CN113740628A - Aging test equipment and heating assembly thereof - Google Patents
Aging test equipment and heating assembly thereof Download PDFInfo
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- CN113740628A CN113740628A CN202010469524.0A CN202010469524A CN113740628A CN 113740628 A CN113740628 A CN 113740628A CN 202010469524 A CN202010469524 A CN 202010469524A CN 113740628 A CN113740628 A CN 113740628A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
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Abstract
The invention discloses an aging test device and a heating assembly thereof, wherein the heating assembly comprises a control board, a heating element and a heat transfer element, and a control circuit is arranged on the control board; the heating piece is electrically connected with the control board and is used for heating under the control of the control board; the heat transfer member is in contact with the heating member and can conduct heat with the heating member, and the heat transfer member is used for being in contact with the chip to be tested so as to heat the chip to be tested. Can carry out heat-conducting heat transfer piece with the piece that generates heat through the setting, can use the chip that awaits measuring of heat transfer piece butt to heat the chip that awaits measuring, compare in current high temperature aging testing equipment, heating element in this application can be fine with current normal atmospheric temperature test with base compatible, so, can practice thrift the cost, and can practice thrift the space, also can promote the detection efficiency of the chip that awaits measuring simultaneously, and the heat direct action of the piece that generates heat in this application awaits measuring the chip, thermal high-usage, and the required power of the piece that generates heat is less, can greatly must save the detection cost.
Description
Technical Field
The invention relates to the technical field of high and low temperature aging tests, in particular to an aging test device and a heating assembly thereof.
Background
Electronic products, whether original paper, parts, complete machines and equipment need to be aged and tested. After the electronic product is manufactured, a complete product is formed, and the electronic product can already exert use value, but the electronic product can have faults after being used. According to the statistical result, the distribution of the faults in the life cycle of the electronic product can be represented by a bathtub curve, namely, the faults of the electronic product mostly appear in a period of initial work. Burn-in testing is an important means of accelerating electronic products over this period of time. The principle of the method is that a certain overstress (high temperature or high voltage) is applied to an electronic product, so that some early faults of an integrated circuit in the electronic product, such as electron migration, hot carrier degradation, oxide layer weak points and the like, can be shown as soon as possible, and effective screening of the product is achieved.
At present, the aging detection of electronic products mainly has two types: the first method is that partial components are additionally arranged in a constant temperature box to realize heating, an electronic product and a test seat are synchronously placed in the constant temperature box to be heated, and the test is carried out in the heating process, so that a cabinet and heating power are required to be larger; the heat transfer time of the constant temperature box is too long, the test time is also invisibly prolonged, the heat loss of the constant temperature box is too large, the heat transfer efficiency is not high, and the power consumption is larger; the external environment temperature of the constant temperature box can be synchronously raised, the environment of the whole workshop is influenced, and the working environment of workers is influenced. The second method is that a high-temperature aging box is customized, a circuit board for testing is customized, and the electronic product is tested while being heated, so that the customization cost is high, the detection period is long, and the maintenance cost is high after the customized high-temperature aging box is damaged, and the customized high-temperature aging box can only be scrapped generally; the normal temperature test and the high temperature test of the customized high temperature aging box can only be distinguished for use, and the automatic introduction is difficult.
Disclosure of Invention
The invention provides an aging test device and a heating assembly thereof, aiming at solving the technical problems of low heat utilization rate and high detection cost of the aging test device.
In order to solve the technical problems, the invention adopts a technical scheme that: providing a heating assembly, the heating assembly comprising: the control panel is provided with a control circuit; the heating piece is electrically connected with the control board and is used for heating under the control of the control board; and the heat transfer piece is in contact with the heating piece and can conduct heat with the heating piece, and the heat transfer piece is used for being in contact with the chip to be tested so as to heat the chip to be tested.
According to a specific embodiment of the present invention, the heating member includes a heating chip, a heating plate and a heating ceramic plate, the heating chip is electrically connected to the control circuit, the heating plate is provided with a heating circuit, the heating circuit electrically connects the heating chip and the heating ceramic plate, the heating chip is used for controlling the heating ceramic plate to generate heat under the action of the control circuit, and the heating ceramic plate is disposed on one side of the heating plate facing the heat transfer member, contacts with the heat transfer member and can conduct heat with the heat transfer member.
