CN114688785A - Horizontal refrigerating cabinet - Google Patents

Abstract

The invention provides a horizontal refrigeration cabinet, which comprises a cabinet body enclosing a storage chamber, a heat preservation door body arranged above the cabinet body and used for opening and closing an upper opening of the storage chamber, and a semiconductor refrigeration system, wherein the semiconductor refrigeration system is arranged in the heat preservation door body, a cooling mechanism of the semiconductor refrigeration system is insulated and isolated from the external environment of the horizontal refrigeration cabinet through a heat preservation layer of the heat preservation door body and supplies cold energy to the storage chamber, and a heating mechanism of the semiconductor refrigeration system is insulated and isolated from the storage chamber through the heat preservation layer of the heat preservation door body and gives off heat to the external environment of the horizontal refrigeration cabinet. On the one hand, the refrigerating system can be prevented from being arranged in the cabinet body to influence the volume rate of the storage chamber, on the other hand, the heat preservation layer of the heat preservation door body can not only isolate the cold quantity generated by the cold supply mechanism from being dissipated to the external environment of the horizontal refrigerating cabinet, but also prevent the heat supply mechanism from dissipating heat into the storage chamber, and the refrigerating efficiency is improved.

Description

Horizontal refrigerating cabinet

Technical Field

The invention relates to the technical field of refrigeration equipment, in particular to a horizontal refrigeration cabinet.

Background

The horizontal refrigeration cabinets commonly used in the market at present usually adopt a vapor compression type refrigeration cycle, a refrigeration system comprises a compressor, a condenser, a throttling device, an evaporator and the like, and a compressor bin is generally arranged at the lower right corner of a cabinet body of the horizontal refrigeration cabinet for placing the compressor due to the large volume of the compressor, so that the storage space of the cabinet body is greatly occupied, the volume ratio of the horizontal refrigeration cabinet is seriously reduced, and the compressor bin can protrude into the storage space, so that the internal attractiveness of the horizontal refrigeration cabinet is influenced.

Disclosure of Invention

In order to solve the technical problems, the invention aims to provide a horizontal refrigeration cabinet to solve the problems of low volume ratio and unattractive interior of the existing horizontal refrigeration cabinet.

In order to achieve one of the above objects, an embodiment of the present invention provides a horizontal refrigeration cabinet, which includes a cabinet body enclosing a storage compartment, a heat preservation door body disposed above the cabinet body to open and close an upper opening of the storage compartment, and a semiconductor refrigeration system disposed in the heat preservation door body, wherein a cooling mechanism of the semiconductor refrigeration system is insulated and isolated from an external environment of the horizontal refrigeration cabinet by a heat preservation layer of the heat preservation door body and supplies cooling capacity to the storage compartment, and a heating mechanism of the semiconductor refrigeration system is insulated and isolated from the storage compartment by the heat preservation layer of the heat preservation door body and emits heat to the external environment of the horizontal refrigeration cabinet.

As a further improvement of an embodiment of the present invention, an air duct system is arranged in the heat-insulating door body, the air duct system includes a hot air duct, an installation cavity and a cold air duct which are sequentially arranged from top to bottom, extension directions of the hot air duct and the cold air duct are crossed with each other and are not parallel to each other, the installation cavity is arranged at a crossing position of the hot air duct and the cold air duct, and the installation cavity is respectively communicated with the hot air duct and the cold air duct;

the cold supply mechanism comprises a cold end of a semiconductor refrigeration piece and a cold guide assembly, the heat supply mechanism comprises a hot end of the semiconductor refrigeration piece and a heat dissipation assembly, the semiconductor refrigeration piece is accommodated in the installation cavity, the hot air duct and the cold air duct are isolated from the installation cavity, the cold guide assembly is in heat conduction connection with the cold end and extends into the cold air duct from the cold end, and the heat dissipation assembly is in heat conduction connection with the hot end and extends into the hot air duct from the hot end.

As a further improvement of an embodiment of the present invention, the extending directions of the hot air duct and the cold air duct are perpendicular to each other.

As a further improvement of an embodiment of the present invention, the insulating layer includes a heat insulating sheet formed at an intersection of the hot air duct and the cold air duct, the installation cavity is provided as a channel which penetrates the heat insulating sheet vertically, and the semiconductor chilling plate is horizontally disposed in the channel and its periphery is attached to an inner wall of the installation cavity.

