2005216^1 九、發明說明： 【發明所屬之技術領域】 本發=有關^電氣(electrical)和電子元件 component)的切技術，尤歧有關於利麟態冷 輸送冷媒’使其在多個熱接觸於待冷卻之電氣和 的冷卻平板或蒸發器中循環的冷卻技術。 + 【先前技術】 電氣和電子it件如微處理器(micr〇pr〇ce 雙極電晶體⑽T)和功率二極料，絕大多數係利3 接貼附於待散熱之表©的風冷(如。_)式之散熱裳置的 延伸表面進行冷卻。風扇或鼓風機係帶動空氣流經 片’以使空氣帶走元件產生的熱量。隨著元件的功率不斷 增加，7L件日益小型化以及整體壓縮 f和強㈣流對钱和電子元魏行充分冷卻Γ而= 其他方法解決散熱問題。 、 ，直接風冷式受到_時，—種元件散熱的方法是將 =屬Ιίίίί料Ϊ。典型的冷卻平板通常具有貼附 而社、、'千ί的m冷卻元件係與金屬平板熱接觸， 达之單相流體係流過彎管而帶走元件所産生的敎量。 歸^卩平板有多種設計形式，且其中—些係以機i加工 槽替代管道來輸送㈣。但不論如何，所有冷卻平板大多 =流體的感熱性來散熱。吸收熱量後的流體將流向位於 =的風冷ft ’並經由周遭纽將其冷卻後返回幫浦， 再開始下_循環。這種利用流體感熱性對電氣和電子 20052亂 元件進行冷卻的方法係受到單相流動流體之熱容量 (thermal capacity)的限制。對於一個給定的流體而言，如要 吸收更多的熱量，必然導致其自身溫度升高，或必須抽取 更多的流體。在冷卻高功率的微電子裝置時，將會導致高 溫及/或大液流量，其中高溫可能會損害電氣和電子裝置， 而大液流夏則需要使用大馬達的幫浦，因而消耗寄生電 能，並限制了冷卻系統的運行。大液流量還可能因為高流 速而導致金屬冷卻平板的腐钮。 在不適合使用風冷式冷卻的情況下，另一種元件散熱 ^法^使用熱管將熱量從熱源傳送至更易於散熱之處。熱 官爲密封裝置’其係细可凝結之流體來將熱能從某一處 傳至另一處。流體的傳送是利用毛細結構對液相的毛細管 抽吸作用而完成的。熱管的—端（蒸發器）係位於元件的 發熱處，另-端（冷凝H)難位於散熱處。通常冷凝器 h係接觸於政熱器翅片的延伸表面，以利於將熱量散發到 周，工氣巾1^種散熱方法*限於毛細結構輸送流體到蒸 發器的能力。在高熱通量(the職丨㈣的情訂，當毛細 結構不能輸送足_流體到蒸發_，會發生所謂「供 ⑽情況，造成元件的溫度升高，甚至導致元件損 ΐ時易受到重力的影響。也就是說，當蒸發端上 、⑽λλ/熱能力小於蒸發端下置。因絲發端下置時， if的輸送除毛細作料還附加有重力的作用。由於毛細 i端 的限制，熱管不能遠距離傳熱’因而無法實現 200521657 15495pif.doc 在不適合使用風冷式冷卻的情況下，還有一種散熱方 法是利用眾所周知的蒸汽壓縮製冷循環。在此例中，冷卻 平板爲此循環的蒸發器。壓縮機將提升蒸汽的溫度和壓 力以使蒸A通過風冷式冷凝器而凝結成液態，並返回冷 卻平板以進行進一步的蒸發和冷卻。這種方法具有等溫的 南熱傳導率以及傳熱距離遠的優點，但此方法的某些主要 缺點卻限制了它在電氣和電子元件之冷卻方面的實際應 用。第一，此方法會產生壓縮機耗損能量的問題。在高溫 負荷的系統中，壓縮機消耗的電能大大超過此系統散熱所 需要的能量。另外，在常溫下工作的蒸發器（冷卻平板）， 其絕緣不佳之表面的溫度有可能低於周圍空氣的露點溫度 (dew point temperature)，並引起水汽凝結，因而産生短路 而危及人身安全。蒸汽壓縮製冷循環系統的設計不允許任 何液態冷媒返回壓縮機，以避免造成壓縮機的物理損害和 因潤滑油稀釋而縮短壓縮機壽命。在電氣和電子元件散熱 過程中，熱負荷會有报大變化，造成未蒸發的冷 ，卻平板和進入壓縮機。這會導致壓縮機的損害而縮短其 奇π 這也疋蒸Α壓法冷卻電子元件的缺點之一。 由此看來，在不適合風冷式冷卻的情況下，元件的 熱方法還需進一步改進。 【發明内容】 本發明提出-種泵送液態冷媒系統，其係以非常 寄生能量耗損及非常高的熱傳導率來冷卻電氣和 件。本發明減少了將熱量從元件傳送至散熱片時所下= 20052 的溫度。 依據本發明之一觀點，一液態冷媒幫浦係將冷媒輸送 至與待冷卻電氣和電子元件熱接觸的冷卻平板或蒸發器。 液恶冷媒在吸收元件所產生的熱量之後，將部分地或完全 地蒸發。蒸汽借由常規的冷凝器彎管凝結成液體，而已凝 結之液體係與其餘未蒸發之液體返回幫浦。本發明所提出 的系統在蒸發和冷凝過程中是近乎等溫的。 基於上述，本發明之一目的是提供電氣和電子元件的 冷，方法。本發_另—目的是錄低的寄生能量耗損和 很局，熱傳導率對元件騎冷卻。本發明的再—目的是減 少熱置由7L件向周圍散熱片傳導之過程中所降低的溫度。 爲讓本發明之上述和其他目的、龍和優點能更ς 易懂，下文特舉較佳實施例，並配合所附圖式，; 明如下。 、4 【實施方式】 圖1Α和1Β!會示爲冷卻系統1〇的示意 浦12開始’其例如是—密封式的液體 將液態冷縣送至㈣歧f(manifGld)14 靖 多條支管—ch)(或線路(line)) 16 /每刀佈於—或 16係從歧管14將液態冷媒輸送到冷卻平板路） 凝溫度較佳岐控财冷料板祕找在 200524各S3。。 境露點溫度之上。 如圖2所不，每一冷卻平板18係與待冷卻之電氣和 電子兀件2〇熱軸，因而導致㈣冷 發。根據元件20所產生之熱量的多少，冷媒有可能在;^ 平板18上的疋全不蒸發、部分蒸發、或全部蒸發。在大多 數It況下’只有—部分冷媒會蒸發，喊液雙相混合的冷 媒將會離開每一冷卻平板18，如圖认和1B中箭頭22所 示0 在本發明一較佳實施例中，在冷卻系統的上述工作 每一冷卻平板18係將其上之冷_雙相混合物排入導 官=4，如圖1A及圖1B所示。在大多數的應用中，導管 24是一根管子，其係與包含有一冷凝彎管如和一風扇μ 的冷凝器28連接。與導管24連接的冷凝彎管3〇係使氣相 物質凝結回液相物質，並帶走元件2〇所産生的熱量，如圖 ^所不。在導管24中，任何未蒸發的液體則僅僅流過冷凝 器28。在圖认和1B，冷凝器28係利用風扇32靠周圍空 氣進行冷卻。只要不違背本發明的目標，可採用任何先前 技術中適用的散熱方式，如風冷式冷凝器、水冷式或液冷 式冷凝器以及蒸發式冷凝器。 ，凝器28在一壓力及其對應之溫度下工作，且此溫 度略咼於周圍空氣的露點溫度。由於系統溫度始終高於環 境露點溫度，從而避免了周圍空氣的水汽凝結。該冷凝器 工作點係根據輸入的冷卻溫度及其從冷凝器中帶走熱能的 能力來設定整個系統的壓力，進而確定冷凝溫度和壓力。 20052觀 將從導管爲液態’因此冷凝器28 而盔需壓顿將Ϋ、Γ 建個已祕之冷制流道， 盛有ί二:=?」並通過導…進入 發，並且變成雙相混^。；_媒f达至冷部平板而使冷媒蒸 ΪΪΓ 卻平板後係進人將蒸汽凝結成液體的 冷政器，因此流出冷凝器的只有液體。 口。的出口係連接於液態冷媒幫浦12的入 中的摩、#冷媒賴力储充分秘高以克服系統 ==，；而開始下一輪的冷卻循環。在設計幫浦 隸力升高轉於或大㈣統中的摩 细系im送液體錢不同，本發明提出的等溫運行冷 ’而非冷媒的感熱能力來傳熱。這使得 可以有較低的溫度，且此系統對元件的冷卻效果也 透過工作流體的蒸發來散熱可達到較 :的，罝，且其可維持低流體速率以及非常低的泵送功 率。與早相泵送液態冷媒系統及蒸汽壓縮製冷系統相較之 y ’此系統的寄生電子功率將大大地降低。本發明之冷卻 系統主要係由至少一個待冷卻的發熱元件以及至少一個與 此元件熱接綱冷卻平板蒸發器裝置所構成。可蒸發之^ 媒係藉由液態冷媒幫浦抽送至該冷卻平板蒸發^而循環。 