CN115177125B - Semiconductor cold and hot display cabinet and control method thereof - Google Patents
Semiconductor cold and hot display cabinet and control method thereof Download PDFInfo
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- CN115177125B CN115177125B CN202210846322.2A CN202210846322A CN115177125B CN 115177125 B CN115177125 B CN 115177125B CN 202210846322 A CN202210846322 A CN 202210846322A CN 115177125 B CN115177125 B CN 115177125B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000005057 refrigeration Methods 0.000 claims abstract description 58
- 238000001816 cooling Methods 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 24
- 238000009413 insulation Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 3
- 239000003570 air Substances 0.000 description 129
- 238000005338 heat storage Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000012080 ambient air Substances 0.000 description 2
- 235000020965 cold beverage Nutrition 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000012171 hot beverage Nutrition 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47F—SPECIAL FURNITURE, FITTINGS, OR ACCESSORIES FOR SHOPS, STOREHOUSES, BARS, RESTAURANTS OR THE LIKE; PAYING COUNTERS
- A47F3/00—Show cases or show cabinets
- A47F3/04—Show cases or show cabinets air-conditioned, refrigerated
- A47F3/0404—Cases or cabinets of the closed type
- A47F3/0408—Cases or cabinets of the closed type with forced air circulation
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47F—SPECIAL FURNITURE, FITTINGS, OR ACCESSORIES FOR SHOPS, STOREHOUSES, BARS, RESTAURANTS OR THE LIKE; PAYING COUNTERS
- A47F3/00—Show cases or show cabinets
- A47F3/04—Show cases or show cabinets air-conditioned, refrigerated
- A47F3/0404—Cases or cabinets of the closed type
- A47F3/0426—Details
- A47F3/043—Doors, covers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention belongs to the technical field of display cabinets, and particularly relates to a semiconductor cold and hot display cabinet and a control method thereof. The showcase comprises a case body and a thermoelectric refrigeration unit arranged at the lower part of the case body; at least one shelf is arranged in the cabinet to form at least two compartments from top to bottom, an air outlet is formed in the back air plate in the cabinet corresponding to each compartment, and an air door is arranged at the air outlet of the uppermost compartment; the uppermost shelf is a thermoelectric cold-hot plate, and the thermoelectric cold-hot plate supplies heat upwards and downwards when direct current is supplied in the forward direction, and supplies heat upwards and supplies cold downwards when direct current is supplied in the reverse direction; the thermoelectric refrigeration unit cools or heats the return air in the cabinet; the air after cooling or heating enters the air duct, and then circulation cold or circulation heat is provided for the display cabinet. The display cabinet provided by the invention realizes the functions of refrigeration, hot storage and cold and hot storage, and the positions of the cold storage area and the hot storage area are adjustable, so that the diversity requirements of users can be better met.
Description
Technical Field
The invention belongs to the technical field of display cabinets, and particularly relates to a semiconductor cold and hot display cabinet and a control method thereof.
Background
At present, a display cabinet is commonly arranged in places such as a market, a supermarket, a convenience store and the like, a plurality of layers of shelves are arranged in the display cabinet, and articles are placed on the shelves in a classified manner for sale. However, most of the existing display cabinets can only carry out pure refrigeration or hot storage on articles such as drinks in the cabinet, but can not provide cold drinks and hot drinks at the same time, so that different requirements of different seasons and different consumers on the temperatures of the drinks can not be met; the individual cold and hot double-temperature showcases appear in the market, but the positions of the cold storage area and the hot storage area in the showcases are fixed, and the storage positions of cold drinks and hot drinks cannot be adjusted according to actual needs, so that the diversity requirements of users cannot be met better.
Disclosure of Invention
Aiming at the defects existing in the related art, the invention provides a semiconductor cold-hot display cabinet and a control method thereof, which aim to realize the functions of refrigeration, hot storage and cold-hot storage of the display cabinet and can adjust the positions of a cold storage area and a hot storage area according to actual needs.