As a further improvement of an embodiment of the present invention, a first groove is formed in the upper surface of the insulating layer, and the hot air duct is enclosed between a groove wall of the first groove and an upper cover plate of the insulating door body; and a second groove is formed in the lower surface of the heat insulation layer, and the cold air duct is enclosed between the groove wall of the second groove and the lower cover plate of the heat insulation door body.

As a further improvement of the embodiment of the present invention, a first air outlet and a second air outlet are arranged at a side portion of the heat-insulating door body, and the hot air duct includes a first air duct communicating the installation cavity and the first air outlet, and a second air duct communicating the installation cavity and the second air outlet; the lower cover plate of the heat-insulating door body is provided with a first air supply outlet and a second air supply outlet, and the cold air duct comprises a third air duct communicated with the mounting cavity and the first air supply outlet and a fourth air duct communicated with the mounting cavity and the second air supply outlet.

As a further improvement of an embodiment of the present invention, the first air outlet and the second air outlet are oppositely disposed on a front side and a rear side of the insulated door body, the first air supply outlet and the second air supply outlet are respectively disposed on a left end and a right end of the insulated door body, and a length of the insulated door body in a left-right direction is greater than a length of the insulated door body in a front-back direction.

As a further improvement of the embodiment of the present invention, the cabinet body is provided with two air supply ducts, the two air supply ducts are respectively arranged in two opposite side walls of the cabinet body in an up-and-down extending manner, an upper end of one of the two air supply ducts is communicated with the first air supply outlet, an upper end of the other of the two air supply ducts is communicated with the second air supply outlet, inner wall surfaces of the two opposite side walls of the cabinet body are respectively provided with a third air supply outlet, and the third air supply outlet is communicated with the storage compartment and the air supply ducts.

As a further improvement of an embodiment of the present invention, a plurality of the third air blowing openings are arranged in parallel at intervals in the vertical direction on each of the side walls, and the area of the plurality of the third air blowing openings is gradually increased from top to bottom.

As a further improvement of an embodiment of the present invention, the heat dissipation assembly includes a heat dissipation fan, the upper cover plate is provided with an air inlet, and the air inlet is communicated with an air suction port of the heat dissipation fan and an external environment of the horizontal refrigeration cabinet; the cold guide assembly comprises a cold guide fan, the lower cover plate is provided with an air return opening, and the air return opening is communicated with the storage compartment and an air suction opening of the cold guide fan.

As a further improvement of an embodiment of the present invention, the heat dissipation assembly includes a heat dissipation fin set, a heat dissipation centrifugal fan, and a heat conduction base which is in heat conduction connection with the heat dissipation fin set and the hot end, the heat dissipation fin set is annular, and an inner annular surface of the heat dissipation fin set encloses a heat dissipation cavity, the heat dissipation centrifugal fan is disposed in the heat dissipation cavity, the heat dissipation fin set includes a plurality of heat dissipation fins, and air blown out by the heat dissipation centrifugal fan is sent to the hot air duct through a gap between adjacent heat dissipation fins;

the cold guide assembly comprises a cold guide fin group, a cold guide centrifugal fan and a cold guide base which is in heat conduction connection with the cold guide fin group and the cold guide base of the cold end, the cold guide fin group is annular, the inner ring surface of the cold guide fin group is closed to form a cold guide cavity, the cold guide centrifugal fan is arranged in the cold guide cavity, the cold guide fin group comprises a plurality of cold guide fins, and air blown out by the cold guide centrifugal fan is conveyed to the cold air duct through the adjacent gaps between the cold guide fins.

As a further improvement of an embodiment of the present invention, the horizontal refrigeration cabinet includes two semiconductor refrigeration systems and two air duct systems respectively matched with the two semiconductor refrigeration systems, two hot air ducts of the two air duct systems are arranged at left and right intervals, and two cold air ducts of the two air duct systems are arranged at front and back intervals.

