CN221306331U - Core board assembly and chip prototype verification apparatus - Google Patents

Abstract

A core board assembly and a chip prototype verification apparatus are disclosed. Wherein the core plate assembly comprises: a first support frame having a plurality of hollow regions; the first support frame carries each core plate and is fixedly connected with each core plate, and different core plates cover different hollow areas; a plurality of first heat sinks, different first heat sinks passing through different hollow areas, and each first heat sink being disposed on a corresponding core board; the bottom plate bears the first supporting frame and is fixedly connected with the first supporting frame, and the bottom plate is further electrically connected with each core plate respectively. By adopting the embodiment of the disclosure, the stable fixing, heat dissipation and interconnection of a plurality of core boards included in the chip prototype verification device can be effectively realized.

Description

Core board assembly and chip prototype verification apparatus

Technical Field

The present disclosure relates to chip technology, and more particularly, to a core board assembly and a chip prototype verification apparatus.

Background

In general, before a chip is marketed, it is necessary to simulate the function and application environment of the chip and verify the chip, and the process is generally applied to a chip prototype verification apparatus. Therefore, the performance of the chip prototype verification apparatus is a key to ensuring that chips are rapidly marketed.

Disclosure of utility model

The present disclosure is presented in order to ensure stable fixing, heat dissipation, and interconnection of a plurality of core boards included in a chip prototype verification apparatus. Embodiments of the present disclosure provide a core board assembly and a chip prototype verification apparatus.

According to one aspect of an embodiment of the present disclosure, there is provided a core board assembly comprising:

A first support frame having a plurality of hollow regions;

The first support frames bear each core plate and are fixedly connected with each core plate, and different core plates cover different hollow areas;

A plurality of first heat sinks, different ones of the first heat sinks passing through different ones of the hollow regions, and each of the first heat sinks being disposed at a corresponding one of the core boards;

The bottom plate bears the first supporting frame and is fixedly connected with the first supporting frame, and the bottom plate is also respectively and electrically connected with each core plate.

According to another aspect of an embodiment of the present disclosure, there is provided a chip prototype verification apparatus including:

The core plate assembly described above;

The device comprises a device shell, wherein the core plate assembly is positioned in the device shell, and a first supporting frame in the core plate assembly is fixedly connected with the device shell.

Based on the core board assembly and the chip prototype verification apparatus provided by the above embodiments of the present disclosure, the first support frame may bear each core board and is fixedly connected with each core board, so that stable fixing of a plurality of core boards may be achieved through the first support frame. The first support frame can be provided with a plurality of hollow areas, so that the plurality of first radiators can be avoided, normal installation of the plurality of first radiators is guaranteed, and heat dissipation is achieved for the plurality of core plates through the plurality of first radiators. The bottom plate can bear first braced frame and with first braced frame fixed connection, so, can realize through the bottom plate that first braced frame's stable is fixed to be favorable to guaranteeing the stable of polylith core board to the bottom plate is connected with every core board electricity respectively, so, can realize the interconnection of polylith core board through the bottom plate. Therefore, by adopting the embodiment of the disclosure, the stable fixing, heat dissipation and interconnection of a plurality of core boards included in the chip prototype verification apparatus can be effectively realized by a simpler structure.

The technical scheme of the present disclosure is described in further detail below through the accompanying drawings and examples.

Drawings

Fig. 1 is an exploded structural schematic view of a core plate assembly provided by some exemplary embodiments of the present disclosure.

Fig. 2 is a schematic structural view of an assembly of a core board and a first heat sink in some exemplary embodiments of the present disclosure.

Fig. 3 is a schematic structural view of a base plate in some exemplary embodiments of the present disclosure.

Fig. 4 is a schematic view of a mounting structure of a first heat sink in some exemplary embodiments of the present disclosure.

Fig. 5 is a schematic diagram of an assembly structure of a chip prototype verification apparatus according to some exemplary embodiments of the present disclosure.

Fig. 6 is an exploded view of a chip prototype verification apparatus according to some exemplary embodiments of the present disclosure.

Fig. 7 is a schematic view of a mounting structure of a second heat sink in some exemplary embodiments of the present disclosure.

Detailed Description

Hereinafter, example embodiments according to the present disclosure will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present disclosure and not all of the embodiments of the present disclosure, and that the present disclosure is not limited by the example embodiments described herein.

In the description of the present disclosure, the azimuth or positional relationship indicated by the terms "upper", "lower", "left", "right", etc., are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the apparatus referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present disclosure.

In the description of the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.

Summary of the application

In general, before a chip is marketed, it is necessary to simulate the function and application environment of the chip and verify the chip, and the process is generally applied to a chip prototype verification apparatus.

The core board is an important component for realizing chip verification in the chip prototype verification device. With the increasing of chip functions and integration level, the number of core boards in the chip prototype verification apparatus is increasing, and power consumption is increasing, so that in order to ensure the performance of the chip prototype verification apparatus, stable fixing, heat dissipation and interconnection of the core boards are required to be ensured. How to ensure stable fixing, heat dissipation and interconnection of these core boards is a matter of concern to those skilled in the art.

Exemplary Structure

Embodiments of the present disclosure provide a core board assembly. The core board assembly may be applied to a chip prototype verification apparatus. As shown in fig. 1, the core board assembly may include:

a first support frame 10, the first support frame 10 having a plurality of hollow regions 12;

A plurality of core plates 20, the first support frame 10 carrying each core plate 20 and being fixedly connected to each core plate 20, and different core plates 20 shielding different hollow areas 12;

A plurality of first heat sinks 30, different first heat sinks 30 passing through different hollow regions 12, and each first heat sink 30 being disposed at a respective core board 20;

the bottom plate 40, the bottom plate 40 bears the first support frame 10 and is fixedly connected with the first support frame 10, and the bottom plate 40 is also electrically connected with each core plate 20 respectively.

