CN102435428A - Test module for simulating heating of IGBT (Insulated Gate Bipolar Transistor) module - Google Patents
Test module for simulating heating of IGBT (Insulated Gate Bipolar Transistor) module Download PDFInfo
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- CN102435428A CN102435428A CN2011102995472A CN201110299547A CN102435428A CN 102435428 A CN102435428 A CN 102435428A CN 2011102995472 A CN2011102995472 A CN 2011102995472A CN 201110299547 A CN201110299547 A CN 201110299547A CN 102435428 A CN102435428 A CN 102435428A
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Abstract
The invention discloses a test module for simulating heating of an IGBT (Insulated Gate Bipolar Transistor) module. The test module comprises a base panel, a plurality of lug bosses, a plurality of heating elements and a heat isolating layer, wherein the lug bosses are arranged on the base panel; the heating elements are arranged on the lug bosses; one of the heating elements is corresponding to at least one of the lug bosses; the heat isolating layer is paved on all the heating elements; and a positive electrode and a negative electrode which are respectively connected to an external power supply are arranged on each of the heating elements. On the one hand, the test module provided by the invention is provided with a property related to the heating of the IGBT module. On the other hand, the test module is used for supplying a heat source. An experimental device with higher cost performance is supplied for the test of the IGBT module and the optimization of a cooling system.
Description
Technical field
The present invention relates to a kind of cooling method of testing of device for high-power power electronic module, particularly a kind of IGBT module cooling method of testing that applies to.
Background technology
Device for high-power power electronic has produced a large amount of heat in its work operational process.Mainly contain the type of cooling of several kinds of comparative maturities such as air-cooled, water-cooled and heat pipe at present.The air-cooled heat exchange that is mainly used in the less power electronic device module of heat flow density; Water-cooled is a kind of that advantage is the most obvious in the present high-voltage and high-power power electronic device type of cooling, application prospect is best, is adopted widely in countries in the world; Heat pipe is mainly used in lower-powered high-voltage and high-power power electronic device.Device for high-power power electronic is installed on the cold drawing, inserts relevant cooling system again.Because device for high-power power electronic is expensive, general Study cold drawing heat exchanger components mechanism can't obtain, and also is difficult to be adjusted to normal operating mode even have.The heat generating components of insulated gate bipolar transistor (IGBT) module is made up of a plurality of IGBT and power diode, and IGBT is different with the heat flow density of power diode heating, makes the two surface temperature differ.Therefore, whole heater is not the single monoblock of average heating, but is made up of each heating module, and the common type of heating of employing can't satisfy the heating requirement of experiment of Simulation with I GBT module.In order better to study the heat dissipating state of cooled plate, reach the optimal effectiveness of its operation simultaneously, adopt the actual cheap simulation heating module of IGBT module.
Summary of the invention
The objective of the invention is to overcome the shortcoming of above-mentioned prior art; A kind of test module of Simulation with I GBT module heating is provided; Adopt the device of this test module test device for high-power power electronic water-cooling system; Can guarantee that it can simulate the IGBT working condition, and compact conformation, low price.
The object of the invention is realized through following technical scheme:
A kind of test module of Simulation with I GBT module heating; Comprise a base flat board, a plurality of boss, a plurality of heating element and a thermofin; Be provided with a plurality of boss at the base flat board, place heating element on the boss, corresponding at least one boss of heating element; On all heating elements, spread a thermofin then; Be respectively equipped with the both positive and negative polarity that is connected with external power supply on each heating element, control the thermal value of heating element through the mode of control supply voltage, thus the heating system of acquisition and IGBT and diode equivalent.Said boss is to set up according to the size of IGBT in the actual IGBT module and diode and shape.
In order better to realize the present invention, the corresponding row's boss of a said heating element, a plurality of heating element parallel arranged.
In order better to realize the present invention, said base flat board and boss material are aluminium or copper.
In order better to realize the present invention, said base flat board and boss material are copper.
In order better to realize the present invention, be embedded with the thermoelectric duct that to insert thermopair that occasionally is provided with in the said base flat board.
In order better to realize the present invention, said thermopair is a K type thermopair.
In order better to realize the present invention, said heating element is a ceramic heating element.
In order better to realize that the present invention, said boss and heating element contact position scribble coefficient of heat conductivity at 1～50w/ (colloidal material of m * K).
In order to realize that better the present invention, colloidal material are silver slurry or silicone grease.
In order better to realize the present invention; Said thermofin is provided with cover plate; Cover plate is fixed through bolt and base are dull and stereotyped, selects suitable power to make module can tightly be pressed on the base flat board of IGBT, makes that the heat major part at heating element is transferred to the base flat board.
