CN114624042A

CN114624042A - Electronic device heat dissipation test system

Info

Publication number: CN114624042A
Application number: CN202210345687.7A
Authority: CN
Inventors: 孙可; 方奇; 邬将军; 项品义
Original assignee: Inventec Pudong Technology Corp; Inventec Corp
Current assignee: Inventec Pudong Technology Corp; Inventec Corp
Priority date: 2022-03-31
Filing date: 2022-03-31
Publication date: 2022-06-14

Abstract

The invention provides a heat dissipation test system of an electronic device, which comprises a device shell, at least one heating module, a power supply module, a power regulation and control module and at least one temperature sensor. The heating module is arranged in the device shell and is thermally connected with a cold plate type heat dissipation module to provide simulation heat energy. The power supply module is electrically connected to the heating module for supplying power to the heating module. The power regulating module is electrically connected with the heating module and the power supply module and is used for regulating and controlling the operation power of the heating module under operation so as to regulate and control the simulation heat energy to be the same as a working heat energy generated when an electronic element operates. The temperature sensor is used for detecting the temperature of the heating module so as to analyze the heat dissipation efficiency of the cold plate type heat dissipation module.

Description

Electronic device heat dissipation test system

Technical Field

The present invention relates to heat dissipation testing systems, and more particularly to a heat dissipation testing system for an electronic device.

Background

In recent years, due to the development of technology, many new electronic devices or software programs have been developed, and these electronic devices or software programs also need to be supported by a processor (i.e., a chip) with more enhanced functions, so that the chip design and manufacturing process are further advanced.

However, while the chip functions are more powerful and perfect, the heat generated during the operation of the chip is more and more generated, and thus, the heat dissipation design of the chip is also more rigorous.

Referring to fig. 1 to 3, fig. 1 is a schematic perspective view illustrating a chip disposed on a heat dissipation device in the prior art; FIG. 2 is a perspective view of a prior art chip mounted on a heat sink from another perspective; fig. 3 is a schematic cross-sectional view of a heat dissipation device and a chip in the prior art. As shown in fig. 1 to fig. 3, generally, some servers need to install a plurality of graphics processors PA100 (only one is labeled in the figures), and therefore, the heat dissipation device PA200 of these servers is usually designed to dissipate heat of a plurality of graphics processors PA100 at the same time, and therefore, in order to ensure that the heat dissipation device PA200 can reliably dissipate heat of these graphics processors PA100 during actual operation, a plurality of graphics processors PA100 are usually prepared to be tested in cooperation with the heat dissipation device PA 200.

However, since the cost of the graphic processor PA100 is high and the production cycle is long, when the heat dissipation device PA200 needs to perform a heat dissipation test, the conventional heat dissipation test is not only costly to perform, but also takes a long time to manufacture, which is inconvenient. In addition, when the specifications of the chips to be tested are different, the chips need to be additionally assembled and disassembled, which easily causes the damage of the chips.

Disclosure of Invention

In view of the foregoing, in the prior art, since most servers are configured with a plurality of processors, the required heat dissipation device also needs to dissipate heat of the plurality of processors at the same time, and in order to ensure the heat dissipation effect of the heat dissipation device, a plurality of processors are generally prepared for actual measurement, however, the cost of the processors is high, and the time taken for manufacturing is also long, which results in relatively high overall cost of the heat dissipation device for performing the heat dissipation test; therefore, a primary objective of the present invention is to provide a heat dissipation testing system for an electronic device, which can simulate the heat generated by the processor during operation to effectively perform a heat dissipation test on the heat dissipation device, so as to reduce the cost and improve the testing efficiency.

The present invention provides a heat dissipation testing system for an electronic device, for testing the heat dissipation performance of a cold plate type heat dissipation module, wherein the cold plate type heat dissipation module is thermally connected to at least one electronic component for dissipating at least one working heat generated by the electronic component during operation, and the heat dissipation testing system comprises a device housing, at least one heat generating module, a power supply module, a power regulation and control module, and at least one temperature sensor.

The device shell is provided with an accommodating space. The heating module is arranged in the accommodating space and is thermally connected with the cold plate type heat dissipation module to provide at least one simulation heat energy which is the same as the working heat energy. The power supply module is electrically connected to the heating module for supplying power to the heating module.

