇位於圖示 Z2方向之被下壓之狀態時，前述推壓構件。位於退避至離 開電子零件1之側方之位置’且可通過前述裝填⑼而可 施行電子零件1之進出之狀態。 如圖2及圖3所示，前述台座2〇具有底部21c、與設於底 部21C上之左右一對之壁部21A、21B。在底部2ic之中央 且壁部21A與壁部21B之間之區域，形成有略正方形狀構 成之開口部21。又，在底部21C之四角分別形成固定用之* 處安裝孔2 1 a。 在前述台座20之底部之背面（Z2側之面）且前述開口部2ι 之外周部以包圍前述開口部2 1之周圍之方式形成有由底部 背面向圖示Z1方向凹入之陷沒部23。如圖3所示，在前述 陷沒部23之角部形成向圖示Z2方向突出之複數凸起部24。 前述凸起部24具有設於基端側之腳部2钝與設於末端側之 掛定部24b。 如圖3所示，在前述開口部21内，設有如圖4及圖6所示 之導引構件50。又，在前述台座20之底部之背面，設有形 成連接基板CB之中繼基板40。在前述台座2〇之底部之背 面’且别述開口部2 1之外周部形成有由底部背面向圖示z工 方向凹入之陷沒部23 ’前述中繼基板4〇係以定位於前述陷 沒部23之狀態被固定。 如圖4所示，前述中繼基板40例如係以聚醯亞胺等樹脂 構成之絕緣性片體41為基底而形成。在前述片體41以特定 之行數及列數向XY方向有規則地穿設有多數通孔42，在 132751.doc -12- 200924326 圖4所示構造中’整體上排列成平面「口」形狀。 又’前述多數通孔之排列形狀依存於形成在電子零件 1(半導體）之連接面1A之前述球狀接觸頭（外部接觸頭）2&之 排列。例如，在球狀接觸頭2a配置成平面矩陣狀之電子零 件1 (半導體）之情形，前述多數通孔42也排列成平面矩陣 狀，又，如實施型態一般，在球狀接觸頭2a配置成平面 口」形狀之電子零件1 (半導體）之情形，前述多數通孔42 也排列成平面「口」形狀。 如圖5所示，在各個通孔42之内周面形成有施行鍍銅之 導電部43，在導電部43之上端（圖示乙丨側之端部）及下端（圖 示Z2側之端部）形成露出於片體41之表面及背面之連接部 43a、43b。上端侧之連接部43a與下端側之連接部43b係經 由導電部43而被導電連接。 而，在上端側之連接部43a及下端側之連接部43b，設有 例如如以下所說明之彈性接點。 在圖5所不之構造申’以覆蓋通孔42之上下兩開口端部 之方式在通孔42之上側設有上側螺旋接觸頭（彈性接 ..占）44A纟通孔42之下側設有了側螺旋接觸頭（彈性接 點）44Β。 前述螺旋接觸頭44Α、44Β例如係藉由在銅科電性材 料之表面電鑛形成鎳等而形成，在整體上，具有作為導電 性及彈性優異之彈性接點之功能。 前述螺旋接觸頭44Α +、〇·· 與則述螺旋接觸頭44B係同一構 成’在此等之外周側形成略 哀1狀之基部44a。而，前述 132751.doc 200924326 上側螺旋接觸頭44A之基部44a連接於上端側之連接部 43a，前述下側螺旋接觸頭44B之基部44a連接於下端側之 連接部43b。故前述上側螺旋接觸頭44 A與前述下側螺旋接 觸頭44B係經由前述導電部43被導通連接。 螺旋接觸頭44A、44B均由設於基部44a側之捲繞始端 44b向末端側之捲繞終端44c延伸成螺旋狀，捲繞終端44c 位於通孔42之大致中心。而’螺旋接觸頭44A、44B係成 型為隨著由前述捲繞始端44b向捲繞終端44c而徐徐脫離片 體41之凸型。故螺旋接觸頭44A、44B係在前述通孔42之 兩開口端部呈現可向上下方向（Z1-Z2方向）彈性變形之狀 態。 如圖4及圖5所示，在形成前述中繼基板4〇之片體41之表 面’且形成如述多數螺旋接觸頭4 4 A之區域之外側設有複 數板簧45。 前述板簧45係以薄的帶狀金屬板所形成，具有框狀之基 部45a與彈性部45b，被設置成使長側方向朝向與前述片體 41之各邊平行之狀態。 前述板簧45係將前述基部45a固定於前述片體41之表 面，將前述彈性部45b形成作為由前述片體41向圖示上方 (Z1)方向豎起之自由端。而，在前述自由端之末端，一體 地形成比前述彈性部45b窄之寬度尺寸之凸部45ς。 又，前述板簧45例如可利用施行對銅板表面賦予彈性力 之鍍鎳等而形成，此情形，可在與前述螺旋接觸頭44a相 同步驟中同時形成。此情形，在前述片體41上，可利用與 132751.doc -14- 200924326 螺旋接觸頭同揭·* 、+· 樣呵之加工精度形成板簧化。因此，如後 可： = 板簧45彈性地支撐前述導引構件5〇之情形， 、”月、導引構件50之水平方向之位置偏移。而且，若 7用一次之製造步驟同時形成前述螺旋接觸頭44與板簧45 時，也可減少製造步驟。 ’ 如圖4所不’在形成前述中繼基板40之片體41之角部， 形成插入後述之4個支撐突起53之4個貫通孔46，在前： 通孔46之附近形成4個定位孔47。 如圖3及圖4所示，導引構件5〇係設於前述中繼基板40之 圖示Z1方向之上部。前述導引構件5〇係由略正方形狀構成 之平板狀之構件，例如係利用將具有絕緣性之樹脂壓入模 具内而一體地成型之注塑成型法所形成。 、如圖4所不，前述導引構件5〇具有樹脂製之基體观與形 成於前述基體50A之角狀之貫通孔5〇B。 而，在前述貫通孔50B之周圍設有貫通於上下方向(圖示 方向）之多數小孔51所構成之定位機構。前述各個小 孔5!係對應於前述電子零件κ前述球狀接㈣（外部接觸 頭）23及前述中繼基板4〇之螺旋接觸頭44a而形成，敕體之 排：與上述同樣地呈現平面「口」形狀。小孔5心徑大 於前述球狀接觸頭（外部接觸頭）2a及螺旋接觸頭々々A。 但，小孔51之排列也可與前述中繼基板4〇之通孔42之情形 同樣地，對應於形成於前述電子零们之連接面^之外部 接觸頭2之排列形狀，例如呈現平面矩陣等其他形狀。 又 在前述小孔5 1之表背 兩端之一方端部（板厚方向之 132751.doc -15- 200924326 一方端部），最好在雙方端部形成傾斜面。因此，在本實 2型態所示之導引構件50中，容易將前述球狀接觸頭以與 别述上側螺旋接觸頭44A之一方或雙方引導至前述小孔51 内。 • #圖4所示’在前述基體5GA之外周部形成有沿著各邊平 行地延伸之複數凹部52、及由前述基體5〇a之背面（z2側之 面）向圖不下方突出之（22方向延伸之複數）之支撐突起 f , 53(在本實施型態中為4個）。 前述凹部52例如係由帶狀之長溝或長孔所形成，形成在 對應於設在前述中繼基板4〇之前述板簧45之位置。前述凹 口 P 52之寬度尺寸係以寬於前述板簧μ之凸部彳“且窄於前 述彈性部45b之寬度尺寸形成。 因此，在前述凸部45c進入前述凹部52之狀態下，相當 於則述凸部45c之基部之彈性部45b之肩部45d抵接於前述 凹部52之周圍（基體50A之背面）。前述導引構件5〇係在此 * 種狀態下被前述複數板簧45彈性地支樓（參照圖2及圖4)。 連接基板CB係藉由一體地組裝前述中繼.基板4〇與前述 導引構件50所形成。為了利用中繼基板4〇與導引構件5〇組 裝連接基板CB，首先，將導引構件5〇之各支撐突起53之 末端分別插入前述中繼基板40之各貫通孔46。此時，各板 簧45之凸部45c分別插入導引構件5〇之凹部52。 其次’在中繼基板40之背面側（Z2側）’在前述支樓突起 53之末端設有大於前述貫通孔46之直徑之尺寸構成之脫落 防止機構54，以防止支撐突起53由前述貫通孔46脫落。作 132751.doc 16 200924326 為前述脫落防止機槿5 4，Κ « 例如採用加熱而使各支樓突5 之末端變形成為大於前述貫通孔46之直徑之尺寸之構成， 或在各支撑大起53之末端安裝大於前述貫通孔“之直徑之 尺寸之別的構件之構成等。 二 又，各貫通孔46之直徑處於大於各支撐突起”之直炉之 I態。因此’在-體化後之連接基板CB中，處於可沿著 互相接近或離開之對向方向r7古 & Π万勹（Z方向）而在剛述支撐突起53 C 之長度尺寸内變更前述中繼基板40與前述導引構件5〇之對 向距離之狀態。 又，組裝作為連接基板€6後之各支撐突起53之長度尺 寸最好處於前述中繼基板4〇與前述導引構件5〇之對向距離 短於前述板簧45之高度方向（z方向）之豎起尺寸之狀態。 在此狀態下，前述板簧45之凸部45c難以由前述導引構件 50之凹部52脫落，故容易維持前述導引構件5〇被前述板簧 45彈性地支撐之狀態。 在前述插座1 0中，由前述台座2〇之底面側將前述連接基 板CB之導引構件50裝填於開口部21。同時，將前述連接 基板CB之令繼基板40安裝於設在前述插座1〇之底部之背 面之陷沒部23。 此時’將形成於陷沒部23之凸起部24插入於前述中繼基 板40之定位孔47。又，前述定位孔47之直徑係以大於前述 凸起部24之基端之前述腳部24a之直徑，且略小於前述掛 定部24b之直徑之尺寸形成。 使前述凸起部24之掛定部24b，由中繼基板40之上面側 13275l.doc 200924326 套入前述定位孔47時，前述掛定部24b會貫穿定位孔47而 到達中繼基板40之下面側。而且，其後，前述掛定部24b 會掛定於定位孔47。因此，前述中繼基板4〇會被保持於前 述陷沒部23(參照圖3)。 在此狀態下，前述中繼基板40處於可沿著前述凸起部24 之腳部24a而在其長度尺寸内自如地向圖示z方向移動之狀 態。 f' 又，欲在定位孔47之緣部以銅等金屬加邊時，可使定位 孔47強嵌合地套入掛定部24b，在可提高脫落防止效果之 點上相當理想。 在連接基板CB保持於台座2〇之底部側之狀態下，使設 於前述中繼基板40之表面之各個上侧螺旋接觸頭44A分別 插入形成在前述導引構件50之各個小孔51内。又，在前述 小孔51之下端形成傾斜面，故各上側螺旋接觸頭44A位於 各小孑L 5 1 ° 強板6G係以不錄鋼等構成之金屬板或陶甍形成。補強 板60呈現與台座2〇之底面相同之略正方形，其面積也與台 座20之底面相同程度。在補強板6〇之四角分別形成螺絲孔 61 61 61 ’其中在設於對角之位置之2個螺絲孔 61、61之附近形成有固定用之安裝孔62、62。 絕緣片體（絕緣構件）70係以聚酿亞胺等樹脂構成之絕緣 !生间之片體所形成。絕緣片體7〇具有與前述補強板叫同樣 之形狀及大小。在絕緣片體7G形成4個貫通m與2個貫通 孔72月，J述4個貫通孔71形成於對應於補強板之4個螺絲 132751.doc -18· 200924326 孔6!之位置，前述2個貫通孔72形成於對應於補強板的之2 個安裝孔62之位置。 又，絕緣片體70在本發明中並非為必須之構成要素。 即絕緣片體70係在以導電性材料形成前述補強板之情 ;4必要之構件’在以陶瓷等非導電性材料形成前述補 強板60之形’也可採用不具有絕緣片體μ之構成。 • *其次，說明有關固定插座10之老化測試基板1〇〇。如圖3 n 冑戶斤τ，在老化測試基板100形成有複數貫通孔及螺絲 孔在本實施型態中，在老化測試基板100之一個區域内 安裝有-個插座10。在前述一個區域，例如設有4個後讓 孔101、4個插通孔102、與2個螺絲孔1〇3。又在前述一 個區域3又有對應於前述複數螺旋接觸頭（彈性接點）44B ，複數連接電極104。各個連接電極1〇4呈現小的圓板形狀 等，但將該等集合配置成平面「口」形狀或平面矩陣狀。 1述4個後讓孔101係形成對應於形成在中繼基板4〇之4 ； 貝L孔46及4個支撐突起53，同樣地，4個插通孔1 〇2係 形成對應於形成在台座2〇之四角之4個安裝孔⑴、與形成 在補強板6〇及絕緣片體7〇之4個螺絲孔61及貫通孔71。 2個螺絲孔1 〇3係形成對應於形成在補強板及絕緣片 體7〇之對角位置之2個安裝孔62及貫通孔72。 其-人’說明有關插座安裝於老化測試基板之方法。 插座10係將台座2〇安裝於老化測試基板1〇〇之一方之面 (Z1側之上面絕緣片體7〇係以重疊於補強板⑼上之狀態 安裝於老化測試基板100之另一方之面（22侧之下面）。 132751.doc 19 200924326 首先’在老化測試基板100之下面側固定補強板6〇與絕 緣片體70。即，在老化測試基板1〇〇之另一方之面之下面 側以重疊之狀態設置補強板60及絕緣片體70，將前述2個 螺絲孔103與前述2個安裝孔62及貫通孔72定位。而，將2 個螺絲（第1螺絲）81、81插入補強板60之2個安裝孔62、 62 ’再插入絕緣片體7〇之貫通孔72、72，而螺定於老化測 試基板1 00之2個螺絲孔103、1 03。 其次’將上部側具有框體30且底面側具有連接基板cb 之台座20固定於老化測試基板1 〇〇之一方之面之上面側。 即’使形成在台座20之四角之4個安裝孔21a與形成在老化 測試基板100之4個插通孔1〇2，在此狀態下，將4個螺絲 (第2螺絲）82插入4個安裝孔2la，螺定於前述螺絲孔（第1螺 絲孔）61。 藉此’可分別將台座20與補強板60牢固地固定於老化測 試基板100之兩面。此時，設於前述中繼基板4〇之下面側 之複數螺旋接觸頭（彈性接點）44B接觸於設於老化測試基 板1 0 0之複數連接電極1 〇 4。藉此，可使電子零件1之各個 外部接觸頭2a與前述老化測試基板1〇〇之各個連接電極1〇4 電性連接。 如此，本案發明之插座10由於呈現聚備有插座本體與對 應於此之補強板60，可在老化測試基板1 〇〇上之一個區 域，由其兩側套入而安裝之構成，因此，可將一個插座10 確實安裝於老化測試基板1 00。因此，可使裝填於插座之 内部之電子零件1之球狀接觸頭（外部接觸頭）2a與老化測試 132751.doc -20- 200924326 基板100上之連接電極104間確實連接，可提高作為插座1〇 之可靠性。 