CN219390180U - Refrigerating equipment for semiconductor refrigeration - Google Patents

Abstract

The utility model belongs to the technical field of refrigeration, and particularly provides a semiconductor refrigeration device. The utility model aims to solve the problem of low volume utilization rate of the existing refrigeration equipment. To this end, the refrigeration apparatus of the present utility model includes a cabinet and a semiconductor refrigeration module. The box body is defined with a storage room, a refrigeration room and a heat dissipation room which are distributed in sequence from top to bottom, and is also defined with an evaporation room positioned behind the heat dissipation room; wherein, be provided with the wash port on the diapire of refrigeration room, the box still is limited with the drainage channel of wash port intercommunication, and the one end that the drainage channel kept away from the wash port communicates with the evaporation room. The semiconductor refrigeration module comprises a semiconductor refrigeration sheet, a cold end fin and a hot end fin, wherein the cold end fin is arranged in the refrigeration compartment, and the hot end fin is arranged in the heat dissipation compartment. The utility model improves the volume utilization rate of the refrigeration equipment.

Description

Refrigerating equipment for semiconductor refrigeration

Technical Field

The utility model belongs to the technical field of refrigeration, and particularly provides a semiconductor refrigeration device.

Background

Existing refrigeration equipment, such as refrigerators, freezers, etc., typically employ vapor compression refrigeration systems for cooling. The vapor compression refrigeration system generally comprises a compressor, a condenser, a capillary tube (or an electronic expansion valve) and an evaporator, and when the vapor compression refrigeration system is used for refrigerating, the evaporator is used for refrigerating a storage room in refrigeration equipment, so that the aim of preserving food materials is fulfilled.

Because the volume of the compressor is larger, the compressor occupies larger space of the refrigeration equipment, thereby occupying the space of the storage compartment and further leading to lower volume utilization rate of the existing refrigeration equipment.

Disclosure of Invention

An object of the present utility model is to solve the problem of low volume utilization of the existing refrigeration equipment.

A further object of the present utility model is to ensure smooth draining of defrost water of a semiconductor refrigeration module.

To achieve the above object, the present utility model provides a refrigeration apparatus for semiconductor refrigeration, comprising:

the refrigerator comprises a box body, a refrigerating chamber, a heat dissipation chamber and an evaporation chamber, wherein the box body is defined with a storage chamber, a refrigerating chamber and a heat dissipation chamber which are sequentially distributed from top to bottom; the bottom wall of the refrigeration compartment is provided with a drain hole, the box body is further limited with a drain channel communicated with the drain hole, and one end of the drain channel away from the drain hole is communicated with the evaporation compartment;

a semiconductor refrigeration module comprising a semiconductor refrigeration sheet, a cold side fin disposed within the refrigeration compartment, and a hot side fin disposed within the heat dissipation compartment.

Optionally, an end of the drain channel remote from the drain hole is formed on a top wall of the evaporation chamber.

Optionally, the bottom wall of the drain channel is gradually inclined downward in a direction away from the drain hole.

Optionally, the evaporation chamber is located diagonally behind the heat dissipation chamber.

Optionally, the drain hole is located above the heat dissipation chamber.

Optionally, the cold end fin is disposed at a front side of the drain hole, and a bottom surface of the refrigeration compartment is inclined downward from a front end of the cold end fin to the drain hole.

Optionally, the bottom surface of the cold end fin is attached to the bottom surface of the refrigeration chamber, and the inclination angle of the cold end fin ranges from 5 degrees to 10 degrees.

Optionally, the semiconductor refrigeration module further comprises a cold guide block arranged between the semiconductor refrigeration sheet and the cold end fin, and the top surface of the cold guide block and the inclined part of the bottom surface of the refrigeration compartment are in the same plane.

Optionally, the air inlet and the air outlet of the heat dissipation chamber are formed on the front side of the bottom of the box body; the evaporation port of the evaporation chamber is formed at the rear side of the bottom of the box body.

