CN111124004B - Test board, test frame, temperature difference control system and method for high-acceleration stress test - Google Patents
Test board, test frame, temperature difference control system and method for high-acceleration stress test Download PDFInfo
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- CN111124004B CN111124004B CN201911267833.3A CN201911267833A CN111124004B CN 111124004 B CN111124004 B CN 111124004B CN 201911267833 A CN201911267833 A CN 201911267833A CN 111124004 B CN111124004 B CN 111124004B
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Abstract
The application discloses survey test panel, test jig and high acceleration stress test's difference in temperature control system and method, this survey test panel includes: the heat dissipation assembly is positioned on the surface of the sample to be measured, which deviates from the sample clamping groove, and the heat dissipation assembly is fixed in the sample clamping groove through a threaded part; the test frame comprises a first connecting part, a second connecting part and a test board which are perpendicular to each other. The test board and the test frame disclosed by the application enable the temperature of a product to be balanced, reduce the temperature difference between the temperature of a chip and the ambient temperature of a test box, truly simulate the working state of a sample in an experimental environment and find design and process faults in time; the control method disclosed by the application can monitor the temperature difference between the test sample and the test box body in real time, does not need manual monitoring and temperature difference adjustment, and further ensures the failure state of a real simulation product.
Description
Technical Field
The invention relates to the technical field of semiconductor testing, in particular to a test board, a test frame and a temperature difference control system and method for high-acceleration stress testing.
Background
The reliability test project, namely a high accelerated stress test, is to apply high-temperature, high-humidity and high-pressure environment to a semiconductor packaging product, load proper working voltage to the product, accelerate the invasion of moisture to the product under the working state of a simulation product, generate an ion migration effect, so as to accelerate the discovery and the location of the design and the process defects of the product, provide a powerful basis for the design and the perfection of the product, shorten the test period, and enable the design and the manufacturing process of the product to rarely generate design and process related faults before being put into production or used in the field of a final customer, thereby improving the product competitiveness.
In the current commercial products with low power consumption, when bias high acceleration stress test is carried out, the sample is mounted on a test board, a specified voltage is loaded, and a test box provides temperature/humidity/pressure conditions (HAST conditions: 130 +/-2 ℃, 85 +/-5% RH, 230kPa) meeting the standard requirements. In the test operation process, because the power consumption of the product is relatively small, the difference between the internal temperature of the chip and the environmental temperature of the test box is small (less than or equal to 5 ℃), and the temperature difference can not influence the sample in the test process. However, for a product with high power consumption, a large amount of heat can be generated in the test process of loading a working voltage to simulate a working state, the internal temperature of the chip and the environmental temperature of the test box exceed 5 ℃ or even more than 10 ℃, the heat generated by power dissipation can disperse moisture closely related to a failure mechanism on the surface and the periphery of the chip, the invasion of the moisture to a sample is prevented, and a real state that the test fails to work on the sample cannot be simulated, so that the accuracy of a reliability test is influenced, and hidden dangers are buried for the quality of subsequent mass production.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a test board, a test rack, and a temperature difference control system and method for high-acceleration stress testing, which improve the high heat generated by a chip in a high-acceleration test of a high-power product and balance the temperature difference between the internal temperature of the chip and the ambient temperature of a test chamber.
In a first aspect, the present invention provides a test board comprising: the base plate and a plurality of sample draw-in grooves of array distribution on the base plate, a side of base plate is provided with the pin, is suitable for connecting external circuit, and the sample draw-in groove is used for loading the sample that awaits measuring, is provided with radiator unit on the sample draw-in groove, and radiator unit is located the sample that awaits measuring and deviates from the face of sample draw-in groove, and radiator unit passes through the screw and fixes on the sample draw-in groove.
Preferably, the heat dissipation assembly comprises a copper sheet located on the opening of the sample clamping groove, an aluminum alloy heat dissipation sheet is welded on the surface of the copper sheet, and the copper sheet is fixed on the sample clamping groove through a threaded piece.
Preferably, the length of the copper sheet is equal to the length of the sample card slot, and the width of the copper sheet is equal to the width between the two outer side walls of the sample card slot.