The invention provides a semiconductor cold and hot showcase, which comprises:
the cabinet body is provided with a containing cavity for storing articles therein; the cabinet body is internally provided with a back air plate, an air channel is formed between the back air plate and the inner wall of the cabinet body, and the air channel is communicated with the accommodating cavity;
at least one shelf arranged in the accommodating cavity to divide the accommodating cavity into at least two compartments from top to bottom, wherein the compartments are communicated with each other; an air outlet is formed in the back air plate corresponding to each compartment, and an air door capable of opening or closing the air outlet is arranged at the air outlet of the uppermost compartment; the shelf at the uppermost layer is a thermoelectric cold-hot plate, and when direct current is positively supplied to the thermoelectric cold-hot plate, the thermoelectric cold-hot plate supplies cold to the upper side and supplies heat to the lower side; when the thermoelectric cold-hot plate reversely electrifies direct current, heat is supplied to the upper part of the thermoelectric cold-hot plate and cold is supplied to the lower part of the thermoelectric cold-hot plate;
the thermoelectric refrigerating unit is arranged at the lower part of the cabinet body; when the thermoelectric refrigerating unit is powered on with direct current in the forward direction, the return air in the cabinet body is cooled; when the thermoelectric refrigerating unit reversely electrifies direct current, the return air in the cabinet body is heated and warmed; the air after cooling or heating enters the air duct, and then circulation cooling capacity or circulation heat is provided for the accommodating cavity.
According to the technical scheme, the thermoelectric refrigerating unit is arranged, so that the display cabinet achieves the functions of refrigeration and hot storage, and in addition, the thermoelectric cold-hot plate and the air door are arranged, so that the display cabinet achieves the function of cold-hot storage, and the positions of the cold storage area and the hot storage area are adjustable, so that the display cabinet can better meet the diversity requirements of users.
In some embodiments, the thermoelectric cold-hot plate comprises a first single-stage thermoelectric sheet group and two metal heat-conducting plates respectively covered on the upper surface and the lower surface of the first single-stage thermoelectric sheet group. According to the technical scheme, one side of the thermoelectric cold-hot plate absorbs heat and the other side of the thermoelectric cold-hot plate dissipates heat through the arrangement of the first single-stage thermoelectric sheet group, and cooling and heating are respectively supplied to the compartments on two sides of the thermoelectric cold-hot plate through the arrangement of the metal heat conducting plate.
In some of these embodiments, the thermoelectric refrigeration unit comprises:
the first heat radiator is arranged between the two second single-stage thermoelectric sheet groups in a clamping way, so that a first heat exchange area is formed between the two second single-stage thermoelectric sheet groups;
the two heat insulation plates are respectively positioned at the outer sides of the two second single-stage thermoelectric sheet groups, and a second radiator is arranged between each heat insulation plate and one second single-stage thermoelectric sheet group in a clamping way so as to form a second heat exchange area between each second single-stage thermoelectric sheet group and the corresponding heat insulation plate;
when the thermoelectric refrigeration unit is powered on with direct current in the forward direction, the return air in the cabinet body is cooled by the first heat exchange area; when the thermoelectric refrigeration unit reversely supplies direct current, return air in the cabinet body is heated and warmed through the first heat exchange area.
According to the technical scheme, through the arrangement of the two second single-stage thermoelectric sheet groups which are oppositely arranged and the first radiator between the two thermoelectric sheet groups, return air in the cabinet enters the air duct after being cooled or heated, and then the display cabinet achieves the functions of refrigeration and heat storage.
In some embodiments, the thermoelectric refrigeration unit further includes a first fan and two second fans, wherein the first fan is disposed on the air outlet side of the first heat sink, and the two second fans are disposed on the air outlet sides of the two second heat sinks, respectively.
In some embodiments, a bottom plate is arranged at the lower part of the cabinet body, a control cavity is formed between the bottom plate and the inner wall of the cabinet body, and the thermoelectric refrigeration unit is positioned in the control cavity; an air return port communicated with the accommodating cavity and an air outlet port communicated with the air duct are formed in the bottom plate, the air return port is located on the air inlet side of the first radiator, and the air outlet port is located on the air outlet side of the first radiator.
In some embodiments, the side wall of the lower part of the cabinet body is provided with an air inlet and an air outlet which are communicated with the external environment, the air inlet is positioned on the air inlet side of the second radiator, and the air outlet is positioned on the air outlet side of the second radiator.
