CN211601249U - Refrigerator with a door - Google Patents

Abstract

The utility model provides a refrigerator. Wherein this refrigerator includes: the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body; the semiconductor refrigerating system is used for providing cold energy for the first storage space; the compression refrigeration system provides cold energy for the second storage space and reduces the temperature of the hot end of the semiconductor refrigeration system; the air supply assembly is arranged in the first storage space and comprises a front cover, a rear cover and a cross-flow fan, the cross-flow fan is arranged in an air channel defined by the front cover and the rear cover, cold energy generated by a semiconductor refrigerating system is transmitted to the first storage space, an air supply opening is formed in the position, corresponding to the cross-flow fan, of the front side of the front cover, an air return opening is formed in the lower portion of the front side of the front cover, and an air suction opening is defined by the rear side of the front cover and the top of the rear cover. The utility model discloses a refrigerator, the structure and the semiconductor refrigerating system phase-match of air supply subassembly, the cold volume transmission that produces semiconductor refrigerating system to first storing space makes first storing space realize the deep cooling.

Description

Refrigerator with a door

Technical Field

The utility model relates to a household electrical appliances field especially relates to a refrigerator.

Background

With the increasing development of society and the continuous improvement of living standard of people, the pace of life of people is faster and faster, and a lot of food can be purchased and stored at one time. In order to ensure the storage effect of food, a refrigerator has become one of household appliances indispensable to people's daily life.

The current refrigerators are generally classified into compression refrigeration refrigerators and semiconductor refrigeration refrigerators according to the type of a refrigeration system. The temperature regulation precision of the compression refrigeration refrigerator is lower, generally +/-3.5 ℃, and the temperature regulation precision of the semiconductor refrigeration refrigerator can reach +/-0.1 ℃. Although the temperature adjusting precision of the semiconductor refrigeration refrigerator is high, the following defects exist: the semiconductor chip in the semiconductor refrigeration system is easily influenced by the external environment temperature, and when the external environment temperature is very high, the heat dissipation of the hot end of the semiconductor chip is difficult, so that the temperature of the hot end is increased, and the refrigerating capacity is reduced. Because the efficiency of the semiconductor refrigeration system is low, the semiconductor refrigeration system can only be applied to small-volume common refrigeration products or can only be used for radiating certain key components, and low-temperature refrigeration cannot be realized. In addition, when the semiconductor refrigeration system is applied to small-volume common refrigeration products, the conventional air duct structure cannot meet the requirement for arranging the semiconductor refrigeration system due to the small volume of the refrigeration products.

SUMMERY OF THE UTILITY MODEL

One object of the utility model is to make the air supply subassembly of refrigerator match with semiconductor refrigerating system.

The utility model discloses a further purpose is to realize the specific storing space degree of depth refrigeration of refrigerator, satisfies the storage requirement of eating the material.

Particularly, the utility model provides a refrigerator, include: the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body; the semiconductor refrigeration system is configured to provide cold energy to the first storage space; the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and the air supply assembly is arranged in the first storage space and comprises a front cover, a rear cover and a cross-flow fan, the cross-flow fan is arranged in an air channel defined by the front cover and the rear cover and is configured to transmit cold energy generated by the semiconductor refrigerating system to the first storage space, an air supply opening is formed in the position, corresponding to the cross-flow fan, of the front side of the front cover, an air return opening is formed in the lower portion of the front side of the front cover, and an air suction opening is defined by the rear side of the front cover and the top of the rear cover together.

Optionally, the semiconductor refrigeration system comprises: the semiconductor chip is arranged between the hot heat exchanger and the cold heat exchanger, the semiconductor chip is provided with a hot end and a cold end, the hot heat exchanger is partially adhered to the hot end, and the cold heat exchanger is partially adhered to the cold end.

Optionally, the compression refrigeration system comprises: compressor, condenser, capillary and evaporimeter, and hot heat exchanger sets up between capillary and evaporimeter, and the low temperature refrigerant absorbs heat when flowing through hot heat exchanger, reduces the temperature of hot junction, and the temperature of cold junction also reduces thereupon, and the cold volume conduction of cold junction is to the cold heat exchanger after the cross flow fan with cold heat exchanger's cold volume transmission to first storing space.