Optionally, the refrigeration device further comprises a plurality of transversely distributed refrigeration fans arranged in the refrigeration compartment, and the refrigeration fans are used for driving air between the refrigeration compartment and the storage compartment to circulate; and/or the refrigeration equipment further comprises a plurality of transversely distributed cooling fans which are arranged in the cooling room, wherein the cooling fans are used for driving outside air into the cooling room and forcing the air in the cooling room to flow to the outside.

Based on the foregoing description, it can be understood by those skilled in the art that in the foregoing technical solution of the present utility model, by defining the case body with a heat dissipation compartment, a refrigeration compartment and a storage compartment that are sequentially distributed from bottom to top, by disposing the cold end fins of the semiconductor refrigeration module in the refrigeration compartment and the hot end fins of the semiconductor refrigeration module in the heat dissipation compartment, the semiconductor refrigeration module can cool the refrigeration compartment through the cold end fins and dissipate heat into the heat dissipation compartment through the hot end fins. Therefore, the refrigeration apparatus of the present utility model can perform refrigeration by the semiconductor refrigeration module. Because the volume (at least thickness) of the semiconductor refrigeration module is far smaller than that of the existing compressor, compared with the existing refrigeration equipment which is refrigerated by the compressor, the refrigeration equipment which is refrigerated by the semiconductor refrigeration module improves the space occupancy of the storage compartment, and further improves the volume utilization rate of the refrigeration equipment.

Further, by arranging the drain hole on the bottom wall of the refrigeration compartment and arranging the drain channel for communicating the drain hole with the evaporation compartment, defrosting water in the refrigeration compartment can flow into the evaporation compartment along the drain hole and the drain channel, so that the defrosting water is prevented from accumulating in the refrigeration compartment and is frozen, and the refrigeration of the semiconductor refrigeration module to the storage compartment is affected.

Further, by gradually inclining the bottom wall of the drain passage downward in a direction away from the drain hole, it is ensured that all of the defrost water in the drain passage can flow into the evaporation compartment, preventing the defrost water from accumulating in the drain passage.

The above, as well as additional objectives, advantages, and features of the present utility model will become apparent to those skilled in the art from the following detailed description of a specific embodiment of the present utility model when read in conjunction with the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solution of the present utility model, some embodiments of the present utility model will be described hereinafter with reference to the accompanying drawings. It will be understood by those skilled in the art that components or portions thereof identified in different drawings by the same reference numerals are identical or similar; the drawings of the utility model are not necessarily to scale relative to each other. In the accompanying drawings:

FIG. 1 is a front upper isometric view of a refrigeration appliance according to some embodiments of the present utility model;

FIG. 2 is a front lower isometric view of a refrigeration appliance according to some embodiments of the present utility model;

FIG. 3 is a front view of a refrigeration appliance according to some embodiments of the utility model;

FIG. 4 is a cross-sectional view of the refrigeration appliance of FIG. 3 taken along the direction A-A;

FIG. 5 is a schematic diagram of a semiconductor refrigeration module according to some embodiments of the utility model;

FIG. 6 is a cross-sectional view of the refrigeration module of FIG. 4 taken along the direction B-B;

fig. 7 is an enlarged view of a portion C of the refrigeration module of fig. 4;

FIG. 8 is a cross-sectional view of the refrigeration module of FIG. 4 taken along the direction D-D;

fig. 9 is a cross-sectional view of the refrigeration module of fig. 4 taken along the direction E-E.

Detailed Description

It should be understood by those skilled in the art that the embodiments described below are only some embodiments of the present utility model, but not all embodiments of the present utility model, and the some embodiments are intended to explain the technical principles of the present utility model and are not intended to limit the scope of the present utility model. All other embodiments, which can be obtained by a person skilled in the art without any inventive effort, based on the embodiments provided by the present utility model, shall still fall within the scope of protection of the present utility model.

It should be noted that, in the description of the present utility model, terms such as "center", "upper", "lower", "top", "bottom", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate directions or positional relationships, which are based on the directions or positional relationships shown in the drawings, are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Further, it should also be noted that, in the description of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected, can be indirectly connected through an intermediate medium, and can also be communicated with the inside of two elements. The specific meaning of the above terms in the present utility model can be understood by those skilled in the art according to the specific circumstances.

