CN101476708A

CN101476708A - Heat radiating device used for LED

Info

Publication number: CN101476708A
Application number: CNA200910000940XA
Authority: CN
Inventors: 彭庆龙
Original assignee: LCF Corp
Current assignee: LCF Corp
Priority date: 2009-01-23
Filing date: 2009-01-23
Publication date: 2009-07-08
Also published as: CN201838617U

Abstract

The invention provides a heat radiating device for a light emitting diode, which comprises a heat radiating structure. The heat radiating structure comprises a flat base part and a plurality of fins which are arranged on the circumference of the flat base part. The surface of the flat base part is provided with at least one light emitting diode module and a substrate which is arranged on the light emitting diode module, wherein light emitting diode modules are clamped between the radiating structure and the substrate. When the light emitting diode module is operated, the light emitting diode module directly dissipates the generated heat from the flat base part and the fins by permeating through a part which is arranged on the flat base part so as to effectively prevent a heat source from cornering in the light emitting diode module.

Description

Be applied to the heat abstractor of light emitting diode

Technical field

The present invention is relevant a kind of heat abstractor, is meant a kind of heat abstractor that is applied to light emitting diode especially.

Background technology

LED possesses lot of advantages because of the optical characteristics of himself, for instance, use the life-span of overlength, extremely low power consumption, in addition owing to belong to cold light source, have more advantages such as fire safety, noiselessness and ultraviolet radiation, therefore the category of using also more and more widely.Person more, along with rapid economy development, the consumption of the energy increases rapidly, the problem that supply of electric power is critical appears in many areas, the measure that causes limiting power supply produces, and more highlights the superiority of the LED lighting of low power consumption this moment, in view of this, using the LED lighting to replace existing lighting, will be an irreversible trend.

And the factor that influences LED lighting device output light flux is removed the quantum efficiency of led chip, chip size (light-emitting area), outside the input power etc., another key factor is exactly a heat-sinking capability, if the heat of LED encapsulating structure can't dissipate (Dissipation), various composition materials can be the differences of number and the doubt of reliabilitys such as gold thread fracture or the yellow of resin glue material is arranged because expand to each other in the LED encapsulating structure, the luminous efficiency of crystal grain more can have decline significantly along with the rising of temperature, and causes its life-span to shorten significantly and wavelength, phenomenon such as voltage (Vf) drift forward.

In view of this, the present invention satisfies the disappearance at above-mentioned known techniques, proposes a kind of heat abstractor that is applied to light emitting diode, effectively to overcome these above-mentioned problems.

Summary of the invention

Main purpose of the present invention is providing a kind of heat abstractor that is applied to light emitting diode, it is with substrate light-emitting diode (LED) module to be held between substrate and radiator structure, so that the base of light-emitting diode (LED) module can directly be contacted with radiator structure, so that the thermal source that light-emitting diode (LED) module produced can be directly conducted to radiator structure, preventing that effectively thermal source from hoarding in light emitting diode, and then improve the luminous efficiency and the life-span of light-emitting diode (LED) module.

Another object of the present invention is providing a kind of heat abstractor that is applied to light emitting diode, it is to utilize the substrate of bottom surface tool metal material that light-emitting diode (LED) module is held between substrate and radiator structure, to form the upper and lower approach that all has thermally conductive heat of light-emitting diode (LED) module, the heat dissipation that light-emitting diode (LED) module was produced is gone out with acceleration.

In order to achieve the above object, the invention provides a kind of heat abstractor that is applied to light emitting diode, it includes a radiator structure, and radiator structure includes a planar base portion and a plurality of fin of being located at the planar base portion periphery, is to be provided with at least one light-emitting diode (LED) module on the planar base portion surface; An and substrate, it is to be arranged on the light-emitting diode (LED) module, light-emitting diode (LED) module is held between radiator structure and substrate, when light-emitting diode (LED) module operated, light-emitting diode (LED) module was directly gone out the heat that is produced through being located at the lip-deep part of planar base portion by planar base portion and fin dissipation.

Under illustrate in detail by specific embodiment, when the effect that is easier to understand purpose of the present invention, technology contents, characteristics and is reached.

