CN101865864A - System for testing phase transformation cooling effect of electronic components - Google Patents
System for testing phase transformation cooling effect of electronic components Download PDFInfo
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- CN101865864A CN101865864A CN201010195989.8A CN201010195989A CN101865864A CN 101865864 A CN101865864 A CN 101865864A CN 201010195989 A CN201010195989 A CN 201010195989A CN 101865864 A CN101865864 A CN 101865864A
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Abstract
The invention discloses a system for testing phase transformation cooling effect of electronic components, comprising an evaporation chamber, a refrigerant temperature control system, an electronic component fixing device, a condensation and pressure regulation system, a data acquisition system and a visual observation system. The evaporation chamber contains a refrigerant for cooling the phase transformation of the electronic component to be tested; the refrigerant temperature control system is used for controlling the temperature of the refrigerant; electronic component fixing device is used for fixing the electronic component to be tested in the refrigerant of the evaporation chamber; the condensation and pressure regulation system is used for condensing and reflowing the steam generated in the evaporation chamber and monitoring the pressure of the steam; the data acquisition system is used for measuring, acquiring and monitoring the surface temperature of the refrigerant and the electronic component to be tested; the visual observation system is used for observing the boiling bubble behavior on the surface of the electronic component to be tested in the evaporation chamber to obtain the kinetic parameter of the bubbles. The test system of the invention can be used to evaluate the cooling effect of the phase transformation under the conditions of different materials, surface shapes, locations and inclined angles of the electronic components, and different refrigerants and degrees of super cooling.
Description
Technical field
The present invention relates to a kind of test macro, particularly relate to a kind ofly, carry out the test macro of the cooling effect in phase transformation when cooling at the heat control of high heat flux electronic devices and components.
Background technology
The application of electronic devices and components spreads all over each aspect of daily life, production and even national security.Miniaturization and densification are the developing direction of microelectronic component.Since nineteen fifty-nine, along with the appearance of silicon integrated level circuit, the integrated level of chip is with annual 40%～50% speed increment, and the heat flow density in the integrated circuit (IC) chip is from the 10W/cm of the seventies in 20th century
2Rise to the present 100W/cm that surpasses
2The heat flow density of some micro-system is up to 1000W/cm
2Calculate according to famous " Moore's Law ": the transistor on the chip doubled in per 18 months, and so by 2010, transistorized quantity will be above 1,000,000,000 on the chip.The develop rapidly of microelectromechanical systems makes the heat dissipation problem of microelectronic chip, VLSI (very large scale integrated circuit) highlight day by day, impels heat-exchange system further to stride forward towards high efficiency, microminiaturization.
The electronic devices and components integrated level improves, and heat is concentrated, and the microelectronic device local temperature is too high, causes microelectronic component to work under the hot environment and loses efficacy.Meanwhile, the usable range of microelectronic device is increasingly extensive, and environment for use alters a great deal, and often is in the environment temperature height, and difference variation is big, and condition is very harsh, thereby causes the serviceability of microelectronic component and stability to reduce greatly.Studies show that, 10 ℃ of the every risings of the temperature of single semiconductor components and devices, system reliability will reduce by 50%, and the electronic equipment above 55% lost efficacy and caused owing to temperature is too high.Therefore, chip power density constantly rises, and causes the power consumption of chip and the bottleneck that heat radiation becomes the development of restriction microelectric technique, and how effectively row is diffusing with high quantity of heat production, and chip temperature is remained on reduced levels becomes an extremely urgent problem already.
At present, reducing the most extensive method of electronic devices and components temperature applications is air-cooled and liquid cooling.The air-cooled circulating current that promptly utilizes fan to produce cools off chip, but this method is because the heat radiation cooling effect is poor, noise is serious, be only applicable to the low chip cooling of integrated level and arithmetic speed, have now to force air to be cooled to main microprocessor heat dissipation technology and can only handle the used heat that 60% microprocessor is produced at most, so this heat dissipation technology has reached bottleneck, need to rely on the liquid cooling technology that volume of new generation is littler and efficient is high and solve.
The immersion phase transformation cooling means that chip directly is immersed in the phase-change heat-exchange that seethes with excitement in the non-conductive liquid of inertia (cryogen) is a kind of radiating mode efficiently, also is a research focus at present both domestic and external.In order further to improve the reliability of this high efficiency and heat radiation mode, be necessary to carry out the evaluation of its cooling effect, thereby further optimize cooling system, promote applying of this phase-change heat technology.Therefore the test macro of developing this kind of energy effective evaluation radiating mode radiating effect is significant.
