CN102663943A - Teaching experiment device for radiation of electronic equipment - Google Patents
Teaching experiment device for radiation of electronic equipment Download PDFInfo
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- CN102663943A CN102663943A CN2012101411806A CN201210141180A CN102663943A CN 102663943 A CN102663943 A CN 102663943A CN 2012101411806 A CN2012101411806 A CN 2012101411806A CN 201210141180 A CN201210141180 A CN 201210141180A CN 102663943 A CN102663943 A CN 102663943A
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Abstract
The invention provides a teaching experiment device for radiation of electronic equipment. The device comprises at least one heat source, a plurality of radiators, a heat source installation part, a radiator installation part and a temperature measuring instrument, wherein the heat source is arranged on the heat source installation part, the radiators are arranged on the radiator installation part and used for radiating the heat source; for one heat source, the teaching experiment device is provided with the heat source installation part and the at least one radiator installation part, when one heat source is arranged on the heat source installation part, the radiator installation part is replaceably provided with a plurality of radiators corresponding to the heat source, and the temperature measuring instrument measures the temperature of the heat source. The teaching experiment device can enable a user to evaluate and learn different radiation technologies or radiation schemes and research the heating property of the heat source through experiments, thus improving the research and development and learning efficiency, and being simple in structure and convenient to use.
Description
Application
A kind of electronic equipment dissipating heat that is applied in correlated curriculum education experiment, the electronic product heat sink conception R&D process that relates to the electronic equipment dissipating heat technical field is used experimental provision.
Background technology
Thermal environment produces material impact to the operate as normal of most of electronic equipments.Exceed the device design temperature and can cause components and parts to quicken to lose efficacy, thereby cause that entire equipment lost efficacy.Design proposes to be strict with to electronic equipment dissipating heat for this.
The electronic equipment dissipating heat technology is divided into active heat removal and passive heat dissipation technology.Passive heat dissipation technology does not need the additive decrementation energy, mainly leans on electronic equipment and continuous radiating element natural convection, heat conduction, heat radiation or phase-change heat transfer to make the electronic device works temperature be able to control.Can not satisfy heat radiation when requiring when passive heat radiation, need to use the active heat removal technology.For example adopt the forced gas heat loss through convection of fan, the pressure liquid heat loss through convection that adopts pump, thermoelectric cooling technology etc.
Based on active and passive heat dissipation technology; The combined radiator spare that the radiating element that uses now has finned radiator, cold drawing, thermoelectric module, general heat pipe, gravity auxiliary heat pipe, variable heat conduction pipe, oscillating heat pipe, loop circuit heat pipe, phase-change heat sink, radiator and above-mentioned combination of devices to form adds that power machines such as fan, pump constitute the heat radiation module.
The industrial circle electronic equipment dissipating heat method has much now, but all is concrete product arranged heat sink conception is individual targetedly, lacks a cover and supplies heat dissipation design and use to different product, thermal value different radiating scheme experiment porch.In the teaching process of correlated curriculum, do not have to find that such experimental provision is arranged yet, can let the characteristics and the heat-sinking capability of students various different heat dissipation technologys from the experimental middle school to the electronic equipment, the problem and the solution that exist when various heat dissipation technologys are used.
Summary of the invention
To above problem, the present invention proposes a cover electronic equipment dissipating heat and uses experimental provision, can make the user pass through experiment, and assessment and study different radiating technology or heat sink conception improve research and development or learning efficiency.
Electronic equipment dissipating heat of the present invention comprises that with experimental provision a kind of electronic equipment dissipating heat uses experiment device for teaching, it is characterized in that, comprising: at least a thermal source, multiple heating radiator, thermal source installation portion, heating radiator installation portion, temperature measuring set.Wherein, thermal source is installed on the thermal source installation portion, and heating radiator dispels the heat to thermal source and is installed on the heating radiator installation portion; Corresponding to a thermal source; Instructional device has thermal source installation portion and at least one heating radiator installation portion, when the thermal source installation portion has been installed a thermal source, corresponding to this thermal source; The heating radiator installation portion is installed multiple heating radiator replaceably, and temperature measuring set can be measured the temperature of thermal source.