又，因不需要如以往一般使用相當於老化測試基板丨〇〇 整體之面積之大型補強板，故可減輕裝載複數插座1〇之老 化測試基板100整體之重量。因此，在維修作業時，一個 作業員也可處理老化測試基板1 00。因此，可使中繼基板 40之更換作業容易化，或效率化。 前述中繼基板40之更換係藉由卸下將插座本體（台座2〇) 螺定於老化測試基板100之螺絲82、82而施行。即，僅需 將有缺失之插座10之插座本體由老化測試基板1〇〇卸下。 其次’取出插座本體内之連接基板CB，將中繼基板4〇換 新。而’組裝連接基板CB將其裝回本體内部。最後，利 用剛才卸下之螺絲82、82再將具備連接基板CB之插座本 體螺定於老化測試基板1〇〇。又，補強板6〇係被螺絲81、 81固疋於老化測試基板之另一方之面，故可僅却下插 座本體側而施行前述更換作業。即，無必要將插座本體與 補強板6 0 —起卸下。 又’本案發明並非採用如以往一般將具有與老化測試基 板100同程度之面積之一塊大型補強板固定於老化測試基 板100之另一方之面之構成，而係藉由排列小面積之小型 補強板60所構成。如以往一般，在大型補強板上形成多數 螺絲孔之情形’其所有的螺絲孔難以高精度地形成。且縱 使可高精度地形成所有的螺絲孔，補強板在老化測試室内 曝露於高溫環境下之次數增多時，大型補強板尤其容易發 132751.doc •21 - 200924326 生變形，而提高螺絲孔間之尺寸發生誤差之可能性。 對此，在本案發明中，由於可藉由在不容易發生變形之 小型補強板60形成少數螺絲孔（在上例中，僅有螺絲孔 61、61兩個）而構成，故可消除或減少螺絲孔間之尺寸誤 差。因此，在中繼基板之更換作業上，也難以發生不能螺 定螺絲孔等故障，故可防止作業效率之降低。又，在形成 於補強板60之其他之安裝孔62、62方面，只要可貫穿螺絲 孔81 82即可，並不要求咼的精度，使用所謂呆孔也無 妨。 而且，在老化測試基板1 〇〇上之各區域逐一地安裝補強 板時，也可使整個老化測試基板1〇〇難以發生變形。 又，在上述實施型態中，雖說明有關在中繼基板4〇之兩 面設有彈性接點之情形，但本發明並非限定於此。例如， 也可採用彈性接點僅設在中繼基板之一方之面之構成。例 如，下部側之螺旋接觸頭44B也可為固定接點。此情形， 將電子零件1安裝於插座1〇内時，球狀接觸頭2&會向下方 推壓上部側之螺旋接觸頭44A，此時產生之螺旋接觸頭 44A之彈性力可向圖示Z2方向推壓整個前述中繼基板扣。 故6又於中繼基板40之下部側之前述固定接點可彈壓老化測 試基板上之連接電極丨〇4。 又，在上述實施型態中，雖說明有關使用螺旋接觸頭作 為彈性接點之情形，但本發明並非限定於此。例如，也可 使用在圓頂狀之金屬膜背面貼附橡膠或彈性體等構成之彈 性膜之膜片型接觸點、將作為接點之末端部彎曲形成略u 132751.doc -22· 200924326 字狀’並使整體可彈性變形之彈簧銷（接觸銷）、應力金 屬、接觸探針（例如參照曰本特開2002_357622)、或以竹子 彈簧等彈性接點形成之構成。 另外，在上述實施型態中，有關台座20雖以使用其底部 具有陷沒部23之構成加以說明，但也可採用未具有陷沒部 23之構成。此情形’將插座本體固定於老化測試基板1 〇〇 上時’可將中繼基板40夾台座20之底面與老化測試基板 100之—方之面（上面）之間’牢固地固定中繼基板40。 又’有關螺絲孔數，也不限定於上述實施型態。 【圖式簡單說明】 圖1係表示作為本發明之實施型態之插座與老化測試基 板之一部分之立體圖。 圖2係表示由異於圖丨之方向所視之情形之插座與老化測 試基板之一部分之分解立體圖。 圖3係表示除去框體之情形之插座與老化測試基板之概 略之剖面圖。 圖4係表示構成連接基板之導引構件與中繼模式之立體 圖。 圖5係放大表示中繼基板之一部分之剖面圖。 圖6係中繼基板之平面圖。 【主要元件符號說明】 1 電子零件 2 外部接觸頭 10 插座 132751.doc -23. 200924326BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for aging inspection, and more particularly to a socket which can be easily realized in terms of weight reduction and maintenance work, and an aging test substrate provided with the socket. [Prior Art] In the manufacturing process of a semiconductor integrated circuit (electronic component), it is necessary to perform an aging (burn_in) of a screening test for causing an initial failure of an electronic component and performing removal of an initial defective product. test. The aging test is performed by applying a specific voltage to the aging test substrate in which the plurality of electronic components are mounted in the burn-in test chamber to provide electrical stress. At the same time, the air in the aging test chamber is heated to provide specific thermal stress at high temperatures, thereby rendering the defective electronic components visible. An inspection device (aging test chamber) for performing aging inspection accommodates an aging test substrate for a plurality of electronic components. On the aging test substrate, a plurality of sockets for mounting electronic components are usually disposed. The electronic component mounted in the socket is electrically connected to the inspection device provided outside the burn-in test chamber via a terminal formed in the socket and an electrode and a wiring pattern formed on the burn-in test substrate. In the socket described in the following Patent Document 1, an interposer in which a plurality of elastic contacts (spiral contact heads) are formed on both sides is included in the socket. When the electronic component is mounted in the socket, an external contact head such as a BGA or LGA provided on the bottom surface of the electronic component and a platform seat portion formed on the burn-in test substrate may be connected via the elastic contact of the relay substrate. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Repetition of I in the environment Therefore, it is necessary to prevent deformation of the surface of the test substrate itself. Conventionally, a reinforcing plate having a metal material having a shape and a size corresponding to the aged test substrate is fixed on the bottom surface of the aging test substrate (the surface opposite to the surface of the female socket) to prevent deformation of the burn-in test substrate. Further, in the socket including the above-described configuration, even in the case where the number of uses is increased in the reusable intermediate substrate, the possibility of occurrence of a defect is improved. Therefore, it is necessary to periodically replace the new substrate with the relay substrate. When replacing the relay substrate in the socket, it is necessary to remove the socket body from the burn-in test substrate. Therefore, it is necessary to pull out the entire aging test substrate from the aging test chamber, and then remove the screws provided on the surface and the back surface of the aging test substrate one by one. Therefore, it is necessary to vertically erect the aging test substrate. However, since the aging test substrate has a plurality of sockets, the body is large and heavy, and at least two or more workers are required for the replacement work, which is complicated and inefficient. Further, it is necessary for the socket to be fixed to the screw hole of the reinforcing plate provided on the back side of the burn-in test substrate. As a result, since the burn-in test substrate has a configuration in which a plurality of sockets are provided, it is necessary to form the dimensional accuracy between the screw holes. In other words, when the dimensional accuracy between the screw holes is low, the socket cannot be properly fixed to the burn-in test substrate. Therefore, there is a problem that connection failure easily occurs between the external contact head on the electronic component side to which the relay substrate 132751.doc 200924326 is connected and the flat seat portion on the side of the burn-in test substrate. The present invention has been made