CN102663943A - Teaching experiment device for radiation of electronic equipment - Google Patents

Abstract

A teaching experiment device for heat dissipation of electronic equipment includes: at least one heat source, multiple radiators, a heat source installation part, a radiator installation part, and a temperature measuring instrument. Wherein, the heat source is installed on the heat source installation part, and the heat sink is installed on the heat sink installation part to dissipate heat. Corresponding to one heat source, the teaching experiment device for heat dissipation of electronic equipment has a heat source installation part and at least one heat dissipation device. When a heat source is installed in the heat source installation part, the radiator installation part can replaceably install various radiators corresponding to the heat source, and the temperature measuring instrument measures the temperature of the heat source. The teaching experiment device for heat dissipation of electronic equipment provided by the present invention can enable users to evaluate and learn different heat dissipation technologies or heat dissipation schemes and study the heat generation performance of heat sources through experiments, improve the efficiency of research and development and learning, and has a simple structure and is easy to use.

Description

Teaching experiment device for heat dissipation of electronic equipment

Application field

An experimental device for heat dissipation of electronic equipment used in the teaching experiment of related courses and in the research and development process of heat dissipation schemes for electronic products, which relates to the field of heat dissipation technology of electronic equipment.

Background technique

The thermal environment has a significant impact on the proper operation of most electronic devices. Exceeding the design temperature of the equipment will lead to accelerated failure of components, which will cause the failure of the entire equipment. This puts strict requirements on the heat dissipation design of electronic equipment.

Electronic equipment cooling technology is divided into active cooling and passive cooling technology. Passive heat dissipation technology does not require additional energy consumption, mainly relying on the natural convection, heat conduction, heat radiation or phase change heat transfer of electronic equipment and connected heat dissipation devices to control the operating temperature of electronic equipment. When passive cooling cannot meet the cooling requirements, active cooling technology needs to be used. For example, forced gas convection heat dissipation by fans, forced liquid convection heat dissipation by pumps, thermoelectric refrigeration technology, etc.

Based on active and passive cooling technologies, the cooling devices used today include finned radiators, cold plates, thermoelectric cooling sheets, ordinary heat pipes, gravity-assisted heat pipes, variable heat pipes, oscillating heat pipes, loop heat pipes, phase change radiators, radiation The combined heat dissipation device formed by the radiator and the above-mentioned devices, together with power machinery such as fans and pumps, constitutes a heat dissipation module.

There are many cooling methods for electronic equipment in the industrial field today, but all of them are specific product-specific individual cooling solutions, and there is a lack of a set of cooling solution experimental platforms for different products and different calorific values for cooling design and use. In the teaching process of related courses, no such experimental device has been found, so that students can learn from the experiment the characteristics and cooling capabilities of various heat dissipation technologies of electronic equipment, and the problems and solutions in the application of various heat dissipation technologies .

Contents of the invention

In view of the above problems, the present invention proposes a set of experimental devices for heat dissipation of electronic equipment, which can enable users to evaluate and learn different heat dissipation technologies or schemes through experiments, and improve the efficiency of research and development or learning.

The experimental device for heat dissipation of electronic equipment of the present invention includes a teaching experimental device for heat dissipation of electronic equipment, which is characterized in that it includes: at least one heat source, multiple radiators, a heat source installation part, a radiator installation part, and a temperature measuring instrument. Wherein, the heat source is installed on the heat source installation part, and the radiator dissipates heat to the heat source and is installed on the radiator installation part, corresponding to one heat source, the teaching device has a heat source installation part and at least one radiator installation part, when the heat source installation part is installed For one heat source, the heat sink installation part can replaceably mount various heat sinks corresponding to the heat source, and the temperature measuring instrument can measure the temperature of the heat source.

Further, the teaching experimental device for heat dissipation of electronic equipment provided by the present invention may also include: a heat source power regulator and a temperature display, the heat source power regulator adjusts the power of the heat source; the temperature measuring instrument measures the temperature of heat sources with different powers and outputs the Temperature to temperature display; The temperature display shows the temperature sent from the temperature measuring instrument.

Further, the teaching experiment device for heat dissipation of electronic equipment provided by the present invention can also have such a feature: corresponding to a heat source, a variety of radiators are respectively: finned radiators, cold plates, thermoelectric cooling fins, ordinary heat pipes, and gravity-assisted heat pipes , variable heat pipes, oscillating heat pipes, loop heat pipes, phase change radiators, radiant radiators, and combined heat dissipation devices combined with the above devices, plus fans, pumps and other power machinery to form a heat dissipation module, which is installed on the radiator The radiator on the mounting part is one of many kinds.