In addition, it should be noted that, in the description of the present utility model, the terms "cooling capacity" and "heating capacity" are two descriptions of the same physical state. That is, the higher the "cooling capacity" of a certain object (for example, evaporator, air, condenser, etc.), the lower the "heat" of the object, and the lower the "cooling capacity" of the object, the higher the "heat" of the object. Some object absorbs the cold and releases the heat, and the object releases the cold and absorbs the heat. A target maintains "cold" or "heat" to maintain the target at a current temperature. "refrigeration" and "heat absorption" are two descriptions of the same physical phenomenon, i.e., a target (e.g., an evaporator) absorbs heat while it is refrigerating.

As shown in fig. 1 to 3, in some embodiments of the present utility model, a semiconductor refrigeration appliance includes a cabinet 100, a first drawer 200, and a second drawer 300. Wherein, the first drawer 200 and the second drawer 300 are both installed to the case 100 in a drawing manner.

As can be seen from fig. 1 to 3, in some embodiments of the present utility model, the refrigerating apparatus includes two first drawers 200 and one second drawer 300, and the one second drawer 300 is located below the two first drawers 200. Furthermore, the one second drawer 300 may be disposed above the two first drawers 200 or between the two first drawers 200 as desired by those skilled in the art.

As shown in fig. 4, in some embodiments of the present utility model, the first drawer 200 is an air-cooled drawer, so that the first drawer 200 can be cooled by air cooling to provide a dry cooling environment for a user. The second drawer 300 is a sealed drawer so that the second drawer 300 can be cooled by direct cooling to provide a high humidity cooling environment for a user.

Furthermore, in other embodiments of the present utility model, the first drawer 200 may be provided in any other feasible number, such as one, three, four, etc., as desired by one skilled in the art. And optionally, the second drawer 300 is provided in any other feasible number, such as two, three, four, etc. Alternatively, one skilled in the art may configure only the first drawer 200 or the second drawer 300 for the refrigerating apparatus as needed.

Alternatively, in other embodiments of the present utility model, a person skilled in the art may also configure a door for the refrigerating apparatus as needed, instead of the first drawer 200 and/or the second drawer 300, and open or shield the cabinet 100 through the door.

As shown in fig. 2 to 4, in some embodiments of the present utility model, a front side of a bottom of the case 100 is provided with a skirting area 101. That is, the case 100 is provided with the skirting area 101 below the second drawer 300. Alternatively, the height of the skirting area 101 is 10cm. Alternatively, the height of the skirting area 101 may be set to any other feasible value, such as 5cm, 6cm, 8cm, 12cm, etc., as desired by a person skilled in the art.

In the present utility model, the skirting area 101 can make the refrigerating apparatus and the environment integrated together more beautiful when the refrigerating apparatus is fitted in a space such as a cabinet.

As shown in fig. 4, in some embodiments of the present utility model, the case 100 defines a storage compartment 102, a cooling compartment 103, and a heat dissipation compartment 104, which are sequentially disposed from top to bottom. The first drawer 200 and the second drawer 300 are each disposed within the storage compartment 102.

With continued reference to fig. 4, in some embodiments of the utility model, the refrigeration appliance further includes a semiconductor refrigeration module 400 mounted between the heat sink compartment 104 and the refrigeration compartment 103, the semiconductor refrigeration module 400 cooling the refrigeration compartment 103 through its cold end so that the refrigeration compartment 103 cools the storage compartment 102, the semiconductor refrigeration module 400 dissipating heat to the heat sink compartment 104 through its hot end.

Further, as shown in fig. 5, the semiconductor refrigeration module 400 includes a semiconductor refrigeration sheet 410, a cold side fin 420, and a hot side fin 430, the cold side fin 420 being disposed within the refrigeration compartment 103 such that the semiconductor refrigeration module 400 absorbs heat within the refrigeration compartment 103 through the cold side fin 420. The hot side fins 430 are disposed in the heat dissipation compartment 104 such that the semiconductor refrigeration module 400 dissipates heat generated by the hot side fins 430 into the heat dissipation compartment 104.