Description of drawings

Fig. 1 is the schematic perspective view of the first embodiment of the present invention.

Fig. 2 is the local appearance cutaway view of the first embodiment of the present invention.

Fig. 3 is the side view of the first embodiment of the present invention.

Fig. 4 is the schematic perspective view of the second embodiment of the present invention.

Fig. 5 is the schematic perspective view of the third embodiment of the present invention.

Among the figure:

10 radiator structures

12 light-emitting diode (LED) modules

14 substrates

16 planar base portion

18 fins

20 screws

22 bases

24 diffusers

26 power pins

30 circuit layouts

32 open-works

34 fixing holes

36 screws

38 thermal greases

40 light-emitting diode (LED) modules

42 bases

44 diffusers

46 substrates

50 open-works

52 bases

54 substrates

56 power supply contacts

The specific embodiment

See also Fig. 1～Fig. 3, it is respectively to be schematic perspective view, part assembly cutaway view and the side view of first kind of embodiment of the heat abstractor that is applied to light emitting diode of the present invention.As shown in the figure, this creation consists predominantly of a radiator structure 10, at least one light-emitting diode (LED) module 12 and a substrate 14, and radiator structure 10 and substrate 14 are in the middle of 12 groups of light-emitting diodes pipe dies are held on, to form similar sandwich-like structure.Below be to be elaborated at said modules:

Radiator structure 10 includes: a planar base portion 16; Several are located at the fin 18 of planar base portion 16 peripheries; And several are located at the screw 20 on the planar base portion 16.

At least one light-emitting diode (LED) module 12, it includes a base 22 in order to carry a led chip (not shown), and its bottom surface is the surface of contact planar base portion 16; One is arranged at the diffuser 24 of base 22 tops and covering led chip, and it can allow led chip light penetrate; And several extend in the power pin 26 of base 22 sides.

One supports and to terminate in light-emitting diode (LED) module 12 lip-deep substrates 14, and it includes a circuit layout 30 that is arranged at substrate 14 bottom surfaces, and it is and 26 one-tenths electric connections of power pin, with supply led chip power source, as the power supply conducting structure; Substrate 14 surfaces are provided with several open-works 32 corresponding to diffuser 24, and bottom surface periphery is held in base 22 surfaces of light-emitting diode (LED) module 12 around the open-work of substrate 14; And several are with respect to the fixing hole 34 of aforementioned screw 20, passing fixing hole 34 to screw 20 by several screws 36, with substrate 14 lockings on planar base portion 16, make light-emitting diode (LED) module 12 firm be held on radiator structure 10 and substrate 14 between.

When the present invention establishes in group, can a thermal grease 38 be set, so that base 22 contact thermal greases 38 are beneficial to heat radiation in light-emitting diode (LED) module 12 and 16 of planar base portion.In addition, thermal grease 38 also can be filled up the space of 16 of base 22 and planar base portion, can come conduction heat sources by maximum area with the base 22 of guaranteeing light-emitting diode (LED) module 12.

When light-emitting diode (LED) module 12 of the present invention operates, the pattern of heat abstractor will be to be held on thermal energy transfer that the light-emitting diode (LED) module 12 of 14 of radiator structure 10 and substrates produced to base 22, at the planar base portion 16 that is passed to the next-door neighbour, radiating fin 18, to reach heat radiation fast, prevent that effectively heat from hoarding in light-emitting diode (LED) module 12, reach and improve luminous efficiency and assembly life-span.

Substrate 14 can be aluminium base or composite metal substrate, in order to do the pyrogen that light-emitting diode (LED) module 12 is sent, except being passed to the radiator structure, also can be by the metal endothermic character of substrate 14, absorb the heat of light-emitting diode (LED) module 12, more fast thermal source dissipation is gone out.