Summary of the invention
The technical problem to be solved in the present invention is existing electronic devices and components to be lacked the defective of the test macro of immersion phase transformation cooling effect in order to overcome, and a kind of test macro that can carry out the phase transformation cooling effect of electronic components of Validity Test to the phase transformation cooling effect of electronic devices and components is provided.
The present invention solves above-mentioned technical matters by following technical proposals: a kind of test macro of phase transformation cooling effect of electronic components, and its characteristics are that it comprises:
One vaporization chamber is loaded with the cryogen that tested electronic devices and components is carried out the phase transformation cooling;
One refrigerant temperature control system is used to control the temperature of described cryogen;
One electronic devices and components stationary installation is used for described tested electronic devices and components are fixed on the cryogen of described vaporization chamber;
One condensation and pressure regulating system are used for steam that the described vaporization chamber of condensing reflux produces and the pressure of monitoring this steam;
One data acquisition system (DAS) is used to measure, gather and monitor the surface temperature of described cryogen and tested electronic devices and components; And
One visual inspection system is used to observe the boiling bubbling behaviour on the surface of the tested electronic devices and components in the described vaporization chamber, in order to obtain the bubble dynamics parameter.
Preferably, when adopting liquid medium such as water-bath or oil bath to carry out temperature control, described vaporization chamber places in the described refrigerant temperature control system; Pass through the temperature of control refrigerant temperature control system like this, thereby control the temperature of the cryogen in the vaporization chamber required when testing.In another preferred embodiment of the present invention, can also adopt gas, such as: steam, as temperature control means.
More preferably, described refrigerant temperature control system comprises:
One is loaded with the water bath of liquid water;
One places the well heater of described liquid water; And
The one water-bath temperature controller that is connected with described well heater.
In these cases, described vaporization chamber can be positioned in the constant temperature water bath, realizes the temperature control of cryogen.
Preferably, a cushion block that is used to support described vaporization chamber is established in the interior diapire of described water bath top.
More preferably, the inner bottom part of described vaporization chamber is put a magnetic stir bar, the exterior bottom wall of described refrigerant temperature control system be provided with one with the corresponding magnetic stirring apparatus of described magnetic stir bar, to guarantee the homogeneity of refrigerant temperature better.
Preferably, described condensation and pressure regulating system comprise: a condenser, and described condenser communicates with described vaporization chamber by several pipelines, also is provided with a pressure transducer at least one described pipeline; More preferably, the top of described condenser is provided with a valve that is communicated with, is used to discharge fouling gas with atmosphere.
Preferably, described electronic devices and components stationary installation is a swingle, and described swingle comprises:
One inside end, this inside end stretch in the cryogen of described vaporization chamber, and be affixed with described tested electronic devices and components; And
One is installed in the outer end of the sidewall of described vaporization chamber.
Preferably, the outer end of described swingle also has a wholecircle protractor that is used for accurately measuring the anglec of rotation of described tested electronic devices and components.
Preferably, described data acquisition system (DAS) comprises the thermopair that the tested electronic devices and components in the some and described vaporization chamber are connected, and is used to test the temperature signal of gathering described tested electronic devices and components surface.Thermopair is the temperature-measurement principle that utilizes thermoelectromotive force, the collecting temperature signal, and signal outputed to data acquisition unit.
Preferably, described data acquisition system (DAS) also comprises a data acquisition unit.
Preferably described data acquisition unit is the continuous PC of electricity also.This is just as preferred embodiment a kind of, and data acquisition unit also can connect PC, and adopts other can extract the electric terminal that the collecting temperature signal carries out data analysis.
Preferably, described vaporization chamber is a transparent airtight container, and described visual inspection system places outside the described vaporization chamber, is used for described tested electronic devices and components are observed.
Preferably, described visual inspection system comprises: a high-speed camera instrument and an enlarging lens, be used for from the side of vaporization chamber and above the observation of realization bubble stereoeffect; Described test macro illuminates the light source of usefulness when also comprising an observation, such as adopting parallel beam cold light LED lamp.
Preferably, described tested electronic devices and components are an electronic devices and components simulated block, and described electronic devices and components simulated block comprises:
One is electrically connected the heating element of a direct current stabilized voltage supply, and described heating element can provide up to 200-350W/cm
2Heat flow density; And
One test surfaces that is connected with described heating element, described test surfaces is located at the upper surface of described heating element by a heat-conducting glue, and insulation is all carried out on other surface of described heating element, not with described cryogen heat exchange.
