CN207994335U - A kind of no pressure formula semiconductor laser ageing device - Google Patents
A kind of no pressure formula semiconductor laser ageing device Download PDFInfo
- Publication number
- CN207994335U CN207994335U CN201820370903.2U CN201820370903U CN207994335U CN 207994335 U CN207994335 U CN 207994335U CN 201820370903 U CN201820370903 U CN 201820370903U CN 207994335 U CN207994335 U CN 207994335U
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- heat sink
- heat
- laser
- copper billet
- conducting pad
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Semiconductor Lasers (AREA)
Abstract
A kind of no pressure formula semiconductor laser ageing device, including：Aging copper billet, heat-conducting pad, N number of heat sink, N number of laser.By by laser be plugged in it is corresponding it is heat sink after, each heat sink be in series is connected and be positioned on heat-conducting pad using gold thread, each heat sink both ends after series connection can start burn-in test after being powered using conducting wire I and conducting wire II, it is simple in structure, it is easy to operate, while can be to multiple laser gold thread burn-in tests.Since connection is each heat sink in the form of gold thread welding, to reduce the resistance value in circuit, it is ensured that electric current is stablized.Additionally, due to it is heat sink be with heat-conducting pad fitting contact, heat-conducting pad will be in the heat transfer in burn-in test to aging copper billet, to change traditional spring needle the structure as pressing fixed laser again is conducted as electric current, it is a kind of no pressure test device, the phenomenon that laser pressure break avoided occurs.
Description
Technical field
The utility model is related to photoelectron technical fields, and in particular to a kind of no pressure formula semiconductor laser ageing dress
It sets.
Background technology
Semiconductor laser development speed is fast, and application range is wide, development potentiality is big be other current lasers without
Method analogy, in recent years, the usage quantity shelter of fixed wave length semiconductor laser has first of laser, certain important applications
Other common lasers of field past, are gradually replaced by semiconductor laser.This is because outstanding excellent there are many it
Point：Small, light-weight, output power is small and high conversion efficiency, can be carried out by Injection Current directly modulation, reliability it is high,
From visible infrared, wide coverage, price increasingly reduce for long working life, launch wavelength.
But the aging of semiconductor laser, it is one of production testing stream being had to pass through before manufacturer's product export
Journey, the laser after burn-in screen just can ensure that its quality and service life.The method of traditional laser ageing screening
Very much；
Chinese patent document CN201010201586.X, which is disclosed, provides a kind of aging folder suitable for semiconductor laser
Tool, including：One main body, the main body are a printed circuit board, a groove are provided in the centre of the main body, among the main body
Groove is rectangular, bar shaped or T-shaped, and the both sides of the groove of the body upper are provided with screw hole, the screw hole and the circular hole pair on cover board
It answers；One is heat sink with laser, this is heat sink to be located in the groove；Wherein further include a cover board, the cover board is for covering this
Heat sink, the both sides above the cover board are provided with circular hole, and cover board is fixed on main body for passing through screw.The patent can only single dress
One laser, one laser of a fixture aging, ageing efficiency are low.
Chinese patent document CN200410085345.8 discloses a kind of multi-channel semiconductor laser ageing method, will partly lead
Volumetric laser diode LD by being only mounted on multichannel LD test and aging clamp, the fixture with equipped with power supply and with central analysis,
The multichannel constant-power control circuit connection of control computer connection；Computer is tested and the matched permanent work(of certain LD on fixture first
Rate resistance, then, with the matched power control circuit units of this LD and its unicom, this will be made in multichannel constant-power control circuit
LD with actual condition it is same or similar like in the environment of carry out aging, aforementioned step is then completed one by one to remaining LD to be measured again
Suddenly.The equipment that the present invention utilizes is mostly the transformation to existing equipment, makes the simpler circuit of equipment, reliability increase and operates
Convenient, need to only connect with the mains can carry out aging, and ageing efficiency is high, and ageing results are more acurrate, more practical, exempt from debugging and again perseverance
Power works so that LD will not be damaged.The patent is the aging simultaneously of more lasers, but is using the electric current for connecing adjusting
The work of laser is adapted to, larger resistance is will produce in circuit, needs to be equipped with multiple systems to ensure the stabilization of aging, if
Standby cumbersome, the resistance of steel is bigger in circuit.
