CN108679877B

CN108679877B - Solid-state refrigerating device

Info

Publication number: CN108679877B
Application number: CN201810392900.3A
Authority: CN
Inventors: 廉锋; 张尚民; 丁剑波; 潘自杰
Original assignee: Qingdao Haier Special Refrigerator Co Ltd; Qingdao Haier Smart Technology R&D Co Ltd; Haier Smart Home Co Ltd
Current assignee: Qingdao Haier Special Refrigerator Co Ltd; Qingdao Haier Smart Technology R&D Co Ltd; Haier Smart Home Co Ltd
Priority date: 2017-04-28
Filing date: 2018-04-27
Publication date: 2022-03-22
Anticipated expiration: 2038-04-27
Also published as: CN108397959B; CN108895705B; CN108917256A; CN108731298A; CN108709335A; CN108731298B; CN108375274B; CN108800656B; CN108375276A; CN108709335B; CN108917256B; CN108895705A; CN108397959A; CN108375276B; CN108679877A; CN108800656A; CN108375274A; WO2018196679A1

Abstract

The invention discloses a solid-state refrigerating device which comprises a heat-conducting inner container, a semiconductor refrigerating module and a humidity control assembly, wherein the semiconductor refrigerating module comprises a first semiconductor refrigerating chip, a heat pipe and an assembling module, the assembling module comprises a first heat-insulating support, a second heat-insulating support, a hot-end heat-conducting seat and a cold-end heat-conducting seat, a first groove is formed in the first heat-insulating support, a mounting hole penetrating through the first heat-insulating support is formed in the first groove, a second groove is formed in the second heat-insulating support, the first heat-insulating support is fixed on the second heat-insulating support, a mounting cavity is formed between the first groove and the second groove, the first semiconductor refrigerating chip is located in the mounting hole, the cold-end heat-conducting seat is in contact with the cold-end surface of the first semiconductor refrigerating chip, the hot-end heat-conducting seat is in contact with the hot-end surface of the first semiconductor refrigerating chip, and the heat pipe is connected with the cold-end heat-conducting seat. The refrigeration capacity loss of the semiconductor refrigeration module is reduced, so that the refrigeration efficiency of the refrigeration equipment is improved, and the energy consumption is reduced.

Description

Solid-state refrigerating device

Technical Field

The invention relates to refrigeration equipment, in particular to a solid-state refrigeration device.

Background

At present, with the development of semiconductor refrigeration technology, refrigeration equipment which adopts a first semiconductor refrigeration chip for refrigeration is widely used, and chinese patent No. 2014107111772 discloses a semiconductor refrigeration equipment which adopts the refrigeration quantity generated by the first semiconductor refrigeration chip to realize refrigeration. The first semiconductor refrigeration chip comprises a cold end for releasing cold and a hot end for releasing heat, in the operation process, the cold end of the first semiconductor refrigeration chip releases the cold into the refrigeration compartment of the refrigeration equipment through the cold end radiator, and the hot end of the first semiconductor refrigeration chip needs to radiate the heat to the outside through the hot end radiator. However, in the actual use process, because the cold end and the hot end of the first semiconductor refrigeration chip are oppositely arranged in a back-to-back manner, the cold end radiator and the hot end radiator are adjacent to each other, and the cold end radiator and the hot end radiator are easy to generate heat exchange to cause the loss of cold energy, so that the refrigeration efficiency of the refrigeration equipment is lower and the energy consumption is increased. The invention aims to solve the technical problem of how to design a refrigeration device with high refrigeration efficiency and low energy consumption.

Disclosure of Invention

The invention provides a solid-state refrigerating device, which can reduce the cold loss of a semiconductor refrigerating module so as to improve the refrigerating efficiency of refrigerating equipment and reduce energy consumption.

