CN211084550U - Refrigerator with a door - Google Patents

Abstract

The utility model provides a refrigerator. Wherein this refrigerator includes: the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body; the semiconductor refrigeration system is configured to provide cold energy to the first storage space; the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and the air supply assembly is arranged in the first storage space and comprises a front cover, a rear cover and an axial flow fan, the axial flow fan is arranged in an air channel defined by the front cover and the rear cover and is configured to transmit cold energy generated by the semiconductor refrigeration system to the first storage space, the positions of the front cover and the rear cover, which correspond to the axial flow fan, are respectively provided with an air supply opening and an air suction opening, and the lower part of the front side of the front cover is provided with a return air opening. The utility model discloses a refrigerator, the structure and the semiconductor refrigerating system phase-match of air supply subassembly transmit the cold volume that semiconductor refrigerating system produced to first storing space smoothly, make first storing space realize the deep cooling.

Description

Refrigerator with a door

Technical Field

The utility model relates to a household electrical appliances field especially relates to a refrigerator.

Background

With the increasing development of society and the continuous improvement of living standard of people, the pace of life of people is faster and faster, and a lot of food can be purchased and stored at one time. In order to ensure the storage effect of food, a refrigerator has become one of household appliances indispensable to people's daily life.

The current refrigerators are generally classified into compression refrigeration refrigerators and semiconductor refrigeration refrigerators according to the type of a refrigeration system. The temperature regulation precision of the compression refrigeration refrigerator is lower, generally +/-3.5 ℃, and the temperature regulation precision of the semiconductor refrigeration refrigerator can reach +/-0.1 ℃. Although the temperature adjusting precision of the semiconductor refrigeration refrigerator is high, the following defects exist: the semiconductor chip in the semiconductor refrigeration system is easily influenced by the external environment temperature, and when the external environment temperature is very high, the heat dissipation of the hot end of the semiconductor chip is difficult, so that the temperature of the hot end is increased, and the refrigerating capacity is reduced. Because the efficiency of the semiconductor refrigeration system is low, the semiconductor refrigeration system can only be applied to small-volume common refrigeration products or can only be used for radiating certain key components, and low-temperature refrigeration cannot be realized. In addition, when the semiconductor refrigeration system is applied to small-volume common refrigeration products, the conventional air duct structure cannot meet the requirement for arranging the semiconductor refrigeration system due to the small volume of the refrigeration products.

SUMMERY OF THE UTILITY MODEL

One object of the utility model is to make the air supply subassembly of refrigerator match with semiconductor refrigerating system.

The utility model discloses a further purpose is to realize the specific storing space degree of depth refrigeration of refrigerator, satisfies the storage requirement of eating the material.

Particularly, the utility model provides a refrigerator, include: the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body; the semiconductor refrigeration system is configured to provide cold energy to the first storage space; the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and the air supply assembly is arranged in the first storage space and comprises a front cover, a rear cover and an axial flow fan, the axial flow fan is arranged in an air channel defined by the front cover and the rear cover and is configured to transmit cold energy generated by the semiconductor refrigeration system to the first storage space, the positions of the front cover and the rear cover, which correspond to the axial flow fan, are respectively provided with an air supply opening and an air suction opening, and the lower part of the front side of the front cover is provided with a return air opening.

Optionally, the semiconductor refrigeration system comprises: the semiconductor chip is arranged between the hot heat exchanger and the cold heat exchanger, the semiconductor chip is provided with a hot end and a cold end, the hot heat exchanger is partially adhered to the hot end, and the cold heat exchanger is partially adhered to the cold end.

Optionally, the compression refrigeration system comprises: compressor, condenser, capillary and evaporimeter, and hot heat exchanger sets up between capillary and evaporimeter, and the low temperature refrigerant absorbs heat when flowing through hot heat exchanger, reduces the temperature of hot junction, and the temperature of cold junction also reduces thereupon, and the cold volume conduction of cold junction is to the cold heat exchanger after axial fan transmits the cold volume of cold heat exchanger to first storing space.

Optionally, the cold heat exchanger is disposed at the rear side of the rear cover, and a side of the cold heat exchanger facing the rear cover is provided with a plurality of fins, and a longitudinal channel is formed between two adjacent fins, so that the air flow exchanges heat through the cold heat exchanger.

