CN211552108U - XRF temperature control device based on semiconductor - Google Patents
XRF temperature control device based on semiconductor Download PDFInfo
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- CN211552108U CN211552108U CN201921619196.7U CN201921619196U CN211552108U CN 211552108 U CN211552108 U CN 211552108U CN 201921619196 U CN201921619196 U CN 201921619196U CN 211552108 U CN211552108 U CN 211552108U
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- semiconductor refrigeration
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 87
- 238000005057 refrigeration Methods 0.000 claims abstract description 57
- 238000012544 monitoring process Methods 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 229910052802 copper Inorganic materials 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 239000011152 fibreglass Substances 0.000 claims 1
- 229910021389 graphene Inorganic materials 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 2
- 238000004781 supercooling Methods 0.000 abstract 1
- 238000004876 x-ray fluorescence Methods 0.000 description 41
- 230000001276 controlling effect Effects 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 9
- 238000011835 investigation Methods 0.000 description 9
- 238000004458 analytical method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- -1 graphite alkene Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000003900 soil pollution Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a XRF temperature control device based on semiconductor, the device includes the semiconductor refrigeration piece, the radiator, the fan, temperature monitoring and controlling means, the equipment inner shell inboard at parcel XRF equipment radiating area is installed to the semiconductor refrigeration piece, the A end and the XRF equipment radiating area of semiconductor refrigeration piece meet, the B end of semiconductor refrigeration piece exposes the equipment inner shell outside, the equipment inner shell outside of parcel XRF equipment radiating area is equipped with equipment shell, equipment shell's air outlet department installs the fan, install the radiator that is close to the fan between equipment shell and the equipment inner shell, and the radiator is connected with the B end of semiconductor refrigeration piece, the fan, the radiator, the semiconductor refrigeration piece all with temperature monitoring and controlling means electric connection. The utility model discloses combine temperature control device and quick check out test set (XRF), the environment of adaptable multiple transform just provides the protection for XRF, solves XRF in use and appears overheated or the supercooling problem and lead to the equipment to move slow as far as the card is dead and detect wrong problem.
Description
Technical Field
The utility model relates to a temperature regulating equipment technical field specifically is a XRF temperature control device based on semiconductor.
Background
In recent years, with the advent of the action plan for soil pollution control (abbreviated as "ten items of soil") in China, the treatment of polluted sites has risen to the national level. Pollution site management and investigation are also increasingly important, and for site investigation, rapid site investigation equipment plays a crucial role in site investigation. Quick place investigation equipment can help the quick pollutant level of distinguishing the place investigation of place investigator, and better setting is detected and investigation scheme, saves owner and place investigator's time and fund.
The rapid site investigation equipment has the advantages of simple structure, less interference and no external influence on detection. The range of analysis elements is wide. The requirements on the pretreatment of the sample are not high, and the analysis speed is high. The method is very wide in the application field of material analysis. And the equipment has different functions and can be selected according to the form of the sample. The test time is shorter than the typical destructive wet analysis time.
The current fast detection equipment (XRF) used in site survey is easy to overheat in use, which causes the condition that the equipment runs slowly and even is stuck. In addition, in a low-temperature environment, due to insufficient starting voltage of equipment caused by too low temperature, the equipment cannot be started, and the required value cannot be accurately detected due to too low temperature, so that site investigation and evaluation conclusion are directly influenced. Therefore, it is imperative to find a temperature control device that can rapidly control the temperature of an XRF device.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that an XRF temperature control device based on semiconductor is provided, the device can overcome among the prior art quick detection equipment (XRF) high generate heat and the unstable problem of operation under the low temperature environment in long-time use, improve equipment operation's stability and work efficiency.