Optionally, the rear cover includes a vertical portion and two protruding portions, the two protruding portions extend backward from two sides of the top of the vertical portion, the cross-flow fan is clamped between the two protruding portions, and an air suction opening is formed below the cross-flow fan.

Optionally, the front cover comprises a flat plate part and an extending part, the extending part extends backwards from the top of the flat plate part, and the rear side of the extending part and the top of the rear cover jointly define the air suction opening.

Optionally, a plurality of fins are arranged on one side of the cold heat exchanger facing the vertical portion, a longitudinal channel is formed between every two adjacent fins so that the air flow can exchange heat through the cold heat exchanger, and the plurality of fins are arranged below the cross flow fan.

Optionally, the air supply assembly further comprises: and the two shielding pieces are respectively arranged at the left side and the right side of the cold heat exchanger.

Optionally, the air supply assembly further comprises: the heat preservation piece is arranged in the air duct, and the shape of the heat preservation piece is matched with that of the rear cover.

Optionally, the top center of the heat preservation piece is a slope gradually decreasing from front to back so as to discharge residual moisture during defrosting.

Optionally, an induced draft hood is arranged at the air supply port to guide air blown out by the cross flow fan to the first storage space; and a plurality of partition ribs are uniformly arranged in the draught hood in the longitudinal direction so as to uniformly supply air.

The utility model discloses a refrigerator, include: the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body; the semiconductor refrigeration system is configured to provide cold energy to the first storage space; the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and the air supply assembly is arranged in the first storage space and comprises a front cover, a rear cover and a cross-flow fan, the cross-flow fan is arranged in an air channel defined by the front cover and the rear cover and is configured to transmit cold energy generated by the semiconductor refrigerating system to the first storage space, an air supply opening is formed in the position, corresponding to the cross-flow fan, of the front side of the front cover, an air return opening is formed in the lower portion of the front side of the front cover, and an air suction opening is defined by the rear side of the front cover and the top of the rear cover together. The structure of the air supply assembly is matched with the semiconductor refrigerating system, so that the cold energy generated by the semiconductor refrigerating system can be smoothly transmitted to the first storage space. In addition, compression refrigerating system reduces the temperature of semiconductor refrigerating system's hot junction, can promote semiconductor refrigerating system to provide cold volume to first storing space, and then makes first storing space realize deep refrigeration, satisfies the storage requirement of eating the material, promotes the storage effect of eating the material.

Further, the utility model discloses a refrigerator can guarantee that the return air is through cold heat exchanger heat transfer completely, avoids the return air not to deliver to first storing space through other routes through cold heat exchanger heat transfer. The air after the heat exchange of the cold heat exchanger directly reaches the air suction opening, can smoothly enter the air channel through the air suction opening, and is blown to the first storage space from the air supply opening through the cross flow fan. The whole structure of the air supply assembly occupies a small volume, and air circulation can be guaranteed to be smoothly carried out.

Further, the utility model discloses a refrigerator, the low temperature refrigerant of compression refrigerating system absorbs heat when flowing through hot heat exchanger, reduces the temperature in hot junction, and the temperature of cold junction reduces thereupon, and the cold volume conduction of cold junction is to cold heat exchanger back cross flow fan with cold heat exchanger's cold volume transmission to first storing space. Combine traditional compression refrigerating system of refrigerator, take away the heat of heat exchanger fast through the low temperature refrigerant, maintain the hot junction in low temperature environment, with the help of the self difference in temperature of semiconductor chip hot junction and cold junction, realize the cold junction temperature and further descend, the strong convection mode heat transfer of rethread cross flow fan realizes first storing space and realizes deep refrigeration, the energy consumption is low among the refrigeration process, and semiconductor refrigerating system is by electric energy direct conversion energy, effectively avoid producing the noise, promote user's use and experience.

The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.

Drawings

Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

fig. 1 is a schematic structural view of a refrigerator according to an embodiment of the present invention;

fig. 2 is a schematic view of a connection structure of a compression refrigeration system and a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a hot heat exchanger of a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

FIG. 5 is an exploded view of the thermal heat exchanger shown in FIG. 4;

fig. 6 is a schematic view of a semiconductor refrigeration system in a refrigerator providing cooling capacity to a first storage space according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a semiconductor refrigeration system and an air supply assembly in a refrigerator according to an embodiment of the present invention;

FIG. 8 is a schematic view of the semiconductor refrigeration system and blower assembly of FIG. 7 from another perspective;

fig. 9 is a front view of an air supply assembly in a refrigerator according to an embodiment of the present invention;

fig. 10 is a rear view of an air supply assembly in a refrigerator according to an embodiment of the present invention;

fig. 11 is a bottom view of an air supply assembly in a refrigerator according to an embodiment of the present invention;

fig. 12 is an exploded schematic view of an air supply assembly in a refrigerator according to an embodiment of the present invention; and

fig. 13 is a schematic partial structure diagram of a refrigerator according to an embodiment of the present invention.