According to a specific embodiment of the present invention, a containing groove is disposed on a surface of the heat transfer member facing the heating ceramic sheet, the heat transfer member is connected to the heating plate, and the heating ceramic sheet is contained in the containing groove.
According to an embodiment of the present invention, a surface of the heat transfer element, on which the accommodating groove is formed, abuts against the heating plate, and at least a portion of a sidewall of the heating ceramic sheet abuts against at least a portion of an inner wall of the accommodating groove.
According to a specific embodiment of the present invention, the heating assembly further includes a temperature sensor, the control board is electrically connected to the temperature sensor, the temperature sensor is configured to detect the temperature of the heating ceramic sheet and feed the temperature back to the control board, the control board is provided with a display panel, and the display panel is electrically connected to the control circuit and configured to display the temperature of the heating element.
According to a specific embodiment of the present invention, the heating assembly includes a heat insulation cover, and at least a portion of the heat insulation cover is sandwiched between the heat generating member and the control board.
According to an embodiment of the present invention, the heat insulation cover includes a main body plate and a surrounding plate, the surrounding plate is disposed on a surface of the main body plate facing the heat generating element and surrounds the main body plate to form a mounting groove, the heat generating element is disposed in the mounting groove and connected to the main body plate, and the control board is disposed on a side of the main body plate facing away from the heat generating element and spaced from the main body plate.
According to a specific embodiment of the present invention, an avoiding notch is formed in the surrounding plate, the heating assembly further includes a first connector, the first connector is disposed in the avoiding notch, one end of the first connector is connected to the control board and electrically connected to the control circuit, and the other end of the first connector is connected to the heating plate and electrically connected to the heating chip.
According to an embodiment of the present invention, a carrying portion is disposed on a side of the main body plate away from the heat generating element, the carrying portion is disposed on the other opposite side of the main body plate relative to the first connector, and opposite ends of the control board are respectively bridged to the carrying portion and the first connector.
According to a specific embodiment of the present invention, a supporting pillar is disposed on a side of the main body board away from the heat generating element, the heating assembly further includes a main board and a second connector, the main board is fixed to a terminal of the supporting pillar away from the main body board, and the second connector is sandwiched between the main board and the control board and is electrically connected to the main board and the control board, respectively.
According to a specific embodiment of the present invention, the heating assembly includes a buffer pad connected to the heat transfer member for abutting against a surface of the chip to be tested.
According to a specific embodiment of the present invention, the heat transfer element has a heating surface for contacting the chip to be tested and a side surface adjacent to the heating surface, the side surface is disposed obliquely with respect to the heating surface, and an included angle between the side surface and the heating surface is greater than 90 degrees.
In order to solve the technical problem, the invention adopts another technical scheme that: the utility model provides an aging testing equipment, aging testing equipment includes the base and as before heating element, be equipped with the test chamber on the base, the test chamber is used for the holding chip that awaits measuring, heating element is used for to locating in the test chamber the chip that awaits measuring heats.
The invention has the beneficial effects that: different from the situation of the prior art, the heating element electrically connected with the control board is arranged, so that the heating element can be controlled to heat up, cool down and preserve heat by utilizing the control board, the control process is more convenient, and the heat transfer element capable of conducting heat with the heating element is arranged, the heat transfer element can be abutted to the chip to be tested to heat the chip to be tested.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic perspective view of a burn-in test apparatus according to an embodiment of the present invention;
FIG. 2 is an exploded view of the burn-in apparatus of FIG. 1;
FIG. 3 is a schematic cross-sectional view of the burn-in apparatus of FIG. 1;
fig. 4 is a perspective view of the thermal cover of fig. 2.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first", "second" and "third" in the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 1 to 3, fig. 1 is a schematic perspective view of a burn-in test apparatus according to an embodiment of the present invention, fig. 2 is a schematic exploded view of the burn-in test apparatus in fig. 1, and fig. 3 is a schematic cross-sectional view of the burn-in test apparatus in fig. 1. The invention provides an aging test device 100, wherein the aging test device 100 comprises a base 10 and a heating component 20, a test cavity 12 is arranged on the base 10, the test cavity 12 is used for accommodating a chip to be tested, and the heating component 20 is used for heating the chip to be tested arranged in the test cavity 12.