Further, electronic equipment dissipating heat provided by the invention can also comprise with experiment device for teaching: a power of heat source regulator and a temperature indicator, and the power of heat source regulator is regulated the power of thermal source; Temperature measuring set measure different capacity thermal source temperature and export this temperature to temperature indicator; The temperature that temperature indicator displays temperature measuring instrument sends over.
Further; Electronic equipment dissipating heat provided by the invention can also have such characteristic with experiment device for teaching: corresponding to a thermal source; Multiple heating radiator is respectively: the combined radiator spare that finned radiator, cold drawing, thermoelectric module, general heat pipe, gravity auxiliary heat pipe, variable heat conduction pipe, oscillating heat pipe, loop circuit heat pipe, phase-change heat sink, radiator and above-mentioned combination of devices form; Add that power machines such as fan, pump constitute the heat radiation module, be installed in heating radiator on the heating radiator installation portion and be a kind of in multiple.
Further; Electronic equipment dissipating heat provided by the invention can also have such characteristic with experiment device for teaching: the fin in the finned radiator can be the square-section longitudinal rib, trapezoidal cross-section longitudinal rib, cylindrical needle rib, rectangle pin rib, triangular section longitudinal rib, spill para-curve section longitudinal rib, spill para-curve section pin rib, circular cone pin rib kind a kind of.
Further; Electronic equipment dissipating heat provided by the invention can also have such characteristic with experiment device for teaching: the heating radiator installation portion is more than two; The multiple heating radiator that can install is the combined radiator spare that finned radiator, cold drawing, thermoelectric module, general heat pipe, gravity auxiliary heat pipe, variable heat conduction pipe, oscillating heat pipe, loop circuit heat pipe, phase-change heat sink, radiator and above-mentioned combination of devices form; Add that power machines such as fan, pump constitute the heat radiation module; Corresponding to a thermal source, at least two kinds in the multiple heating radiator are installed on the heating radiator installation portion.
Further, electronic equipment dissipating heat provided by the invention can also have such characteristic with experiment device for teaching: thermal source is multiple, and the thermal source that the thermal source installation portion is installed is a kind of in multiple.
Invention effect and effect
Electronic equipment dissipating heat provided by the invention can make the user pass through experiment with experiment device for teaching, and the performance of assessment and study different radiating technology or heat sink conception and the heating of research thermal source improves research and development and learning efficiency, and is simple in structure, easy to use.
Description of drawings
Fig. 1 is that electronic equipment dissipating heat among the embodiment is with the structural representation of experiment device for teaching;
Fig. 2 is that the electronic equipment dissipating heat among the embodiment uses the thermal source installed in the experiment device for teaching part-structure synoptic diagram as the electrical heating piece;
Fig. 3 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as heat sink;
Fig. 4 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as finned radiator;
Fig. 5 is the dissimilar fin that is used for finned radiator;
Fig. 6 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as heat-pipe radiator;
Fig. 7 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the heat pipe finned radiator;
Fig. 8 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the thermoelectric cooling heat sink;
Fig. 9 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the thermoelectric cooling finned radiator;
Figure 10 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the fan finned radiator;
Figure 11 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the cold drawing heat abstractor;
Figure 12 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as thermoelectric cooling cold drawing heat abstractor;
Figure 13 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the heat pipe cold plate heat abstractor;
Figure 14 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as solution-air phase transformation cooling system;
Figure 15 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as solid-liquid phase change cooling system-heat accumulation cold drawing;
Figure 16 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the circuit cools system;
Embodiment
Fig. 1 is that electronic equipment dissipating heat among the embodiment is with the structural representation of experiment device for teaching; As shown in Figure 1; The electronic equipment dissipating heat that in the R&D process of education experiment and electronic product, uses comprises with experiment device for teaching: thermal source, multiple heating radiator, thermal source installation portion, heating radiator installation portion, temperature measuring set; The power of heat source regulator, temperature indicator.Wherein, thermal source is used for the heating of duty of analog electronic equipment, is installed on the thermal source installation portion; Heating radiator is used for the thermal source heat radiation is installed on the heating radiator installation portion, and the heating radiator installation portion is installed multiple heating radiator replaceably; The power of heat source regulator is used to regulate the power of said thermal source; Temperature measuring set be used to measure different capacity thermal source temperature and export this temperature to temperature indicator; The temperature of temperature indicator in order to show that said temperature measuring set sends over.