Alternatively, the first support frame 10 may be a frame structure capable of functioning as a support. The plurality of hollow regions 12 provided in the first support frame 10 may be N hollow regions 12.N may be an integer greater than or equal to 2. For example, N may be 2, 4, 5, 8, 10, or other values not expressly recited herein. The N hollow regions 12 may be the same or different in size.

Alternatively, the core board assembly may include a plurality of core boards 20 of N core boards 20. The N core boards 20 may be PCBA; the English full name of the PCBA is Printed Circuit Board Assembly, and the PCBA can refer to a finished circuit board which completes the technological processes of loading or inserting and the like. The N core plates 20 may be fixed to the top of the first support frame 10, so that the first support frame 10 can carry the N core plates 20 on top thereof. Each core plate 20 of the N core plates 20 may cover one hollow region 12, so that each of the N hollow regions 12 can be covered.

Alternatively, the plurality of first heat sinks 30 included in the core board assembly may be N first heat sinks 30. The N first heat sinks 30 may each belong to a fin type heat sink. The N first heat sinks 30 may be manufactured by using aluminum profiles. Each of the N first heat sinks 30 may pass through one of the hollow regions 12 and be disposed on the core board 20 that blocks the hollow region 12, and thus, each of the N first heat sinks 30 may be regarded as being flip-chip placed.

Alternatively, the first support frame 10 may be fixed to the top of the bottom plate 40, so that the bottom plate 40 can carry the first support frame 10 on its top. The backplane 40 may be electrically connected to the N core boards 20, respectively, so that the backplane 40 may be used for transit transmission of signals between the N core boards 20, thereby implementing interconnection of the N core boards 20.

Based on the core board assembly provided by the embodiment of the present disclosure, the first support frame 10 may carry each core board 20 and be fixedly connected with each core board 20, so that stable fixing of a plurality of core boards 20 may be achieved through the first support frame 10. The first support frame 10 may have a plurality of hollow areas 12, so that the plurality of first heat sinks 30 may be avoided, and normal installation of the plurality of first heat sinks 30 is ensured, so as to dissipate heat for the plurality of core boards 20 through the plurality of first heat sinks 30. The bottom plate may carry the first support frame 10 and be fixedly connected with the first support frame 10, so that stable fixing of the first support frame 10 may be achieved through the bottom plate 40, thereby being beneficial to ensuring stable fixing of the plurality of core boards 20, and the bottom plate 40 is electrically connected with each core board 20, respectively, so that interconnection of the plurality of core boards 20 may be achieved through the bottom plate 40. Therefore, with the embodiments of the present disclosure, stable fixing, heat dissipation, and interconnection of the plurality of core boards 20 included in the chip prototype verification apparatus can be effectively achieved by a relatively simple structure.

In some alternative examples, as shown in fig. 1, the first support frame 10 may include:

The first plate body 101, the second plate body 102, the third plate body 103 and the fourth plate body 104 are sequentially connected end to end, a hollow first enclosing area is formed by enclosing the first plate body 101, the second plate body 102, the third plate body 103 and the fourth plate body 104, the first plate body 101 and the third plate body 103 are oppositely arranged, and the second plate body 102 and the fourth plate body 104 are oppositely arranged;

At least one beam dividing the first enclosed region into a plurality of hollow regions 12.

Alternatively, the first plate 101 and the third plate 103 may be parallel. The second plate 102 and the fourth plate 104 may be parallel. The shape of the first enclosing region formed by enclosing the first plate 101, the second plate 102, the third plate 103 and the fourth plate 104 may include, but is not limited to, rectangular, circular, diamond, etc., and is not specifically described herein.

Alternatively, the at least one beam included in the first support frame 10 may be M beams. M may be an integer greater than or equal to 1. For example, M may be 1, 2, 3, 4, or other values not expressly recited herein.

In some alternative embodiments of the present disclosure, as shown in fig. 1, the number of beams may be two (i.e., M is 2), where one beam is the first beam 105 and the other beam is the second beam 106;

The first beam 105 and the second beam 106 are arranged in the first enclosing area in a crossing manner;

the first beam 105 extends from the first plate 101 to the third plate 103;

the second beam 106 extends from the second plate 102 to the fourth plate 104.

Alternatively, one end of the first beam 105 may be fixed to an edge of the first plate body 101 facing the third plate body 103, and the other end of the first beam 105 may be fixed to an edge of the third plate body 103 facing the first plate body 101. The first beam 105 may be perpendicular to the first plate 101 and the third plate 103, respectively.

Alternatively, one end of the second beam 106 may be fixed to an edge of the second plate 102 facing the fourth plate 104, and the other end of the second beam 106 may be fixed to an edge of the fourth plate 104 facing the second plate 102. The second beam 106 may be perpendicular to the second plate 102 and the fourth plate 104, respectively. In addition, the second beam 106 may be perpendicular to the first beam 105.

In this way, through the arrangement of the first cross beam 105 and the second cross beam 106, the first enclosing area can be divided into four relatively independent small areas by a large area, each small area can be used as a hollow area 12, avoidance of one first radiator 30 can be realized by each small area, and interference between different first radiators 30 is not easy to occur.

In fig. 1, the number of the first beam 105 and the second beam 106 is one, and in a specific implementation, the number of at least one of the first beam 105 and the second beam 106 may be one or more. For example, the number of the first beams 105 may be one, and the number of the second beams 106 may be two, so that the first enclosing region may be divided into six relatively independent small regions by one large region.

