CN110672659A - Double-sided water cooling plate heat dissipation performance testing device and testing method - Google Patents

Double-sided water cooling plate heat dissipation performance testing device and testing method Download PDF

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CN110672659A
CN110672659A CN201911054349.2A CN201911054349A CN110672659A CN 110672659 A CN110672659 A CN 110672659A CN 201911054349 A CN201911054349 A CN 201911054349A CN 110672659 A CN110672659 A CN 110672659A
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water
cooling plate
electric heating
thermal resistor
temperature
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于德营
阎红亮
刘伟龙
何成峰
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Beijing Machinery Equipment Research Institute
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Beijing Machinery Equipment Research Institute
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    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/20Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity

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Abstract

The invention relates to a device and a method for testing heat dissipation performance of a double-sided water-cooling plate, belongs to the technical field of heat dissipation performance testing of water-cooling plates, and solves the problems that the existing testing device cannot test the heat dissipation performance of double sides of the water-cooling plate, the difference between the testing process and the practical application environment is large, and the accuracy of the testing effect is low. The testing device comprises a water chiller, a temperature measuring component and a power supply; the water outlet and the water inlet of the water cooler are respectively connected with the water inlet and the water outlet of the water cooling plate through water pipes; the number of the temperature measuring components is at least 2, and the temperature measuring components are fixedly arranged on the upper surface and the lower surface of the water cooling plate to be measured; the temperature measuring component comprises a copper block, an electric heating rod, a thermal resistor, a heat insulation cover and a temperature measurement recorder, the electric heating rod and the thermal resistor are embedded into the copper block, the electric heating rod is connected with a power supply, the thermal resistor is connected with the temperature measurement recorder, and the heat insulation cover is buckled on the copper block. The invention realizes the heat dispersion test of the double surfaces of the water cooling plate, and the test result is more accurate.

Description

Double-sided water cooling plate heat dissipation performance testing device and testing method
Technical Field
The invention relates to the technical field of heat dissipation performance testing, in particular to a device and a method for testing heat dissipation performance of a double-sided water-cooling plate.
Background
The invention is applied to the field of water-cooling heat dissipation of power electronic devices, in particular to a high-power IGBT module of a motor controller of an electric automobile. The common heat dissipation modes include natural cooling, forced air cooling and water cooling, and because the natural cooling and the forced air cooling have low heat dissipation efficiency, the water cooling heat dissipation mode is often adopted in the field of high-power electronics so as to achieve an efficient heat dissipation effect and ensure that the working temperature of the IGBT module does not exceed the maximum allowable temperature. Different water-cooling heating panels lead to the radiating effect different because of its design is different (like water course shape, heat dissipation tooth shape etc.), so the water-cooling heating panel who designs need carry out the heat dispersion test, knows the rationality of water-cooling panel design through the test.
When the performance of the water-cooling heat dissipation plate is tested, if a real IGBT module working condition is adopted, a series of problems can be caused, such as complicated test platform building and long time consumption; a large current needs to be applied to the IGBT module, so that the safety is reduced; the working temperature of the IGBT module can not be accurately measured, and the test error is large. In addition, the existing double-motor controller and the high-power controller with modules connected in parallel generally adopt a mode of arranging the IGBT modules on the upper side and the lower side of the double-sided water cooling plate for heat dissipation, in the arrangement structure, the heat dissipation capacity of the IGBT modules is extremely large, higher requirements are provided for the heat dissipation performance of the water cooling plate, but an effective method for testing the double-sided water cooling plate is not available.
In order to solve the problems, devices and methods capable of simulating the heating of the IGBT and testing the performance of the water cooling plate exist at present, but some defects exist. For example, the difference between the whole test structure of the existing test device and the actual application scene is large, and the real heat dissipation working condition cannot be simulated; the ceramic heating element is adopted, so that the power is low, the heat of the high-power IGBT module is difficult to simulate, the heat of the radiating element is constant and cannot be adjusted, and the radiating effect under different heats cannot be simulated; the position where the thermal resistor is arranged is not described, and the temperature of the heating element cannot be accurately measured; the heat insulating board does not completely cover the heating element, resulting in poor accuracy of the measurement result. The test apparatus is designed only for the water passage portion of the water cooling plate, but is not explained and designed for the heating element.
Disclosure of Invention
In view of the above analysis, the present invention aims to provide a device and a method for testing heat dissipation performance of a double-sided water-cooled board, so as to solve the problems that the existing testing device cannot test the heat dissipation performance of the double sides of the water-cooled board, the testing process is greatly different from the actual application environment, and the testing effect accuracy is low.
