M319605 八、新型說明： 【新型所屬之技術領域】 本創作係一種多層排列之發光二極體散熱結構，其係一種將發光二極體透 過多層排列之設計，而使發光二極體所產生之熱，可以分散方式迅速散發至外 界者。 【先前技術】 按，在日常生活上取$接觸之燈光光源有舊式燈泡、石英燈泡、日光燈泡 及水銀燈等，不同於前述之燈源，發光二極體係屬於冷發光，具有耗電量低、 元件壽命長、不需暖燈時間、反應速度快等優點，再加上其體積小、耐震動、 適合$產、容易配合應用上之需求製作成極小及陣列式元件，所以發光二極體 在寊訊、通訊及消費性產品之指示、顯示裝置上，已成為曰常生活上不可或缺 之重要元件，同樣地，以高亮度發光二極體為背光或照明之光源亦將愈來愈受 到重視。 但以高亮度發光二極體作為背光或照明用之光源，因轉換效率問題，使用 時會產生高熱，而持續之高熱對於電子元件會造成損害，且需作為高亮度背光 或照明器具時，則需集中多個發光二極體，因此所產生熱將會更高，為解決背 光或照明燈具之散熱問題，請參閱第1圖所示，其設有一散熱座1〇〇，該散熱座 ® 100—面上設有複數個排列整齊之散熱鰭片101，該等散熱鰭片1〇1與散熱座1〇〇 係呈垂直狀，且該散熱座100上並與散熱鰭片101相對之一面則貼設有一光源 •基板102，該光源基板102上設有多個發光二極體丨〇3，該等發光二極體1〇3分 別與光源基板102作電性連接，如此一來，雖可藉由光源基板1〇2與散熱座1〇〇 將發光二極體103所產生之熱加以排除，惟因發光二極體1〇3皆安裝在同一光 源基板102上’因此所產生之熱亦先集中在光源基板丨〇2，雖透過與光源基板 緊接觸之散熱座1〇〇將熱傳導至外界，但往往於光源基板1〇2上會發生熱滯 留現象’無法迅速將熱導散出去，而使背光或照明光源之發光光源過烫，同時， 藉由散熱座100與散熱鰭片101之設計方式，將使該燈具之體積及製作成本增 5 M319605 加，使用上非常不理想。 【新型内容】 創作綱要： 本創作之創作人有餅上狀缺點，目此糾雜麟所在，開始著手加 以謀求改善，補其所缺，以麟求—項合理解決之道，經過無數次之研析、設 計，終於完成本創作之多層排列之發光二極體散熱結構。 ' 本辦之-目的，在提供_種多獅狀發光二極體散熱結構，該裝置係 .為-種供作為背光或細用之發光二極體散熱之用，該裝置上設有-個以上具 散熱效果之中空m定散熱轉，該等@定散熱框架間分财置有-絲基板， φ該光源基板係由導熱材料製成，且該等光源基板上分別設有電流引線，而該等 光源基板上分別設有複數個一定排列之插孔及發光二極體，且任一層之光源基 板上之發光二極_與他層之發光二極體排列呈互相錯錄，如此-來，可藉 由該等疊置在-起之光源基板將電路及發光二極體分散配置，使其分布不在同 一平面上，而能達到迅速散熱之目的者。 本創作之次-目的，在提供一種多層排列之發《二極體散熱結構，其内層 之光源基板上之發光二極體上可分別設有與其相對應之導光柱，該等導光柱分 別穿過上層之光源基板，而凸露在最外層光源基板之表面上，如此一來，可將 _深藏在内層光源基板令之發光二極體，透過導光柱之導引，而將所發出之亮光， • 集中在最外層光源基板之表面上，而增加亮度與均勻發光。 本創作之另一目的，在提供一種多層排列之發光二極體散熱結構，其外層 之固定散熱框㈣邊上設有光學增光均光板，以加強均光或縣及亮度效果。 本創作之再一目的，在提供一種多層排列之發光二極體散熱結構，其光學 增光均光板上設有一體成型之導光柱，該等導光柱分別穿過内層之光源基板， 並與發光二極體接觸，如此一來，可將深藏在内層光源基板中之發光二極體， 透過導光柱之導引，而將所發出之亮光，集中在最外層光源基板之表面上。 【實施方式】 6 M319605 明參閱第2、3、4圖所示，其為本創作之第一種實施方式，本創作主要係 為-種供作為高亮度背光或照之發光二極體散熱之用，該裝置上設有一個 、上，、散熱效果之固定散熱框架1〇，該等固定散熱框架1〇中設有一開口 Η， 且該等固定散熱框架1〇之端邊分別設有相對之鎖孔12 (如第3圖所示），該等 鎖孔12中分別可穿套有一鎖合件13，於本實施例為一鎖桿，以令該等固定散熱 框架10可藉由穿套在鎖孔12巾之鎖合件13之鎖合，而疊置在一起。 . _ # ’該_定散熱_ 1G W分別夾置有-絲基板20，鮮光源基板20 係由導熱性佳之材㈣成，使該等光源基板20具錄熱效果，且該等光源 基板20上分別設有電流引線(圖中未示），而該等光源基板卻上分別設有複數 春個一疋排列之插孔21及發光二極體3〇，該等發光二極體3〇並透過電流引線與 驅動電路(®t未不)減接，且任_層光源基板2G上之發光二極體3()與其他 層上之發光二極體30之排列係呈互相錯位狀，如此一來，可藉由該等疊置在一 起光源基板20將發光二極體3〇分散配置，使其分布不在同一平面上，而能透 過不同平面之固定散熱框架10及光源基板2〇進行導熱及散熱，以達到迅速散 熱之目的者’晴’ _之絲基板20上之發光三極體3〇可透過上—層及最 外層之固定散熱框架1〇上之開口 n及光源基板2〇上之插孔21將光發出。 再者，該内層之光源基板20上之發光二極體30上分別可設有導光柱4〇， φ該等導光柱40並穿過上層光源基板20之插孔21及該等固定散熱框架1〇之開 口 11 ’而凸露在最外層之光源基板20表面上，如此一來，可將深藏在内層光源 •基板20中之發光二極體30，透過導光柱40之導引，而將所發出之亮光，集中 在最外層光源基板20之表面上，而增加亮度及發光面積(如第4圖所示）。 又，於相互疊置在一起之最外層固定散熱框架1〇周邊設有光學增光均光板 50，以使在光源基板2〇上之發光二極體3〇可藉由光學增光均光板如之作用， 均勻增加光源之亮度(如第2圖所示）。 4參照第5及第5a圖所示，其為本創作之又一種實施方式，本實施方式與 第一種實施方式之不同在於：該光學增光均光板5〇面對發光二極體3〇之一面 上設有複數個與之一體成型之導光柱40，該等導光柱40之另一端則分別穿套過 7 M319605 内層光源基板20之穿孔21而與發光二極體3〇接觸，如此一來，可將深藏在内 層光源，板2G中之發光二極體3〇’透過導紐4{)之導引，而將所發出之亮光， 集中在敢外層光源基板2〇之表面上，而增加亮度及發光面積。 綜上所述，本創作在物品、形狀、構造、裝置上屬首先創作，且可改良習 用技術之各魏點’在上能增進功效，合於實用，紐符合難專利 實為一理想之創作。 【圖式簡單說明】 第1圖··為習知技術之立體示意圖。 第2圖：為本創作之立體示意圖。 第3圖：為本創作之立體分解示意圖。 第4圖：為本創作之斷面組合示意圖。 第5圖：為本創作又一實施例之立體分解示意圖。 第5a圖：為第5圖A-A之導光柱一體成型之部分斷面示意圖。 【主要元件符號說明】 固定散熱框架 10 開口 11 鎖孔 12 鎖合件 13 光源基板 20 插孔 21 發光二極體 30 導光柱 40 光學增光均光板 50M319605 VIII. New Description: [New Technology Field] This creation is a multi-layered light-emitting diode heat-dissipating structure, which is a kind of design that transmits the LEDs through multiple layers, so that the LEDs are produced. Heat can be quickly distributed to outsiders in a decentralized manner. [Prior Art] Press, the light source for the contact in daily life is old bulb, quartz bulb, daylight bulb and mercury lamp. Unlike the above-mentioned lamp source, the light-emitting diode system is cold-emitting