CN214791997U

CN214791997U - Cold and hot dual-purpose box

Info

Publication number: CN214791997U
Application number: CN202023330142.4U
Authority: CN
Inventors: 李大伟; 张书锋
Original assignee: Wuhan Haier Refrigerator Co ltd
Current assignee: Wuhan Haier Refrigerator Co ltd
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-11-19
Anticipated expiration: 2030-12-30

Abstract

The utility model provides a cold and hot dual-purpose case, including the box, the door body, room between two at least storing and for the semiconductor refrigerating system of room heat transfer between two at least storing, semiconductor refrigerating system includes two at least semiconductor refrigerating plant for room heat transfer between two at least storing respectively, and every semiconductor refrigerating plant includes the actuating mechanism who switches between cold junction and hot junction for the heat transfer end and the drive heat transfer end of room heat transfer between the storing that corresponds. The heat exchange end is switched between the cold end and the hot end through the driving of the driving mechanism, the semiconductor refrigerating device can selectively refrigerate or heat the storage room according to needs, the temperature range applicable to the cold and hot dual-purpose box is larger, the requirements of freezing, refrigerating and heating are met, at least two storage rooms can be used for refrigerating and heating, or part of the storage rooms are used for refrigerating other storage rooms and heating, and therefore the application range of the cold and hot dual-purpose box is enlarged.

Description

Cold and hot dual-purpose box

Technical Field

The utility model relates to a refrigeration plant technical field especially relates to a cold and hot dual-purpose case.

Background

The refrigeration case commonly used in the existing market only has a refrigeration function, and when the temperature needs to be raised or the heating needs are met, the refrigeration can be stopped, the temperature of the refrigeration case can be naturally adjusted by depending on the external environment, the process is slow, the temperature range is limited, especially when the refrigeration case has the cooling needs and the heating needs, the existing refrigeration case can not meet the requirements completely, and the use flexibility and the application range of the refrigeration case are limited greatly.

Disclosure of Invention

In order to solve the technical problem, an object of the utility model is to provide a cold and hot dual-purpose case to solve the problem that current refrigeration case only can supply cold and can not supply heat and can't satisfy the demand of cooling and heat supply simultaneously.

In order to realize one of the above-mentioned utility model aims, the utility model discloses an embodiment provides a cold and hot dual-purpose case, including the box and the door body, still include two at least storing rooms and give the semiconductor refrigerating system of room heat transfer between two at least storing rooms, semiconductor refrigerating system includes and gives respectively two at least semiconductor refrigerating plant of room heat transfer between two at least storing rooms, every semiconductor refrigerating plant includes for corresponding the heat transfer end and the drive of room heat transfer between the storing the actuating mechanism that the heat transfer end switched between cold junction and hot junction.

As a further improvement of an embodiment of the present invention, the dual-purpose box further includes a controller, and the controller is connected to and used for controlling the driving mechanism to be powered on and opened.

As an embodiment of the utility model provides a further improvement, the dual-purpose case of cold and hot includes two that set up side by side from top to bottom the room and give respectively between the storing two semiconductor refrigeration devices of room heat transfer between the storing, one of them of two semiconductor refrigeration devices locates in the roof of the dual-purpose case of cold and hot and give and be located the top room heat transfer between the storing, one of them another of two semiconductor refrigeration devices locates in the diapire of the dual-purpose case of cold and hot and give and be located the below room heat transfer between the storing.

As a further improvement of an embodiment of the present invention, a duct system is respectively disposed in the top wall and the bottom wall, the duct system includes an installation cavity, a first duct close to the storage compartment, and a second duct far from the storage compartment, extending directions of the first duct and the second duct intersect with each other and are not parallel to each other, the installation cavity is disposed at an intersection of the first duct and the second duct, and the installation cavity is respectively communicated with the first duct and the second duct;

the semiconductor refrigerating device comprises a semiconductor refrigerating piece and two air guide assemblies, wherein the semiconductor refrigerating piece comprises a heat exchange end and a heat dissipation end opposite to the heat exchange end, the semiconductor refrigerating piece is contained in the installation cavity and enables the first air duct and the second air duct to be isolated at the installation cavity, one of the two air guide assemblies is in heat conduction connection with the heat exchange end and extends into the first air duct from the heat exchange end, and the other of the two air guide assemblies is in heat conduction connection with the heat dissipation end and extends into the second air duct from the heat dissipation end.