The power regulating module is arranged in the device shell, is electrically connected with the heating module and the power supply module, and is used for regulating and controlling the operating power of the heating module under operation so as to regulate and control the simulation heat energy to be the same as the working heat energy. The temperature sensor is thermally connected to the heating module and used for detecting the temperature of the heating module so as to analyze the heat dissipation efficiency of the cold plate type heat dissipation module.

In an auxiliary technical means derived from the above-mentioned necessary technical means, the heat generating module further comprises an insulating base and a heat generating component. The insulating base is arranged in the accommodating space. The heating component comprises a lower heat conducting plate, at least one heating sheet and an upper heat conducting plate. The lower heat conducting plate is arranged on the insulating base. The heating sheet is arranged on the lower heat conducting plate. The upper heat conducting plate is arranged on the lower heat conducting plate and covers the heating sheet.

In a subsidiary technical means derived from the above-mentioned essential technical means, the power control module further comprises at least one converter and at least one power control knob. The converter is electrically connected to the power supply module and the heating module. The power adjusting knob is electrically connected to the converter and used for adjusting and controlling the operating power of the heating module. Preferably, the power control module further comprises at least one power meter and at least one power display. The power meter is electrically connected to the converter and used for detecting the operating power of the heating module. The power display is electrically connected to the power meter and used for displaying the operating power of the heating module.

In an auxiliary technical means derived from the above-mentioned necessary technical means, the power supply module further includes at least one power interface and at least one power switch, the power interface is used for plugging an external power source, and the power switch is electrically connected to the power interface correspondingly for controlling the on/off of the power interface.

In an auxiliary technical means derived from the above-mentioned necessary technical means, the device housing includes a bottom plate, two side plates, a front baffle and a rear baffle, the two side plates are respectively integrally connected to two sides of the bottom plate, the front baffle is fixedly connected to one end of the bottom plate and one end of the two side plates, and the rear baffle is fixedly connected to the bottom plate and the other end of the two side plates opposite to the front baffle to enclose the accommodating space. Preferably, one of the two side plates further has a cooling tube support for supporting a cooling tube of the cold plate type heat dissipation module. In addition, the rear baffle plate is also provided with a pipeline setting port adjacent to the cooling pipe bracket, and the cooling pipe penetrates through the pipeline setting port.

As mentioned above, the present invention mainly utilizes the heating module to provide the simulated heat energy which is the same as the working heat energy generated by the electronic component during operation, and utilizes the cold plate type heat dissipation module to test the heat dissipation efficiency by dissipating the simulated heat energy.

The present invention will be further described with reference to the following embodiments and drawings.

Drawings

FIG. 1 is a perspective view illustrating a prior art chip mounted on a heat dissipation device;

FIG. 2 is a perspective view of a prior art chip mounted on a heat sink from another perspective;

FIG. 3 is a cross-sectional view of a heat dissipation device and a chip according to the prior art;

FIG. 4 is a perspective view of an electronic device heat dissipation testing system according to a preferred embodiment of the present invention;

FIG. 5 is a perspective view of another perspective of the heat dissipation testing system of an electronic device according to the preferred embodiment of the invention;

FIG. 6 is a perspective exploded view of the heat dissipation testing system of an electronic device according to the preferred embodiment of the present invention;

FIG. 7 is a perspective exploded view of a heating module according to a preferred embodiment of the present invention;

FIG. 8 is a block diagram of a system for testing heat dissipation of an electronic device according to a preferred embodiment of the present invention; and

FIG. 9 is a cross-sectional view of an electronic device heat dissipation testing system according to a preferred embodiment of the present invention;

PA100, graphics processor;

PA200 is a heat sink;

100, an electronic device heat dissipation test system;

1, a device shell;

11, a bottom plate;

12,13, side plates;

121, cooling pipe support;

14, a front baffle plate;

15, a rear baffle;

16, an upper cover plate;

151, pipeline setting port;

2, a circuit board;

3, a heating module;

31, an insulating base;

311, a lead fixing groove;

32,32a is a heating component;

321 lower heat conducting plate;

3211 arranging a groove on the heating sheet;

3212, arranging a groove for the temperature sensor;

322, a heating sheet;

3221 heating sheet body;

3222 heating sheet lead wire;

323 an upper heat-conducting plate;

3231 arranging a temperature sensor in a groove;

4, a power supply module;

41, a power interface;

42, a power switch;

5, a power regulation module;

51, a converter;

52, a power adjusting knob;

53, a power meter;

54, a power display;

6, a temperature sensor;

200, a cold plate type heat dissipation module;

201,202 cooling plate body;

203,204 cooling pipes;

300: a power supply source;

400, a display module;

s, an accommodating space.