Optionally, the height of the middle fins with the preset number is lower than the height of the fins on the left and right sides, and the air supply assembly further comprises: the first shielding piece is arranged on the front side of the fins with the preset number; and the two second shielding pieces are respectively arranged at the left side and the right side of the cold heat exchanger.

Optionally, the left side and the right side of the air suction opening are both provided with a protruding structure, so that a certain distance is formed between the first shielding piece and the air suction opening.

Optionally, the air supply assembly further comprises: the heat preservation piece is arranged in the air duct, and a channel is formed in the middle of the heat preservation piece so as to be provided with an axial flow fan.

Optionally, the bottom wall of the channel below the axial flow fan is an arc surface, and a water outlet is formed in the lowest position of the arc surface so as to discharge residual moisture at the axial flow fan during defrosting.

Optionally, the air return openings are provided in plurality, and the air return opening in the middle is smaller than the air return openings on the left and right sides.

Optionally, the air supply outlet is the same size as the axial flow fan; and a plurality of cutting ribs are arranged at the air supply opening so as to supply air uniformly.

The utility model discloses a refrigerator, include: the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body; the semiconductor refrigeration system is configured to provide cold energy to the first storage space; the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and the air supply assembly is arranged in the first storage space and comprises a front cover, a rear cover and an axial flow fan, the axial flow fan is arranged in an air channel defined by the front cover and the rear cover and is configured to transmit cold energy generated by the semiconductor refrigeration system to the first storage space, the positions of the front cover and the rear cover, which correspond to the axial flow fan, are respectively provided with an air supply opening and an air suction opening, and the lower part of the front side of the front cover is provided with a return air opening. The structure of the air supply assembly is matched with the semiconductor refrigerating system, so that the cold energy generated by the semiconductor refrigerating system can be smoothly transmitted to the first storage space. In addition, compression refrigerating system reduces the temperature of semiconductor refrigerating system's hot junction, can promote semiconductor refrigerating system to provide cold volume to first storing space, and then makes first storing space realize deep refrigeration, satisfies the storage requirement of eating the material, promotes the storage effect of eating the material.

Further, the utility model discloses a refrigerator, the concrete setting of the protruding structure of the inlet scoop both sides of first shielding piece, second shielding piece, back lid can guarantee that the return air passes through cold heat exchanger heat transfer completely, avoids the return air not to pass through other routes through cold heat exchanger heat transfer and sends to first storing space. A certain distance is reserved between the first shielding piece and the air suction opening, so that the air after heat exchange can smoothly enter the air channel through the air suction opening, and then is blown to the first storage space from the air supply opening through the axial flow fan. The whole structure of the air supply assembly occupies a small volume, and air circulation can be guaranteed to be smoothly carried out.

Further, the utility model discloses a refrigerator, the low temperature refrigerant of compression refrigerating system absorbs heat when flowing through hot heat exchanger, reduces the temperature in hot junction, and the temperature of cold junction reduces thereupon, and the cold volume conduction of cold junction is to the cold heat exchanger after axial fan with cold heat exchanger's cold volume transmission to first storing space. Combine traditional compression refrigerating system of refrigerator, take away the heat of heat exchanger fast through the low temperature refrigerant, maintain the hot junction in low temperature environment, with the help of the self difference in temperature of semiconductor chip hot junction and cold junction, realize that the cold junction temperature further descends, the strong convection mode heat transfer of rethread axial fan realizes first storing space and realizes deep refrigeration, the energy consumption is low among the refrigeration process, and semiconductor refrigerating system is by electric energy direct conversion energy, effectively avoid producing the noise, promote user's use and experience.

The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

fig. 1 is a schematic structural view of a refrigerator according to an embodiment of the present invention;

fig. 2 is a schematic view of a connection structure of a compression refrigeration system and a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a hot heat exchanger of a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

FIG. 5 is an exploded view of the thermal heat exchanger shown in FIG. 4;

fig. 6 is a schematic view of a semiconductor refrigeration system in a refrigerator providing cooling capacity to a first storage space according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a semiconductor refrigeration system and an air supply assembly in a refrigerator according to an embodiment of the present invention;

FIG. 8 is a schematic view of the semiconductor refrigeration system and blower assembly of FIG. 7 from another perspective;

fig. 9 is a front view of an air supply assembly in a refrigerator according to an embodiment of the present invention;

fig. 10 is a rear view of an air supply assembly in a refrigerator according to an embodiment of the present invention; and

fig. 11 is an exploded view of an air supply assembly in a refrigerator according to an embodiment of the present invention.