to solve the above-mentioned conventional problems, and an object of the invention is to provide a socket which can reduce the weight of the burn-in test substrate and facilitate replacement work of the relay substrate, and an burn-in test substrate including the socket. Further, it is an object of the present invention to provide a socket which can be used to reinforce an aging test substrate, and to mount each socket on the aging test substrate so that the electronic component and the burn-in test substrate are reliably connected. [Technical means for solving the problem] The present invention is characterized by comprising: a socket body that holds an electronic component therein; and a reinforcing plate that is attached to a bottom surface side of the socket body with a base substrate interposed therebetween. Moreover, the present invention is characterized in that the socket body includes a socket body that is disposed on the base substrate and that holds the electronic component therein, and a connection substrate that is disposed between the electronic component and the base substrate and that is electrically connected a plurality of elastic contacts between the external contacts of the electronic component and the connection electrodes formed on the base substrate; the socket body is provided on one of the surfaces of the base substrate, and the reinforcing plate is provided on the other surface. In the socket of the present invention, since one socket body and one reinforcing plate are mounted on both sides of the aging test substrate, the entire aging test substrate can be made lighter. Therefore, the unloading operation of the socket can be facilitated. In the above, it is preferable that the connection substrate is provided between the socket body and the base substrate. 132751. (J〇, 200924326) In the above-mentioned machine, it is possible to reliably connect the material of the electron zero (4) with the connection electrode on the side of the aging test substrate. In the above, it is preferable that the reinforcing plate is fixed to the base substrate. On one side, the socket system is attached to the reinforcing plate on one side of the base substrate. In the above mechanism, it is not necessary to remove the reinforcing plate from the base substrate, and only the socket body side can be removed, and the inner portion can be removed. Specifically, the replacement of the relay substrate is relatively easy. Specifically, the socket body, the base substrate, and the reinforcing plate are integrally fixed by the second screw, and only the reinforcing plate is fixed to the base substrate by the first screw. The socket system includes a pedestal that is fixed to a surface of the base substrate, and a frame that is detachably supported on the pedestal and holds electronic components therein. Further, the base substrate may be used. The structure of the insulating sheet is provided between the reinforcing plate and the reinforcing plate. Further, the aging test substrate of the present invention is characterized in that a plurality of substrates are provided on a base substrate. In the present invention, a lightweight aging test substrate can be realized while carrying a plurality of sockets. [Embodiment] [Effect of the Invention] In the present invention, an aging test substrate can be provided Quantitatively, and can be used to facilitate the replacement of the internal relay substrate. Also, 'providing a socket 132751.doc -9-200924326 which can be surely connected between the electronic component and the burn-in test substrate. FIG. 1 is a view showing the present invention. The perspective view of one part of the socket and the aging test board of the implementation type, FIG. 2 is an exploded perspective view of a part of the socket and the aging test substrate which is different from the direction of the figure ,, and FIG. 3 shows the frame removal. FIG. 4 is a perspective view showing a guide member and a relay pattern constituting a connection substrate, and FIG. 5 is an enlarged cross-sectional view showing a portion of the relay substrate. FIG. A plan view of the substrate. The socket 10 shown in Fig. 1 is used to hold a plurality of external connection electrodes (outer contact heads) at the connection surface (bottom surface), for example, in a moment. An electronic component 1 (see Fig. 3) such as a semiconductor (lattice or checkerboard shape) or a flat "mouth" shape. The socket 10 is attached to the burn-in test substrate 1 as a jig for aging test. The sockets 10 are arranged, for example, in a matrix on an aging test substrate (substrate) 1 . The electronic components i are kept fixed inside the socket 1 , and are disposed in the aging test device (aging test chamber) in this state, A specific aging test is performed. Further, the external contact head 2 is formed on the connection surface 1A of the electronic component 1, and for example, a planar contact head (Lga: Land Grid Array) as shown in FIG. 3, or a spherical contact can be used. A head (BGA. Ball Grid Array), a needle contact (PGA: Pin Grid Array), etc., and the case where the spherical contact head 2a is used will be described below. As shown in Fig. 1, the socket 10 has a pedestal 20 and a frame body 30 which is provided on the pedestal 20 so as to be freely movable in the Z direction. As shown in Fig. 3 and Fig. 4, the bottom portion 21C of the pedestal 20 is provided with a connection substrate 132B composed of a relay substrate 40 and a guide member 50, 132751.doc • 10· 200924326. Further, as shown in Figs. 2 and 3, the reinforcing plate 60 and the insulating sheet (insulating member) 7 are provided on the bottom surface (the side of the drawing Z2) of the socket 10. In the