As shown in fig. 2 and 3, the heating assembly 20 includes a control plate 21, a heat generating member 22, and a heat transfer member 23. The control panel 21 is provided with a control circuit; the heating element 22 is electrically connected with the control board 21, and the heating element 22 is used for heating under the control of the control board 21; the heat transfer member 23 is in contact with the heat generating member 22 and is capable of conducting heat with the heat generating member 22, and the heat transfer member 23 is used for contacting with a chip to be tested to heat the chip to be tested.
The embodiment of the invention can utilize the control panel 21 to control the heating, cooling and heat preservation processes of the heating 22 by arranging the heating 22 electrically connected with the control panel 21, the control process is more convenient, and the heat transfer member 23 capable of conducting heat with the heating 22 is arranged, the heat transfer member 23 can be abutted against the chip to be tested to heat the chip to be tested, compared with the existing high-temperature aging test equipment 100, the heating assembly 20 in the application can be well compatible with the existing base 10 for normal-temperature test, so the cost can be saved, the space can be saved, the detection efficiency of the chip to be tested can be improved, the heat of the heating 22 in the application directly acts on the chip to be tested, the utilization rate of the heat is high, the power required by the heating 22 is smaller, and the detection cost can be greatly saved.
The heat transfer member 23 can be in direct contact with the heat generating member 22 or in indirect contact with the heat generating member 22 through a heat conducting member, as long as the heat on the heat generating member 22 can be transferred to the heat transfer member 23. The heat transfer member 23 may be in contact with the chip to be tested, such as directly contacting the heat transfer member 23 with the chip to be tested, or indirectly contacting the chip to be tested through other elements, or not contacting each other, as long as the chip to be tested can be heated.
Because the chip to be measured is fragile, if the heat transfer member 23 with a large hardness coefficient is directly abutted to the chip to be measured, the chip to be measured can be damaged, and the yield of the chip to be measured is reduced.
Therefore, in a specific embodiment, as shown in fig. 1 to 3, the heating assembly 20 may include a buffer pad 24, the buffer pad 24 is connected to the heat transfer element 23 and is used for abutting against the surface of the chip to be tested, so that the heat transfer element 23 may indirectly abut against the chip to be tested through the buffer pad 24, on one hand, the heat transfer element 23 may be prevented from being in hard contact with the chip to be tested, and on the other hand, an acting force acting on the chip to be tested may be buffered, so that a large impact acting force is prevented from acting on the chip to be tested, so that the chip to be tested is damaged, and the temperature of the chip to be tested may be gradually raised through the buffer pad 24, so that the chip to be tested is prevented from being damaged due to a fast temperature rise.
The cushion pad 24 may be made of a material having elasticity and good heat resistance, for example, a material such as heat-resistant silica gel.
Further, in an embodiment, as shown in fig. 2 and 3, the heat generating member 22 includes a heat generating chip 221, a heat generating plate 222 and a heat generating ceramic sheet 223. The heating chip 221 is electrically connected to the control circuit, the heating plate 222 is provided with a heating circuit, the heating circuit electrically connects the heating chip 221 and the heating ceramic sheet 223, the heating chip 221 is used for controlling the heating ceramic sheet 223 to generate heat under the action of the control circuit, and the heating ceramic sheet 223 is arranged on one side of the heating plate 222 facing the heat transfer member 23, is in contact with the heat transfer member 23, and can conduct heat with the heat transfer member 23.
Specifically, in the present embodiment, the heating board 222 is a commonly used PCB board, and is provided with a heating circuit, the heating circuit is used to electrically connect the heating chip 221 and a control circuit on the control board 21, so as to transmit a control signal to the heating chip 221, and the heating circuit is used to electrically connect the heating chip 221 and the heating ceramic plate 223, so that the heating chip 221 controls the heating ceramic plate 223 to generate heat, thereby generating heat.