With continued reference to fig. 5, the semiconductor refrigeration module 400 further includes a cold guide block 440 disposed between the semiconductor refrigeration sheet 410 and the cold end fins 420, and the cold guide block 440 is respectively abutted against the semiconductor refrigeration sheet 410 and the cold end fins 420, so that the cold generated by the semiconductor refrigeration sheet 410 is rapidly and uniformly transferred to the cold end fins 420 through the cold guide block 440. The cooling block 440 may be any feasible metal member, such as a steel block, an iron block, etc.

As shown in fig. 4, the case 100 further defines a return air inlet 1031 and an air supply passage 105 communicating with the refrigerating compartment 103, wherein the return air inlet 1031 is located at a front side of the refrigerating compartment 103, and the air supply passage 105 is located at a rear side of the refrigerating compartment 103. Further, the air supply channel 105 communicates with the refrigerating compartment 103 through the bottom end thereof, and two air supply openings aligned with the two first drawers 200 are provided at the top of the air supply channel 105, respectively, so that the air supply channel 105 supplies cool air into the two first drawers 200 through the air supply openings.

As can be seen from fig. 4, through holes are provided at the front side walls of the two first drawers 200, respectively, so that air in the first drawers 200 flows out of the through holes. A cover (not shown) is provided on the second drawer 300 to seal the second drawer 300 by the cover. It should be noted that the second drawer 300 may be completely sealed or may have an opening as shown in the cover of fig. 4. As will be appreciated by those skilled in the art, since the second drawer 300 of fig. 4 has only one opening in the cover, no cool air is allowed to flow therein, the second drawer 300 can maintain a highly humid environment.

Further, as can be seen from fig. 4, two adjacent drawers among the three drawers, and a gap is formed between each drawer and a side wall of the storage compartment 102, so that air flowing out from the first drawer 200 can flow back to the return air inlet 1031 through the gap, and then flow back into the refrigerating compartment 103.

With continued reference to fig. 4, in some embodiments of the utility model, the refrigeration appliance further includes at least one refrigeration blower 500 disposed within the refrigeration compartment 103, the at least one refrigeration blower 500 configured to drive air within the refrigeration compartment 103 to flow to the first drawer 200 via the supply air channel 105 and to drive air within the first drawer 200 to flow to the refrigeration compartment 103 via the return air inlet 1031.

Preferably, the number of the cooling fans 500 is plural, and the cooling fans are sequentially arranged in the left-right direction of the cooling apparatus, so that the height of the cooling fans 500 is not excessively high while ensuring that the cooling fans 500 can provide sufficient wind power to the cooling compartments 103, so as to ensure the space utilization of the cooling apparatus. The plurality of refrigeration fans 500 are located between the return air inlet 1031 and the cold end fins 420 in the front-to-rear direction.

In addition, one skilled in the art can also place the refrigeration fan 500 at any other feasible location, such as at the rear side of the cold end fins 420, as desired.

As shown by the arrows in fig. 4, when the refrigeration fan 500 is in operation, air in the storage compartment 102 flows from the return air inlet 1031 into the refrigeration compartment 103 and is cooled at the cold end fins 420. The air in the cooling compartment 103, which is cooled by the cold end fins 420, flows to the first drawer 200 and the second drawer 300 via the air supply duct 105, and cools the food in the first drawer 200 and the second drawer 300. The air in the first drawer 200 and the second drawer 300 flows out of the through holes of the front sides of the first drawer 200 and the second drawer 300 by the air pressure and flows downward along the gap between them and the sidewall of the storage compartment 102. The air cools the second drawer 300 while passing through the second drawer 300. Finally, the air again flows into the refrigerated compartment 103 from the return air inlet 1031 and is cooled by the cold end fins 420.