Further, the teaching experiment device for heat dissipation of electronic equipment provided by the present invention can also have such features: the fins in the fin radiator can be longitudinal ribs with rectangular cross-section, longitudinal ribs with trapezoidal cross-section, cylindrical pin ribs, rectangular pin fins, and triangular cross-sectional ribs. A type of longitudinal rib, longitudinal rib with concave parabolic section, needle rib with concave parabolic section, and conical needle rib.

Further, the teaching experiment device for heat dissipation of electronic equipment provided by the present invention can also have such features: there are more than two radiator mounting parts, and the various radiators that can be installed are finned radiators, cold plates, thermoelectric cooling fins, common Heat pipes, gravity-assisted heat pipes, variable heat pipes, oscillating heat pipes, loop heat pipes, phase-change radiators, radiation radiators, and combined heat dissipation devices combined with the above-mentioned devices, plus fans, pumps and other power machinery to form a heat dissipation module , corresponding to one heat source, at least two kinds of radiators are installed on the radiator mounting part.

Furthermore, the teaching experiment device for heat dissipation of electronic equipment provided by the present invention may also have the following features: there are multiple heat sources, and the heat source installed in the heat source installation part is one of the multiple types.

Invention function and effect

The teaching experiment device for heat dissipation of electronic equipment provided by the present invention can enable users to evaluate and learn different heat dissipation technologies or heat dissipation schemes and study the heat generation performance of heat sources through experiments, improve the efficiency of research and development and learning, and has a simple structure and is easy to use.

Description of drawings

Fig. 1 is the structural representation of the teaching experimental device for heat dissipation of electronic equipment in the embodiment;

Fig. 2 is the partial structure diagram that the heat source installed in the teaching experimental device for heat dissipation of electronic equipment in the embodiment is an electric heating block;

Fig. 3 is the partial structure schematic diagram that the radiator installed in the teaching experimental device for heat dissipation of electronic equipment in the embodiment is a heat dissipation plate;

Fig. 4 is the partial structure diagram that the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment is a finned radiator;

Figure 5 is the different types of fins used in finned radiators;

Fig. 6 is the partial structural schematic diagram that the radiator installed in the teaching experimental device for heat dissipation of electronic equipment in the embodiment is a heat pipe radiator;

Fig. 7 is the partial structure diagram that the radiator installed in the teaching experimental device for heat dissipation of electronic equipment in the embodiment is a heat pipe fin radiator;

Fig. 8 is a schematic diagram of a part of the structure of the radiator installed in the teaching experimental device for heat dissipation of electronic equipment in the embodiment as a thermoelectric cooling heat dissipation plate;

Fig. 9 is a schematic diagram of the partial structure of the radiator installed in the teaching experimental device for heat dissipation of electronic equipment in the embodiment as a thermoelectric cooling fin radiator;

Fig. 10 is a schematic diagram of the partial structure of the radiator installed in the teaching experimental device for heat dissipation of electronic equipment in the embodiment as a fan fin radiator;

Fig. 11 is a schematic diagram of the partial structure of the radiator installed in the teaching experimental device for heat dissipation of electronic equipment in the embodiment as a cold plate heat dissipation device;

Fig. 12 is a schematic diagram of the partial structure of the heat sink installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment as a thermoelectric cold plate heat sink;

Fig. 13 is a partial structural schematic diagram of the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment as a heat pipe cold plate heat dissipation device;

Fig. 14 is a partial structural schematic diagram of a gas-liquid phase change cooling system in which the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment;

Fig. 15 is a partial structural schematic diagram of a solid-liquid phase change cooling system-heat storage cold plate in which the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment;

Fig. 16 is a partial structural schematic diagram of a loop cooling system in which the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment;

Detailed ways

Fig. 1 is the structural representation of the teaching experiment device for heat dissipation of electronic equipment in the embodiment; Device, heat source installation department, radiator installation department, temperature measuring instrument, heat source power regulator, temperature display. Among them, the heat source is used to simulate the heat generation of the working state of the electronic equipment, and is installed on the heat source installation part; the radiator is used for dissipating heat from the heat source, and is installed on the radiator installation part, and the radiator installation part can replaceably install various radiators The heat source power regulator is used to adjust the power of the heat source; the temperature measuring instrument is used to measure the temperature of the heat source with different power and output the temperature to the temperature display; the temperature display is used to display the temperature sent by the temperature measuring instrument.