In a preferred embodiment of the present invention, the heat flow density that described heating element can provide can reach 200-350W/cm
2, preferably be 300W/cm
2, adopt this heating element just can simulate heat flow density and be up to 350W/cm
2The heat radiation of electronic devices and components; Described test surfaces is preferably the copper base that a upper surface has porous coating.To be immersed in the cryogen by the simulated block that heating element and test surfaces are formed by connecting by heat-conducting glue, heating element can provide above-mentioned heat flow density, and its thermal power is provided by D.C. regulated power supply.Described swingle one end connects the electronic devices and components simulated block, and an end is fixed on the vaporization chamber wall.An end that is fixed on the swingle of vaporization chamber wall outside is connected with a wholecircle protractor, can accurately measure the angle of inclination of electronic devices and components simulated block by the wholecircle protractor.The rotation of the outer end by swingle is regulated the angle of inclination of tested electronic devices and components, with the heat dissipating state of simulation electronic components and parts in different spatial.
Phase transformation among the present invention is meant by the variation of liquid phase to gas phase.Immersion wherein is relative liquid one gas phase a kind of of but system that turn cold, and refers to electronic power components directly is immersed in cryogen, utilizes the cryogen vaporization to absorb latent heat of vaporization cooling device (assembly).Above-mentioned cryogen refers to electronic devices and components is carried out immersion phase transformation when cooling, is used for the dielectric fluid compatible with electronic devices and components.Such as, can be water white transparency, tasteless inertia perfluor liquid FC-72, can also be other electronics such as HFE-7100 are fluoridized organism such as cold-producing mediums such as liquid, R113, alcohol and water etc.
Positive progressive effect of the present invention is:
1, test macro of the present invention, primary solve provide a test macro that is used to test the phase transformation cooling effect of electronic devices and components.Secondly, the present invention can also be by the temperature on monitoring electronic devices and components simulated block surface, obtain parameters such as surperficial boiling heat transfer coefficient, critical heat flux density, observe bubbling behaviour visually and obtain the bubble dynamics parameter by high-speed camera instrument and enlarging lens, realize the evaluation of immersion phase-change radiation system cooling effect.Critical heat flux among the present invention (CHF), be that heat flow density reaches the turning point that is changed into film boiling by bubble boiling, there are a large amount of bubbles to produce at this stage boiling surface, cause bubble to cover boiling surface fully, make heat in time not discharge from boiling surface, thereby cause heat to concentrate, surface temperature sharply raises, and causes the damage of boiling surface and heating element easily.The slave unit security standpoint is considered, must strictly monitor and control heat flow density (just being offered the thermal power of heating element by direct supply), guarantees within range of safety operation.Simultaneously, by monitoring with measure the numerical value of CHF, thereby determine the limit heat-flow density that test surfaces can bear, as one of index of phase transformation cooling heat dissipation effect assessment.
2, in addition, test macro of the present invention is owing to adopted rotating mechanism to control the placement location and the angle of inclination of the electronic devices and components simulated block of test, therefore, can estimate different electronic devices and components materials, surface configuration, placement location and angle of inclination effectively delicately, and the phase transformation cooling heat dissipation effect under the multiple conditions such as different cryogen and degree of supercooling.
Description of drawings
Fig. 1 is the system schematic of a preferred embodiment of the present invention.
Fig. 2 is the structural representation of electronic devices and components simulated block among Fig. 1.
Fig. 3 is the immersion phase transformation cooling porous coating surface that records during for cryogen with FC-72 among Fig. 1 boiling curve comparison diagram with smooth surface.
The porous coating surface boiling curve comparison diagram of Fig. 4 different rotary angle correspondence when being cryogen with FC-72 among Fig. 1.
The porous coating surface coefficient of heat transfer comparison diagram of Fig. 5 different rotary angle correspondence when being cryogen with FC-72 among Fig. 1.
Porous coating surface boiling curve and boiling view figure when Fig. 6 anglec of rotation when being cryogen with FC-72 among Fig. 1 is in 0 °.
Porous coating surface boiling curve and boiling view figure when Fig. 7 anglec of rotation when being cryogen with FC-72 among Fig. 1 is in 60 °.
Porous coating surface boiling curve and boiling view figure when Fig. 8 anglec of rotation when being cryogen with FC-72 among Fig. 1 is in 120 °.
