CN212321492U

CN212321492U - Heat dispersion testing arrangement

Info

Publication number: CN212321492U
Application number: CN202021715518.0U
Authority: CN
Inventors: 张荣明; 付娟; 关宏山; 宋敏; 王虎; 叶锐; 张亚玎; 方旭; 李潇峰; 杨猛; 林泉; 王磊
Original assignee: CETC 38 Research Institute
Current assignee: CETC 38 Research Institute
Priority date: 2020-08-14
Filing date: 2020-08-14
Publication date: 2021-01-08
Anticipated expiration: 2030-08-14

Abstract

The utility model provides a heat dispersion testing arrangement, including the chassis, the chassis is put on the shelf and is equipped with the removal frame, removes the unsettled integration heat source that can change the height that is provided with on the frame, and the radiator unit has been placed to thermal-insulated on the chassis, and radiator unit surface detachable is fixed with first temperature sensor, and the integration heat source is provided with second temperature sensor with the part of radiator unit contact. The utility model provides a heat dispersion testing arrangement's advantage lies in: the integrated heat source is hung on the chassis in a suspension mode, the radiating assembly is placed on the chassis, the integrated heat source heat sink is suitable for radiating assemblies of different types and specifications, effective contact between the heat source and the radiating assembly is guaranteed, the heat source temperatures of the radiating assembly and the radiating assembly are collected through the first temperature sensor and the second temperature sensor respectively, the temperature of the integrated heat source can be adjusted as required to reach the testing temperature, the result of whether the temperature on the surface of the radiating assembly exceeds a preset value is directly obtained, a middle calculation link is omitted, and the result is more visual.

Description

Heat dispersion testing arrangement

Technical Field

The utility model relates to a radiator unit's capability test technical field especially relates to a heat dispersion testing arrangement.

Background

At present, the evaluation of electronic equipment thermal control means in China mostly depends on theoretical calculation and simulation technology, along with the development of the electronic technology, high-power-consumption electronic devices are increased, and the existing chassis basically adopts standard modules, so that the heat flow density is high, the heat dissipation space is small, the problems brought by the method are that the requirement on the heat dissipation performance of the electronic equipment is higher and higher, the diversification and integration of thermal control modes and the complication of heat transfer paths are caused, and the complex boundary conditions all provide higher and accurate requirements on the establishment of a simulation model, the division of grids and the setting of empirical parameters in the simulation process. Therefore, whether the thermal control simulation result has accurate actual reference needs to be verified by a thermal control test, and a set of electronic equipment sample is put into production, so that the period is long, and the cost is too heavy. Therefore, a set of general thermal performance test platform is urgently needed to quantitatively test thermal control means, accumulate engineering data, verify theoretical simulation results, provide important guidance for the accuracy of some empirical parameters in the simulation process, provide important data basis for designers to better develop thermal control work, and greatly improve the thermal control design capability of electronic equipment.

The utility model patent application with publication number CN110672659A discloses a double-sided water-cooled plate heat dissipation performance testing device, which is characterized in that temperature measuring components and matched electric heating rods, thermal resistors and other devices are respectively arranged on two sides of a water-cooled plate, the temperature of the thermal resistor is measured according to the temperature measuring components, and the water outlet temperature of a water outlet plate is obtained to test the heat dissipation performance of the water-cooled plate, but the testing device can only test the water-cooled plate with specific specification, and the water-cooled plate is required to be provided with a threaded hole for installing the temperature measuring components or other assembly components, so that the applicability is poor; in addition, the water temperature is measured, whether the heat dissipation performance of the water cooling plate is qualified or not can be known through some calculation, and the structure is not visual enough.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a heat dispersion testing arrangement suitable for different radiator unit is provided.

The utility model discloses a solve above-mentioned technical problem through following technical scheme: the utility model provides a heat dispersion testing arrangement, includes the chassis, and the chassis is put on the shelf and is equipped with the removal frame, removes the unsettled integration heat source that can change the height that is provided with on the frame, and the radiator unit has been placed to thermal-insulated on the chassis, and radiator unit surface detachable is fixed with first temperature sensor, and the part of integration heat source and radiator unit contact is provided with second temperature sensor.

The utility model discloses hang the integration heat source is unsettled on the chassis, radiator unit places on the chassis, thereby can be applicable to the radiator unit of different grade type and specification, and guarantee heat source and radiator unit's effective contact, gather the temperature on radiator unit surface optional position and heat source surface respectively through first temperature sensor and second temperature sensor, can adjust the working condition of calorific capacity in order to simulate actual electron device of integration heat source as required, and directly obtain the result of whether radiator unit surface temperature surpasses the default, the calculation link in the middle of having saved, the result is more directly perceived.

