CN211959918U - Combined heat dissipation structure based on heat conduction paste - Google Patents
Combined heat dissipation structure based on heat conduction paste Download PDFInfo
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- CN211959918U CN211959918U CN202020959300.3U CN202020959300U CN211959918U CN 211959918 U CN211959918 U CN 211959918U CN 202020959300 U CN202020959300 U CN 202020959300U CN 211959918 U CN211959918 U CN 211959918U
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- heat dissipation
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Abstract
The utility model discloses a combined heat dissipation structure based on heat conduction paste, which comprises a heat absorption bin, a heat dissipation tube arranged in the heat absorption bin, a heat dissipation bin connected with the heat dissipation tube and a liquid circulation pump arranged on the heat dissipation tube; the radiating pipe is hermetically connected with the radiating bin through a liquid guide pipe; and a liquid replacing port for replacing liquid is arranged on the heat dissipation bin.
Description
Technical Field
The utility model relates to an electrical apparatus original paper heat dissipation technical field especially relates to a combination formula heat radiation structure based on heat conduction cream.
Background
Along with the more and more extensive use of electrical lifting appliances of people's living standard, the intelligent furniture also appears to ordinary families along with the improvement of science and technology, the intelligent electrical appliances must use electronic elements such as electronic chips, and the electronic chips are mounted on computers, intelligent televisions, air conditioners and the like which are commonly used by people, and the electronic chips can normally operate only by timely heat dissipation in the using process; the common heat dissipation device is a fan for heat dissipation, a large amount of dust can be gathered at a heat dissipation port by the fan in the heat dissipation process to seriously affect the heat dissipation effect, and in the serious process, because the heat dissipation is insufficient, the electronic components are damaged to influence the normal use of the electric appliance.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to solve the technical problem of providing a combination formula heat radiation structure based on heat conduction cream to solve the above-mentioned problem.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a pair of combination formula heat radiation structure based on heat conduction cream, its characterized in that: comprises a heat absorption bin, a heat dissipation pipe arranged in the heat absorption bin, a heat dissipation bin connected with the heat dissipation pipe and a liquid circulating pump arranged on the heat dissipation pipe; the radiating pipe is hermetically connected with the radiating bin through a liquid guide pipe; and a liquid replacing port for replacing liquid is arranged on the heat dissipation bin.
Furthermore, the heat absorption bin is made of a sealing structure made of a material with good heat conductivity, a heat conduction solution with good heat absorption is filled inside the heat absorption bin, and heat conduction paste is coated outside the heat conduction bin to be attached to an electric element.
Further, the radiating pipe is a copper pipe.
Furthermore, the heat dissipation bin is of a sealing structure, and the interior of the heat dissipation bin is filled with liquid with good heat absorption performance.
Furthermore, a thermistor for controlling temperature is arranged in the heat absorption bin; the thermistor is electrically connected with the liquid circulating pump.
Further, a thermometer for displaying temperature is arranged on the heat dissipation bin.
The utility model has the advantages that:
a combined heat dissipation structure based on heat conduction paste conducts heat by utilizing the heat conduction paste, can rapidly conduct heat to a heat dissipation pipe, is provided with a water circulation pump on the heat dissipation pipe, and is connected with a heat dissipation bin by a liquid guide pipe to promote circulation between liquid in the heat dissipation bin and liquid in the heat dissipation pipe, so that the heat dissipation efficiency is accelerated; the cooling is carried out by utilizing the liquid circulation heat absorption, so that the heat dissipation of a fan is changed, the cooling efficiency is higher, and the original parts of the electric appliance cannot be burnt due to the fact that dust blocks a heat dissipation port; the liquid changing port is arranged on the heat dissipation bin, so that liquid can be changed when the temperature is too high, rapid cooling can be realized, and liquid can be supplemented when the liquid is insufficient.
Drawings
Fig. 1 is a schematic view of the overall structure of a combined heat dissipation structure based on thermal conductive paste of the present invention;
fig. 2 is a schematic view of a separation structure of a combined heat dissipation structure based on heat conductive paste.