The invention has the beneficial effects as follows: the present invention sets up corresponding projection according to the size and the shape of IGBT in the actual IGBT module and diode; And control the thermal value of heating element through the mode of control supply voltage; Thereby the heating system of acquisition and IGBT and diode equivalent; Guarantee that on the one hand it possesses the correlated performance of IGBT module heating, thermal source is provided on the other hand, the experimental provision of higher price-performance ratio is provided for realizing IGBT module testing and cooling system optimization.
Description of drawings
Fig. 1 is the test module front schematic view of the described Simulation with I GBT module heating of one embodiment of the invention;
Fig. 2 is the test module longitudinal section A-A synoptic diagram of the described Simulation with I GBT module heating of one embodiment of the invention;
Fig. 3 is the test module cross section B-B synoptic diagram of the described Simulation with I GBT module heating of one embodiment of the invention;
Fig. 4 is the test module projection distribution schematic diagram of the described Simulation with I GBT module heating of one embodiment of the invention;
Fig. 5 places the heating element distribution schematic diagram on the test module projection of the described Simulation with I GBT module of one embodiment of the invention heating.
Embodiment
Below in conjunction with embodiment and accompanying drawing an embodiment of the invention are described in further detail, but embodiment of the present invention is not limited thereto.
Like Fig. 1, Fig. 2 and shown in Figure 3; A kind of test module of Simulation with I GBT module heating comprises base flat board 1, a plurality of boss 2, a plurality of heating element 3 and a thermofin 4, is provided with a plurality of boss 2 (as shown in Figure 4) at base dull and stereotyped 1; Place heating element 3 on the boss 2; Heating element 3 corresponding at least one boss 2 are spread a thermofin 4 then on all heating elements 3, be respectively equipped with the both positive and negative polarity that is connected with external power supply on each heating element 3; Mode through the control supply voltage is controlled the thermal value of heating element 3, thus the heating system of acquisition and IGBT and diode equivalent.Said boss 2 is to set up according to the size of IGBT in the actual IGBT module and diode and shape.
A said heating element 3 corresponding row's boss 2, a plurality of heating element 3 parallel arranged (as shown in Figure 5).
Said base dull and stereotyped 1 and boss 2 materials are aluminium or copper.
Said base dull and stereotyped 1 and boss 2 materials are copper.
Be embedded with the thermoelectric duct that to insert thermopair that occasionally is provided with in the said base dull and stereotyped 1.
Said thermopair is a K type thermopair.
Said heating element 3 is a ceramic heating element.
Said boss 2 and heating element 3 contact positions scribble coefficient of heat conductivity at 1～50w/ (colloidal material of m * K).
Said colloidal material is silver slurry or silicone grease.
Said thermofin 4 is provided with cover plate 5, and cover plate 5 is fixed through bolt and base dull and stereotyped 1, selects suitable power to make module can tightly be pressed on the base flat board of IGBT, makes that the heat major part at heating element is transferred to the base flat board.
The foregoing description is a preferred implementation of the present invention; But embodiment of the present invention is not restricted to the described embodiments; Other any do not deviate from change, the modification done under spirit of the present invention and the principle, substitutes, combination, simplify; All should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (10)
1. the test module of Simulation with I GBT module heating; It is characterized in that: said test module comprises a base flat board, a plurality of boss, a plurality of heating element and a thermofin; Be provided with a plurality of boss at the base flat board, place heating element on the boss, corresponding at least one boss of heating element; On all heating elements, spread a thermofin then, be respectively equipped with the both positive and negative polarity that is connected with external power supply on each heating element.
2. the test module of a kind of Simulation with I GBT module heating according to claim 1 is characterized in that: the corresponding row's boss of a said heating element, a plurality of heating element parallel arranged.
3. the test module of a kind of Simulation with I GBT module heating according to claim 1 is characterized in that: be embedded with the thermoelectric duct that can insert thermopair that occasionally is provided with in the said base flat board.
4. the test module of a kind of Simulation with I GBT module heating according to claim 1, it is characterized in that: said thermofin is provided with cover plate, and cover plate is dull and stereotyped fixing through bolt and base.
5. the test module of a kind of Simulation with I GBT module heating according to claim 3, it is characterized in that: said thermopair is a K type thermopair.
6. the test module of a kind of Simulation with I GBT module heating according to claim 1, it is characterized in that: said heating element is a ceramic heating element.
7. the test module of a kind of Simulation with I GBT module heating according to claim 1, it is characterized in that: said base flat board and boss material are aluminium or copper.
8. the test module of a kind of Simulation with I GBT module heating according to claim 7, it is characterized in that: said base flat board and boss material are copper.
9. the test module of a kind of Simulation with I GBT module heating according to claim 1 is characterized in that: said boss and heating element contact position scribble coefficient of heat conductivity at 1～50w/ (colloidal material of m * K).