Detailed Description

The embodiment provides a refrigerator, wherein the structure of an air supply assembly is matched with a semiconductor refrigerating system, so that cold energy generated by the semiconductor refrigerating system can be smoothly transmitted to a first storage space; the temperature of the hot end of the semiconductor refrigerating system is reduced through the compression refrigerating system, the semiconductor refrigerating system is promoted to provide cold energy to the first storage space, deep refrigeration is achieved through the first storage space, the storage requirement of food materials is met, and the storage effect of the food materials is improved. Fig. 1 is a schematic structural diagram of a refrigerator 100 according to an embodiment of the present invention, fig. 2 is a schematic structural diagram of a connection structure between a compression refrigeration system 140 and a semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention, fig. 3 is a schematic structural diagram of the semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention, fig. 4 is a schematic structural diagram of a heat exchanger 132 of the semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention, fig. 5 is an exploded schematic structural diagram of the heat exchanger 132 shown in fig. 4, and fig. 6 is a schematic structural diagram of the semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention providing cooling capacity to a first storage space 111. As shown in fig. 1 to 6, the refrigerator 100 of the present embodiment may generally include: a box 110, a semiconductor refrigeration system 130, a compression refrigeration system 140, and an air supply assembly 170.

Wherein at least a first storage space 111 and a second storage space 112 are defined inside the case 110. In fact, the number and structure of the storage spaces can be configured as required. And the storage space can be configured into a refrigerating space, a freezing space, a temperature changing space or a fresh-keeping space according to different purposes. Each storage space may be divided into a plurality of storage regions by a partition plate, and the articles may be stored by a rack or a drawer. As shown in fig. 1, the refrigerator 100 of the present embodiment may have four storage spaces defined inside the cabinet 110: a first storage space 111, a second storage space 112, a third storage space 113 and a fourth storage space 114. The second storage space 112 may be located at the top and may be a refrigerating space; the first storage space 111 and the third storage space 113 may be arranged below the second storage space 112 side by side, the first storage space 111 may be a deep cooling space, and the third storage space 113 may be a temperature changing space; the fourth storage space 114 may be disposed at the lowermost portion to be a freezing space.

The refrigerator 100 of the present embodiment may further include: the door 120 is pivotally disposed on a front surface of the cabinet 110, so that a user can open and close the storage space. The door bodies 120 may be disposed corresponding to the storage spaces, that is, each storage space corresponds to one or more door bodies 120. The door 120 may be opened by pivoting or may be opened by sliding, for example, the door 120 corresponding to the second storage space 112 is opened by pivoting, and the rest of the storage spaces may be opened by sliding.

The semiconductor refrigeration system 130 can be configured to provide cooling to the first storage space 111. The compression refrigeration system 140 can be configured to provide refrigeration to the second storage space 112. Since the refrigerator 100 of the present embodiment is further provided with the third storage space 113 and the fourth storage space 114 in addition to the first storage space 111 and the second storage space 112, the other storage spaces can be provided with the cooling capacity by the compression refrigeration system 140 in addition to the first storage space 111 provided with the cooling capacity by the semiconductor refrigeration system 130.

It should be noted that the compression refrigeration system 140 provides different cooling capacities to the storage spaces, so that the temperatures in the storage spaces are different. Wherein the temperature in the refrigerated space is generally between 2 ℃ and 10 ℃, preferably between 4 ℃ and 7 ℃. The temperature in the refrigerated space is typically in the range of-22 ℃ to-14 ℃. The optimal storage temperatures of different types of articles are different, and thus the storage spaces suitable for storage are also different. For example, fruits and vegetables are suitable for storage in a refrigerated space or a fresh-keeping space, while meat is suitable for storage in a refrigerated space. The temperature changing space can be internally provided with a heating device for heating food.