Porous coating surface boiling curve and boiling view figure when Fig. 9 anglec of rotation when being cryogen with FC-72 among Fig. 1 is in 180 °.
Embodiment
Provide preferred embodiment of the present invention below in conjunction with accompanying drawing, to describe technical scheme of the present invention in detail.
The test macro of phase transformation cooling effect of electronic components provided by the invention, mainly by vaporization chamber, electronic devices and components stationary installation, refrigerant temperature control system, condensation and pressure regulating system, data acquisition system (DAS), and composition such as visual inspection system, light source.Vaporization chamber is one to be loaded with the bright airtight container of full impregnated of cryogen, is used for the boiling behavior of being heated of tested electronic devices and components is observed.Vaporization chamber soaks to be located in the refrigerant temperature control system, by the temperature of control refrigerant temperature control system, and then the temperature of the cryogen in when test control required vaporization chamber.The water-bath temperature controller that refrigerant temperature control system water bath, uncovered by one and that be loaded with liquid water places the well heater and in the liquid water of water bath to be connected with well heater is formed.The inner bottom part of vaporization chamber is placed with a magnetic stir bar, the exterior bottom wall of refrigerant temperature control system be provided with one with the corresponding magnetic stirring apparatus of magnetic stir bar.By the stirring of external magnetic stirring apparatus, guarantee the homogeneity of refrigerant temperature.Refrigerant temperature control system is used to heat and control the temperature of cryogen in the described vaporization chamber.The end inwall of water bath is placed a cushion block that is used to support the vaporization chamber bottom.When cushion block was provided with, the height of cushion block is dried up bath tub bottom part inwall will exceed the well heater in the water bath, and vaporization chamber can stably be placed on above the cushion block like this, and can contact heater.The electronic devices and components stationary installation can be a swingle that links to each other with vaporization chamber, is used for tested electronic devices and components are fixed on cryogen in the vaporization chamber.Swingle has an inside end and an outer end.The inside end of swingle stretches in the liquid cryogen in the vaporization chamber, be used for tested electronic devices and components affixed after, tested electronic devices and components are carried out the test of the immersion phase transformation cooling under the various anglecs of rotation.After the outer end of swingle wears a wholecircle protractor, be installed in the outside of the sidewall of vaporization chamber.Utilize the wholecircle protractor, the rotation of the outer end by swingle can accurately be regulated the diverse location of tested electronic devices and components in cryogen, and read the angle of rotation according to the demonstration on the protractor.The electronic devices and components stationary installation can also be the rotating mechanism of other form, such as, also can be designed to be fixed in a suspension rod of vaporization chamber top.Only this suspension rod stretch into a end in the cryogen in the vaporization chamber, also can be used for fixing tested electronic devices and components.In like manner, also can wear a protractor, be used to regulate the angle of rotation at the other end of suspension rod.Condensation and pressure regulating system are connected with vaporization chamber, are used for the steam that produces in the described vaporization chamber of condensing reflux.Condensation and pressure regulating system are made up of a condenser and several pipeline.Several pipelines are connected with condenser and vaporization chamber respectively, are used for condensed fluid is carried back in the vaporization chamber.Also be connected with a pressure transducer at least one pipeline, be used to monitor the pressure in the vaporization chamber.The top of condenser is connected with a valve that is connected with ambient atmosphere, is used to discharge fouling gas.Data acquisition system (DAS) is made up of several thermopairs, a data collector and a PC.Thermopair in the data acquisition system (DAS) stretches in the vaporization chamber, is used for being connected with tested electronic devices and components, monitors the temperature on tested electronic devices and components surface.One end of thermopair is connected with tested electronic devices and components, and its other end is connected with data acquisition unit, is used to carry out the collection of temperature.Data acquisition unit links to each other with the PC electricity, is used for accurately measuring and monitoring.The visual inspection system places the vaporization chamber outside, be used for from the side of vaporization chamber and above the stereoeffect of boiling bubble in the shooting vaporization chamber.The visual inspection system is made up of high-speed camera instrument and enlarging lens.The light source of this test macro can be one group of parallel beam cold light LED lamp, to take and to observe.
Be example with an electronic devices and components simulated block as tested electronic devices and components below, describe the operation steps of test macro of the present invention in detail, and the test result that obtains.