Detailed Description

The embodiment provides a refrigerator, wherein the structure of an air supply assembly is matched with a semiconductor refrigerating system, so that cold energy generated by the semiconductor refrigerating system can be smoothly transmitted to a first storage space; the temperature of the hot end of the semiconductor refrigerating system is reduced through the compression refrigerating system, the semiconductor refrigerating system is promoted to provide cold energy to the first storage space, deep refrigeration is achieved through the first storage space, the storage requirement of food materials is met, and the storage effect of the food materials is improved. Fig. 1 is a schematic structural diagram of a refrigerator 100 according to an embodiment of the present invention, fig. 2 is a schematic structural diagram of a connection structure between a compression refrigeration system 140 and a semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention, fig. 3 is a schematic structural diagram of the semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention, fig. 4 is a schematic structural diagram of a heat exchanger 132 of the semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention, fig. 5 is an exploded schematic structural diagram of the heat exchanger 132 shown in fig. 4, and fig. 6 is a schematic structural diagram of the semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention providing cooling capacity to a first storage space 111. As shown in fig. 1 to 6, the refrigerator 100 of the present embodiment may generally include: a box 110, a semiconductor refrigeration system 130, a compression refrigeration system 140, and an air supply assembly 170.

Wherein at least a first storage space 111 and a second storage space 112 are defined inside the case 110. In fact, the number and structure of the storage spaces can be configured as required. And the storage space can be configured into a refrigerating space, a freezing space, a temperature changing space or a fresh-keeping space according to different purposes. Each storage space may be divided into a plurality of storage regions by a partition plate, and the articles may be stored by a rack or a drawer. As shown in fig. 1, the refrigerator 100 of the present embodiment may have four storage spaces defined inside the cabinet 110: a first storage space 111, a second storage space 112, a third storage space 113 and a fourth storage space 114. The second storage space 112 may be located at the top and may be a refrigerating space; the first storage space 111 and the third storage space 113 may be arranged below the second storage space 112 side by side, the first storage space 111 may be a deep cooling space, and the third storage space 113 may be a temperature changing space; the fourth storage space 114 may be disposed at the lowermost portion to be a freezing space.

The refrigerator 100 of the present embodiment may further include: the door 120 is pivotally disposed on a front surface of the cabinet 110, so that a user can open and close the storage space. The door bodies 120 may be disposed corresponding to the storage spaces, that is, each storage space corresponds to one or more door bodies 120. The door 120 may be opened by pivoting or may be opened by sliding, for example, the door 120 corresponding to the second storage space 112 is opened by pivoting, and the rest of the storage spaces may be opened by sliding.

The semiconductor refrigeration system 130 can be configured to provide cooling to the first storage space 111. The compression refrigeration system 140 can be configured to provide refrigeration to the second storage space 112. Since the refrigerator 100 of the present embodiment is further provided with the third storage space 113 and the fourth storage space 114 in addition to the first storage space 111 and the second storage space 112, the other storage spaces can be provided with the cooling capacity by the compression refrigeration system 140 in addition to the first storage space 111 provided with the cooling capacity by the semiconductor refrigeration system 130.

It should be noted that the compression refrigeration system 140 provides different cooling capacities to the storage spaces, so that the temperatures in the storage spaces are different. Wherein the temperature in the refrigerated space is generally between 2 ℃ and 10 ℃, preferably between 4 ℃ and 7 ℃. The temperature in the refrigerated space is typically in the range of-22 ℃ to-14 ℃. The optimal storage temperatures of different types of articles are different, and thus the storage spaces suitable for storage are also different. For example, fruits and vegetables are suitable for storage in a refrigerated space or a fresh-keeping space, while meat is suitable for storage in a refrigerated space. The temperature changing space can be internally provided with a heating device for heating food.

More importantly, the compression refrigeration system 140, in addition to providing cooling to the storage space, may be configured to: the temperature of the hot side 136 of the semiconductor refrigeration system 130 is reduced. The hot side 136 of the semiconductor refrigeration system 130 may have difficulty dissipating heat, which may cause the temperature of the hot side 136 to increase and thus reduce the cooling capacity. Compression refrigeration system 140 in time reduces the temperature of hot junction 136 of semiconductor refrigeration system 130, can promote semiconductor refrigeration system 130 to provide cold volume to first storing space 111, and then makes first storing space 111 realize deep cooling, satisfies the storage requirement of eating the material, promotes the storage effect of eating the material.