Fig. 2 is that the electronic equipment dissipating heat in the present embodiment uses the thermal source installed in the experiment device for teaching part-structure synoptic diagram as the electrical heating piece.As shown in Figure 1; Thermal source in the present embodiment is the electrical heating piece, thereby when the operating power of power of heat source regulator adjusting electrical heating piece changed operating power, the temperature that keep electric electrical heating piece was in the requirement temperature range; Just need be according to its heating power density; Select suitable radiating element, heat radiation module, heat is in time taken away
This electronic equipment dissipating heat uses the multiple heating radiator in the experiment device for teaching to be the combined radiator spare that finned radiator, cold drawing, thermoelectric module, general heat pipe, gravity auxiliary heat pipe, variable heat conduction pipe, oscillating heat pipe, loop circuit heat pipe, phase-change heat sink, radiator and above-mentioned combination of devices form, and adds that power machines such as fan, pump constitute the heat radiation module.
The heating radiator installation portion is installed multiple heating radiator replaceably:
Fig. 3 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as heat sink.As shown in Figure 2; The heating radiator of installing on the heating radiator installation portion is a heat sink; When electrical heating power is very little; Rely on electrical heating piece self convection current and heat loss through radiation to get final product dissipated heat, transfer big electrical heating power to itself passive heat radiation to exceed limiting temperature, consideration on the electrical heating piece, add the rectangle sheet heat sink.
This heat sink also can rectangular sheet, disk, circular ring plate or the like, and the heat sink material can be metal material (for example aluminium, copper), pottery, graphite, alloy material, synthetic material etc.
Fig. 4 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as finned radiator; Fig. 5 is the dissimilar fin that is used for finned radiator.Like Fig. 4, shown in 5, according to thermal value and limiting temperature, the heating radiator of installing on the heating radiator installation portion is a finned radiator.The kind of finned radiator is a lot, according to wing shape the square-section longitudinal rib is arranged, trapezoidal cross-section longitudinal rib, cylindrical needle rib, rectangle pin rib, triangular section longitudinal rib, spill para-curve section longitudinal rib, spill para-curve section pin rib, circular cone pin rib etc.
Fig. 6 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as heat-pipe radiator; Fig. 7 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the heat pipe finned radiator.Like Fig. 6, shown in 7, according to thermal value and limiting temperature, the dress heat pipe can be assembled into the heat pipe heat radiation plate on above-mentioned heat sink, it is installed on the heating radiator installation portion electric heating is dispelled the heat soon; The dress heat pipe can be assembled into the heat pipe heat radiation plate and comes electric heating is dispelled the heat soon on above-mentioned fin heat sink.
Heat pipe can be general heat pipe, gravity auxiliary heat pipe, variable heat conduction pipe, oscillating heat pipe (claiming pulsating heat pipe again) and loop circuit heat pipe etc.
Fig. 8 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the thermoelectric cooling heat sink; Fig. 9 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the thermoelectric cooling finned radiator.Like Fig. 8, shown in 9,, the cold junction that is contained in the thermoelectric semiconductor cooling piece on the heating radiator installation portion and heat block are formed the thermoelectric cooling heat sink and are installed on the heating radiator installation portion electrical heating piece is dispelled the heat with linking to each other according to thermal value and limiting temperature; With linking to each other with thermoelectric semiconductor cooling piece cold junction on the heat block, thermoelectric semiconductor cooling piece hot junction installation heat sink formation thermoelectric cooling heat sink is installed on the heating radiator installation portion heat block is dispelled the heat; Thermoelectric semiconductor cooling piece hot junction installation finned radiator formation thermoelectric cooling finned radiator is installed on the heating radiator installation portion heat block is dispelled the heat.
Figure 10 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the fan finned radiator.Shown in figure 10, to the electrical heating piece under certain power, regulate fan power with the fan finned radiator and regulate air quantity.