To shown in Figure 2, electronic devices and components simulated block 1 is by a heating element 102 that is electrically connected with an external D.C. regulated power supply 14, and a test surfaces that is connected with heating element 102 101 is formed as Fig. 1.Test surfaces 101 is by be sticked surface directly over heating element 102 of a heat-conducting glue.In electronic devices and components simulated block 1, except test surfaces 101, insulation is all carried out on other surface of electronic devices and components simulated block 1, not with cryogen generation heat exchange.The insulation here can be to coat insulating gel 103, so just guaranteed that most heats that heating element 102 produces distribute from the upper surface of test block, and the heating power of heating element 102 can be approximately the heat that test surfaces distributes.
Before the test beginning, carry out corresponding preliminary work, with accuracy and the stability of guaranteeing to test.At first, electronic devices and components simulated block 1 is installed in the vaporization chamber 2, heating element 102 wherein can provide and be up to 350W/cm
2Heat flow density, thermal power is provided by D.C. regulated power supply 14.What in the present embodiment, test surfaces 101 adopted is a copper matrix with upper surface of porous coating.But also can be other material, such as: silicon chip, porous graphite and foam metal etc.In the punching of the side of copper matrix and insert two thermopairs 4, in order to carry out the measurement of test surfaces temperature.The exit of thermopair 4 connects data acquisition unit 15 again and carries out the collection of temperature.Then, inject cryogen 3, what the cryogen in the present embodiment used is that electronics is fluoridized liquid FC-72, and it is water white transparency, tasteless inertia perfluor liquid, has and the much the same viscosity of water, and the saturation temperature under the normal pressure is 56 ℃.Afterwards,,,, adjust the scope that irradiation and high-speed camera 7 are taken, aim at test surfaces 101 and top boiling range thereof by adjusting light source 6 by the angle of inclination of rotating mechanism 5 adjusting electronic devices and components simulated blocks 1 according to test request.At last, open cooling water switch, the valve 9 that open cold condenser 8 tops are communicated with atmosphere.Regulate the heating power of the water-bath 12 in the water baths by water-bath temperature controller 11, open magnetic stirring apparatus 13 simultaneously, the magnetic stir bar that is positioned at vaporization chamber 2 like this will movement therewith, has guaranteed that electronics fluoridizes liquid FC-72 and evenly heat.After the temperature that reaches capacity in the vaporization chamber 2, make cryogen FC-72 fully seethe with excitement at least two hours to carry out degasification, discharge fouling gas by valve 9, to avoid fouling gas to weaken boiling heat transfer intensity test is impacted.After excluding fouling gas, close magnetic stirring apparatus 13, and the water in the external water bath regulated and control to suitable temperature, make electronics fluoridize liquid FC-72 and keep desired steady state (SS), and monitor refrigerant temperature by two thermopairs 4 that place electronics to fluoridize liquid FC-72.The pressure transducer 10 on the top by being connected in vaporization chamber 2, the pressure in the monitoring vaporization chamber 2, thus regulate the flow of cryogen, guarantee under atmospheric pressure state, to finish test.Ce Shi preliminary work has just been finished earlier like this.
In measuring process, except that guaranteeing that experiment carrying out under the atmospheric pressure state, also will guarantee cryogen by the adjusting of external water-bath, promptly electronics is fluoridized liquid FC-72 and is kept state of saturation, or needed degree of supercooling.By the power input of D.C. regulated power supply 14 change electronic devices and components simulated blocks 1, with the variation of simulation electronic component thermal current density in different range.To be tested in stable condition after, carry out temperature acquisition by the surface of 15 pairs of electronic devices and components simulated blocks 1 of data acquisition unit, and on PC 16, store and put in order.The high-speed photography system adopts parallel beam cold light LED lamp as light source, and its irradiation area is the test surfaces and the generation of top bubble thereof of electronic devices and components simulated block 1 and breaks away from the zone.High-speed camera 7 configuration Navitar Zoom 6000 enlarging lens are from the side with the shooting of top realization bubble stereoeffect.The data collecting card chip of data acquisition unit 15 is connected with PC 16, takes pictures and the storing high-speed photographs by PC 16 controls, utilizes image processing software to carry out data analysis.
By changing the angle of inclination and the heating power of electronic devices and components simulated block 1, analyze it in different spatial, the heat flow density under the different degrees of superheat, heat transfer coefficient and critical heat flux density.The concrete analysis process is as follows: after determining a certain anglec of rotation, constantly increase the heating power of heating element 102 in the electronic devices and components simulated block 1, and it is multiplied by the heat transfer efficiency of heating element on test surfaces (according to experimental data, by the thermal insulation material dispersed heat account for net quantity of heat about 5%), just obtained the heat flow density of test surfaces 101.Along with the increase of heat flow density, boiling surface liquid film and top cryogen thereof enter the nucleate boiling zone, and the temperature of boiling surface also increases thereupon.If in the process that increases heat flow density gradually, the discovery boiling surface temperature boiling surface temperature corresponding with a last heat flow density compared, and exceeds more than the 30K, and so just proof has reached critical heat flux density, this point is rise nucleate boiling turning point, i.e. a peak slowly of heat flow density.Will close D.C. regulated power supply 14 this moment immediately, prevents that equipment from being burnt.And the heat flow density of the value of critical heat flux density during by a preceding steady state (SS) add current heat flow density increment half calculate, critical heat flux densities all in the present embodiment all obtain with the method.Utilize the surperficial degree of superheat (boiling surface temperature deduct refrigerant temperature) of heat flow density, promptly obtained the heat transfer coefficient under should the surface degree of superheat divided by correspondence.Carry out visual inspection by high-speed camera 7, select the parameter of a plurality of bubble sample continuous coverage multiframe bubbles, (probabilistic method adopts prior art to adopt probabilistic statistical method, can reference: 1. Shandong clock fine jade, two-phase flow and boiling heat transfer, 2002, Beijing: publishing house of Tsing-Hua University; 2. woods ancestor tiger, Wang Dong and Wang Shuzhong, biphase gas and liquid flow and boiling heat transfer .2003: publishing house of Xi'an Communications University; 3.Carey, VP, Liquid-vapor phase-change phenomena.1992. or the like) calculate bubble the disengaging diameter, break away from the mean value and the probability distribution rule of frequency etc., and observation different surfaces state is to the influence of above-mentioned each parameter.Finish test this time afterwards.Refrigerant temperature is stable in surface to be tested and the vaporization chamber, and after identical with the saturation temperature of FC-72 value, change the angle of inclination of electronic devices and components simulated block 1, carry out test again, thereby analyze the phase transformation cooling effect under different spatial, different heat flow density as above-mentioned process.
In the present embodiment, be immersed in electronics and fluoridize electronic devices and components simulated block 1 among the liquid FC-72 with porous coating surface, as shown in Figure 3, after tested, the porous coating surface of horizontal positioned, compare with smooth surface, when having identical horizontal ordinate (boiling surface temperature), its ordinate (heat flow density) is higher, when the surface temperature that reaches same is described, more heat can be taken away in the porous coating surface, and the initial fluidizing point on porous coating surface is lower, can enter into the nucleate boiling zone with lower surface temperature.From these several aspects, illustrate that its phase transformation cooling effect is better than smooth surface.Estimate phase transformation cooling effect with the method at other boiling surfaces of horizontal level.
Fig. 4 and Fig. 5 have reflected when electronic devices and components simulated block 1 is in different rotary angle θ and locus the influence to phase transformation cooling effect.Along with the anglec of rotation θ of electronic devices and components simulated block 1 increase from 0 °～180 °, the porous coating surface under identical surface temperature, heat flow density reduces gradually, illustrates that the angle of inclination is big more, the heat of taking away under the same surface temperature still less, cooling effect is poor more.And whole heat transfer coefficient along with the increase of anglec of rotation θ, at first reaches a peak, afterwards along with the arrival of critical heat flux density, conducts heat and is worsened.Meanwhile, critical heat flux density reduces gradually along with the increase at angle of inclination, when anglec of rotation θ reaches 180 °, only is 14.1W/cm
2, the safety of equipment is caused great threat, therefore should avoid electronic component to be inverted as far as possible, prevent it because too concentrated the causing of heat burnt.To shown in Figure 9, use the visual inspection system as Fig. 6, dynamically take the boiling surface anglec of rotation be in 0 °, 60 °, 120 ° and 180 ° respectively the time, the boiling view under the corresponding locus, the porous coating surface that obtains, during different heat flow density.By bubble dynamics parameter comparative descriptions, under a certain definite anglec of rotation and locus, along with the increase gradually of surface temperature, bubble disengagement diameter and disengaging frequency become greatly gradually, and it is more and more violent to seethe with excitement.In sum, can estimate the influence of different rotary angle and locus with this method of operating to phase transformation cooling effect.
Therefore, this test macro can be used for the test evaluation of the heat control of high heat flux electronic devices and components with the immersion phase transformation cooling effect.Adopt test macro of the present invention, can simulate heat flow density and be up to 350W/cm
2The heat radiation of electronic devices and components can be estimated different electronic devices and components materials, surface configuration, placement location and angle of inclination, and the radiating effect of phase transformation cooling system under the conditions such as different cryogen and degree of supercooling.
Though more than described the specific embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, under the prerequisite that does not deviate from principle of the present invention and essence, can make numerous variations or modification to these embodiments.Therefore, protection scope of the present invention is limited by appended claims.
Claims (11)
1. the test macro of a phase transformation cooling effect of electronic components is characterized in that, it comprises:
One vaporization chamber is loaded with the cryogen that tested electronic devices and components is carried out the phase transformation cooling;
One refrigerant temperature control system is used to control the temperature of described cryogen;
One electronic devices and components stationary installation is used for described tested electronic devices and components are fixed on the cryogen of described vaporization chamber;
One condensation and pressure regulating system are used for steam that the described vaporization chamber of condensing reflux produces and the pressure of monitoring this steam;
One data acquisition system (DAS) is used to measure, gather and monitor the surface temperature of described cryogen and tested electronic devices and components; And
One visual inspection system is used to observe the boiling bubbling behaviour on the surface of the tested electronic devices and components in the described vaporization chamber, in order to obtain the bubble dynamics parameter.
2. test macro as claimed in claim 1 is characterized in that, described vaporization chamber places in the described refrigerant temperature control system; Preferably, described refrigerant temperature control system comprises:
One is loaded with the water bath of liquid water,
One places the well heater of described liquid water, and
The one water-bath temperature controller that is connected with described well heater,
Wherein, be equipped with this vaporization chamber in the described water bath.
3. test macro as claimed in claim 2 is characterized in that, a cushion block that is used to support described vaporization chamber is established in the interior diapire top of described water bath; The inner bottom part of described vaporization chamber is put a magnetic stir bar, the exterior bottom wall of described refrigerant temperature control system be provided with one with the corresponding magnetic stirring apparatus of described magnetic stir bar.
4. test macro as claimed in claim 1 is characterized in that, described condensation and pressure regulating system comprise: a condenser, and described condenser communicates with described vaporization chamber by several pipelines, also is provided with a pressure transducer at least one described pipeline; The top of described condenser is provided with a valve that is communicated with, is used to discharge fouling gas with atmosphere.
5. test macro as claimed in claim 1 is characterized in that, described electronic devices and components stationary installation is a swingle, and described swingle comprises:
One inside end, this inside end stretch in the cryogen of described vaporization chamber, and be affixed with described tested electronic devices and components; And
One is installed in the outer end of the sidewall of described vaporization chamber.
6. test macro as claimed in claim 5 is characterized in that, the outer end of described swingle also has a wholecircle protractor that is used to measure the anglec of rotation of described tested electronic devices and components.
7. test macro as claimed in claim 1 is characterized in that, described data acquisition system (DAS) comprises the thermopair that the tested electronic devices and components in the some and described vaporization chamber are connected, and is used for the test collection to the temperature signal on described tested electronic devices and components surface.
8. test macro as claimed in claim 7 is characterized in that described data acquisition system (DAS) also comprises a data acquisition unit, and preferably, described data acquisition unit is the continuous PC of electricity also.
9. test macro as claimed in claim 1 is characterized in that, described vaporization chamber is a transparent airtight container, and described visual inspection system places outside the described vaporization chamber, is used for described tested electronic devices and components are observed.
10. test macro as claimed in claim 9 is characterized in that, described visual inspection system comprises: a high-speed camera instrument and an enlarging lens, described test macro also comprise the light source of an observation usefulness.
11., it is characterized in that described tested electronic devices and components are an electronic devices and components simulated block as any described test macro in the claim 1 to 10, described electronic devices and components simulated block comprises:
One is electrically connected the heating element of a direct current stabilized voltage supply, and described heating element can provide up to 200-350W/cm
2Heat flow density; And
One test surfaces that is connected with described heating element, described test surfaces is located at the upper surface of described heating element by a heat-conducting glue, and insulation is all carried out on other surface of described heating element, not with described cryogen heat exchange;
Wherein, the preferred upper surface of described test surfaces has the copper base of porous coating.
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN102180272B (en) * | 2011-04-14 | 2013-11-13 | 北京航空航天大学 | Method for evaluating adaptability of aerospace component to thermal environment |
| CN102180272A (en) * | 2011-04-14 | 2011-09-14 | 北京航空航天大学 | Method for evaluating adaptability of aerospace component to thermal environment |
| CN102435428A (en) * | 2011-09-30 | 2012-05-02 | 广州高澜节能技术股份有限公司 | Test module for simulating heating of IGBT (Insulated Gate Bipolar Transistor) module |
| CN103364701A (en) * | 2012-03-30 | 2013-10-23 | 中国科学院电子学研究所 | A method for measuring the passing rate of an electron beam in a microwave vacuum device |
| CN103364701B (en) * | 2012-03-30 | 2015-08-26 | 中国科学院电子学研究所 | The measuring method of Beam transmission in microwave vacuum electron device |
| CN104280416B (en) * | 2014-10-11 | 2017-06-20 | 哈尔滨工程大学 | Omnibearing visual pool boiling experimental provision |
| CN104280416A (en) * | 2014-10-11 | 2015-01-14 | 哈尔滨工程大学 | All-dimensional visual pool type boiling experiment device |
| CN104914126B (en) * | 2015-05-14 | 2017-12-15 | 哈尔滨工业大学 | Low melting point trnaslucent materials phase transition process radiant heating and temperature measuring equipment |
| CN104914126A (en) * | 2015-05-14 | 2015-09-16 | 哈尔滨工业大学 | Low-melting-point half-transparent material phase change process radiation heating and temperature measuring device |
| CN105651808B (en) * | 2016-02-28 | 2018-06-01 | 北京工业大学 | A kind of experimental system and implementation for reducing the fever electronics device surface degree of superheat |
| CN105651808A (en) * | 2016-02-28 | 2016-06-08 | 北京工业大学 | Experiment system for reducing superheat on surface of electronic heating device and implementing method |
| CN106018467B (en) * | 2016-06-24 | 2019-05-03 | 安徽工业大学 | A kind of visualization bulk container boiling experimental provision |
| CN106018467A (en) * | 2016-06-24 | 2016-10-12 | 安徽工业大学 | Visual large vessel boiling experiment device |
| CN106769799A (en) * | 2016-11-11 | 2017-05-31 | 中山大学 | The mode identification method and system of a kind of latent heat of vaporization on-line monitoring |
| CN107154205A (en) * | 2017-07-13 | 2017-09-12 | 安徽工业大学 | A kind of humorous container boiling heat transfer experimental provision of adjustable angle and experimental method |
| CN107154205B (en) * | 2017-07-13 | 2022-10-28 | 安徽工业大学 | Angle-tunable container boiling heat exchange experimental device and experimental method |
| CN108037064A (en) * | 2017-12-26 | 2018-05-15 | 华测检测认证集团股份有限公司 | Multitask multi-temperature section is carried out at the same time automotive electronics component reliability test device |
| CN108469195A (en) * | 2018-01-03 | 2018-08-31 | 北京今日能源科技发展有限公司 | A kind of fin-tube type Latent Heat Storage Exchanger |
| CN110032795B (en) * | 2019-04-10 | 2022-09-20 | 西北工业大学 | Method for predicting thermal fatigue crack initiation life of nickel-based single crystal alloy |
| CN110032795A (en) * | 2019-04-10 | 2019-07-19 | 西北工业大学 | Crystal Nickel-based Superalloy heat fatigue cracking initiating life prediction technique |
| CN110470695A (en) * | 2019-08-29 | 2019-11-19 | 哈尔滨工程大学 | A kind of bulk container boiling experimental system |
| CN111366838A (en) * | 2020-03-16 | 2020-07-03 | 华北电力大学 | Power device characteristic testing cavity in immersion cooling environment |
| CN113834849A (en) * | 2020-06-23 | 2021-12-24 | 上海交通大学 | Visual test device for researching influence of surface characteristics on critical heat flux density |
| CN112798473A (en) * | 2020-12-29 | 2021-05-14 | 杭州新灵峰润滑油有限公司 | Cooling performance detection equipment and detection method for motor vehicle cooling liquid |
| CN112798645A (en) * | 2020-12-29 | 2021-05-14 | 安徽工业大学 | Heating piece for multi-angle detection of boiling heat transfer, experimental device and experimental method thereof |
| CN112710943A (en) * | 2021-03-29 | 2021-04-27 | 普世通（北京）电气有限公司 | Phase change cooling performance test system for high-power semiconductor device |
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