The heating ceramic sheet 223 is a safe and reliable electric heating plate with a heated plate surface and without electricity and open fire after being electrified. The heating ceramic sheet 223 is mainly based on heat conduction when in use, so that the heat efficiency is high. And the ceramic wafer 223 that generates heat has advantages such as intensification is rapid, temperature compensation is fast, heating temperature is high, acid and alkali-resistance and other corrosive substance, and the application adopts the ceramic wafer 223 that generates heat as the piece 22 that generates heat not only can promote detection efficiency, but also can practice thrift the electric energy.
Further, in the present embodiment, the heat transfer member 23 is in contact with the heating ceramic sheet 223 so as to transfer the heat of the heating ceramic sheet 223 to the chip to be tested.
Wherein, the heat transfer member 23 may be in direct contact or indirect contact with the heating ceramic sheet 223. The indirect contact may be an arrangement in which the heat transfer member 23 and the heating ceramic sheet 223 are spaced apart from each other to conduct heat using air, or the heat transfer member 23 and the heating ceramic sheet 223 are in indirect contact through another heat conduction element to conduct heat using the heat conduction element.
Since the entire surface of the heating ceramic sheet 223 can generate heat, if the heat transfer member 23 is disposed on a side of the heating ceramic sheet 223 away from the heating plate 222, the heat transfer member 23 is only in contact with one surface of the heating ceramic sheet 223, which causes heat loss on the other surface.
Therefore, in an embodiment, as shown in fig. 2 and 3, an accommodating groove 231 may be formed on a surface of the heat transfer member 23 facing the heating ceramic sheet 223, the heat transfer member 23 is connected to the heating plate 222, and the heating ceramic sheet 223 is accommodated in the accommodating groove 231.
Wherein, heat transfer member 23 can be through modes such as bonding, welding or spiro union with generate heat board 222 lug connection, perhaps carry out indirect connection through other components and the board 222 that generates heat, through set up the storage tank 231 that is used for holding the ceramic wafer 223 that generates heat on heat transfer member 23, on the one hand can avoid the ceramic wafer 223 that generates heat to expose, cause the heat to run off, and then promote heat utilization ratio, practice thrift the efficiency, on the other hand also can shorten heat transfer member 23 and generate heat the distance between the board 222, make heating element 20's structure compacter.
Alternatively, in an embodiment, the accommodating groove 231 may be formed on a middle region of the heat transfer element 23, and a periphery of the heat transfer element 23 surrounding the accommodating groove 231 is connected to the heat generating plate 222 in an abutting manner, so that an opening of the accommodating groove 231 is completely sealed by the heat generating plate 222, thereby reducing heat dissipation.
The shape of the receiving groove 231 may be substantially the same as that of the heating ceramic sheet 223, so that at least a part of the sidewall of the heating ceramic sheet 223 abuts against at least a part of the inner wall of the receiving groove 231, thereby increasing the contact area between the heating ceramic sheet 223 and the heat transfer element 23 and improving the heat conduction efficiency.
Further, the heating assembly 20 further includes a temperature sensor (not shown in the figure) for detecting the temperature of the heating ceramic plate 223, and the control board 21 is configured to receive the temperature and convert the temperature of the heating ceramic plate 223 into the temperature of the surface of the heat transfer element 23 contacting the chip to be tested by using a preset conversion model, so that the control board 21 can precisely adjust the temperature acting on the chip to be tested.
Alternatively, in a specific embodiment, a display panel may be disposed on the control board 21, and the display panel is electrically connected to the control board for displaying the temperature of the surface of the heat transfer member 23 contacting the chip to be tested. The display panel can facilitate users to know the testing process, facilitate temperature control of the heating part 22, and facilitate timely detection when abnormality occurs in the detection process.
The display panel may be disposed at a position convenient for a user to observe, and the present application is not particularly limited.