In some embodiments, the first radiator comprises two oppositely arranged first aluminum profiles, a plurality of first heat pipes and a plurality of open-pore fins which are arranged in parallel at intervals; each first heat pipe penetrates through the plurality of perforated fins, and two ends of each first heat pipe are respectively embedded into the two first aluminum profiles; the outer walls of the two first aluminum profiles are respectively bonded and covered with two second single-stage thermoelectric sheet groups. In some embodiments, the second radiator comprises a second aluminum profile, a plurality of second heat pipes and a plurality of open-pore fins which are arranged in parallel at intervals; one end of each second heat pipe is embedded into the second aluminum profile, and the other end of each second heat pipe penetrates through a plurality of perforated fins; the outer wall of the second aluminum profile is adhered to and covers the second single-stage thermoelectric sheet group. According to the technical scheme, the aluminum profile, the heat pipe and the perforated fins are compounded, so that the first radiator and the second radiator have high-efficiency heat exchange capacity, and the refrigerating and heating effects of the display cabinet are improved.
The invention also provides a control method of the semiconductor cold and hot display cabinet, which comprises the following steps:
when the semiconductor cold-hot display cabinet only needs to refrigerate, the air door is opened, the thermoelectric cold-hot plate is not electrified, and the thermoelectric refrigeration unit positively electrified direct current so as to refrigerate the articles in each compartment;
when the semiconductor cold and hot display cabinet only needs to be heated, the air door is opened, the thermoelectric cold and hot plate is not electrified, and the thermoelectric refrigerating unit reversely electrified direct current so as to heat and store articles in each compartment;
when the semiconductor cold and hot display cabinet needs to be refrigerated and heated simultaneously, the air door is closed, and the control method of the semiconductor cold and hot display cabinet further comprises the following steps:
the thermoelectric cooling and heating sheet reversely supplies direct current, and the thermoelectric refrigerating unit positively supplies direct current so as to heat and store the articles in the uppermost compartment and refrigerate the articles in other compartments;
the thermoelectric cooling and heating sheet is powered on with direct current in the forward direction, and the thermoelectric refrigerating unit is powered on with direct current in the reverse direction, so that the articles in the uppermost compartment can be refrigerated, and meanwhile, the articles in other compartments can be stored in the hot mode.
According to the technical scheme, through the opening and closing of the air door and the electrifying control of the thermoelectric refrigerating unit and the thermoelectric cold-hot plate, four working modes of full refrigeration, full heat storage, upper heat storage and lower refrigeration and upper refrigeration and lower heat storage can be realized, and the switching of the working modes is simple and convenient.
Based on the technical scheme, the semiconductor cold and hot display cabinet and the control method thereof can enable the display cabinet to realize functions of refrigeration, hot storage and cold and hot storage, and the positions of the cold storage area and the hot storage area are adjustable, so that the diversity requirements of users are better met.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
FIG. 1 is a schematic diagram of a semiconductor cold and hot display case of the present invention;
FIG. 2 is a schematic diagram of a thermoelectric refrigeration unit according to the present invention;
FIG. 3 is a schematic diagram of a second heat sink according to the present invention;
fig. 4 is an explanatory view of a control method of the semiconductor cooling and heating showcase of the present invention.
In the figure: 1. a cabinet body; 11. a receiving chamber; 12. an air duct; 13. a compartment; 131. an uppermost compartment; 14. a control chamber; 141. an air inlet; 142. an air outlet; 2. a back wind plate; 21. an air outlet; 22. a damper; 3. a bottom plate; 31. an air return port; 32. an air outlet main port; 4. a shelf; 5. a thermoelectric cold-hot plate; 51. a first single-stage thermoelectric sheet set; 52. a metal heat-conducting plate; 6. a thermoelectric refrigeration unit; 61. a second single stage thermoelectric sheet set; 62. a first heat sink; 621. a first aluminum profile; 622. a first heat pipe; 623. a perforated fin; 63. a heat insulating plate; 64. a second heat sink; 641. a second aluminum profile; 642. a second heat pipe; 65. a first fan; 66. a second fan; z1, a first heat exchange area; z2, a second heat exchange area; 7. a glass door.
Detailed Description
The technical solutions in the embodiments will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," "front," "rear," "vertical," "horizontal," and the like indicate an orientation or a positional relationship based on that shown in fig. 1, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the invention.