The purpose of the invention is mainly realized by the following technical scheme:
on one hand, the heat dispersion performance testing device for the double-sided water cooling plate comprises a water chiller, a temperature measuring assembly and a power supply; the water outlet and the water inlet of the water cooler are respectively connected with the water inlet and the water outlet of the water cooling plate; the number of the temperature measuring components is at least 2, and the temperature measuring components are fixedly arranged on the upper surface and the lower surface of the water cooling plate; the temperature measuring component comprises a copper block, an electric heating rod, a thermal resistor, a heat insulation cover and a temperature measuring and recording instrument, the electric heating rod and the thermal resistor are embedded in the copper block, the electric heating rod is connected with a power supply, the thermal resistor is connected with the temperature measuring and recording instrument, and the heat insulation cover is buckled on one side of the copper block, which is far away from the water cooling plate.
Furthermore, the copper block is provided with a first mounting hole for mounting the electric heating rod and a second mounting hole for mounting the thermal resistor; the first mounting hole and the second mounting hole are arranged in parallel with the water cooling plate.
Further, the quantity of first mounting hole is 2, and the second mounting hole is located 2 first mounting holes middles.
Furthermore, the heat insulation cover is fixed on the copper block through a mounting screw, and the electric heating rod and the thermal resistor can penetrate out from the side wall mounting opening of the heat insulation cover, or the electric heating rod and a lead connected with the thermal resistor can penetrate out from the side wall mounting opening of the heat insulation cover.
Further, a heat conducting material layer is coated between the copper block and the water cooling plate; the surfaces of the electric heating rod and the thermal resistor are coated with heat conducting material layers, or the inner walls of the first mounting hole and the second mounting hole are provided with heat conducting material layers.
Further, the heat conducting material layer is a heat conducting silicone grease layer.
Furthermore, the electric heating rod is connected with the first mounting hole through threads, and the thermal resistor is connected with the second mounting hole through threads.
On the other hand, the method for testing the heat dissipation performance of the double-sided water cooling plate is used for testing by using the device for testing the heat dissipation performance of the double-sided water cooling plate, and comprises the following steps:
the method comprises the following steps: connecting the water cooler with a water cooling plate to be tested, and setting the outlet water temperature and the outlet water flow of the water cooler;
step two: assembling temperature measuring components, and fixedly installing a plurality of temperature measuring components on the upper surface and the lower surface of the water cooling plate;
step three: after the temperature measuring assembly is installed, a water cooler and a power supply are turned on, testing is started, a temperature measuring recorder collects and records the temperature of the thermal resistor in a thermal balance state, and the average temperature T1 of the thermal resistor is calculated;
step four: measuring the water outlet temperature of the water cooling plate, recording the water outlet temperature T2, and recording the output power P of the power supply;
step five: and calculating the thermal resistance R of the water cooling plate by a thermal resistance calculation formula R which is (T2-T1)/P.
Further, in the second step, when the temperature measuring assembly is assembled, firstly, the surfaces of the electric heating rod and the thermal resistor are coated with heat conducting material layers, and then the electric heating rod and the thermal resistor are respectively arranged in the first mounting hole and the second mounting hole of the copper block; or, spraying heat conducting material layers on the inner walls of the first mounting hole and the second mounting hole, and then respectively installing the electric heating rod and the thermal resistor into the first mounting hole and the second mounting hole; buckling a heat insulation cover on one side of the copper block far away from the water cooling plate; the electric heating rod and the thermal resistor are respectively connected to a power supply and a temperature measuring and recording instrument.
Further, in the third step, the basis for determining that the thermal resistor is in the thermal equilibrium state is as follows: the temperature of the thermal resistor does not rise or fall within 3 minutes, and the temperature fluctuation is within 2 ℃, namely the thermal equilibrium is achieved.
Compared with the prior art, the invention has at least one of the following beneficial effects:
a) according to the double-sided water-cooling plate heat dissipation performance testing device, the copper block is adopted to replace the traditional ceramic, so that the testing result is closer to the real heat dissipation effect of the IGBT copper heat dissipation plate, the copper block has higher heat conduction performance than the ceramic, the thermal resistor is embedded into the heating device and is positioned between the two electric heating rods and in the middle of the copper block, the temperature of the heating device can be accurately measured, the precision of the collected copper block temperature reaches 0.15 ℃, the temperature is displayed on the temperature measuring and recording instrument, and reading and recording are convenient.
b) According to the double-sided water-cooling plate heat dissipation performance testing device, the electric heating rod is of a detachable structure and is fixed on the copper block through threads, the electric heating rods with different powers can be replaced quickly, damaged electric heating rods can be replaced conveniently, different heating powers of the IGBT module can be simulated by selecting different heating power combinations for replacing the electric heating rods, the installation is convenient, the cost is low, the replacement can be performed quickly, the testing precision is high, and the double-sided water-cooling plate heat dissipation performance testing device has high convenience and universality.
c) The double-sided water-cooling plate heat dissipation performance testing device provided by the invention adopts the covering type heat insulation cover to coat the copper block, so that the influence of air convection is effectively prevented, most of heat of the copper block is guaranteed to be dissipated through the water-cooling heat dissipation plate, the actual working state of IGTB is restored to the maximum extent, and the testing result is more accurate.
