CN203466184U - Liquid cooling insulation type radiator - Google Patents
Liquid cooling insulation type radiator Download PDFInfo
- Publication number
- CN203466184U CN203466184U CN201320580752.0U CN201320580752U CN203466184U CN 203466184 U CN203466184 U CN 203466184U CN 201320580752 U CN201320580752 U CN 201320580752U CN 203466184 U CN203466184 U CN 203466184U
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- liquid cooling
- insulation
- substrate
- heat
- cooling tube
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Abstract
Disclosed in the utility model is a liquid cooling insulation type radiator. The radiator comprises a conducting substrate; and substrate through holes are arranged inside the conducting substrate, wherein the extending directions of the substrate through holes are consistent with that of the conducting substrate. A liquid cooling tube passes through the substrate through holes; and thermally conductive and insulating materials are arranged between the walls of the substrate through holes and the liquid cooling tube, so that heat conduction and mutual insulation between the conducting substrate and the liquid cooling tube can be realized. Furthermore, the radiator is also provided with an insulated monitor for detecting the insulation performance of the thermally conductive and insulating materials. With the liquid cooling insulation type radiator, the heat generated by a power semiconductor device is transmitted to the liquid cooling tube by the conducting substrate and the thermally conductive and insulating materials and then is taken away by the medium flowing inside the liquid cooling tube, thereby achieving an objective of cooling of the power semiconductor device. Meanwhile, requirements of heat dissipation, insulation and small size can be met simultaneously, so that the high-voltage electrical transmitting device can meet some requirements by the special environment.
Description
Technical field
The utility model relates to heat sink technology field, relates in particular to a kind of liquid cooling insulation radiator.
Background technology
At present, mesohigh electric actuator is owing to being subject to the restriction of power semiconductor device self insulation level, and the power semiconductor device in use generally all insulate with shell or the grounded part of electric actuator.To power semiconductor device, generally adopt two kinds of types of cooling to carry out cooling now: a kind of is power semiconductor device and radiator and the insulation of other parts, adopts directly air-cooled mode; Another kind is power semiconductor device and radiator deionized water circulating cooling.But any mode all makes the cooling system of high-voltage electrical apparatus transmission device huger and complicated, limited the scope of application of high-voltage electrical apparatus transmission device.
Summary of the invention
Technical problem to be solved in the utility model is: a kind of liquid cooling insulation radiator is provided, can meets the requirement that heat radiation, insulation and volume are little simultaneously, make high-voltage electrical apparatus transmission device can meet the requirement of some particular surroundingss.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of liquid cooling insulation radiator, comprise: heat-conducting substrate, the inside of described heat-conducting substrate is provided with substrate through-hole, and the bearing of trend of described substrate through-hole is consistent with the bearing of trend of described heat-conducting substrate; Liquid cooling tube, described liquid cooling tube is through described substrate through-hole, and described liquid cooling tube has liquid feeding end and outlet end; And heat-conducting insulation material, described heat-conducting insulation material is arranged between the hole wall and described liquid cooling tube of described substrate through-hole, makes described heat-conducting substrate and described liquid cooling tube mutually insulated.
Preferably, described liquid cooling tube is U-shaped pipe; Described substrate through-hole relative set is two.
Preferably, described liquid cooling tube is for to connect by a plurality of U-shaped pipe strings the coil pipe forming; Described substrate through-hole is correspondingly provided with a plurality of.
Preferably, described liquid cooling insulation radiator also comprises the insulation monitoring device for detection of the insulation property of described heat-conducting insulation material.
Preferably, described insulation monitoring device comprises current sensor, and the electric current that described current sensor flows through described liquid cooling tube by detection is realized the supervision to the insulation property of described heat-conducting insulation material.
Preferably, described insulation monitoring device is electrically connected to described liquid cooling tube, described heat-conducting substrate respectively, by the voltage detecting between described heat-conducting substrate and described liquid cooling tube, realizes the supervision to the insulation property of described heat-conducting insulation material.
Preferably, described heat-conducting insulation material comprises the heat conductive silica gel that is added with boron nitride powder; Described heat-conducting substrate comprises aluminium sheet or copper coin; Described liquid cooling tube comprises aluminum pipe or copper pipe.