As shown in fig. 4 and 6, in some embodiments of the present utility model, the case 100 defines an appliance compartment 106 obliquely rearward of the heat dissipation compartment 104, and an evaporation compartment 107 obliquely rearward of the heat dissipation compartment 104. The electrical compartment 106 is used for arranging electrical components (such as a controller, an electrical box, a transformer, etc.) of a refrigeration device, and an avoidance groove 108 is arranged on a side wall between the electrical compartment 106 and the heat dissipation compartment 104, and the avoidance groove 108 is used for avoiding wires. The evaporation chamber 107 is used for receiving the defrost water flowing down from the refrigeration chamber 103, which will be described in detail later, and will not be described here again.

As shown in fig. 6, in some embodiments of the present utility model, the case 100 includes a baffle 120 disposed within the heat dissipation chamber 104, the baffle 120 dividing the heat dissipation chamber 104 into an air intake passage 1041 communicating with the air intake 1011 and an air outlet passage 1042 communicating with the air outlet 1012.

As can be seen from fig. 6, the air inlet 1011 is located in the middle of the skirting board 101, and the skirting board 101 is formed with air outlets 1012 on the left and right sides of the air inlet 1011, respectively; an air outlet passage 1042 is arranged on the left and right sides of the air inlet passage 1041, respectively.

As can also be seen from fig. 6, the width of the air intake passage 1041 in the left-right direction is larger than the width of the air outlet passage 1042 in the left-right direction. Alternatively, the width of the air intake passage 1041 in the left-right direction is 2 to 5 times the total width of the two air outlet passages 1042 in the left-right direction. For example, the width of the intake passage 1041 is 2 times, 3 times, 3.5 times, 4.5 times, 5 times, etc. the total width of the two exhaust passages 1042.

As shown in fig. 4 and 6, in some embodiments of the present utility model, the refrigeration apparatus further includes at least one heat dissipation fan 600 disposed in the air intake passage 1041, such that the at least one heat dissipation fan 600 drives air from the outside into the heat dissipation compartment 104 from the air intake 1011, cools the hot end fins 430, and drives air in the heat dissipation compartment 104 from the air outlet 1012 to the outside.

Preferably, the number of the heat dissipation fans 600 is plural, and the heat dissipation fans 600 are sequentially distributed along the left-right direction of the box 100, so that the height of the heat dissipation fans 600 is not excessively high while ensuring that the heat dissipation fans 600 can provide sufficient wind power for the compartments of the air inlet channel 1041, so as to ensure the space utilization rate of the refrigeration equipment. The plurality of heat dissipation fans 600 are located between the air inlet 1011 and the hot end fins 430 in the front-rear direction. In addition, those skilled in the art may also place the heat dissipation fan 600 at any other possible location, for example, at the rear side of the hot end fins 430, as desired.

With continued reference to fig. 6, the case 100 further includes a plurality of partitions 140 disposed between the heat dissipation fans 600 and the air inlet 1011, the partitions 140 preventing the heat dissipation fans 600 at both sides thereof from affecting each other. Specifically, the heat radiation fans 600 at both sides of the partition 140 are prevented from affecting each other when sucking air.

In other embodiments of the present utility model, those skilled in the art may omit the partition 140 according to the need, which may affect the air suction effect of the heat dissipation fan 600.

With continued reference to fig. 6, in some embodiments of the present utility model, the box 100 further defines a connection channel 1043 that connects the air inlet channel 1041 with the air outlet channel 1042, and the connection channel 1043 is defined as a C-shape or a U-shape, so that the air inlet channel 1041 is parallel to the air outlet channel 1042, and also reduces wind resistance when the airflow turns in the connection channel 1043, thereby reducing wind noise when the airflow flows in the connection channel 1043.

Preferably, the joints between the rear side wall of the joint channel 1043 and the air inlet channel 1041 and the air outlet channel 1042 are respectively provided with an arc shape, so as to reduce the wind resistance when the airflow turns in the joint channel 1043.