d) According to the double-sided water-cooling plate heat dissipation performance testing device, the size of the copper block which is the same as that of the real IGBT module is selected according to testing requirements, the working state of the IGBT module can be truly reproduced, and the measured heating temperature of the real IGBT module is compared with the measured heating temperature of the copper block, so that the heating temperature similarity rate reaches over 90%.
e) According to the method for testing the heat dissipation performance of the double-sided water-cooling plate, the temperature measurement assemblies are arranged on the upper surface and the lower surface of the water-cooling plate, the copper block, the electric heating rod, the thermal resistor and the heat insulation cover of each temperature measurement assembly are of detachable structures, and the heat dissipation performance of the double-sided water-cooling plate under the conditions of different heating powers of the double-sided IGBT module can be quickly evaluated by accurately testing the temperature of the copper block and the temperature of the water outlet of the water-cooling plate, so that the method is simple to operate and.
In the invention, the technical schemes can be combined with each other to realize more preferable combination schemes. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, wherein like reference numerals are used to designate like parts throughout.
FIG. 1 is a schematic diagram of the testing apparatus showing the water path and electrical connections in the embodiment of the present invention;
FIG. 2 is a diagram illustrating the installation of a double-sided water-cooling plate and a heating device according to an embodiment of the present invention;
FIG. 3 is a front structure view of a two-sided water cooling plate and a heat generating device according to an embodiment of the present disclosure;
fig. 4 is an exploded view of a double-sided water-cooled plate and a heat generating device according to an embodiment of the invention.
Reference numerals:
1-a water chiller; 2-a power supply; 3-temperature measuring recorder; 4-water cooling plate; 5-copper block; 6-electric heating rod; 7-thermal resistance; 8-heat insulation cover; 9-mounting screws; 601-606-upper electric heating rod; 607-612-lower electric heating rod; 701-703-upper thermal resistance; 704-706-lower thermal resistance.
Detailed Description
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate preferred embodiments of the invention and together with the description, serve to explain the principles of the invention and not to limit the scope of the invention.
Example one
The invention discloses a heat dispersion performance testing device for a double-sided water cooling plate, which comprises a water chiller 1 and a temperature measuring assembly, as shown in figures 1 to 4; wherein, the water outlet and the water inlet of the water cooler 1 are respectively connected with the water inlet and the water outlet of the water cooling plate 4 to be measured through water pipes, and cooling water circularly flows between the water cooler 1 and the water cooling heat dissipation plate; the number of the temperature measuring components is at least 2, and the temperature measuring components are fixedly arranged on the upper surface and the lower surface of the water cooling plate 4 to be measured through screws and used for measuring the temperature of the water cooling plate 4; the temperature measuring component comprises a copper block 5, electric heating rods 6, a thermal resistor 7, a heat insulation cover 8 and a temperature measuring recorder 3, wherein the electric heating rods 6 and the thermal resistor 7 are embedded into the copper block 5, the copper block 5 is provided with a first mounting hole for mounting the electric heating rods 6 and a second mounting hole for mounting the thermal resistor 7, the first mounting hole and the second mounting hole are arranged in parallel with the water cooling plate 4, the number of the first mounting holes is 2, the second mounting hole is arranged between the 2 first mounting holes, the distances from the second mounting holes to the first mounting holes on the two sides are equal, and the thermal resistor 7 is positioned in the middle of the two electric heating rods 6; the electric heating rod 6 is connected with the power supply 2 and can generate heat after being electrified; the thermal resistor 7 is connected with the temperature measuring and recording instrument 3, and can measure and record the temperature of the thermal resistor 7 in real time; the heat insulation cover 8 is buckled on one side of the copper block 5 far away from the water cooling plate 4. Because the copper block has higher heat-conducting property than ceramic, the copper block 5 is adopted to replace the traditional ceramic, so that the test result is closer to the real heat dissipation effect of the IGBT copper heat dissipation plate.
In this embodiment, thermal-insulated lid 8 is the cover formula heat-insulating cover, and thermal-insulated lid 8 passes through mounting screw 9 to be fixed on copper billet 5, and the full cover formula heat-insulating cover includes top surface and three lateral wall, and the bottom surface opening sets up, installs thermal-insulated lid 8 and can cover copper billet 5's upper surface and three side is whole on copper billet 5, and is specific, and a lateral wall in four lateral walls of thermal-insulated lid 8 sets up the lateral wall installing port, electric rod 6, thermal resistance 7 can be followed the lateral wall installing port of seting up of thermal-insulated lid 8 is worn out, perhaps, the wire of being connected with electric rod 6, thermal resistance 7 can be followed thermal-insulated lid 8's lateral wall installing port is worn out, and thermal-insulated lid 8 of this structure can effectively prevent the influence of natural convection.