200522005216 ^ 1 IX. Description of the invention: [Technical field to which the invention belongs] The present invention is related to the ^ electrical and electronic component component cutting technology, in particular, it is related to the cold transport of refrigerants in the Linn state, which makes it Cooling technology circulating in contact with the electrical and cooling plate or evaporator to be cooled. + [Previous technology] Electrical and electronic components such as microprocessors (micr〇pr〇ce bipolar transistor ⑽T) and power diodes, most of which are attached to the table to be cooled © air-cooled (Such as. _) The extended surface of the cooling rack is cooled. A fan or blower drives the air through the sheet ' so that the air takes away the heat generated by the element. As the power of the components continues to increase, 7L parts are increasingly miniaturized and the overall compression f and strong convection are sufficient to cool the money and electronic elements. However, other methods solve the heat dissipation problem. When the direct air-cooling method is used, a method for dissipating heat of the component is to belong to ΙΙίίίΪ. A typical cooling slab usually has an attached cooling unit that is in thermal contact with a metal flat plate, so that a single-phase flow system flows through the elbow to take away the amount of chirp generated by the element. There are many design forms of returning flat plates, and some of them use machined grooves instead of pipes to convey the concrete. In any case, all cooling plates are mostly the fluid's thermal sensitivity to dissipate heat. The fluid that has absorbed the heat will flow to the air-cooled ft ′ at = and will be cooled through the surroundings, then return to the pump, and then start the next cycle. This method of using fluid thermal properties to cool electrical and electronic 20052 components is limited by the thermal capacity of a single-phase flowing fluid. For a given fluid, if more heat is to be absorbed, it will inevitably lead to an increase in its own temperature, or more fluid must be extracted. When cooling high-power microelectronic devices, high temperatures and / or large liquid flows will be caused. High temperatures may damage electrical and electronic devices, while large liquid flows require the use of large motor pumps, thus consuming parasitic power. And limit the operation of the cooling system. Large fluid flows can also cause metal buttons to scorch due to high flow rates. When air-cooled cooling is not suitable, another component dissipates heat. ^ Use a heat pipe to transfer heat from a heat source to a place where it is easier to dissipate heat. The heat official is a sealing device 'which is a fine condensable fluid to transfer heat energy from one place to another. The transfer of fluid is accomplished by capillary suction of the liquid phase by the capillary structure. The one-end (evaporator) of the heat pipe is located at the heating place of the component, and the other-end (condensing H) is difficult to be located at the heat sink. Generally, the condenser h is in contact with the extended surface of the fins of the heat radiator to facilitate the dissipation of heat to the periphery. The industrial air towel 1 heat dissipation method * is limited to the ability of the capillary structure to transport fluid to the evaporator. In the case of high heat flux, the so-called "supply condition" occurs when the capillary structure cannot transport enough fluid to evaporate_, which causes the temperature of the component to rise, and even causes the component to be vulnerable to gravity. That is to say, when the evaporation end is above, ⑽λλ / heating capacity is lower than the evaporation end below. Because the silk hair end is placed underneath, the if conveys the capillary removal material and has the effect of gravity. Due to the limitation of the capillary i end, the heat pipe cannot be far 'Heat transfer by distance' cannot be achieved 200521657 15495pif.doc In the case where air-cooled