FIG. 2 is a schematic diagram of a partial structure in which the heat source installed in the teaching experiment device for heat dissipation of electronic equipment in this embodiment is an electric heating block. As shown in Figure 1, the heat source in this embodiment is an electric heating block. When the heat source power regulator adjusts the working power of the electric heating block so that the working power changes, the temperature of the electric heating block should be kept within the required temperature range. It is necessary to select the appropriate heat dissipation device and heat dissipation module according to its heating power density to take away the heat in time.

The various radiators in the teaching experiment device for heat dissipation of electronic equipment are finned radiators, cold plates, thermoelectric cooling sheets, ordinary heat pipes, gravity-assisted heat pipes, variable heat pipes, oscillating heat pipes, loop heat pipes, and phase change radiators , radiation radiator and the combined heat dissipation device combined with the above-mentioned devices, plus power machinery such as fans and pumps to form a heat dissipation module.

The radiator mounting section can replaceably mount various radiators:

Fig. 3 is a schematic diagram of a part of the structure in which the heat sink installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment is a heat dissipation plate. As shown in Figure 2, the radiator installed on the radiator installation part is a heat sink. When the electric heating power is small, the heat can be lost by relying on the convection and radiation heat dissipation of the electric heating block itself, and the electric heating power is increased to passively dissipate heat. If the temperature exceeds the limit, consider adding a rectangular sheet-shaped heat sink on the electric heating block.

The cooling plate can also be a rectangular piece, a circular piece, an annular piece, etc., and the material of the cooling plate can be metal materials (such as aluminum, copper), ceramics, graphite, alloy materials, synthetic materials, etc.

Fig. 4 is a schematic diagram of part of the structure of the fin radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment; Fig. 5 is a diagram of different types of fins used in the fin radiator. As shown in Figures 4 and 5, according to the calorific value and limited temperature, the radiator installed on the radiator mounting part is a finned radiator. There are many types of fin radiators. According to the wing shape, there are longitudinal ribs with rectangular section, longitudinal ribs with trapezoidal section, cylindrical needle ribs, rectangular needle ribs, longitudinal ribs with triangular section, longitudinal ribs with concave parabolic section, needle ribs with concave parabolic section, and conical ribs. Needle ribs etc.

Fig. 6 is the partial structural representation that the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment is a heat pipe radiator; Fig. 7 is the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment is a heat pipe rib Schematic diagram of part of the structure of the fin radiator. As shown in Figures 6 and 7, according to the calorific value and the limited temperature, installing heat pipes on the above-mentioned cooling plate can be assembled into a heat-pipe cooling plate, which is installed on the radiator installation part to dissipate heat from the electric heater; The heat pipe can be assembled into a heat pipe cooling plate to dissipate heat from the electric heater.

Heat pipes can be ordinary heat pipes, gravity-assisted heat pipes, variable heat pipes, oscillating heat pipes (also known as pulsating heat pipes), and loop heat pipes.

Fig. 8 is the partial structural representation that the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment is a thermoelectric cooling heat dissipation plate; Schematic diagram of part of the cooling fin radiator. As shown in Figures 8 and 9, according to the calorific value and the limited temperature, the cold end of the thermoelectric semiconductor cooling sheet installed on the radiator installation part is connected to the heating block to form a thermoelectric cooling heat dissipation plate and installed on the radiator installation part to control the electric current. The heating block dissipates heat; the heating block is connected to the cold end of the thermoelectric semiconductor cooling sheet, and the hot end of the thermoelectric semiconductor cooling sheet is installed with a heat sink to form a thermoelectric cooling cooling plate, which is installed on the radiator installation part to dissipate heat from the heating block; the thermoelectric semiconductor cooling sheet heats The fin radiator is installed at the end to form thermoelectric cooling. The fin radiator is installed on the radiator installation part to dissipate heat from the heating block.

Fig. 10 is a partial structural schematic diagram of the fan fin radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment. As shown in Figure 10, for the electric heating block under a certain power, the air volume is adjusted by adjusting the fan power with the fan fin radiator.

Wherein, the fan can be a suction fan or a blower fan, and the installation position can be on the side or on the top of the fin radiator. The fan can also be applied to the above-mentioned heat pipe fin radiator and thermoelectric cooling fin radiator and assembled into a fan heat pipe fin radiator and a fan thermoelectric cooling fin radiator. The fan can be installed on the top and side of the fin radiator, and the power can be Tune.