As a further improvement of an embodiment of the present invention, the two hot air ducts extend front and back, and the two cold air ducts extend left and right; in the two semiconductor refrigeration systems, the distance between the heat radiation component of one of the two semiconductor refrigeration systems and the front side edge of the heat preservation door body is smaller than the distance between the heat radiation component of the other semiconductor refrigeration system and the rear side edge of the heat preservation door body, and the distance between the cold conduction component of the other semiconductor refrigeration system and the left side edge of the heat preservation door body is larger than the distance between the cold conduction component of the other semiconductor refrigeration system and the right side edge of the heat preservation door body; in the two semiconductor refrigeration systems, the distance between the heat dissipation assembly of the other semiconductor refrigeration system and the front side edge of the heat preservation door body is greater than the distance between the heat dissipation assembly of the other semiconductor refrigeration system and the rear side edge of the heat preservation door body, and the distance between the cold conduction assembly of the other semiconductor refrigeration system and the left side plate of the heat preservation door body is less than the distance between the cold conduction assembly of the other semiconductor refrigeration system and the right side edge of the heat preservation door body;

or, in the two semiconductor refrigeration systems, the distance between the heat dissipation assembly of one of the two semiconductor refrigeration systems and the front side edge of the heat preservation door body is greater than the distance between the heat dissipation assembly of the other semiconductor refrigeration system and the rear side edge of the heat preservation door body, and the distance between the cold conduction assembly of the other semiconductor refrigeration system and the left side edge of the heat preservation door body is greater than the distance between the cold conduction assembly of the other semiconductor refrigeration system and the right side edge of the heat preservation door body; in the two semiconductor refrigeration systems, the distance between the heat radiation component of the other semiconductor refrigeration system and the front side edge of the heat preservation door body is smaller than the distance between the heat radiation component of the other semiconductor refrigeration system and the rear side edge of the heat preservation door body, and the distance between the cold guide component of the other semiconductor refrigeration system and the left side plate of the heat preservation door body is smaller than the distance between the cold guide component of the other semiconductor refrigeration system and the right side edge of the heat preservation door body.

As a further improvement of an embodiment of the present invention, the horizontal refrigeration cabinet further includes a controller and a sensor, the sensor is disposed on at least one of the heat preservation door body and the cabinet body, the sensor detects position information of the heat preservation door body and the cabinet body, and the controller is connected to the sensor and is configured to control the semiconductor refrigeration system to be powered on and off according to the position information, so that the semiconductor refrigeration system provides cooling capacity to the storage compartment.

Compared with the prior art, the invention has the following beneficial effects: the horizontal refrigeration cabinet has the advantages that the semiconductor refrigeration system is arranged in the heat preservation door body, so that the influence on the volume ratio of the storage compartment due to the fact that the refrigeration system is arranged in the cabinet body can be avoided, the occupied space of the semiconductor refrigeration system is small, the volume and the occupied space of the horizontal refrigeration cabinet are reduced on the whole, and the horizontal refrigeration cabinet is convenient to store and transport; on the other hand, the heat preservation layer of the heat preservation door body can isolate the cold quantity generated by the cold supply mechanism from being emitted to the external environment of the horizontal refrigeration cabinet through the heat preservation door body, and can avoid the heat supply mechanism from emitting heat to the storage chamber, so that the refrigeration efficiency is greatly improved.

Drawings

FIG. 1 is a front view of a chest freezer in accordance with one embodiment of the invention;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 3 is a cross-sectional view taken along line B-B of FIG. 1;

FIG. 4 is a cross-sectional view taken along line C-C of FIG. 1;

FIG. 5 is another angular, longitudinal cross-sectional view of the horizontal refrigeration cabinet according to one embodiment of the present invention;

fig. 6 is a schematic perspective view of a heat dissipation assembly according to an embodiment of the invention.

Detailed Description

The invention will be described in detail hereinafter with reference to specific embodiments shown in the drawings.

In the various drawings of the present invention, certain dimensions of structures or portions are exaggerated relative to other structures or portions for ease of illustration and, therefore, are used only to illustrate the basic structure of the subject matter of the present invention.

It will be understood that, although the terms first, second, third, fourth, etc. may be used herein to describe various elements or structures, these described elements should not be limited by these terms. These terms are only used to distinguish these descriptive objects from one another.

The refrigeration equipment provided by the embodiment of the invention comprises a semiconductor refrigeration system, a cabinet body 1 enclosing a storage compartment 2 and a door body for opening and closing the storage compartment 2. The refrigeration equipment can be specifically designed into a horizontal refrigeration cabinet 100, a wine cabinet and the like.

Referring to fig. 1 to 5, an embodiment of the present invention provides a horizontal refrigeration cabinet 100, including the above-mentioned semiconductor refrigeration system, a cabinet body 1 enclosing a storage compartment 2, and a thermal insulation door body 3 for opening and closing the storage compartment 2, where the thermal insulation door body 3 is disposed above the cabinet body 1 and is used to open and close an upper opening of the storage compartment 2, and the semiconductor refrigeration system is disposed in the thermal insulation door body 3.