As shown in fig. 6, the air supply assembly 170 may be disposed in the first storage space 111, and the air supply assembly 170 includes a front cover 171, a rear cover 172, and an axial flow fan 173. The axial flow fan 173 is disposed in the air duct 160 defined by the front cover 171 and the rear cover 172, and configured to transmit the cold energy generated by the semiconductor refrigeration system 130 to the first storage space 111, the positions of the front cover 171 and the rear cover 172 corresponding to the axial flow fan 173 are respectively provided with an air supply opening 161 and an air suction opening 163, and the lower portion of the front side of the front cover 171 is provided with an air return opening 162.

The box body 110 may further include an inner container 115, and the air supply assembly 170 may be disposed at a back of the inner container 115 of the first storage space 111. And "front" and "rear" of the front cover 171 and the rear cover 172 are directional descriptions in a normal use state of the refrigerator 100, that is, the front cover 171 is closer to the door body 120 than the rear cover 172. Further, a lower portion of the front cover 171 on the front side is opened with a return air opening 162, and the lower portion is substantially below the axial flow fan 173 with respect to the axial flow fan 173, the return air opening 162. The positions of the air supply opening 161, the air return opening 162 and the air suction opening 163 are matched with the air inlet and outlet modes of the axial flow fan 173, so that air circulation is promoted. In the refrigerator 100 of the embodiment, the structure of the air supply assembly 170 is matched with the semiconductor refrigeration system 130, so that the cold energy generated by the semiconductor refrigeration system 130 can be smoothly transmitted to the first storage space 111.

As shown in fig. 2 and 3, the semiconductor cooling system 130 may include: a semiconductor chip 131, a hot heat exchanger 132, and a cold heat exchanger 133. Wherein the semiconductor chip 131 is disposed between the hot heat exchanger 132 and the cold heat exchanger 133, and the semiconductor chip 131 has a hot end 136 and a cold end 137, the hot heat exchanger 132 is partially bonded to the hot end 136, and the cold heat exchanger 133 is partially bonded to the cold end 137.

In a preferred embodiment, the semiconductor refrigeration system 130 may further include: a thermally conductive layer 134 and a thermally insulating layer 135. The heat conducting layer 134 is made of a material with a high thermal conductivity coefficient, the hot heat exchanger 132 is partially adhered to the hot end 136 through the heat conducting layer 134, and the cold heat exchanger 133 is partially adhered to the cold end 137 through the heat conducting layer 134. Good heat transfer between the hot heat exchanger 132 and the hot end 136, and between the cold end 137 and the cold heat exchanger 133 is possible due to the high thermal conductivity of the thermally conductive layer 134. Specifically, the material of the heat conductive layer 134 may include, but is not limited to: heat-conducting silicone grease, liquid metal.

The thermal insulation layer 135 is made of a material with low thermal conductivity, and the thermal insulation layer 135 is disposed at a position other than the semiconductor chip 131 between the hot heat exchanger 132 and the cold heat exchanger 133, and configured to insulate the hot heat exchanger 132 and the cold heat exchanger 133. Since the semiconductor chip 131 is generally thin, the hot heat exchanger 132 and the cold heat exchanger 133 are closer to each other, and the thermal insulation layer 135 is added between the hot heat exchanger 132 and the cold heat exchanger 133 except the semiconductor chip 131, so that the heat conduction between the hot heat exchanger 132 and the cold heat exchanger 133 can be effectively prevented from affecting the cooling effect. Specifically, the material of the thermal insulation layer 135 may include, but is not limited to: foam, foaming material, PE cotton and aerogel.

As shown in fig. 2, the compression refrigeration system 140 may include: the compressor 141, the condenser 142, the capillary tube 143, and the evaporator 144, and the hot heat exchanger 132 is disposed between the capillary tube 143 and the evaporator 144, when the low-temperature refrigerant flows through the hot heat exchanger 132, the low-temperature refrigerant absorbs heat to lower the temperature of the hot end 136, the temperature of the cold end 137 is lowered accordingly, and the cold energy of the cold end 137 is transmitted to the cold heat exchanger 133 and then transmitted to the first storage space 111 by the axial fan 173 after the cold end 137 is transmitted to the cold heat exchanger 133. As shown in fig. 2 to 5, the heat exchanger 132 is connected to the capillary tube 143 through the liquid inlet tube 151 and to the evaporator 144 through the liquid outlet tube 152.

