CN221006598U - Simulated heat load temperature testing device - Google Patents
Simulated heat load temperature testing device Download PDFInfo
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- CN221006598U CN221006598U CN202322628269.1U CN202322628269U CN221006598U CN 221006598 U CN221006598 U CN 221006598U CN 202322628269 U CN202322628269 U CN 202322628269U CN 221006598 U CN221006598 U CN 221006598U
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- heat conducting
- conducting plate
- testing device
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- 238000012360 testing method Methods 0.000 title claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims 1
- 238000012546 transfer Methods 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000005485 electric heating Methods 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009414 blockwork Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The utility model relates to the technical field of temperature testing devices, in particular to a simulated heat load temperature testing device. The simulated heat load temperature testing device comprises: the temperature measuring assembly comprises a heating block, an insulating cushion block, a heat conducting plate and a temperature measuring element; the insulating cushion block and the heat conducting plate are respectively arranged at two sides of the heating block, and the temperature measuring element is buried in the heat conducting plate. The temperature measuring element (such as a thermocouple) is buried in the heat transfer plate and is prevented from being arranged on the to-be-measured piece, so that the wall surface of the to-be-measured piece is prevented from being damaged, the temperature field and the heat exchange state between the heating block and the to-be-measured piece are prevented from being damaged, the temperature measuring element is buried in the heat conducting plate and is protected from being damaged, and the accuracy of the test is improved.
Description
Technical Field
The utility model relates to the technical field of temperature testing devices, in particular to a simulated heat load temperature testing device.
Background
The IGBT (IGBT power module based on PCB connection) can generate a large amount of heat in the working process, and if the heat cannot be timely transferred out, the IGBT can fail and break down due to the fact that the IGBT works at a high temperature for a long time. Therefore, a radiator is usually required to be installed on the IGBT, so that heat generated by the IGBT is guaranteed to be timely dissipated, and the temperature of the IGBT is stabilized within the range of design requirements.
In the IGBT simulated heat load test process, a thermocouple is usually inserted between a simulated heat source and an IGBT heat dissipation plate, so that a gap is generated between the simulated heat source and the IGBT heat dissipation plate, a wall surface temperature field is damaged, and the accuracy of a measurement result is low.
Disclosure of utility model
The utility model aims to provide a simulated heat load temperature testing device so as to solve the technical problem of low accuracy of a measurement result in the prior art to a certain extent.
The utility model provides a simulated heat load temperature testing device, which comprises: the temperature measuring assembly comprises a heating block, an insulating cushion block, a heat conducting plate and a temperature measuring element; the insulating cushion block and the heat conducting plate are respectively arranged at two sides of the heating block, and the temperature measuring element is buried in the heat conducting plate.
When the simulated heat load temperature testing device provided by the utility model is used, one side of the heat conducting plate far away from the heating block is contacted with the wall surface of a piece to be tested (such as a heat radiating plate), and the heating block works to simulate heat load (such as heating of a circuit board); the insulating cushion block is arranged on one side of the heating block far away from the heat conducting plate, so that the heating block can be protected, and heat can be prevented from being transferred to the side, so that the heat is transferred to the to-be-tested piece through the heat conducting plate; the temperature measuring element (such as a thermocouple) is buried in the heat transfer plate and is prevented from being arranged on the to-be-measured piece, so that the wall surface of the to-be-measured piece is prevented from being damaged, the temperature field and the heat exchange state between the heating block and the to-be-measured piece are prevented from being damaged, the temperature measuring element is buried in the heat conducting plate and is protected from being damaged, and the accuracy of the test is improved.
Further, a mounting hole is formed in the heat conducting plate, and the temperature measuring element is inserted into the mounting hole.
Further, in the thickness direction of the heat conductive plate, the heating block is provided at one side of the heat conductive plate; the mounting hole is provided on one side wall of the heat conductive plate in the width direction of the heat conductive plate.
Further, in the thickness direction of the heat conductive plate, a distance from the center of the mounting hole to an edge of the heat conductive plate, which is close to the heating block, is greater than a distance from the center of the mounting hole to an edge of the heat conductive plate, which is far away from the heating block.
Further, a heat conducting glue filling layer is arranged between the heating block and the heat conducting plate.
Further, the material of the heat conducting plate is copper.
Further, the thickness of the heat-conducting plate is 2mm-3mm.
Further, the heat-conducting glue filling layer adopts heat-conducting silicone grease.
Further, the simulated heat load temperature testing device also comprises a bottom plate, a bracket and a positioning component; the temperature measuring assembly and the to-be-measured piece are clamped between the bottom plate and the bracket, and the positioning assembly is connected between the bottom plate and the bracket.
Further, the positioning assembly comprises a connecting plate and a bolt; the connecting plate is arranged on the bracket, a connecting hole is formed in the connecting plate, a threaded hole is correspondingly formed in the bottom plate, and the bolt penetrates through the connecting hole and is screwed into the threaded hole.