Preferably, the heat dissipation assembly at least comprises a cold plate, two liquid cooling platforms are arranged on the chassis, the liquid cooling platforms are of hollow structures, one ends of the two liquid cooling platforms in the length direction are provided with liquid connectors, and the other ends of the two liquid cooling platforms are communicated with each other through pipelines.

Preferably, the liquid cooling platform is fixedly provided with a heat insulation slide block matched with the chassis below, and the heat insulation slide block can slide on the chassis along the direction vertical to the liquid cooling platform.

Preferably, the chassis is fixed with the fixed plate respectively with liquid cooling platform vertically both ends, the upper end of fixed plate surpasss the upper surface of chassis, is provided with the spout that is in above the chassis upper surface along length direction on the fixed plate, and the terminal surface of thermal-insulated slider is provided with and is in the screw hole of same height with the spout.

Preferably, the chassis is provided with at least one limiting groove at two ends of the vertical liquid cooling platform respectively; the bottom of the heat insulation sliding block is provided with a convex block which is in sliding fit with the limiting groove.

Preferably, the two sides of the chassis are respectively and fixedly provided with an angle plate, and the liquid cooling platform is positioned between the two angle plates and is parallel to the angle plates; the movable rack is characterized in that at least two movable racks are arranged on the chassis and comprise two vertical plates matched with corner plates on two sides and a movable plate fixedly matched with the two vertical plates, an adjusting groove is formed in the movable plate along the length direction, and the integrated heat source is suspended below the movable racks through a fixed rod fixedly matched with the adjusting groove.

Preferably, a plurality of adjusting grooves are arranged in parallel on the same moving plate, the vertical plate is matched with the vertical surface of the angle plate, and the vertical surface of the angle plate is provided with a strip-shaped groove fixedly matched with the vertical plate along the length direction.

Preferably, the rod body of the fixed rod is screwed with two adjusting nuts which are respectively arranged on the upper part and the lower part of the movable plate, the fixed rod freely penetrates through the adjusting groove, and the lower end of the fixed rod is fixedly connected with a connecting plate fixedly connected with the integrated heat source in a screwed mode.

Preferably, the integrated heat source comprises a heat insulation plate fixedly matched with the connecting plate and a heat conduction plate fixedly matched with the heat insulation plate, a heating element is fixedly connected to the upper surface of the heat conduction plate, a temperature measurement groove communicated with the side edge is formed in the lower surface of the heat conduction plate, and the second temperature sensor is accommodated in the temperature measurement groove and connected with the heat conduction plate.

Preferably, a heat conducting block is fixedly arranged on the lower surface of the heat conducting plate, and the temperature measuring groove is formed in the lower surface of the heat conducting block.

The utility model provides a heat dispersion testing arrangement's advantage lies in: the integrated heat source is hung on the chassis in a suspended mode, the radiating assembly is placed on the chassis, so that the radiating assembly is suitable for radiating assemblies of different types and specifications, effective contact between the heat source and the radiating assembly is guaranteed, the temperature of any position on the surface of the radiating assembly and the temperature of the heat source are collected through the first temperature sensor and the second temperature sensor respectively, the heat productivity of the integrated heat source can be adjusted according to needs to simulate the working condition of an actual electronic device, the result of whether the surface temperature of the radiating assembly exceeds a preset value is directly obtained, an intermediate calculation link is omitted, and the result is more visual; by arranging the liquid cooling platform, different types of radiating assemblies can be simulated, the interval of the liquid cooling platform can be adjusted according to the specification of the cold plate, and the application range is wide; the movable frame is matched with the angle plate, and the fixed rod is matched with the movable frame, so that the integrated heat source can heat any position on the surface of the cold plate, and different test requirements are met; the second temperature sensor is arranged at a position close to the cold plate, so that the real heat source temperature of the cold plate can be more accurately obtained, and the accuracy of the result is improved.

Drawings

Fig. 1 is an exploded view of a heat dissipation performance testing apparatus according to an embodiment of the present invention;

fig. 2 is a schematic view of a heat dissipation performance testing apparatus according to an embodiment of the present invention;

fig. 3 is an exploded view of an integrated heat source of the heat dissipation performance testing apparatus according to an embodiment of the present invention;

fig. 4 is a schematic view of a usage state of the heat dissipation performance testing apparatus according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 1, the present embodiment provides a heat dissipation performance testing apparatus for a heat dissipation assembly, which includes a chassis 1, a moving frame 2 is erected on the chassis 1, an integrated heat source 3 capable of changing height is suspended on the moving frame 2, a heat dissipation assembly (not shown) is placed on the chassis 1 in a heat insulation manner, a first temperature sensor (not shown) is detachably fixed on the surface of the heat dissipation assembly, and a second temperature sensor 31 is disposed at a contact portion of the integrated heat source 3 and the heat dissipation assembly; wherein first temperature sensor can select for use SMD temperature sensor to can paste on radiator unit's surface, conveniently change radiator unit, and need not carry out the adaptability design to radiator unit's structure.