Further, as shown in fig. 3, the heat transfer member 23 has a heating surface 232 for contacting the chip to be tested and a side surface 234 adjacent to the heating surface 232, and the cushion pad 24 is provided on the heating surface 232 for abutting against the chip to be tested. The side 234 is disposed obliquely relative to the heating surface 232, and the included angle between the side 234 and the heating surface 232 is greater than 90 degrees. By this way, the cross-sectional dimension of the heat transfer element 23 can be gradually increased in the direction away from the heating surface 232, and then a guiding inclined surface is formed around the heating surface 232 of the heat transfer element 23, so that the heat transfer element 23 is adapted to the testing base 10, and the heating surface 232 can be guided, so that the heating surface 232 can be accurately abutted to the chip to be tested.
Further, in the present embodiment, as shown in fig. 2 and 3, the heating assembly 20 further includes a heat insulation cover 25, and at least a portion of the heat insulation cover 25 is sandwiched between the heat generating member 22 and the control board 21 to isolate the heat generating member 22 from the control board 21, so as to prevent the heat generating member 22 from being at a high temperature and damaging the control board 21.
Since PEI (Polyetherimide) has strong high temperature stability, it has good toughness and strength even though it is a non-reinforced PEI. Therefore, the PEI with excellent thermal stability can be used for manufacturing high-temperature heat-resistant devices. In addition, PEI has excellent mechanical property, electric insulation property, irradiation resistance, high and low temperature resistance and wear resistance, and can penetrate microwaves. PEI also has good flame retardancy, chemical resistance, and electrical insulation properties. The glass transition temperature of PEI is very high, reaching 215 ℃. PEI also has very low shrinkage and good isotropic mechanical properties.
Therefore, in the present embodiment, the heat insulation cover 25 may be made of LCP (Liquid Crystal Polymer) or PEI (polyetherimide) and the like, so as to have high mechanical strength while ensuring good heat insulation performance.
Referring to fig. 4, fig. 4 is a schematic perspective view of the heat insulation cover of fig. 2. The heat insulation cover 25 includes a main body plate 252 and a surrounding plate 254, the surrounding plate 254 is disposed on a surface of the main body plate 252 facing the heat generating element 22 and surrounds the main body plate 252 to form a mounting groove 256, and the heat generating element 22 is disposed in the mounting groove 256 and connected to the main body plate 252. This embodiment sets up bounding wall 254 through the periphery at the piece 22 that generates heat, can reduce the area of contact of the piece 22 that generates heat with the air on the one hand, avoids the heat to run off, and on the other hand also can avoid the staff to trigger the hot piece 22 by mistake and take place the scald.
Optionally, in an embodiment, the heat generating element 22 is disposed in the mounting groove 256, and the heat generating plate 222 can be fixed on the main body plate 252 by bonding, clamping, screwing, or the like, so that the heat insulating cover 25 can be used not only for heat insulation, but also as a bracket for fixing the heat generating element 22, thereby simplifying the structure of the heating assembly 20 and reducing the production cost.
Optionally, the control board 21 is disposed on a side of the main body plate 252 away from the heat generating element 22, and since the control board 21 is a commonly used PCB, when the control board 21 is in a state with a high temperature, not only the control board 21 may be deformed, but also the working stability of the control circuit may be affected.
Therefore, in the present embodiment, the control board 21 and the main body board 252 can be disposed at an interval to prevent heat on the main body board 252 from being transmitted to the control board 21, thereby protecting the control board 21.
Referring to the above description, the control board 21 and the heat generating board 222 are respectively disposed at opposite sides of the main body board 252 with a space therebetween, and if the control board 21 and the heat generating board 222 are electrically connected using wires, the number of wires is large, and the installation process is complicated.
Therefore, in the present embodiment, the control board 21 and the heat generating board 222 may be electrically connected using a connector.
Specifically, as shown in fig. 1 to 4, an avoiding gap 258 is provided in the surrounding plate 254, and the control plate 21 and the heat generating plate 222 are further extended and provided in the avoiding gap 258. The heating assembly 20 further includes a first connector 26, the first connector 26 is disposed in the avoiding gap 258, one end of the first connector 26 is connected to the control board 21 and electrically connected to the control circuit, and the other end of the first connector 26 is connected to the heating board 222 and electrically connected to the heating chip 221.