In the embodiment of the disclosure, the first supporting frame 10 is composed of a plurality of plate bodies and a plurality of cross beams, the whole structure of the first supporting frame 10 is simple, and the plurality of first heat sinks 30 can be reasonably arranged and are not easy to interfere with each other.

In some alternative examples, as shown in fig. 1, at least one beam may include a first beam 105 extending from the first plate 101 to the third plate 103;

The bottom plate 40 includes:

The fifth plate body 401 and the sixth plate body 402, the fifth plate body 401 extends along the first direction, the fifth plate body 401 carries the first plate body 101, the sixth plate body 402 is arranged at the edge of the fifth plate body 401, the sixth plate body 402 extends along the second direction, the sixth plate body 402 carries the first beam 105, and the sixth plate body 402 is electrically connected with each core plate 20 respectively;

wherein, the first direction is: the direction consistent with the connecting line direction of the second plate 102 and the fourth plate 104 is: a direction which coincides with the direction of the line connecting the first plate body 101 and the third plate body 103.

For convenience of description, the wiring direction of the second plate 102 and the fourth plate 104 will be referred to as a wiring direction a, and the wiring direction of the first plate 101 and the third plate 103 will be referred to as a wiring direction B.

Alternatively, the first plate 101 may be fixed to the top of the fifth plate 401, so that the first plate 101 can carry the first plate 101 on top thereof. The fifth plate 401 may extend in a first direction that coincides with the wiring direction a. The first direction coinciding with the wiring direction a can be understood as: the first direction is parallel to the connection line direction a.

Alternatively, the first beam 105 may be fixed to the top of the sixth plate 402, such that the sixth plate 402 is capable of carrying the first beam 105 on top thereof. The sixth plate 402 may extend in a second direction that coincides with the wire direction B. The second direction coinciding with the wiring direction B can be understood as: the second direction is parallel to the connecting line direction B.

Alternatively, the sixth plate 402 may be perpendicular to the fifth plate 401. The bottom plate 40 including the fifth plate body 401 and the sixth plate body 402 may have a T-shaped structure as a whole.

In the embodiment of the disclosure, the first plate 101 may be fixed and carried by the fifth plate 401, and the first beam 105 may be fixed and carried by the sixth plate 402, so that the entire first support frame 10 may be firmly fixed by the bottom plate 40 having a T-shaped structure. Further, the sixth board 402 is electrically connected to each core board 20, respectively, so that interconnection of a plurality of core boards 20 can be achieved by the sixth board 402.

In some of the alternative examples of the present invention,

Each core board 20 is provided with a first connector 201 shown in fig. 2;

The first cross member 105 is provided with a first escape hole 1051 shown in fig. 1 corresponding to the first connector 201;

The sixth plate 402 is provided with a second connector 4021 shown in fig. 1 corresponding to the first escape hole 1051, and the first escape hole 1051 is used for passing at least part of the first connector 201 and/or at least part of the second connector 4021 so as to electrically connect the first connector 201 with the second connector 4021.

Alternatively, the first connector 201 may be provided at the bottom of the core board 20 (with respect to fig. 1). The second connector 4021 may be provided on top of the sixth plate 402. The first connector 201 and the second connector 4021 may include, but are not limited to, a circular electrical connector, a rectangular electrical connector, etc., as long as the first connector 201 and the second connector 4021 are ensured to be normally mated and conducted.

Alternatively, first relief aperture 1051 may include, but is not limited to, a circular aperture, a rectangular aperture, and the like.

In actual installation, the second connector 4021 may protrude upward from the upper plate surface of the sixth plate 402 by a certain height, and the first connector 201 may protrude downward from the lower plate surface of the core plate 20 by a certain height, where both the second connector 4021 and the first connector 201 may partially extend into the first avoidance hole 1051 and be electrically connected in the first avoidance hole 1051. Alternatively, the specific connection between the second connector 4021 and the first connector 201 may be a snap connection.

Of course, in a specific implementation, only one of the first connector 201 and the second connector 4021 may pass through the first avoiding hole 1051. For example, a groove may be formed in the bottom of the core board 20, and the first connector 201 may be disposed in the groove, and the second connector 4021 may pass through the first escape hole 1051 and be electrically connected to the first connector 201 in the groove.

In the embodiment of the disclosure, only the paired connectors are required to be arranged on the core board 20 and the sixth board body 402, and the first avoidance hole 1051 is provided on the first beam 105, so that the electrical connection between the core board 20 and the sixth board body 402 can be reliably realized through the butt joint of the paired connectors, and thus, the interconnection of a plurality of core boards 20 can be realized through the sixth board body 402.

In some alternative examples, the fifth plate 401 is electrically connected to the sixth plate 402, the fifth plate 401 being provided with a third connector 4011 shown in fig. 3;

as shown in fig. 1, the core board assembly further includes:

Reinforcing plate 50, reinforcing plate 50 and bottom plate 40 fixed connection, reinforcing plate 50 include seventh plate body 501 and eighth plate body 502, and seventh plate body 501 extends along first direction, and seventh plate body 501 bears fifth plate body 401, and eighth plate body 502 sets up in the edge of seventh plate body 501, and eighth plate body 502 extends along the second direction, and eighth plate body 502 bears sixth plate body 402 to seventh plate body 501 is provided with the second corresponding hole 5011 of dodging of third connector 4011.

Alternatively, the fifth plate 401 may be fixed to the top of the seventh plate 501, such that the seventh plate 501 is capable of carrying the fifth plate 401 on top thereof. Similarly to the fifth plate 401, the seventh plate 501 also extends in the first direction, and then the seventh plate 501 and the fifth plate 401 may be parallel.

