CN220931453U - Refrigerating appliance - Google Patents

Abstract

The application relates to the technical field of household appliances, and discloses refrigeration equipment, which comprises: refrigeration compartment, cold-storage module and semiconductor dehumidification subassembly. The cold accumulation module is connected with the refrigeration compartment through a heat conduction assembly; the semiconductor dehumidification component is arranged in the refrigeration compartment, and the hot end of the semiconductor dehumidification component faces the heat conduction component. The cold accumulation module is utilized to cool the hot end of the semiconductor dehumidification assembly, so that the refrigeration dehumidification efficiency of the semiconductor dehumidification assembly can be maintained, the temperature stability in the refrigeration compartment can be maintained, and the balance of the temperature and the humidity in the refrigeration compartment can be kept stable.

Description

Refrigerating appliance

Technical Field

The application relates to the technical field of household appliances, in particular to refrigeration equipment.

Background

At present, in daily life, vegetables, wine, medicines, vaccines and the like have strict requirements on the temperature and the humidity of a storage environment, on one hand, the articles can avoid the loss of the humidity of the articles in the optimal temperature and humidity storage environment, and the articles are deteriorated due to the too high or the too low temperature; on the other hand, the humidity is reduced, so that the mold breeding caused by the excessively high humidity can be reduced, and finally the probability of deterioration of the articles is reduced.

In the related art, in order to adjust the humidity of the refrigeration equipment, a semiconductor refrigeration module can be adopted to dehumidify in the refrigeration space, a hot end radiator and a cold end radiator are respectively arranged at the hot end and the cold end of a semiconductor refrigeration sheet, a hot end radiating fan and a cold end radiating fan are respectively arranged at the outer parts of corresponding radiators, the cold end radiating fan flows through the cold end radiating sheet through the air of the space to be dehumidified, the humidity is condensed on the cold end radiating sheet by utilizing the characteristic that the temperature of the cold end radiating sheet is lower than that of the air, and the hot end radiating fan flows the air in the environment through the hot end radiating sheet, so that the aim of radiating the hot end is fulfilled.

Therefore, how to better maintain the stability of the temperature and humidity in the refrigerating chamber is a technical problem to be solved by those skilled in the art.

It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the application and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art.

Disclosure of utility model

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview, and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended as a prelude to the more detailed description that follows.

The embodiment of the disclosure provides a refrigeration device to solve the problem of large temperature fluctuation of a dehumidifying space.

In some embodiments, a refrigeration appliance includes: refrigeration compartment, cold-storage module and semiconductor dehumidification subassembly. The cold accumulation module is connected with the refrigeration compartment through a heat conduction assembly; the semiconductor dehumidification component is arranged in the refrigeration compartment, and the hot end of the semiconductor dehumidification component faces the heat conduction component.

Optionally, the cold storage module includes: solution tank and thermal insulation board. The solution tank is arranged at one side of the refrigeration compartment, and cold accumulation medium is injected into the solution tank; the heat insulation plate is arranged on the side wall of the solution tank, which is close to the refrigeration compartment.

Optionally, a heat exchanger is arranged in the solution tank and is connected with the heat conduction component.

Optionally, the heat conduction assembly comprises: a first heat conduction part and a second heat conduction part. The first heat conduction part covers the inner side wall of the refrigeration compartment; the second heat conduction part is arranged at one side of the semiconductor dehumidification component.

Optionally, the length of the second thermally conductive section is related to the power of the semiconductor dehumidification assembly.

Optionally, the semiconductor dehumidifying assembly includes: semiconductor refrigerating fin, cold junction fin and hot junction fin. The cold end radiating fin covers the cold end of the semiconductor refrigerating fin; the hot end radiating fin covers the hot end of the semiconductor refrigerating fin.

Optionally, the semiconductor dehumidifying assembly includes: a housing. The semiconductor refrigerating fin, the cold end radiating fin and the hot end radiating fin are all arranged in the shell, a hot end radiating opening is arranged on the shell corresponding to the hot end radiating fin 303, and a cold end air inlet is arranged on the shell corresponding to the cold end radiating fin.

Optionally, a heat dissipation fan is arranged at the heat dissipation port of the hot end, and the heat dissipation fan outputs air towards the heat conduction assembly.