As can be seen from fig. 6, the air inlet channel 1041, the connecting channel 1043 and the air outlet channel 1042 are generally M-shaped to reasonably utilize the space of the heat dissipation chamber 104.

As shown in fig. 4, 6 and 7, in some embodiments of the present utility model, the bottom wall of the air intake passage 1041 is inclined upward from the heat radiation fan 600 to the hot end fin 430. And, the rear end of the bottom wall of the air intake passage 1041 is located at the middle and rear portions of the hot end fin 430 in the front-rear direction.

Further, the rear portion of the hot side fin 430 protrudes rearward from the air inlet passage 1041, and the portion of the hot side fin 430 protruding from the air inlet passage 1041 is 1/5 to 1/3, e.g., 1/5, 1/4, 1/2, etc., of the hot side fin 430. Optionally, a gap is formed between the bottom surface of the hot end fin 430 and the rear end of the bottom wall of the air intake passage 1041, so as to leave a sufficient mounting tolerance between the hot end fin 430 and the bottom wall of the air intake passage 1041, and meanwhile, the occurrence of a wind-holding phenomenon can be prevented, and the occurrence of burning of the heat dissipation fan 600 can be prevented.

As shown particularly in fig. 7, in some embodiments of the utility model, the enclosure 100 includes an air deflector 160, the air deflector 160 forming at least a portion of the bottom wall of the air intake passage 1041. Preferably, the air deflector 160 forms the entirety of the bottom wall of the air intake passage 1041. The air deflector 160 is inclined upward from the heat radiation fan 600 to the hot side fins 430 such that the rear end of the air deflector 160 is located at the middle rear portion of the hot side fins 430 in the front-rear direction.

As can be seen in fig. 6, in some embodiments of the present utility model, the bottom surface of the partition 140 is inclined upward from the heat radiation fan 600 to the hot end fins 430, so that the bottom side of the air deflector 160 is formed with a bottom channel 1044 (as shown in fig. 7) that communicates the air inlet channel 1041 with the air outlet channel 1042.

In the present utility model, the wires of the semiconductor refrigeration module 400 and/or the heat radiation fan 600 may pass out of the appliance compartment 106 through the escape groove 108.

As shown in fig. 6 and 7, when the heat radiation fan 600 is operated, external air enters the air intake passage 1041 from the air intake 1011 and absorbs heat of the hot side fins 430 when flowing through the hot side fins 430. The majority of the air flowing from the air intake passage 1041 flows through the junction passage 1043 to the air outlet passage 1042, and the minority flows through the bottom passage 1044 to the air outlet passage 1042. Finally, the air in the air outlet channel 1042 flows to the outside through the air outlet 1012, thereby cooling the hot end fins 430.

As shown in fig. 7 and 8, in some embodiments of the present utility model, the bottom ends of the cold end fins 420 are fitted to the bottom surface of the refrigeration compartment 103, and at least a portion of the bottom surface of the refrigeration compartment 103 is inclined downward rearward from the front ends of the cold end fins 420, the bottom wall of the refrigeration compartment 103 being provided with a drain hole 1032 at its lowest position. In other words, the bottom wall of the refrigerating compartment 103 is provided with the drainage hole 1032, and the bottom surface of the refrigerating compartment 103 is inclined downward from the front end of the cold end fin 420 to the section of the drainage hole 1032, so that the defrost water of the cold end fin 420 flows into the drainage hole 1032 under the action of gravity.

As shown in fig. 5 and 7, the top surface of the cold guide block 440 is flush with the inclined portion of the bottom surface of the refrigerating compartment 103 to ensure that the bottom ends of the cold end fins 420 are in contact with the bottom surface of the refrigerating compartment 103.

In some embodiments of the present utility model, the angle of inclination of the cold end fins 420 ranges from 5 ° to 10 °. That is, the top surface of the cold end fin 420 or the cold guide block 440 has an angle of 5 ° to 10 °, for example, 5 °, 6 °, 7 °, 9 °, 10 °, etc., with respect to the horizontal plane.