Preferably, fill the heat-conducting layer between sample and the radiator unit that awaits measuring, the upper surface that the thickness of heat-conducting layer satisfies the heat-conducting layer and the opening parallel and level of sample draw-in groove, the width of heat-conducting layer is no longer than the width between the two inside walls of sample draw-in groove.
Preferably, the heat conducting layer is a silicone gasket.
In a second aspect, the present invention provides a test rack comprising: the first connecting part, the second connecting part and the test board described in the first aspect are perpendicular to each other;
at least two parallel slots are arranged on the surface of the first connecting part at intervals, the slots correspond to the pins of the test board, at least two grooves are arranged on the surface of the second connecting part, the grooves correspond to the slots in position and are perpendicular to the slots, and the grooves are used for fixing the side edges, adjacent to the side edges where the pins are located, of the test board.
Preferably, the first connecting portion is provided with a connecting terminal between two adjacent slots.
Preferably, at least one hollow-out area is arranged between two adjacent grooves of the second connecting part.
In a third aspect, the present invention provides a temperature difference control system for high acceleration stress test, including:
the test box, the power supply, the first temperature sensor, the second temperature sensor, the processor, the controller and the test rack of the second aspect;
the test piece that awaits measuring passes through the binding post on the connection of electric lines test jig, the test jig is installed inside the proof box, binding post on the test jig is connected with the inside binding post that corresponds of proof box, the power is used for providing the power for the proof box and realizes the voltage loading, first temperature sensor and the equal connection treater of second temperature sensor, first temperature sensor is located the sample surface that awaits measuring, be used for detecting the sample surface temperature that awaits measuring, second temperature sensor is located the proof box, be used for the inside temperature of test box, the treater is used for handling test sample surface temperature and experimental inside temperature and obtains the difference in temperature, treater connection director, the break-make of controller according to the difference in temperature control power.
In a fourth aspect, the invention provides a temperature difference control method for a high acceleration stress test, and a control system based on the third aspect specifically includes:
acquiring the surface temperature of a high-power-consumption product and the internal temperature of a test box;
calculating the temperature difference between the surface temperature of the high-power-consumption product and the internal temperature of the test box;
controlling the working state of the power supply according to the temperature difference, specifically: and when the temperature difference exceeds 10 ℃, closing the power supply to stop voltage loading, timing, starting the power supply to load voltage again after timing for 30min, and performing cyclic operation.
The invention has the following beneficial effects:
according to the test board, the heat dissipation assemblies are arranged on the sample clamping grooves, so that heat generated by a test sample in the test process can be fully transferred under the action of the heat dissipation assemblies, and the temperature of a test product is reduced. Meanwhile, a heat conduction layer is filled between the heat dissipation assembly and the test sample, and the heat conduction layer is in surface contact with the test sample and the heat dissipation assembly respectively, so that the heat transfer effect is improved, and the temperature difference is reduced as much as possible. The external monitoring equipment is connected to the test frame through the wiring terminal, and in a high-acceleration stress test, the on-off of a power supply is controlled by detecting the temperature difference between a test sample and the test box, so that the balance of temperature and humidity in the test process is further ensured, the real state of failure of the test sample can be truly simulated, and the accuracy of the quality of the test sample is improved.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a conventional test board;
FIG. 2 is a schematic structural diagram of a test board according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a sample card slot according to an embodiment of the invention;
FIG. 4 is a schematic cross-sectional exploded view of a sample card slot according to one embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a test rack according to an embodiment of the present invention;
FIG. 6 is a front view of a test rack according to an embodiment of the present invention, wherein the right side is an enlarged structural view in a dashed box;
FIG. 7 is a left side view of a test rack according to one embodiment of the present invention;
FIG. 8 is a top view of a test rack according to one embodiment of the present invention;
FIG. 9 is a schematic view of the mounting of a test board and test rack according to one embodiment of the present invention;
fig. 10 is a flowchart of a temperature difference control method in a high acceleration stress test according to an embodiment of the present invention.