It is to be understood that both the foregoing general description and the following detailed description are for purposes of example and explanation and are not necessarily limiting of the disclosure. The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate the subject matter of the present disclosure. Meanwhile, the description and drawings are used to explain the principles of the present disclosure.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a simulated heat load temperature testing device according to an embodiment of the utility model;
fig. 2 is a schematic structural diagram of a temperature measuring component in the simulated heat load temperature testing device shown in fig. 1.
Icon: 1-a temperature measuring component; 2-a bracket; 3-a bottom plate; 4-positioning assembly; 5-a piece to be tested; 11-heating blocks; 12-insulating cushion blocks; 13-a heat-conducting plate; 14-a temperature measuring element.
Detailed Description
The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown.
The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model.
All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Furthermore, the terms "horizontal," "vertical," "overhang," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
As shown in fig. 1 and 2, the device for testing simulated heat load temperature according to the embodiment of the present utility model includes: the temperature measuring assembly 1 comprises a heating block 11, an insulating cushion block 12, a heat conducting plate 13 and a temperature measuring element 14; the insulating cushion block 12 and the heat conducting plate 13 are respectively arranged at two sides of the heating block 11, and the temperature measuring element 14 is buried in the heat conducting plate 13.
When the simulated heat load temperature testing device provided by the embodiment is used, one side, far away from the heating block 11, of the heat conducting plate 13 is contacted with the wall surface of the to-be-tested piece 5 (for example, a heat radiating plate), and the heating block 11 works to simulate heat load (for example, a circuit board generates heat); the insulating cushion block 12 is arranged on one side of the heating block 11 far away from the heat conducting plate 13, so that the heating block 11 can be protected, and heat can be prevented from being transferred to the side, so that the heat is transferred to the to-be-tested piece 5 through the heat conducting plate 13; the temperature measuring element 14 (for example, thermocouple) is buried in the heat transfer plate and is prevented from being arranged on the member to be tested 5, so that the wall surface of the member to be tested 5 is prevented from being damaged, a gap is prevented from being generated between the heating block 11 and the member to be tested 5, the temperature field and the heat exchange state between the heating block 11 and the member to be tested 5 are prevented from being damaged, the temperature measuring element 14 is also protected from being damaged when buried in the heat transfer plate 13, and the accuracy of the test is improved.
Wherein the heating block 11 may comprise a plurality of electric heating elements, such as: an electric heating wire, an electric heating rod, an electric heating disc and the like.
As an alternative, the heat conducting plate 13 is provided with a mounting hole, the temperature measuring element 14 is inserted into the mounting hole, compared with the groove structure for accommodating the temperature measuring element 14 arranged on the heat conducting plate 13, the integrity of the wall surface of the heat conducting plate, which is in contact with the piece to be tested, is reduced or even avoided, and the heat dissipation of the mounting hole can be reduced, so that the damage to the temperature field and the heat exchange state is avoided, and the accuracy of the test is further improved.
Wherein the heating block 11 is disposed at one side of the heat conductive plate 13 in the thickness direction of the heat conductive plate 13; in the width direction of the heat conducting plate 13, the mounting hole is formed on one side wall of the heat conducting plate 13, that is, opposite to the heating block 11, the mounting hole is formed on the side portion of the heat conducting plate 13, so that the heating block 11 can be conveniently mounted, and the heating block 11 can be conveniently connected with an external power supply or a controller through an electric wire. The mounting holes can be punched on the side wall of the heat conducting plate 13 along the isotherm according to the practical conditions of the test, and the depths of the holes reach the center position of the heat conducting plate 13.
Wherein, in the thickness direction of the heat conducting plate 13, the distance from the center of the mounting hole to the edge of the heat conducting plate 13, which is close to the heating block 11, is greater than the distance from the center of the mounting hole to the edge of the heat conducting plate 13, which is far away from the heating block 11, i.e. the mounting hole is closer to the wall surface of the workpiece 5, so that the temperature measurement on the wall surface of the workpiece 5 is more accurate.
For example: the distance from the top end of the mounting hole to the upper surface of the heat conducting plate is 0.5mm, and the distance from the bottom end of the mounting hole to the edge of the heating block can be between 1mm and 2mm according to the actual space size of the product.
As shown in fig. 2, further, a heat-conducting glue filling layer is disposed between the heating block 11 and the heat-conducting plate 13. In this embodiment, gaps between the heating block 11 and the heat conducting plate 13 may be generated due to machining errors, and a heat conducting glue filling layer, that is, a heat conducting glue filling the gaps, is arranged between the gaps, so that air is prevented from being present between the heating block 11 and the heat conducting plate 13, and heat loss is reduced.
The heat-conducting adhesive filling layer is preferably heat-conducting silicone grease, the heat conductivity coefficient of the heat-conducting silicone grease is high, heat loss can be reduced, and the accuracy of testing is improved.
Further, based on the above embodiment, the heat conducting plate 13 is made of copper, and the copper has a high heat conductivity coefficient, so that heat loss can be reduced, and thus, the accuracy of the test result is high, for example: the thickness of the copper plate is 1mm, the heat transfer loss is 0.51 ℃, and the error is within the allowable range.
The thickness of the heat conductive plate 13 may be any value from 2mm to 3mm, for example: 2mm, 2.2mm, 2.5mm, 3mm, etc.