In this embodiment, the coating has the heat conduction material layer between copper billet 5 and water-cooling board 4, and copper billet 5 passes through screw and 4 fixed connection of water-cooling board, and the heat conduction material is heat conduction silicone grease, and heat conduction silicone grease has lower thermal resistance (about 2w/m ∙ k), and the high application temperature scope of insulating degree is wide, can fill up the small clearance between copper billet 5 and the water-cooling board 4 to promote heat transfer.
In this embodiment, the diameter of the electric heating rod 6 is equal to the aperture of the first mounting hole, and the diameter of the thermal resistor 7 is equal to the aperture of the second mounting hole; the surface of the electric bar 6 and the thermal resistor 7 is coated with a heat conducting material layer, during installation, the electric bar 6 and the thermal resistor 7 coated with the heat conducting material layer are respectively installed in the first installation hole and the second installation hole, or the inner walls of the first installation hole and the second installation hole are provided with the heat conducting material layer, and the heat conducting material layer can be in contact with the electric bar 6 and the thermal resistor 7. The heat conduction material layer is a heat conduction silicone grease layer, the coating thickness of the heat conduction silicone grease is 0.1-0.3 mm, the heat conduction performance of the heat conduction silicone grease is good, heat conduction can be fully achieved, the test precision is improved, and the test effect is improved.
In the embodiment, the thermal resistor 7 is a high-precision thermal resistor, for example, the thermal resistor 7 is a PT100 or PT1000 thermal resistor, the measurement range is-100 to 500 ℃, the measurement precision reaches 0.15 ℃, and the measurement precision is improved by 5 times compared with that of a traditional thermocouple.
In this embodiment, the electric rod 6 passes through threaded connection with first mounting hole, thermal resistor 7 passes through threaded connection with the second mounting hole, it is concrete, the tip that stretches into first mounting hole of electric rod 6 is equipped with the external screw thread, the supporting internal thread that is equipped with external screw-thread fit of first mounting hole, the tip that thermal resistor 7 stretches into the second mounting hole is equipped with the external screw thread, the supporting internal thread that is equipped with external screw-thread fit of second mounting hole, adopt threaded connection's structural design, not only can effectively prevent among the test procedure electric rod 6, thermal resistor 7 drops, the stability of test procedure has been guaranteed, the convenience of installation and change has still been improved. When the electric bar 6, the thermal resistance 7 damage or need to change other model electric bar 6, thermal resistance 7, twist off original electric bar 6 or thermal resistance 7, twist on again the electric bar 6 or the thermal resistance 7 of will changing can, the change process is no longer than 1 minute, improves the installation effectiveness greatly.
In this embodiment, the water-cooling plate 4 is a double-sided water-cooling plate, the copper blocks are symmetrically installed on the upper surface and the lower surface of the water-cooling plate 4, and the cooling water in the internal pipeline of the water-cooling plate 4 carries away the heat of the copper blocks on the upper surface and the lower surface of the water-cooling plate 4. The upper surface and the lower surface of the water cooling plate 4 are provided with a plurality of groups of temperature measuring components, and the number of the temperature measuring components is determined according to the design requirement.
As shown in fig. 2 to 3, the upper surface and the lower surface of the water cooling plate 4 are provided with 3 sets of temperature measuring components, and the upper electric heating rods 601 to 606 arranged on the upper surface of the water cooling plate 4 and the lower electric heating rods 607 to 612 arranged on the lower surface of the water cooling plate 4 are connected with the power supply 2 through conducting wires; the upper thermal resistors 701-703 arranged on the upper surface of the water cooling plate 4 and the lower thermal resistors 704-706 arranged on the lower surface of the water cooling plate 4 are connected with the temperature measurement recorder 3 through leads, and the temperature measurement recorder 3 is used for collecting the temperature of the thermal resistor 7 and displaying the measured temperature of the thermal resistor 7 through a display screen; the mounting surfaces of the three copper blocks 5 on the upper surface of the water cooling plate 4 are coated with heat conduction materials and are fixedly connected with the upper surface of the water cooling plate 4 through screws; the mounting surfaces of the three copper blocks 5 on the lower surface of the water cooling plate 4 are coated with heat conduction materials and are fixedly connected with the lower surface of the water cooling plate 4 through screws; the surfaces of the upper electric heating rods 601-606 are coated with heat conducting materials and are divided into three groups, and then the three groups of the upper electric heating rods are respectively inserted into first mounting holes of three copper blocks 5 on the upper surface of the water cooling plate 4, and the upper electric heating rods 601-606 are connected with the copper blocks 5 through threads; the surfaces of the lower electric heating rods 607-612 are coated with heat conducting materials, are divided into three groups and then are respectively inserted into first mounting holes of three copper blocks 5 on the lower surface of the water cooling plate 4, and are connected with the copper blocks 5 through threads of the electric heating rods; the surfaces of the upper thermal resistors 701-703 are coated with heat conducting materials and are respectively inserted into second mounting holes of the three copper blocks 5 on the upper surface of the water cooling plate 4, and the upper thermal resistors 701-703 are connected with the copper blocks 5 through threads; the surfaces of the lower thermal resistors 704-706 are coated with heat conducting materials and are respectively inserted into second mounting holes of the three copper blocks 5 on the lower surface of the water cooling plate 4, and the lower thermal resistors 704-706 are connected with the copper blocks 5 through threads; three heat insulation covers 8 on the upper surface of the water cooling plate 4 are respectively buckled on the three copper blocks 5 from top to bottom to cover five surfaces of the copper blocks 5, and the heat insulation covers 8 on the upper surface of the water cooling plate 4 are fixed on the copper blocks 5 through mounting screws 9; three heat insulation covers 8 on the lower surface of the water cooling plate 4 are respectively buckled on the following three copper blocks 5 from bottom to top to cover five surfaces of the copper blocks 5, and the heat insulation covers 8 on the lower surface of the water cooling plate 4 are fixed on the following copper blocks 5 through mounting screws 9.