Alternatively, the sixth plate 402 may be secured to the top of the eighth plate 502 such that the eighth plate 502 is capable of carrying the sixth plate 402 on top thereof. Similar to the sixth plate 402, the eighth plate 502 also extends in the second direction, and thus the eighth plate 502 may be parallel to the sixth plate 402.

Alternatively, the eighth plate 502 may be perpendicular to the seventh plate 501. The reinforcing plate 50 including the seventh plate 501 and the eighth plate 502 may have a T-shaped structure as a whole.

Alternatively, the second relief hole 5011 may include, but is not limited to, a circular hole, a rectangular hole, and the like.

In the embodiment of the disclosure, the fifth plate 401 may be fixed and carried by the seventh plate 50, and the sixth plate 402 may be fixed and carried by the eighth plate 502, so that the entire bottom plate 40 may be firmly fixed by the reinforcing plate 50 having a T-shaped structure. The reinforcing plate 50 can play a structural reinforcing role, and the problems of warping, insufficient rigidity and the like of components in the core plate assembly due to clamping, heating and the like during the process of pasting and assembling are avoided as much as possible. In addition, since the seventh board 501 is provided with the second avoiding hole 5011 corresponding to the third connector 4011, by using the second avoiding hole 5011, the third connector 4011 can be electrically connected to some parts of the chip prototype verification apparatus except for the core board assembly, thereby enabling information interaction between the core board 20 and these parts.

In some alternative examples, as shown in fig. 4, each core board 20 may be provided with a plurality of through holes 202, and each first heat spreader 30 may be provided to the corresponding core board 20 by one connection assembly;

The connection assembly may include:

Back clip 61, back clip 61 includes a back clip body 611 and a plurality of protrusions 612 provided to back clip body 611, back clip body 611 being abutted against respective core board 20, each protrusion 612 passing through one through hole 202 provided to respective core board 20;

A plurality of sleeves 63 provided corresponding to the plurality of protrusions 612;

A plurality of connection members 65 provided corresponding to the plurality of sleeves 63, each connection member 65 passing through the corresponding first heat sink 30, the corresponding sleeve 63, and being connected with the corresponding protrusion 612.

Alternatively, the plurality of through holes 202 provided for each core plate 20 may be four through holes 202, and the four through holes 202 may be symmetrically distributed with respect to the core plate 20.

Alternatively, the back clip body 611 may have a hollow sheet-like structure. The four corners of the back clip body 611 may be provided with one protrusion 612, respectively, and thus the back clip 61 may include four protrusions 612. In actual installation, the four protrusions 612 may pass through the four through holes 202 in a one-to-one correspondence, and the back clip body 611 may abut against the core board 20 where the four through holes 202 are located.

Alternatively, the plurality of sleeves 63 included in the connection assembly may be four sleeves 63, and the four sleeves 63 may be disposed in one-to-one correspondence with the four protrusions 612.

Alternatively, the plurality of connection members 65 included in the connection assembly may be four connection members 65, and the four connection members 65 and the four sleeves 63 may be disposed in one-to-one correspondence. The four connectors 65 may each be a connecting screw. In actual installation, for each connector 65, the connector 65 is threaded through the first heat sink 30, the corresponding sleeve 63 and the corresponding boss 612. In this way, the first heat sink 30 can be firmly flip-chip mounted to the core board 20 through the connection assembly.

Of course, in specific implementation, the number of through holes 202 provided in each core board 20, and the number of back clips 61, sleeves 63, and connectors 65 included in each connection assembly are not limited to four, for example, six, eight, etc., so long as the first heat sink 30 can be stably mounted.

In the embodiment of the present disclosure, by the connection assembly including the back clip 61, the sleeve 63, and the connection member 65, reliable mounting of the first heat sink 30 can be achieved, and the connection assembly is simple in structure and low in cost.

In some alternative examples, as shown in fig. 4, each first heat sink 30 is provided with a boss 301 near a surface of the corresponding core board 20, with a heat conductive medium interposed between the boss 301 and the corresponding core board 20.

Alternatively, boss 301 may include, but is not limited to, a rectangular parallelepiped boss, a cylindrical boss, and the like.

Alternatively, the thermally conductive medium may include, but is not limited to, silica gel, thermally conductive silicone grease, thermally conductive gel, and the like.

In the embodiment of the disclosure, through the arrangement of the heat conducting medium, the heat at the core board 20 can be quickly conducted to the first radiator 30 through the heat conducting medium, which is beneficial to improving the heat dissipation effect. In addition, through the setting of boss 301, only need set up heat conduction medium between the upper surface of boss 301 and the lower surface of core board 20 can, and need not set up heat conduction medium between the upper surface of first radiator 30 and the lower surface of core board 20, so, be favorable to reducing the thickness of heat conduction medium that needs to set up to be favorable to guaranteeing the heat conduction effect.

In some alternative examples, the back clip body 611 is provided with an insulating film against the surface of the corresponding core board 20.

Alternatively, the lower surface of the back clip body 611 in fig. 4 may be provided with an insulating film.

It will be appreciated that the insulating film is a film capable of ensuring good electrical insulation, and by providing the insulating film on the surface of the back clip body 611 abutting against the core board 20, the insulating effect of the insulating film can be utilized, and adverse effects of the back clip body 711 on normal operation of the core board 20 are avoided.

The embodiment of the disclosure also provides a chip prototype verification device. As shown in fig. 5 and 6, the chip prototype verification apparatus may include:

The core plate assembly of any of the above embodiments;

The device housing, the core board assembly is located in the device housing, and the first support frame 10 in the core board assembly is fixedly connected with the device housing.