Fig. 11 is the partial structure schematic diagram that the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment is a cold plate cooling device; Fig. 12 is the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment is a thermoelectric Schematic diagram of part of the structure of the cooling plate cooling device; FIG. 13 is a schematic diagram of part of the structure of the cooling plate cooling device in which the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment is a heat pipe. As shown in Figures 11, 12, and 13, according to the calorific value and the limited temperature, cold plates can be installed on the heating block, the heating block equipped with thermoelectric cooling sheets, and the heating block equipped with heat pipes to form different cold plate cooling devices. The cold plate can be It is an air-cooled cold plate or a liquid-cooled cold plate, gas or liquid can pass between the plates, and a liquid-gas phase change can also occur in the liquid-cooled type. The cold plate has a tube and a flat plate form, a plate type and a plate-fin type.

According to the calorific value and the limited temperature, the micro-scale heat exchanger is installed on the radiator installation part to be bonded with the heating block to form a micro-scale heat exchanger device to dissipate heat from the electric heating block, and the micro-scale heat exchanger and thermoelectric refrigeration The hot ends of the fins are combined and installed on the radiator mounting part so that they are bonded with the heating block to form a micro-scale thermoelectric cooling and cooling device to dissipate heat from the electric heating block, and the micro-scale heat exchanger and the heat pipe condensation section are combined and installed on the radiator The installation part is bonded with the heating block to form a micro-scale heat pipe condensation cooling device to dissipate heat from the electric heating block.

Among them, the micro-channel cross-sections in the micro-scale radiators have various forms such as circular, rectangular, trapezoidal, triangular, I-shaped, and porous medium flow channel cross-sections.

Fig. 14 is the partial structural representation that the radiator installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment is a gas-liquid phase change cooling system; Fig. 15 is the heat dissipation device installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment The device is a solid-liquid phase change cooling system—a partial structural schematic diagram of a heat storage cold plate. As shown in Figures 14 and 15, according to the calorific value and the limited temperature, the phase change cooler is installed on the radiator installation part to dissipate heat from the electric heating block, wherein the phase change cooler includes a liquid-gas phase change cooler and a solid-gas phase change cooler. Liquid phase change cooler.

Liquid-gas phase change coolers can be either direct immersion or indirect. Direct immersion cooling includes direct consumption of refrigerant cooling, cooling with a condenser outside or inside the vapor space, and cooling with an immersion condenser, etc. Indirect phase change cooling has consumable refrigerants and non-consumable refrigerants.

When the solid-liquid phase change cooler is cooled in the form of a heat storage cold plate, the bottom surface of the cold plate is the heating surface of the electric heating block, and the top surface can be an adiabatic surface, and the top surface can also be connected with a compact heat exchanger as a heat dissipation surface, or made into Radiant cooling surface.

For the heating block under certain power, the surface of the electric heating block is coated with different types and colors of organic paint, colored paint, radiation paint, etc. to increase the radiation heat dissipation of the heating block. It is also possible to coat the surface of the cooling device composed of a radiator plate, a radiator cover, a fin radiator, and a cold plate on the above-mentioned heating block according to the calorific value of the heating block to further help the above radiator to dissipate heat.

Fig. 16 is a partial structural schematic diagram of the circuit cooling system in which the radiator is installed in the teaching experiment device for heat dissipation of electronic equipment in the embodiment. As shown in Figure 16, the loop cooling system is installed in the radiator installation part, the heating block is placed in the groove of the loop cooling system to dissipate heat, and the loop cooling system is equipped with a coolant supplement tank, a pump and a heat exchanger (also A heat exchanger compatible with the action of the pump can be used), the cooling liquid flows through the fin radiator installed on the copper plate under the drive of the pump, and the temperature of the cooling liquid rises after absorbing the heat dissipated by the copper plate, and the heated cooling liquid flows through a The heat exchanger unit reduces the heat, and the pump continues to circulate the cooling. According to the calorific value and limited temperature of the heating block, water or refrigerant can be used as cooling liquid. At this time, pay attention to the sealing of the channel of the circuit system when selecting the refrigerant to prevent the refrigerant from leaking into the air.

The above liquid-cooled fin radiators, heat pipe fin radiators, thermoelectric cooling fin radiators, cold plate radiators or microscale heat exchangers can all be put into the cooling circuit channel.