The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1, the invention provides a semiconductor cold and hot display cabinet, which comprises a display cabinet body 1, a shelf 4 arranged in the cabinet body 1, a thermoelectric refrigeration unit 6 arranged at the lower part of the cabinet body 1, and a glass door 7 arranged at one side of the cabinet body 1 and used for opening or closing the cabinet body 1.
The showcase body 1 is provided with a containing cavity 11 for storing articles. One side in the cabinet body 1 is provided with a back air plate 2, an air channel 12 is formed between the back air plate 2 and the inner wall of the cabinet body 1, and the air channel 12 is communicated with the accommodating cavity 11.
The shelf 4 is disposed in the accommodating cavity 11, and has at least one number, so as to divide the accommodating cavity 11 into at least two compartments 13 from top to bottom, and each compartment 13 is mutually communicated. An air outlet 21 is arranged on the back air plate 2 corresponding to each compartment 13, and air in the air duct 12 enters the accommodating cavity 11 through the air outlet 21. An air door 22 capable of opening or closing the air outlet 21 is installed at the air outlet 21 of the uppermost compartment 131; specifically, when the damper 22 is opened, air in the air duct 12 may directly enter the uppermost compartment 131 through the air outlet 21 at the damper 22, and when the damper 22 is closed, air in the air duct 12 cannot enter the uppermost compartment 131 through the air outlet 21 at the damper 22. The uppermost shelf 4 of the at least one shelf 4 is a thermoelectric cold-hot plate 5, i.e. the thermoelectric cold-hot plate 5 is above the uppermost compartment 131. When the thermoelectric cold-hot plate 5 is positively electrified with direct current, the thermoelectric cold-hot plate supplies cold to the upper side and heat to the lower side, namely, the upper compartment 131 is internally cooled and the lower compartment 13 of the thermoelectric cold-hot plate 5 is supplied with heat; when the thermoelectric cold-hot plate 5 is reversely energized with direct current, heat is supplied to the upper side thereof and cold is supplied to the lower side thereof, that is, heat is supplied to the uppermost compartment 131 and cold is supplied to the lower compartment 13 of the thermoelectric cold-hot plate 5.
The thermoelectric cooling unit 6 is provided at the lower portion of the cabinet 1. When the thermoelectric refrigeration unit 6 is powered on with direct current in the forward direction, the return air in the cabinet body 1 is cooled, the cooled air enters the air duct 12, and then enters the accommodating cavity 11 through the air outlet 21 on the back air plate 2, and circulating cold energy is provided for the accommodating cavity 11. When the thermoelectric refrigeration unit 6 reversely electrifies direct current, the return air in the cabinet body 1 is heated, the heated air enters the air duct 12, and then enters the accommodating cavity 11 through the air outlet 21 on the back air plate 2, and circulation heat is provided for the accommodating cavity 11.
Further, when the air door 22 is opened and the thermoelectric cold-hot plate 5 is not electrified, if the thermoelectric refrigeration unit 6 is electrified with direct current in the forward direction, the circulating cold energy is provided for the whole accommodating cavity 11, so that the full refrigeration function of the display cabinet is realized; if the thermoelectric refrigeration unit 6 reversely supplies direct current, the whole accommodating cavity 11 can be provided with circulating heat, so that the full heat storage function of the display cabinet is realized. When the air door 22 is closed, if the thermoelectric cold-hot plate 5 is reversely electrified with direct current, and the thermoelectric refrigerating unit 6 is positively electrified with direct current, heat is provided for the uppermost compartment 131 and cold is provided for other compartments 13, so that the upper heat storage and lower refrigeration functions of the display cabinet are realized; if the thermoelectric cold-hot plate 5 is powered on with direct current in the forward direction and the thermoelectric refrigerating unit 6 is powered on with direct current in the reverse direction, the cold energy is provided for the uppermost compartment 131 and the heat energy is provided for the other compartments 13, so that the upper refrigerating and lower heat storage functions of the display cabinet are realized.
The above-mentioned exemplary embodiment, through the setting of thermoelectric refrigeration unit 6, make the display cabinet realize cold-stored and hot function of hiding, in addition through the setting of thermoelectric cold and hot plate 5 and air door 22, still make the display cabinet realize cold and hot function of hiding simultaneously to the position that the cold is hidden district and is hidden district with heat has the adjustability, therefore makes the display cabinet can satisfy user's various demands better.