cooling is not suitable, another method of heat dissipation is to use the well-known vapor compression refrigeration cycle. In this example, the cooling plate is the evaporator of this cycle. The compressor will raise the temperature and pressure of the steam so that steam A condenses into a liquid through an air-cooled condenser and returns to the cooling plate for further evaporation and cooling. This method has an isothermal south thermal conductivity and a heat transfer distance Advantages, but some major disadvantages of this method limit its practical application in cooling electrical and electronic components. First, this This method will cause the energy loss of the compressor. In a high-temperature load system, the power consumed by the compressor greatly exceeds the energy required for the system to dissipate heat. In addition, the evaporator (cooling plate) operating at normal temperature has poor insulation. The surface temperature may be lower than the dew point temperature of the surrounding air and cause condensation of water vapor, which may cause a short circuit and endanger human safety. The design of the vapor compression refrigeration cycle system does not allow any liquid refrigerant to return to the compressor to avoid causing The physical damage of the compressor and the shortened compressor life due to the dilution of the lubricating oil. During the heat dissipation process of the electrical and electronic components, the thermal load will change greatly, resulting in un-evaporated cold, but flat and entering the compressor. This will cause the compressor This shortens the odd π damage. This is also one of the shortcomings of the electronic component cooling method by steaming A. From this point of view, in the case of not suitable for air-cooled cooling, the thermal method of the component needs to be further improved. The invention proposes a pumped liquid refrigerant system, which uses very parasitic energy loss and very The thermal conductivity of the cooling electrical components and parts. The present invention reduces the temperature when the heat is transferred from the component to the heat sink = 20052. According to one aspect of the present invention, a liquid refrigerant pump system sends the refrigerant to the electrical components to be cooled. A cooling plate or evaporator that is in thermal contact with electronic components. The liquid evil refrigerant will partially or completely evaporate after absorbing the heat generated by the components. The steam is condensed into liquid by a conventional condenser elbow, but the condensed liquid system Return to the pump with the remaining non-evaporated liquid. The system proposed by the present invention is nearly isothermal in the process of evaporation and condensation. Based on the above, one object of the present invention is to provide a method for cooling electrical and electronic components. The other purpose is to record low parasitic energy consumption and very local, thermal conductivity to cool the components. The second purpose of the present invention is to reduce the temperature lowered during the heat transfer from the 7L part to the surrounding heat sink. In order to make the above and other objects, advantages, and advantages of the present invention more comprehensible, a preferred embodiment is given below, in conjunction with the accompanying drawings, as follows. [Embodiment] Figs. 1A and 1B! The schematic pump 12 which will be shown as the cooling system 10 starts, which is, for example, a sealed liquid that sends a liquid cold county to the ㈣ 分 f (manifGld) 14. ch) (or line) 16 / each knife cloth at-or 16 series to transfer liquid refrigerant from the manifold 14 to the cooling slab.) The condensing temperature is better. . Above the dew point. As shown in Fig. 2, each cooling plate 18 is connected to the hot axis of the electrical and electronic element 20 to be cooled, thus causing a cold hair. Depending on the amount of heat generated by the element 20, the refrigerant may be on the ^ plate 18 does not evaporate, partially evaporate, or evaporate. In most cases, 'only — part of the refrigerant will evaporate, and the refrigerant mixed with the liquid biphase will leave each cooling plate 18, as shown by arrow 22 in FIG. 1B. In a preferred embodiment of the present invention, In the above-mentioned work of the cooling system, each cooling plate 18 discharges the cold_dual-phase mixture on it into the guide = 4, as shown in FIG. 1A and FIG. 1B. In most applications, the conduit 24 is a tube connected to a condenser 28 containing a condensing elbow such as a fan μ. The condensation elbow 30 connected to the duct 24 condenses the gas-phase substance back to the liquid-phase substance and removes the heat generated by the element 20, as shown in FIG. In the conduit 24, any non-evaporated liquid then flows through the condenser 28 only. In Fig. 1B, the condenser 28 is cooled by the surrounding air using a fan 32. As long as the object of the present invention is not violated, any heat dissipation method applicable in the prior art may be adopted, such as an air-cooled condenser, a water-cooled or liquid-cooled condenser, and an evaporative condenser. The condenser 28 operates at a pressure and its corresponding temperature, and this temperature is slightly lower than the dew point temperature of the surrounding air. Since the system temperature is always higher than the ambient dew point temperature, moisture condensation in the surrounding air is avoided. The operating point of the condenser is based on the input cooling temperature and its ability to remove thermal energy from the condenser to set the pressure of the entire system, thereby determining the condensation temperature and pressure. In 20052, the tube will be liquid, so the condenser 28 and the helmet need to be pressed to build a secret cold flow channel, which contains ί 二: =? ”And enters the hair through the guide, and becomes biphasic. ^. _Media f reaches the cold plate and the refrigerant evaporates ΪΪΓ, but the plate is tied into a refrigerator that condenses the steam into a liquid, so only the liquid flows out of the condenser. mouth. The outlet is connected to the inlet of the liquid refrigerant pump 12, and the #refrigerant refrigerant is fully secreted to overcome the system ==, and the next cooling cycle begins. In designing pumps, the transfer of liquids to the micro-systems of the pump system or the pump system is different, and the isothermal operation of the present invention is not cold, rather than the heat-sensing capacity of the refrigerant, to transfer heat. This makes it possible to have a lower temperature, and the cooling effect of this system on the components is also achieved through the evaporation of the working fluid to dissipate heat, which can maintain a low fluid rate and a very low pumping power. Compared with the early-phase pumped liquid refrigerant system and vapor compression refrigeration system, the system's parasitic electronic power will be greatly reduced. The cooling system of the present invention is mainly composed of at least one heating element to be cooled and at least one cooling plate evaporator device thermally connected to the element. The evaporable medium is pumped to the cooling plate by a liquid refrigerant pump to be evaporated and circulated. 20052