The heat exchanger 132 is a flat plate and has a groove 155 formed therein, and a low-temperature refrigerant flows into the groove 155 through the liquid inlet pipe 151, flows along the groove 155, and flows out through the liquid outlet pipe 152. Preferably, the groove 155 is shaped as a curve with a predetermined number of inflection points, so that the flowing area of the low-temperature refrigerant inside the heat exchanger 132 can be increased, the heat exchange efficiency can be improved, and the temperature of the hot end 136 can be effectively reduced. In one embodiment, as shown in fig. 4 and 5, the heat exchanger 132 may include a cover plate 153 and a back plate 154, the back plate 154 has a groove 155, and the cover plate 153 covers the groove 155. In other embodiments, the interior of the heat exchanger 132 may also be perforated or have copper tubes or other forms for flowing the low-temperature refrigerant therein.

In one particular embodiment, after reducing the temperature of hot end 136, the temperature of cold end 137 is reduced to a first temperature value. The refrigeration principle of the semiconductor refrigeration system 130 mainly utilizes the peltier effect: when current passes through a loop formed by different conductors, in addition to generating irreversible joule heat, heat absorption and heat release phenomena respectively occur at joints of different conductors along with different current directions. Semiconductor chip 131 creates a temperature difference between hot end 136 and cold end 137 after being powered on, so that after the temperature of hot end 136 is reduced, the temperature of cold end 137 is reduced to a first temperature value.

Further, after the temperature of cold end 137 is subsequently reduced to the first temperature value, the cold energy of cold end 137 is conducted to cold heat exchanger 133. It is noted that the cold end 137 and the cold heat exchanger 133 are disposed at a side close to the first storage space 111 so as to lower the temperature of the first storage space 111. Specifically, the axial flow fan 173 may be provided at a corresponding position with an air supply outlet 161 to supply cold to the first storage space 111; an air return port 162 may be provided below the axial fan 173 to return the air with the increased temperature to the semiconductor refrigeration system 130, thus forming an air circulation.

In a preferred embodiment, after the cold energy of the cold heat exchanger 133 is transmitted to the first storage space 111, the temperature of the first storage space 111 is reduced to a second temperature value, wherein the first temperature value is lower than the second temperature value, and the second temperature value is-30 ℃ to-60 ℃. That is, there is a certain loss in the process of transferring the cold energy of the cold end 137 to the first storage space 111, for example, the first temperature value may be 5 ℃ lower than the second temperature value. The second temperature value of the first storage space 111 can reach-30 ℃ to-60 ℃, and the storage requirements of some special food materials can be met.

One embodiment is described below: when the compression refrigeration system 140 operates, a low-temperature refrigerant absorbs heat when flowing through the hot heat exchanger 132, the hot heat exchanger 132 and the hot end 136 are adhered through the heat conduction layer 134 to realize cooling of the hot end 136, the semiconductor chip 131 enables the hot end 136 and the cold end 137 to generate temperature difference due to the peltier effect when being electrified, the temperature of the cold end 137 is reduced to a first temperature value, cold energy of the cold end 137 is conducted to the cold heat exchanger 133 through the heat conduction layer 134, the cold energy of the cold heat exchanger 133 is transmitted to the first storage space 111 by the axial fan 173 in the air duct 160, the temperature inside the cold heat exchanger is reduced to a second temperature value, and a cryogenic function is realized.

It should be noted that when the semiconductor chip 131 is not powered on, the compression refrigeration system 140 operates normally, the low-temperature refrigerant still flows through the hot heat exchanger 132 to cool the hot end 136, and although there is no temperature difference between the hot end 136 and the cold end 137, the cold energy may still be transmitted to the first storage space 111 through the cold end 137, the cold heat exchanger 133, and the axial fan 173 in sequence. Although the amount of cooling energy transmitted to the first storage space 111 is less than that when the semiconductor chip 131 is powered on, the first storage space 111 can be used as a normal freezing space without consuming extra electric energy. In addition, when the compression refrigeration system 140 stops operating, the hot end 136 and the cold end 137 can be exchanged by applying a reverse voltage to the semiconductor chip 131, so that the cold heat exchanger 133 can be heated and defrosted.