In the figure: 1. the test device comprises a substrate, 2 sample clamping grooves, 3 heat dissipation assemblies, 4 threaded parts, 5 copper sheets, 6 aluminum alloy cooling fins, 7 heat conduction layers, 8 first connection parts, 9 second connection parts, 10 slots, 11 grooves, 12 wiring terminals, 13 hollow areas and 14 test samples.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
It should be noted that in the description of the present application, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
It should be noted that unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and include, for example, fixed or removable connections or integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
At present, when a bias high-acceleration stress test is carried out, a sample is installed on a test board, rated voltage is loaded, a test box provides conditions of temperature, humidity and pressure meeting standard requirements, the conventional test board is shown in figure 1, the heat generated by the test sample due to power consumption can dissipate the moisture on the surface of a chip and the surrounding of the chip, and therefore the real state of failure caused by the test sample cannot be simulated.
The invention relates to a bias high acceleration stress test, which consists of a test box, a power supply, a test board and monitoring software.
In a first aspect, referring to fig. 2 and fig. 3, a structure of a test board suitable for implementing the embodiment of the present application is shown, where the test board includes a substrate 1 and a plurality of sample card slots 2 distributed in an array manner on the substrate, a side of the substrate is provided with pins suitable for connecting an external circuit, the sample card slot 2 is used for loading a sample to be tested, the sample card slot 2 is provided with a heat dissipation assembly 3, the heat dissipation assembly 3 is located on a surface of the sample to be tested, the sample to be tested deviates from the sample card slot 2, and the heat dissipation assembly 3 is fixed at four corners of the sample card slot 2 through screws 4.
It should be noted that, in this embodiment, a side of the substrate is provided with a pin for connecting an external circuit and performing communication, where the pin is usually made of metal, and a side of the substrate where the pin is provided is also provided with a fool-proof structure to prevent direction installation errors in an installation process, where the fool-proof structure may be a groove, a notch, or a protrusion structure located on the side of the substrate, which is mainly convenient for installation, and can make the installation direction and position unique in the installation process. A plurality of sample clamping grooves are formed in the substrate, wherein the number of the sample clamping grooves is selected and distributed according to the size of a tested product.
Especially, set up radiator unit on the sample draw-in groove, compare in current conventional test panel, radiator unit among this embodiment is favorable to improving test sample after voltage loading, because the higher thermal of production of consumption distributes, reduces the temperature of product, has solved the moisture that the proof box produced and has reduced on the product surface of high temperature, influences the problem that the product is really failure state. The working state of the test sample in the experimental environment can be truly simulated, the design and process faults can be timely found in the test process, the subsequent design and process can be conveniently improved, and the reliability of the product can be improved.
The heat dissipation assembly can be a heat dissipation die made of heat dissipation materials, or can be a metal sheet easy to conduct heat, and the metal sheet can be a single metal as the heat dissipation assembly, or can be a heat dissipation assembly which is formed by welding different metals together.
The heat dissipation assemblies are fixed at four corners of the sample clamping groove through the threaded pieces, so that the heat dissipation assemblies can be well fixed, and the heat dissipation assemblies are prevented from falling off during the working process of the test board; simultaneously, compare in sticky mode through the screw is fixed, have better temperature toleration, can not take place the problem that drops under high temperature. The screw thread piece is fixed in the test that the four corners does not influence the chip, has reduced the interference problem. The screw member here may be a screw or a bolt.
In a preferred embodiment, as shown in fig. 3, the heat dissipation assembly 3 includes a copper sheet 5 located on the sample card slot opening 2, an aluminum alloy heat sink 6 is welded on the surface of the copper sheet 5, and the copper sheet 5 is fixed at four corners of the sample card slot 2 by screws 4. The copper sheet has good heat conductivity, the aluminum alloy radiating fin has a large heat transfer area, and the copper sheet and the aluminum alloy radiating fin are welded together and fixed at four corners of the sample clamping groove. Because the price of copper is more expensive, the processing degree of difficulty is higher, weight is too big, the weight that adopts the copper sheet alone is probably more than the weight of chip, therefore, adopt the fin cooperation of copper sheet and aluminum alloy, aluminum alloy fin has sufficient hardness for pure aluminum fin, low price, light in weight, consequently, adopt copper sheet and aluminum alloy welding to regard as radiator unit together, guaranteed that the process can give off faster because the heat that the consumption produced when the test, compare current survey test panel that does not set up radiator unit, can reduce the temperature of test sample itself more rapidly, guarantee that test sample itself receives the erosion of moisture, improve the accuracy of test, the quality of product has been guaranteed.