present embodiment, the pedestal 20 and the frame body 30 form a body (socket body) of the socket 10, and the reinforcing plate 60 and the insulating sheet body 70 are disposed opposite to the bottom surface of the socket body (the bottom surface of the pedestal 20). . A pedestal 20 constituting the socket body is attached to one surface (upper surface) of the aging test substrate (base substrate), and a reinforcing plate 6 〇 and an insulating sheet are fixed on the other surface (lower surface) of the aging test substrate 100. Body 7〇. The pedestal 2 and the reinforcing plate 60 are fixed to both sides of the aforementioned aging test substrate 100 in a mutually opposing relationship as will be described later. The pedestal 20 and the frame body 30 are formed of a material that is not easily deformed in a high-temperature environment, such as a metal material or ceramics. As shown in Fig. 1, the frame body 30 has a filling opening 31 which is hollowed out to a substantially square shape in the thickness (z) direction. The frame body 30 is attached to the pedestal 20 in a state where the urging member (not shown) is biased in the direction of the Z1 direction, so that the frame body 30 is pressed in the Z2 direction from the initial position shown in the figure. In this case, the frame body 30 can be pressed down in the direction close to the pedestal 20, and when the pressing force is released, the frame member 30 can be pushed up by the urging member to return to the initial position before the pressing. Inside the pedestal 20, a pressing member 22 for pressing the electronic component 1 in the direction of the drawing Z2 is provided. As shown in Fig. 1, the pressing member 22 is disposed in the loading port 31 of the casing 30. The details of the pressing member 22 are omitted. When the frame 3 is located at the initial position in the Z2 direction, the pressing member 22 is located directly above the electronic component 1 132751.doc • 11 - 200924326 and can be illustrated. Pressurize in 22 directions. Further, when the casing 3 is in a state of being pressed in the direction of Z2 in the drawing, the pressing member is pressed. It is located at a position that is retracted to the side away from the electronic component 1 and can be moved in and out of the electronic component 1 by the aforementioned filling (9). As shown in Figs. 2 and 3, the pedestal 2 has a bottom portion 21c and a pair of left and right wall portions 21A and 21B provided on the bottom portion 21C. In the region between the wall portion 21A and the wall portion 21B at the center of the bottom portion 2ic, an opening portion 21 having a substantially square shape is formed. Further, mounting holes 2 1 a for fixing are formed at the four corners of the bottom portion 21C. On the back surface (the surface on the Z2 side) of the bottom portion of the pedestal 20, and the outer peripheral portion of the opening portion 2i surrounds the periphery of the opening portion 21, a recessed portion 23 recessed in the direction Z1 from the bottom surface is formed. . As shown in Fig. 3, a plurality of convex portions 24 projecting in the direction of the drawing Z2 are formed at the corner portions of the trap portion 23. The boss portion 24 has a leg portion 2 provided on the proximal end side and a hook portion 24b provided on the distal end side. As shown in Fig. 3, a guide member 50 as shown in Figs. 4 and 6 is provided in the opening portion 21. Further, on the back surface of the bottom of the pedestal 20, a relay substrate 40 on which the connection substrate CB is formed is provided. The peripheral portion of the bottom portion of the pedestal 2 is not formed, and the peripheral portion of the opening portion 2 1 is formed with a recessed portion 23 that is recessed from the bottom surface and the back surface of the drawing, and the relay substrate 4 is positioned to be positioned in the foregoing The state of the trap portion 23 is fixed. As shown in Fig. 4, the relay substrate 40 is formed, for example, by using an insulating sheet 41 made of a resin such as polyimide. In the sheet body 41, a plurality of through holes 42 are regularly formed in the XY direction by a specific number of rows and columns, and are arranged in a plane "mouth" as a whole in the structure shown in Fig. 4, 132751.doc -12-200924326. shape. Further, the arrangement shape of the plurality of through holes depends on the arrangement of the spherical contact heads (external contact heads) 2& formed on the connection surface 1A of the electronic component 1 (semiconductor). For example, in the case where the spherical contact heads 2a are arranged in a planar matrix-shaped electronic component 1 (semiconductor), the plurality of through holes 42 are also arranged in a planar matrix shape, and, as in the embodiment, are disposed in the spherical contact head 2a. In the case of the electronic component 1 (semiconductor) in the shape of a flat opening, the plurality of through holes 42 are also arranged in a planar "mouth" shape. As shown in FIG. 5, a copper-plated conductive portion 43 is formed on the inner peripheral surface of each of the through holes 42, and the upper end of the conductive portion 43 (the end portion on the side of the ytterbium side) and the lower end (the end on the side of the Z2 side are shown). The part is formed with the connecting portions 43a and 43b exposed on the front and back surfaces of the sheet body 41. The connection portion 43a on the upper end side and the connection portion 43b on the lower end side are electrically connected via the conductive portion 43. Further, the connecting portion 43a on the upper end side and the connecting portion 43b on the lower end side are provided with, for