In this way, the use of wires can be reduced, and the stability of the electrical connection of the control board 21 and the heat generating board 222 can be improved. In addition, the enclosure 254 is provided with an avoiding notch 258 for accommodating the first connector 26, so that the first connector 26 is more compact relative to the main body plate 252 to reduce the volume of the heating assembly 20, the enclosure 254 can be used for shielding the first connector 26 to protect the first connector 26, and the avoiding notch 258 can also be used for positioning the control board 21 and the heating board 222 to prevent the control board 21 and the heating board 222 from being displaced to cause electrical connection failure of the first connector 26 in the moving process of the heating assembly 20.
Further, a carrying portion 251 is disposed on a side of the main body plate 252 away from the heat generating element 22, the carrying portion 251 is disposed on the other opposite side of the main body plate 252 relative to the first connector 26, and opposite ends of the control board 21 are respectively bridged to the carrying portion 251 and the first connector 26.
Specifically, as shown in fig. 2 and fig. 3, a carrying portion 251 is convexly disposed on a side of the main body plate 252 opposite to the first connector 26, a surface of the carrying portion 251 facing away from the main body plate 252 is flush with a surface of the first connector 26 facing away from the heat generating plate 222 to form a carrying table together, and opposite ends of the control board 21 are overlapped on the carrying table to space the control board 21 and the main body plate 252. In the present embodiment, the bearing portion 251 is protruded from a side of the main body plate 252 opposite to the first connector 26 for fixing the control board 21 in cooperation with the first connector 26, so that the fixing structure of the control board 21 can be simplified, and the assembling efficiency of the heating assembly 20 can be improved.
Further, as shown in fig. 2 and 3, a supporting column 253 is disposed on a side of the main body plate 252 facing away from the heat generating member 22. The heating assembly 20 further includes a main board 27 and a second connector 28, the main board 27 is fixed to the end of the supporting column 253 facing away from the main body board 252, and the second connector 28 is sandwiched between the main board 27 and the control board 21 and is electrically connected to the main board 27 and the control board 21, respectively.
In one embodiment, the main board 27 may be electrically connected to a power source for supplying power to the control board 21. In the present embodiment, the supporting posts 253 are disposed around the circumference of the main body plate 252, and the main plate 27 is connected to the supporting posts 253, so that the main plate 27 is uniformly stressed. In a specific embodiment, the main board 27 may be connected to an end surface of the supporting pillar 253, which faces away from the main body board 252, and the main board 27 may also be connected to a side surface of the supporting pillar 253.
Further, in this embodiment, the main board 27 is fixed to the end surface of the supporting column 253, which faces away from the main body board 252, by a screw, or in other alternative embodiments, the main board 27 may also be fixed to the end surface of the supporting column 253, which faces away from the main body board 252, by bonding, clamping, and the like.
Alternatively, the number of the supporting columns 253 may be plural, and the plural supporting columns 253 are arranged at even intervals around the circumference of the main body plate 252 so that the main plate 27 is uniformly stressed. For example, in the present embodiment, the main body plate 252 has a rectangular shape, the number of the supporting pillars 253 is four, and four supporting pillars 253 are disposed at four corner positions of the rectangular main body plate 252. Alternatively, in other embodiments, the number of the supporting columns 253 can be two or three, and the like.
In another embodiment, the number of the supporting pillars 253 may also be one, the supporting pillars 253 are arranged in a continuous ring shape, and the ring-shaped supporting pillars 253 are arranged around the circumference of the main body plate 252 for forming a stable support below the main plate 27.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (13)
1. A heating assembly, characterized in that the heating assembly comprises:
the control panel is provided with a control circuit;
the heating piece is electrically connected with the control board and is used for heating under the control of the control board; and
the heat transfer piece, with generate heat the piece contact and can with generate heat the piece and carry out heat-conduction, the heat transfer piece is used for with the chip contact that awaits measuring, in order to heat the chip that awaits measuring.
2. The heating assembly of claim 1, wherein the heating element comprises a heating chip, a heating plate and a heating ceramic plate, the heating chip is electrically connected to the control circuit, a heating circuit is disposed on the heating plate, the heating circuit electrically connects the heating chip and the heating ceramic plate, the heating chip is configured to control the heating ceramic plate to generate heat under the action of the control circuit, and the heating ceramic plate is disposed on a side of the heating plate facing the heat transfer element, and is in contact with the heat transfer element and capable of conducting heat with the heat transfer element.