Owing to having adopted technique scheme, liquid cooling insulation radiator of the present utility model comprises: heat-conducting substrate, in the inside of heat-conducting substrate, be provided with the substrate through-hole consistent with its bearing of trend, liquid cooling tube is through substrate through-hole, between the hole wall of substrate through-hole and liquid cooling tube, be provided with heat-conducting insulation material, make heat-conducting substrate and liquid cooling tube mutually insulated.Liquid cooling insulation radiator heat-dissipation process of the present utility model is: power semiconductor and heat-conducting substrate laminating, the heat that power semiconductor produces is delivered to liquid cooling tube through heat-conducting substrate, heat-conducting insulation material, medium by liquid cooling tube internal flow is taken away heat, realizes the object to power semiconductor cooling.Due to the bearing of trend of substrate through-hole and the bearing of trend of heat-conducting substrate consistent, in the situation that heat-conducting substrate size is certain, large through the area of dissipation of the liquid cooling tube of substrate through-hole, improved the radiating effect of radiator.The heat-conducting insulation material arranging between substrate through-hole and liquid cooling tube, has reached and has made can to conduct heat between heat-conducting substrate and liquid cooling tube and the object of mutually insulated.
Because liquid cooling insulation radiator of the present utility model is also further provided with insulation monitoring device, can detect by two kinds of modes the insulation property of heat-conducting insulation material.Mode: insulation monitoring device comprises a current sensor, current sensor detects the electric current flow through liquid cooling tube and realizes the supervision to heat-conducting insulation material insulation property, and electric current is less, shows that the insulation property of heat-conducting insulation material are higher.Another kind of mode: insulation monitoring device is electrically connected to liquid cooling tube, heat-conducting substrate respectively, by the voltage detecting between heat-conducting substrate and liquid cooling tube, realize the supervision to heat-conducting insulation material insulation property, voltage is higher, shows that the insulation property of heat-conducting insulation material are higher.
To sum up, liquid cooling insulation radiator of the present utility model can meet the requirement that heat radiation, insulation and volume are little simultaneously, makes high-voltage electrical apparatus transmission device can meet the requirement of some particular surroundingss.
Accompanying drawing explanation
Fig. 1 is the structure cross-sectional schematic of the utility model embodiment mono-;
Fig. 2 is the structure cross-sectional schematic of the utility model embodiment bis-;
In figure: 1-liquid cooling tube; 2-heat-conducting substrate; 3-heat-conducting insulation material; 4-insulation monitoring device.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further non-limitingly described.
Embodiment mono-
As shown in Figure 1, the liquid cooling insulation radiator of the present embodiment, comprising: heat-conducting substrate 2, in the inside of heat-conducting substrate 2, be provided with substrate through-hole, and wherein, the bearing of trend of substrate through-hole is consistent with the bearing of trend of heat-conducting substrate 2; Liquid cooling tube 1, liquid cooling tube 1 is through substrate through-hole, and liquid cooling tube 1 has liquid feeding end and outlet end; Between the hole wall of substrate through-hole and liquid cooling tube 1, be equipped with heat-conducting insulation material 3, the setting of heat-conducting insulation material 3 makes can conduct heat between heat-conducting substrate 2 and liquid cooling tube 1 and can mutually insulated.
In the present embodiment, liquid cooling tube 1 is set to U-shaped pipe; Its liquid feeding end and outlet end are all positioned at the same side of heat-conducting substrate 2; Substrate through-hole is correspondingly set to two.
Wherein, the liquid cooling insulation radiator of the present embodiment also comprises the insulation monitoring device 4 for detection of the insulation property of heat-conducting insulation material 3.Can detect by following two kinds of modes the insulation property of heat-conducting insulation material 3.A kind of mode: be provided with current sensor in insulation monitoring device 4, current sensor detects the electric current that flows through liquid cooling tube 1, thereby realize the supervision to heat-conducting insulation material insulation property, the electric current detecting is less, shows that the insulation property of heat-conducting insulation material 3 are higher.Another kind of mode: insulation monitoring device 4 is electrically connected to liquid cooling tube 1, heat-conducting substrate 2 respectively, by the voltage detecting between heat-conducting substrate 2 and liquid cooling tube 1, realize the supervision to heat-conducting insulation material insulation property, voltage is higher, shows that the insulation property of heat-conducting insulation material 3 are higher.