In order to achieve the technical purpose, the invention adopts the following technical scheme:

a solid-state refrigerating device comprises a heat-conducting inner container, a semiconductor refrigerating module and a dehumidifying module; the semiconductor refrigeration module comprises a first semiconductor refrigeration chip and a heat pipe, wherein the first semiconductor refrigeration chip comprises a cold end surface for releasing cold and a hot end surface for releasing heat, the semiconductor refrigeration module further comprises an assembly module, the assembly module comprises a first heat insulation support, a second heat insulation support, a hot end heat conduction seat and a cold end heat conduction seat, the first heat insulation support is fixed on the second heat insulation support, an installation cavity is formed between the first heat insulation support and the second heat insulation support, the first heat insulation support is provided with an installation hole communicated with the installation cavity, the first semiconductor refrigeration chip is positioned in the installation hole, the cold end heat conduction seat is arranged in the installation cavity and is in contact with the cold end surface of the first semiconductor refrigeration chip, the hot end heat conduction seat is arranged on the first heat insulation support and is in contact with the hot end surface of the first semiconductor refrigeration chip, the heat pipe is connected with the cold end heat conduction seat, and the heat pipe of the semiconductor refrigeration module is attached to the surface of the heat conduction inner container; the dehumidification module comprises a second semiconductor refrigeration chip, a cold end radiator is arranged on a cold end face of the second semiconductor refrigeration chip, a hot end radiator is arranged on a hot end face of the second semiconductor refrigeration chip, the cold end radiator is located in the heat conduction liner, the hot end radiator is located outside the heat conduction liner, and a humidity sensor is further arranged in the heat conduction liner.

Furthermore, the dehumidification module further comprises a heat insulation frame, the heat insulation frame is provided with an installation through hole, and the second semiconductor refrigeration chip is arranged in the installation through hole; an embedding opening is formed in the heat conduction inner container, and the heat insulation frame is embedded in the embedding opening in a sealing mode.

Furthermore, the dehumidification module further comprises a fan cover and a fan, a first circulation air port and a second circulation air port are formed in the fan cover, the fan cover is fixed to the heat conduction inner container and covers the cold end radiator, and the fan is located in a cavity structure formed between the fan cover and the heat conduction inner container.

Furthermore, the humidification module includes water box, humidification bubble cotton, upper cover and fan, the humidification bubble is cotton to be located in the water box, the upper cover covers the upper portion of water box, cover on and be provided with air intake and air outlet, the fan covers the air intake or the air outlet, the water box sets up in the heat conduction inner bag.

Furthermore, a water pan is arranged at the bottom of the cold end radiator and is connected with the water box through a drain pipe.

Further, a heat insulation groove is formed in the outer surface of the first heat insulation support and surrounds the mounting hole, and heat insulation cotton is arranged in the heat insulation groove; the hot end of the first semiconductor refrigeration chip protrudes outwards from the outer surface of the first heat insulation support.

Furthermore, an avoiding gap is formed in the cold-end heat conducting seat, through holes are formed in the first heat insulation support, the second heat insulation support and the hot-end heat conducting seat respectively, bolts penetrate through the corresponding through holes, and the bolts penetrate through an area formed by the avoiding gap.

Further, the cold end heat conduction seat comprises a first heat conduction plate and a second heat conduction plate which are connected together, and the heat pipe is clamped between the first heat conduction plate and the second heat conduction plate.

Further, the internal surface of first heat-conducting plate has seted up the first mounting groove of horizontal setting, the internal surface of second heat-conducting plate has seted up the second mounting groove of vertical setting, the heat pipe divide into horizontal flat heat pipe and vertical flat heat pipe, horizontal flat heat pipe sets up in the first mounting groove, vertical flat heat pipe sets up in the second mounting groove, and, horizontal flat heat pipe with vertical flat heat pipe contacts each other.

Furthermore, the inner surface of the first heat insulation support is provided with a first pipe groove for installing the heat pipe, and the edge of the second heat insulation support is provided with a notch or a through hole or a second pipe groove for the heat pipe to pass through.

Compared with the prior art, the invention has the advantages and positive effects that: the cold end heat conduction seat is installed through the installation cavity formed between the two heat insulation supports, so that the cold end heat conduction seat and the hot end heat conduction seat are effectively insulated and spaced by the heat insulation supports, the heat exchange quantity generated between the cold end heat conduction seat and the hot end heat conduction seat can be greatly reduced, the dissipation of cold quantity is effectively reduced, and the refrigeration efficiency of refrigeration equipment is improved and the energy consumption is reduced. Meanwhile, the first semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulation support, so that good contact between the cold end face of the first semiconductor refrigeration chip and the cold end heat conduction seat is ensured, good contact between the hot end face of the first semiconductor refrigeration chip and the hot end heat conduction seat is ensured, rapid heat dissipation is ensured, and use reliability is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is an assembly view of a heat-conducting inner container and a semiconductor refrigeration module in the refrigeration equipment of the present invention;