Optionally, the cold junction fin lower extreme is equipped with comdenstion water collecting part, and comdenstion water collecting part passes through drain pipe and water collector intercommunication.

Optionally, the refrigeration device further comprises: humidity sensor and controller assembly. The humidity sensor is arranged in the refrigerating compartment and used for acquiring the humidity in the refrigerating compartment; the controller component is connected with the humidity sensor and the semiconductor dehumidification component, and presets a humidity maximum set value, a humidity minimum set value and a dehumidification speed minimum set value in the controller component, and combines the current humidity and the current dehumidification speed in the refrigeration compartment to control the working state of the semiconductor dehumidification component.

The refrigerating equipment provided by the embodiment of the disclosure can realize the following technical effects:

The cold accumulation module is arranged in the refrigeration equipment, on one hand, cold accumulation in the cold accumulation module can be utilized to provide cold energy for the refrigerating room when power fails, the temperature in the refrigerating room is kept, a stable storage space is provided, the storage effect is improved, on the other hand, the cold accumulation module can cool the hot end of the semiconductor dehumidification component, as the refrigerating efficiency of the semiconductor dehumidification component is low, the heat discharged by the hot end is larger than the cold energy generated by the cold end, if the heat of the unbalanced hot end can cause the temperature in the refrigerating room to rise, the temperature fluctuation in the refrigerating room is larger, and therefore, the cold accumulation module is utilized to cool the hot end of the semiconductor dehumidification component, the refrigerating dehumidification efficiency of the semiconductor dehumidification component can be kept, the temperature in the refrigerating room can be kept stable, the balance of the temperature and the humidity can be kept stable, the better storage environment is kept, and the storage effect is improved.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:

FIG. 1 is a schematic view of a refrigeration appliance according to an embodiment of the present disclosure;

FIG. 2 is a front view of a refrigeration appliance provided in accordance with an embodiment of the present disclosure;

FIG. 3 is a schematic view of the internal structure of a refrigeration appliance according to an embodiment of the present disclosure;

FIG. 4 is a schematic view of a semiconductor dehumidification assembly provided in accordance with an embodiment of the present disclosure;

fig. 5 is a schematic structural view of a side of a shell provided with a hot end heat dissipation port according to an embodiment of the present disclosure;

FIG. 6 is a schematic view of a side of a housing provided with a cold end air inlet according to an embodiment of the present disclosure;

FIG. 7 is a cross-sectional view of a semiconductor dehumidification assembly provided in an embodiment of the disclosure;

FIG. 8 is a cross-sectional view of a refrigeration appliance provided in an embodiment of the present disclosure;

FIG. 9 is a side view of a semiconductor dehumidification assembly provided in an embodiment of the present disclosure;

Fig. 10 is a block diagram of a refrigeration appliance according to an embodiment of the present disclosure.

Reference numerals:

100. A refrigeration compartment; 101. a heat conductive liner; 200. a cold accumulation module; 201. a solution tank; 202. a thermal insulation plate; 203. a heat exchanger; 300. a semiconductor dehumidification assembly; 301. a semiconductor refrigeration sheet; 302. cold end radiating fin; 303. a hot side heat sink; 304. a housing; 305. a hot end heat dissipation port; 306. a cold end air inlet; 307. a heat radiation fan; 308. a condensed water collection unit; 309. a drain pipe; 310. a water receiving tray; 400. a heat conduction assembly; 401. a first heat conduction part; 402. a second heat conduction part; 500. a humidity sensor; 600. a controller assembly.

Detailed Description

So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.

The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe embodiments of the present disclosure. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.

In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are used primarily to better describe embodiments of the present disclosure and embodiments thereof and are not intended to limit the indicated device, element, or component to a particular orientation or to be constructed and operated in a particular orientation. Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the embodiments of the present disclosure will be understood by those of ordinary skill in the art in view of the specific circumstances.

In addition, the terms "disposed," "connected," "secured" and "affixed" are to be construed broadly. For example, "connected" may be in a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the embodiments of the present disclosure may be understood by those of ordinary skill in the art according to specific circumstances.

The term "plurality" means two or more, unless otherwise indicated.

In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.

The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.

It should be noted that, without conflict, the embodiments of the present disclosure and features of the embodiments may be combined with each other.