Wpii .doc 在此，至少有一部分的冷媒係藉由吸收發熱元件所產生之 熱量而蒸發為蒸汽。-冷凝器係使部分已蒸發的冷媒蒸汽 凝結，而形成單相液體。來自幫浦的可蒸發冷媒係藉由與 冷卻平板蒸發器連接的第一導管而被接收。第二導管係連 接冷卻平板蒸發器和冷凝器，因而在冷凝器與冷卻幫浦入 口之間形成液體的返回管道。 與熱管冷卻系統相比，本發明之系統的優點在於 ，液流量不取決於毛細作用，而是取決於液體幫浦的液流 量之設定，®此可避免烘乾齡料生。與鮮冷卻系統 =同的是’本發明的冷卻平板/蒸發器系統無需考慮重力的 影響’蒸發器18賴容量不因其安裝的方向性而改變。 本發明與熱管和蒸汽壓縮冷卻系統相較之下，另一優 ，在於其和冷凝器可置於相距較遠的地方，以使封 和配置設計具有更大的$活性。本發啊簡單地處 元件2G之熱貞荷_化。由於所有未蒸發的液態 回至幫浦’因此可輕易地調節多個冷卻平板的熱 化’而毋須擔心壓縮機之損壞。由於本發明之冷卻 /、、、、 的各個工作點溫度始終高於環境露點、、w #， 會引起水蒸汽凝結。 m度’因而不 限定發明已以較佳實施例揭露如上，然其並非用以 範圍當視二申者=本發明之保護 【圖式簡單說明】 11 圖1A繪示爲本發明之泵送液態冷媒系統的並聯結構 之方塊示意圖。 圖1Β繪示爲本發明之泵送液態冷媒系統的串聯結構 之方塊示意圖。 圖2繪示爲多個冷卻平板蒸發器裝置的示意圖，其中 每一冷卻平板均熱接觸於待冷卻元件。 【主要元件符號說明】 10 :冷卻系統 12 :液體幫浦 14 =歧管 16 :支管 18 :冷卻平板 20 :待冷卻之電氣和電子元件 22 ·氣液混合之冷媒的流動方向 24、34 :導管 28 :冷凝器 30 :冷凝彎管 32 :風扇 35…夜態冷媒流動方向 36 :附加容積 12Wpii.doc Here, at least a part of the refrigerant is evaporated into steam by absorbing the heat generated by the heating element. -The condenser condenses part of the evaporated refrigerant vapor to form a single-phase liquid. The evaporable refrigerant from the pump is received through a first duct connected to the cooling plate evaporator. The second duct is connected to the cooling plate evaporator and the condenser, thereby forming a liquid return pipe between the condenser and the cooling pump inlet. Compared with the heat pipe cooling system, the advantage of the system of the present invention is that the liquid flow rate does not depend on the capillary effect, but depends on the liquid flow rate setting of the liquid pump. This can avoid the drying of raw materials. The same as the fresh cooling system = 'the cooling plate / evaporator system of the present invention does not need to consider the influence of gravity' The capacity of the evaporator 18 does not change due to the directionality of its installation. Compared with the heat pipe and vapor compression cooling system, the present invention has another advantage in that it can be placed far away from the condenser to make the sealing and configuration design more active. The hair is simply located in the heat of the 2G element. Since all non-evaporated liquid is returned to the pump ', the heating of multiple cooling plates can be easily adjusted without worrying about damage to the compressor. Because the temperatures of the working points of the cooling / ,,,, and the present invention are always higher than the environmental dew point,, w #, it will cause water vapor to condense. 'm degree' therefore does not limit the invention has been disclosed as above with a preferred embodiment, but it is not intended to be used as the scope of the second application = the protection of the present invention [Schematic description] 11 Figure 1A shows the pumped liquid of the present invention Block diagram of parallel structure of refrigerant system. FIG. 1B is a schematic block diagram of a series structure of a pumped liquid refrigerant system according to the present invention. Fig. 2 is a schematic diagram of a plurality of cooling plate evaporator devices, wherein each cooling plate is in thermal contact with the element to be cooled. [Description of main component symbols] 10: Cooling system 12: Liquid pump 14 = Manifold 16: Branch pipe 18: Cooling plate 20: Electrical and electronic components to be cooled 22 · Flow direction of gas-liquid mixed refrigerant 24, 34: Conduit 28: Condenser 30: Condensing elbow 32: Fan 35 ... Night refrigerant flow direction 36: Additional volume 12