and has low power consumption. Long life of components, no need for warm-up time, fast response, etc., plus its small size, vibration resistance, suitable for production, easy to match the needs of the application to make very small and array components, so the LED is The indications and display devices of the news, communication and consumer products have become an indispensable important component in the daily life. Similarly, the light source with high-brightness light-emitting diodes as backlight or illumination will be more and more subject to Pay attention to it. However, high-brightness light-emitting diodes are used as backlights or light sources for illumination. Due to conversion efficiency problems, high heat is generated during use, and continuous high heat causes damage to electronic components, and when used as a high-brightness backlight or lighting fixture, It is necessary to concentrate a plurality of light-emitting diodes, so the heat generated will be higher. To solve the heat dissipation problem of the backlight or the lighting fixture, please refer to FIG. 1 , which has a heat sink 1 〇〇, the heat sink ® 100 A plurality of heat-dissipating fins 101 are arranged on the surface, and the heat-dissipating fins 1〇1 are perpendicular to the heat-dissipating block 1 and the heat-dissipating block 100 is opposite to the heat-dissipating fins 101. A light source substrate 102 is disposed, and the light source substrate 102 is provided with a plurality of light emitting diodes 丨〇3, and the light emitting diodes 〇3 are electrically connected to the light source substrate 102, respectively. The heat generated by the light-emitting diode 103 is removed by the light source substrate 1〇2 and the heat sink 1〇〇, but since the light-emitting diodes 1〇3 are all mounted on the same light source substrate 102, the heat generated is also generated. Focus on the light source substrate 丨〇2 first, though The heat sink 1 in close contact with the light source substrate conducts heat to the outside, but heat stagnation occurs on the light source substrate 1 ' 2 'the heat can not be quickly dissipated, and the light source of the backlight or the illumination source is too hot. At the same time, the design of the heat sink 100 and the heat sink fins 101 will increase the volume and manufacturing cost of the lamp by 5 M319605, which is very unsatisfactory in use. [New Content] Outline of Creation: The creator of this creation has the shortcomings of the cake, and the purpose of this is to find the way to improve, to make up for the lack of it, to solve the problem with the principle of rationality, after countless times. Research and design, and finally completed the multi-layer arrangement of the light-emitting diode cooling structure of the creation. 'This is the purpose of providing _ kinds of lion-like light-emitting diode heat-dissipating structure. This device is used for backlighting or fine-graining LEDs for heat dissipation. The above-mentioned hollow heat-dissipating heat-dissipating effect is arranged, and the light-emitting substrate is made of a heat-conducting material, and the light-source substrates are respectively provided with current leads, and Each of the light source substrates is respectively provided with a plurality of fixed-arranged jacks and light-emitting diodes, and the light-emitting diodes on the light source substrate of any layer are arranged in a wrong manner with