As shown in fig. 1, in some embodiments, the thermoelectric cold-hot plate 5 includes a first single-stage thermoelectric sheet group 51 and two metal heat-conducting plates 52 respectively covering upper and lower sides of the first single-stage thermoelectric sheet group 51. It will be appreciated that the first single-stage thermoelectric sheet set 51 belongs to a thermoelectric semiconductor refrigeration module, and when current passes through the first single-stage thermoelectric sheet set 51, an endothermic phenomenon appears on one side as a cold side, and an exothermic phenomenon appears on the other side as a hot side; and when the current direction changes, the cold end and the hot end of the current change. Thus, in the exemplary embodiment, by the arrangement of the first single-stage thermoelectric sheet group 51, one side of the thermoelectric cold-hot plate 5 absorbs heat and the other side dissipates heat, and by the arrangement of the metal heat-conducting plate 52, cooling and heating are respectively supplied to the inside of the compartments 13 on both sides of the thermoelectric cold-hot plate 5; and by changing the current direction of the first single-stage thermoelectric sheet set 51, the state of cooling and heating in the compartments 13 on both sides of the thermoelectric cold-hot plate 5 can be conveniently adjusted.
As shown in fig. 2, in some embodiments, the thermoelectric refrigeration unit 6 includes two oppositely disposed second single-stage thermoelectric sheet groups 61 and two insulation panels 63 located outside the two second single-stage thermoelectric sheet groups 61, respectively. It will be appreciated that the second single-stage thermoelectric sheet set 61 belongs to a thermoelectric semiconductor refrigeration assembly, and when current passes through the second single-stage thermoelectric sheet set 61, one side is subjected to an endothermic phenomenon to become a cold side, and the other side is subjected to an exothermic phenomenon to become a hot side; when the current direction is changed, the cold end and the hot end of the current are exchanged; in this embodiment, the two second single-stage thermoelectric sheet sets 61 are disposed opposite to each other, i.e., the cold ends or the hot ends of the two thermoelectric sheet sets are disposed opposite to each other.
A first heat sink 62 is interposed between the two second single-stage thermoelectric sheet sets 61 such that a first heat exchange zone Z1 is formed between the two second single-stage thermoelectric sheet sets 61. A second heat sink 64 is sandwiched between each insulating plate 63 and a second single-stage thermoelectric sheet set 61, so that a second heat exchange zone Z2 is formed between each second single-stage thermoelectric sheet set 61 and its corresponding insulating plate 63. Further, when the thermoelectric refrigeration unit 6 is powered on with direct current in the forward direction, cold ends of the two second single-stage thermoelectric sheet groups 61 are oppositely arranged, the first heat exchange area Z1 becomes a cold area, the return air in the cabinet is cooled, and the cooled air enters the air duct 12; and the second heat exchange zone Z2 is used to dissipate heat outwards. When the thermoelectric refrigeration unit 6 reversely applies direct current, the hot ends of the two second single-stage thermoelectric sheet groups 61 are oppositely arranged, the first heat exchange area Z1 becomes a hot area, the return air in the cabinet is heated and warmed, and the heated air enters the air duct 12; and the second heat exchange zone Z2 is used to dissipate cooling energy outwards.
In the above-mentioned exemplary embodiment, through the arrangement of the two second single-stage thermoelectric sheet sets 61 and the first radiator 62 between them, the return air in the cabinet enters the air duct 12 after being cooled down or heated up, and then enters the accommodating cavity 11, so that the display cabinet realizes the functions of refrigeration and heat storage.
As shown in fig. 1-2, in some embodiments, the thermoelectric refrigeration unit 6 further includes a first fan 65 and two second fans 66, where the first fan 65 is disposed on the air outlet side of the first heat sink 62, and the two second fans 66 are disposed on the air outlet sides of the two second heat sinks 64, respectively, for driving air flow.