The utility model discloses solve above-mentioned technical problem with following technical scheme:
the utility model relates to a XRF temperature control device based on semiconductor, including semiconductor refrigeration piece, radiator, fan, temperature monitoring and controlling means, the semiconductor refrigeration piece is equipped with A end and B end, the semiconductor refrigeration piece is installed at the equipment inner shell inboard of parcel XRF equipment radiating area, the A end and the XRF equipment radiating area of semiconductor refrigeration piece meet, the B end of semiconductor refrigeration piece exposes the equipment inner shell outside, the equipment inner shell outside of parcel XRF equipment radiating area is equipped with equipment shell, the fan is installed to equipment shell's air outlet department, install the radiator between equipment shell and the equipment inner shell, and the B end of radiator and semiconductor refrigeration piece is connected, and be close to the fan, the radiator, the semiconductor refrigeration piece all with temperature monitoring and controlling means electric connection, realize the temperature of automatic control XRF equipment.
Semiconductor refrigeration piece sets up two pairs to be located the radiating area of XRF equipment both sides respectively.
Semiconductor refrigeration piece's B end leads temperature copper sheet, microchannel flat tube or heat pipe, terminal lead the temperature copper sheet and be connected with the radiator through the front end, and the front end leads temperature copper sheet, microchannel flat tube or heat pipe, terminal lead temperature copper sheet and radiator and all set up at equipment shell inboardly, and microchannel flat tube or heat pipe set up several, and both ends are connected the front end respectively and are led temperature copper sheet and terminal lead the temperature copper sheet, and the front end is led the temperature copper sheet and is met with the B end of semiconductor refrigeration piece, and terminal lead the temperature copper sheet and meet with the radiator.
The utility model discloses binding face between A end and the XRF radiating area of semiconductor refrigeration piece, B end and the front end of semiconductor refrigeration piece lead temperature copper sheet or the binding face between the radiator all have heat conduction interface material.
The heat conduction interface material is liquid metal, heat conduction silicone grease or graphite alkene material, can improve heat conduction efficiency.
The inner shell of the equipment is made of glass fiber heat insulation material.
The utility model discloses XRF temperature control device based on semiconductor has following advantage:
1. the utility model discloses XRF temperature control device based on semiconductor need not frequently to wait for detector cooling and heating, can provide refrigeration and heat for XRF equipment, provides stable operating temperature for XRF equipment, makes XRF equipment be unlikely to because the high temperature or the low temperature that the during operation produced influence equipment behavior to improve XRF equipment's stability and work efficiency.
2. The utility model discloses utilize the semiconductor refrigeration piece to have the temperature control device that small, the noise is low, the vibration is little, the reliability is high, do not have the characteristics design of movable part to according to XRF equipment inner space structure's difference, can adopt multiple structural design, compact structure, lightly controllable, strong adaptability when realizing good radiating effect, reaches energy-conserving and efficient purpose.
Drawings
Fig. 1 is a schematic structural diagram of an XRF temperature control device based on a semiconductor according to embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of an XRF temperature control device based on a semiconductor according to embodiment 2 of the present invention;
fig. 3 is an operation flowchart of the semiconductor-based XRF temperature control device of the present invention.
In the figure: the method comprises the following steps of 1-end A of a semiconductor refrigeration piece, 2-end B of the semiconductor refrigeration piece, 3-front-end temperature conduction copper piece, 4-micro-channel flat tube or heat pipe, 5-tail-end temperature conduction copper piece, 6-radiator, 7-fan, 8-equipment inner shell, 9-equipment outer shell, 10-XRF equipment and 11-temperature monitoring and controlling device.
Detailed Description
The technical solution of the present invention is further explained with reference to the accompanying drawings and embodiments. The examples are intended to be illustrative of the present invention and are not intended to limit the scope of the present invention.