FIG. 2 is an assembly view of a heat-conducting inner container and a humidifying module in the refrigeration device of the present invention;

FIG. 3 is a schematic view of a semiconductor refrigeration module according to the present invention;

FIG. 4 is a schematic front view of a first heat-insulating support of the semiconductor refrigeration module according to the present invention;

FIG. 5 is a schematic view of a reverse structure of a first heat-insulating support of the semiconductor refrigeration module according to the present invention;

FIG. 6 is a schematic front view of a second heat insulating frame of the semiconductor refrigeration module of the present invention;

FIG. 7 is a schematic view of a second heat-insulating support of the semiconductor refrigeration module according to the present invention;

FIG. 8 is a schematic diagram of a first heat-conducting plate of the semiconductor refrigeration module according to the present invention;

FIG. 9 is a schematic diagram of a second heat-conducting plate of the semiconductor refrigeration module according to the present invention;

FIG. 10 is an exploded view of the semiconductor refrigeration module of the present invention;

FIG. 11 is a schematic view of a humidifying module according to the present invention;

FIG. 12 is an exploded view of the humidifying module of the present invention;

fig. 13 is an exploded view of the dehumidification module of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 to 13, a humidifying module 300 and/or a dehumidifying module 400 may be disposed in a storage cavity formed by an inner container of the refrigeration apparatus according to needs, so as to adjust humidity in the storage cavity as needed, and meet storage requirements of specific articles. The refrigeration equipment can be used for refrigerating by adopting a solid-state refrigeration technology, wherein the inner container of the refrigeration equipment is a heat-conducting inner container 100, and the semiconductor refrigeration module 200 is arranged on the heat-conducting inner container 100. How to explain different innovative points with reference to the attached drawings.

First, the specific structure of the semiconductor refrigeration module 200 is described as follows:

the semiconductor refrigeration module 200 comprises a first semiconductor refrigeration chip 1 and a heat pipe 2, wherein the first semiconductor refrigeration chip 1 comprises a cold end face for releasing cold and a hot end face for releasing heat, and further comprises an assembly module 3, the assembly module 3 comprises a first heat insulation support 31, a second heat insulation support 32, a hot end heat conduction seat 33 and a cold end heat conduction seat 34, the first heat insulation support 31 is fixed on the second heat insulation support 32, a mounting cavity with a heat insulation function is formed between the first heat insulation support 31 and the second heat insulation support 32, a mounting cavity is formed between the first groove 311 and the second groove 321, the first semiconductor refrigeration chip 1 is positioned in the mounting hole 312, the cold end heat conduction seat 34 is arranged in the mounting cavity and is in contact with the cold end face of the first semiconductor refrigeration chip 1, the hot end heat conduction seat 33 is arranged on the first heat insulation support 31 and is in contact with the hot end face of the first semiconductor refrigeration chip 1 In contact, the heat pipe 2 is connected to the cold end heat conduction seat 34.

Specifically, the semiconductor refrigeration module 200 embeds the first semiconductor refrigeration chip 1 in the mounting hole 312 of the first heat insulation support 31, the periphery of the first semiconductor refrigeration chip 1 is wrapped by the first heat insulation support 31, and the hot end heat conduction seat 33 and the cold end heat conduction seat 34 are separated by the first heat insulation bracket 31, the heat transfer generated between the hot-end heat conduction seat 33 and the cold-end heat conduction seat 34 can be effectively reduced, thereby reducing the cold loss of the cold end heat conducting seat 34, meanwhile, the cold end heat conducting seat 34 is wrapped in the installation cavity which is formed by the first heat insulation bracket 31 and the second heat insulation bracket 32 and has the heat insulation function, the cold energy generated by the first semiconductor refrigeration chip 1 conducted by the cold-end heat conduction seat 34 can be rapidly transmitted to a required area through the heat pipe 2 to the maximum extent, thereby reducing the amount of cold energy dissipation of the cold end heat conduction seat 34 per se, more effectively reducing the energy consumption and improving the refrigeration efficiency. Wherein, the inner surface of the first heat insulation support 31 and/or the inner surface of the second heat insulation support 32 are provided with grooves, and the installation cavity is formed by the grooves, for example: the inner surface of the first heat insulation support 31 is provided with a first groove 311, the first groove 311 is provided with a mounting hole 312 penetrating through the first heat insulation support 31, the inner surface of the second heat insulation support 32 is provided with a second groove 321, and a mounting cavity is formed between the first groove 311 and the second groove 321.