Specifically, in this embodiment, the semiconductor refrigeration system includes a cooling mechanism and a heating mechanism, the cooling mechanism is insulated and isolated from the external environment of the horizontal refrigeration cabinet 100 by the insulating layer 31 of the insulating door 3 and supplies cooling capacity to the storage compartment 2, and the heating mechanism is insulated and isolated from the storage compartment 2 by the insulating layer 31 of the insulating door 3 and emits heat to the external environment of the horizontal refrigeration cabinet 100. The semiconductor refrigeration system is arranged in the heat preservation door body 3, so that on one hand, the refrigeration system is prevented from being arranged in the cabinet body 1 to influence the volume ratio of the storage chamber 2, and the occupied space of the semiconductor refrigeration system is small, so that the volume and the occupied space of the horizontal refrigeration cabinet 100 are reduced on the whole, and the storage and the transportation are convenient; on the other hand, the heat preservation layer 31 of the heat preservation door body 3 can isolate the cold energy generated by the cold supply mechanism from being dissipated to the external environment of the horizontal refrigeration cabinet 100 through the heat preservation door body 3, and can avoid the heat dissipation of the heat supply mechanism to the storage chamber 2, thereby greatly improving the refrigeration efficiency.

With reference to fig. 1 to 5, further, an air duct system is disposed in the heat preservation door 3, and the air duct system includes a hot air duct 32, an installation cavity 33, and a cold air duct 34, which are sequentially arranged from top to bottom. The hot air duct 32 is arranged above, so that on one hand, the distance between the hot air duct 32 and the storage chamber 2 can be increased, heat is prevented from being dissipated into the storage chamber 2, and refrigeration is not facilitated, on the other hand, the distance between the hot air duct 32 and the external environment is reduced, heat dissipation is facilitated as soon as possible, and heat dissipation efficiency is improved; the cold air duct 34 is arranged below, so that on one hand, the distance between the cold air duct 34 and the external environment can be increased, the cold energy is prevented from being lost to the external environment, on the other hand, the distance between the cold air duct and the storage room 2 is reduced, the cold energy in the cold air duct 34 can be favorably emitted to the storage room 2, and the refrigeration efficiency is improved; the installation cavity 33 is arranged between the hot air duct 32 and the cold air duct 34 based on the peltier effect of the semiconductor refrigeration system, so that the cold energy generated by the semiconductor refrigeration system can be conducted to the storage compartment 2, and the heat generated by the semiconductor refrigeration system can be dissipated to the external environment.

Referring to fig. 2 to 5, the hot air path 32 and the cold air path 34 extend in directions crossing each other and not parallel to each other, so that heat exchange between the hot air path 32 and the cold air path 34 can be reduced. The installation cavity 33 is arranged at the intersection of the hot air duct 32 and the cold air duct 34, and the installation cavity 33 is respectively communicated with the hot air duct 32 and the cold air duct 34, so that the cold quantity and heat quantity transmission path of the semiconductor refrigeration system can be shortened, and the refrigeration efficiency and the heat dissipation efficiency are improved.

In this embodiment, the cold supply mechanism includes a cold end of the semiconductor refrigeration sheet 4 and a cold guide assembly 6, and the cold guide assembly 6 conducts cold generated by the cold end of the semiconductor refrigeration sheet 4 to supply the cold to the storage compartment 2; the heat supply mechanism comprises a hot end of the semiconductor refrigerating sheet 4 and a heat dissipation assembly 5, and heat generated by the heat dissipation assembly 5 on the hot end of the semiconductor refrigerating sheet 4 is conducted out and dissipated to the external environment of the horizontal refrigerating cabinet 100, so that the heat is prevented from influencing the refrigerating efficiency of the storage chamber 2.