As shown in fig. 1-2, in some embodiments, a bottom plate 3 is provided at the lower portion of the cabinet 1, a control chamber 14 is formed between the bottom plate 3 and the inner wall of the cabinet 1, and the thermoelectric refrigeration unit 6 is located in the control chamber 14. The bottom plate 3 is provided with a return air inlet 31 communicated with the accommodating cavity 11 and an air outlet total opening 32 communicated with the air duct 12, the return air inlet 31 is positioned on the air inlet side of the first radiator 62, the air outlet total opening 32 is positioned on the air outlet side of the first radiator 62, and the return air in the cabinet is conveniently guided to flow through the first radiator 62 for heat exchange.
As shown in fig. 1-2, in some embodiments, an air inlet 141 and an air outlet 142 which are communicated with the external environment are formed on the side wall of the lower part of the cabinet body 1; the air inlet 141 is located at the air inlet side of the second radiator 64, and the air outlet 142 is located at the air outlet side of the second radiator 64, so that heat or cold of the second heat exchange area Z2 is conveniently taken away and discharged to the outside of the cabinet 1.
As shown in fig. 2-3, in some embodiments, the first heat sink 62 includes two oppositely disposed first aluminum profiles 621, a plurality of first heat pipes 622, and a plurality of parallel spaced apart perforated fins 623. Each first heat pipe 622 penetrates through the plurality of perforated fins 623, and two ends of the first heat pipe 622 are respectively embedded into the two first aluminum profiles 621. The outer walls of the two first aluminum profiles 621 are respectively bonded to and cover the two second single-stage thermoelectric sheet sets 61. In some of these embodiments, the second heat sink 64 includes a second aluminum profile 641, a plurality of second heat pipes 642, and a plurality of parallel spaced apart perforated fins 623. One end of each second heat pipe 642 is embedded into the second aluminum profile 641, and the other end penetrates through the plurality of perforated fins 623. The outer wall of the second aluminum profile 641 is bonded to and covers the second single-stage thermoelectric sheet set 61. It can be understood that the heat pipe is a heat transfer element with high heat conduction performance, and the heat transfer is carried out by evaporating and condensing working medium in the totally-enclosed tube shell, so that the heat transfer efficiency is high and the speed is high; in addition, the aluminum profile has good heat conduction performance, and the perforated fins 623 have good heat dissipation effect, so that the first radiator 62 and the second radiator 64 have high-efficiency heat exchange capability through the structural combination of the aluminum profile, the heat pipe and the perforated fins 623, and the refrigerating and heating effects of the display cabinet are improved.
The invention also provides a control method of the semiconductor cold and hot display cabinet, which is shown in combination with fig. 1-4, and specifically comprises the following steps:
1) When the semiconductor cold and hot display cabinet only needs to be refrigerated, the air door 22 is opened, the thermoelectric cold and hot plate 5 is not electrified, the thermoelectric refrigeration unit 6 positively supplies direct current, the return air in the cabinet body 1 flows through the first heat exchange area Z1 to be cooled, the cooled air enters the air duct 12 through the air outlet main port 32 and then enters each compartment 13 through the air duct 12 and each air outlet 21, and the objects in the display cabinet are refrigerated, as shown by solid arrows in fig. 1; meanwhile, the ambient air outside the cabinet 1 enters the control cavity 14 through the air inlet 141, flows through the second heat exchange area Z2 to take away heat, and then is discharged out of the cabinet 1 through the air outlet 142, as shown by a dotted arrow in FIG. 1;
2) When the semiconductor cold and hot display cabinet only needs to be heated, the air door 22 is opened, the thermoelectric cold and hot plate 5 is not electrified, the thermoelectric refrigeration unit 6 reversely supplies direct current, the return air in the cabinet body 1 flows through the first heat exchange area Z1 to be heated, the heated air enters the air duct 12 through the air outlet main port 32, and then enters each compartment 13 through the air duct 12 and each air outlet 21 to heat and store articles in the display cabinet; meanwhile, the ambient air outside the cabinet 1 enters the control cavity 14 through the air inlet 141, flows through the second heat exchange area Z2 to take away cold, and then is discharged out of the cabinet 1 through the air outlet 142;
3) When the semiconductor cold and hot display cabinet needs to be cooled and heated simultaneously, the air door 22 is closed, and at this time, the control method of the semiconductor cold and hot display cabinet further comprises the following steps:
the thermoelectric cold and hot sheets reversely supply direct current to supply heat to the upper side thereof to heat and store articles in the uppermost compartment 131 and simultaneously supply cold to the lower side thereof; the thermoelectric refrigeration unit 6 is positively electrified with direct current to cool the return air in the cabinet body 1, and the cooled air enters other compartments 13 except the uppermost compartment 131 through the air duct 12 and the air outlet 21 to refrigerate the articles in the compartments;
the thermoelectric cold and hot sheet positively supplies direct current, and supplies cold to the upper side thereof to cool the articles in the uppermost compartment 131 while supplying heat to the lower side thereof; the thermoelectric refrigeration unit 6 reversely supplies direct current to heat and raise the temperature of the return air in the cabinet body 1, and the heated air enters other compartments 13 except the uppermost compartment 131 through the air duct 12 and the air outlet 21 to heat and store the articles in the compartments.