Preferably, the outer surface of the first heat insulation bracket 31 is provided with a heat insulation groove 313 around the mounting hole 312, and heat insulation cotton (not marked) is arranged in the heat insulation groove 313; the hot end of the first semiconductor refrigeration chip 1 protrudes outward from the outer surface of the first heat insulation support 31. Specifically, the heat insulation groove 313 can be used for arranging the heat insulation cotton at the periphery of the first semiconductor refrigeration chip 1, so that the heat insulation ring formed by the heat insulation cotton further reduces the outward dissipation of the cold quantity of the cold end face of the first semiconductor refrigeration chip 1, and meanwhile, the heat quantity of the hot end face of the first semiconductor refrigeration chip 1 can be reduced to enter the installation cavity, and the loss of the cold quantity is reduced to the maximum extent; and the hot end face of the first semiconductor refrigeration chip 1 is slightly higher than the outer surface of the first heat insulation support 31, so that on one hand, the hot end face of the first semiconductor refrigeration chip 1 and the hot end heat conduction seat 33 can be in good contact heat transfer, and on the other hand, the hot end face of the first semiconductor refrigeration chip 1 is separated from the mounting hole 312, so that heat can be reduced from being transferred into the mounting cavity from the mounting hole 312, and the loss of cold energy can be effectively reduced. In order to facilitate the connection of circuit wiring, a wiring groove 314 is further disposed on the outer surface of the first heat insulation support 31, and the wiring groove 314 is communicated with the mounting hole 312. In addition, according to the requirement of the refrigerating capacity of the refrigerating device, the semiconductor refrigerating module 200 includes a plurality of the first semiconductor refrigerating chips 1, the assembly module 3 is configured with the hot end heat conduction seat 33 and the cold end heat conduction seat 34 corresponding to the first semiconductor refrigerating chips 1, and the first heat insulation support 31 is provided with the mounting hole 312 corresponding to the first semiconductor refrigerating chip 1.

Further, in order to more effectively reduce heat transfer generated between the hot end heat conduction seat 33 and the cold end heat conduction seat 34 due to assembly, an avoidance gap 340 is provided on the cold end heat conduction seat 34, through holes (not marked) are respectively provided on the first heat insulation support 31, the second heat insulation support 32 and the hot end heat conduction seat 33, a bolt 35 is inserted into the corresponding through hole, and the bolt 35 passes through an area formed by the avoidance gap 340. Specifically, in the assembling process, the hot end heat conducting seat 33, the first heat insulating support 31, the cold end heat conducting seat 34 and the second heat insulating support 32 are sequentially assembled and fixed together through the bolt 35, and the bolt 35 avoids the cold end heat conducting seat 34 through the avoiding notch 340, so that heat exchange between the hot end heat conducting seat 33 and the cold end heat conducting seat 34 through the bolt 35 can be avoided. The inner surface of the first heat insulation support 31 is provided with a first pipe groove 316 and a first pipe groove 317 for installing the heat pipe 2, and the edge of the second heat insulation support 32 is provided with a notch or a through hole 322 or a second pipe groove for the heat pipe 2 to pass through. Specifically, the heat pipe 2 passes through the assembly module 3 through the first pipe groove 316, the first pipe groove 317 and the through hole 322 in a matching manner, so that the heat pipe 2 is conveniently arranged on the heat-conducting inner container 100 of the refrigeration equipment. In addition, in order to facilitate quick positioning and installation of the hot end heat conduction seat 33, a plurality of positioning baffles 315 are arranged on the outer surface of the first heat insulation support 31 around the outer side of the installation hole 312, and the hot end heat conduction seat 33 is arranged among the positioning baffles 315. During the equipment, the hot junction heat conduction seat 33 can be conveniently positioned and installed through the positioning baffle 315, and the hot junction heat conduction seat 33 can be ensured to be accurately in good contact with the first semiconductor refrigeration chip 1.

Still further, the cold end heat conduction seat 34 includes a first heat conduction plate 341 and a second heat conduction plate 342 connected together, and the heat pipe 2 is sandwiched between the first heat conduction plate 341 and the second heat conduction plate 342. Specifically, the inner surface of the first heat conducting plate 341 is provided with a first mounting groove 3411 which is transversely arranged, the inner surface of the second heat conducting plate 342 is provided with a second mounting groove 3421 which is longitudinally arranged, the heat pipe 2 is divided into a transverse flat heat pipe and a longitudinal flat heat pipe, the transverse flat heat pipe is arranged in the first mounting groove 3411, the longitudinal flat heat pipe is arranged in the second mounting groove 3421, and the transverse flat heat pipe and the longitudinal flat heat pipe are in contact with each other. Specifically, adopt flat heat pipe can effectual increase heat pipe and the area of contact of cold junction heat conduction seat 34, simultaneously, flat heat pipe can also effectual increase and the area of contact between the heat conduction inner bag 100, provides heat exchange efficiency. And the transverse flat heat pipe is contacted with the longitudinal flat heat pipe, so that the temperature of the heat pipes at different positions is uniformly distributed, the temperature difference is reduced, and the temperature uniformity is improved.

The cold end heat conduction seat is installed through the installation cavity formed between the two heat insulation supports, so that the cold end heat conduction seat and the hot end heat conduction seat are effectively insulated and spaced by the heat insulation supports, the heat exchange quantity generated between the cold end heat conduction seat and the hot end heat conduction seat can be greatly reduced, the dissipation of cold quantity is effectively reduced, and the refrigeration efficiency of refrigeration equipment is improved and the energy consumption is reduced. Meanwhile, the first semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulation support, so that good contact between the cold end face of the first semiconductor refrigeration chip and the cold end heat conduction seat is ensured, good contact between the hot end face of the first semiconductor refrigeration chip and the hot end heat conduction seat is ensured, rapid heat dissipation is ensured, and use reliability is improved.

Secondly, the specific structural form of the humidifying module 300 is described as follows:

the humidifying module 300 comprises a water box 4, humidifying foam 41, an upper cover 43 and a fan 42, wherein the humidifying foam 41 is positioned in the water box 4, the upper cover 43 covers the upper part of the water box 4, an air inlet 432 and an air outlet 431 are arranged on the upper cover 43, the fan 42 covers the air inlet 432 or the air outlet 431, and the water box 4 is arranged in a storage cavity formed by the heat-conducting inner container 100. Specifically, water is held in the water box 4, and the fan 42 can realize induced drafting in the water box 4 or blowing outside the water box 4 as required to make humid air in the water box 4 can flow into the storing cavity that heat conduction inner bag 100 formed, in order to realize carrying out humidification processing to the storing cavity that heat conduction inner bag 100 formed, the cotton 41 of humidification bubble can increase the area of contact of air and water that enters into in the water box 4, in order to improve humidification efficiency.

Further, the humidification module 300 further comprises a wind guide assembly, the wind guide assembly comprises a housing 44, a wind guide plate 45 and a motor 46, a vent 441 is arranged at the top of the housing 44, the wind guide plate 45 is located in the vent 441 and rotatably mounted on the housing 44, the motor 46 is used for driving the wind guide plate 45 to rotate, and the housing 44 is arranged on the water box 4 and covers the fan 42. Specifically, in the humidification process, the motor 46 can drive the air deflector 45 to swing so as to control the output wet air to be uniformly distributed in the storage cavity of the heat-conducting inner container 100, thereby ensuring uniform humidity distribution of the storage cavity of the heat-conducting inner container 100. One end of the humidification foam 41 is located below the air inlet 432, and the other end of the humidification foam 41 is located below the air outlet 431, so that air entering the water box 4 from the air inlet 432 flows through the humidification foam 41 for sufficient humidification and then is discharged from the air outlet 431, and the humidification efficiency is improved; in order to prevent the inlet 432 and the outlet 431 from interfering with each other, a baffle 433 for separating the inlet 432 and the outlet 431 is further provided on the upper surface of the upper cover 43. In addition, in order to facilitate the assembly of the humidifying module 300, the two sides of the housing 44 are provided with the insertion strips 442, the water box 4 is provided with the insertion grooves 405 matched with the insertion strips 442, and the insertion strips 442 are inserted into the insertion grooves 405. For the convenience of installation, the humidifying module 300 further includes a fixing bracket 402 fixedly installed in the heat-conducting inner container 100, and the water box 4 is detachably installed on the fixing bracket 402.