More importantly, the compression refrigeration system 140, in addition to providing cooling to the storage space, may be configured to: the temperature of the hot side 136 of the semiconductor refrigeration system 130 is reduced. The hot side 136 of the semiconductor refrigeration system 130 may have difficulty dissipating heat, which may cause the temperature of the hot side 136 to increase and thus reduce the cooling capacity. Compression refrigeration system 140 in time reduces the temperature of hot junction 136 of semiconductor refrigeration system 130, can promote semiconductor refrigeration system 130 to provide cold volume to first storing space 111, and then makes first storing space 111 realize deep cooling, satisfies the storage requirement of eating the material, promotes the storage effect of eating the material.

As shown in fig. 6, the air supply assembly 170 may be disposed in the first storage space 111, and the air supply assembly 170 includes a front cover 171, a rear cover 172, and a cross-flow fan 173. Wherein the cross flow fan 173 is disposed in the air duct 160 defined by the front cover 171 and the rear cover 172, and configured to transmit the cold generated from the semiconductor refrigeration system 130 to the first storage space 111. An air supply opening 161 is formed in the front side of the front cover 171 corresponding to the position of the cross-flow fan 173, an air return opening 162 is formed in the lower portion of the front side of the front cover 171, and an air suction opening 163 is defined by the rear side of the front cover 171 and the top of the rear cover 172.

The box body 110 may further include an inner container 115, and the air supply assembly 170 may be disposed at a back of the inner container 115 of the first storage space 111. And "front" and "rear" of the front cover 171 and the rear cover 172 are directional descriptions in a normal use state of the refrigerator 100, that is, the front cover 171 is closer to the door body 120 than the rear cover 172. The positions of the air supply opening 161, the air return opening 162 and the air suction opening 163 are matched with the air inlet and outlet modes of the cross flow fan 173, and air circulation is promoted. The included angle between the air inlet direction and the air outlet direction of the cross flow fan 173 is 90 degrees, so that air can be supplied to the lower part of the cross flow fan 173 and air can be discharged from the front part of the cross flow fan 173. In the refrigerator 100 of the embodiment, the structure of the air supply assembly 170 is matched with the semiconductor refrigeration system 130, so that the cold energy generated by the semiconductor refrigeration system 130 can be smoothly transmitted to the first storage space 111.

As shown in fig. 2 and 3, the semiconductor cooling system 130 may include: a semiconductor chip 131, a hot heat exchanger 132, and a cold heat exchanger 133. Wherein the semiconductor chip 131 is disposed between the hot heat exchanger 132 and the cold heat exchanger 133, and the semiconductor chip 131 has a hot end 136 and a cold end 137, the hot heat exchanger 132 is partially bonded to the hot end 136, and the cold heat exchanger 133 is partially bonded to the cold end 137.

In a preferred embodiment, the semiconductor refrigeration system 130 may further include: a thermally conductive layer 134 and a thermally insulating layer 135. The heat conducting layer 134 is made of a material with a high thermal conductivity coefficient, the hot heat exchanger 132 is partially adhered to the hot end 136 through the heat conducting layer 134, and the cold heat exchanger 133 is partially adhered to the cold end 137 through the heat conducting layer 134. Good heat transfer between the hot heat exchanger 132 and the hot end 136, and between the cold end 137 and the cold heat exchanger 133 is possible due to the high thermal conductivity of the thermally conductive layer 134. Specifically, the material of the heat conductive layer 134 may include, but is not limited to: heat-conducting silicone grease, liquid metal.

The thermal insulation layer 135 is made of a material with low thermal conductivity, and the thermal insulation layer 135 is disposed at a position other than the semiconductor chip 131 between the hot heat exchanger 132 and the cold heat exchanger 133, and configured to insulate the hot heat exchanger 132 and the cold heat exchanger 133. Since the semiconductor chip 131 is generally thin, the hot heat exchanger 132 and the cold heat exchanger 133 are closer to each other, and the thermal insulation layer 135 is added between the hot heat exchanger 132 and the cold heat exchanger 133 except the semiconductor chip 131, so that the heat conduction between the hot heat exchanger 132 and the cold heat exchanger 133 can be effectively prevented from affecting the cooling effect. Specifically, the material of the thermal insulation layer 135 may include, but is not limited to: foam, foaming material, PE cotton and aerogel.