Referring to fig. 1-3, embodiments of the present disclosure provide a refrigeration appliance including: a refrigeration compartment 100, a cool storage module 200, and a semiconductor dehumidifying assembly 300. The cold accumulation module 200 is connected with the refrigerating compartment 100 through the heat conduction assembly 400; the semiconductor dehumidifying element 300 is disposed in the refrigerating compartment 100 with its hot end facing the heat conducting element 400.

By adopting the refrigeration equipment provided by the embodiment of the disclosure, the cold accumulation module 200 is arranged in the refrigeration equipment, on one hand, cold accumulation in the cold accumulation module 200 can be utilized to provide cold for the refrigeration compartment 100 when power is cut, the temperature in the refrigeration compartment 100 is kept, a stable storage space is provided, and the storage effect is improved, on the other hand, the cold accumulation module 200 can cool the hot end of the semiconductor dehumidification assembly 300, and as the refrigeration efficiency of the semiconductor dehumidification assembly 300 is low, the heat discharged by the hot end is larger than the cold amount generated by the cold end, if the heat of the unbalanced hot end can cause the temperature in the refrigeration compartment 100 to rise, so that the temperature fluctuation in the refrigeration compartment 100 is larger, the cold accumulation module 200 is utilized to cool the hot end of the semiconductor dehumidification assembly 300, the refrigeration dehumidification efficiency of the semiconductor dehumidification assembly 300 can be kept, the temperature in the refrigeration compartment 100 can be kept stable, the balance of the temperature and the humidity can be kept stable, the good storage environment can be kept, and the storage effect can be improved.

Optionally, the cold storage module 200 includes: a solution tank 201 and a thermal insulation plate 202. The solution tank 201 is arranged at one side of the refrigerating compartment 100, and cold storage medium is injected into the solution tank; the heat insulating plate 202 is provided on the side wall of the solution tank 201 near the refrigerating compartment 100. In this way, by injecting the cold storage medium into the solution tank 201, the cold storage medium is used to store cold energy, the refrigeration compartment 100 can be refrigerated in the power failure process, meanwhile, the heat insulation plate 202 is arranged between the refrigeration compartment 100 and the heat insulation plate 202, so that direct cold energy exchange between the refrigeration compartment 100 and the heat insulation plate 202 can be avoided, the cold energy of the cold storage module 200 is better utilized through the exchange of the heat conduction assembly 400 for controlling the cold energy, meanwhile, the cold energy stored in the cold storage module 200 can be used for radiating the hot end of the semiconductor dehumidification assembly 300 when the power failure is not caused, the temperature in the refrigeration compartment 100 is balanced, and the dehumidification efficiency of the semiconductor dehumidification assembly 300 is improved.

Optionally, an injection port is provided on the solution tank 201, and a heat-insulating sealing plug is provided on the injection port. Like this, can pour into the cold-storage medium into solution case 201 through the filling port in, be convenient for supplement or change the cold-storage medium in the solution case 201, adopt the heat preservation sealing plug to seal the heat preservation to the filling port simultaneously, can prevent that the cold-storage medium temperature in the solution case 201 from revealing, keep the cold-storage effect of cold-storage medium better.

Optionally, the cold storage medium is water. Like this, adopt water as cold-storage medium, the cost is lower, and cold-storage efficiency is higher, and cold-storage and the speed of putting cold are faster, improve cold-storage module 200 holistic cold-storage effect, improve user's use experience.

As shown in fig. 3, optionally, a heat exchanger 203 is disposed within the solution tank 201, and the heat exchanger 203 is connected to a heat conduction assembly 400. In this way, the heat exchanger 203 is disposed in the solution tank 201, so that heat exchange with the cold storage medium in the solution tank 201 can be better performed, the cold energy of each position in the solution tank 201 is fully utilized, the utilization efficiency of the cold energy in the solution tank 201 is improved, and the cold energy of the cold storage medium stored in the solution tank 201 is better conducted to the heat conduction assembly 400.

Alternatively, the heat exchanger 203 is a fin heat exchanger 203 and is flooded inside the solution tank 201. In this way, by providing the fin heat exchanger 203 inside the solution tank 201, the fin heat exchanger 203 can be distributed inside the solution tank 201 more effectively, and can exchange heat with various positions in the solution tank 201 sufficiently, thereby improving the heat exchange efficiency and more fully utilizing the cooling capacity in the solution tank 201.