In a preferred embodiment, the length of the copper sheet is equal to the length of the sample card slot, and the width of the copper sheet is equal to the width between two outer side walls of the sample card slot. To facilitate the mounting of the copper sheet and the mounting of the test board, the dimensions of the copper sheet should be consistent with the dimensions of the sample card slot.
In some embodiments, as shown in fig. 4, a heat conducting layer 7 is filled between the sample to be tested and the heat dissipation assembly, the thickness of the heat conducting layer 7 is such that the upper surface of the heat conducting layer is flush with the opening of the sample card slot, and the width of the heat conducting layer 7 does not exceed the width between two inner side walls of the sample card slot 2. As shown in fig. 3, the heat conducting layer 7 is tightly attached to the sample to be measured and the heat dissipating assembly 3, and the heat conducting layer can make the product and the heat dissipating assembly contact each other in a sufficient surface-to-surface manner, so that the heat flow transfer effect is improved, and the temperature difference is as small as possible. Because the test sample is located inside the sample card slot, consequently, the width of heat-conducting layer should be less than or equal to the width between the sample card slot inside wall, in order to guarantee that radiator unit can take the heat on test sample surface out fully, the thickness of heat-conducting layer is at least with the opening parallel and level of sample card slot, guarantee to contact fully completely with the radiator unit surface, make the heat that test sample sent conduct radiator unit more effectively on, it goes to in the air around to give off through radiator unit again. The thermally conductive layer may generally be a silicon-containing material, such as: silicone grease or silicone gaskets.
Preferably, the heat conducting layer is a silicone gasket.
In a second aspect, a test rack according to an embodiment of the present invention, as shown in fig. 5 and 6, includes a first connecting portion 8, a second connecting portion 9, and a test board according to the first aspect, which are perpendicular to each other;
the surface of the first connecting part 8 is provided with at least two parallel slots 10 at intervals, the slots 10 correspond to the pins of the test board, the surface of the second connecting part 9 is provided with at least two grooves 11, and the grooves 11 correspond to and are perpendicular to the positions of the slots 10 and are used for fixing the side edges of the test board adjacent to the side edges where the pins are located.
It should be noted that, at least two slots are formed in the first connecting portion, so that a plurality of test boards can be simultaneously mounted on the test rack. The slot of first connecting portion is arranged in the installation to survey test panel, surveys test panel and has the side of pin and insert the slot in, surveys the joint that opposite side corresponds of test panel in the recess of second connecting portion, has realized surveying the stable fixed of test panel. Here, the first and second connection portions of the test rack should have a size that satisfies the size of the test chamber tray and the size of the test chamber case.
Preferably, set up in the slot and prevent slow-witted structure, prevent that the test panel installation direction from makeing mistakes. The design of preventing slow-witted structure can conveniently survey the installation of surveying the board, has ensured to survey the board and has surveyed that the direction of installation is unique under any circumstance, can not the mistake appear. Here, the fool-proof structure may be a protruding structure disposed in the slot, and the protruding structure is designed corresponding to the recessed portion on the side where the pin is located; the fool-proof structure can also be a notch designed at one end of the slot, the shape of the notch is not limited, but the notch can be only arranged at one position of the slot, and the cross section of the slot is an asymmetric figure due to the position of the notch.
In some embodiments, please see fig. 7, the first connecting portion is disposed between two adjacent slots 10 and provided with a connection terminal 12. The positive and negative poles of the test sample are connected to the connecting terminals inside the test box through the connecting terminals of the test frame and are finally communicated with the connecting terminals outside the device, the connecting terminals outside the device are connected with the power supply and are connected to the positive and negative poles of the power supply through electric wires, the power supply is turned on, the voltage specified by the test sample is adjusted, and the voltage is loaded on the test sample. The universal meter can be connected to the terminal on the test frame to confirm whether the voltage value on the test board is consistent with the voltage of the power supply.