Considering that the heating components on the high-power IGBT are not uniformly distributed, the actual heating positions are not uniformly distributed. In this embodiment, the size and the number of the temperature measurement components are determined according to the practical application, the size and the shape of the copper block 5 in different temperature measurement components are matched with the size and the shape of the practical heating component, correspondingly, the arrangement positions of the temperature measurement components on the water cooling plate 4 are the same as the arrangement positions of the practical heating component, and the number and the length of the electric heating rods 6 and the thermal resistors 7 are matched with each other. Illustratively, the size of the copper block 5 is the same as that of a common IGBT module with rated current of 450A, 600A and 800A, and one copper block 5 can simulate the IGBT modules with different current levels. The temperature measurement assembly with the structure has the advantages that the specific size can be set according to actual needs, the simulated heat dissipation condition is closer to the actual condition, and the test result is more accurate
In this embodiment, the electric heating rod 6 has a cylindrical structure or a rectangular structure, and correspondingly, the copper block 5 is correspondingly provided with a circular mounting hole or a rectangular mounting hole. The power of the electric heating rod 6 is 0.1-2 kW, the electric heating rod with proper heating power can be selected according to design requirements, the heat dissipation performance of the water cooling plate 4 to IGBT modules with different heating powers can be tested, and the power grade of the electric heating rod 6 is 100W, 200W, 500W, 1000W, 1500W and 2000W. For example, if the heating power of the upper and lower electric heating rods 6 is 100W, the upper electric heating rod 601 is 100W, the upper electric heating rod 602 is not installed in an empty state or installed but not powered, the lower electric heating rod 607 is 100W, and the lower electric heating rod 608 is not installed in an empty state or installed but not powered; if the heating power of the upper electric heating rod 6 and the lower electric heating rod 6 is 2000W, 1000W is selected for the upper electric heating rod 601, 1000W is selected for the upper electric heating rod 602, 1000W is selected for the lower electric heating rod 607, and 1000W is selected for the lower electric heating rod 608; if the heating power of the upper and lower electric heating rods 6 is 3000W, 1500W is selected for the upper electric heating rod 601, 1500W is selected for the upper electric heating rod 602, 1500W is selected for the lower electric heating rod 607, and 1500W is selected for the lower electric heating rod 608. After the power of the electric bar 6 is selected, after the surface of the electric bar 6 is coated with a heat conduction material, the first mounting hole of the copper block 5 is screwed in, the electric bar 6 is connected to the power supply 2 through a wire, the thermal resistor 7 is screwed in the second mounting hole of the copper block 5, the thermal resistor 7 is connected to the temperature measurement recorder 3 through the wire, the power supply 2 is turned on, the electric bar 6 starts to heat, the temperature measurement recorder 3 collects the temperature of the thermal resistor 7 and displays the measured temperature of the thermal resistor 7 through the display screen.
Compared with the traditional test device adopting ceramics, the test device of the embodiment has remarkable advantages in the aspects of disassembly and assembly time, the total time for completing the average test of one sample, result accuracy, heating temperature similarity and the like, and particularly, the following table 1 is shown.
TABLE 1 comparison data sheet between the testing device of the present invention and the conventional testing device
Figure BDA0002256158130000101
Compared with the prior art, the double-sided water-cooling board heat dispersion testing arrangement that this embodiment provided adopts copper billet 5 to replace traditional pottery and can make the test result more be close to the radiating effect of real IGBT copper heating panel, with in the hot resistance embedding heating device, the hot resistance is located two electric bars in the middle of and is in the copper billet intermediate position, can the temperature of the accurate measurement heating device, the copper billet temperature precision of gathering reaches 0.15 ℃, and show the temperature on the temperature measurement record appearance, conveniently read and record. In addition, the electric bar adopts detachable construction, through the threaded fixation to the copper billet, but the electric bar of the different power of quick replacement also makes things convenient for the electric bar of quick replacement damage, and different heating power that the different heating power combination that changes the electric bar through the selection simulate IGBT module are different, simple to operate, and low cost can quick replacement, and the measuring accuracy is high, possesses stronger convenience and commonality. In addition, the testing device adopts the covering type heat insulation cover to coat the copper block, so that the influence of air convection is effectively prevented, most of heat of the copper block is guaranteed to be dissipated through the water-cooling heat dissipation plate, the actual working state of the IGTB is restored to the maximum extent, and the testing result is more accurate. The size of the copper block which is the same as that of the real IGBT module is selected according to test requirements, the working state of the IGBT module can be truly reproduced, the measured heating temperature of the real IGBT module is compared with the measured heating temperature of the copper block, and the heating temperature similarity rate reaches more than 90%.