Still further, a partition 401 is disposed in the water box 4, the partition 401 divides the water box into a main water cavity and an auxiliary water cavity which are communicated with each other, and a sterilization module 404 and/or a water level sensor 403 are disposed in the auxiliary water cavity. Specifically, the sterilization module 404 may be an ultraviolet sterilizer or an ozone sterilizer to realize sterilization treatment of the stored water in the water box 4, and the water level sensor 403 may detect the water level in the water box 4 to remind the user of timely water replenishment in the water shortage state.

Thirdly, the specific structure of the dehumidification module 400 is described as follows:

the dehumidification module 400 comprises a second semiconductor refrigeration chip 5, a heat insulation frame 51, a hot end radiator 52 and a cold end radiator 53, wherein the cold end face of the second semiconductor refrigeration chip 5 is provided with the cold end radiator 53, the hot end face of the second semiconductor refrigeration chip 5 is provided with the hot end radiator 52, the cold end radiator 53 is located in a storage cavity in the heat conduction liner 100, the hot end radiator 52 is located on the outer side of the heat conduction liner 100, and a humidity sensor (not shown) is further arranged in the heat conduction liner 100. Specifically, in the dehumidification process, the second semiconductor refrigeration chip 5 is electrified, the cold quantity generated by the cold end surface of the second semiconductor refrigeration chip 5 is released through the cold end radiator 53, the temperature of the cold end radiator 53 is lower than that in the storage cavity, and therefore the moisture in the air in the storage cavity is condensed on the cold end radiator 53, so that the dehumidification operation is realized. In order to facilitate installation, the dehumidification module 400 further comprises a heat insulation frame 51, the heat insulation frame 51 is provided with an installation through hole, the second semiconductor refrigeration chip 5 is arranged in the installation through hole, the heat insulation frame 51 is embedded into an embedding opening formed in the heat conduction liner 100 in a sealing mode, and therefore the heat end radiator 52 can be prevented from influencing the temperature inside the heat conduction liner 100 through the heat insulation frame 51 in a sealing mode. Preferably, a water pan 54 is disposed at the bottom of the cold-end radiator 53, specifically, the condensed water formed on the cold-end radiator 53 flows into the water pan 54 at the bottom under the action of gravity, and a drain pipe is connected to the bottom of the water pan 54 and extends out of the drain pipe to the outside of the heat-conducting inner container 100 to drain the condensed water. Wherein, cold junction radiator 53 is the heat-conducting plate, a surface subsides of heat-conducting plate are leaned on at the cold junction face of second semiconductor refrigeration chip 5, and another is provided with many vertical arrangement's radiating fin (not mark) on the surface, and radiating fin can increase the area of contact with the air on the one hand, improves the efficiency of condensation dehumidification, and on the other hand, radiating fin vertical arrangement can make things convenient for the comdenstion water to trickle to the water collector 54 of bottom in. The bottom of each radiating fin is of a conical structure, the tip of each conical structure faces the water receiving disc 54 at the bottom, so that condensed water can be guaranteed to drop into the water receiving disc 54 to be collected, the surfaces of the radiating fins are provided with the hydrophobic films, the flowing speed of the condensed water on the surfaces of the radiating fins is improved, and the condensed water is prevented from freezing or frosting on the radiating fins for a long time. In addition, in order to improve dehumidification efficiency, the dehumidification module 400 further comprises a fan cover 61 and a fan 6, a first circulation air port and a second circulation air port are formed in the fan cover 61, the fan cover 61 is fixed on the heat conduction inner container 100 and covers the cold-end radiator 53, the fan 6 is located in the fan cover 61 and a cavity structure formed between the heat conduction inner containers 100, air in the storage cavity can be humidified through the fan and contacts with the cold-end radiator 53, and dehumidification efficiency is improved.