In some embodiments, as shown in fig. 8, at least one hollow area 13 is disposed between two adjacent grooves of the second connection portion. The hollowed-out area can reduce the weight of the test jig, so that the test jig is lighter and more convenient, and meanwhile, the heat dissipation of the test jig is facilitated.
For example, one, two or more than two hollow-out areas are arranged between two adjacent grooves of the second connecting part, and the shape of the hollow-out area can be rectangular, oval, circular or other shapes. The shape of the hollow-out area may also be a grid shape, which is not specifically limited herein.
In summary, the working process of the test board and test rack of the present application is illustrated:
at first test sample loads to testing on the board, at the attached silica gel gasket in test sample's surface, the model of the silica gel gasket that adopts in this embodiment is: the thickness is 0.5 mm; the heat conductivity coefficient is 8.0W/mK; density 3.55g/cm3(ii) a The thickness of the attached silica gel gasket ensures that the upper surface of the silica gel gasket is flush with the height of the sample clamping groove; then, manufacturing a copper sheet with the size consistent with that of the sample clamping groove, welding aluminum alloy radiating fins on the copper sheet, and fixing four corners of the copper sheet welded with the aluminum alloy radiating fins at four corners of the sample clamping groove through screws; the installation is reversed as shown in fig. 9, the height edge (height is recorded as H) of the test board corresponds to the height edge (height is recorded as H) of the first connecting part, the width edge (width is recorded as D) of the test board corresponds to the width edge (width is recorded as D) of the second connecting part, after all the test samples are installed, the pin direction of the test board is inserted into the corresponding slot of the test frame, the positive electrode and the negative electrode of the test sample are connected to the connecting terminal in the test box through the connecting terminal of the test frame, and finally the positive electrode and the negative electrode are communicated with the external connecting terminal; two wires are connected to the positive pole and the negative pole of the power supply, the two wires are connected to the positive pole and the negative pole of the test box, the power supply is turned on, the voltage requirement specified by the sample is adjusted, and a universal meter is utilized to measure whether the voltage value on the test board is consistent with the power supply. Here, it is necessary to attach a temperature sensing wire to the surface of one of the test samples using an AB adhesive, connect the other end of the temperature sensing wire to a monitoring computer, and close the test chamber to perform the test.
To sum up, the survey test panel that this application shows can reduce the temperature of test product itself through set up radiator unit on sample card groove, fills the heat-conducting layer between radiator unit and test product, on fully will testing the heat transfer of product surface to radiator unit through the heat-conducting layer, reduces the temperature of test product. The test frame shown in the application tests the mounting of the board and is light in weight and easy to operate.
In a third aspect, a temperature differential control system for high acceleration stress testing includes:
the test box, the power supply, the first temperature sensor, the second temperature sensor, the processor, the controller and the test rack described in the second aspect;
the test piece that awaits measuring passes through the binding post on the connection of electric lines test jig, the test jig is installed inside the proof box, binding post on the test jig is connected with the inside binding post that corresponds of proof box, the power is used for providing the power for the proof box and realizes the voltage loading, first temperature sensor and the equal connection treater of second temperature sensor, first temperature sensor is located the sample surface that awaits measuring, be used for detecting the sample surface temperature that awaits measuring, second temperature sensor is located the proof box, be used for the inside temperature of test box, the treater is used for handling test sample surface temperature and experimental inside temperature and obtains the difference in temperature, treater connection director, the break-make of controller according to the difference in temperature control power.