As a further improvement of an embodiment of the present invention, the extending directions of the first air duct and the second air duct are perpendicular to each other.

As a further improvement of an embodiment of the present invention, the side portions of the top wall and the bottom wall are both provided with air outlets, and the second air duct communicates the installation cavity and the air outlets; the surfaces of the top wall and the bottom wall facing the storage compartments respectively correspond to the top wall and the bottom wall are provided with first air supply openings, and the first air channel is communicated with the mounting cavity and the first air supply openings.

As an embodiment of the utility model provides a further improvement, every all be provided with the supply-air duct that extends from top to bottom in the outdoor lateral wall in storing room, the one end intercommunication of supply-air duct first supply-air outlet, the internal face of lateral wall is provided with the second supply-air outlet, the second supply-air outlet intercommunication between the storing room with the supply-air duct.

As a further improvement of an embodiment of the present invention, the second supply-air outlet is provided in plurality side by side at an upper and lower interval, and is a plurality of the area of the second supply-air outlet is gradually increased along the direction away from the heat exchanging end.

As a further improvement of an embodiment of the present invention, the air guiding assembly includes a centrifugal fan, the top wall and the bottom wall are respectively provided with an air inlet, and the air inlet communicates with an air suction port of the centrifugal fan located in the second air duct and an external environment of the cold and hot dual-purpose box; the top wall and the bottom wall are respectively provided with an air return inlet which is communicated with the storage chamber and an air suction inlet of the centrifugal fan positioned in the first air channel.

As an embodiment of the present invention, the air guiding assembly includes a fin set, a centrifugal fan and a heat conducting connection, the fin set and the heat conducting base of the semiconductor refrigerating sheet, the fin set is annular and the inner ring surface thereof encloses a cavity, the centrifugal fan is disposed in the cavity, the fin set includes a plurality of fins, the wind blown out by the centrifugal fan is adjacent to the gap between the fins, and is sent to the first wind channel or the second wind channel.

Compared with the prior art, the utility model discloses following beneficial effect has: the utility model discloses a cold and hot dual-purpose case, its beneficial effect lies in, through drive heat transfer end switch between cold junction and hot junction of actuating mechanism drive, when the heat transfer end switches to the cold junction, semiconductor refrigerating plant supplies cold volume to the storing compartment, and gives off heat to the external environment; when the heat exchange end is switched to the hot end, the semiconductor refrigerating device supplies heat to the storage chambers and gives off cold to the external environment, so that the storage chambers are selectively refrigerated or heated according to needs, the applicable temperature range of the cold and hot dual-purpose box is wider, the requirements of freezing, refrigerating and heating are met, and each storage chamber is provided with an independent semiconductor refrigerating device, namely at least two storage chambers can be used for refrigerating and heating, or part of the storage chambers are used for refrigerating and the rest of the storage chambers are used for heating, so that the application range of the cold and hot dual-purpose box is expanded.

Drawings

Fig. 1 is a schematic cross-sectional view of a cooling and heating dual-purpose box according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of another angle of the dual-purpose cooling and heating box according to an embodiment of the present invention;

fig. 3 is a schematic perspective view of a semiconductor refrigeration device according to an embodiment of the present invention;

fig. 4 is a schematic perspective view of an air guide assembly according to an embodiment of the present invention;

fig. 5 is a schematic view of a connection structure between the semiconductor refrigeration sheet and the air guide assembly according to an embodiment of the present invention.

Detailed Description

The present invention will be described in detail below with reference to specific embodiments shown in the drawings.

In the various figures of the present invention, certain dimensions of structures or portions are exaggerated relative to other structures or portions for ease of illustration, and thus, are used only to illustrate the basic structure of the subject matter of the present invention.

It will be understood that, although the terms first, second, etc. may be used herein to describe various elements or structures, these described elements should not be limited by these terms. These terms are only used to distinguish these descriptive objects from one another.