In the present embodiment, above-mentioned heat-conducting insulation material 3 can adopt the heat conductive silica gel that is added with boron nitride powder; Heat-conducting substrate 2 can adopt aluminium sheet or copper coin; Liquid cooling tube 1 can adopt aluminum pipe or copper pipe; The medium of liquid cooling tube 1 internal flow can be water.
Embodiment bis-
As shown in Figure 1, embodiment bis-and embodiment mono-are basic identical, and difference is: liquid cooling tube 1 is to connect by a plurality of U-shaped pipe strings the coil arrangement forming; Substrate through-hole is correspondingly provided with a plurality of.The liquid cooling tube of coil arrangement has strengthened heat transfer area, can further improve the radiating effect of radiator.
In sum, use liquid cooling insulation radiator of the present utility model, the heat that power semiconductor produces is delivered to liquid cooling tube through heat-conducting substrate, heat-conducting insulation material, medium by liquid cooling tube internal flow is taken away heat, realized the object to power semiconductor cooling, can meet the requirement that heat radiation, insulation and volume are little simultaneously, make high-voltage electrical apparatus transmission device can meet the requirement of some particular surroundingss.
The above is only giving an example of the utility model preferred embodiments, and the part of wherein not addressing is in detail those of ordinary skills' common practise.Protection range of the present utility model is as the criterion with the content of claim, and any equivalent transformation carrying out based on technology enlightenment of the present utility model, also within protection range of the present utility model.
Claims (6)
1. a liquid cooling insulation radiator, is characterized in that, comprising:
Heat-conducting substrate, the inside of described heat-conducting substrate is provided with substrate through-hole, and the bearing of trend of described substrate through-hole is consistent with the bearing of trend of described heat-conducting substrate;
Liquid cooling tube, described liquid cooling tube is through described substrate through-hole, and described liquid cooling tube has liquid feeding end and outlet end; And
Heat-conducting insulation material, described heat-conducting insulation material is arranged between the hole wall and described liquid cooling tube of described substrate through-hole, makes described heat-conducting substrate and described liquid cooling tube mutually insulated.
2. liquid cooling insulation radiator as claimed in claim 1, is characterized in that: described liquid cooling tube is U-shaped pipe; Described substrate through-hole relative set is two.
3. liquid cooling insulation radiator as claimed in claim 2, is characterized in that: described liquid cooling tube is for to connect by a plurality of U-shaped pipe strings the coil pipe forming; Described substrate through-hole is correspondingly provided with a plurality of.
4. the liquid cooling insulation radiator as described in claims 1 to 3 any one, is characterized in that: described liquid cooling insulation radiator also comprises the insulation monitoring device for detection of the insulation property of described heat-conducting insulation material.
5. liquid cooling insulation radiator as claimed in claim 4, it is characterized in that: described insulation monitoring device comprises current sensor, the electric current that described current sensor flows through described liquid cooling tube by detection is realized the supervision to the insulation property of described heat-conducting insulation material.
6. liquid cooling insulation radiator as claimed in claim 4, it is characterized in that: described insulation monitoring device is electrically connected to described liquid cooling tube, described heat-conducting substrate respectively, by the voltage detecting between described heat-conducting substrate and described liquid cooling tube, realize the supervision to the insulation property of described heat-conducting insulation material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320580752.0U CN203466184U (en) | 2013-09-18 | 2013-09-18 | Liquid cooling insulation type radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320580752.0U CN203466184U (en) | 2013-09-18 | 2013-09-18 | Liquid cooling insulation type radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203466184U true CN203466184U (en) | 2014-03-05 |
Family
ID=50178529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320580752.0U Withdrawn - After Issue CN203466184U (en) | 2013-09-18 | 2013-09-18 | Liquid cooling insulation type radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203466184U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103500734A (en) * | 2013-09-18 | 2014-01-08 | 张永亮 | Liquid cooling insulation type radiator |
-
2013
- 2013-09-18 CN CN201320580752.0U patent/CN203466184U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103500734A (en) * | 2013-09-18 | 2014-01-08 | 张永亮 | Liquid cooling insulation type radiator |
| CN103500734B (en) * | 2013-09-18 | 2016-06-08 | 张永亮 | A kind of liquid cold insulation formula radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140305 Effective date of abandoning: 20160608 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20140305 Effective date of abandoning: 20160608 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |