CN1624911A - Pumped liquid cooling system using a phase change refrigerant - Google Patents

Pumped liquid cooling system using a phase change refrigerant Download PDF

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Publication number
CN1624911A
CN1624911A CN200410096016.3A CN200410096016A CN1624911A CN 1624911 A CN1624911 A CN 1624911A CN 200410096016 A CN200410096016 A CN 200410096016A CN 1624911 A CN1624911 A CN 1624911A
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CN
China
Prior art keywords
cooling
cooling system
condenser
evaporator
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200410096016.3A
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Chinese (zh)
Inventor
约瑟夫·马尔萨拉
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Thermal Form and Function LLC
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Thermal Form and Function LLC
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Publication date
Application filed by Thermal Form and Function LLC filed Critical Thermal Form and Function LLC
Publication of CN1624911A publication Critical patent/CN1624911A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evaporator device. Refrigerant is circulated by a liquid refrigerant pump to the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. The vapor is condensed by a conventional condenser coil and the condensed liquid along with any unevaporated liquid is returned to the pump. The system operates nearly isothermally in both evaporation and condensation.

Description

Use the pumped liquid cooling system of phase change refrigerant
Related application
The application is that the sequence number of submitting on November 12nd, 2002 is No.10/292, the part continuity of 071 application co-pending.
Technical field
The present invention relates to the cooling of Electrical and Electronic element, more specifically, relate to a kind of liquid refrigerant pump, it makes refrigerant cycle arrive a plurality of cooling bench/evaporators with electric or electronic component thermo-contact to be cooled.
Background technology
Electrical and Electronic element (for example: microprocessor, IGBT ' s (igbt element), power semiconductor etc.) is cooled off by the air cooling radiator with extensional surface usually, and these radiators directly are contained on the surface to be cooled.Fan or air blast make air move through heat radiator fin, and the heat that element produces is taken away.Along with the increase of power density, the miniaturization of element and the contraction of encapsulation, can not come abundant cooling electric and electronic component by radiator and forced air flow sometimes.In this case, just must use other method to take away heat from element.
A kind of method that is used for when direct air cooling taking away from element heat is to use monophasic fluid, and this fluid is pumped into cooling bench.Usually, this cooling bench has a coiled pipe that is installed on the flat metallic plate.Element to be cooled is installed on this flat board by heat, and the monophasic fluid that is pumped that flows through this pipe has been taken away the heat that is produced by element.
Existing polytype cooling bench design, some of them contain the machine work groove and replace pipeline to transport fluid.But the design of all cooling benches is all taken away heat by the sensible heat (sensibleheating) that uses fluid similarly and is come work.Then, the air cooling coil pipe that heated direction of flow is provided with a long way off, this be in fluid return pump and begin to circulate once more before this fluid cooled off by surrounding air.The sensible heat of this use fluid is taken away the method for heat from the Electrical and Electronic element, is subjected to the thermal capacitance quantitative limitation of single-phase mobile fluid.For the particular fluid that will take away more heats, or its temperature must raise, or must the pumping more fluid.This can cause producing high temperature and/or big flow rate for the cooling high power microelectronic device.High temperature may damage electric or electronic installation, and simultaneously big flow rate need have the pump of big motor, and should big motor consumption extra electric power has also limited the application of this cooling system.Big flow rate also may cause corrosion of metal in the cooling bench owing to high fluid velocity.
Another kind be used in the time can not using air cooling from the method that element is taken away heat use heat pipe with heat from thermal source be sent to can easier heat radiation the position.Heat pipe is a sealing device, and it uses condensable fluid that heat is moved to another position from a position.The capillary pump of the liquid phase by using the core rope structure is used for finishing fluid and transmits.One end (evaporator) of heat pipe is located in the element and produces the heat place, and the other end (condenser) is located at heat and treats dissipation place; Condenser end often and the extensional surface such as fin contact helping heat taken in the surrounding air.This method of taking away heat is subjected to fluid is transferred to the restriction of ability of the core rope structure of evaporator.When high heat-flux, the situation of usually said " dry (dry out) " can take place, its SMIS rope structure can not will raise to the temperature that evaporator transmits enough fluids and this device, may cause damage to this device.Heat pipe also to respect to gravity towards sensitivity.That is, have the littler ability of taking away heat than evaporator towards the below towards the evaporator of top, towards below situation in, except the capillarity of core rope structure, gravity has also been assisted the transmission of fluid.At last, owing to the restriction of capillary pump effect, heat pipe can not the distance that heat delivered is very long arrive dissipator at a distance once more.
Another method that is adopted when direct air cooling is used known both vapor compression cool cycles.In this case, cooling bench is the evaporator of this circulation.Compressor reducer has improved the temperature and pressure of steam, arrives such degree during away from evaporator, that is, air can be used for vapor condensation is turned back to cooling bench with further evaporation and cooling to its liquid state and with it.This method has higher isothermal heat delivered rate and the heat mobile phase can be worked as remote advantage.But this method has some major defects,, has limited its practical application in cooling electric and electronic installation that is.It at first is the power consumption of compressor reducer.In high heat load was used, the required electrical power of compressor reducer may very big and available above this application power.Another problem relates in the operation that is lower than evaporator under the ambient temperature (cooling bench).In this case, the surface of poor insulation is around below the dew point of air, thereby the possibility that causes the condensation of aqueous water and produce short circuit produces harm to the people.The both vapor compression cool cycles is designed to any liquid refrigerant not turned back to compressor reducer, and this returning may cause the physical hazard of compressor reducer and shorten its life-span owing to having diluted its lubricating oil.In cooling electric and electronic component, heat load may be a height change, causes unevaporated cold-producing medium discharge cooling bench and enters compressor reducer.The life-span that this can cause damaging compressor reducer and shorten compressor reducer.This is another shortcoming of the both vapor compression cooling of element.
As can be seen, exist for the lasting demand of improving one's methods of in the time can not using air cooling, taking away heat from element.
Summary of the invention
Satisfy this demand by pumped liquid cooling system of the present invention, wherein the Electrical and Electronic element is cooled off with very low secondary power consumption and very high heat delivered rate from element surface.The present invention has also reduced and heat is moved on every side the required temperature of radiator from element falls.
According to an aspect of the present invention, a kind of liquid refrigerant pump with refrigerant cycle to the cooling bench/evaporator of electric or electronic component thermo-contact to be cooled.This liquid refrigerant then partly or entirely evaporates by the heat that is produced by element.Steam is condensed by traditional condenser coil, and the liquid of condensation and other unevaporated liquid turn back to pump.System of the present invention works near isothermal ground in evaporation and condensation.
Therefore, an object of the present invention is the Electrical and Electronic element is cooled off.Another object of the present invention is under the situation of very low secondary power consumption and very high heat delivered rate from element surface element to be carried out this cooling.Another purpose of the present invention is to reduce heat to be moved on every side the required temperature of radiator from element to fall.
Other purpose of the present invention and advantage will become clear from following description, accompanying drawing and claims.
Description of drawings
Figure 1A is a schematic block diagram, shows the parallel-connection structure of pump in accordance with the present invention liquor charging body cooling system;
Figure 1B is a schematic block diagram, shows the cascaded structure of pump in accordance with the present invention liquor charging body cooling system; And
Fig. 2 shows a plurality of cooling bench evaporators, wherein each all with element thermo-contact to be cooled.
Embodiment
With reference now to Figure 1A and Figure 1B,, show cooling system 10, it makes as the refrigerant cycle of working fluid.But this cold-producing medium can be any suitable vaporized refrigerant, for example R-134a.This cool cycles can begin at liquor pump 12 places that are shown as the seal fluid pump.Pump 12 is pumped into liquid menifold 14 with liquid refrigerant, is assigned to one or more branch roads or circuit 16 at this place's liquid refrigerant.Every branch road or circuit 16 supply to cooling bench 18 from menifold 14 with liquid refrigerant.The condensing temperature of cold-producing medium preferably is controlled to be is higher than the dew point that is provided with around the cooling bench evaporator place.
As shown in Figure 2, each cooling bench 18 all with electric or electronic component 20 thermo-contacts to be cooled, make liquid refrigerant under system pressure, evaporate.According to produce what of heats by element 20, do not have, some or all liquid refrigerant can evaporate at cooling bench 18 places.In most of the cases, some cold-producing mediums evaporate, and the two-phase mixture of liquid and vapor refrigerant all will leave each cooling bench 18, shown in arrow 22 among Figure 1A and Figure 1B.
In a preferred embodiment of the invention, at this some place of system works, each cooling bench 18 all is discharged to conduit 24 with the mixture of its two phase refrigerant, shown in Figure 1A and Figure 1B.Use for majority, conduit 24 is pipes, rather than separator.Conduit 24 is installed on the condenser 28 that comprises condenser coil 30 and fan 32.The condenser coil 30 that is installed on the conduit 24 is got back to liquid with the vapor phase condensation, and will be taken away by the heat that electronic component 20 produces, as shown in Figure 2.Any unevaporated liquid in conduit 24 is only by condenser 28.In Figure 1A and Figure 1B, show the condenser 28 that uses fan 32 to carry out the surrounding air cooling, but for those skilled in the art, can use any suitable heat extraction form that does not break away from the scope of the invention, for example air, water-cooled or liquid cooling condenser or evaporative condenser.
Condenser 28 with a little more than the corresponding pressure of the temperature of surrounding air dew point temperature under work.In this manner, because system temperature can not be lower than dew point temperature on every side, therefore can not form the condensation of water.This condenser working point is set the pressure of whole system by the refrigerant temperature that enters and from the ability that condenser zone is walked heat, therefore fixes this condensing temperature and pressure.Equally, because the cold-producing medium of evaporation is condensed into liquid phase, so the cold-producing medium that condenser 28 is set up evaporation enters flowing of condenser 28 from conduit 24, and will not move to condenser 28 from cooling bench-evaporator 18 by steam for any compressor.This liquid refrigerant is discharged from condenser 28, and is as shown in arrow 35 by conduit 34, and shifts to the additional volume 36 that maintains the certain quantity of fluid cold-producing medium.Pump 12 is pumped into liquid refrigerant the cooling bench from this additional volume 36, at this place cold-producing medium evaporation becoming two-phase mixture, all these processes all without any need for vapour/liquid separate.This two-phase mixture leaves cooling bench and enters into condenser, and this condenser is a liquid with vapor condensation, thereby only liquid leaves condenser.
The outlet of additional volume 36 is connected to the inlet of liquid refrigerant pump 12.At pump 12 places, the pressure of cold-producing medium is elevated to the friction loss that is enough to overcome in system, and begins to cool down circulation once more.Pump 12 is chosen as its pressure and is elevated to and equals or exceeds in design friction loss in system during flow rate.
Different with the pumping liquid single phase system, the present invention works in the isothermal mode, and this is because it uses phase transformation to take away heat, rather than utilizes the sensible capacity of liquid refrigerant to take away heat.Lower and the element cooling of this temperature that allows to compare with the single-phase liquid system in evaporator better.Evaporation by working fluid has obtained lower liquid flow rate to take away heat, thereby keeps fluid velocity lower and the pumping power that will be used for heat extraction keeps very lowly.All decrease for pumping single-phase liquid system and steam compression refrigerant system additional electrical power.Cooling system of the present invention comprises that at least one produces the element that heat and needs cool off, and the cooling bench evaporator of at least one and this at least one element thermo-contact.Transpirable cold-producing medium is recycled at least one cooling bench evaporator by the liquid refrigerant pump, thereby this cold-producing medium passes through the heat of vaporization by at least one element generation at least in part, thereby produces steam.Condenser has generated single liquid phase with the refrigerant vapour condensation of this part evaporation.But come the vaporized refrigerant of self-pumping to receive by first liquid conduits that is connected on (one or more) cooling bench evaporator.Second conduit from the cooling bench evaporator is connected on the condenser.The liquid return line is made as the inlet from the condenser to the refrigerated medium pump.
System 10 of the present invention has obtained the advantage with respect to hot-pipe system, and this is because liquid flow rate depends on capillarity not resembling in heat pipe, and can set independently by the flow rate of setting liquor pump.Therefore can avoid dry.Cooling bench/evaporator system of the present invention for respect to gravity towards insensitive.Different with hot-pipe system, the thermal capacity of evaporator 18 of the present invention some towards in can not reduce.
The present invention with respect to heat pipe and based on another advantage of steam compression system be on bigger distance with evaporator and condenser separately.This permission has greater flexibility in package system and design arrangement.The heat load that the present invention can easily handle element 20 to be cooled changes.Because any unevaporated liquid refrigerant all turns back in the pump, therefore can easily fit in a plurality of cooling benches under the different load, and needn't worry to damage compressor reducer.Do not work because the present invention have be lower than at any some place of system 10 under the temperature of dew point temperature on every side, so can not make water vapor condensation and form aqueous water.
Describe the present invention in detail, obviously under the situation that does not break away from the scope of the present invention that is defined by the following claims, can make other modifications and variations with reference to the preferred embodiments of the present invention.

Claims (16)

1, a kind of cooling system comprises:
The element that at least one produces heat and needs cooling;
At least one cooling bench evaporator, itself and described at least one element thermo-contact;
The liquid refrigerant pump, it has at least one inlet;
But vaporized refrigerant, it is recycled to this at least one cooling bench evaporator by this liquid refrigerant pump, thus this cold-producing medium is at least in part by by the heat of vaporization that this at least one element produced, to produce steam;
Condenser is used for the refrigerant vapour that this part of condensation is evaporated, to generate single liquid phase;
First liquid conduits is used to receive the transpirable cold-producing medium from the liquid refrigerant pump, and described first liquid conduits is connected on this at least one cooling bench evaporator;
Second conduit, it comes from this at least one cooling bench evaporator, and described second conduit is connected on this condenser; And
The liquid return line of inlet from the condenser to the refrigerated medium pump.
2, cooling system as claimed in claim 1, it is characterized in that, one additional volume is included in the cooling system, with when liquid refrigerant moves by steam in cooling bench evaporator and condenser in the cooling work process, is used for the storage of liquids cold-producing medium.
3, cooling system as claimed in claim 2 is characterized in that, this additional volume is located between described refrigerated medium pump and the cooling bench evaporator.
4, cooling system as claimed in claim 2 is characterized in that, this additional volume is located between described cooling bench evaporator and the condenser.
5, cooling system as claimed in claim 2 is characterized in that, this additional volume is located between described condenser and the refrigerated medium pump.
6, cooling system as claimed in claim 1 is characterized in that, described at least one cooling bench evaporator comprises at least two cooling bench evaporators.
7, cooling system as claimed in claim 6 is characterized in that, described at least two cooling bench evaporators are series connection.
8, cooling system as claimed in claim 6 is characterized in that, described at least two cooling bench evaporators are in parallel.
9, cooling system as claimed in claim 1 is characterized in that, this condenser comprises air.
10, cooling system as claimed in claim 1 is characterized in that, this condenser comprises water-cooled condenser.
11, cooling system as claimed in claim 1 is characterized in that, this condenser comprises the liquid cooling condenser.
12, cooling system as claimed in claim 1 is characterized in that, this condenser comprises evaporative condenser.
13, cooling system as claimed in claim 1 is characterized in that, this liquid refrigerant pump comprises the seal fluid pump.
14, cooling system as claimed in claim 1 is characterized in that, this cold-producing medium comprises the R-134a cold-producing medium.
15, cooling system as claimed in claim 1 is characterized in that, but this cold-producing medium comprises vaporized refrigerant.
16, cooling system as claimed in claim 1 is characterized in that, the condensing temperature of this cold-producing medium is controlled to be to be higher than cooling bench evaporator place dew point on every side is set.
CN200410096016.3A 2003-11-26 2004-11-25 Pumped liquid cooling system using a phase change refrigerant Pending CN1624911A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/723,529 US20050005623A1 (en) 2002-11-12 2003-11-26 Pumped liquid cooling system using a phase change refrigerant
US10/723,529 2003-11-26

Publications (1)

Publication Number Publication Date
CN1624911A true CN1624911A (en) 2005-06-08

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CN200410096016.3A Pending CN1624911A (en) 2003-11-26 2004-11-25 Pumped liquid cooling system using a phase change refrigerant

Country Status (3)

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US (1) US20050005623A1 (en)
CN (1) CN1624911A (en)
TW (1) TW200521657A (en)

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CN101865864A (en) * 2010-06-08 2010-10-20 华东理工大学 System for testing phase transformation cooling effect of electronic components
CN102246276A (en) * 2008-12-19 2011-11-16 瓦里安半导体设备公司 Condensible gas cooling system
CN102589190A (en) * 2012-02-24 2012-07-18 刘小江 Refrigeration method and special equipment without using compressor
CN104344596A (en) * 2013-08-02 2015-02-11 Abb研究有限公司 Refrigeration apparatus and method
CN110044105A (en) * 2018-01-16 2019-07-23 华为技术有限公司 Refrigeration system and its control method and controller
CN111263878A (en) * 2017-07-23 2020-06-09 祖达科尔有限公司 System and method for heat exchange
CN112902715A (en) * 2019-12-03 2021-06-04 中兴通讯股份有限公司 Liquid cooling board and heat dissipation equipment

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US20090229283A1 (en) * 2007-08-24 2009-09-17 Joseph Marsala Method and apparatus for isothermal cooling of hard disk drive arrays using a pumped refrigerant loop
US20090158757A1 (en) * 2007-12-19 2009-06-25 Joseph Marsala System and method for controlling the cooling of variable heat loads in heat generating devices
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JP6269478B2 (en) * 2012-03-22 2018-01-31 日本電気株式会社 Electronic substrate cooling structure and electronic device using the same
US9537686B2 (en) 2014-04-03 2017-01-03 Redline Communications Inc. Systems and methods for increasing the effectiveness of digital pre-distortion in electronic communications
CN109743869B (en) * 2019-01-30 2020-04-14 全亿大科技（佛山）有限公司 Liquid cooling radiator and server system
US20220236018A1 (en) * 2019-03-15 2022-07-28 Shimadzu Corporation Cooling device
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US5333677A (en) * 1974-04-02 1994-08-02 Stephen Molivadas Evacuated two-phase head-transfer systems
US5406807A (en) * 1992-06-17 1995-04-18 Hitachi, Ltd. Apparatus for cooling semiconductor device and computer having the same
JP3405653B2 (en) * 1997-04-03 2003-05-12 三菱電機株式会社 Hermetic electric compressor, method for producing the same, and refrigeration / air-conditioning apparatus using the same
US6393853B1 (en) * 2000-12-19 2002-05-28 Nortel Networks Limited Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms
JP2003318341A (en) * 2002-04-25 2003-11-07 Matsushita Electric Ind Co Ltd Cooling device for semiconductor element

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CN102246276A (en) * 2008-12-19 2011-11-16 瓦里安半导体设备公司 Condensible gas cooling system
CN102246276B (en) * 2008-12-19 2013-08-28 瓦里安半导体设备公司 Workpiece cooling method and system for transferring heat away
CN101865864A (en) * 2010-06-08 2010-10-20 华东理工大学 System for testing phase transformation cooling effect of electronic components
CN102589190A (en) * 2012-02-24 2012-07-18 刘小江 Refrigeration method and special equipment without using compressor
CN104344596A (en) * 2013-08-02 2015-02-11 Abb研究有限公司 Refrigeration apparatus and method
CN111263878A (en) * 2017-07-23 2020-06-09 祖达科尔有限公司 System and method for heat exchange
CN110044105A (en) * 2018-01-16 2019-07-23 华为技术有限公司 Refrigeration system and its control method and controller
CN110044105B (en) * 2018-01-16 2020-11-03 华为技术有限公司 Refrigeration system and control method and controller thereof
CN112902715A (en) * 2019-12-03 2021-06-04 中兴通讯股份有限公司 Liquid cooling board and heat dissipation equipment
WO2021110052A1 (en) * 2019-12-03 2021-06-10 中兴通讯股份有限公司 Liquid-cooled plate and heat dissipation device

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US20050005623A1 (en) 2005-01-13

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