This implementation is hung integration heat source 3 is unsettled on chassis 1, radiator unit places on chassis 1, thereby can be applicable to the radiator unit of different grade type and specification, and guarantee heat source and radiator unit's effective contact, gather the temperature of radiator unit surface optional position and heat source respectively through first temperature sensor and second temperature sensor 31, can adjust the working condition that actual electron device was simulated to calorific capacity of integration heat source 3 as required, and directly obtain the result of whether radiator unit surface temperature surpasss the default, the intermediate calculation link has been saved, the result is more directly perceived.

The heat dissipation assembly at least comprises a cold plate 4, two liquid cooling platforms 5 are arranged on the chassis 1, and the liquid cooling platforms 5 are of hollow structures; combine fig. 1 and fig. 2, the one end of the length direction of two liquid cooling platforms 5 is provided with liquid connector 51, the other end passes through pipeline 52 and communicates each other, be connected with liquid connector 51 through external liquid cold source, make two liquid cooling platforms 5 constitute circulation liquid cooling system, certainly also can set up more liquid cooling platforms 5, let every liquid cooling platform 5 cool off with external cold source intercommunication cooperation respectively, perhaps communicate a plurality of liquid cooling platforms 5 each other, only remain an export of import and constitute liquid cooling system with external cold source intercommunication, specifically can set up according to radiator unit's application scene.

The upper surface of the liquid cooling platform 5 is detachably provided with a heat insulation pad (not shown), and based on the matching of the cold plate 4, the liquid cooling platform 5 and the heat insulation pad, a heat dissipation assembly which only has the cold plate 4 and utilizes air to dissipate heat, a heat dissipation assembly of which the cold plate 4 is provided with a cooling liquid inlet and a cooling liquid outlet, and a heat dissipation assembly of which the cold plate 4 is externally provided with a liquid cooling system to dissipate heat can be simulated; the heat insulating pad can be fixedly connected with the upper surface of the liquid cooling platform 5 through bolts, so that the heat insulating pad is convenient to detach, and the upper end of each bolt is noticed to be settled below the upper surface of the heat insulating pad, so that the cold plate 4 is prevented from being damaged.

Referring to fig. 1, a heat insulation slider 53 matched with a chassis 1 is fixedly arranged below the liquid cooling platform 5, and the heat insulation slider 53 can slide on the chassis 1 along a direction vertical to the liquid cooling platform 5, so that the position and the distance of the liquid cooling platform 5 can be adjusted according to a heat dissipation component to be tested; the chassis 1 is fixed respectively with 5 vertically both ends of liquid cooling platform and is provided with fixed plate 11, and modes such as fixed plate 11 accessible spiro union, welding are fixed on the chassis, the upper end of fixed plate 11 surpasss the upper surface of chassis 1, is provided with spout 12 that is located above the chassis 1 upper surface along length direction on the fixed plate 11, and thermal-insulated slider 53's terminal surface is provided with and is in same high screw hole (not shown) with spout 12, through set up the bolt (not shown) that passes spout 12 on the screw hole, can fix thermal-insulated slider 53 or adjust thermal-insulated slider 53's position through adjusting bolt's elasticity.

At least one limiting groove 13 is respectively arranged at two ends of the vertical liquid cooling platform 5 on the chassis 1, and a convex block 54 in sliding fit with the limiting groove 13 is arranged at the bottom of the heat insulation sliding block 53, so that the fixing and guiding of the heat insulation sliding block 53 are realized in an auxiliary manner; the liquid cooling platform 5 can be fixed on the heat insulation slide block 53 by means of screwing, welding, gluing and the like.