Referring to fig. 4 to 5, the semiconductor cooling plate 4 is accommodated in the mounting cavity 33 and separates the hot air duct 32 and the cold air duct 34 from each other at the mounting cavity 33, the cold conducting assembly 6 is connected to the cold end in a heat conducting manner and extends from the cold end to the cold air duct 34, and the heat dissipating assembly 5 is connected to the hot end in a heat conducting manner and extends from the hot end to the hot air duct 32. In this way, the cold energy generated by the cold end of the semiconductor refrigeration sheet 4 can be conducted to the cold air duct 34 through the cold guide assembly 6, and then supplied to the storage compartment 2 to refrigerate the storage compartment 2, and the heat generated by the hot end of the semiconductor refrigeration sheet 4 can be conducted to the hot air duct 32 through the heat conducting assembly, and then dissipated to the external environment of the horizontal refrigeration cabinet 100; semiconductor refrigeration piece 4 can also further prevent the cold and hot exchange of installation cavity 33 department, avoids cold volume to run off and the heat gives off to storing compartment 2 in, improves refrigeration efficiency, reduces the energy consumption.

Referring to fig. 2 to 3, it is preferable that the hot air path 32 and the cold air path 34 extend in directions perpendicular to each other, so that the overlapping area of the hot air path 32 and the cold air path 34 and the heat exchange are minimized.

With reference to fig. 2 and fig. 4 to fig. 6, the heat dissipation assembly 5 includes a heat dissipation fin set 51, a heat dissipation centrifugal fan 52, and a heat conduction base 53, the heat conduction base 53 is connected to the heat ends of the heat dissipation fin set 51 and the semiconductor chilling plate 4 in a heat conduction manner, the heat dissipation fin set 51 is annular, a heat dissipation cavity is defined by the inner annular surface of the heat dissipation fin set, the heat dissipation centrifugal fan 52 is disposed in the heat dissipation cavity, the heat dissipation fin set 51 includes a plurality of heat dissipation fins, and air blown out by the heat dissipation centrifugal fan 52 is sent to the hot air duct 32 through a gap between adjacent heat dissipation fins.

Referring to fig. 3 to 5, the cooling guide assembly 6 includes a cooling guide fin set 61, a cooling guide centrifugal fan 62, and a cooling guide base 63. Since the structure of the cold conduction assembly 6 is the same as that of the heat dissipation assembly 5, the specific structure thereof can be referred to fig. 6. The cold guide base 63 is connected with the cold guide fin group 61 and the cold end of the semiconductor refrigerating sheet 4 in a heat conduction mode, the cold guide fin group 61 is annular, the inner ring surface of the cold guide fin group encloses a cold guide cavity, the cold guide centrifugal fan 62 is arranged in the cold guide cavity, the cold guide fin group 61 comprises a plurality of cold guide fins, and air blown out by the cold guide centrifugal fan 62 is sent to the cold air duct 34 through gaps between the adjacent cold guide fins.

For convenience of description, when the insulated door 3 opens the upper opening of the storage compartment 2, a user faces the insulated door 3 as a reference, the side of the insulated door 3 connected to the cabinet 1 is defined as the rear, the side of the cabinet 1 close to the user is defined as the front, and the left-right direction of the user is defined as the left-right direction in this embodiment.

Specifically, in this embodiment, the length of the thermal insulation door body 3 in the left-right direction is greater than the length of the thermal insulation door body in the front-back direction, the hot air duct 32 extends in the front-back direction, and the cold air duct 34 extends in the left-right direction and is vertically crossed with the hot air duct 32, so that the length of the hot air duct 32 is the minimum, the hot air duct 32 can dissipate heat to the external environment as soon as possible, and the cold energy which can be sent out by the cold air duct 34 can penetrate through the storage compartment 2 in the left-right direction, so that the cold energy in the storage compartment 2 is uniform, and the refrigeration efficiency is improved.

Referring to fig. 4 to 5, further, the insulating layer 31 includes a heat insulating sheet 311 formed at the intersection of the hot air duct 32 and the cold air duct 34, the mounting cavity 33 is a channel penetrating the heat insulating sheet 311 up and down, the semiconductor chilling plate 4 is horizontally disposed in the channel, and the periphery of the semiconductor chilling plate is attached to the inner wall of the mounting cavity 33. In another aspect, the heat insulation sheet 311 is provided with a mounting cavity 33 surrounding the semiconductor refrigeration sheet 4, the heat insulation sheet 311 extends outwards from the periphery of the semiconductor refrigeration sheet 4 to protrude out of the outer annular surface of the fin group, specifically, in the present embodiment, the heat insulation sheet 311 extends outwards from the periphery of the semiconductor refrigeration sheet 4 to the outside far away from the semiconductor refrigeration sheet 4 to protrude out of the outer annular surface of the cooling guide fin group 61 and protrude out of the outer annular surface of the cooling fin group 51. Like this, isolated hot-blast main 32 and cold wind channel 34 through semiconductor refrigeration piece 4 to avoided cold volume and heat to exchange from installation cavity 33, isolated hot-blast main 32 and cold wind channel 34 through heat shield 311 in addition, further avoided the cold and hot exchange between hot-blast main 32 and the cold wind channel 34.