Referring to fig. 1 to 2, an embodiment of the present invention provides a cold and hot dual-purpose box 100, including box 1, door body 2, at least two storage compartments 3, and the semiconductor refrigeration system for the heat exchange of at least two storage compartments 3, the semiconductor refrigeration system includes at least two semiconductor refrigeration devices 5 for the heat exchange of at least two storage compartments 3 respectively, and each semiconductor refrigeration device 5 includes a heat exchange end 511 for the heat exchange of corresponding storage compartments 3 and a driving mechanism for driving the heat exchange end 511 to switch between a cold end and a hot end. When the heat exchanging end 511 is switched to the cold end, the semiconductor refrigerating device 5 supplies cold energy to the storage compartment 3 and radiates heat to the external environment; when the heat exchanging end 511 is switched to a hot end, the semiconductor refrigeration device 5 supplies heat to the storage compartment 3 and emits cold to the external environment. In this way, the heat exchange end 511 can be switched between the cold end and the hot end through the driving mechanism, so that the storage compartments 3 can be selectively cooled or heated according to needs, the temperature range applicable to the cold and hot dual-purpose box 100 can be larger, and the requirements of freezing, refrigerating and heating can be met, each storage compartment 3 is provided with an independent semiconductor cooling device 5, that is, at least two storage compartments 3 can be used for cooling and can also be used for heating, or part of the storage compartments 3 are used for cooling and the rest of the storage compartments 3 are used for heating, so that the application range of the cold and hot dual-purpose box 100 is expanded.

Further, the cold and hot dual-purpose box 100 further comprises a controller, wherein the controller is connected with the driving mechanism and used for controlling the driving mechanism to be powered on and switched on, so that the heat exchange end 511 of the semiconductor refrigerating device 5 is driven to be switched between the cold end and the hot end to exchange heat for the corresponding storage compartment 3, the refrigerating effect and the heating effect of each storage compartment 3 are switched, and the intelligent level of the cold and hot dual-purpose box 100 is improved.

For convenience of description, with reference to the hot and cold box 100 facing the user, the side of the box body 1 facing the user is defined as front, the side of the box body 1 facing away from the user is defined as rear, and the left-right direction of the user is defined as the left-right direction in the present embodiment.

Referring to fig. 1 to 2, in the present embodiment, specifically, the cold and hot dual-purpose box 100 includes two storage compartments 3, the semiconductor refrigeration system includes two semiconductor refrigeration devices 5 that respectively exchange heat for the two storage compartments 3, and each semiconductor refrigeration device 5 includes a heat exchanging end 511 that exchanges heat for the corresponding storage compartment 3, and a driving mechanism that drives the heat exchanging end 511 to switch between a cold end and a hot end. The two storage compartments 3 may be used for both cooling and heating, or one of the two storage compartments 3 may be used for cooling and the other may be used for heating, so that the application range of the hot and cold dual-purpose box 100 is expanded.

Specifically, the box body 1 encloses a storage space, and the storage space is divided into two storage compartments 3 which are arranged side by side from top to bottom. Of course, in other embodiments, the storage space may be divided into three or more storage compartments 3, and the semiconductor refrigeration system includes the same number of semiconductor refrigeration devices 5 as the storage compartments 3, and each semiconductor refrigeration device 5 exchanges heat with its corresponding storage compartment 3.

The two storage compartments 3 are respectively provided with a front opening, the door body 2 is positioned in front of the box body 1 and used for opening or closing the storage compartments 3, one of the two semiconductor refrigerating devices 5 is arranged in the top wall 11 of the cold and hot dual-purpose box 100 and exchanges heat for the storage compartment 3 positioned above, the other of the two semiconductor refrigerating devices 5 is arranged in the bottom wall 12 of the cold and hot dual-purpose box 100 and exchanges heat for the storage compartment 3 positioned below, and therefore the two storage compartments 3 can have different temperatures, and different temperature requirements are met.

In other embodiments, the storage space may be divided into two storage compartments 3 arranged side by side left and right, the two storage compartments 3 respectively have a front opening or an upper opening, and the two semiconductor refrigeration devices 5 are respectively arranged in the two opposite side walls 13 of the box body 1 and respectively exchange heat with the two storage compartments 3.

Referring to fig. 1 to 2, in the present embodiment, a partition plate 4 is used to divide the storage space into two storage compartments 3, and preferably, the partition plate 4 is a heat-insulating partition plate 4, so that the two storage compartments 3 are prevented from being affected by heat exchange from the partition plate 4.

In addition, the cold and hot dual-purpose box 100 further includes two air duct systems respectively matched with the two semiconductor refrigeration devices 5, the two air duct systems are respectively arranged in the top wall 11 and the bottom wall 12, and the two semiconductor refrigeration devices 5 corresponding to the two storage compartments 3 and the air duct systems have the same structure except that the arrangement positions are different.