As shown in fig. 2, the compression refrigeration system 140 may include: the compressor 141, the condenser 142, the capillary tube 143, and the evaporator 144, and the hot heat exchanger 132 is disposed between the capillary tube 143 and the evaporator 144, when the low-temperature refrigerant flows through the hot heat exchanger 132, the low-temperature refrigerant absorbs heat to lower the temperature of the hot end 136, the temperature of the cold end 137 is lowered accordingly, and the cold energy of the cold end 137 is transmitted to the cold heat exchanger 133, and then the cold energy of the cold heat exchanger 133 is transmitted to the first storage space 111 by the cross flow fan 173. As shown in fig. 2 to 5, the heat exchanger 132 is connected to the capillary tube 143 through the liquid inlet tube 151 and to the evaporator 144 through the liquid outlet tube 152.

The heat exchanger 132 is a flat plate and has a groove 155 formed therein, and a low-temperature refrigerant flows into the groove 155 through the liquid inlet pipe 151, flows along the groove 155, and flows out through the liquid outlet pipe 152. Preferably, the groove 155 is shaped as a curve with a predetermined number of inflection points, so that the flowing area of the low-temperature refrigerant inside the heat exchanger 132 can be increased, the heat exchange efficiency can be improved, and the temperature of the hot end 136 can be effectively reduced. In one embodiment, as shown in fig. 4 and 5, the heat exchanger 132 may include a cover plate 153 and a back plate 154, the back plate 154 has a groove 155, and the cover plate 153 covers the groove 155. In other embodiments, the interior of the heat exchanger 132 may also be perforated or have copper tubes or other forms for flowing the low-temperature refrigerant therein.

In one particular embodiment, after reducing the temperature of hot end 136, the temperature of cold end 137 is reduced to a first temperature value. The refrigeration principle of the semiconductor refrigeration system 130 mainly utilizes the peltier effect: when current passes through a loop formed by different conductors, in addition to generating irreversible joule heat, heat absorption and heat release phenomena respectively occur at joints of different conductors along with different current directions. Semiconductor chip 131 creates a temperature difference between hot end 136 and cold end 137 after being powered on, so that after the temperature of hot end 136 is reduced, the temperature of cold end 137 is reduced to a first temperature value.

Further, after the temperature of cold end 137 is subsequently reduced to the first temperature value, the cold energy of cold end 137 is conducted to cold heat exchanger 133. It is noted that the cold end 137 and the cold heat exchanger 133 are disposed at a side close to the first storage space 111 so as to lower the temperature of the first storage space 111. Specifically, the cross flow fan 173 may be provided at a corresponding position with an air supply outlet 161 to supply cold to the first storage space 111; the front side lower portion of the front cover 171 may be provided with a return air opening 162 to return the air having the increased temperature to the semiconductor cooling system 130, thus forming an air circulation.

In a preferred embodiment, after the cold energy of the cold heat exchanger 133 is transmitted to the first storage space 111, the temperature of the first storage space 111 is reduced to a second temperature value, wherein the first temperature value is lower than the second temperature value, and the second temperature value is-30 ℃ to-60 ℃. That is, there is a certain loss in the process of transferring the cold energy of the cold end 137 to the first storage space 111, for example, the first temperature value may be 5 ℃ lower than the second temperature value. The second temperature value of the first storage space 111 can reach-30 ℃ to-60 ℃, and the storage requirements of some special food materials can be met.

One embodiment is described below: when the compression refrigeration system 140 operates, a low-temperature refrigerant absorbs heat when flowing through the hot heat exchanger 132, the hot heat exchanger 132 and the hot end 136 are adhered through the heat conduction layer 134 to realize cooling of the hot end 136, the semiconductor chip 131 enables the hot end 136 and the cold end 137 to generate temperature difference due to the peltier effect when being electrified, the temperature of the cold end 137 is reduced to a first temperature value, cold energy of the cold end 137 is conducted to the cold heat exchanger 133 through the heat conduction layer 134, and the cross-flow fan 173 in the air duct 160 transmits the cold energy of the cold heat exchanger 133 to the first storage space 111 to reduce the temperature inside the first storage space to a second temperature value, so that a cryogenic function is realized.