Example two
The invention further discloses a method for testing heat dissipation performance of the double-sided water-cooling plate, which is based on the device for testing heat dissipation performance of the double-sided water-cooling plate in the first embodiment and comprises the following steps:
the method comprises the following steps: and (3) connecting the water cooler 1 with a water cooling plate 4 to be tested, and setting the outlet water temperature and the outlet water flow of the water cooler 1.
Step two: and assembling temperature measuring components, and fixedly installing a plurality of temperature measuring components on the upper surface and the lower surface of the water cooling plate 4.
According to the design requirement, an electric heating rod 6 and a thermal resistor 7 with proper heating power are selected.
When the electric heating rod 6 and the thermal resistor 7 are installed in the copper block 5, firstly coating heat conduction material layers on the surfaces of the electric heating rod 6 and the thermal resistor 7, and then respectively installing the electric heating rod 6 and the thermal resistor 7 coated with the heat conduction material layers into a first installation hole and a second installation hole on the copper block 5; or, firstly, heat conducting material layers are sprayed on the inner walls of the first mounting hole and the second mounting hole, and then the electric heating rod 6 and the thermal resistor 7 are respectively installed in the first mounting hole and the second mounting hole coated with the heat conducting material layers. The thickness of the heat conducting material layer can ensure that the electric heating rod 6 and the thermal resistor 7 are respectively arranged in the first mounting hole and the second mounting hole and then are contacted with the copper block 5 through the heat conducting material layer. The copper blocks 5 of the plurality of temperature measuring components are fixedly arranged on the upper surface and the lower surface of the water cooling plate 4 by screws, the heat insulation cover 8 is arranged on the copper blocks 5, five surfaces of the copper blocks 5 are covered, and the copper blocks 5 are fixed by screws. The electric heating bar 6 is connected to the power supply 2 by a lead, and the thermal resistor 7 is connected to the temperature measuring recorder 3 by a lead
Step three: after the temperature measuring assembly is installed, the water chiller 1 and the power supply 2 are turned on, the test is started, the temperature measuring and recording instrument 3 collects and records the temperature of all the thermal resistors 7 in a thermal balance state, and the average temperature T1 of all the thermal resistors 7 is calculated;
step four: in the thermal equilibrium state, the outlet water temperature of the water cooling plate 4 is measured, and the outlet water temperature T2 and the output power P of the power supply 2 are recorded.
Step five: the thermal resistance R of the water cooling plate 4 is calculated by a thermal resistance calculation formula R which is (T2-T1)/P. The value of the thermal resistance R of the water cooling plate 4 reflects the good and bad heat dissipation performance of the water cooling plate, the smaller the value of the thermal resistance R is, the better the heat dissipation performance of the water cooling plate 4 is, and the larger the value of the thermal resistance R is, the worse the heat dissipation performance of the water cooling plate 4 is.
Specifically, after the temperature measuring assembly is installed, the water cooler 1 is firstly turned on, cooling water starts to flow in a circulating mode in the water cooling plate 4, then the power supply 2 is turned on, the electric heating rod 6 starts to heat, and the temperature measuring recorder 3 collects the temperature of the thermal resistor 7 and displays the measured temperature of the thermal resistor 7 through the display screen. Wherein, observe temperature measurement record appearance 3 real-time supervision and record all thermal resistance 7 and be in the temperature data under the thermal equilibrium state, judge whether reach thermal equilibrium, judge according to the temperature that observes a certain thermal resistance no longer rises or descends within 3 minutes, and the temperature fluctuation is within 2 ℃, reaches the thermal equilibrium state promptly. When the temperatures of all the thermal resistors reach stability, the temperatures of all the thermal resistors 7 are measured, the average value T1 is obtained, the water outlet temperature of the water cooling plate is measured, the recorded temperature is T2, and the output power of the power supply 2 is recorded as P. The thermal resistance R of the water cooling plate 4 is calculated by a thermal resistance calculation formula R which is (T2-T1)/P.