Invention content
For the utility model in order to overcome the shortcomings of the above technology, providing one kind makes laser preferably be in electrical contact your few electricity
Resistance value in road, the no pressure formula semiconductor laser ageing device for improving ageing efficiency.
Technical solution is used by the utility model overcomes its technical problem：
A kind of no pressure formula semiconductor laser ageing device, including：
Aging copper billet, elongated structure；
Heat-conducting pad, is located at aging copper billet side, elongated structure and it is parallel with aging copper billet, heat-conducting pad
Side end face side end face corresponding with aging copper billet is in contact；
N number of heat sink, N is the natural number more than or equal to 2, and heat sink interior be horizontally disposed with has jack, the internal diameter of the jack
More than the outer diameter of laser；
N number of laser, respectively correspond be plugged in it is N number of it is heat sink in, the hard contact of laser is in contact with heat sink；
N number of heat sink bottom is in contact with the upper surface of heat-conducting pad, it is N number of it is heat sink do not contacted with aging copper billet, phase
Adjacent two it is heat sink between be connected by M gold thread, it is N number of it is heat sink be serially connected after, I phase of heat sink and conducting wire at leftmost side end
Even, the heat sink and conducting wire II at rightmost side end is connected.
In order to ensure heat sink fitting closely with heat-conducting pad, above-mentioned heat-conducting pad is made of magnetic material, in magnetism
Under effect, heat-conducting pad upper end is fixed in N number of heat sink absorption.
Preferably, the thickness of above-mentioned aging copper billet is 2-10mm.
Preferably, above-mentioned aging copper billet and heat-conducting pad are cuboid structure.
Preferably, above-mentioned N is that 12,12 heat sink utilization gold threads are connected in series with each other.
The utility model has the beneficial effects that：By by laser be plugged in it is corresponding it is heat sink after, will be each using gold thread
Heat sink be in series connects and is positioned on heat-conducting pad, after each heat sink both ends after series connection are powered using conducting wire I and conducting wire II
It can start burn-in test, it is simple in structure, it is easy to operate, while can be to multiple laser gold thread burn-in tests.Due to using
The form connection of gold thread welding is each heat sink, to reduce the resistance value in circuit, it is ensured that electric current is stablized.It is additionally, due to heat sink
It is contacted with heat-conducting pad fitting, heat-conducting pad is by the heat transfer in burn-in test to aging copper billet, to change tradition
Spring needle conduct the structure as pressing fixed laser again as electric current, be a kind of no pressure test device, what is avoided is sharp
The phenomenon that light device pressure break, occurs.
Description of the drawings
Fig. 1 is the overlooking structure diagram at the heat-conducting pad position of the utility model；
Fig. 2 is the heat sink cross-sectional view of the utility model；
Fig. 3 is multiple heat sink structural schematic diagrams being serially connected using gold thread of the utility model；
Fig. 4 is the use state overlooking structure diagram of the utility model；
In figure, 1. heat-conducting pad, 2. aging copper billet, 3. 6. gold thread of heat sink 4. jack, 5. laser, 7. conducting wire I 8. is led
Line II.
Specific implementation mode
1 the utility model is described further to attached drawing 4 below in conjunction with the accompanying drawings.
A kind of no pressure formula semiconductor laser ageing device, including：Aging copper billet 2, elongated structure；Heat conductive pad
Piece 1, is located at 2 side of aging copper billet, elongated structure and it is parallel with aging copper billet 2, the side end face of heat-conducting pad 1 with it is old
Change 2 corresponding side end face of copper billet to be in contact；N number of heat sink 3, N is natural number more than or equal to 2, be horizontally disposed in heat sink 3 have it is slotting
Hole 4, the internal diameter of jack 4 are more than the outer diameter of laser 5；N number of laser 5 corresponds be plugged in N number of heat sink 3 respectively, laser
The hard contact of device 5 is in contact with heat sink 3；N number of heat sink 3 bottom is in contact with the upper surface of heat-conducting pad 1, N number of heat sink 3 with
Aging copper billet 2 does not contact, and is connected by M gold thread 6 between adjacent two heat sink 3, after N number of heat sink 3 are serially connected, most
Heat sink the 3 of left-hand end are connected with conducting wire I 7, and heat sink the 3 of rightmost side end is connected with conducting wire II 8.By the way that laser 5 is plugged in
After corresponding heat sink 3, each heat sink 3 are in series using gold thread 6 and connects and is positioned on heat-conducting pad 1, it is each after series connection
Heat sink 3 both ends can start burn-in test after being powered using conducting wire I 7 and conducting wire II 8, simple in structure, easy to operate, while can
With to multiple laser gold thread burn-in tests.Due to connecting each heat sink 3 in the form of gold thread welding, to reduce circuit
In resistance value, it is ensured that electric current stablize.Additionally, due to heat sink 3 contacted with the fitting of heat-conducting pad 1, heat-conducting pad 1 is by burn-in test
In heat transfer to aging copper billet 2 on, swash again as pressing is fixed to change traditional spring needle and be conducted as electric current
The phenomenon that structure of light device, is a kind of no pressure test device, 5 pressure break of laser avoided occurs.