It should be noted that when the semiconductor chip 131 is not powered on, the compression refrigeration system 140 operates normally, the low-temperature refrigerant still flows through the hot heat exchanger 132 to cool the hot end 136, and although there is no temperature difference between the hot end 136 and the cold end 137, the cold energy may still be transmitted to the first storage space 111 through the cold end 137, the cold heat exchanger 133, and the cross-flow fan 173 in sequence. Although the amount of cooling energy transmitted to the first storage space 111 is less than that when the semiconductor chip 131 is powered on, the first storage space 111 can be used as a normal freezing space without consuming extra electric energy. In addition, when the compression refrigeration system 140 stops operating, the hot end 136 and the cold end 137 can be exchanged by applying a reverse voltage to the semiconductor chip 131, so that the cold heat exchanger 133 can be heated and defrosted.

It is emphasized that the temperature difference between the hot end 136 and the cold end 137 is not constant, and in low ambient temperatures, the temperature difference may be 20 c to 30 c, and in normal ambient conditions, the temperature difference may be greater. That is, in a low temperature environment, it may be difficult to achieve a low temperature of the cold end 137, and thus it may be difficult to achieve a cryogenic function in the storage space. Refrigerator 100 of this embodiment, combine traditional compression refrigerating system 140, take away the heat of hot heat exchanger 132 fast through the low temperature refrigerant, maintain hot junction 136 in low temperature environment, with the help of semiconductor chip 131's hot junction 136 and cold junction 137's self difference in temperature, realize cold junction 137 temperature further drop, the heat transfer of rethread cross flow fan 173 strong convection current mode, realize that first storing space 111 realizes deep refrigeration, the energy consumption is low in the refrigeration process, and semiconductor refrigerating system 130 is by electric energy direct conversion energy, effectively avoid producing the noise, promote user's use experience.

Fig. 7 is a schematic structural diagram of the semiconductor refrigeration system 130 and the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, fig. 8 is a schematic structural diagram of another view angle of the semiconductor refrigeration system 130 and the air supply assembly 170 in fig. 7, fig. 9 is a front view of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, fig. 10 is a rear view of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, fig. 11 is a bottom view of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, fig. 12 is an exploded schematic diagram of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention, and fig. 13 is a schematic structural diagram of a part of the refrigerator 100 according to an embodiment of the present invention. Fig. 13 is a schematic diagram of the blower unit 170 and the cold heat exchanger 133 with the front cover 171 removed, showing the positional relationship between the cross flow fan 173 and the cold heat exchanger 133.

As shown in fig. 12, the rear cover 172 may include a vertical portion 174 and two protruding portions 177, the two protruding portions 177 respectively extend backward from two sides of the top of the vertical portion 174, the cross flow fan 173 is clamped between the two protruding portions 177, and the air suction opening 163 is located below the cross flow fan 173. The front cover 171 may include a flat plate portion 178 and an extension portion 179, and the extension portion 179 extends rearward from a top of the flat plate portion 178, and a rear side of the extension portion 179 and a top of the rear cover 172 together define the air suction opening 163.

As shown in fig. 12 and 13, the cold heat exchanger 133 is provided with a plurality of fins 138 on a side facing the vertical portion 174, and a longitudinal passage 139 is formed between two adjacent fins 138 to allow air to flow through the cold heat exchanger 133 for heat exchange. The plurality of fins 138 are provided below the cross flow fan 173. The air after heat exchange directly enters the air duct 160 through the air suction opening 163 below the cross flow fan 173, and then is turned by 90 ° by the cross flow fan 173 and blown out from the air supply opening 161 in front. The air supply assembly 170 further includes: two shielding members 175 are disposed on the left and right sides of the cold heat exchanger 133, respectively. The shield 175 and the vertical portion 174 of the rear cover 172 are defined so that the air at the bottom of the cold heat exchanger 133 can only flow along the longitudinal channels 139 of the fins 138, ensuring that the air is totally heat exchanged before being blown out by the crossflow blower 173. In a preferred embodiment, the shield 175 can be a foam material.

Note that the heights of the plurality of fins 138 of the cold heat exchanger 133 are the same, where the height of the fin 138 refers to the size of the fin 138 in the front-rear direction. Also, as shown in fig. 7, 9 and 10, the air return opening 162 may be provided in plural, and the sizes of the plural air return openings 162 are the same. Therefore, the return air can uniformly reach the bottom of the cold heat exchanger 133 through the plurality of return air inlets 162, and then uniformly exchanges heat through the plurality of fins 138 of the cold heat exchanger 133, so that the air volume distribution of the cold heat exchanger 133 is more reasonable, and the heat exchange efficiency is improved.