example, elastic contacts as described below. The upper side of the through hole 42 is provided with an upper side spiral contact head (elastic connection: occupying) 44A, and the lower side of the through hole 42 is provided on the upper side of the through hole 42 so as to cover the upper and lower open end portions of the through hole 42. With a side spiral contact (elastic joint) 44 Β. The spiral contact heads 44A and 44, for example, are formed by forming nickel or the like on the surface of a copper-based electrical material, and have a function as an elastic contact excellent in electrical conductivity and elasticity as a whole. The spiral contact heads 44 Α +, 〇·· are formed in the same configuration as the spiral contact heads 44B described above, and a base portion 44a having a slight shape is formed on the outer peripheral side. Further, the base portion 44a of the upper spiral contact head 44A is connected to the upper end side connecting portion 43a, and the base portion 44a of the lower side spiral contact head 44B is connected to the lower end side connecting portion 43b. Therefore, the upper spiral contact 44A and the lower spiral contact 44B are electrically connected via the conductive portion 43. Each of the spiral contact heads 44A and 44B extends in a spiral shape from the winding start end 44b provided on the side of the base portion 44a toward the winding end terminal 44c on the distal end side, and the winding end portion 44c is located substantially at the center of the through hole 42. Further, the "spiral contact heads 44A, 44B are formed into a convex shape which is gradually separated from the sheet body 41 as the winding start end 44b is wound toward the winding end portion 44c. Therefore, the spiral contact heads 44A, 44B are elastically deformed in the upward and downward directions (Z1-Z2 direction) at the two end portions of the through holes 42. As shown in Figs. 4 and 5, a plurality of leaf springs 45 are provided on the outer side of the region where the surface of the sheet 41 of the intermediate substrate 4 is formed and the plurality of spiral contact heads 4 4 A are formed. The leaf spring 45 is formed of a thin strip-shaped metal plate, and has a frame-shaped base portion 45a and an elastic portion 45b, and is disposed such that the longitudinal direction thereof is parallel to the respective sides of the sheet body 41. The leaf spring 45 fixes the base portion 45a to the surface of the sheet body 41, and the elastic portion 45b is formed as a free end that is raised from the sheet body 41 in the upward (Z1) direction. Further, at the end of the free end, a convex portion 45A having a width smaller than that of the elastic portion 45b is integrally formed. Further, the leaf spring 45 can be formed, for example, by performing nickel plating or the like for imparting an elastic force to the surface of the copper plate. In this case, it can be simultaneously formed in the same step as the spiral contact head 44a. In this case, on the sheet body 41, it is possible to form a leaf spring by the same precision as that of the 132751.doc -14-200924326 spiral contact head. Therefore, as follows: = the leaf spring 45 elastically supports the above-mentioned guiding member 5 ,, "month, the positional deviation of the guiding member 50 in the horizontal direction. Moreover, if the manufacturing step of 7 is used at the same time, the aforementioned When the spiral contact head 44 and the leaf spring 45 are used, the manufacturing steps can be reduced. As shown in Fig. 4, four corners of the four support protrusions 53 to be described later are formed at the corners of the sheet body 41 on which the relay substrate 40 is formed. In the through hole 46, four positioning holes 47 are formed in the vicinity of the front hole 46. As shown in Fig. 3 and Fig. 4, the guide member 5 is attached to the upper portion of the relay substrate 40 in the direction Z1. The guide member 5 is a flat member having a substantially square shape, and is formed, for example, by an injection molding method in which an insulating resin is pressed into a mold and integrally molded. As shown in FIG. 4, the above guide The lead member 5 has a resin-made base body and a through hole 5〇B formed in the angular shape of the base 50A. Further, a plurality of small holes penetrating in the vertical direction (illustrated direction) are provided around the through hole 50B. Positioning mechanism composed of 51. Each of the aforementioned small holes 5! Κ should be in the spherical contact the electronic component (iv) (outer contacts) 23 and the coil of the relay substrate 4〇 contact head 44a is formed, the body of the discharge imperial: the plane of the "mouth" shape in the same manner presented above. The small hole 5 has a larger core diameter than the aforementioned spherical contact head (external contact head) 2a and the spiral contact head 々々A. However, the arrangement of the small holes 51 may be similar to the case of the through holes 42 of the above-mentioned relay substrate 4, corresponding to the arrangement shape of the external contact heads 2 formed on the connection faces of the electrons, for example, a plane matrix Other shapes. Further, at one end of each of the front and back ends of the small hole 5 1 (one end portion of the thickness direction 132751.doc -15 - 200924326), it is preferable to form an inclined surface at both end portions. Therefore, in the guide member 50 shown in the second embodiment, the spherical contact head is easily guided into the small hole 51 in one or both of the upper spiral contact heads 44A. • As shown in FIG. 4, a plurality of concave portions 52 extending in parallel along the respective sides are formed on the outer