the light-emitting diodes of the other layers, so that The circuit and the light-emitting diodes can be dispersedly arranged by the stacked light source substrates so that the distribution is not on the same plane, and the purpose of rapid heat dissipation can be achieved. The second purpose of the present invention is to provide a multilayer heat-dissipating structure in which a light-emitting diode on an inner layer of a light-emitting diode can be respectively provided with a corresponding light guiding column, and the light guiding columns are respectively worn. Passing through the upper light source substrate and protruding on the surface of the outermost light source substrate, so that the inner light source substrate can be immersed in the inner light source substrate to guide the light emitting diode through the light guiding column, and the emitted light is emitted. Bright, • Focus on the surface of the outermost light source substrate to increase brightness and uniform illumination. Another object of the present invention is to provide a multi-layered light-emitting diode heat-dissipating structure, and an optically-enhanced light-homogenizing plate is arranged on the outer fixed heat-dissipating frame (4) to enhance the uniform light or the county and the brightness effect. A further object of the present invention is to provide a multi-layered light-emitting diode heat-dissipating structure, wherein an optically-enhanced homogenizing plate is provided with an integrally formed light guiding column, and the light guiding columns respectively pass through the inner light source substrate, and the light emitting two The polar body contacts, so that the light-emitting diodes hidden in the inner light source substrate can be guided through the light guide column, and the emitted light is concentrated on the surface of the outermost light source substrate. [Embodiment] 6 M319605 As shown in Figures 2, 3 and 4, which is the first embodiment of the creation, this creation is mainly for the purpose of providing high-brightness backlight or illumination for the light-emitting diode. The device is provided with a fixed heat dissipation frame 1 上, an upper heat dissipation frame, and an opening Η is arranged in the fixed heat dissipation frame 1 , and the opposite ends of the fixed heat dissipation frame 1 设有 are respectively provided with relative locks The holes 12 (as shown in FIG. 3 ) are respectively sleeved with a locking member 13 , which is a locking rod in the embodiment, so that the fixed heat dissipation frame 10 can be worn over the sleeve. The locking holes 13 of the locking holes 12 are locked and stacked together. _# 'The _ fixed heat dissipation _ 1G W respectively has a wire substrate 20 interposed therebetween, and the fresh light source substrate 20 is made of a material having good thermal conductivity (4), so that the light source substrates 20 have a heat recording effect, and the light source substrates 20 The current leads are respectively provided with current leads (not shown), and the light source substrates are respectively provided with a plurality of jacks 21 arranged in a spring and a light emitting diode 3, and the light emitting diodes are passed through The current lead is deducted from the driving circuit (not including), and the arrangement of the light-emitting diodes 3 on the layer substrate 2G and the light-emitting diodes 30 on the other layers are