An angle plate 14 is fixedly arranged on each of two sides of the chassis 1, the horizontal plane of the angle plate 14 is fixedly connected with the chassis 1 in a threaded manner, the vertical plane of the angle plate 14 is parallel to the liquid cooling platform 5, the liquid cooling platform 5 is positioned between the two angle plates 14, at least two moving frames 2 are arranged on the chassis 1, each moving frame 2 comprises two vertical plates 21 fixedly matched with the angle plates 14 on the two sides and a horizontal moving plate 22 fixedly matched with the two vertical plates, an adjusting groove 23 is formed in the moving plate 22 along the length direction, and the integrated heat source 3 is suspended below the moving plate 22 through a fixing rod 6 fixedly matched with the adjusting groove 23; specifically, two adjusting nuts 61 respectively arranged above and below the moving plate 22 are screwed on the rod body of the fixing rod 6, the fixing rod 6 freely penetrates through the adjusting groove 23, and the height of the fixing rod 6 and the matching position of the fixing rod and the adjusting groove 23 can be changed by adjusting the positions of the adjusting nuts 61; since only the integrated heat source 3 is required to be placed on the cold plate 4 in the present application, the requirement for heat supply to the cold plate 4 can be satisfied only by arranging the adjusting nut 61 above the moving plate 22.

The vertical surface of the angle plate 14 is provided with a strip-shaped groove 15 fixedly matched with the vertical plate 21 along the length direction, so that the position of the vertical plate 21 relative to the angle plate 14 can be adjusted as required, and the integrated heat source 3 can be placed at any position on the surface of the cold plate 4 by changing the position of the movable frame 2 and the position of the fixed rod 6 relative to the adjusting groove 23. In the embodiment, a plurality of adjusting grooves 23 are also arranged on the moving plate 22 in parallel, so that the position of the integrated heat source 3 can be conveniently adjusted; based on this arrangement, one skilled in the art can arrange a movable plate 22 covering the area between the two corner plates 14, and arrange a plurality of adjustment slots 23 in parallel on the surface thereof, so as to place the integrated heat source 3 at a specific position of the cold plate 4 according to the matching of the fixing rod 6 and different adjustment slots 23 at different positions; the number and specific positions of the integrated heat sources 3 can be determined as required.

The lower end of the fixing rod 6 is fixedly provided with a connecting plate 62 through screw connection, and the connecting plate 62 is fixedly connected with the integrated heat source 3; referring to fig. 3, the integrated heat source 3 comprises a heat insulation plate 32 in threaded engagement with a connection plate 62, and a heat conduction plate 33 in threaded engagement with the heat insulation plate 32, wherein a heating element 34 is fixedly connected to the upper surface of the heat conduction plate 33, the integrated heat source 3 is placed upside down in fig. 3 for convenience of showing the structure, and the lower side in fig. 3 is above the use state of the integrated heat source 3; the heating element 34 is connected with a power supply inlet wire through a lead 35 for heating, and the current of the heating element 34 can be adjusted according to the set temperature to change the temperature; the lower surface of the heat insulating plate 33 is provided with a notch for receiving the heating element 34 and the lead 35, and when specifically disposed, the notch may be disposed on the upper surface of the heat conductive plate 33. In order to approximate the temperature of the true heat source of the cold plate 4, the second temperature sensor 31 is arranged on the lower surface of the heat conducting plate 33 facing the cold plate 4; the lower surface of the heat conducting plate 33 is provided with a temperature measuring groove 36 communicated with the side edge, and the second temperature sensor 31 is accommodated in the temperature measuring groove 36 and connected with the heat conducting plate 33. The temperature is measured to be close to the temperature of the lower surface of the heat conducting plate 33 and is used as the temperature of the heat source of the cold plate 4.

In the preferred embodiment, a heat conducting block 37 is fixed on the lower surface of the heat conducting plate 33, the temperature measuring groove 36 is opened on the lower surface of the heat conducting block 37, and the second temperature sensor 31 measures the temperature of the heat conducting block 37. The appearance of the heat conducting block 37 can be processed and manufactured according to the appearance of a real heating device of the component to be tested, the actual simulation effect is more met, in addition, a temperature measuring groove 36 is formed above the heat conducting block 37 for placing the second temperature sensor 31, and the heating element 34 cannot be grooved; thus, the heat generating element 34 is prevented from being damaged by external factors by the heat conductive block 37, and the heat generating element 34 is an electrified device, and electric shock can be prevented by transferring heat using the heat conductive block 37.

In this embodiment, the heat conducting plate 33 is made of a material with good heat conducting performance and certain strength, such as a metal block or a high heat conducting material; the heat insulation plate 32 and the heat insulation slide block 53 are made of materials with poor heat conductivity and certain strength, such as glass fiber reinforced plastics, skid, high polymer materials, honeycomb heat insulation devices and the like; the heat insulating mat may be made of the above-mentioned material or a flexible material such as rubber.