Compared with the prior art, the double-sided water-cooling plate heat dissipation performance test method provided by the embodiment has the advantages that the temperature measurement assemblies are arranged on the upper surface and the lower surface of the water-cooling plate, the copper blocks, the electric heating rods, the thermal resistors and the heat insulation covers of the temperature measurement assemblies are of detachable structures, the heat dissipation performance evaluation of the double-sided water-cooling plate under the conditions of different heating powers of the double-sided IGBT module can be quickly realized by accurately testing the temperature of the copper blocks and the temperature of the water-cooling plate, the operation is simple, the test result is accurate, the working state of the IGBT module can be truly reproduced, the measured actual heating temperature of the IGBT module is compared with the measured heating temperature of the copper blocks, and the heating temperature similarity. The test method of this embodiment is based on the heat dissipation performance test device for the double-sided water-cooled panel in the first embodiment, and can achieve the effect of the heat dissipation performance test device for the double-sided water-cooled panel in the first embodiment, which is not described herein again.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.

Claims (10)

1. A double-sided water cooling plate heat dispersion performance testing device is characterized by comprising a water chiller (1), a temperature measuring assembly and a power supply (2); the water outlet and the water inlet of the water cooler (1) are respectively connected with the water inlet and the water outlet of the water cooling plate (4);
the number of the temperature measuring components is at least 2, and the temperature measuring components are fixedly arranged on the upper surface and the lower surface of the water cooling plate (4); the temperature measurement assembly comprises a copper block (5), an electric heating rod (6), a thermal resistor (7), a heat insulation cover (8) and a temperature measurement recorder (3), the electric heating rod (6) and the thermal resistor (7) are embedded in the copper block (5), the electric heating rod (6) is connected with a power supply (2), the thermal resistor (7) is connected with the temperature measurement recorder (3), and the heat insulation cover (8) is buckled on one side of the copper block (5) far away from a water cooling plate (4).
2. The double-sided water-cooled panel heat dissipation performance test device according to claim 1, wherein the copper block (5) is provided with a first mounting hole for mounting the electric heating rod (6) and a second mounting hole for mounting the thermal resistor (7);
the first mounting hole and the second mounting hole are arranged in parallel with the water cooling plate (4).
3. The double-sided water-cooled panel heat dissipation performance testing device according to claim 2, wherein the number of the first mounting holes is 2, and the second mounting hole is located between the 2 first mounting holes.
4. The double-sided water-cooled panel heat dissipation performance test device according to claim 1, wherein the heat insulation cover (8) is fixed on the copper block (5) through a mounting screw (9);
the electric heating rod (6) and the thermal resistor (7) can penetrate out of the side wall mounting opening of the heat insulation cover (8), or the electric heating rod (6) and a lead connected with the thermal resistor (7) can penetrate out of the side wall mounting opening of the heat insulation cover (8).
5. The double-sided water-cooled plate heat dissipation performance test device according to claim 2, wherein a heat conduction material layer is coated between the copper block (5) and the water-cooled plate (4);
the surfaces of the electric heating rod (6) and the thermal resistor (7) are coated with heat conduction material layers, or the inner walls of the first mounting hole and the second mounting hole are provided with heat conduction material layers.
6. The double-sided water-cooled panel heat dissipation performance testing device according to claim 5, wherein the heat conducting material layer is a heat conducting silicone grease layer.
7. The double-sided water-cooled panel heat dissipation performance testing device according to any one of claims 2 to 5, wherein the electric heating rod (6) is in threaded connection with the first mounting hole, and the thermal resistor (7) is in threaded connection with the second mounting hole.
8. A heat radiation performance test method of a double-sided water-cooled plate is characterized in that the heat radiation performance test device of the double-sided water-cooled plate disclosed by claims 1 to 7 is used for testing, and the method comprises the following steps:
the method comprises the following steps: connecting the water cooler (1) with a water cooling plate (4) to be tested, and setting the outlet water temperature and the outlet water flow of the water cooler (1);
step two: assembling temperature measuring components, and fixedly installing a plurality of temperature measuring components on the upper surface and the lower surface of the water cooling plate (4);
step three: after the temperature measurement component is installed, the water cooler (1) and the power supply (2) are turned on, the test is started, the temperature measurement recorder (3) collects and records the temperature of the thermal resistor (7) in a thermal balance state, and the average temperature T1 of the thermal resistor (7) is calculated;
step four: measuring the water outlet temperature of the water cooling plate (4), recording the water outlet temperature T2, and recording the output power P of the power supply (2);
step five: the thermal resistance R of the water cooling plate (4) is calculated by a thermal resistance calculation formula R which is (T2-T1)/P.
9. The method for testing the heat dissipation performance of the double-sided water-cooled plate according to claim 8, wherein in the second step, when the temperature measuring assembly is assembled, the surfaces of the electric heating rod (6) and the thermal resistor (7) are coated with the heat conducting material layer, and then the electric heating rod (6) and the thermal resistor (7) are respectively installed in the first installation hole and the second installation hole of the copper block (5); or, firstly, spraying heat conducting material layers on the inner walls of the first mounting hole and the second mounting hole, and then respectively installing the electric heating rod (6) and the thermal resistor (7) into the first mounting hole and the second mounting hole;
buckling a heat insulation cover (8) on one side of the copper block (5) far away from the water cooling plate (4);
the electric heating rod (6) and the thermal resistor (7) are respectively connected to the power supply (2) and the temperature measuring and recording instrument (3).