The storage compartment 3 located above, the semiconductor refrigeration device 5 located in the top wall 11 corresponding to the storage compartment, and the air duct system are taken as an example for description, and the storage compartment 3 located below, the semiconductor refrigeration device 5 corresponding to the storage compartment, and the air duct system are mirror-symmetric to each other, and detailed description thereof is omitted.

The top wall 11 is provided with a heat insulating layer 111 and the air duct system, the air duct system comprises an installation cavity, a first air duct 112 close to the storage compartment 3 and a second air duct 113 far away from the storage compartment 3, the extension directions of the first air duct 112 and the second air duct 113 are crossed with each other and are not parallel to each other, so that the heat exchange between the first air duct 112 and the second air duct 113 can be reduced, the installation cavity is arranged at the crossed position of the first air duct 112 and the second air duct 113, and the installation cavity is respectively communicated with the first air duct 112 and the second air duct 113, so that the cold quantity and heat transmission path of the semiconductor refrigerating device 5 can be shortened, and the heat exchange efficiency and the heat dissipation efficiency are improved.

Specifically, the first air duct 112, the mounting cavity and the second air duct 113 in the top wall 11 are sequentially arranged from bottom to top, and correspondingly, the first air duct 112, the mounting cavity and the second air duct 113 in the bottom wall 12 are sequentially arranged from top to bottom. Therefore, the first air duct 112 is close to the storage compartment 3 relative to the second air duct 113, so that the distance between the heat exchanging end 511 and the storage compartment 3 can be reduced, the heat exchanging efficiency is improved, and the heat exchanging end 511 is prevented from exchanging heat with the external environment.

Referring to fig. 3, the semiconductor refrigeration device 5 includes a semiconductor refrigeration sheet 51 and two air guide assemblies 52, the semiconductor refrigeration sheet 51 includes a heat exchanging end 511 and a heat dissipating end 512 opposite to the heat exchanging end 511, the semiconductor refrigeration sheet 51 is accommodated in the installation cavity and isolates the first air duct 112 and the second air duct 113 at the installation cavity, so as to prevent heat and cold exchange at the installation cavity, improve heat exchange efficiency and reduce energy consumption.

One of the two air guiding assemblies 52 is connected with the heat exchanging end 511 in a heat conducting manner and extends into the first air duct 112 from the heat exchanging end 511, and the other one of the two air guiding assemblies 52 is connected with the heat dissipating end 512 in a heat conducting manner and extends into the second air duct 113 from the heat dissipating end 512.

When the heat exchange end 511 of the semiconductor refrigeration device 5 is switched to the cold end, correspondingly, the heat dissipation end 512 is switched to the hot end, the heat exchange end 511 is insulated and isolated from the external environment of the cold and hot dual-purpose box 100 through the heat insulation layer 111 of the top wall 11 and supplies cold energy to the storage compartment 3, the cold energy can be conducted to the first air duct 112 through the air guide assembly 52 and then supplied to the storage compartment 3 and refrigerates the storage compartment 3, the heat dissipation end 512 is insulated and isolated from the storage compartment 3 through the heat insulation layer 111 of the top wall 11 and radiates heat to the external environment of the cold and hot dual-purpose box 100, and the heat can be conducted to the second air duct 113 through the air guide assembly 52 and then radiated to the external environment; when the heat exchanging end 511 of the semiconductor refrigerating device 5 is switched to the hot end, correspondingly, the heat dissipating end 512 is switched to the cold end, the heat exchanging end 511 is insulated and isolated from the external environment of the cold and hot dual-purpose box 100 through the heat insulating layer 111 of the top wall 11 and supplies heat to the storage compartment 3, the heat can conduct the air guiding assembly 52 to the first air duct 112 and further supplies the heat to the storage compartment 3 and refrigerates the storage compartment 3, the heat dissipating end 512 is insulated and isolated from the storage compartment 3 through the heat insulating layer 111 of the top wall 11 and dissipates cold to the external environment of the cold and hot dual-purpose box 100, and the cold can conduct the air guiding assembly 52 to the second air duct 113 and further dissipates to the external environment.

Referring to fig. 1 to 2, it is preferable that the first air duct 112 and the second air duct 113 extend in directions perpendicular to each other, so that the overlapping area of the first air duct 112 and the second air duct 113 and the heat and cold exchange are minimized.