It should be noted that, the test box herein is used for providing the high temperature, high humidity and high pressure environment of the high accelerated stress test, the test rack that loads the sample to be tested is placed in the test box, the test box switches on the power supply, the sample to be tested is loaded with voltage, wherein, the first temperature sensor can be a temperature sensing line, one end of the temperature sensing line is bonded on the surface of the sample to be tested through an AB glue, the other end of the temperature sensing line is used for detecting the surface temperature of the sample to be tested, the second temperature sensor is installed inside the test box and used for detecting the temperature of the test box and transmitting the temperature to the processor, the processor processes the temperatures of the two to obtain the temperature difference, the temperature difference is output to the controller, and the controller controls the on-off of the power supply according to the temperature difference. And when the controller controls the power supply to be switched off, the timer is started, and after timing for 30min, the power supply is controlled to be switched on again. The timer can be an external timer or a timer carried by the control system. In this embodiment, through the difference in temperature that detects the sample surface temperature that awaits measuring and the inside temperature of proof box, when the difference in temperature exceeded the threshold value, turn off the power, be favorable to awaiting measuring sample surface temperature to reduce for the high temperature causes the moisture that the sample that awaits measuring loses to resume, treat that temperature reduces and moisture resumes the back, opens the power again and continues loading voltage, and cycle operation can.
The control system can conveniently monitor the temperature difference between the test sample and the test box body in real time, does not need manual monitoring and temperature difference adjustment, and solves the problem that the actual state that the real simulation product fails due to overhigh temperature difference in the prior art.
In a fourth aspect, the present invention provides a temperature difference control method in a high acceleration stress test, where a control system based on the third aspect, as shown in fig. 10, specifically includes the following steps:
step 10: acquiring the surface temperature of a high-power-consumption product and the internal temperature of a test box;
it should be noted that the surface temperature of the high-power consumption product is the actual temperature of the surface of the sample to be tested, which is the temperature obtained by the test of the temperature sensing line when the test frame is installed in the test box; the temperature inside the test box refers to that the temperature of the center inside the test box body is detected through a temperature sensor carried by the test box body, and the temperature of the center of the test box body can reflect the real temperature of the test box body;
step 20: calculating the temperature difference between the surface temperature of the high-power-consumption product and the internal temperature of the test box;
because the product is in the experimental time, under the effect of loading bias voltage, because self consumption for the temperature on test product surface all can all be higher than the temperature that the experimental box provided, through calculating the temperature difference of the temperature on test sample surface and the inside temperature of experimental box, can regard as the foundation of design fin, can be favorable to guaranteeing the temperature balance of experimental box and test product simultaneously, required temperature and humidity condition under the real simulation product failure state.
Step 30: according to the temperature difference control power supply operating condition, specifically: and when the temperature difference exceeds 10 ℃, closing the power supply to stop the voltage loading, timing, opening the loading voltage again after timing for 30min, and circularly operating to maintain the temperature difference not to exceed 10 ℃. The working state of the power supply is controlled through temperature difference, namely the on-off of the loading voltage is controlled, so that moisture dissipated by heat when the voltage is loaded is collected on the chip again in the period of power supply off, the penetration of the moisture is accelerated, the power supply loading voltage is turned on again after 30min, the operation is circulated, and the real state of failure of a sample caused by a test can be simulated.
In particular, according to embodiments of the present application, the process described with reference to fig. 10 may be implemented as a computer software program. For example, embodiments of the present application include a computer program product comprising a computer program embodied on a machine-readable medium, the computer program comprising program code for performing the method illustrated in flowchart 10.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The units or modules described in the embodiments of the present application may be implemented by software or hardware. The described units or modules may also be provided in a processor, and may be described as: a processor includes an acquisition unit, a calculation unit, and a control unit. Where the names of these units or modules do not in some cases constitute a limitation of the units or modules themselves, the control unit may also be described as a "unit for processing according to the results generated by the acquisition unit and the calculation unit", for example.