mutually misaligned. The light-emitting diodes 3 can be dispersed and disposed on the light source substrate 20 so as to be distributed on the same plane, and can be transmitted through the fixed heat dissipation frame 10 and the light source substrate 2 of different planes. The heat-dissipating heat sink is used for the purpose of rapid heat dissipation. The light-emitting diode 3 on the substrate 20 can pass through the opening n of the upper and lower layers of the fixed heat-dissipating frame 1 and the light source substrate 2 The jack 21 emits light. Furthermore, the light-emitting diodes 30 on the light source substrate 20 of the inner layer may respectively be provided with light guiding columns 4, φ, the light guiding columns 40 and the insertion holes 21 of the upper light source substrate 20 and the fixed heat dissipation frames 1 The opening 11' of the crucible is exposed on the surface of the outermost light source substrate 20, so that the light-emitting diode 30 hidden in the inner-layer light source substrate 20 can be guided through the light guiding column 40. The emitted light is concentrated on the surface of the outermost light source substrate 20 to increase the brightness and the light emitting area (as shown in Fig. 4). Moreover, an optically-enhanced light-homogenizing plate 50 is disposed around the outermost surface of the heat-dissipating heat-dissipating frame 1 so as to be overlapped with each other, so that the light-emitting diodes 3 on the light-emitting substrate 2 can be acted upon by the optically-enhanced light-homogenizing plate. , evenly increase the brightness of the light source (as shown in Figure 2). 4, which is shown in the fifth and fifth embodiments, which is another embodiment of the present invention. The difference between the present embodiment and the first embodiment is that the optically-enhanced light-homogenizing plate 5 〇 faces the light-emitting diode 3 A plurality of light guide columns 40 are formed on one side, and the other ends of the light guide columns 40 are respectively passed through the through holes 21 of the inner light source substrate 20 of the 7 M319605 to be in contact with the light emitting diodes 3, thus The light source can be hidden in the inner layer light source, and the light-emitting diode 3' in the plate 2G is guided through the guide button 4{), and the emitted light is concentrated on the surface of the outer light source substrate 2〇. Increase brightness and light area. In summary, this creation is the first creation in the article, shape, structure, and device, and can improve the various techniques of the conventional technology. It can enhance the effect on the top, and it is practical, and the New Zealand meets the difficult patent. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a conventional technique. Figure 2: A three-dimensional diagram of the creation. Figure 3: A three-dimensional exploded view of the creation. Figure 4: Schematic diagram of the cross-section of the creation. Fig. 5 is a perspective exploded view showing still another embodiment of the present invention. Fig. 5a is a partial cross-sectional view showing the light guide column of Fig. 5A-A integrally formed. [Description of main component symbols] Fixed heat dissipation frame 10 Opening 11 Keyhole 12 Locking member 13 Light source substrate 20 Jack 21 Light-emitting diode 30 Light guide 40 Optically brightened light plate 50