Wherein, fan can be air draught or Air Blast fan, the installation site can the finned radiator side or above.Fan also can be applicable to above-mentioned heat pipe finned radiator, the thermoelectric cooling finned radiator is assembled into fan heat pipe finned radiator and fan thermoelectric cooling finned radiator, and fan can be installed in above the finned radiator and side, adjustable power.
Figure 11 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the cold drawing heat abstractor; Figure 12 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as thermoelectric cooling cold drawing heat abstractor; Figure 13 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the heat pipe cold plate heat abstractor.Like Figure 11,12, shown in 13; According to thermal value and limiting temperature; Can on the heat block of heat block, the heat block of adorning thermoelectric module, dress heat pipe, form different cold drawing heat abstractors respectively by the dress cold drawing; Cold drawing can be that the ventilation type cold drawing also can be the liquid-cooled cold drawing, can ventilate between plate body or liquid, and liquid-gas phase transition also can take place in liquid-cooled.Cold drawing has pipe to add flat type, has board-like and plate-fin.
According to thermal value and limiting temperature; The microscale heat interchanger is installed in makes it on the heating radiator installation portion electrical heating piece to be dispelled the heat with the bonding formation microscale of heat block heat exchanger apparatus; Combined being installed in the hot junction of microscale heat interchanger and thermoelectric module made it on the heating radiator installation portion with the bonding formation microscale of heat block thermoelectric cooling heat abstractor the electrical heating piece to be dispelled the heat, microscale heat interchanger and combined being installed in of heat pipe condenser section are made it on the heating radiator installation portion with the bonding formation microscale of heat block heat pipe condensation heat abstractor the electrical heating piece to be dispelled the heat.
Wherein there are various ways such as circle, rectangle, trapezoidal, triangle, I shape and porous medium runner cross section in the miniature conduit cross section in the microscale heating radiator.
Figure 14 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as solution-air phase transformation cooling system; Figure 15 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as solid-liquid phase change cooling system-heat accumulation cold drawing.Like Figure 14, shown in 15, according to thermal value and limiting temperature, the phase transformation refrigeratory is installed on the heating radiator installation portion electrical heating piece is dispelled the heat, wherein, the phase transformation refrigeratory comprises that liquid-gas phase becomes refrigeratory and solid-liquid phase change refrigeratory.
It can be direct immersion and indirect type that liquid-gas phase becomes refrigeratory.Directly the submergence cooling has direct consumption cryogen cooling, have in vapor space outside or the condenser cooling is put in the inside, in addition with the cooling of submergence condenser or the like, turning cold mutually indirectly has expendable cryogen and non-expendable cryogen.
When the solid-liquid phase change refrigeratory cooled off with the form of heat accumulation cold drawing, the cold drawing bottom surface was an electrical heating piece heating surface, and end face can be adiabatic face, and end face also can be connected as radiating surface with compact heat exchanger, perhaps makes the heat loss through radiation face.
To the heat block under some power, increase the heat loss through radiation of heat block at the organic varnish of electrical heating piece surface-coated variety classes and color, colored paint, radiation paint etc.Thereby also can on above-mentioned heat block, adorn the heat abstractor surfaces coated that heat sink, heat dissipating housing, finned radiator, cold drawing form and further help above radiator heat-dissipation to coat according to the heat block thermal value.
Figure 16 is that the electronic equipment dissipating heat among the embodiment uses the heating radiator installed in the experiment device for teaching part-structure synoptic diagram as the circuit cools system.Shown in figure 16; The circuit cools system is installed in the heating radiator installation portion; Heat block be placed in the groove of circuit cools system from but heat radiation; Liquid coolant supplemental tank, pump and heat exchanger (the also heat exchanger of available compatible pumping action) are housed in the circuit cools system, and liquid coolant is flowed through under the driving of pump and is installed in the finned radiator on the copper coin, and coolant temperature raises behind the heat that the absorption copper coin sheds; Flow through again heat exchanger device of liquid coolant after the intensification reduces heat, drives at pump and continues circulation down and cool off.According to heat block thermal value and limiting temperature, available water or cold-producing medium are made liquid coolant.When note selecting cold-producing medium for use this moment the circuit system conduit to seal in case freezing medium leakage in air.
More than finned radiator, heat pipe fin heat abstractor, thermoelectric cooling fin heat abstractor, cold drawing heat abstractor or the microscale heat exchanger apparatus etc. of available liquid cooling all can put into the cooling circuit conduit.