Embodiment 1：
Heat-conducting pad 1 is made of magnetic material, and under magnetic action, N number of heat sink 3 absorption is fixed on heat-conducting pad 1
End.Heat sink 3 absorption is fixed on heat-conducting pad 1 by magnetic absorption, is not only fixed conveniently, while may insure under heat sink 3
End is fitted closely with heat-conducting pad 1, further improves electrical contact, ageing efficiency is made to be further improved.
Embodiment 2：
The thickness of aging copper billet 2 is 2-10mm.
Embodiment 3：
Aging copper billet 2 and heat-conducting pad 1 are cuboid structure.
Embodiment 4：
N is 12,12 heat sink 3 and is connected in series with each other using gold thread 6.
Claims (5)
1. a kind of no pressure formula semiconductor laser ageing device, which is characterized in that including：
Aging copper billet（2）, elongated structure；
Heat-conducting pad（1）, it is located at aging copper billet（2）Side, elongated structure and itself and aging copper billet（2）It is parallel, heat conduction
Gasket（1）Side end face and aging copper billet（2）Corresponding side end face is in contact；
It is N number of heat sink（3）, N is the natural number more than or equal to 2, described heat sink（3）Interior be horizontally disposed with has jack（4）, the jack
（4）Internal diameter be more than laser（5）Outer diameter；
N number of laser（5）, respectively correspond be plugged in it is N number of heat sink（3）In, laser（5）Hard contact with it is heat sink（3）
It is in contact；
It is described N number of heat sink（3）Bottom and heat-conducting pad（1）Upper surface be in contact, it is N number of heat sink（3）With aging copper billet（2）No
Contact, adjacent two heat sink（3）Between pass through M gold thread（6）It is connected, it is N number of heat sink（3）After being serially connected, leftmost side end
It is heat sink（3）With conducting wire I（7）Be connected, rightmost side end it is heat sink（3）With conducting wire II（8）It is connected.
2. no pressure formula semiconductor laser ageing device according to claim 1, it is characterised in that：The heat-conducting pad
（1）It is made of magnetic material, it is N number of heat sink under magnetic action（3）Heat-conducting pad is fixed in absorption（1）Upper end.
3. no pressure formula semiconductor laser ageing device according to claim 1, it is characterised in that：The aging copper billet
（2）Thickness be 2-10mm.
4. no pressure formula semiconductor laser ageing device as claimed in any of claims 1 to 3, feature exist
In：The aging copper billet（2）With heat-conducting pad（1）It is cuboid structure.
5. no pressure formula semiconductor laser ageing device according to claim 4, it is characterised in that：The N is 12,12
It is a heat sink（3）Utilize gold thread（6）It is connected in series with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820370903.2U CN207994335U (en) | 2018-03-19 | 2018-03-19 | A kind of no pressure formula semiconductor laser ageing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820370903.2U CN207994335U (en) | 2018-03-19 | 2018-03-19 | A kind of no pressure formula semiconductor laser ageing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207994335U true CN207994335U (en) | 2018-10-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820370903.2U Active CN207994335U (en) | 2018-03-19 | 2018-03-19 | A kind of no pressure formula semiconductor laser ageing device |
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| CN (1) | CN207994335U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114389247A (en) * | 2022-01-17 | 2022-04-22 | 苏州联讯仪器有限公司 | Hot plug protection device, method, equipment and medium |
-
2018
- 2018-03-19 CN CN201820370903.2U patent/CN207994335U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114389247A (en) * | 2022-01-17 | 2022-04-22 | 苏州联讯仪器有限公司 | Hot plug protection device, method, equipment and medium |
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