Optionally, the device housing may include: an upper cover 71, a bottom chassis 72, a first side plate 73, a second side plate 74, a front panel 75, and a rear panel 76; wherein, the first side plate 73, the second side plate 74, the front panel 75 and the rear panel 76 may be fixed to the bottom chassis 72; the upper cover 71 may be fixed to the first side plate 73, the second side plate 74, the front panel 75, and the rear panel 76. In order to prevent buckling deformation of the upper cover 71 during processing and assembly, a surface of the upper cover 71 facing the bottom chassis 72 may be welded with mesh-shaped reinforcing ribs to reinforce rigidity of the upper cover 71. The front panel 75 may be a complete machine operation panel, which may include a start button and several PCBAs.

It should be noted that, the upper cover 71, the bottom case 72, the first side plate 73, the second side plate 74, the front panel 75, and the rear panel 76 may enclose a hollow cavity, and the core plate assembly may be located in the hollow cavity. In addition, one end of the first support frame 10 in the core plate assembly may be fixed to the first side plate 73 by a first set of fixing structures 77, and the other end may be fixed to the second side plate 74 by a second set of fixing structures 78.

With the embodiments of the present disclosure, the core board assembly can be reliably fixed by the device housing, and the stable fixing, heat dissipation and interconnection of the plurality of core boards 20 are ensured by the core board assembly, so that it is advantageous to ensure the normal and reliable operation of the chip prototype verification device.

In some alternative examples, the core plate assembly may include the bottom plate 40 and the reinforcing plate 50 shown in fig. 1, 6;

as shown in fig. 6, the chip prototype verification apparatus may further include:

Control board assembly 80, control board assembly 80 is mounted within the device housing, control board assembly 80 including a fourth connector 801 disposed in a second relief aperture 5011 of reinforcing plate 50 for passing through at least a portion of a third connector 4011 (see, in particular, fig. 3) disposed in base plate 40 and/or at least a portion of fourth connector 801 to electrically connect third connector 4011 with fourth connector 801.

Alternatively, the control board assembly 80 may be mounted within the hollow cavity.

It should be noted that, the specific assembly scheme of the third connector 4011 and the fourth connector 801 is referred to the description related to the assembly scheme of the first connector 201 and the second connector 4021 hereinabove, and will not be repeated here.

In the embodiment of the disclosure, only the matched connectors are required to be arranged on the bottom plate 40 and the control board assembly 80, and the second avoiding holes 5011 are provided on the reinforcing plate 50, so that the electric connection between the core board assembly and the control board assembly 80 can be realized through the butt joint of the matched connectors, and the information interaction between the core board assembly and the control board assembly 80 can be realized.

In some alternative examples, as shown in fig. 6, the chip prototype verification apparatus may further include:

The second support frame 83, where the second support frame 83 includes a ninth plate 831, a tenth plate 832, an eleventh plate 833 and a twelfth plate 834 that are sequentially connected end to end, and the ninth plate 831, the tenth plate 832, the eleventh plate 833 and the twelfth plate 834 enclose a second enclosing area that forms a hollow, the ninth plate 831 and the eleventh plate 833 are disposed opposite to each other, and the tenth plate 832 and the twelfth plate 834 are disposed opposite to each other;

The first leg 85, the tenth plate 832 is fixedly connected with the device housing through the first leg 85;

The second leg 87, the twelfth plate 834 is fixedly connected with the device housing through the second leg 87;

as shown in fig. 6 and 7, the control board assembly 80 may further include:

the control board 803, the control board 803 shields the second enclosing area and is fixedly connected with the second support frame 83, the control board 803 comprises a first surface and a second surface which are oppositely arranged, and the fourth connector 801 is arranged on the first surface;

The second heat spreader 805 passes through the second enclosing region and is disposed on the second surface.

Alternatively, the ninth plate 831 may be parallel to the eleventh plate 833. The tenth plate 832 may be parallel to the twelfth plate 834. The shapes of the second enclosing regions formed by enclosing the ninth plate 831, the tenth plate 832, the eleventh plate 833 and the twelfth plate 834 may include, but are not limited to, rectangular, circular, diamond, etc., and are not specifically described herein.

Optionally, the tenth plate 832 may be fixedly connected to the bottom case 72 through the first leg 85, the twelfth plate 834 may be fixedly connected to the bottom case 72 through the second leg 87, and both the first leg 85 and the second leg 87 may be perpendicular to the bottom case 72. In order to secure the mounting stability, the number of the first and second legs 85 and 87 may be two, so that the fixation of the second support frame 83 may be achieved by four legs in total.

Alternatively, the control board 803 may be a PCBA. The control board 803 may be fixed to the top of the second support frame 83 such that the second support frame 83 may carry the control board 803 on top thereof. The upper surface of the control board 803 may be a first surface and the lower surface of the control board 803 may be a second surface.

It should be noted that, the structure (connection assembly) for realizing flip-chip mounting of the first heat sink 30 is described in detail above, and the second heat sink 805 may be mounted in a similar manner, and particularly, refer to fig. 7.

In the embodiment of the present disclosure, stable fixing of the control board assembly inside the chip prototype verification apparatus can be achieved by the second support frame 83, the first leg 85, and the second leg 87. Through the second heat sink 805, heat dissipation of the control board 803 can be achieved, and thus, normal and reliable operation of the control board 803 is facilitated.

In some alternative examples, as shown in fig. 6, the chip prototype verification apparatus may further include:

the fan assembly, the fan assembly is installed in the device shell, the first quantity of fans 90 in the fan assembly is corresponding to the first radiator 30 in the core board assembly, the second quantity of fans 90 in the fan assembly is corresponding to the second radiator 805, and the device shell is corresponding to the fan assembly and is provided with an air inlet and an air outlet.