Correspond respectively to above heat abstractor; Regulate electrical heating power that piece adds with the power of heat source regulator; The simultaneous temperature measuring instrument is measured the heat block surface temperature, write down its temperature substantially constant and in allowed band add the surface temperature of power and thermal source and these data sent to display, display shows above data; Thereby draw the scope of the heat dissipation capacity of every kind of device, the assessment heat abstractor.
Use finned radiator, heat pipe, radiation paint or cooling working medium in the experimental provision, adopt dissimilar finned radiators, heat pipe, heat loss through radiation coating, cooling working medium to experimentize respectively, pen recorder heat dissipation capacity scope.Fan, thermoelectric module experimental provision to different capacity experimentize respectively, draw the heat dissipation capacity scope.
Because different fins, fin type are arranged, fan, cooling piece power is all adjustable, and heat radiation or refrigeration working medium kind are a lot, can find in the experiment that the heat dissipation capacity scope of different heat abstractors also has overlapping.
This electronic equipment dissipating heat can also be used to the heating property of different heat sources of the same type is studied with experiment device for teaching, and thermal source wherein also can be installed on the thermal source installation portion for removable.
This electronic equipment dissipating heat also can be for a plurality of with the heating radiator installation portion in the experiment device for teaching, corresponding a plurality of heating radiators can be installed.
Embodiment effect and effect
The electronic equipment dissipating heat that present embodiment provides can make the user pass through experiment with experiment device for teaching, and the performance of assessment and study different radiating technology or heat sink conception and the heating of research thermal source improves research and development and learning efficiency, and is simple in structure, easy to use.
Claims (6)
1. an electronic equipment dissipating heat is used experiment device for teaching, it is characterized in that, comprising:
At least a thermal source; Multiple heating radiator; The thermal source installation portion; The heating radiator installation portion; Temperature measuring set,
Wherein, said thermal source is installed on the said thermal source installation portion,
Said heating radiator dispels the heat to said thermal source, is installed on the said heating radiator installation portion,
Corresponding to a said thermal source; Said instructional device has said thermal source installation portion and at least one heating radiator installation portion, when said thermal source installation portion has been installed a said thermal source, corresponding to this said thermal source; Said heating radiator installation portion is installed multiple said heating radiator replaceably
Said temperature measuring set is measured the temperature of said thermal source.
2. electronic equipment dissipating heat according to claim 1 is used experiment device for teaching, it is characterized in that, also comprises:
A power of heat source regulator; A temperature indicator,
Wherein, said power of heat source regulator is regulated the power of said thermal source;
Said temperature measuring set, measure different capacity said thermal source temperature and export this temperature to said temperature indicator
Said temperature indicator shows the temperature that said temperature measuring set sends over.
3. electronic equipment dissipating heat according to claim 1 is used experiment device for teaching, it is characterized in that:
Corresponding to a said thermal source; Multiple heating radiator is respectively: the combined radiator spare that finned radiator, cold drawing, thermoelectric module, general heat pipe, gravity auxiliary heat pipe, variable heat conduction pipe, oscillating heat pipe, loop circuit heat pipe, phase-change heat sink, radiator and above-mentioned combination of devices form; Add that power machines such as fan, pump constitute the heat radiation module, be installed in heating radiator on the said heating radiator installation portion and be said a kind of in multiple.
4. electronic equipment dissipating heat according to claim 3 is used experiment device for teaching, it is characterized in that:
Wherein, the fin in the said finned radiator is the square-section longitudinal rib, trapezoidal cross-section longitudinal rib, cylindrical needle rib, rectangle pin rib, triangular section longitudinal rib, spill para-curve section longitudinal rib, spill para-curve section pin rib, circular cone pin rib kind a kind of.
5. electronic equipment dissipating heat according to claim 1 is used experiment device for teaching, it is characterized in that:
Said heating radiator installation portion is more than two; The multiple heating radiator that can install is the combined radiator spare that finned radiator, cold drawing, thermoelectric module, general heat pipe, gravity auxiliary heat pipe, variable heat conduction pipe, oscillating heat pipe, loop circuit heat pipe, phase-change heat sink, radiator and above-mentioned combination of devices form; Add that power machines such as fan, pump constitute the heat radiation module; Corresponding to a said thermal source, at least two kinds in the said multiple heating radiator are installed on the said heating radiator installation portion.