Alternatively, the heat exchanger 203 is the same material as the heat conduction assembly 400. In this way, the heat exchanger 203 can exchange heat with the heat conduction assembly 400 better, the utilization rate of the cold energy in the solution tank 201 is improved, and the heat conduction efficiency is maintained better.

It will be appreciated that both the heat exchanger 203 and the heat transfer assembly 400 are made of aluminum. In this way, the aluminum material has higher heat conduction efficiency, can improve the cold energy conduction efficiency of the heat exchanger 203 to the heat conduction assembly 400, and the heat exchanger 203 and the heat conduction assembly 400 are made of the same material, so that the heat conduction efficiency between the heat exchanger 203 and the heat conduction assembly 400 is more balanced, the conduction effect between the heat exchanger 203 and the heat conduction assembly 400 is maintained, and the cold energy in the cold storage module 200 is fully applied.

Optionally, the heat conduction assembly 400 includes: a first heat conduction portion 401 and a second heat conduction portion 402. The first heat conduction part 401 covers the inner side wall of the refrigerating compartment 100; the second heat conduction part 402 is disposed at one side of the semiconductor dehumidifying assembly 300. In this way, the first heat conducting portion 401 covers the inner side wall of the refrigeration compartment 100, so that the first heat conducting portion 401 can be used for providing cold energy for the refrigeration compartment 100, the low-temperature effect in the refrigeration compartment 100 can be kept conveniently in the power failure process, the second heat conducting portion 402 corresponds to the semiconductor dehumidification assembly 300, the heat of the semiconductor dehumidification assembly 300 can be dissipated, the heat of the semiconductor dehumidification assembly 300 can be balanced, the temperature fluctuation in the refrigeration compartment 100 is avoided, the dehumidification effect of the semiconductor dehumidification assembly 300 is improved, and the storage effect in the refrigeration compartment 100 is better kept.

Optionally, the inner side wall of the refrigeration compartment 100 is a heat-conducting liner 101, and the first heat-conducting portion 401 is connected to the heat-conducting liner 101. In this way, the cooling capacity of the cold storage module 200 can be transferred into the heat conductive liner 101 through the first heat conductive portion 401, and the cooling capacity can be uniformly supplied into the cooling compartment 100 through the heat conductive liner 101, thereby improving the uniformity of the temperature in the cooling compartment 100.

Optionally, the first heat conducting portion 401 is a grid structure. In this way, the first heat conduction portion 401 having the mesh structure can more uniformly transfer the cooling capacity, and the cooling capacity in the cooling compartment 100 can be kept uniform.

Alternatively, the first heat conductive portion 401 is embedded and disposed on the heat conductive liner 101. In this way, the heat conduction efficiency between the first heat conduction part 401 and the heat conduction liner 101 can be improved, and embedding the first heat conduction part 401 in the heat conduction liner 101 can reduce the space occupation of the first heat conduction part 401, and keep the heat conduction liner 101 flat.

Alternatively, the second heat conducting part 402 has a cylindrical structure, one end of which is connected to the heat exchanger 203 in the cold accumulation module 200, and the other end of which extends to one side of the semiconductor dehumidifying assembly 300. In this way, the cold energy in the cold accumulation module 200 can be transferred to the semiconductor dehumidifying assembly 300, so that the heat of the hot end of the semiconductor dehumidifying assembly 300 can be better dissipated, the dehumidifying efficiency of the semiconductor dehumidifying assembly 300 can be improved, and the temperature in the refrigerating compartment 100 can be better balanced.

Alternatively, the length of the second heat conductive part 402 is related to the power of the semiconductor dehumidifying assembly 300. In this way, the greater the length of the second heat conducting portion 402, the lower the heat conducting efficiency, and the higher the power of the semiconductor dehumidifying assembly 300, the greater the difference between the heat dissipated from the hot end and the cold end, so that the length of the second heat conducting portion 402 and the power of the semiconductor dehumidifying assembly 300 are set to be related, so that the heat dissipated from the hot end of the semiconductor dehumidifying assembly 300 can be balanced better, and the temperature balance in the refrigerating compartment 100 can be maintained.