As can be seen in fig. 7, the drainage hole 1032 is located above the heat dissipation chamber 104.

As shown in fig. 9, in some embodiments of the present utility model, the case 100 further defines a drain passage 109 communicating with the drain hole 1032, and an end of the drain passage 109 remote from the drain hole 1032 communicates with the evaporation chamber 107. Specifically, the drain passage 109 is formed in the insulating layer below the refrigeration compartment 103.

Specifically, one end of the drain passage 109 away from the drain hole 1032 is formed on the top wall of the evaporation compartment 107, and the bottom wall of the drain passage 109 is gradually inclined downward toward a direction away from the drain hole 1032 to ensure that the defrosting water flowing from the drain hole 1032 into the drain passage 109 can flow to the evaporation compartment 107 by the force of gravity.

Alternatively, the angle between the bottom wall of the drain passage 109 and the horizontal is any value from 3 ° to 8 °, for example 5 °.

Further, the person skilled in the art may also have the drainage hole 1032 located above the evaporation chamber 107 as needed, so that the arrangement of the drainage channel 109 may be omitted.

As will be appreciated by those skilled in the art, the hot side becomes the cold side and the cold side becomes the hot side as the semiconductor refrigeration sheet 410 is energized with a reverse current. Therefore, when defrosting the cold side fin 420, a reverse current can be applied to the semiconductor refrigeration sheet 410. Alternatively, a person skilled in the art may also configure a separate electric heating device for the cold end fins 420 as needed to heat the cold end fins 420 by the electric heating device.

As shown in fig. 6 to 9, when the cold end fin 420 is frosted, the frosted water enters the drainage channel 109 from the drainage hole 1032 and finally enters the evaporation chamber 107 again.

Optionally, the refrigeration device further comprises an evaporation pan arranged within the evaporation compartment 107 to receive defrost water from the drain channel 109 through the evaporation pan.

Alternatively, the person skilled in the art may omit the evaporation pan as required, while ensuring that the evaporation chamber 107 does not leak water.

Further, in the present utility model, the evaporation chamber 107 has an evaporation port 1071 so that the water vapor in the evaporation chamber 107 is discharged to the outside through the evaporation port 1071.

Further alternatively, the evaporation port 1071 is provided at the rear side of the bottom of the case 100 to be hidden. It will be appreciated by those skilled in the art that the evaporation port 1071 is not limited to the one shown in fig. 6, but may be provided as a grill, or an elongated hole, or the like.

Alternatively, although not shown in the drawings, a drain pipe may be provided in the evaporation chamber 107 as required by those skilled in the art, with one end thereof being communicated with the outlet end of the drain passage 109 and the other end thereof extending downward. Further, the bottom of drain pipe still is fixed with the container, and this container opening up and cover are established in the bottom of drain pipe to make the defrosting water in the container carry out the water seal to the bottom of drain pipe, prevent that the air in the evaporation room 107 from getting into refrigeration room 103 along drainage channel 109, influence the refrigeration efficiency of semiconductor refrigeration module 400 to refrigeration plant. Wherein, be provided with the fixed muscle between this container and the drain pipe to make container and drain pipe pass through this fixed muscle fixed connection together. Further, the container may be a barrel-like structure, a bowl-like structure, or any other feasible structure.

As can be seen from fig. 5 to 8, in the present utility model, the refrigerating compartment 103 and the heat dissipating compartment 104 are each provided in a flat structure to reduce the height of the refrigerating compartment 103 and the heat dissipating compartment 104 in the vertical direction, thereby leaving more space for the storage compartment 102.

Preferably, the top end of the skirting area 101 is higher than the bottom surface of the cooling compartment 103 so that the height of the heat dissipation compartment 104 is sufficiently low.

As shown in fig. 8 and 9, in some embodiments of the present utility model, the semiconductor refrigeration sheet 410, the cold side fin 420, the hot side fin 430, and the cold guide block 440 are all plural and are sequentially arranged in the left-right direction of the refrigeration apparatus. In addition, one skilled in the art may set the semiconductor refrigeration sheet 410, the cold end fin 420, the hot end fin 430 and the cold guide block 440 to be one, respectively, as required, which may increase the cost of the semiconductor refrigeration module 400 and reduce the heat insulation of the refrigeration compartment 103.