It is emphasized that the temperature difference between the hot end 136 and the cold end 137 is not constant, and in low ambient temperatures, the temperature difference may be 20 c to 30 c, and in normal ambient conditions, the temperature difference may be greater. That is, in a low temperature environment, it may be difficult to achieve a low temperature of the cold end 137, and thus it may be difficult to achieve a cryogenic function in the storage space. Refrigerator 100 of this embodiment, combine traditional compression refrigerating system 140, take away the heat of hot heat exchanger 132 fast through the low temperature refrigerant, maintain hot junction 136 in low temperature environment, with the help of semiconductor chip 131's hot junction 136 and cold junction 137's self difference in temperature, realize cold junction 137 temperature further drop, the strong convection mode heat transfer of rethread axial fan 173, realize first storing space 111 and realize deep refrigeration, the energy consumption is low among the refrigeration process, and semiconductor refrigerating system 130 is by electric energy direct conversion energy, effectively avoid producing the noise, promote user's use and experience.

Fig. 7 is a schematic structural diagram of the semiconductor refrigeration system 130 and the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, fig. 8 is a schematic structural diagram of another view angle of the semiconductor refrigeration system 130 and the air supply assembly 170 in fig. 7, fig. 9 is a front view of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, fig. 10 is a rear view of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, and fig. 11 is an exploded schematic diagram of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention. The semiconductor refrigeration system 130 in fig. 7 and 8 does not show the semiconductor chip 131, since the semiconductor chip 131 is thin and located between the cold heat exchanger 133 and the hot heat exchanger 132.

As shown in fig. 7 and 8, the cold heat exchanger 133 is disposed at the rear side of the rear cover 172, and a plurality of fins 138 are disposed on a side of the cold heat exchanger 133 facing the rear cover 172, and a longitudinal channel 139 is formed between two adjacent fins 138 to allow air to flow through the cold heat exchanger 133 for heat exchange. Specifically, the height of the middle preset number of fins 138 is lower than the height of the left and right fins 138, and the air supply assembly 170 further includes: a first shield 174 and two second shields 175. Wherein, the first shielding piece 174 is disposed at the front side of the preset number of fins 138; two second blinders 175 are respectively disposed at left and right sides of the cold heat exchanger 133. Also, the first and second blinders 174 and 175 may be both of a foam material.

It should be noted that the height of the middle predetermined number of fins 138 is lower than the height of the left and right fins 138, wherein the height of the fins 138 refers to the size of the fins 138 in the front-rear direction. In a preferred embodiment, as shown in fig. 7, 9 and 10, the air return opening 162 is provided in plurality, and the air return opening 162 in the middle is smaller than the air return openings 162 on the left and right sides. Thus, the return air can mostly reach the bottom of the cold heat exchanger 133 through the return air inlets 162 at the left and right sides, and then exchange heat through the fins 138 at the left and right sides of the cold heat exchanger 133; a minor portion of the return air passes through the intermediate return air opening 162 to the bottom of the cold heat exchanger 133 and then exchanges heat through the intermediate fins 138 of the cold heat exchanger 133. The size of return air inlet 162 matches with the fin 138 of cold heat exchanger 133 not co-altitude and sets up, and is more reasonable to the amount of wind distribution of cold heat exchanger 133, promotes heat exchange efficiency. In addition, the middle return air inlet 162 is closer to the air supply opening 161 than the return air inlets 162 on the left and right sides, and the size of the middle return air inlet 162 is smaller, so that the air blown out from the bottom of the air supply opening 161 can be prevented from directly returning to the cold heat exchanger 133 through the middle return air inlet 162 without flowing to the first storage space 111, and short circuit of air supply and return air is effectively avoided.

As shown in fig. 8, the left and right sides of the air suction opening 163 of the rear cover 172 are provided with the protrusion structures 165 so that the first shielding member 174 and the air suction opening 163 have a certain distance therebetween. As shown in fig. 8, the first shielding member 174 is opposite to the air suction opening 163, and a certain distance is formed between the first shielding member 174 and the air suction opening 163, so that the air that has exchanged heat in the cold heat exchanger 133 can smoothly enter the air duct 160 through the air suction opening 163. In fact, the height of the predetermined number of fins 138 in the middle of the inter-cooling heat exchanger 133 is lower than the height of the left and right fins 138, and the height of the first shielding member 174 behind the front side of the predetermined number of fins 138 may be substantially flush with the height of the left and right fins 138. Therefore, the protruding structures 165 on both sides of the air suction opening 163 can absolutely ensure a certain distance between the first shielding member 174 and the air suction opening 163. In addition, the bottom center of the rear cover 172 may further have a shelf 181 extending rearward, and the first shutter 174 may at least partially rest above the shelf 181.