As another aspect, the present application also provides a computer-readable storage medium, which may be the computer-readable storage medium included in the foregoing device in the foregoing embodiment; or it may be a separate computer readable storage medium not incorporated into the device. The computer readable storage medium stores one or more programs for use by one or more processors in performing the temperature differential control described herein for use in high acceleration stress testing.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (7)
1. A temperature differential control system for high acceleration stress testing, comprising:
the device comprises a test box, a power supply, a first temperature sensor, a second temperature sensor, a processor, a controller and a test frame;
the test jig includes: the first connecting part, the second connecting part and the test board are mutually vertical; the surface of the first connecting part is provided with at least two parallel slots at intervals, a wiring terminal is arranged between every two adjacent slots of the first connecting part, the slots correspond to the pins of the test board, at least two grooves are formed in the surface of the second connecting part, the grooves correspond to the slots and are perpendicular to the slots, and the grooves are used for fixing the side edges of the test board adjacent to the side edges where the pins are located;
the test box comprises a test frame, a connecting terminal, a power supply, a first temperature sensor, a second temperature sensor, a processor, a controller and a power supply, wherein a sample to be tested is connected with the connecting terminal on the test frame through an electric wire, the test frame is installed inside the test box, the connecting terminal on the test frame is connected with a corresponding connecting terminal inside the test box, the power supply is used for providing power for the test box to realize voltage loading, the first temperature sensor and the second temperature sensor are both connected with the processor, the first temperature sensor is located on the surface of the sample to be tested and used for detecting the surface temperature of the sample to be tested, the second temperature sensor is located inside the test box and used for testing the temperature inside the test box, the processor is used for processing the surface temperature of the test sample and the temperature inside the test to obtain a temperature difference, the processor is connected with the controller, and the controller controls the on-off of the power supply according to the temperature difference.
2. The thermoelectric control system of claim 1, wherein the test plate comprises: the sample clamping groove is used for loading a sample to be tested, and is characterized in that a heat dissipation assembly is arranged on the sample clamping groove and is located on the surface, deviating from the sample to be tested, of the sample clamping groove, the heat dissipation assembly is fixed on the sample clamping groove through a threaded part, a heat conduction layer is filled between the sample to be tested and the heat dissipation assembly, the heat conduction layer is tightly attached to the sample to be tested and the heat dissipation assembly, the heat dissipation assembly comprises a copper sheet located on an opening of the sample clamping groove, aluminum alloy cooling fins are welded on the surface of the copper sheet, and the copper sheet is fixed on the sample clamping groove through the threaded part.
3. The temperature difference control system according to claim 2, wherein the copper sheet has a length equal to a length of the sample card slot and a width equal to a width between two outer side walls of the sample card slot.
4. The temperature difference control system according to claim 2, wherein a heat conduction layer is filled between the sample to be measured and the heat dissipation assembly, the thickness of the heat conduction layer is such that the upper surface of the heat conduction layer is flush with the opening of the sample clamping groove, and the width of the heat conduction layer is not more than the width between the two inner side walls of the sample clamping groove.
5. The temperature differential control system of claim 4, wherein the thermally conductive layer is a silicone gasket.
6. The temperature difference control system according to claim 1, wherein at least one hollow-out area is arranged between two adjacent grooves of the second connecting portion of the test jig.
7. A temperature difference control method for a high-acceleration stress test is characterized in that based on the control system of any one of claims 1-6, the temperature difference control method specifically comprises the following steps:
acquiring the surface temperature of a high-power-consumption product and the internal temperature of a test box;
calculating the temperature difference between the surface temperature of the high-power-consumption product and the internal temperature of the test box;
and controlling the working state of the power supply according to the temperature difference, when the temperature difference exceeds 10 ℃, closing the power supply to stop voltage loading, timing at the same time, opening the power supply to load voltage again after timing for 30min, and performing cyclic operation.
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| CN112904179B (en) * | 2021-01-22 | 2022-04-26 | 长鑫存储技术有限公司 | Chip testing method and device and electronic equipment |
| CN115014558B (en) * | 2021-09-03 | 2023-05-09 | 荣耀终端有限公司 | Inductance testing device and inductance testing method thereof |
| CN114295961B (en) * | 2021-12-30 | 2024-01-16 | 上海季丰电子股份有限公司 | Power temperature cycle test method and device for high-power chip and electronic equipment |
| CN114578877A (en) * | 2022-03-04 | 2022-06-03 | 苏州信科检测技术有限公司 | Intelligent test device and method |
| CN115060855A (en) * | 2022-08-19 | 2022-09-16 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Heat conduction material reliability testing device |
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