Please consult Fig. 4 again, it is the schematic perspective view of second kind of embodiment of the heat abstractor that is applied to light emitting diode of the present invention.The difference of this kind embodiment and above-mentioned first kind of embodiment is the change on the kenel of light-emitting diode (LED) module.This type of light-emitting diode (LED) module 40 is to include a base 42, base 42 is provided with four led chip (not shown), and be coated with a diffuser 44 on each led chip, base 42 surfaces are provided with several power supply contacts 48 that can electrically connect with the circuit layout (not shown) of substrate 46 bottom surfaces.And also respective leds module 40 size of making amendment and to allow several diffusers 44 appear simultaneously of the open-work 50 of substrate 14 for as shown in FIG..

Please consult Fig. 5 again, it is the schematic perspective view of the third embodiment of the heat abstractor that is applied to light emitting diode of the present invention.The difference of this kind embodiment and above-mentioned first kind of embodiment is the base of light-emitting diode (LED) module and the change on the power supply contact kenel.As shown in the figure, this base 52 more stretches out and forms a substrate 54, increasing the area that contact with planar base portion 16, and substrate 54 be provided with power supply contact 56 all around, with the circuit layout (not shown) electric connection of substrate 14 bottom surfaces.

In sum, the invention provides a kind of brand-new LED radiating device, it is to utilize radiator structure and substrate with the light-emitting diode (LED) module clamping, and light-emitting diode (LED) module is seen through be contacted with the lip-deep part of this planar base portion and directly the heat that is produced is gone out by planar base portion and fin dissipation.More person's substrate is made of metal material, to increase the approach of heat dissipation.In addition, the present invention more discloses and utilizes the circuit layout be arranged on the substrate bottom surface to be equipped with electrical pin on base, forms the power supply conducting structure of supplying with light-emitting diode (LED) module power.

The above is preferred embodiment of the present invention only, is not to be used for limiting scope of the invention process.So be that all equalizations of doing according to described feature of the present patent application scope and spirit change or modification, all should be included in the claim of the present invention.

Claims

1. heat abstractor that is applied to light emitting diode, it is characterized in that: it includes:

One radiator structure, it includes a planar base portion and a plurality of fin of being located at this planar base portion periphery, is to be provided with at least one light-emitting diode (LED) module on this planar base portion surface; And

One substrate, it is to be arranged on this light-emitting diode (LED) module, this light-emitting diode (LED) module is held between this radiator structure and this substrate;

Wherein, during this light-emitting diode (LED) module running, this light-emitting diode (LED) module is directly gone out the heat that is produced through being located at the lip-deep part of this planar base portion by this planar base portion and this fin dissipation.

2. according to 1 described heat abstractor that is applied to light emitting diode of claim the, it is characterized in that: wherein this substrate more includes an open-work in the position corresponding to this light-emitting diode (LED) module, so that the light of this light-emitting diode (LED) module irradiates, and be to be provided with a circuit layout on this substrate bottom surface, it is to electrically connect with this light-emitting diode (LED) module, to supply with this light-emitting diode (LED) module power resources.

3. according to 2 described heat abstractors that are applied to light emitting diode of claim the, it is characterized in that: wherein this light-emitting diode (LED) module includes:

At least one base, it is to fit on this planar base portion surface, this base is in order to carry a led chip;

At least one diffuser that is positioned on this base and covers this led chip, it is to manifest from this open-work;

And

Several are arranged at the electrical pin of this base, and it is to electrically connect with this circuit layout.

4. according to 3 described heat abstractors that are applied to light emitting diode of claim the, it is characterized in that: wherein this electrical pin is to be arranged at the side of this base or the surface of this base.

5. according to 3 described heat abstractors that are applied to light emitting diode of claim the, it is characterized in that: wherein more outside formation one substrate in the bottom of this base to contact with this planar base portion, increases heat-conducting area.

6. according to 1 described heat abstractor that is applied to light emitting diode of claim the, it is characterized in that: wherein more be provided with a thermal grease between the bottom surface of this light-emitting diode (LED) module and this planar base portion.

7. according to 1 described power supply conducting structure that is applied to the heat abstractor of light emitting diode of claim the, it is characterized in that: it includes:

One circuit layout, it is to be arranged on the bottom surface of this substrate; And

Several electrical pins, it is to be arranged on this base, this electrical pin is to form with this circuit layout to electrically connect.