Alternatively, the fan assembly may include at least two fans 90, wherein a portion of the fans 90 (i.e., a first number of fans 90) are disposed corresponding to the first heat sink 30 and another portion of the fans 90 (i.e., a second number of fans 90) are disposed corresponding to the second heat sink 805. It should be noted that the first number and the second number may be the same or different, and only the first number and the second number need to be ensured to be greater than or equal to 1, and specific values of the first number and the second number are not limited in the disclosure.

Alternatively, the air inlet may be disposed on the first side plate 73, and the air inlet may have a hexagonal shape. The air outlet may be provided in the second side plate 74.

In the embodiment of the disclosure, through the arrangement of the air inlet, the air outlet and the fan assembly, the air circulation speed in the hollow cavity can be improved through the rotation of the fan 90 in the fan assembly, so that the heat in the hollow cavity is quickly brought out of the hollow cavity, the heat dissipation effect of the first radiator 30 and the second radiator 805 is improved, and the normal and reliable operation of the core board 20 and the control board 803 is ensured.

In some of the alternative examples of the present invention,

The core plate 20 in the core plate assembly includes a temperature sensor;

the control board 803 is provided with fifth connectors corresponding to each fan 90, respectively, each fan 90 is provided with a sixth connector, the fifth connectors are electrically connected with the sixth connectors through a first connection wire harness, and the control board 803 outputs a control signal for the corresponding fan 90 from the fifth connectors according to temperature information collected by the temperature sensor.

Alternatively, the temperature sensor may include, but is not limited to, a thermal resistance type temperature sensor, a thermocouple type temperature sensor, and the like.

Alternatively, the fifth connector and the sixth connector may each include, but are not limited to, a circular electrical connector, a rectangular electrical connector, etc., so long as the electrical connection through the fifth connector and the sixth connector is ensured, and the information interaction between the control board 803 and the fan 90 can be achieved. The first connection harness between the fifth connector and the sixth connector may be a cable for transmitting a control signal.

Alternatively, fan 90 may support stepless speed regulation, or gear speed regulation.

In the embodiment of the present disclosure, the control board 803 may determine the chip junction temperature of any core board 20 through temperature information collected by a temperature sensor in the core board 20, and provide a control signal to the fan 90 disposed corresponding to the core board 20 according to the determined junction temperature. For example, if the junction temperature is determined to be very high, a control signal may be provided to the fan 90 to cause the fan 90 to rotate at a high speed, thereby more effectively dissipating heat from the core board 20. For another example, if the junction temperature is determined to be low, a control signal may be provided to the fan 90 to cause the fan 90 to rotate at a low speed or stop rotating, thereby saving energy and reducing noise caused by the fan 90.

In some alternative examples, as shown in fig. 6, the chip prototype verification apparatus may further include:

A power supply housing 93, the power supply housing 93 defining an installation space within the device housing;

A power supply 95, the power supply 95 being installed in the installation space, the power supply 95 being provided with a seventh connector;

The power supply board 98 is mounted outside the mounting space in the device housing through the power supply support 97, the power supply board 98 is provided with an eighth connector and a ninth connector, the control board assembly 80 is provided with a tenth connector, the eighth connector is electrically connected with the seventh connector, and the ninth connector is electrically connected with the tenth connector through a second connecting wire harness.

Alternatively, the power source housing 93 may be fixed to the top of the bottom chassis 72. The power source housing 93 may have a U-shaped structure, and an open end (a left end shown in fig. 6) of the U-shaped structure abuts against the rear panel 76, so that a rectangular parallelepiped-shaped installation space is defined in the hollow cavity.

Alternatively, the power supply 95 may be plugged into the installation space. The power source 95 may be a 220V ac power source.

Alternatively, the power board 98 may be a PCBA. The power supply bracket 97 and the power supply board 98 may be vertically fixed to the top of the bottom chassis 72. The power bracket 97 may be located between the power supply housing 93 and the power supply board 98. The eighth connector provided by the power panel 98 may be a gold finger connector for achieving electrical connection between the power panel 98 and the power source 95. The second connection harness between the ninth connector and the tenth connector may be a cable (may be referred to as a power cable) for transmitting a power signal.

Optionally, the chip prototype verification apparatus may further include a power cover plate 99. The power cover 99 may have an open state and a closed state. In the opened state of the power cover 99, the power 95 can be put into the installation space or the power 95 in the installation space can be taken out.

In the embodiment of the disclosure, an installation space can be defined in the device housing through the power housing 93 for installation of the power source 95, that is, the power source 95 can be installed in a built-in manner, so that on one hand, the power source 95 can be fixed by reasonably utilizing the space inside the chip prototype verification device, and on the other hand, a certain shielding effect can be achieved through the power housing 93, and normal and reliable operation of the power source 95 is ensured. In addition, the eighth connector is electrically connected with the seventh connector, and the ninth connector is electrically connected with the tenth connector, so that the electrical connection between the power supply 95 and the power panel 98 and the electrical connection between the power panel 98 and the control panel assembly 80 can be realized, and accordingly, the power supply 95 can supply power to the control panel assembly 80 and supply power to the core panel assembly through the control panel assembly 80, thereby ensuring the normal and reliable operation of the whole chip prototype verification apparatus.