Alternatively, the greater the power of the semiconductor dehumidifying assembly 300, the smaller the length of the second heat conductive part 402. In this way, the greater the power of the semiconductor dehumidifying assembly 300, the greater the difference between the generated heat and the cooling capacity thereof, and the smaller the length of the second heat conducting portion 402 is, the higher the conduction efficiency of the cooling capacity is, and the more cooling capacity can be used to balance the heat generated at the hot end of the semiconductor dehumidifying assembly 300, so as to maintain the temperature balance in the cooling compartment 100.

As shown in fig. 4, the semiconductor dehumidifying assembly 300 optionally includes: semiconductor refrigeration fins 301, cold side heat sink fins 302, and hot side heat sink fins 303. The cold end radiating fin 302 covers the cold end of the semiconductor refrigerating fin 301; the hot side heat sink 303 covers the hot side of the semiconductor refrigeration sheet 301. In this way, the cold end heat sink 302 and the hot end heat sink 303 are used to dissipate heat from the cold end and the hot end of the semiconductor refrigeration sheet 301, so as to increase the heat exchange speed between the cold end and the hot end of the semiconductor refrigeration sheet 301, improve the refrigeration effect of the semiconductor refrigeration sheet 301, and further improve the dehumidification effect of the semiconductor dehumidification assembly 300.

Alternatively, one end of the second heat conductive part 402 is directly connected to the hot side heat sink 303. In this way, the second heat conduction part 402 can be directly used to dissipate heat from the hot end heat sink 303, and the heat dissipation efficiency can be improved by adopting a direct contact mode.

Optionally, one end of the second heat conducting portion 402 is opposite to the hot end heat sink 303, and has a set distance from the hot end heat sink 303. In this way, a certain installation space can be reserved between the second heat conducting part 402 and the hot end radiating fin 303, so that the installation of the structures such as the radiating fan 307 is facilitated.

As shown in fig. 5-6, the semiconductor dehumidifying assembly 300 optionally includes: a housing 304. The semiconductor refrigerating fin 301, the cold-end radiating fin 302 and the hot-end radiating fin 303 are all arranged in the shell 304, a hot-end radiating opening 305 is arranged on the shell 304 corresponding to the hot-end radiating fin 303, and a cold-end air inlet 306 is arranged on the shell 304 corresponding to the cold-end radiating fin 302. In this way, the semiconductor refrigerating fin 301, the cold-end radiating fin 302 and the hot-end radiating fin 303 are wrapped by the shell 304, the hot-end radiating opening 305 is formed at the position corresponding to the hot-end radiating fin 303, and the cold-end air inlet 306 is formed at the position corresponding to the cold-end radiating fin 302, so that air flow can better pass through the cold-end radiating fin 302 and the hot-end radiating fin 303, water vapor in the air flow is better condensed under the action of the cold quantity of the cold-end radiating fin 302, dehumidification is better performed, and the air flow in the refrigerating compartment 100 is subjected to humidity adjustment.

Optionally, the housing 304 is a thermal enclosure. In this way, the shell 304 has heat-insulating capability, so that heat of the hot-end radiating fin 303 can be prevented from being directly dissipated into the refrigerating compartment 100, heat can be gathered and transferred to the second heat conduction part 402, temperature fluctuation in the refrigerating compartment 100 can be better prevented, and temperature balance in the refrigerating compartment 100 can be improved.

Optionally, a heat dissipation fan 307 is disposed at the hot end heat dissipation port 305, and the heat dissipation fan 307 is configured to emit air toward the heat conduction assembly 400. In this way, the heat dissipation fan 307 drives the air flow, and the air flow blown out from the hot end heat dissipation port 305 is blown to the heat conduction assembly 400, so that the air flow is offset with the cold energy transferred from the heat conduction assembly 400, the temperature balance in the refrigeration compartment 100 can be maintained, the temperature fluctuation is reduced, and the stability of the storage environment is improved.