Reference numbers in the figures:
1. a heat absorption bin; 11. a thermistor; 2. a radiating pipe; 21. a catheter; 3. a heat dissipation bin; 4. a liquid circulation pump; 31. a liquid changing port; 32. a thermometer.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
As shown in fig. 1 to fig. 2, the combined heat dissipation structure based on thermal conductive paste provided in this embodiment includes a heat absorption bin 1, a heat dissipation pipe 2 disposed inside the heat absorption bin 1, a heat dissipation bin 3 connected to the heat dissipation pipe 2, and a liquid circulation pump 4 disposed on the heat dissipation pipe 2; the radiating pipe 2 is hermetically connected with the radiating bin 3 through a liquid guide pipe 21; the heat dissipation chamber 3 is provided with a liquid replacement port 31 for replacing liquid.
Further, the heat absorption bin 1 is made of a sealing structure made of a material with good heat conductivity, a heat conduction solution with good heat absorption is filled inside the heat absorption bin, and heat conduction paste is coated outside the heat conduction bin to be attached to an electric element.
Further, the heat dissipation pipe 2 is a copper pipe.
Further, the heat dissipation bin 3 is a sealing structure, and the interior of the heat dissipation bin is filled with liquid with good heat absorption performance.
Further, a thermistor 11 for controlling temperature is arranged in the heat absorption bin 1; the thermistor 11 is electrically connected to the liquid circulation pump 4.
Further, a thermometer 32 for displaying temperature is disposed on the heat dissipation chamber 3.
The working principle is as follows:
a combined heat-dissipating structure based on heat conduction cream is characterized in that the heat conduction cream is coated outside a heat-absorbing bin 1 and is attached to an electronic chip of an electric appliance, a solution with good conductivity is filled in the heat-absorbing bin 1, the heat-absorbing bin 1 is hermetically connected with a heat-dissipating bin 3 through a liquid guide tube 21, and a liquid circulating pump 4 arranged on a heat-dissipating tube 2 is used for exchanging liquid in the heat-dissipating tube 2 with liquid in the heat-dissipating bin 3 so as to absorb heat generated by the electronic chip of the electric appliance; when the temperature rises to a certain degree, the liquid in the heat dissipation bin 3 can be replaced through the liquid replacement port 31 arranged on the heat dissipation bin 3 to realize rapid temperature reduction.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The present invention is not to be limited by the specific embodiments disclosed herein, and other embodiments that fall within the scope of the claims of the present application are intended to be within the scope of the present invention.
Claims (6)
1. The utility model provides a combination formula heat radiation structure based on heat conduction cream which characterized in that: comprises a heat absorption bin (1), a heat dissipation pipe (2) arranged in the heat absorption bin (1), a heat dissipation bin (3) connected with the heat dissipation pipe (2) and a liquid circulation pump (4) arranged on the heat dissipation pipe (2); the radiating pipe (2) is hermetically connected with the radiating bin (3) through a liquid guide pipe (21); the heat dissipation bin (3) is provided with a liquid replacing port (31) for replacing liquid.
2. The combined heat dissipation structure based on thermal paste of claim 1, wherein: the heat absorption bin (1) is made of a sealing structure made of a material with good heat conductivity, a heat conduction solution with good heat absorption is filled inside the heat absorption bin, and heat conduction paste is coated outside the heat absorption bin to be attached to an electric element.
3. The combined heat dissipation structure based on thermal paste of claim 1, wherein: the radiating pipe (2) is a copper pipe.
4. The combined heat dissipation structure based on thermal paste of claim 1, wherein: the heat dissipation bin (3) is of a sealing structure, and the interior of the heat dissipation bin is filled with liquid with good heat absorption.
5. The combined heat dissipation structure based on thermal paste of claim 1, wherein: a thermistor (11) for controlling temperature is arranged in the heat absorption bin (1); the thermistor (11) is electrically connected with the liquid circulating pump (4).
6. The combined heat dissipation structure based on thermal paste of claim 1, wherein: a thermometer (32) for displaying temperature is arranged on the heat dissipation bin (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020959300.3U CN211959918U (en) | 2020-05-29 | 2020-05-29 | Combined heat dissipation structure based on heat conduction paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020959300.3U CN211959918U (en) | 2020-05-29 | 2020-05-29 | Combined heat dissipation structure based on heat conduction paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211959918U true CN211959918U (en) | 2020-11-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020959300.3U Active CN211959918U (en) | 2020-05-29 | 2020-05-29 | Combined heat dissipation structure based on heat conduction paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211959918U (en) |
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2020
- 2020-05-29 CN CN202020959300.3U patent/CN211959918U/en active Active
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