In some alternative examples, when the assembly of the chip prototype verification apparatus is performed, the assembly of the core board assembly may be performed first, that is, the bottom board 40 is fixed to the bottom of the first support frame 10, the reinforcing board 50 is fixed to the bottom of the bottom board 40, four first heat sinks 30 are mounted to the four core boards 20 in a one-to-one correspondence manner, the four core boards 20 are mounted to the top of the first support frame 10, and it is necessary to fix one end of the first support frame 10 to the first side board 73 and the other end of the first support frame 10 to the second side board 74. Alternatively, the strength of the connection between each core plate 20 and the bottom plate 40 may be increased by staking the studs. In addition to the core board assembly, assembly of the control board assembly 80 and the power supply assembly (which may include the power supply housing 93, the power supply 95, the power supply bracket 97, the power supply board 98) and the like is also required. When mounting the control board assembly 80, it is necessary to ensure that the third connector 4011 mates with the fourth connector 801.

After the assembly of the chip prototype verification apparatus is completed, the power cover 99 may be removed, the power supply 95 may be plugged into the installation space, and then the power cover 99 may be replaced. Then, the power button of the rear panel 76 may be pressed, and the button indicator light may be turned on in red to indicate that the module for converting ac power to dc power in the chip prototype verification apparatus is started, and at this time, the PCBAs in the chip prototype verification apparatus are not powered on. Then, if the start button of the front panel 75 is pressed again, the whole machine is started, each PCBA in the chip prototype verification apparatus is powered on, the indicator lamp in the center of the front panel 75 can be turned on, and the fan assembly can be started. The developer can configure system parameters according to the chip design requirement, and connect the required daughter board, cable, universal serial bus (Universal Serial Bus, USB) and the like for the chip prototype verification device to perform chip design function verification. After verification is complete, the start button of the front panel 75 may be pressed and the power button of the rear panel 76 may be pressed, so far the entire chip prototype verification apparatus is completely powered down.

In summary, with the embodiments of the present disclosure, stable fixing, heat dissipation, and interconnection of the plurality of core boards 20 can be effectively achieved through the first support frame 10 and the bottom plate 40. By the reinforcing plate 50, the structural strength can be improved, and the problems of warpage, insufficient rigidity and the like can be avoided. By means of the connection assembly comprising the back clip 61, the sleeve 63, the connection 65, a reliable mounting of the heat sink can be achieved at a low cost. By adjusting the rotation speed of the fan 90 according to the junction temperature, energy saving and consumption reduction can be realized, and noise reduction can be realized. By adopting the built-in mode to install the power supply 95, the space can be more reasonably utilized, the whole machine is more compact, and the problems that the external mode is difficult to install and occupies large space and an additional power supply fixing structure is required to be designed are avoided.

It should be noted that, the various optional embodiments and optional implementations disclosed above may be flexibly selected and combined according to the needs, so as to achieve corresponding functions and effects, which are not listed in this disclosure.

The basic principles of the present disclosure have been described above in connection with specific embodiments, but it should be noted that the advantages, benefits, effects, etc. mentioned in the present disclosure are merely examples and not limiting, and these advantages, benefits, effects, etc. are not to be considered as necessarily possessed by the various embodiments of the present disclosure. Furthermore, the specific details disclosed herein are for purposes of illustration and understanding only, and are not intended to be limiting, since the disclosure is not necessarily limited to practice with the specific details described.

In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different manner from other embodiments, so that the same or similar parts between the embodiments are mutually referred to.

Various modifications and alterations to this disclosure may be made by those skilled in the art without departing from the spirit and scope of the application. Thus, the present disclosure is intended to include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims (14)

1. A core board assembly, comprising:

-a first support frame (10), the first support frame (10) having a plurality of hollow areas (12);

A plurality of core plates (20), wherein each core plate (20) is borne by the first supporting frame (10) and fixedly connected with each core plate (20), and different hollow areas (12) are shielded by different core plates (20);

-a plurality of first heat sinks (30), different ones of said first heat sinks (30) passing through different ones of said hollow areas (12), and each of said first heat sinks (30) being provided to a respective one of said core boards (20);

the base plate (40), the base plate (40) bear the first support frame (10) and with first support frame (10) fixed connection, base plate (40) still respectively with every core board (20) electricity is connected.

2. The core plate assembly according to claim 1, wherein the first support frame (10) comprises:

the novel solar panel comprises a first plate body (101), a second plate body (102), a third plate body (103) and a fourth plate body (104) which are sequentially connected end to end, wherein the first plate body (101), the second plate body (102), the third plate body (103) and the fourth plate body (104) are surrounded to form a hollow first enclosing area, the first plate body (101) and the third plate body (103) are oppositely arranged, and the second plate body (102) and the fourth plate body (104) are oppositely arranged;

At least one beam dividing the first enclosed region into a plurality of hollow regions (12).

3. The core plate assembly according to claim 2, wherein the number of beams is two, one of the beams being a first beam (105) and the other beam being a second beam (106);

The first cross beam (105) and the second cross beam (106) are arranged in the first enclosing area in a crossing way;

The first cross beam (105) extends from the first plate (101) to the third plate (103);

the second beam (106) extends from the second plate (102) to the fourth plate (104).

4. The core plate assembly according to claim 2, wherein at least one of the beams comprises a first beam (105) extending from the first plate body (101) to the third plate body (103);

the base plate (40) includes:

A fifth plate body (401) and a sixth plate body (402), wherein the fifth plate body (401) extends along a first direction, the fifth plate body (401) carries the first plate body (101), the sixth plate body (402) is arranged at the edge of the fifth plate body (401), the sixth plate body (402) extends along a second direction, the sixth plate body (402) carries the first cross beam (105), and the sixth plate body (402) is electrically connected with each core plate (20);

Wherein, the first direction is: the direction consistent with the connecting line direction of the second plate body (102) and the fourth plate body (104), wherein the second direction is as follows: and a direction which is consistent with the connecting line direction of the first plate body (101) and the third plate body (103).

