CN210604469U - Experimental device for measuring heat conductivity coefficient of poor conductor by steady state method - Google Patents
Experimental device for measuring heat conductivity coefficient of poor conductor by steady state method Download PDFInfo
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- CN210604469U CN210604469U CN201921103538.XU CN201921103538U CN210604469U CN 210604469 U CN210604469 U CN 210604469U CN 201921103538 U CN201921103538 U CN 201921103538U CN 210604469 U CN210604469 U CN 210604469U
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Abstract
The utility model provides a steady state method measures bad conductor coefficient of heat conductivity experimental apparatus relates to coefficient of heat conductivity measuring technical field, include: a heating and radiating device, a temperature collector and a computer; the heating and radiating device comprises a heating disc and a radiating disc; the heating plate comprises a first temperature sensor; the heat dissipation plate comprises a second temperature sensor; the temperature collector is connected with the computer. The utility model discloses utilize the computer to calculate the data that temperature collector gathered, reduced the influence of human factor to the coefficient of heat conductivity measurement result, simultaneously the utility model provides a device is furnished with thermal current sensor and voltmeter, has simplified the experiment flow, has all covered the heat conduction material simultaneously at thermal current sensor's upper surface and thermal current sensor's lower surface to it has the calorific loss of thermal insulation material in order to reduce the experimentation to cover in the sample side that awaits measuring, has improved the accuracy of coefficient of heat conduction result.
Description
Technical Field
The utility model belongs to the technical field of the thermal conductivity measurement technique and specifically relates to a steady state method is measured bad conductor thermal conductivity experimental apparatus is related to.
Background
The thermal conductivity is a basic physical property parameter of the material, and the measurement of the thermal conductivity of the material is an important content in the physical and thermal experiments of universities. Experimental device for measuring heat conductivity of poor conductor by steady state method is applied to college physics teaching, and the experimental process for measuring heat conductivity of poor conductor is as follows: and manually recording the temperatures of the upper surface and the lower surface of the sample in a steady state and the temperature change of the heat dissipation disc in natural cooling respectively, and drawing by using coordinate paper to solve the cooling rate. Although the experiment has important significance in the aspect of recording and processing data by tools such as stopwatches, coordinate paper, calculators and the like for students, the heat transfer of the side surface of the conductor is ignored, and the data recording and the calculation are both carried out manually, so that the result obtained by the experiment has larger dispersity and cannot be used for scientific research. With the development of information technology, modern instruments for measuring the thermal conductivity adopt computers to collect and process corresponding experimental data without exception, and standards such as ASTM D5470 and ASTM E1530 according to which the mainstream thermal conductivity test instrument is based also introduce a heat flow sensor, so that the test process is changed from three stages into one stage, the test time is shortened, the test flow is simplified, and the test precision is improved. It can be seen that the experimental device for measuring the heat conductivity coefficient of the poor conductor by the original steady state method is seriously disconnected from the device actually adopted by engineering, the original experimental device is used for manually recording the temperature in order to improve the operational capability of students, the intelligent degree is low, and meanwhile, the measured result is greatly influenced by people and cannot be used for scientific research.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing a steady state method measures bad conductor coefficient of heat conductivity experimental apparatus based on computer data acquisition handles to strengthen current steady state method and measure bad conductor coefficient of heat conductivity device and engineering actual contact, reduce the intelligent degree of current device simultaneously and hang down, the result of surveying receives artificial influence great, can't be used for scientific research's technical problem.
The embodiment of the utility model provides a steady state method measurement nonconductor coefficient of heat conductivity experimental apparatus, include: a heat conductivity coefficient heating and radiating device, a temperature collector and a computer;
the heat conductivity coefficient heating and radiating device comprises a radiating disc and a heating disc;
the upper surface of the sample to be detected is contacted with the heating plate;
the lower surface of the sample to be detected is contacted with the heat dissipation disc;
the heating plate comprises a first temperature sensor which is used for measuring the upper surface temperature theta of the sample to be measured1Transmitting to the temperature collector;
specifically, the first temperature sensor is a first thermocouple, the first thermocouple is connected to the temperature collector, and the first thermocouple is used for measuring the upper surface temperature θ of the sample to be measured1；
The heat dissipation plate comprises a second temperature sensor which is used for measuring the lower surface temperature theta of the sample to be measured2Transmitting to the temperature collector;
specifically, the second temperature sensor is a second thermocouple, the second thermocouple is connected to the temperature collector, and the second thermocouple is used for measuring the lower surface temperature θ of the sample to be measured2；
The temperature collector is connected with the computer.