In the above-mentioned exemplary embodiment, through the opening and closing of the air door 22 and the power-on control of the thermoelectric refrigeration unit 6 and the thermoelectric cold-hot plate 5, four working modes of full refrigeration, full heat storage, upper heat storage, lower refrigeration and upper refrigeration, lower heat storage can be realized for the showcase, and the switching of each working mode can be realized by changing the opening and closing state of the air door 22 and the power-on direction of the thermoelectric refrigeration unit 6 and the thermoelectric cold-hot plate 5, so that the operation is simple and convenient.
In summary, according to the semiconductor cold-hot display cabinet and the control method thereof, the functions of refrigeration, hot storage and cold-hot storage can be realized by the arrangement of the thermoelectric refrigeration unit, the thermoelectric cold-hot plate and the air door and the power-on control, and the positions of the cold storage area and the hot storage area are adjustable, so that the diversity requirements of users can be better met; in addition, the semiconductor cold and hot display cabinet is different from the common compression refrigeration display cabinet in the market, is based on the semiconductor refrigeration technology, and does not need to be provided with the common compressor, evaporator, condenser and other parts for compression refrigeration, so that the display cabinet has fewer parts and a more compact structure; in addition, the first radiator and the second radiator which are formed by compounding the aluminum profile, the heat pipe and the perforated fins have high-efficiency heat exchange capacity, and the refrigerating and heating effects of the semiconductor cold and hot display cabinet are improved.
Finally, it should be noted that: in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same; while the invention has been described in detail with reference to the preferred embodiments, those skilled in the art will appreciate that: modifications may be made to the specific embodiments of the present invention or equivalents may be substituted for part of the technical features thereof; without departing from the spirit of the invention, it is intended to cover the scope of the invention as claimed.
Claims (8)
1. A semiconductor cold and hot display cabinet, comprising:
the cabinet body is provided with a containing cavity for storing articles therein; the cabinet body is internally provided with a back wind plate, an air channel is formed between the back wind plate and the inner wall of the cabinet body, and the air channel is communicated with the accommodating cavity;
at least one shelf arranged in the accommodating cavity to divide the accommodating cavity into at least two compartments from top to bottom, wherein the compartments are communicated with each other; an air outlet is formed in the back air plate corresponding to each compartment, and an air door capable of opening or closing the air outlet is arranged at the air outlet of the compartment at the uppermost part; the shelf at the uppermost layer is a thermoelectric cold-hot plate, and the thermoelectric cold-hot plate comprises a first single-stage thermoelectric sheet group and two metal heat-conducting plates respectively covered on the upper surface and the lower surface of the first single-stage thermoelectric sheet group; when direct current is positively supplied to the thermoelectric cold-hot plate, cooling is supplied to the upper part of the thermoelectric cold-hot plate and heat is supplied to the lower part of the thermoelectric cold-hot plate; when the thermoelectric cold-hot plate reversely electrifies direct current, heat is supplied to the upper part of the thermoelectric cold-hot plate and cold is supplied to the lower part of the thermoelectric cold-hot plate;
the thermoelectric refrigerating unit is arranged at the lower part of the cabinet body; when the thermoelectric refrigeration unit is powered on with direct current in the forward direction, the return air in the cabinet body is cooled; when the thermoelectric refrigeration unit reversely electrifies direct current, the return air in the cabinet body is heated; and air subjected to cooling or heating enters the air duct, and then enters the accommodating cavity through the air outlet on the leeward plate, so that circulating cold or circulating heat is provided for the accommodating cavity.