Referring to fig. 4, the air guide assembly 52 includes a fin set 521, a centrifugal fan 522, and a heat conducting base 523, the heat conducting base 523 is connected to the fin set 521 and the semiconductor chilling plate 51 in a heat conducting manner, the fin set 521 is annular, and an inner annular surface of the fin set 521 encloses a cavity, the centrifugal fan 522 is disposed in the cavity, the fin set 521 includes a plurality of fins, and air blown by the centrifugal fan 522 is sent to the first air duct 112 or the second air duct 113 through gaps between adjacent fins.

With reference to fig. 1 to 3, further, the insulating layer 111 includes a heat insulation sheet 1111 formed at the intersection of the first air duct 112 and the second air duct 113, the installation cavity is provided as a channel penetrating the heat insulation sheet 1111 from top to bottom, the semiconductor refrigeration sheet 51 is horizontally disposed in the channel, and the periphery of the semiconductor refrigeration sheet is attached to the inner wall of the installation cavity. In another way, the heat insulation sheet 1111 is provided with the installation cavity surrounding the semiconductor refrigeration sheet 51, and the heat insulation sheet 1111 extends outwards from the periphery of the semiconductor refrigeration sheet 51 to the outer annular surface of the protruding fin group 521, specifically, in the present embodiment, the heat insulation sheet 1111 extends outwards from the periphery of the semiconductor refrigeration sheet 51 to the outer annular surface of the protruding fin group 521 far away from the semiconductor refrigeration sheet 51. In this way, the first air duct 112 and the second air duct 113 are isolated by the semiconductor refrigeration sheet 51, so that cold and heat exchange from the installation cavity is avoided, and the first air duct 112 and the second air duct 113 are isolated by the heat insulation sheet 1111, so that cold and heat exchange between the first air duct 112 and the second air duct 113 is further avoided.

With reference to fig. 1 and fig. 2, further, a first groove is formed on the upper surface of the insulating layer 111, and a second air duct 113 is enclosed between a groove wall of the first groove and the upper cover plate 114 of the top wall 11; the lower surface of the insulating layer 111 is provided with a second groove, and a first air duct 112 is enclosed between the groove wall of the second groove and the lower cover plate 115 of the top wall 11. In this way, only the upper cover plate 114 is arranged between the second air duct 113 and the external environment, which is beneficial to the heat exchange between the second air duct 113 and the external environment through the upper cover plate 114, and the heat exchange efficiency can be further improved, and only the lower cover plate 115 is arranged between the first air duct 112 and the storage compartment 3, which is beneficial to the heat exchange between the first air duct 112 and the storage compartment 3 through the lower cover plate 115, and the heat exchange efficiency can be further improved.

Specifically, in this embodiment, first recess is located the top of second recess, the installation cavity set up in first recess with the intersection of second recess, the installation cavity is linked together respectively with first recess and second recess, has completely cut off the heat exchange of second wind channel 113 and storing room 3 and the heat exchange between first wind channel 112 and the external environment through heat preservation 111 and semiconductor refrigeration piece 51 like this, has avoided the energy consumption to increase.

Referring to fig. 1 to 2, further, an air outlet 116 is disposed at a side portion of the top wall 11, and the second air duct 113 communicates the installation cavity with the air outlet 116. Specifically, in this embodiment, the two air outlets 116 are disposed on two opposite sides of the top wall 11, and thus the second air duct 113 extends from the mounting cavity to two opposite directions to the two air outlets 116, that is, two opposite ends of the second air duct 113 extend to two opposite sides of the top wall 11 and form two air outlets 116 at the intersection of two pairs of two side plates of the top wall 11, so as to improve the heat exchange efficiency.

Referring to fig. 1, further, a first air supply outlet 117 is formed in a surface of the top wall 11 facing the corresponding storage compartment 3, specifically, the first air supply outlet 117 is disposed on a lower cover plate 115 of the top wall 11, and the first air duct 112 communicates the installation cavity and the first air supply outlet 117, so that heat or cold generated by the heat exchanging end 511 can flow into the storage compartment 3 from the first air duct 112, thereby realizing heat exchange.