In the embodiment provided by the present invention, preferably, the sample to be measured is covered with a heat insulating material;
specifically, the heat insulating material covers the side surface of the sample to be measured (except the upper surface of the sample to be measured and the lower surface of the sample to be measured), and the heat insulating material may be any material having heat insulating property, such as asbestos, ceramic, glass fiber, nano aerogel felt and the like;
in practical operation, an experimenter may coat the side surface of the sample to be measured with a heat insulating material in advance, and place the sample to be measured coated with the heat insulating material between the heating plate and the heat dissipating plate.
The embodiment of the utility model provides a steady state method surveys bad conductor coefficient of heat conductivity experimental apparatus, still includes heat flux sensor and voltmeter;
the heat flow sensor is connected with the voltmeter, and the voltmeter is used for measuring the voltage at two ends of the heat flow sensor;
the heat flow sensor and the voltmeter are used for measuring the axial heat flow density of the sample to be measured.
In order to realize the installation of the heat flow sensor, one surface of the heat dissipation plate, which is close to the sample to be tested, is provided with a groove;
in order to realize the sufficient thermal contact between the heat flow sensor and a sample to be measured and the heat dissipation plate, the upper surface of the heat flow sensor and the lower surface of the heat flow sensor are both coated with heat conduction materials;
specifically, the heat conductive material is heat conductive silicone grease.
The embodiment of the utility model provides a following beneficial effect has been brought: the utility model provides a steady state method measures bad conductor coefficient of heat conductivity experimental apparatus, include: a heat conductivity coefficient heating and radiating device, a temperature collector and a computer; the heat conductivity coefficient measuring device comprises a heat dissipation disc and a heating disc; the heating plate comprises a first temperature sensor which is used for measuring the upper surface temperature theta of a sample to be measured1Transmitting the data to a temperature collector; the heat dissipation plate comprises a second temperature sensor which is used for measuring the lower surface temperature theta of the sample to be measured2Transmitting the data to a temperature collector; the temperature collector is connected with the computer. The utility model discloses utilize the computer to calculate the data that temperature collector gathered, reduced the influence of human factor to the coefficient of heat conductivity result, be furnished with thermal current sensor and voltmeter simultaneously, simplified the experiment flow, it has the heat conduction material all to cover at thermal current sensor's upper surface and thermal current sensor's lower surface simultaneously to cover the thermal insulation material in order to reduce the calorific loss in the experimentation in the sample side of awaiting measuring, improved the accuracy of coefficient of heat conductivity result.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view of a thermal conductivity measuring apparatus according to an embodiment of the present invention;
fig. 2 is a rear view of a thermal conductivity measuring apparatus according to an embodiment of the present invention;
fig. 3 is an experimental apparatus for measuring the thermal conductivity of a poor conductor by a steady state method according to an embodiment of the present invention;
fig. 4 is another experimental apparatus for measuring the thermal conductivity of a poor conductor by a steady-state method provided by the embodiment of the present invention.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
At present, based on this, the embodiment of the utility model provides a pair of steady state method measurement nonconductor coefficient of heat conductivity experimental apparatus can strengthen the steady state method survey nonconductor coefficient of heat conductivity experimental apparatus and the actual contact of engineering among the prior art, reduces simultaneously among the prior art steady state method survey nonconductor coefficient of heat conductivity experimental apparatus and carry out artifical record to the temperature in order to improve student's operational capability and lead to the intelligent degree of device low, the result of surveying is influenced by the people great, can't be used for scientific research's technical problem.
For understanding this embodiment, first, the experimental apparatus for measuring the thermal conductivity of a poor conductor by a steady state method disclosed in the embodiments of the present invention is described in detail.