Optionally, a set distance between one end of the second heat conducting portion 402 and the hot end heat sink 303 is greater than or equal to 20% of the diameter of the heat dissipating fan 307 and less than or equal to 5% of the diameter of the heat dissipating fan 307. In this way, the influence of the exhaust side barrier on the performance of the cooling fan 307 can be reduced, noise is reduced, and if the distance is too large, the effective volume of the refrigerator can be wasted, so that the set distance is set between 5% and 20% of the diameter of the cooling fan 307, the performance of the cooling fan 307 can be ensured, and the waste of space can be avoided.

As shown in fig. 7-8, optionally, a condensate water collecting portion 308 is provided at the lower end of the cold end fin 302, and the condensate water collecting portion 308 communicates with a water receiving tray 310 through a drain pipe 309. In this way, the condensed water generated on the cold-end cooling fin 302 can be timely collected and timely discharged, so that the frosting of the condensed water is avoided, the heat dissipation effect of the cold-end cooling fin 302 is affected, and the dehumidification efficiency of the semiconductor dehumidification assembly 300 can be improved.

Alternatively, the condensed water collecting portion 308 is integrally formed with the housing 304. In this way, the stability of the connection between the condensed water collecting portion 308 and the case 304 is maintained, and condensed water generated inside the case 304 is better collected, thereby preventing frost from being generated due to accumulation of condensed water.

Optionally, the condensate water collecting unit 308 has a funnel structure, and is located at the bottom of the cold end fin 302, and the drain 309 is in communication with the bottom of the condensate water collecting unit 308. In this way, the condensed water is collected by the condensed water collecting portion 308 with the funnel structure, and the collected condensed water can be quickly discharged by the drain pipe 309 at the bottom of the condensed water collecting portion, so that the condensed water is prevented from volatilizing again or generating condensation, and the humidity in the refrigeration compartment 100 is effectively reduced.

Optionally, the refrigeration device further comprises: the compressor and the condenser that communicates with the compressor, and be equipped with the evaporation pan on the condenser, water collector 310 sets up on the evaporation pan, is connected with the evaporation pan. In this way, the condensed water collected in the refrigerating compartment 100 is transferred to the evaporation pan, and the condensed water is evaporated into steam by the evaporation pan without discharging the condensed water.

As shown in fig. 9-10, optionally, the refrigeration appliance further includes: humidity sensor 500 and controller assembly 600. The humidity sensor 500 is disposed in the refrigeration compartment 100 and is used for acquiring the humidity in the refrigeration compartment 100; the controller assembly 600 is connected to the humidity sensor 500 and the semiconductor dehumidifying assembly 300, and preset a maximum humidity set value, a minimum humidity set value and a minimum dehumidifying speed set value therein, and controls the operating state of the semiconductor dehumidifying assembly 300 in combination with the current humidity and the current dehumidifying speed in the refrigerating compartment 100. In this way, the humidity sensor 500 is used to detect the humidity in the refrigerating compartment 100, and thus the working state of the semiconductor dehumidifying assembly 300 is controlled, so that the temperature balance in the refrigerating compartment 100 can be maintained, and the dehumidifying speed is calculated according to the humidity change in the refrigerating compartment 100, so as to determine whether the cold-end radiating fin 302 is frosted or not, and control the semiconductor dehumidifying assembly 300 to enter the defrosting mode, so as to maintain the dehumidifying efficiency of the semiconductor dehumidifying assembly 300.

Optionally, a humidity sensor 500 is provided at the cold end air inlet 306. In this way, under the action of the heat dissipation fan 307, the air flow circulation in the refrigeration compartment 100 enters from the cold end air inlet 306, so that the humidity sensor 500 is arranged at the cold end air inlet 306 to enable the flowing air flow to pass through the humidity sensor 500, so that the humidity in the refrigeration compartment 100 can be better detected, and the accuracy of detecting the humidity in the refrigeration compartment 100 is improved.

Alternatively, the semiconductor dehumidifying assembly 300 is controlled to be started when the humidity in the refrigerating compartment 100 is greater than a humidity maximum set value, and the semiconductor dehumidifying assembly 300 is controlled to be closed when the humidity in the refrigerating compartment 100 is less than a humidity minimum set value. In this way, dehumidification is started when the humidity in the cooling compartment 100 is excessively high, and the semiconductor dehumidification unit 300 is controlled to be turned off after the humidity value is reduced, so that the humidity in the cooling compartment 100 can be controlled between the humidity maximum setting and the humidity minimum setting.