Referring to fig. 4 to 5, further, the upper surface of the insulating layer 31 is provided with a first groove 312, and a hot air duct 32 is enclosed between a groove wall of the first groove 312 and the upper cover plate 35 of the insulating door body 3; the lower surface of the heat-insulating layer 31 is provided with a second groove 313, and a cold air duct 34 is enclosed between the groove wall of the second groove 313 and the lower cover plate 36 of the heat-insulating door body 3. Like this, only have upper cover plate 35 between hot-blast main 32 and the external environment, be favorable to the heat in the hot-blast main 32 to distribute to the external environment through upper cover plate 35 in, can further improve the radiating efficiency, and only have lower cover plate 36 between cold-blast main 34 and storing room 2, be favorable to the cold volume in the cold-blast main 34 to supply to storing room 2 in through lower cover plate 36, can further improve refrigeration efficiency.

With reference to fig. 2 to 5, specifically, in the present embodiment, the first groove 312 extends back and forth, the second groove 313 extends left and right, the first groove 312 is located above the second groove 313, the installation cavity 33 is disposed at the intersection of the first groove 312 and the second groove 313, and the installation cavity 33 is respectively communicated with the first groove 312 and the second groove 313, so that heat exchange from the hot air duct 32 to the storage compartment 2 and cold exchange between the cold air duct 34 and the external environment are isolated by the insulating layer 31 and the semiconductor chilling plates 4, thereby avoiding cold loss and energy consumption increase caused by heat transfer from the hot air duct 32 to the storage compartment 2.

Referring to fig. 2, further, a first air outlet and a second air outlet are disposed at a side portion of the thermal insulation door body 3, and the hot air duct 32 includes a first air duct 321 communicating the installation cavity 33 and the first air outlet, and a second air duct 322 communicating the installation cavity 33 and the second air outlet. That is, the installation cavity 33 is located in the middle of the hot air duct 32, so that the heat generated by the heat supplying mechanism can flow to the external environment from the first air duct 321 and the second air duct 322 in two directions, respectively, thereby improving the heat dissipation efficiency.

Specifically, in this embodiment, the first air outlet and the second air outlet are oppositely disposed on the front side plate 37 and the rear side plate 38 of the thermal insulation door 3, that is, the front end and the rear end of the hot air duct 32 respectively extend to the front side plate 37 and the rear side plate 38 of the thermal insulation door 3, the first air outlet is formed at the intersection of the first air duct 321 and the front side plate 37, and the second air outlet is formed at the intersection of the second air duct 322 and the rear side plate 38.

Referring to fig. 5, further, the lower cover plate 36 of the insulated door body 3 is provided with a first air supply outlet 341 and a second air supply outlet 342, the first air supply outlet 341 and the second air supply outlet 342 are respectively arranged at the left end and the right end of the insulated door body 3, and the cold air duct 34 includes a third air duct 343 communicating the installation cavity 33 and the first air supply outlet 341, and a fourth air duct 344 communicating the installation cavity 33 and the second air supply outlet 342. That is, the installation cavity 33 is located in the middle of the cold air duct 34, so that the cold energy generated by the cold supply mechanism can flow into the storage compartment 2 from the third air duct 343 and the fourth air duct 344 in two directions, respectively, thereby improving the refrigeration efficiency.

Referring to fig. 4 and 5, the direction of the arrow shown in the drawings is a circulation path of the cooling energy. Further, the cabinet body 1 is provided with two air supply ducts 11, the two air supply ducts 11 respectively extend up and down and are arranged in two opposite side walls of the cabinet body 1, the upper end of one of the two air supply ducts 11 is communicated with the first air supply opening 341, the upper end of the other of the two air supply ducts 11 is communicated with the second air supply opening 342, the inner wall surfaces of the two opposite side walls of the cabinet body 1 are respectively provided with a third air supply opening 111, and the third air supply opening 111 is communicated with the storage compartment 2 and the air supply ducts 11.