The first embodiment is as follows:
combine fig. 1, fig. 2 and fig. 3, the embodiment of the utility model provides a steady state method measures bad conductor coefficient of heat conductivity experimental apparatus, include: a heat conductivity coefficient heating and radiating device, a temperature collector 2 and a computer 3;
the heat conductivity coefficient heating and radiating device comprises a heating disc 4 and a radiating disc 5;
the upper surface of the sample to be measured is contacted with the heating plate 4;
the lower surface of the sample to be measured is contacted with the heat dissipation disc 5;
specifically, in the embodiment provided by the utility model, in order to make the heating plate 4 heat the above-mentioned sample to be measured, above-mentioned thermal conductivity measuring device 1 is furnished with resistance heating wire, in order to reduce the calorific loss of test process simultaneously, above-mentioned thermal conductivity measures the top and is furnished with the heat exchanger, is furnished with two display screens in above-mentioned thermal conductivity measuring device bottom, can show that the temperature to heating plate 4 and radiating plate 5 carries out real-time display;
the heating plate 4 includes a first temperature sensor for measuring the upper surface temperature θ of the sample to be measured1Transmitting to the temperature collector 2;
specifically, the first temperature sensor is a first thermocouple, the first thermocouple is connected to the temperature collector 2, and the first thermocouple is used for measuring the upper surface temperature θ of the sample to be measured1；
The heat dissipation plate comprises a second temperature sensor which is used for measuring the lower surface temperature theta of the sample to be measured2Transmitting to the temperature collector 2;
specifically, the second temperature sensor is a second thermocouple, the second thermocouple is connected to the temperature collector 2, and the second thermocouple is used for measuringMeasuring the lower surface temperature theta of the sample to be measured2；
Further, in the embodiment provided by the utility model, above-mentioned first thermocouple, second thermocouple are K type thermocouple, because the temperature value that K type thermocouple measured among the prior art presents with the voltage value, consequently in this use novel embodiment that provides, the temperature collection ware of looks adaptation is OM-DAQ-USB-2401 thermocouple/voltage data collection ware that OMEGA company produced, and above-mentioned temperature collection ware links to each other with above-mentioned computer.
It should be noted that the temperature collector is used for measuring the upper surface temperature theta of the sample to be measured1And the lower surface temperature theta of the sample to be measured2To the computer 3;
the temperature △ Q of the lower surface of the sample to be measured passing through the heat of the sample to be measured during △ t can be calculated by the following formula:
θ1-the temperature of the upper surface of the sample to be measured;
θ2-the temperature of the lower surface of the sample to be measured;
lambda is the thermal conductivity of the sample to be measured;
Sbottom-area of the bottom surface of the sample to be measured.
During the experiment, the upper surface temperature theta of the sample to be measured is recorded when the steady state is reached1And the lower surface temperature theta of the sample to be measured2Then the sample to be measured is drawn out, the heating plate is contacted with the heat dissipation plate, and when the temperature of the heat dissipation plate rises to be higher than theta2After a certain value is reached, the heating plate is removed, the heat dissipation plate is cooled under the action of the fan, the temperature of the heat dissipation plate is recorded to be reduced along with the time, and the theta of the heat dissipation plate is obtained2Rate of time cooling
Known from physical knowledge:
m-mass of the heat dissipation plate;
c, specific heat capacity of the heat dissipation plate;
the upper surface of the heat dissipation disc is not exposed to air in a steady state, and the cooling rate of an object is proportional to the heat dissipation area of the object, which can be known from physical knowledge:
is obtained by the formula (1) to the formula (3):
Rp-radius of the heat sink disc;
hp-the thickness of the heat sink plate;
dB-the diameter of the sample to be measured;
hB-the thickness of the sample to be tested;
the computer 3 can store and read the temperature data collected by the temperature collector, and then the collected temperature data is processed by using Origin software or Matlab, C language, R language and the like to obtain the heat conductivity coefficient. Therefore, the measurement error caused by manually recording the temperature change is reduced, meanwhile, the experimental data is processed by adopting computer software or programming language, and the lower surface temperature theta of the sample to be measured is calculated by utilizing the software compared with the traditional method2Two points are taken nearby to calculate the cooling rate or a mirror rule method is used for drawing a curve on the lower surface temperature theta of the sample to be measured2The point tangent line and thus the cooling rate calculated from the slope of the tangent line can greatly improve the data processing accuracy.
Example two:
it should be noted that, in other embodiments of the present invention, as shown in fig. 4, in order to simplify the experimental process of the thermal conductivity, assuming that the electric energy is completely converted into the heat energy, the output power P of the hot-end power supply may be considered to be equal to the heat dissipation rate of the heat dissipation plate;
formula (1) can thus be converted into:
therefore, to obtain the heat flux density
The device provided by the embodiment of the utility model also comprises a heat flow sensor (in a groove 301 in the figure) and a voltmeter 302;
the heat flow sensor is connected to the voltmeter 302, and the voltmeter 302 is used for measuring the voltage across the heat flow sensor;
the heat flow density calculation formula is as follows:
the compound represented by formula (6) may be substituted for formula (5):
v-dc voltage of the heat flow sensor;
s-sensitivity of heat flow sensor;
further, the heat flow sensor is XM269C by greenTEG, and the voltmeter is a multimeter having a model number Keysight 34461A.
In order to realize the installation of the heat flow sensor, a groove 301 is formed in one surface, close to the sample to be detected, of the heat dissipation plate;
specifically, the heat flow sensor should be in close contact with the sample to be measured, and the pressing force is preferably in the range of 10N to 100N to ensure good thermal contact; the excessive pressing force can cause the heat flow sensor to deform so as to generate additional voltage, and the insufficient pressing force can cause the heat flow sensor not to be in close contact with a sample to be detected so as to generate heat loss.
The introduction of the heat flow sensor can cause the original heat transfer path to change to a certain extent, so that in order to ensure that the heat transfer paths are basically consistent when the heat flow sensor is introduced and the heat flow sensor is not introduced and to realize the full thermal contact of the heat flow sensor, a sample to be detected and a heat dissipation plate, the upper surface of the heat flow sensor and the lower surface of the heat flow sensor are both covered with heat conduction materials;
specifically, the heat conductive material is heat conductive silicone grease.
In the embodiment provided by the present invention, in order to reduce the heat loss of the sample to be measured in the measurement process, preferably, the sample to be measured is covered with a heat insulating material;
specifically, the heat insulating material is coated on the side surface of the sample to be measured (except the upper surface of the sample to be measured and the lower surface of the sample to be measured), and the heat insulating material can be any material with heat insulating performance, such as asbestos, ceramic, glass fiber, nano aerogel felt and the like;
in practice, the sample to be measured may be coated with a heat insulating material on its side surface, and the sample to be measured coated with the heat insulating material may be placed between the heating plate and the heat dissipating plate.
The utility model provides a device uses, only needs to place the above-mentioned sample that awaits measuring in the middle of above-mentioned heating plate and above-mentioned heat dissipation dish, can realize measuring the coefficient of heat conductivity of the above-mentioned sample that awaits measuring.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the described system and apparatus may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In addition, in the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the terms in the present invention can be understood in a specific case to those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the technical solution of the present invention, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: those skilled in the art can still modify or easily conceive of changes in the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (7)
1. The utility model provides a bad conductor coefficient of heat conductivity experimental apparatus is surveyed to steady state method which characterized in that includes: a heat conductivity coefficient heating and radiating device, a temperature collector and a computer;
the heat conductivity coefficient heating and radiating device comprises a heating disc and a radiating disc;
the upper surface of the sample to be detected is contacted with the heating plate;
the lower surface of the sample to be detected is contacted with the heat dissipation disc;
the heating plate includes a first temperature sensorA first temperature sensor for measuring the temperature theta of the upper surface of the sample1Transmitting the temperature data to the temperature collector;
the heat dissipation plate comprises a second temperature sensor, and the second temperature sensor is used for measuring the lower surface temperature theta of the sample to be measured2Transmitting the temperature data to the temperature collector;
the temperature collector is connected with the computer.
2. The apparatus according to claim 1, wherein the sample to be tested is coated on its side with a heat insulating material.
3. The device of claim 1, wherein the first temperature sensor is a first thermocouple connected to the temperature collector, and the first thermocouple is configured to measure an upper surface temperature θ of the sample to be measured1。
4. The device of claim 1, wherein the second temperature sensor is a second thermocouple, the second thermocouple is connected with the temperature collector, and the second thermocouple is used for measuring the temperature θ of the lower surface of the sample to be measured2。
5. The apparatus of claim 1, further comprising a heat flow sensor and a voltmeter;
the heat flow sensor is connected with the voltmeter, and the voltmeter is used for measuring the voltage of the heat flow sensor;
the heat flow sensor and the voltmeter are used for measuring the axial heat flow density of the sample to be measured.
6. The apparatus of claim 5, wherein a surface of the heat dissipation plate adjacent to the sample is provided with a groove for mounting the heat flow sensor.
7. The apparatus of claim 5, wherein an upper surface of the heat flow sensor and a lower surface of the heat flow sensor are coated with a thermally conductive material.
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| CN201921103538.XU CN210604469U (en) | 2019-07-15 | 2019-07-15 | Experimental device for measuring heat conductivity coefficient of poor conductor by steady state method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114113203A (en) * | 2021-11-05 | 2022-03-01 | 同济大学 | Material thermal conductivity testing method and device convenient to operate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114113203A (en) * | 2021-11-05 | 2022-03-01 | 同济大学 | Material thermal conductivity testing method and device convenient to operate |
| CN114113203B (en) * | 2021-11-05 | 2023-08-29 | 同济大学 | Method and device for testing thermal conductivity of material convenient to operate |
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