As shown in fig. 12, the air blowing assembly 170 further includes: and the heat preservation member 176 is arranged in the air duct 160, and the shape of the heat preservation member is matched with that of the rear cover 172. The top center of the heat insulation member 176 is a slope gradually decreasing from front to back to discharge the residual moisture during defrosting. It should be noted that the lowest position of the inclined plane at the top center of the heat retaining member 176 is lower than the cross flow fan 173, and the highest position of the inclined plane is also lower than the air supply opening 161 of the front cover 171, so as to prevent the air outlet of the cross flow fan 173 from being affected. The heat-insulating member 176 has a heat-insulating function, and can effectively prevent the first storage space 111 from being excessively heated when the cold heat exchanger 133 is defrosted by applying a reverse voltage.

Because residual moisture may exist in the air duct 160 when defrosting the cold heat exchanger 133, the top center of the heat insulating member 176 is set to be an inclined plane gradually decreasing from front to back, so that the residual moisture can be discharged in time, and the influence on the operation of the cross flow fan 173 is avoided. Specifically, the residual moisture may be discharged to the cold heat exchanger 133, and discharged to the outside of the refrigerator 100 together with the defrosting water of the cold heat exchanger 133. Note that, as shown in fig. 12, the bottom of the rear cover 172 and the bottom of the heat insulating member 176 are higher than the air return opening 162 of the front cover 171. As mentioned above, the front cover 171 is opened with the air return opening 162 at the lower portion of the front side, and in fact, the rear cover 172 and the bottom of the heat retaining member 176 are above the air return opening 162, so that the air passing through the air return opening 162 can smoothly reach the bottom of the cold heat exchanger 133.

As shown in fig. 7, 8, 9 and 12, an induced draft cover 166 may be provided at the air supply opening 161 to guide the air blown by the cross flow fan 173 to the first storage space 111. The air guide cover 166 has a guiding function for the air supply direction, prevents the air blown out by the cross flow fan 173 from directly returning to the return air inlet 162, and effectively prevents the short circuit of the air supply and the return air. Furthermore, a plurality of dividing ribs 167 may be uniformly arranged in the air draft cover 166 in the longitudinal direction to uniformly blow air.

Since the air supply assembly 170 may be disposed at the back of the inner container 115 of the first storage space 111, the inner container 115 may define a path for air circulation. For example, the bottom of the bladder 115 defines the return air flow from the return air inlet 162 to the bottom of the cold heat exchanger 133. In short, after the temperature of the air in the first storage space 111 rises, the air returns to the bottom of the cold heat exchanger 133 through the air return opening 162, flows upward, exchanges heat through the cold heat exchanger 133, enters the air duct 160 through the air suction opening 163, and is blown out through the air blowing opening 161 through the cross flow fan 173, so that air circulation is formed.

In the refrigerator 100 of the embodiment, the structure of the air supply assembly 170 is matched with the semiconductor refrigeration system 130, so that the cold energy generated by the semiconductor refrigeration system 130 can be smoothly transmitted to the first storage space 111. In addition, the compression refrigeration system 140 reduces the temperature of the hot end 136 of the semiconductor refrigeration system 130, so that the semiconductor refrigeration system 130 can be promoted to provide cold energy to the first storage space 111, deep refrigeration of the first storage space 111 is realized, the storage requirement of food materials is met, and the storage effect of the food materials is improved.

Further, the refrigerator 100 of the embodiment can ensure that the return air completely passes through the cold heat exchanger 133 for heat exchange, and avoid the return air from being sent to the first storage space 111 through other paths without passing through the cold heat exchanger 133 for heat exchange. The air after heat exchange by the cold heat exchanger 133 directly reaches the air suction opening 163, and can smoothly enter the air duct 160 through the air suction opening 163, and further is blown to the first storage space 111 from the air supply opening 161 through the cross flow fan 173. The overall structure of the air supply assembly 170 occupies a small volume and can ensure smooth air circulation.