Example 1
As shown in fig. 1, the utility model discloses XRF temperature control device based on semiconductor, including semiconductor refrigeration piece, radiator 6, fan 7, temperature monitoring and controlling means 11, the semiconductor refrigeration piece is prior art, and it is including semiconductor refrigeration piece A end 1 and semiconductor refrigeration piece B end 2, and A end and B end are also called cold junction and hot junction. The semiconductor refrigeration piece is arranged on the inner side of an equipment inner shell 8 used for wrapping the heat dissipation area of an XRF device (rapid detector) 10, the A end 1 of the semiconductor refrigeration piece is connected with the heat dissipation area of the XRF device 10, the B end of the semiconductor refrigeration piece is exposed out of the outer side of the equipment inner shell 8, the outer side of the equipment inner shell 8 wrapping the heat dissipation area of the XRF device 10 is provided with an equipment outer shell 9, the equipment outer shell 9 is provided with an air outlet, the air outlet is provided with a fan 7, the B end 2 of the semiconductor refrigeration piece is connected with a radiator 6 through a front end temperature conduction copper sheet 3, a micro channel flat tube or heat pipe 4 and a tail end temperature conduction copper sheet 5, the front end temperature conduction copper sheet 3, the micro channel flat tube or heat pipe 4, the tail end temperature conduction copper sheet 5 and the radiator 6 are all arranged on the inner side of the equipment outer shell 9, the micro channel flat tube or heat pipe 4 can be arranged in parallel, the two ends are, the tail end heat conduction copper sheet 5 is connected with the radiator 6 to realize heat conduction; the radiator 6 is arranged on a fan 7 close to the air outlet, and the fan 7 can guide the heat of the radiator out of the interior of the equipment shell 9 to the environment; the fan 7, the radiator 6 and the semiconductor refrigerating sheet are electrically connected with the temperature monitoring and controlling device 11, and the temperature of the XRF equipment 10 is automatically controlled.
The utility model discloses XRF temperature control device's application method based on semiconductor is as follows:
referring to fig. 3, whether the end a 1 of the semiconductor refrigeration piece and the end B2 of the semiconductor refrigeration piece are correctly assembled is checked, whether dust is accumulated in an air pipeline is checked, whether a fan 7 runs is checked, whether a power supply is sufficient is checked, a temperature control device is installed on an XRF device and fixed, and whether the temperature control device is stable is checked by slight shaking; the power supply is then activated. When the temperature monitoring and control device 11 monitors that the temperature is too high, the semiconductor refrigerating sheet and the fan 7 are started to work, which is beneficial to quickly guiding out the heat of the equipment. When the temperature monitoring and controlling device 11 monitors that the temperature is at the normal temperature of the equipment, the semiconductor refrigerating sheet and the fan 7 are suspended, which is beneficial to reducing the energy consumption of the equipment. When the temperature monitoring and control device 11 detects that the temperature is too low, the current of the semiconductor chilling plate is reversely started and the fan 7 is started, so that the heat exchange of the equipment is facilitated.
Example 2
As shown in fig. 2, the utility model discloses XRF temperature control device based on semiconductor includes semiconductor refrigeration piece, radiator 6, fan 7, temperature monitoring and controlling means 11, the semiconductor refrigeration piece is prior art, and it is including semiconductor refrigeration piece A end 1 and semiconductor refrigeration piece B end 2, and A end and B end are also called cold junction and hot junction. The semiconductor refrigeration piece is arranged on the inner side of an equipment inner shell 8 used for wrapping a heat dissipation area of an XRF (X-ray fluorescence) equipment 10, an A end 1 of the semiconductor refrigeration piece is connected with the heat dissipation area of the XRF equipment 10, a B end of the semiconductor refrigeration piece is exposed out of the outer side of the equipment inner shell 8, an equipment outer shell 9 is arranged on the outer side of the equipment inner shell 8 wrapping the heat dissipation area of the XRF equipment 10, an air outlet is formed in the equipment outer shell 9, a fan 7 is arranged at the air outlet, a radiator 6 is arranged between the equipment outer shell 9 and the equipment inner shell 8, the radiator 6 is connected with the B end of the semiconductor refrigeration piece and is close to the fan 7; the fan 7, the radiator 6 and the semiconductor refrigerating sheet are electrically connected with the temperature monitoring and controlling device 11, and the temperature of the XRF equipment 10 is automatically controlled.