Alternatively, in the case where the semiconductor dehumidifying assembly 300 is started, the current dehumidifying speed is calculated, and in the case where it is determined that the current dehumidifying speed is less than the minimum set value of the dehumidifying speed, the semiconductor dehumidifying assembly 300 is controlled to enter the defrost mode. In this way, by detecting the dehumidification speed, when the dehumidification speed is reduced, it is indicated that there may be a risk of frosting at this time, and the dehumidification efficiency is reduced, so that the semiconductor dehumidification assembly 300 is controlled to enter the defrosting mode, and the semiconductor dehumidification assembly 300 is kept at a high dehumidification efficiency.

As can be appreciated, the defrosting mode of the semiconductor dehumidifying assembly 300 means that the hot side and the cold side thereof are controlled to reversely operate for a first set period of time, and then the dehumidifying mode is continuously entered after stopping the operation for a second set period of time. Therefore, the operation is stopped for a second set period after defrosting is finished, enough dripping time can be given to water drops formed by defrosting, and the phenomenon that excessive moisture is condensed on a cold end to reduce the dehumidification efficiency when dehumidification is continued after defrosting is finished is avoided.

The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may include structural and other modifications. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A refrigeration appliance, comprising:

A refrigeration compartment (100);

The cold accumulation module (200) is connected with the refrigeration compartment (100) through the heat conduction assembly (400);

the semiconductor dehumidification component (300) is arranged in the refrigeration compartment (100), and the hot end of the semiconductor dehumidification component faces the heat conduction component (400).

2. The refrigeration appliance of claim 1, wherein the cold storage module (200) comprises:

A solution tank (201) which is arranged at one side of the refrigeration compartment (100) and is internally injected with a cold storage medium;

and the heat insulation plate (202) is arranged on the side wall of the solution tank (201) close to the refrigeration compartment (100).

3. A cold storage apparatus according to claim 2, characterized in that a heat exchanger (203) is arranged in the solution tank (201), the heat exchanger (203) being connected to the heat conducting assembly (400).

4. The refrigeration appliance of claim 1 wherein the heat conduction assembly (400) comprises:

a first heat conduction part (401) which covers the inner side wall of the refrigeration compartment (100);

And a second heat conduction part (402) arranged on one side of the semiconductor dehumidification assembly (300).

5. The refrigeration appliance of claim 4 wherein the length of the second thermally conductive section (402) is related to the power of the semiconductor dehumidification assembly (300).

6. The refrigeration appliance of any one of claims 1 to 5 wherein the semiconductor dehumidification assembly (300) comprises:

A semiconductor cooling sheet (301);

A cold end radiating fin (302) covering the cold end of the semiconductor refrigerating fin (301);

And the hot end radiating fin (303) is covered on the hot end of the semiconductor refrigerating fin (301).

7. The refrigeration appliance of claim 6 wherein the semiconductor dehumidification assembly (300) includes:

The semiconductor refrigerating fin (301), the cold-end radiating fin (302) and the hot-end radiating fin (303) are arranged in the shell (304), a hot-end radiating opening (305) is formed in the shell (304) corresponding to the hot-end radiating fin (303), and a cold-end air inlet (306) is formed in the shell (304) corresponding to the cold-end radiating fin (302).

8. The refrigeration appliance of claim 7 wherein a heat sink fan (307) is provided at the hot side heat sink (305), and the heat sink fan (307) is vented toward the heat transfer assembly (400).

9. The refrigeration appliance of claim 6 wherein a condensate water collecting portion (308) is provided at a lower end of the cold end fin (302), and the condensate water collecting portion (308) is communicated with the water receiving tray (310) through a drain pipe (309).

10. The refrigeration appliance of claim 6 further comprising:

A humidity sensor (500) which is arranged in the refrigeration compartment (100) and is used for acquiring the humidity in the refrigeration compartment (100);

The controller component (600) is connected with the humidity sensor (500) and the semiconductor dehumidification component (300), and is provided with a humidity maximum set value, a humidity minimum set value and a dehumidification speed minimum set value, and the working state of the semiconductor dehumidification component (300) is controlled by combining the current humidity and the current dehumidification speed in the refrigeration compartment (100).