Detailed Description

Referring to fig. 4 to 9, fig. 4 is a schematic perspective view illustrating an electronic device heat dissipation testing system according to a preferred embodiment of the invention; FIG. 5 is a perspective view of another perspective of the heat dissipation testing system of an electronic device according to the preferred embodiment of the invention; FIG. 6 is a schematic perspective exploded view of an electronic device heat dissipation testing system according to a preferred embodiment of the invention; FIG. 7 is a perspective exploded view of a heating module according to a preferred embodiment of the present invention; FIG. 8 is a system block diagram illustrating a system for testing heat dissipation of an electronic device according to a preferred embodiment of the present invention; fig. 9 is a schematic cross-sectional view of a heat dissipation testing system for an electronic device according to a preferred embodiment of the invention.

As shown in fig. 4 to 9, a heat dissipation testing system 100 for an electronic device includes a device housing 1, a circuit board 2, a plurality of heat generating modules 3 (only one is labeled in the figure), a power supply module 4, a power conditioning module 5, and a plurality of temperature sensors 6 (only one is labeled in the figure). The heat dissipation testing system 100 of the electronic device of the present embodiment is used to test the heat dissipation performance of a cold plate heat dissipation module 200, and the cold plate heat dissipation module 200 is practically used to be thermally connected to at least one electronic component (not shown) to dissipate at least one working heat generated by the electronic component during operation.

The device housing 1 includes a bottom plate 11, two

side plates

12 and 13, a front baffle 14, a rear baffle 15 and an upper cover plate 16. The two

side plates

12 and 13 are integrally connected to two sides of the bottom plate 11, the front baffle plate 14 is fixed to one end of the bottom plate 11 and the two

side plates

12 and 13, and the rear baffle plate 15 is fixed to the other end of the bottom plate 11 and the two

side plates

12 and 13 opposite to the front baffle plate 14. The bottom plate 11, the two

side plates

12 and 13, the front baffle 14 and the rear baffle 15 form an accommodation space S. The upper cover 16 covers the two

side plates

12 and 13, the front baffle 14 and the rear baffle 15 to enclose the accommodating space S. In addition, the side plate 12 further has a cooling tube support 121, and the back plate 15 further has a tube installation opening 151 adjacent to the cooling tube support 121, the cooling tube support 121 is used for supporting two cooling

tubes

203 and 204 of the cold plate type heat dissipation module 200, and the two

cooling tubes

203 and 204 are further disposed through the tube installation opening 151.

The circuit board 2 is mounted on the base plate 11. The heat generating module 3 includes an insulating base 31 and a heat generating component 32. The insulating base 31 is fixed on the circuit board 2 and has two lead fixing slots 311 (only one is labeled in the figure). In the present embodiment, the insulating base 31 is made of a plastic material, such as phenolic resin.

The heat generating component 32 includes a lower heat conducting plate 321, four heat generating sheets 322 (only one is labeled in the figure), and an upper heat conducting plate 323. The lower heat conducting plate 321 is fixed to the insulating base 31, and is provided with two heat generating sheet installation grooves 3211 (only one is labeled in the figure), and one of the two heat generating sheet installation grooves 3211 is further provided with a temperature sensor installation groove 3212.

The four heating sheets 322 are arranged in the two heating sheet arranging grooves 3211; each of the heat generating sheets 322 includes a heat generating sheet body 3221 and two heat generating sheet leads 3222, and in this embodiment, each of the heat generating sheet setting grooves 3211 can accommodate two of the heat generating sheet bodies 3221, and the heat generating sheet leads 3222 of the four heat generating sheets 322 are respectively disposed in the lead fixing groove 311.