Based on the foregoing description, those skilled in the art will appreciate that the refrigeration appliance of the present utility model may effectively enhance its volumetric utilization.

Finally, in the present utility model, the refrigeration device may be a refrigerator, a freezer, or an ice chest.

Thus far, the technical solution of the present utility model has been described in connection with the foregoing embodiments, but it will be readily understood by those skilled in the art that the scope of the present utility model is not limited to only these specific embodiments. The technical solutions in the above embodiments can be split and combined by those skilled in the art without departing from the technical principles of the present utility model, and equivalent changes or substitutions can be made to related technical features, so any changes, equivalent substitutions, improvements, etc. made within the technical principles and/or technical concepts of the present utility model will fall within the protection scope of the present utility model.

Claims (10)

1. A refrigeration device for semiconductor refrigeration, comprising:

the refrigerator comprises a box body, a refrigerating chamber, a heat dissipation chamber and an evaporation chamber, wherein the box body is defined with a storage chamber, a refrigerating chamber and a heat dissipation chamber which are sequentially distributed from top to bottom; the bottom wall of the refrigeration compartment is provided with a drain hole, the box body is further limited with a drain channel communicated with the drain hole, and one end of the drain channel away from the drain hole is communicated with the evaporation compartment;

a semiconductor refrigeration module comprising a semiconductor refrigeration sheet, a cold side fin disposed within the refrigeration compartment, and a hot side fin disposed within the heat dissipation compartment.

2. A refrigerating apparatus for semiconductor refrigeration as recited in claim 1, wherein,

one end of the drain passage, which is far away from the drain hole, is formed on the top wall of the evaporation chamber.

3. A refrigerating apparatus for semiconductor refrigeration as recited in claim 2, wherein,

the bottom wall of the drain passage is gradually inclined downward in a direction away from the drain hole.

4. A refrigerating apparatus for semiconductor refrigeration as recited in claim 3, wherein,

the evaporation chamber is positioned at the inclined rear of the heat dissipation chamber.

5. A refrigerating apparatus for semiconductor refrigeration as recited in claim 1, wherein,

the drain hole is positioned above the heat dissipation chamber.

6. A refrigerating apparatus for semiconductor refrigeration as recited in claim 5, wherein,

the cold end fin is disposed at a front side of the drain hole,

the bottom surface of the refrigeration compartment is inclined downwards from the front end of the cold end fin to the drain hole.

7. A refrigerating apparatus for semiconductor refrigeration as recited in claim 6, wherein,

the bottom surface of the cold end fin is attached to the bottom surface of the refrigeration chamber, and the inclination angle of the cold end fin is 5-10 degrees.

8. A refrigerating apparatus for semiconductor refrigeration as recited in claim 7, wherein,

the semiconductor refrigeration module further comprises a cold guide block arranged between the semiconductor refrigeration piece and the cold end fin,

the top surface of the cold guide block and the inclined part of the bottom surface of the refrigeration compartment are positioned on the same plane.

9. A semiconductor refrigeration device according to any one of claims 1 to 8,

the air inlet and the air outlet of the heat dissipation chamber are formed on the front side of the bottom of the box body;

the evaporation port of the evaporation chamber is formed at the rear side of the bottom of the box body.

10. A refrigerating apparatus for semiconductor refrigeration as recited in claim 9, wherein,

the refrigeration equipment also comprises a plurality of transversely distributed refrigeration fans which are arranged in the refrigeration compartment and are used for driving air circulation flow between the refrigeration compartment and the storage compartment; and/or the number of the groups of groups,

the refrigeration equipment further comprises a plurality of transversely distributed heat dissipation fans which are arranged in the heat dissipation room, wherein the heat dissipation fans are used for driving outside air into the heat dissipation room and forcing the air in the heat dissipation room to flow to the outside.