Furthermore, in the refrigerator 100 of the embodiment, the low-temperature refrigerant of the compression refrigeration system 140 absorbs heat when flowing through the hot heat exchanger 132, so as to reduce the temperature of the hot end 136, and the temperature of the cold end 137 is reduced accordingly, and the cold energy of the cold end 137 is transmitted to the cold heat exchanger 133, and then the cross flow fan 173 transmits the cold energy of the cold heat exchanger 133 to the first storage space 111. Combine refrigerator 100 tradition compression refrigerating system 140, take away the heat of hot heat exchanger 132 fast through the low temperature refrigerant, maintain hot junction 136 in low temperature environment, with the help of the self difference in temperature of hot junction 136 and cold junction 137 of semiconductor chip 131, realize cold junction 137 temperature further drop, rethread cross flow fan 173 strong convection mode heat transfer, realize that first storing space 111 realizes deep refrigeration, the energy consumption is low in the refrigeration process, and semiconductor refrigerating system 130 is by electric energy direct conversion energy, effectively avoid producing the noise, promote user's use experience.

Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been shown and described in detail herein, many other variations and modifications can be made, consistent with the principles of the invention, which are directly determined or derived from the disclosure herein, without departing from the spirit and scope of the invention. Accordingly, the scope of the present invention should be understood and interpreted to cover all such other variations or modifications.

Claims (10)

1. A refrigerator, characterized by comprising:

the refrigerator comprises a box body, a storage box and a control device, wherein at least a first storage space and a second storage space are defined in the box body;

the semiconductor refrigeration system is configured to provide cold energy to the first storage space;

the compression refrigeration system is configured to provide cold energy for the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and

the air supply assembly is arranged in the first storage space and comprises a front cover, a rear cover and a cross-flow fan,

the cross-flow fan is arranged in an air duct defined by the front cover and the rear cover and is configured to transmit cold energy generated by the semiconductor refrigerating system to the first storage space,

the front side of the front cover is provided with an air supply outlet corresponding to the position of the cross-flow fan, the lower part of the front side of the front cover is provided with an air return inlet, and the rear side of the front cover and the top of the rear cover jointly define an air suction inlet.

2. The refrigerator according to claim 1,

the semiconductor refrigeration system includes: a semiconductor chip, a hot heat exchanger and a cold heat exchanger, wherein the semiconductor chip is arranged between the hot heat exchanger and the cold heat exchanger, and

the semiconductor chip has the hot side and the cold side, the hot heat exchanger is partially bonded to the hot side, and the cold heat exchanger is partially bonded to the cold side.

3. The refrigerator according to claim 2,

the compression refrigeration system includes: a compressor, a condenser, a capillary tube and an evaporator, and

the heat exchanger is arranged between the capillary tube and the evaporator, a low-temperature refrigerant absorbs heat when flowing through the heat exchanger, the temperature of the hot end is reduced, the temperature of the cold end is reduced accordingly, and the cold energy of the cold end is transmitted to the cold heat exchanger and then transmitted to the first storage space by the cross flow fan.

4. The refrigerator according to claim 3,

the rear cover includes a vertical portion and two convex portions,

two of the protrusions extend backward from two sides of the top of the vertical part, respectively, and

the cross-flow fan is clamped between the two protruding portions, and the air suction opening is formed below the cross-flow fan.

5. The refrigerator according to claim 4,

the front cover includes a flat plate portion and an extended portion, and

the extension part extends backwards from the top of the flat plate part,

the rear side of the extension part and the top of the rear cover jointly define the air suction opening.

6. The refrigerator according to claim 5,

a plurality of fins are arranged on one side of the cold heat exchanger facing the vertical part, and a longitudinal channel is formed between every two adjacent fins so as to lead the air to flow through the cold heat exchanger for heat exchange, and

the plurality of fins are arranged below the cross flow fan.

7. The refrigerator of claim 6, wherein the air supply assembly further comprises:

and the two shielding pieces are respectively arranged at the left side and the right side of the cold heat exchanger.

8. The refrigerator of claim 7, wherein the air supply assembly further comprises:

and the heat preservation piece is arranged in the air duct, and the shape of the heat preservation piece is matched with that of the rear cover.

9. The refrigerator according to claim 8,

the top center of the heat preservation piece is an inclined plane which gradually decreases from front to back so as to discharge residual moisture during defrosting.

10. The refrigerator according to claim 1,

an induced draft cover is arranged at the air supply port to guide the air blown out by the cross flow fan to the first storage space; and is

A plurality of partition ribs are uniformly arranged in the draught hood in the longitudinal direction, so that air supply is uniform.

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