The upper heat conducting plate 323 covers the four heating sheet bodies 3221 and is fixedly connected to the lower heat conducting plate 321 to clamp and fix the four heating sheet bodies 3221 with the lower heat conducting plate 321; wherein, the upper heat conducting plate 323 is provided with a temperature sensor installation groove 3231.

In this embodiment, the heating plate bodies 3221 are resistance sheets made of ceramic, and can conduct electricity to generate heat through the heating plate leads 3222, and the upper heat conducting plate 323 and the lower heat conducting plate 321 are copper plates with good heat conduction performance, so that when the four heating plate bodies 3221 are energized, heat energy generated by the four heating plate bodies 3221 can be effectively conducted to the upper heat conducting plate 323 and the lower heat conducting plate 321, and further, the whole heating assembly 32 can effectively provide a simulated heat energy; wherein, the four heat generating sheets 322 are arranged in parallel with each other.

In addition, the heat dissipation testing system 100 of the electronic device of the present embodiment further includes six heat generating elements 32a (only one of which is labeled in the figure), the structure of the heat generating element 32a is similar to that of the heat generating element 32 described above, and the difference is that the heat generating element 32a is not disposed on the insulating base 31 but is directly mounted on the circuit board 2, and in the present embodiment, the electronic component simulated by the heat generating element 32 is a Graphics Processing Unit (GPU), and the electronic component simulated by the heat generating element 32a is an NVSwitch chip for connecting a plurality of GPUs; the six heating components 32a are arranged in parallel, and each heating component 32a is formed by connecting two heating sheets (not shown) in series.

As mentioned above, when the cold plate type heat dissipation module 200 is installed in the device housing 1, the heating element 32 and the heating element 32a are also respectively thermally connected to the

cooling plate bodies

201 and 202 of the cold plate type heat dissipation module 200.

The power supply module 4 includes five power interfaces 41 (only one is shown) and five power switches 42 (only one is shown). Five power interfaces 41 and five power switches 42 are respectively disposed on the rear bezel 15. The power source interface 41 is used for plugging a power source 300, and each power switch 42 corresponds to one power source interface 41 for individually controlling the on/off of each power source interface 41.

The power control module 5 is disposed on the front bezel 14, and includes five converters 51 (only one is shown), five power adjusting knobs 52 (only one is shown), five power meters 53 (only one is shown), and five power displays 54 (only one is shown).

The converter 51 is electrically connected to the power interface 41 and the heat generating module 3. In the present embodiment, five converters 51 are electrically connected to five power interfaces 41 respectively, and four converters 51 respectively and correspondingly supply power to two heating modules 3, so that the four power interfaces 41 supply power to eight heating modules 3, and the remaining converter 51 is electrically connected to the six heating elements 32a, so that the remaining power interface 41 supplies power to the six heating elements 32 a; two heat generating modules 3 connected to the same converter 51 are arranged in parallel.

In addition, in the present embodiment, the power supply 300 is an ac power source, and the converter 51 is an ac converter, which can regulate the output current and voltage.

The power adjusting knob 52 is electrically connected to the converter 51 for adjusting the output power from the heating module 3 to the heating module 3, and further controlling the operating power of the heating module 3, so as to adjust the simulated heat generated by the heating element 32 to be the same as the simulated working heat of the electronic component.

The power meter 53 is electrically connected to the converter 51 for detecting the operating power of the heat generating module 3. The power display 54 is electrically connected to the power meter 53 for displaying the operating power of the heating module 3.

The plurality of temperature sensors 6 are disposed in the temperature sensor arrangement grooves 3212 and the temperature sensor arrangement grooves 3231 of the plurality of heat generating components 32, and are thermally connected to each of the heat generating components 32 to sense a temperature of each of the heat generating components 32; in addition, the heating element 32a is also provided with a temperature sensor installation groove (not shown) for installing the temperature sensor 6.

As mentioned above, the plurality of temperature sensors 6 are further electrically connected to a display module 400, so as to display the temperature of each of the

heating elements

32 and 32a through the display module 400, thereby allowing a user to analyze the heat dissipation performance of the cold plate type heat dissipation module 200.