3. The heating assembly as claimed in claim 2, wherein a receiving groove is formed on a surface of the heat transfer member facing the heating ceramic sheet, the heat transfer member is connected to the heating plate, and the heating ceramic sheet is received in the receiving groove.
4. The heating assembly of claim 3, wherein the surface of the heat transfer member provided with the receiving groove abuts against the heat generating plate, and at least a portion of the sidewall of the heat generating ceramic sheet abuts against at least a portion of the inner wall of the receiving groove.
5. The heating assembly of claim 2, further comprising a temperature sensor, wherein the control board is electrically connected to the temperature sensor, the temperature sensor is used for detecting the temperature of the heat-generating ceramic plate and feeding the temperature back to the control board, a display panel is disposed on the control board, and the display panel is electrically connected to the control circuit and is used for displaying the temperature of the heat-generating element.
6. The heating assembly of claim 2, comprising an insulating cover, at least a portion of the insulating cover being sandwiched between the heat generating member and the control panel.
7. The heating assembly of claim 6, wherein the heat insulation cover comprises a main body plate and a surrounding plate, the surrounding plate is disposed on a surface of the main body plate facing the heat generating element and surrounds the main body plate to form a mounting groove, the heat generating element is disposed in the mounting groove and connected to the main body plate, and the control board is disposed on a side of the main body plate facing away from the heat generating element and spaced from the main body plate.
8. The heating assembly according to claim 7, wherein an avoiding notch is formed in the enclosing plate, the heating assembly further comprises a first connector, the first connector is arranged in the avoiding notch, one end of the first connector is connected with the control board and electrically connected with the control circuit, and the other end of the first connector is connected with the heating plate and electrically connected with the heating chip.
9. The heating assembly of claim 8, wherein a side of the main body plate facing away from the heat generating element is provided with a bearing portion, the bearing portion is provided on the other opposite side of the main body plate relative to the first connector, and opposite ends of the control plate are respectively bridged with the bearing portion and the first connector.
10. The heating assembly of claim 7, wherein a supporting pillar is disposed on a side of the main body plate away from the heat generating element, the heating assembly further comprises a main board and a second connector, the main board is fixed to a terminal of the supporting pillar away from the main body plate, and the second connector is sandwiched between the main board and the control board and is electrically connected to the main board and the control board, respectively.
11. The heating assembly of claim 1, comprising a cushion pad connected to the heat transfer element for abutting a surface of the chip under test.
12. The heating assembly of claim 1, wherein the heat transfer element has a heating surface for contacting the chip to be tested and a side surface adjacent to the heating surface, the side surface is disposed obliquely with respect to the heating surface, and an included angle between the side surface and the heating surface is greater than 90 degrees.
13. A burn-in test device, comprising a base and the heating assembly of any one of claims 1-12, wherein the base is provided with a test chamber for accommodating the chip to be tested, and the heating assembly is used for heating the chip to be tested in the test chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010469524.0A CN113740628A (en) | 2020-05-28 | 2020-05-28 | Aging test equipment and heating assembly thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010469524.0A CN113740628A (en) | 2020-05-28 | 2020-05-28 | Aging test equipment and heating assembly thereof |
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| CN113740628A true CN113740628A (en) | 2021-12-03 |
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| CN202010469524.0A Pending CN113740628A (en) | 2020-05-28 | 2020-05-28 | Aging test equipment and heating assembly thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117471289A (en) * | 2023-12-22 | 2024-01-30 | 前海晶方云(深圳)测试设备有限公司 | Chip testing device |
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2020
- 2020-05-28 CN CN202010469524.0A patent/CN113740628A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117471289A (en) * | 2023-12-22 | 2024-01-30 | 前海晶方云(深圳)测试设备有限公司 | Chip testing device |
| CN117471289B (en) * | 2023-12-22 | 2024-04-19 | 前海晶方云(深圳)测试设备有限公司 | Chip testing device |
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