Wherein, can independent use to humidification module 300, dehumidification module 400, also can cooperate the use, humidification module 300 and the operation of dehumidification module 400 are controlled by the humidity transducer who sets up in the storing cavity. In the case where the humidification module 300 and the dehumidification module 400 are used at the same time, the condensed water in the drain pan 54 may be drained to the water bucket 4 through a drain pipe for use.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. A solid-state refrigerating device comprises a heat-conducting inner container, and is characterized by also comprising a semiconductor refrigerating module and a dehumidifying module; the semiconductor refrigeration module comprises a first semiconductor refrigeration chip and a heat pipe, wherein the first semiconductor refrigeration chip comprises a cold end face for releasing cold and a hot end face for releasing heat, and is characterized by further comprising an assembly module, the assembly module comprises a first heat insulation support, a second heat insulation support, a hot end heat conduction seat and a cold end heat conduction seat, the first heat insulation support is fixed on the second heat insulation support, an installation cavity is formed between the first heat insulation support and the second heat insulation support, the first heat insulation support is provided with an installation hole communicated with the installation cavity, the first semiconductor refrigeration chip is positioned in the installation hole, the cold end heat conduction seat is wrapped in the installation cavity which is formed by the first heat insulation support and the second heat insulation support and has a heat insulation function, and the cold end heat conduction seat is in contact with the cold end face of the first semiconductor refrigeration chip, the hot end heat conduction seat is arranged on the first heat insulation support and is in contact with the hot end surface of the first semiconductor refrigeration chip, the heat pipe is connected with the cold end heat conduction seat, and the heat pipe of the semiconductor refrigeration module is attached to the surface of the heat conduction inner container; the dehumidification module comprises a second semiconductor refrigeration chip, a cold end radiator is arranged on the cold end face of the second semiconductor refrigeration chip, a hot end radiator is arranged on the hot end face of the second semiconductor refrigeration chip, the cold end radiator is located in the heat conduction liner, the hot end radiator is located outside the heat conduction liner, and a humidity sensor is further arranged in the heat conduction liner; the hot end face of the first semiconductor refrigeration chip is higher than the outer surface of the first heat insulation support.

2. The solid state refrigeration device of claim 1, wherein the dehumidification module further comprises a thermally insulating frame, the thermally insulating frame being provided with a mounting through hole, the second semiconductor refrigeration chip being disposed in the mounting through hole; an embedding opening is formed in the heat conduction inner container, and the heat insulation frame is embedded in the embedding opening in a sealing mode.

3. The solid state refrigeration device of claim 1 wherein the dehumidification module further comprises a hood and a fan, the hood having a first circulation port and a second circulation port, the hood secured to the heat conductive liner and covering the cold end heat sink, the fan positioned in a cavity formed between the hood and the heat conductive liner.

4. The solid state refrigeration unit of claim 1, further comprising: a humidifying module; the humidification module includes that water box, humidification bubble are cotton, upper cover and fan, the humidification bubble is cotton to be located in the water box, the upper cover covers the upper portion of water box, be provided with air intake and air outlet on the upper cover, the fan covers the air intake or the air outlet, the water box sets up in the heat conduction inner bag.

5. The solid state refrigeration unit of claim 4 wherein a water pan is provided at the bottom of the cold side heat sink, the water pan being connected to the water box by a drain pipe.

6. The solid state refrigeration unit of claim 1 wherein the outer surface of the first insulating support is provided with an insulating groove around the mounting hole, the insulating groove having insulating cotton disposed therein; the hot end of the first semiconductor refrigeration chip protrudes outwards from the outer surface of the first heat insulation support.

7. The solid-state refrigeration device according to claim 1, wherein an avoidance gap is formed in the cold-end heat conduction seat, through holes are formed in the first heat insulation support, the second heat insulation support and the hot-end heat conduction seat respectively, bolts are inserted into the corresponding through holes, and the bolts penetrate through an area formed by the avoidance gap.

8. The solid state refrigeration unit of claim 1 wherein said cold end heat conductive mount comprises first and second heat conductive plates joined together, said heat pipe being sandwiched between said first and second heat conductive plates.

9. The solid state refrigeration device of claim 8, wherein the inner surface of the first heat conducting plate defines a first mounting groove disposed laterally, the inner surface of the second heat conducting plate defines a second mounting groove disposed longitudinally, the heat pipes are divided into a lateral flat heat pipe and a longitudinal flat heat pipe, the lateral flat heat pipe is disposed in the first mounting groove, the longitudinal flat heat pipe is disposed in the second mounting groove, and the lateral flat heat pipe and the longitudinal flat heat pipe are in contact with each other.

10. The solid state refrigeration device of claim 1, wherein the inner surface of the first heat insulating support is provided with a first tube slot for mounting the heat pipe, and the edge of the second heat insulating support is provided with a notch or a through hole or a second tube slot for the heat pipe to pass through.