In practical use, a user may first adjust the power adjustment knob 52 on the front baffle 14 to a minimum value, turn off all the power switches 42 on the rear baffle 15, then turn on the cold plate heat dissipation module 200, and then turn on the power switches 42 and the power adjustment knob 52 to start heating the

heating element

32 or 32a, at this time, the

heating element

32 or 32a may be controlled at a target operating power through the power adjustment knob 52, and finally measure the temperature through the temperature sensor 6, so as to perform an effective heat dissipation test.

To sum up, compared with the prior art that multiple processors are required to perform actual measurement when performing a heat dissipation test on a heat dissipation device, which results in high overall test cost, the heat dissipation test system of the electronic device of the present invention mainly utilizes a heating module with a simple structure and low manufacturing cost to provide simulated heat energy identical to working heat energy generated when an electronic component operates, and utilizes a cold plate type heat dissipation module to test heat dissipation efficiency by dissipating the simulated heat energy, so that not only actual electronic components need not be prepared, but also the heat dissipation test can be effectively performed on the cold plate type heat dissipation module, thereby greatly reducing the cost required by the heat dissipation test, and further improving the test efficiency because additional production and replacement of electronic components are not required.

In addition, because the power supply module and the power regulation and control module of the heat dissipation test system of the electronic device of the invention individually supply power to at least one of the groups of heating modules, when one group of heating modules, the power supply module or the power regulation and control module fails, the test of other groups cannot be influenced, and the reliability is effectively improved.

The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the claims.

Claims

1. A heat dissipation testing system for an electronic device, for testing heat dissipation performance of a cold plate heat dissipation module, the cold plate heat dissipation module being thermally connected to at least one electronic component for dissipating at least one working heat generated by the at least one electronic component during operation, the heat dissipation testing system comprising:

a device shell with a containing space;

the at least one heating module is arranged in the accommodating space, is thermally connected with the cold plate type heat dissipation module and is used for providing at least one simulated heat energy which is the same as the at least one working heat energy;

the power supply module is electrically connected with the at least one heating module and used for supplying power to the at least one heating module;

the power regulation and control module is arranged in the device shell, is electrically connected with the at least one heating module and the power supply module, and is used for regulating and controlling the operation power of the at least one heating module under operation so as to regulate and control the simulation heat energy to be the same as the working heat energy; and

the temperature sensor is thermally connected to the at least one heating module and used for detecting the temperature of the at least one heating module so as to analyze the heat dissipation efficiency of the cold plate type heat dissipation module.

2. The system according to claim 1, wherein the at least one heat generating module comprises:

the insulating base is arranged in the accommodating space; and

a heat generating assembly comprising:

a lower heat conducting plate arranged on the insulating base;

at least one heating sheet arranged on the lower heat conducting plate; and

an upper heat conducting plate arranged on the lower heat conducting plate and covering the at least one heating sheet.

3. The system for testing heat dissipation of an electronic device of claim 1, wherein the power management module further comprises:

at least one converter electrically connected to the power supply module and the at least one heating module; and

and the power adjusting knob is electrically connected with the at least one converter and used for adjusting and controlling the operating power of the at least one heating module.

4. The system according to claim 3, wherein the power management module further comprises:

the power meter is electrically connected with the at least one converter and used for detecting the operating power of the at least one heating module; and

and the power display is electrically connected with the at least one power meter and used for displaying the operating power of the at least one heating module.

5. The system of claim 1, wherein the power supply module further comprises at least one power interface and at least one power switch, the at least one power interface is used for connecting an external power source, and the at least one power switch is correspondingly electrically connected to the at least one power interface for controlling on/off of the at least one power interface.

6. The system according to claim 1, wherein the device housing comprises a bottom plate, two side plates, a front baffle and a rear baffle, the two side plates are integrally connected to two sides of the bottom plate, the front baffle is fixedly connected to one ends of the bottom plate and the two side plates, and the rear baffle is fixedly connected to the other ends of the bottom plate and the two side plates opposite to the front baffle, so as to enclose the accommodating space.

7. The system as claimed in claim 6, wherein one of the two side plates further has a cooling tube holder for holding a cooling tube of the cold plate type heat dissipation module.

8. The system according to claim 7, wherein the back plate further defines a tube opening adjacent to the cooling tube support, and the cooling tube is inserted through the tube opening.