Referring to fig. 1, further, an air supply duct 131 extending up and down is provided in the side wall 13 of each storage compartment 3, one end of the air supply duct 131 is communicated with the first air supply opening 117, a second air supply opening 132 is provided on the inner wall surface of the side wall 13, and the second air supply opening 132 is communicated with the storage compartment 3 and the air supply duct 131. In this way, the heat exchange end 511 of the semiconductor refrigeration sheet 51 exchanges heat with the storage compartment 3 sequentially through the first air duct 112, the first air supply outlet 117, the air supply duct 131 and the second air supply outlet 132, so that cold or heat can be uniformly distributed in the storage compartment 3, and the temperature uniformity in the storage compartment 3 can be improved.

Referring to fig. 1, a plurality of second air supply outlets 132 are arranged in parallel at intervals up and down, and the area of the plurality of second air supply outlets 132 is gradually increased along the direction far away from the heat exchanging end 511, so that the temperature uniformity in the storage compartment 3 in the up-down direction can be further improved.

Referring to fig. 1 to 2, further, the upper cover plate 114 of the top wall 11 is provided with an air inlet 118, and the air inlet 118 is communicated with the external environment and an air suction opening of the centrifugal fan 522 located in the second air duct 113, so that the centrifugal fan 522 located in the second air duct 113 can suck air from the external environment, thereby forming an air circulation between the second air duct 113 and the external environment. The lower cover plate 115 of the top wall 11 is provided with an air return opening 119, and the air return opening 119 is communicated with the storage compartment 3 and an air suction opening of the centrifugal fan 522 positioned in the first air duct 112, so that the centrifugal fan 522 positioned in the first air duct 112 can suck air from the storage compartment 3, and air circulation is formed among the first air duct 112, the air supply duct 131 and the storage compartment 3.

Referring to fig. 1 to 4, in the air guiding assembly 52, the heat conducting base 523 is disposed at one axial end of the fin set 521, and a side surface of the heat conducting base 523 facing away from the fin set 521 abuts against the semiconductor chilling plate 51, so that the heat conducting base 523 conducts heat or cold generated by the semiconductor chilling plate 51 to the fin set 521.

Referring to fig. 4, in particular, in the present embodiment, the heat conducting base 523 is in a circular truncated cone shape. The fin group 521 and the semiconductor chilling plate 51 are respectively located at two axial sides of the heat conduction base 523, and on a plane perpendicular to the axial direction of the heat conduction base 523, the projection of the heat conduction base 523 completely blocks the projection of the semiconductor chilling plate 51. In this way, the heat and cold generated from the semiconductor chilling plates 51 can be conducted and utilized to the maximum.

Furthermore, each fin extends straightly from the inner end to the outer end, so that the circulation path of heat or cold between adjacent fins is shortened, and the heat exchange efficiency is improved.

Further, each of the fins of the fin group 521 extends straight along the axial direction of the fin group 521, so that the centrifugal fan 522 blows heat or cold on the fin to the first air duct 112 or the second air duct 113, and the heat exchange efficiency is improved.

Further, the fin group 521 and the heat conduction base 523 are integrally arranged, so that the assembling procedures are reduced, and the connection firmness of the fin group 521 and the heat conduction base 523 is improved.

Preferably, the heat conducting base 523 is a metal plate or an alloy plate with good heat conducting performance, which can improve the conductivity and heat exchange efficiency of the heat and cold generated by the semiconductor cooling plate 51. In the present embodiment, the heat conductive base 523 is made of an aluminum plate.

Referring to fig. 3 to 4, further, in this example, the fin group 521 is annular, so that on one hand, the number of air outlet channels is increased, air outlet at 360 ° can be realized, and heat exchange efficiency is improved, and on the other hand, the fin group can be adapted to the first air duct 112 and the second air duct 113, so that the air outlet efficiency is ensured, and at the same time, the occupied space of the first air duct 112 and the second air duct 113 is reduced.

Compared with the prior art, the cold and hot dual-purpose box 100 has the advantages that the driving mechanism drives the heat exchanging end 511 to be switched between the cold end and the hot end, and when the heat exchanging end 511 is switched to be the cold end, the semiconductor refrigerating device 5 supplies cold energy to the storage compartment 3 and radiates heat to the external environment; when the heat exchanging end 511 is switched to a hot end, the semiconductor refrigerating device 5 supplies heat to the storage compartments 3 and emits cold to the external environment, so that the storage compartments 3 are selectively refrigerated or heated as required, the applicable temperature range of the cold and hot dual-purpose box 100 is wider, and the requirements of freezing, refrigerating and heating are met, each storage compartment 3 is provided with an independent semiconductor refrigerating device 5, that is, at least two storage compartments 3 can be used for refrigerating and heating, or part of the storage compartments 3 are used for refrigerating and the rest of the storage compartments 3 are used for heating, so that the applicable range of the cold and hot dual-purpose box 100 is expanded.