The utility model discloses XRF temperature control device's theory of operation based on semiconductor is: the heat of the XRF device 10 body is transferred to the copper radiator 6 from the end A of the semiconductor refrigeration piece and the end B of the semiconductor refrigeration piece, the fins of the copper radiator 6 are cooled by the fan 7, and the current of the semiconductor refrigeration piece, the current direction of the semiconductor refrigeration piece and the rotating speed of the fan are adjusted in real time by the temperature monitoring and controlling device 11. In a high-temperature environment, the semiconductor refrigeration can transfer the temperature from the cold end to the hot end, and then the heat is exchanged to the radiator 6 through the micro-channel flat tube or the heat tube 4, so that the heat dissipation of the equipment is completed. The semiconductor can generate heat and absorb heat at the cold end to transfer to the hot end in a low-temperature environment, and then the heat is absorbed from the environment through the temperature-conducting equipment, so that the heat production work of the equipment is completed.
Preferably, the semiconductor refrigeration piece can set up two pairs to be located the heat dissipation area of XRF equipment 10 both sides respectively.
Preferably, the utility model discloses binding face between A end and the XRF radiating area of semiconductor refrigeration piece, the B end of semiconductor refrigeration piece and the binding face between front end lead temperature copper sheet or the radiator all have heat conduction interface material to improve heat conduction efficiency.
Preferably, heat conduction interface material is liquid metal, heat conduction silicone grease or graphite alkene material, can improve heat conduction efficiency.
Preferably, the inner shell of the device of the present invention is made of a heat insulating material made of glass fiber to reduce heat conduction efficiency.
Preferably, the microchannel flat tube or heat pipe 4 is a pure copper pipe and conducts heat by using 3 parallel channels.
Preferably, all air outlets and air inlets connected with the environment are provided with air filter screens so as to reduce the influence of dust in the air on temperature control.
Preferably, the fan 7 should be a heat dissipation fan with 12V voltage of 8 inches according to the size of the device.
The parameters of the semiconductor chilling plates used in the two embodiments are as follows: TEC1-12712 Imax 12A; umax 15.4V; qcmax 114.5W; tmax 65C; dimensions 50 x 3.8; the maximum current is 12 amperes; maximum voltage 15.4 volts; the maximum cold production capacity is 114.5 watts; the maximum temperature difference is 65 ℃; external dimension 50 x 3.8.
Although, the above embodiment has been right the XRF temperature control device and the method of using the same in the present invention are specifically described and analyzed in detail, but the present invention can still make modification and refinement on the basis, which is not a difficult task for the technical personnel in the industry, therefore, the modification or refinement made on the basis of the core composition of the present invention is not deviated, and the present invention is all within the scope of the protection.
Claims (6)
1. The utility model provides a XRF temperature control device based on semiconductor, a serial communication port, including semiconductor refrigeration piece, radiator, fan, temperature monitoring and controlling means, semiconductor refrigeration piece is equipped with A end and B end, the semiconductor refrigeration piece is installed at parcel XRF equipment radiating area's equipment inner shell inboard, the A end and the XRF equipment radiating area of semiconductor refrigeration piece meet, the B end of semiconductor refrigeration piece exposes the equipment inner shell outside, the equipment inner shell outside of parcel XRF equipment radiating area is equipped with equipment shell, the fan is installed to equipment shell's air outlet department, install the radiator between equipment shell and the equipment inner shell, and the B end of radiator and semiconductor refrigeration piece is connected, and be close to the fan, the radiator, the semiconductor refrigeration piece all with temperature monitoring and controlling means electric connection, realize the temperature of automatic control XRF equipment.
2. The semiconductor-based XRF temperature control device of claim 1 wherein two pairs of semiconductor cooling fins are provided and located in the heat sink area on each side of the XRF device.