During test operation, if liquid cooling is needed, the heat dissipation assembly is connected with the liquid cooling equipment, the temperature of the cooling liquid is adjusted to the corresponding working temperature, if the liquid cooling is not needed, the integrated heat source 3 is adjusted to a proper position to be contacted with the cold plate 4 by skipping the step, the current of the integrated heat source 3 is adjusted according to test requirements, the value of the second temperature sensor 31 reaches the preset value, and then the value of the first temperature sensor is read to determine whether the temperature of the surface of the cold plate 4 meets the performance requirements.

Referring to fig. 4, when in use, the heat dissipation performance testing apparatus provided in this embodiment may be connected to the liquid cooling device 16, power is supplied to the heating element 34 through the power supply 17, temperature values of the first temperature sensor and the second temperature sensor 31 are collected through the temperature collecting module 18, and are transmitted to the computer 19 for judgment processing, data measured in a test is compared with data of a theoretical calculation or a simulation result, and by analyzing the data, related parameters and conclusions can be obtained, thereby providing theoretical guidance for setting of simulation parameters.

Claims

1. The utility model provides a heat dispersion testing arrangement which characterized in that: including the chassis, the chassis is put on the shelf and is equipped with the removal frame, removes the unsettled integrated heat source that is provided with and can changes the height that puts, and the radiator unit has been placed to thermal-insulated on the chassis, and radiator unit surface detachable is fixed with first temperature sensor, and the part of integration heat source and radiator unit contact is provided with second temperature sensor.

2. The heat dissipation performance test apparatus according to claim 1, wherein: the heat dissipation assembly at least comprises a cold plate, two liquid cooling platforms are arranged on the chassis and are of hollow structures, a liquid connector is arranged at one end of each of the two liquid cooling platforms in the length direction, and the other ends of the two liquid cooling platforms are communicated with each other through a pipeline.

3. The heat radiation performance test apparatus according to claim 2, characterized in that: the liquid cooling platform is characterized in that a heat insulation sliding block matched with the chassis is fixedly arranged below the liquid cooling platform, and the heat insulation sliding block can slide on the chassis along the direction vertical to the liquid cooling platform.

4. The heat dissipation performance test apparatus according to claim 3, wherein: the chassis is fixed with the liquid cooling platform vertically both ends respectively and is provided with the fixed plate, the upper end of fixed plate surpasss the upper surface on chassis, is provided with the spout that is in above the chassis upper surface along length direction on the fixed plate, and the terminal surface of thermal-insulated slider is provided with and is in the screw hole of same height with the spout.

5. The heat radiation performance test apparatus according to claim 3 or 4, characterized in that: the chassis is provided with at least one limiting groove at two ends of the vertical liquid cooling platform respectively; the bottom of the heat insulation sliding block is provided with a convex block which is in sliding fit with the limiting groove.

6. The heat radiation performance test apparatus according to claim 2, characterized in that: an angle plate is fixedly arranged on each of two sides of the chassis, and the liquid cooling platform is positioned between the two angle plates and is parallel to the angle plates; the movable rack is characterized in that at least two movable racks are arranged on the chassis and comprise two vertical plates matched with corner plates on two sides and a movable plate fixedly matched with the two vertical plates, an adjusting groove is formed in the movable plate along the length direction, and the integrated heat source is suspended below the movable racks through a fixed rod fixedly matched with the adjusting groove.

7. The heat dissipation performance test apparatus according to claim 6, wherein: a plurality of adjusting grooves are arranged in parallel on the same movable plate, the vertical plate is matched with the vertical surface of the angle plate, and the vertical surface of the angle plate is provided with a strip-shaped groove fixedly matched with the vertical plate along the length direction.

8. The heat dissipation performance test apparatus according to claim 6, wherein: the upper end of the movable plate is fixedly connected with the rod body of the fixed rod, the lower end of the movable plate is fixedly connected with the integrated heat source, and the upper end of the movable plate is fixedly connected with the rod body of the fixed rod.

9. The heat dissipation performance test apparatus according to claim 8, wherein: the integrated heat source comprises a heat insulation plate fixedly matched with the connecting plate and a heat conduction plate fixedly matched with the heat insulation plate, a heating element is fixedly connected to the upper surface of the heat conduction plate, a temperature measurement groove communicated with the side edge is formed in the lower surface of the heat conduction plate, and the second temperature sensor is accommodated in the temperature measurement groove and connected with the heat conduction plate.

10. The heat radiation performance test apparatus according to claim 9, characterized in that: the heat conducting plate is fixed with a heat conducting block on the lower surface, and the temperature measuring groove is formed in the lower surface of the heat conducting block.