10. the test module of a kind of Simulation with I GBT module heating according to claim 9 is characterized in that: said colloidal material is silver slurry or silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102995472A CN102435428A (en) | 2011-09-30 | 2011-09-30 | Test module for simulating heating of IGBT (Insulated Gate Bipolar Transistor) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102995472A CN102435428A (en) | 2011-09-30 | 2011-09-30 | Test module for simulating heating of IGBT (Insulated Gate Bipolar Transistor) module |
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|---|---|
| CN102435428A true CN102435428A (en) | 2012-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011102995472A Pending CN102435428A (en) | 2011-09-30 | 2011-09-30 | Test module for simulating heating of IGBT (Insulated Gate Bipolar Transistor) module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105277583A (en) * | 2014-07-23 | 2016-01-27 | 南车株洲电力机车研究所有限公司 | Device simulating heating of IGBT element |
| CN107782570A (en) * | 2016-08-29 | 2018-03-09 | 中车株洲电力机车研究所有限公司 | The system of the device of simulated power device heating and the performance of test radiator |
| CN110672659A (en) * | 2019-10-31 | 2020-01-10 | 北京机械设备研究所 | Double-sided water cooling plate heat dissipation performance testing device and testing method |
| CN113391182A (en) * | 2021-06-09 | 2021-09-14 | 中车青岛四方车辆研究所有限公司 | IGBT thermal simulation device and semi-physical IGBT thermal simulation system |
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| GB2076270B (en) * | 1980-05-14 | 1984-08-30 | Matsushita Electric Ind Co Ltd | Electrical air-heating device |
| US4931627A (en) * | 1988-08-16 | 1990-06-05 | Illinois Tool Works Inc. | Positive temperature coefficient heater with distributed heating capability |
| CN1255749A (en) * | 1998-11-27 | 2000-06-07 | 阿尔斯托姆控股公司 | Power electronic device |
| CN1916614A (en) * | 2005-08-19 | 2007-02-21 | 富准精密工业(深圳)有限公司 | Device for simulating heat source |
| US20070045271A1 (en) * | 2005-08-09 | 2007-03-01 | Shin-Etsu Chemical Co., Ltd. | Heating element |
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| CN102105253A (en) * | 2008-07-23 | 2011-06-22 | 东京毅力科创株式会社 | High temperature electrostatic chuck and using method |
| CN201946584U (en) * | 2011-01-26 | 2011-08-24 | 京信通信技术(广州)有限公司 | Heating device of semiconductor device |
| CN202255863U (en) * | 2011-09-30 | 2012-05-30 | 广州高澜节能技术股份有限公司 | Test module capable of simulating the heating of an IGBT module |
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2011
- 2011-09-30 CN CN2011102995472A patent/CN102435428A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2076270B (en) * | 1980-05-14 | 1984-08-30 | Matsushita Electric Ind Co Ltd | Electrical air-heating device |
| US4931627A (en) * | 1988-08-16 | 1990-06-05 | Illinois Tool Works Inc. | Positive temperature coefficient heater with distributed heating capability |
| CN1255749A (en) * | 1998-11-27 | 2000-06-07 | 阿尔斯托姆控股公司 | Power electronic device |
| US20070045271A1 (en) * | 2005-08-09 | 2007-03-01 | Shin-Etsu Chemical Co., Ltd. | Heating element |
| CN1916614A (en) * | 2005-08-19 | 2007-02-21 | 富准精密工业(深圳)有限公司 | Device for simulating heat source |
| CN102105253A (en) * | 2008-07-23 | 2011-06-22 | 东京毅力科创株式会社 | High temperature electrostatic chuck and using method |
| CN101476708A (en) * | 2009-01-23 | 2009-07-08 | 林大伟 | Heat radiating device used for LED |
| CN101865864A (en) * | 2010-06-08 | 2010-10-20 | 华东理工大学 | System for testing phase transformation cooling effect of electronic components |
| CN201946584U (en) * | 2011-01-26 | 2011-08-24 | 京信通信技术(广州)有限公司 | Heating device of semiconductor device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105277583A (en) * | 2014-07-23 | 2016-01-27 | 南车株洲电力机车研究所有限公司 | Device simulating heating of IGBT element |
| CN105277583B (en) * | 2014-07-23 | 2019-02-15 | 南车株洲电力机车研究所有限公司 | A kind of device for simulating IGBT element heating |
| CN107782570A (en) * | 2016-08-29 | 2018-03-09 | 中车株洲电力机车研究所有限公司 | The system of the device of simulated power device heating and the performance of test radiator |
| CN107782570B (en) * | 2016-08-29 | 2019-08-02 | 中车株洲电力机车研究所有限公司 | The system of the performance of the device and test radiator of simulated power device heating |
| CN110672659A (en) * | 2019-10-31 | 2020-01-10 | 北京机械设备研究所 | Double-sided water cooling plate heat dissipation performance testing device and testing method |
| CN113391182A (en) * | 2021-06-09 | 2021-09-14 | 中车青岛四方车辆研究所有限公司 | IGBT thermal simulation device and semi-physical IGBT thermal simulation system |
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Application publication date: 20120502 |