peripheral portion of the base body 5GA, and the back surface (the surface on the z2 side) of the base body 5〇a protrudes downward from the figure ( Supporting projections f, 53 (four in the present embodiment) of a plurality of 22-direction extensions. The concave portion 52 is formed, for example, by a strip-shaped long groove or a long hole, and is formed at a position corresponding to the leaf spring 45 provided on the relay substrate 4A. The width dimension of the notch P 52 is formed to be wider than the convex portion 前述 of the leaf spring μ and narrower than the width of the elastic portion 45b. Therefore, in a state where the convex portion 45c enters the concave portion 52, it is equivalent. The shoulder portion 45d of the elastic portion 45b of the base portion of the convex portion 45c abuts against the periphery of the concave portion 52 (the back surface of the base 50A). The guiding member 5 is elasticized by the plurality of leaf springs 45 in this state. The ground support (see Fig. 2 and Fig. 4). The connection substrate CB is integrally formed by integrally assembling the relay substrate 4 and the guide member 50. In order to utilize the relay substrate 4 and the guide member 5 In the connection substrate CB, first, the ends of the respective support protrusions 53 of the guide member 5 are inserted into the respective through holes 46 of the relay substrate 40. At this time, the convex portions 45c of the leaf springs 45 are respectively inserted into the guide members 5 The concave portion 52. Next, at the back side (Z2 side) of the relay substrate 40, a fall prevention mechanism 54 having a size larger than the diameter of the through hole 46 is provided at the end of the branch protrusion 53 to prevent the support protrusion 53. Falling off through the through hole 46. .doc 16 200924326 is the above-described fall prevention preventing device 5 4, Κ « for example, by heating, the end of each branch 5 is deformed to be larger than the diameter of the through hole 46, or at the end of each support 53 A configuration of a member other than the size of the diameter of the through hole is installed. Secondly, the diameter of each through hole 46 is in the I state of the straight furnace larger than the respective supporting protrusions. Therefore, in the connecting substrate CB after the body is formed, it is in the opposite direction r7 ancient & In the length direction of the support protrusion 53 C, the state of the opposing distance between the relay substrate 40 and the guiding member 5 is changed in the length direction of the support protrusion 53 C. The length dimension of each of the support projections 53 is preferably in a state in which the opposing distance between the relay substrate 4A and the guide member 5A is shorter than the vertical dimension of the leaf spring 45 in the height direction (z direction). In the case where the convex portion 45c of the leaf spring 45 is hard to be detached from the concave portion 52 of the guide member 50, it is easy to maintain the state in which the guide member 5 is elastically supported by the leaf spring 45. In the socket 10 described above, The guide member 50 of the connection substrate CB is loaded into the opening portion 21 on the bottom surface side of the pedestal 2B. At the same time, the subsequent substrate 40 of the connection substrate CB is mounted on the back surface of the bottom portion of the socket 1B. Part 23. At this point 'will be formed in The protruding portion 24 of the portion 23 is inserted into the positioning hole 47 of the relay substrate 40. Further, the diameter of the positioning hole 47 is larger than the diameter of the leg portion 24a of the base end of the protruding portion 24, and is slightly smaller than The diameter of the hook portion 24b is formed. When the hook portion 24b of the boss portion 24 is inserted into the positioning hole 47 from the upper surface side 13275l.doc 200924326 of the relay substrate 40, the hook portion 24b penetrates. The positioning hole 47 reaches the lower surface side of the relay substrate 40. Further, the hooking portion 24b is hooked to the positioning hole 47. Therefore, the relay substrate 4 is held by the recessed portion 23 (refer to 3) In this state, the relay substrate 40 is in a state of being movable in the z direction along the leg portion 24a of the boss portion 24, and is freely moved in the z direction. When the edge portion of the positioning hole 47 is rimmed with a metal such as copper, the positioning hole 47 can be strongly fitted into the hook portion 24b, which is preferable in that the detachment prevention effect can be improved. The connection substrate CB is held in the pedestal 2 In the state of the bottom side of the crucible, each of the surfaces of the relay substrate 40 is provided The upper spiral contact heads 44A are respectively inserted into the respective small holes 51 of the guiding member 50. Further, an inclined surface is formed at the lower end of the small holes 51, so that the upper spiral contact heads 44A are located at each small 孑 L 5 1 ° The strong plate 6G is formed by a metal plate or a ceramic pot which is not composed of steel, etc. The reinforcing plate 60 has a square shape which is the same as the bottom surface of the pedestal 2, and the area thereof is also the same as the bottom surface of the pedestal 20. In the reinforcing plate 6 Screw holes 61 61 61 ' are respectively formed at the four corners, and mounting holes 62 and 62 for fixing are formed in the vicinity of the two screw holes 61 and 61 provided at the diagonal positions. The insulating sheet (insulating member) 70 is formed of a sheet made of a resin such as polyacrylonitrile. The insulating sheet 