In the description of the present invention, it should be understood that the words "upper", "lower", "inner", "outer", "left", "right", "front", "rear", etc. indicating the orientation or positional relationship are all referred to the directions defined herein, and these words indicating the orientation or positional relationship are only for convenience of description of the present invention and simplification of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.

The above list of details is only for the practical implementation of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the technical spirit of the present invention should be included in the scope of the present invention.

Claims

1. The cold and hot dual-purpose box comprises a box body and a door body, and is characterized by further comprising at least two storage chambers and a semiconductor refrigerating system for exchanging heat for the at least two storage chambers, wherein the semiconductor refrigerating system comprises at least two semiconductor refrigerating devices for exchanging heat for the at least two storage chambers respectively, and each semiconductor refrigerating device comprises a heat exchange end for exchanging heat for the corresponding storage chamber and a driving mechanism for driving the heat exchange end to be switched between a cold end and a hot end.

2. The hot and cold box as claimed in claim 1, further comprising a controller connected to said driving mechanism for controlling said driving mechanism to be turned on by power.

3. A cold-hot dual-purpose box according to claim 1, comprising two storage compartments arranged side by side up and down and two semiconductor refrigerating devices for respectively exchanging heat with the two storage compartments, wherein one of the two semiconductor refrigerating devices is arranged in the top wall of the cold-hot dual-purpose box and exchanges heat with the storage compartment located above, and the other of the two semiconductor refrigerating devices is arranged in the bottom wall of the cold-hot dual-purpose box and exchanges heat with the storage compartment located below.

4. The hot and cold dual-purpose box according to claim 3, wherein an air duct system is respectively arranged in the top wall and the bottom wall, the air duct system comprises a mounting cavity, a first air duct close to the storage compartment and a second air duct far away from the storage compartment, the extension directions of the first air duct and the second air duct are crossed with each other and are not parallel to each other, the mounting cavity is arranged at the crossing position of the first air duct and the second air duct, and the mounting cavity is respectively communicated with the first air duct and the second air duct;

5. The hot and cold box as claimed in claim 4, wherein the first air passage and the second air passage extend in a direction perpendicular to each other.

6. The hot and cold box as claimed in claim 4, wherein the side portions of the top wall and the bottom wall are provided with air outlets, and the second air duct communicates the installation cavity and the air outlets; the surfaces of the top wall and the bottom wall facing the storage compartments respectively correspond to the top wall and the bottom wall are provided with first air supply openings, and the first air channel is communicated with the mounting cavity and the first air supply openings.

7. The cold and hot dual-purpose box according to claim 6, wherein an air supply duct extending up and down is provided in a side wall outside each storage compartment, one end of the air supply duct communicates with the first air supply opening, a second air supply opening is provided in an inner wall surface of the side wall, and the second air supply opening communicates with the storage compartment and the air supply duct.

8. The cooling and heating dual-purpose box according to claim 7, wherein the second air supply opening is arranged in a plurality of rows at intervals up and down, and the area of the second air supply opening is gradually increased along the direction far away from the heat exchanging end.

9. The hot and cold box as claimed in claim 4, wherein the air guiding assembly comprises a centrifugal fan, the top wall and the bottom wall are respectively provided with an air inlet, and the air inlet communicates with an air suction port of the centrifugal fan in the second air duct and an external environment of the hot and cold box; the top wall and the bottom wall are respectively provided with an air return inlet which is communicated with the storage chamber and an air suction inlet of the centrifugal fan positioned in the first air channel.

10. The cooling and heating dual-purpose box according to claim 4, wherein the air guide assembly includes a fin set, a centrifugal fan, and a heat conduction base for heat conduction connection between the fin set and the semiconductor refrigerating sheet, the fin set is annular and has an inner annular surface enclosing a cavity, the centrifugal fan is disposed in the cavity, the fin set includes a plurality of fins, and air blown by the centrifugal fan is sent to the first air duct or the second air duct through a gap between adjacent fins.