5. The core plate assembly of claim 4 wherein,

Each core board (20) is provided with a first connector (201);

The first cross beam (105) is provided with a first avoidance hole (1051) corresponding to the first connector (201);

The sixth plate body (402) is provided with a second connector (4021) corresponding to the first avoidance hole (1051), and the first avoidance hole (1051) is used for allowing at least part of the first connector (201) and/or at least part of the second connector (4021) to pass through so as to enable the first connector (201) to be electrically connected with the second connector (4021).

6. The core board assembly according to claim 4, characterized in that the fifth board body (401) is electrically connected with the sixth board body (402), the fifth board body (401) being provided with a third connector (4011);

The core plate assembly further comprises:

Reinforcing plate (50), reinforcing plate (50) with bottom plate (40) fixed connection, reinforcing plate (50) include seventh plate body (501) and eighth plate body (502), seventh plate body (501) are followed first direction extends, seventh plate body (501) bear fifth plate body (401), eighth plate body (502) set up in the edge of seventh plate body (501), eighth plate body (502) are followed the second direction extends, eighth plate body (502) bear sixth plate body (402), and, seventh plate body (501) are provided with second corresponding to third connector (4011) dodges hole (5011).

7. The core board assembly according to claim 1, wherein each core board (20) is provided with a plurality of through holes (202), each of the first heat sinks (30) being provided to the corresponding core board (20) by one connection assembly;

The connection assembly includes:

-a back clip (61), the back clip (61) comprising a back clip body (611) and a plurality of protrusions (612) provided to the back clip body (611), the back clip body (611) being abutted against the respective core plate (20), each of the protrusions (612) passing through one of the through holes (202) provided to the respective core plate (20);

a plurality of sleeves (63) provided corresponding to the plurality of projections (612);

And a plurality of connecting members (65) provided in correspondence with the plurality of sleeves (63), each connecting member (65) passing through the corresponding first heat sink (30), the corresponding sleeve (63), and being connected to the corresponding protrusion (612).

8. The core plate assembly of claim 7 wherein,

A boss (301) is arranged on the surface, close to the corresponding core plate (20), of each first radiator (30), and a heat conducting medium is clamped between the boss (301) and the corresponding core plate (20);

and/or the number of the groups of groups,

The back clip body (611) is provided with an insulating film against the surface of the corresponding core board (20).

9. A chip prototype-verification apparatus, comprising:

The core plate assembly of any of claims 1-8;

And the core board assembly is positioned in the device shell, and a first supporting frame (10) in the core board assembly is fixedly connected with the device shell.

10. Chip prototype verification apparatus according to claim 9, characterized in that the core board assembly comprises a base board (40) and a stiffening board (50);

The chip prototype verification apparatus further includes:

Control panel subassembly (80), control panel subassembly (80) install in the device shell, control panel subassembly (80) include fourth connector (801), set up in second dodge hole (5011) of reinforcing plate (50) be used for the confession set up in at least part of third connector (4011) of bottom plate (40) and/or at least part of fourth connector (801) pass, so that third connector (4011) with fourth connector (801) electricity is connected.

11. The chip prototype verification apparatus of claim 10, wherein,

The chip prototype verification apparatus further includes:

The second support frame (83), the second support frame (83) includes a ninth plate body (831), a tenth plate body (832), an eleventh plate body (833) and a twelfth plate body (834) which are sequentially connected end to end, the ninth plate body (831), the tenth plate body (832), the eleventh plate body (833) and the twelfth plate body (834) enclose to form a hollow second enclosing area, the ninth plate body (831) and the eleventh plate body (833) are oppositely arranged, and the tenth plate body (832) and the twelfth plate body (834) are oppositely arranged;

The tenth plate body (832) is fixedly connected with the device shell through the first supporting leg (85);

The twelfth plate body (834) is fixedly connected with the device shell through the second supporting leg (87);

The control board assembly (80) further includes:

The control board (803), the control board (803) shields the second enclosing area and is fixedly connected with the second supporting frame (83), the control board (803) comprises a first surface and a second surface which are oppositely arranged, and the fourth connector (801) is arranged on the first surface;

And a second heat sink (805), wherein the second heat sink (805) passes through the second enclosing area and is disposed on the second surface.

12. The chip prototype-verification apparatus as claimed in claim 11, further comprising:

a fan assembly mounted within the device housing, a first number of fans (90) in the fan assembly disposed corresponding to a first heat sink (30) in the core plate assembly, a second number of fans (90) in the fan assembly disposed corresponding to a second heat sink (805), and the device housing disposed with an air inlet and an air outlet corresponding to the fan assembly.

13. The chip prototype verification apparatus of claim 12, wherein,

A core plate (20) in the core plate assembly includes a temperature sensor;

The control board (803) is respectively provided with a fifth connector corresponding to each fan (90), each fan (90) is provided with a sixth connector, the fifth connector is electrically connected with the sixth connector through a first connecting wire bundle, and the control board (803) outputs a control signal for the corresponding fan (90) from the fifth connector according to temperature information acquired by the temperature sensor.

14. The chip prototype-verification apparatus as claimed in claim 10, further comprising:

A power supply housing (93), said power supply housing (93) defining an installation space within said device housing;

a power supply (95), the power supply (95) being mounted in the mounting space, the power supply (95) being provided with a seventh connector;

The power panel comprises a power support (97) and a power panel (98), wherein the power panel (98) is installed in the device shell through the power support (97) outside the installation space, the power panel (98) is provided with an eighth connector and a ninth connector, the control panel assembly (80) is provided with a tenth connector, the eighth connector is electrically connected with the seventh connector, and the ninth connector is electrically connected with the tenth connector through a second connecting wire harness.