As shown in fig. 11, the air blowing assembly 170 further includes: the heat insulation member 176 is disposed in the air duct 160, and a passage 177 is formed in the middle thereof to dispose the axial flow fan 173. The duct 177 is formed to extend forward and backward so that air smoothly enters the axial flow fan 173 from the rear and is directly blown forward toward the air blowing port 161 via the axial flow fan 173. The heat-insulating member 176 has a heat-insulating function, and can effectively prevent the first storage space 111 from being excessively heated when the cold heat exchanger 133 is defrosted by applying a reverse voltage. The axial flow fan 173 may be further provided with a housing 178 at the outside thereof, and the specific shape of the passage 177 may be set according to the housing 178.

Preferably, the bottom wall of the channel 177 below the axial fan 173 is cambered. And, the lowest part of the arc surface may be opened with a drain 179 to discharge the residual moisture at the axial fan 173 during defrosting. Since there may be residual moisture existing at the axial flow fan 173 when defrosting the cold heat exchanger 133, the drain port 179 may drain the residual moisture in time, so as to avoid affecting the operation of the axial flow fan 173. It should be noted that, as shown in fig. 11, the shapes of the bottom of the rear cover 172 and the bottom of the heat insulating member 176 are matched, and the centers of the bottom of the rear cover 172 and the bottom of the heat insulating member 176 are higher than the two sides, so that the return air at the return air inlet 162 of the front cover 171 can smoothly pass through and reach the bottom of the cold heat exchanger 133.

As shown in fig. 7 and 9, the size of the air blowing port 161 and the axial flow fan 173 may be the same to increase the amount of air blown. Also, a plurality of dividing ribs 167 may be provided at the air blowing port 161 to make the air blowing uniform. Specifically, the air supply opening 161 may be circular, and the dividing rib 167 may include a plurality of circular dividing ribs having different sizes with the center of the air supply opening 161 as a center; a plurality of straight dividing ribs may be radially provided to diffuse the supplied wind to each region of the first storage space 111. As shown in fig. 7 and 9, a fixing groove 168 may be further provided on the front cover 171, and a temperature sensor may be provided in the fixing groove 168 to detect a temperature of the first storage space 111.

The top of the front cover 171 may also be provided with a stop 169 to ensure that the blower assembly 170 is mounted in the correct position. Since the air supply assembly 170 may be disposed at the back of the inner container 115 of the first storage space 111, actually, the bottom and the top of the inner container 115 cooperate to define a path for air circulation. For example, the bottom of the inner container 115 is defined by the return air from the return air inlet 162 to the bottom of the cold heat exchanger 133; the top of the inner container 115 is also limited during the process that the air exchanged by the cold heat exchanger 133 enters the air duct 160 through the air suction opening 163. In short, after the temperature of the air in the first storage space 111 rises, the air returns to the bottom of the cold heat exchanger 133 through the air return opening 162, flows upward, exchanges heat through the cold heat exchanger 133, enters the air duct 160 through the air suction opening 163, and is blown out through the air blowing opening 161 through the axial flow fan 173, so that air circulation is formed.

In the refrigerator 100 of the embodiment, the structure of the air supply assembly 170 is matched with the semiconductor refrigeration system 130, so that the cold energy generated by the semiconductor refrigeration system 130 can be smoothly transmitted to the first storage space 111. In addition, the compression refrigeration system 140 reduces the temperature of the hot end 136 of the semiconductor refrigeration system 130, so that the semiconductor refrigeration system 130 can be promoted to provide cold energy to the first storage space 111, deep refrigeration of the first storage space 111 is realized, the storage requirement of food materials is met, and the storage effect of the food materials is improved.

Further, in the refrigerator 100 of the embodiment, the specific arrangement of the first shielding member 174, the second shielding member 175, and the protruding structures 165 on two sides of the air suction opening 163 of the rear cover 172 can ensure that the return air completely passes through the heat exchange of the cold heat exchanger 133, and the return air is prevented from being sent to the first storage space 111 through other paths without passing through the heat exchange of the cold heat exchanger 133. A certain distance is formed between the first shielding member 174 and the air suction opening 163, so that the air after heat exchange can smoothly enter the air duct 160 through the air suction opening 163, and then is blown to the first storage space 111 from the air supply opening 161 through the axial flow fan 173. The overall structure of the air supply assembly 170 occupies a small volume and can ensure smooth air circulation.