Corresponding to the above cooling devices, use the heat source power regulator to adjust the power applied by the electric heating block, and at the same time, the temperature measuring instrument measures the surface temperature of the heating block, and records the applied power and the surface temperature of the heat source whose temperature is basically constant and within the allowable range. These data are sent to the display, and the display displays the above data, thereby obtaining the range of heat dissipation of each device, and evaluating the heat dissipation device.

If finned radiators, heat pipes, radiation coatings or cooling fluids are used in the experimental device, different types of finned radiators, heat pipes, radiation cooling coatings, and cooling fluids are used for experiments, and the heat dissipation range of the device is recorded. Experiments were carried out on different power fans and thermoelectric refrigeration sheet experimental devices to obtain the range of heat dissipation.

Because there are different types of ribs and fins, the power of fans and cooling fins can be adjusted, and there are many types of heat dissipation or cooling fluids. In the experiment, it will be found that the range of heat dissipation of different heat dissipation devices will also overlap.

The teaching experiment device for heat dissipation of electronic equipment can also be used to study the heat generation performance of different heat sources of the same type, and the heat source can also be replaceably installed on the heat source installation part.

There may also be multiple radiator mounting parts in the teaching experiment device for heat dissipation of electronic equipment, and correspondingly multiple radiators may be installed.

Function and effect of embodiment

The teaching experiment device for heat dissipation of electronic equipment provided in this embodiment can enable users to evaluate and learn different heat dissipation technologies or heat dissipation schemes and study the heat generation performance of heat sources through experiments, improve research and development and learning efficiency, and has a simple structure and is easy to use.

Claims (6)

1. A teaching experimental device for heat dissipation of electronic equipment, characterized in that it comprises: At least one heat source; multiple radiators; heat source mounting portion; radiator mounting portion; temperature measuring instrument, Wherein, the heat source is installed on the heat source installation part, The heat sink dissipates heat from the heat source and is installed on the heat sink installation part, Corresponding to one of the heat sources, the teaching device has the heat source installation part and at least one radiator installation part, and when one heat source is installed on the heat source installation part, corresponding to the heat source, the radiator The mounting part can replaceably mount various kinds of the heat sinks, The temperature measuring instrument measures the temperature of the heat source. 2. The teaching experiment device for heat dissipation of electronic equipment according to claim 1, further comprising: a heat source power regulator; a temperature display, Wherein, the heat source power regulator adjusts the power of the heat source; The temperature measuring instrument measures the temperature of the heat source with different powers and outputs the temperature to the temperature display The temperature display displays the temperature sent by the temperature measuring instrument. 3. The teaching experiment device for heat dissipation of electronic equipment according to claim 1, characterized in that: Corresponding to one of the heat sources, the various radiators are: finned radiators, cold plates, thermoelectric cooling sheets, ordinary heat pipes, gravity-assisted heat pipes, variable heat pipes, oscillating heat pipes, loop heat pipes, phase change radiators, The combined heat dissipation device formed by the combination of the radiation radiator and the above-mentioned devices, together with power machinery such as fans and pumps constitutes a heat dissipation module, and the radiator installed on the radiator installation part is one of the above-mentioned types. 4. The teaching experiment device for heat dissipation of electronic equipment according to claim 3, characterized in that: Wherein, the fins in the fin radiator are longitudinal ribs with rectangular cross-section, longitudinal ribs with trapezoidal cross-section, cylindrical needle ribs, rectangular needle ribs, longitudinal ribs with triangular cross-section, longitudinal ribs with concave parabolic cross-section, needle ribs with concave parabolic cross-section, A type of conical needle rib species. 5. The teaching experiment device for heat dissipation of electronic equipment according to claim 1, characterized in that: There are more than two radiator installation parts, and various radiators that can be installed include finned radiators, cold plates, thermoelectric cooling fins, ordinary heat pipes, gravity-assisted heat pipes, variable heat pipes, oscillating heat pipes, loop heat pipes, A combined heat dissipation device formed by a phase change radiator, a radiation radiator, and the above-mentioned devices, plus power machinery such as a fan and a pump to form a heat dissipation module, corresponding to one heat source, at least two of the various radiators A type is mounted on the heat sink mounting portion. 6. The teaching experiment device for heat dissipation of electronic equipment according to claim 1, characterized in that: Wherein, the heat source is multiple, and the heat source installed in the heat source installation part is one of the multiple types.

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