7'' has the same shape and size as the reinforcing plate described above. Four through-m and two through-holes are formed in the insulating sheet body 7G for 72 months, and four through-holes 71 are formed at positions corresponding to the four screws 132751.doc -18· 200924326 holes 6! of the reinforcing plate, the above 2 The through holes 72 are formed at positions corresponding to the two mounting holes 62 of the reinforcing plates. Further, the insulating sheet body 70 is not an essential component in the present invention. That is, the insulating sheet body 70 is formed by forming the reinforcing plate with a conductive material; and the necessary member 'forms the reinforcing plate 60 in a non-conductive material such as ceramics' may also be formed without the insulating sheet μ. . • *Secondly, the aging test substrate 1 of the fixed socket 10 is explained. As shown in Fig. 3, a plurality of through holes and screw holes are formed in the burn-in test substrate 100. In the present embodiment, a socket 10 is mounted in an area of the burn-in test substrate 100. In the foregoing region, for example, four rear access holes 101, four insertion holes 102, and two screw holes 1〇3 are provided. Further, in the aforementioned one region 3, there is a plurality of connection electrodes 104 corresponding to the aforementioned plurality of spiral contact heads (elastic contacts) 44B. Each of the connection electrodes 1〇4 has a small disk shape or the like, but these sets are arranged in a planar "mouth" shape or a planar matrix shape. After the four steps, the holes 101 are formed corresponding to the 4 formed on the relay substrate 4; the B-holes 46 and the four support protrusions 53. Similarly, the four insertion holes 1 and 2 are formed corresponding to each other. Four mounting holes (1) at the four corners of the pedestal, and four screw holes 61 and through holes 71 formed in the reinforcing plate 6A and the insulating sheet 7〇. The two screw holes 1 〇 3 form two mounting holes 62 and through holes 72 corresponding to the diagonal positions formed between the reinforcing plate and the insulating sheet 7〇. Its - person's description of the method by which the socket is mounted on the aging test substrate. In the socket 10, the pedestal 2 is mounted on one side of the aging test substrate 1 (the upper insulating sheet 7 on the Z1 side is attached to the other side of the aging test substrate 100 in a state of being superposed on the reinforcing plate (9). (Bottom of the 22nd side) 132751.doc 19 200924326 First, the reinforcing plate 6A and the insulating sheet 70 are fixed on the lower side of the aging test substrate 100. That is, on the lower side of the other side of the aging test substrate 1 The reinforcing plate 60 and the insulating sheet body 70 are provided in an overlapping state, and the two screw holes 103 are positioned with the two mounting holes 62 and the through holes 72. The two screws (first screws) 81 and 81 are inserted and reinforced. The two mounting holes 62, 62' of the plate 60 are inserted into the through holes 72, 72 of the insulating sheet 7 and are screwed to the two screw holes 103, 103 of the aging test substrate 100. Next, the upper side has The pedestal 20 having the frame 30 and the bottom surface side of the connection substrate cb is fixed to the upper surface side of the surface of the aging test substrate 1. That is, the four mounting holes 21a formed at the four corners of the pedestal 20 are formed on the aging test substrate. 4 of the 100 through holes 1 〇 2, in this state, will 4 The screw (second screw) 82 is inserted into the four mounting holes 21a and screwed into the screw holes (first screw holes) 61. By this, the pedestal 20 and the reinforcing plate 60 can be firmly fixed to both sides of the burn-in test substrate 100. At this time, the plurality of spiral contact heads (elastic contacts) 44B provided on the lower side of the relay substrate 4A are in contact with the plurality of connection electrodes 1 and 4 provided on the burn-in test substrate 100. The external contact heads 2a of the component 1 are electrically connected to the respective connection electrodes 1〇4 of the foregoing aging test substrate 1〇〇. Thus, the socket 10 of the present invention is provided with a socket body and a reinforcing plate 60 corresponding thereto. It can be installed in an area on the aging test substrate 1 套, and is mounted on both sides thereof. Therefore, one socket 10 can be surely mounted on the aging test substrate 100. Therefore, it can be loaded inside the socket. The spherical contact head (external contact head) 2a of the electronic component 1 and the aging test 132751.doc -20- 200924326 are reliably connected between the connection electrodes 104 on the substrate 100, and the reliability as the socket 1 can be improved. In the past, a large reinforcing plate corresponding to the entire area of the aging test substrate , has been generally used, so that the weight of the aging test substrate 100 loaded with a plurality of sockets can be reduced. Therefore, an operator can handle aging during maintenance work. The substrate 1 is tested. Therefore, the replacement work of the relay substrate 40 can be facilitated or made efficient. The replacement of the relay substrate 40 is performed by screwing the socket body (the pedestal 2) to the burn-in test substrate 100. The screws 82, 82 are applied. That is, only the socket body of the missing socket 10 is removed from the burn-in test substrate 1A. Next, the connection substrate CB in the socket body is taken out, and the relay substrate 4 is replaced. And the assembly connection substrate CB is assembled and returned to the inside of the body. Finally, the socket body having