10. The method for testing the heat dissipation performance of the double-sided water-cooled panel according to claim 8, wherein in the third step, the criterion for determining that the thermal resistor (7) is in a thermal equilibrium state is as follows: the temperature of the thermal resistor (7) does not rise or fall within 3 minutes, and the temperature fluctuation is within 2 ℃, namely the thermal equilibrium is achieved.
CN201911054349.2A 2019-10-31 2019-10-31 Double-sided water cooling plate heat dissipation performance testing device and testing method Pending CN110672659A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111781234A (en) * 2020-07-02 2020-10-16 西安交通大学 Power electronic integrated module layered cold plate performance test platform and test method
CN111799238A (en) * 2020-07-10 2020-10-20 东风汽车集团有限公司 Double-sided water-cooling IGBT radiator and radiating installation structure thereof
CN114624042A (en) * 2022-03-31 2022-06-14 英业达科技有限公司 Electronic device heat dissipation test system
CN114707190A (en) * 2022-06-06 2022-07-05 中国飞机强度研究所 Modularized extreme high-temperature heating system for testing aerospace plane

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090161721A1 (en) * 2007-12-21 2009-06-25 Thales Method for testing a heat pipe and corresponding test device
CN102262100A (en) * 2011-04-22 2011-11-30 中国电力科学研究院 Novel thermal resistance and flow resistance test device for radiator
CN102435428A (en) * 2011-09-30 2012-05-02 广州高澜节能技术股份有限公司 Test module for simulating heating of IGBT (Insulated Gate Bipolar Transistor) module
CN103630415A (en) * 2013-12-10 2014-03-12 国家电网公司 Heat dissipation performance test system and method of water-cooling heat sink
CN104582426A (en) * 2013-10-28 2015-04-29 联合汽车电子有限公司 Modularized heat dissipation source device, thermal resistance measurement system with same and measurement method
CN106323663A (en) * 2016-09-17 2017-01-11 上海新时达电气股份有限公司 Radiator test platform and radiator test system
CN107085010A (en) * 2017-06-16 2017-08-22 青岛海信日立空调系统有限公司 A kind of refrigerant radiator test device and method
CN108458519A (en) * 2017-01-06 2018-08-28 Abb瑞士股份有限公司 Cooling adjustment system and method for cooling adjustment
CN109406574A (en) * 2019-01-10 2019-03-01 广东工业大学 A kind of flat-plate heat pipe test device and system
CN209496859U (en) * 2019-03-13 2019-10-15 黄山学院 A kind of two-side water cooling encapsulating structure of high power density IGBT module

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090161721A1 (en) * 2007-12-21 2009-06-25 Thales Method for testing a heat pipe and corresponding test device
CN102262100A (en) * 2011-04-22 2011-11-30 中国电力科学研究院 Novel thermal resistance and flow resistance test device for radiator
CN102435428A (en) * 2011-09-30 2012-05-02 广州高澜节能技术股份有限公司 Test module for simulating heating of IGBT (Insulated Gate Bipolar Transistor) module
CN104582426A (en) * 2013-10-28 2015-04-29 联合汽车电子有限公司 Modularized heat dissipation source device, thermal resistance measurement system with same and measurement method
CN103630415A (en) * 2013-12-10 2014-03-12 国家电网公司 Heat dissipation performance test system and method of water-cooling heat sink
CN106323663A (en) * 2016-09-17 2017-01-11 上海新时达电气股份有限公司 Radiator test platform and radiator test system
CN108458519A (en) * 2017-01-06 2018-08-28 Abb瑞士股份有限公司 Cooling adjustment system and method for cooling adjustment
CN107085010A (en) * 2017-06-16 2017-08-22 青岛海信日立空调系统有限公司 A kind of refrigerant radiator test device and method
CN109406574A (en) * 2019-01-10 2019-03-01 广东工业大学 A kind of flat-plate heat pipe test device and system
CN209496859U (en) * 2019-03-13 2019-10-15 黄山学院 A kind of two-side water cooling encapsulating structure of high power density IGBT module

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
孙凤玉: "高功率半导体用水冷板的数值分析和试验研究,孙凤玉", 《电力电子技术》 *
张龙燕等: "交流装置液冷板性能的数值模拟与试验研究", 《中南大学学报(自然科学版)》 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111781234A (en) * 2020-07-02 2020-10-16 西安交通大学 Power electronic integrated module layered cold plate performance test platform and test method
CN111799238A (en) * 2020-07-10 2020-10-20 东风汽车集团有限公司 Double-sided water-cooling IGBT radiator and radiating installation structure thereof
CN114624042A (en) * 2022-03-31 2022-06-14 英业达科技有限公司 Electronic device heat dissipation test system
CN114707190A (en) * 2022-06-06 2022-07-05 中国飞机强度研究所 Modularized extreme high-temperature heating system for testing aerospace plane

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