3. The semiconductor-based XRF temperature control device according to claim 1 or 2 wherein the B end of the semiconductor refrigeration chip is connected to the heat sink via a front end temperature conducting copper sheet, a micro-channel flat tube or heat pipe, and a tail end temperature conducting copper sheet, wherein the front end temperature conducting copper sheet, the micro-channel flat tube or heat pipe, the tail end temperature conducting copper sheet and the heat sink are all arranged inside the equipment housing, the number of the micro-channel flat tubes or heat pipes is several, the two ends of the micro-channel flat tubes or heat pipes are respectively connected to the front end temperature conducting copper sheet and the tail end temperature conducting copper sheet, the front end temperature conducting copper sheet is connected to the B end of the semiconductor refrigeration chip, and the tail end temperature conducting copper.
4. The semiconductor-based XRF temperature control device of claim 1, wherein the mating surfaces of the semiconductor cooling fin between the end a and the XRF heat sink, the mating surfaces of the semiconductor cooling fin between the end B and the front thermally conductive copper plate or heat sink are thermally conductive interface materials.
5. The semiconductor-based XRF temperature control device as claimed in claim 4 wherein said thermally conductive interface material is a liquid metal, thermally conductive silicone grease or graphene material to improve thermal conductivity.
6. The semiconductor-based XRF temperature control device of claim 1, wherein the inner enclosure is fabricated from fiberglass insulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921619196.7U CN211552108U (en) | 2019-09-26 | 2019-09-26 | XRF temperature control device based on semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921619196.7U CN211552108U (en) | 2019-09-26 | 2019-09-26 | XRF temperature control device based on semiconductor |
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| Publication Number | Publication Date |
|---|---|
| CN211552108U true CN211552108U (en) | 2020-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921619196.7U Active CN211552108U (en) | 2019-09-26 | 2019-09-26 | XRF temperature control device based on semiconductor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110701824A (en) * | 2019-09-26 | 2020-01-17 | 广西博世科环保科技股份有限公司 | XRF temperature control device based on semiconductor |
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2019
- 2019-09-26 CN CN201921619196.7U patent/CN211552108U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110701824A (en) * | 2019-09-26 | 2020-01-17 | 广西博世科环保科技股份有限公司 | XRF temperature control device based on semiconductor |
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| GR01 | Patent grant | ||
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| CP03 | Change of name, title or address |
Address after: Intersection of Dongcheng Avenue and Dongcheng Road in Heli Park, Ningguo Economic and Technological Development Zone, Ningguo City, Xuancheng City, Anhui Province Patentee after: Anhui Boshike Environmental Protection Technology Co.,Ltd. Country or region after: China Address before: 530007 12 Kexing Road, hi tech Zone, Nanning, the Guangxi Zhuang Autonomous Region Patentee before: GUANGXI BOSSCO ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. Country or region before: China |
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| TR01 | Transfer of patent right |
Effective date of registration: 20240426 Address after: 530000 No. 101, Gao'an Road, high tech Zone, Nanning, Guangxi Zhuang Autonomous Region Patentee after: Guangxi Boshike Environmental Technology Co.,Ltd. Country or region after: China Address before: Intersection of Dongcheng Avenue and Dongcheng Road in Heli Park, Ningguo Economic and Technological Development Zone, Ningguo City, Xuancheng City, Anhui Province Patentee before: Anhui Boshike Environmental Protection Technology Co.,Ltd. Country or region before: China |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240506 Address after: 530000 No. 101, Gao'an Road, high tech Zone, Nanning, Guangxi Zhuang Autonomous Region Patentee after: Guangxi Boshike Environmental Technology Co.,Ltd. Country or region after: China Patentee after: Anhui Boshike Environmental Protection Technology Co.,Ltd. Address before: 530000 No. 101, Gao'an Road, high tech Zone, Nanning, Guangxi Zhuang Autonomous Region Patentee before: Guangxi Boshike Environmental Technology Co.,Ltd. Country or region before: China |
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| TR01 | Transfer of patent right |