the connection substrate CB is screwed to the burn-in test substrate 1 using the screws 82 and 82 which have just been removed. Further, since the reinforcing plate 6 is fixed to the other side of the burn-in test substrate by the screws 81 and 81, the above-described replacement work can be performed only on the lower side of the socket body. That is, it is not necessary to remove the socket body together with the reinforcing plate 60. Further, the present invention does not employ a configuration in which a large-sized reinforcing plate having the same area as the aged test substrate 100 is fixed to the other side of the burn-in test substrate 100 as in the prior art, and a small reinforcing plate is arranged by arranging a small area. 60 constitutes. As in the prior art, when a large number of screw holes are formed in a large reinforcing plate, all of the screw holes are difficult to form with high precision. Even if all the screw holes can be formed with high precision, the number of times the reinforcing plate is exposed to a high temperature environment in the aging test room is increased, and the large reinforcing plate is particularly prone to deformation, and the screw holes are increased. The possibility of a dimensional error. On the other hand, in the invention of the present invention, since a small number of screw holes (in the above example, only two screw holes 61, 61) can be formed by forming the small reinforcing plate 60 which is not easily deformed, it can be eliminated or reduced. Dimensional error between screw holes. Therefore, in the replacement work of the relay substrate, it is also difficult to cause a failure such as the screw hole to be screwed, so that the work efficiency can be prevented from being lowered. Further, in terms of the other attachment holes 62, 62 formed in the reinforcing plate 60, it is sufficient that the screw holes 81 82 can be penetrated, and the accuracy of the crucible is not required, and it is also possible to use a so-called dead hole. Further, when the reinforcing plates are attached one by one to the respective regions on the aging test substrate 1, the entire aged test substrate 1 can be hardly deformed. Further, in the above embodiment, the case where the elastic contact is provided on both sides of the relay substrate 4 is described, but the present invention is not limited thereto. For example, it is also possible to adopt a configuration in which the elastic contact is provided only on one side of the relay substrate. For example, the lower side spiral contact 44B can also be a fixed contact. In this case, when the electronic component 1 is mounted in the socket 1 , the spherical contact head 2 & presses the screw contact 44A on the upper side downward, and the elastic force of the spiral contact 44A generated at this time can be shown to the figure Z2 The direction pushes the entire aforementioned intermediate substrate buckle. Therefore, the fixed contact on the lower side of the relay substrate 40 can elastically connect the connection electrode 4 on the aging test substrate. Further, in the above embodiment, the case where the spiral contact head is used as the elastic contact is described, but the present invention is not limited thereto. For example, a diaphragm type contact point of an elastic film made of a rubber or an elastomer or the like attached to the back surface of a dome-shaped metal film may be used, and the end portion as a contact may be bent to form a slightly u 132751.doc -22· 200924326 word A spring pin (contact pin) which is elastically deformable as a whole, a stress metal, a contact probe (for example, see 曰本特开 2002_357622), or a resilient joint such as a bamboo spring. Further, in the above-described embodiment, the pedestal 20 is described with a configuration in which the bottom portion has the recessed portion 23, but a configuration in which the recessed portion 23 is not provided may be employed. In this case, 'when the socket body is fixed to the aging test substrate 1 '', the relay substrate 40 can be firmly fixed between the bottom surface of the pedestal 20 and the surface (top surface) of the aging test substrate 100. 40. Further, the number of screw holes is not limited to the above embodiment. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a part of a socket and an aging test substrate which is an embodiment of the present invention. Fig. 2 is an exploded perspective view showing a portion of the socket and the aging test substrate which are viewed from a direction different from the direction of the figure. Fig. 3 is a schematic cross-sectional view showing the socket and the burn-in test substrate in the case where the frame is removed. Fig. 4 is a perspective view showing a guide member and a relay mode constituting a connection substrate. Fig. 5 is a cross-sectional view showing a part of the relay substrate in an enlarged manner. Figure 6 is a plan view of the relay substrate. [Main component symbol description] 1 Electronic component 2 External contact head 10 Socket 132751.doc -23. 200924326
20 台座（插座本體） 21 開口部 30 框體（插座本體） 31 裝填口 40 中繼基板 44A 、 44B 螺旋接觸頭（彈性接點） 45 板簧 50 導引構件 53 支撐突起 60 補強板 61 螺絲孔 62 安裝孔 70 絕緣片體（絕緣構件） 71 > 72 貫通孔 81 螺絲（第1螺絲） 82 螺絲（第2螺絲） 100 老化測試基板（基體構件） 101 後讓孔 102 插通孔 103 螺絲子L 132751.doc -24-20 pedestal (socket body) 21 Opening 30 Frame (socket body) 31 Filling port 40 Relay substrate 44A, 44B Spiral contact head (elastic joint) 45 Leaf spring 50 Guide member 53 Support protrusion 60 Reinforcing plate 61 Screw hole 62 Mounting Holes 70 Insulation Sheet (Insulating Member) 71 > 72 Through Hole 81 Screw (1st Screw) 82 Screw (2nd Screw) 100 Aging Test Substrate (Base Member) 101 Rear Hole 102 Insert Through Hole 103 Screw L 132751.doc -24-