6. electronic equipment dissipating heat according to claim 1 is used experiment device for teaching, it is characterized in that:
Wherein, said thermal source is multiple, and the thermal source that said thermal source installation portion is installed is said a kind of in multiple.
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| CN2012101411806A CN102663943A (en) | 2012-05-09 | 2012-05-09 | Teaching experiment device for radiation of electronic equipment |
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| CN2012101411806A CN102663943A (en) | 2012-05-09 | 2012-05-09 | Teaching experiment device for radiation of electronic equipment |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103415191A (en) * | 2013-08-20 | 2013-11-27 | 南京理工大学 | Temperature equalizing device of heat pipe/micro channel cold plate composite structure |
| CN103646589A (en) * | 2013-11-27 | 2014-03-19 | 西安理工大学 | A method for demonstrating an influence factor of the heat-dissipating efficiency of a heat-conducting pipe heat dissipater |
| CN107481606A (en) * | 2017-09-19 | 2017-12-15 | 西安电子科技大学 | Experimental teaching unit for Thermal Design of Electronic Equipments |
| CN107995837A (en) * | 2017-12-28 | 2018-05-04 | 深圳红河马智能数字动力技术有限公司 | Air-cooled, water cooling two uses radiator |
| CN114624042A (en) * | 2022-03-31 | 2022-06-14 | 英业达科技有限公司 | Electronic device heat dissipation test system |
| CN114739717A (en) * | 2022-06-13 | 2022-07-12 | 中国飞机强度研究所 | Waterway system for testing ground thermal strength of aerospace plane and design method thereof |
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| CN101000516A (en) * | 2006-01-10 | 2007-07-18 | 英业达股份有限公司 | Connecting method and device for multiple fan |
| CN101583262A (en) * | 2008-05-16 | 2009-11-18 | 宏碁股份有限公司 | Liquid-cooled heat dissipation device |
| CN101937263A (en) * | 2009-07-01 | 2011-01-05 | 鸿富锦精密工业（深圳）有限公司 | Computer heat radiator bracket |
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| CN101000516A (en) * | 2006-01-10 | 2007-07-18 | 英业达股份有限公司 | Connecting method and device for multiple fan |
| CN101583262A (en) * | 2008-05-16 | 2009-11-18 | 宏碁股份有限公司 | Liquid-cooled heat dissipation device |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103415191A (en) * | 2013-08-20 | 2013-11-27 | 南京理工大学 | Temperature equalizing device of heat pipe/micro channel cold plate composite structure |
| CN103646589A (en) * | 2013-11-27 | 2014-03-19 | 西安理工大学 | A method for demonstrating an influence factor of the heat-dissipating efficiency of a heat-conducting pipe heat dissipater |
| CN103646589B (en) * | 2013-11-27 | 2016-06-01 | 西安理工大学 | A kind of method for showing heat pipe radiator heat radiation efficiency affecting factors |
| CN107481606A (en) * | 2017-09-19 | 2017-12-15 | 西安电子科技大学 | Experimental teaching unit for Thermal Design of Electronic Equipments |
| CN107481606B (en) * | 2017-09-19 | 2023-04-07 | 西安电子科技大学 | Experiment teaching device for thermal design of electronic equipment |
| CN107995837A (en) * | 2017-12-28 | 2018-05-04 | 深圳红河马智能数字动力技术有限公司 | Air-cooled, water cooling two uses radiator |
| CN114624042A (en) * | 2022-03-31 | 2022-06-14 | 英业达科技有限公司 | Electronic device heat dissipation test system |
| CN114739717A (en) * | 2022-06-13 | 2022-07-12 | 中国飞机强度研究所 | Waterway system for testing ground thermal strength of aerospace plane and design method thereof |
| CN114739717B (en) * | 2022-06-13 | 2022-08-26 | 中国飞机强度研究所 | Waterway system for testing ground thermal strength of aerospace plane and design method thereof |
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Application publication date: 20120912 |