As shown in fig. 1, on the basis of the above embodiment, the simulated heat load temperature testing device further comprises a bottom plate 3, a bracket 2 and a positioning assembly 4; the temperature measuring assembly 1 and the to-be-measured piece 5 are clamped between the bottom plate and the bracket 2, and the positioning assembly 4 is connected between the bottom plate 3 and the bracket.
In the testing process, the piece 5 to be tested and the temperature measuring component 1 can be clamped between the support 2 and the bottom plate 3, the support 2 and the bottom plate 3 are connected and fixed through the positioning component 4, so that the piece 5 to be tested and the temperature measuring component 1 are positioned, and then other tools are adopted to compress the piece 5 to be tested and the temperature measuring component 1, so that the experiment is convenient.
Specifically, the part 5 to be measured may be a heat dissipation plate, the temperature measuring component 1 is clamped between two heat dissipation plates, the heat conduction plate 13 contacts with one of the heat dissipation plates, and the temperature measuring component 1 and the heat dissipation plate are integrally clamped between the bracket 2 and the bottom plate 3; the heating power of the heating plate is adjusted by controlling the power supply voltage, and the heating power is used for simulating the heating condition of the circuit board under different powers. During temperature measurement, the thermocouple is inserted into the small hole on the side surface of the heat conducting copper sheet, the insertion depth of the thermocouple is controlled, the same insertion depth of each test is ensured, and the repeatability of the test is ensured.
The positioning assembly 4 may have various structural forms, for example: the positioning assembly 4 comprises two clamping plates which are oppositely arranged, one ends of the two clamping plates are rotationally connected through torsion springs, the support 2 is provided with a matching plate, one clamping plate is clamped on the matching plate, and the other clamping plate is clamped on the bottom plate 3.
As an alternative, as shown in fig. 1, the positioning assembly 4 includes a connection plate and a bolt; the connecting plate is arranged on the bracket 2, a connecting hole is formed in the connecting plate, a threaded hole is correspondingly formed in the bottom plate 3, and the bolt penetrates through the connecting hole and is screwed into the threaded hole.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model. In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the utility model may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description. Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the utility model and form different embodiments.
Claims (10)
1. A simulated heat load temperature testing device, comprising: the temperature measuring assembly (1), the temperature measuring assembly (1) comprises a heating block (11), an insulating cushion block (12), a heat conducting plate (13) and a temperature measuring element (14); the insulating cushion block (12) and the heat conducting plate (13) are respectively arranged at two sides of the heating block (11), and the temperature measuring element (14) is buried in the heat conducting plate (13).
2. A simulated heat load temperature testing device as claimed in claim 1, wherein said heat conducting plate (13) is provided with mounting holes in which said temperature measuring elements (14) are inserted.
3. A simulated heat load temperature testing device as claimed in claim 2, wherein said heating block (11) is provided on one side of said heat conducting plate (13) in the thickness direction of said heat conducting plate (13); the mounting hole is provided on one side wall of the heat conductive plate (13) in the width direction of the heat conductive plate (13).
4. A simulated heat load temperature testing device as claimed in claim 3, wherein the distance from the centre of said mounting hole to the edge of said heat conducting plate (13) adjacent to said heating block (11) is greater than the distance from the centre of said mounting hole to the edge of said heat conducting plate (13) remote from said heating block (11) in the thickness direction of said heat conducting plate (13).
5. A simulated heat load temperature testing device as claimed in claim 1, wherein a heat conducting glue filling layer is provided between said heating block (11) and said heat conducting plate (13).
6. A simulated heat load temperature testing device as claimed in claim 1, wherein said heat conducting plate (13) is copper.
7. A simulated heat load temperature testing device as claimed in claim 1, wherein said heat conducting plate (13) has a thickness of 2mm-3mm.
8. The simulated heat load temperature testing device of claim 5, wherein said heat conductive gel filler layer is a heat conductive silicone grease.
9. A simulated heat load temperature testing device as claimed in any of claims 1-8, further comprising a base plate (3), a bracket (2) and a positioning assembly (4); the temperature measuring assembly (1) and the to-be-measured piece (5) are clamped between the bottom plate and the bracket (2), and the positioning assembly (4) is connected between the bottom plate (3) and the bracket.
10. A simulated heat load temperature testing device as claimed in claim 9, wherein said positioning assembly (4) comprises a connection plate and a bolt; the connecting plate is arranged on the bracket (2), a connecting hole is formed in the connecting plate, a threaded hole is correspondingly formed in the bottom plate (3), and the bolt penetrates through the connecting hole and is screwed into the threaded hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322628269.1U CN221006598U (en) | 2023-09-26 | 2023-09-26 | Simulated heat load temperature testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322628269.1U CN221006598U (en) | 2023-09-26 | 2023-09-26 | Simulated heat load temperature testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221006598U true CN221006598U (en) | 2024-05-24 |
Family
ID=91086367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322628269.1U Active CN221006598U (en) | 2023-09-26 | 2023-09-26 | Simulated heat load temperature testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221006598U (en) |
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2023
- 2023-09-26 CN CN202322628269.1U patent/CN221006598U/en active Active
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