Furthermore, in the refrigerator 100 of the embodiment, the low-temperature refrigerant of the compression refrigeration system 140 absorbs heat when flowing through the hot heat exchanger 132, so as to reduce the temperature of the hot end 136, and the temperature of the cold end 137 is reduced accordingly, and the cold energy of the cold end 137 is transmitted to the cold heat exchanger 133, and then the axial fan 173 transmits the cold energy of the cold heat exchanger 133 to the first storage space 111. Combine refrigerator 100 traditional compression refrigerating system 140, take away the heat of hot heat exchanger 132 fast through the low temperature refrigerant, maintain hot junction 136 in low temperature environment, with the help of semiconductor chip 131's hot junction 136 and cold junction 137's self difference in temperature, realize cold junction 137 temperature further drop, the strong convection mode heat transfer of rethread axial fan 173, realize that first storing space 111 realizes deep refrigeration, the energy consumption is low among the refrigeration process, and semiconductor refrigerating system 130 is by the direct conversion energy of electric energy, effectively avoid producing the noise, promote user's use and experience.

Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been shown and described in detail herein, many other variations and modifications can be made, consistent with the principles of the invention, which are directly determined or derived from the disclosure herein, without departing from the spirit and scope of the invention. Accordingly, the scope of the present invention should be understood and interpreted to cover all such other variations or modifications.

Claims (10)

1. A refrigerator, characterized by comprising:

the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body;

the semiconductor refrigeration system is configured to provide cold energy to the first storage space;

the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and

an air supply component arranged in the first storage space and comprising a front cover, a rear cover and an axial flow fan,

the axial flow fan is arranged in an air channel defined by the front cover and the rear cover and is configured to transmit cold energy generated by the semiconductor refrigerating system to the first storage space,

the front cover and the rear cover are respectively provided with an air supply opening and an air suction opening corresponding to the axial flow fan, and the lower part of the front side of the front cover is provided with an air return opening.

2. The refrigerator according to claim 1,

the semiconductor refrigeration system includes: a semiconductor chip, a hot heat exchanger and a cold heat exchanger, wherein the semiconductor chip is arranged between the hot heat exchanger and the cold heat exchanger, and

the semiconductor chip has the hot side and the cold side, the hot heat exchanger is partially bonded to the hot side, and the cold heat exchanger is partially bonded to the cold side.

3. The refrigerator according to claim 2,

the compression refrigeration system includes: a compressor, a condenser, a capillary tube and an evaporator, and

the heat exchanger is arranged between the capillary tube and the evaporator, a low-temperature refrigerant absorbs heat when flowing through the heat exchanger, the temperature of the hot end is reduced, the temperature of the cold end is reduced accordingly, and the cold energy of the cold end is transmitted to the cold heat exchanger and then transmitted to the first storage space by the axial flow fan.

4. The refrigerator according to claim 3,

the cold heat exchanger is arranged at the rear side of the rear cover and

and a plurality of fins are arranged on one side of the cold heat exchanger facing the rear cover, and a longitudinal channel is formed between every two adjacent fins so as to enable air to flow through the cold heat exchanger for heat exchange.

5. The refrigerator according to claim 4,

the height of the fins with the preset number in the middle is lower than the height of the fins on the left side and the right side, and

the air supply assembly further includes: the first shielding pieces are arranged on the front sides of the fins in the preset number; and the two second shielding pieces are respectively arranged at the left side and the right side of the cold heat exchanger.

6. The refrigerator according to claim 5,

the left side and the right side of the air suction opening are both provided with a protruding structure, so that a certain distance is reserved between the first shielding piece and the air suction opening.

7. The refrigerator of claim 6, wherein the air supply assembly further comprises:

and the heat preservation piece is arranged in the air duct, and a channel is formed in the middle of the heat preservation piece so as to arrange the axial flow fan.

8. The refrigerator according to claim 7,

the bottom wall of the channel below the axial flow fan is a cambered surface, and

and a water outlet is formed in the lowest part of the arc surface so as to discharge residual water at the axial flow fan during defrosting.

9. The refrigerator according to claim 5,

the air return openings are multiple, and the air return opening in the middle is smaller than the air return openings on the left side and the right side.

10. The refrigerator according to claim 1,

the air supply outlet is the same as the axial flow fan in size; and is

The air supply opening is provided with a plurality of cutting ribs so as to supply air uniformly.

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