2. The semiconductor hot and cold display case of claim 1, wherein the thermoelectric refrigeration unit comprises:
the heat exchanger comprises two oppositely arranged second single-stage thermoelectric sheet groups, wherein a first radiator is clamped between the two second single-stage thermoelectric sheet groups so as to form a first heat exchange area between the two second single-stage thermoelectric sheet groups;
the two heat insulation plates are respectively positioned at the outer sides of the two second single-stage thermoelectric sheet groups, and a second radiator is clamped between each heat insulation plate and one second single-stage thermoelectric sheet group so as to form a second heat exchange area between each second single-stage thermoelectric sheet group and the corresponding heat insulation plate;
when the thermoelectric refrigeration unit is positively electrified with direct current, the return air in the cabinet body is cooled by the first heat exchange area; when the thermoelectric refrigeration unit reversely electrifies direct current, return air in the cabinet body is heated and warmed through the first heat exchange area.
3. The semiconductor hot and cold display case according to claim 2, wherein the thermoelectric refrigeration unit further comprises a first fan and two second fans, the first fan is disposed on the air outlet side of the first heat sink, and the two second fans are disposed on the air outlet sides of the two second heat sinks, respectively.
4. The semiconductor cold and hot display cabinet according to claim 2, wherein a bottom plate is arranged at the lower part of the cabinet body, a control cavity is formed between the bottom plate and the inner wall of the cabinet body, and the thermoelectric refrigeration unit is positioned in the control cavity; the bottom plate is provided with an air return port communicated with the accommodating cavity and an air outlet port communicated with the air duct, the air return port is positioned on the air inlet side of the first radiator, and the air outlet port is positioned on the air outlet side of the first radiator.
5. The semiconductor cold and hot display cabinet according to claim 2, wherein an air inlet and an air outlet which are communicated with the external environment are formed in the side wall of the lower portion of the cabinet body, the air inlet is located at the air inlet side of the second radiator, and the air outlet is located at the air outlet side of the second radiator.
6. The semiconductor cold and hot display cabinet according to claim 2, wherein the first radiator comprises two oppositely arranged first aluminum profiles, a plurality of first heat pipes and a plurality of perforated fins which are arranged in parallel at intervals; each first heat pipe penetrates through a plurality of perforated fins, and two ends of each first heat pipe are respectively embedded into two first aluminum profiles; the outer walls of the two first aluminum profiles are respectively bonded and covered with the two second single-stage thermoelectric sheet groups.
7. The semiconductor cold and hot display case of claim 2, wherein the second heat sink comprises a second aluminum profile, a plurality of second heat pipes and a plurality of open-pore fins arranged in parallel at intervals; one end of each second heat pipe is embedded into the second aluminum profile, and the other end of each second heat pipe penetrates through a plurality of perforated fins; and the outer wall of the second aluminum profile is adhered to and covers the second single-stage thermoelectric sheet group.
8. A method of controlling a semiconductor hot and cold display case according to any one of claims 1 to 7, comprising:
when the semiconductor cold and hot display cabinet only needs to be refrigerated, the air door is opened, the thermoelectric cold and hot plate is not electrified, and the thermoelectric refrigeration unit is positively electrified with direct current so as to refrigerate the articles in each compartment;
when the semiconductor cold-hot display cabinet only needs to be heated, the air door is opened, the thermoelectric cold-hot plate is not electrified, and the thermoelectric refrigeration unit reversely electrifies direct current so as to heat and store articles in each compartment;
when the semiconductor cold and hot display cabinet needs to be refrigerated and heated simultaneously, the air door is closed, and the control method of the semiconductor cold and hot display cabinet further comprises the following steps:
the thermoelectric cooling and heating sheet reversely supplies direct current, and the thermoelectric cooling unit positively supplies direct current to heat and store the uppermost articles in the compartments and cool other articles in the compartments;
the thermoelectric cooling and heating sheet is powered on with direct current in the forward direction, and the thermoelectric cooling unit is powered on with direct current in the reverse direction, so that the uppermost articles in the compartments are refrigerated, and meanwhile, the articles in the other compartments are heated.
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