Specifically, in the present embodiment, the first air blowing port 341 is provided at the left end of the lower cover plate 36, the second air blowing port 342 is provided at the right end of the lower cover plate 36, the two air blowing ducts 11 are respectively provided in the left side wall 12 and the right side wall 13 of the cabinet 1, the upper end of the air blowing duct 11 in the left side wall 12 communicates with the first air blowing port 341, the upper end of the air blowing duct 11 in the right side wall 13 communicates with the second air blowing port 342, and the inner wall surfaces of the left side wall 12 and the right side wall 13 of the cabinet 1 are respectively provided with the third air blowing port 111. Thus, part of the cold energy generated by the cold end of the semiconductor refrigeration sheet 4 is sequentially conveyed into the storage compartment 2 through the third air duct 343, the first air supply outlet 341, the air supply duct 11 in the left side wall 12 and the third air supply outlet 111 in the left side wall 12, the cold energy generated by the hot end of the semiconductor refrigeration sheet 4 is transmitted to the storage compartment 2 through the fourth air duct 344, the second air supply outlet 342, the air supply duct 11 in the right side wall 13 and the third air supply outlet 111 in the right side wall 13 in sequence, cold is respectively delivered to the storage compartments 2 through the third air outlets 111 of the left side wall 12 and the right side wall 13 and flows in the storage compartments 2, and the length of the cabinet body 1 in the left-right direction is greater than that in the front-back direction, therefore, the cold energy can be uniformly distributed in the storage chamber 2, the cold energy shortage on the left side and the right side of the storage chamber 2 is avoided, and the temperature uniformity in the storage chamber 2 is improved.

With reference to fig. 4 to 5, further, a plurality of third air supply outlets 111 are arranged in parallel at intervals from top to bottom on each of the side walls, and the area of the plurality of third air supply outlets 111 is gradually increased from top to bottom, so that the temperature uniformity in the vertical direction in the storage compartment 2 can be further improved.

Specifically, in this embodiment, the inner side surfaces of the left side wall 12 and the right side wall 13 are respectively provided with a plurality of third air supply outlets 111 in parallel at intervals from top to bottom, the area of the plurality of third air supply outlets 111 on the left side wall 12 gradually increases from top to bottom, and the area of the plurality of third air supply outlets 111 on the right side wall 13 also gradually increases from top to bottom, that is, the plurality of third air supply outlets 111 are arranged in parallel at intervals from top to bottom in the extending direction of the air supply duct 11, so that the storage compartment 2 has cooling capacity supplied to all parts in the up-down direction, and the temperature uniformity in the up-down direction in the storage compartment 2 is improved; along with the extension of air supply duct 11 from top to bottom, the cold volume in air supply duct 11 constantly reduces from the upper end to the lower extreme, and through the area top-down crescent of a plurality of third supply-air outlets 111, can further reduce the upper and lower difference in temperature in storing compartment 2, improve the temperature uniformity of upper and lower direction in storing compartment 2.

Referring to fig. 4 to 5, further, the upper cover plate 35 of the heat preservation door 3 is provided with an air inlet 351, and the air inlet 351 is communicated with the external environment and an air inlet of a heat dissipation fan in the heat dissipation assembly 5, so that the heat dissipation fan can suck air from the external environment, and air circulation is formed between the hot air duct 32 and the external environment. The lower cover plate 36 of the heat preservation door body 3 is provided with an air return opening 361, the air return opening 361 is communicated with the storage chamber 2 and an air suction opening of a cold guide fan in the cold guide assembly 6, so that the cold guide fan can suck air from the storage chamber 2, and air circulation is formed among the cold air duct 34, the air supply duct 11 and the storage chamber 2. In this embodiment, the heat dissipation fan is a heat dissipation centrifugal fan 52, and the cold guiding fan is a cold guiding centrifugal fan 62; in other embodiments, the heat dissipation fan and the cool guiding fan may also adopt an axial flow fan or other fans.

Referring to fig. 4 to 6, further, in the heat dissipation assembly 5, the heat conduction base 53 is disposed at one axial end of the heat dissipation fin set 51, and a side surface of the heat conduction base 53 facing away from the heat dissipation fin set 51 is abutted against the hot end of the semiconductor chilling plate 4, so that the heat conduction base 53 conducts heat generated by the hot end of the semiconductor chilling plate 4 to the heat dissipation fin set 51.

Similarly, in the cold guiding assembly 6, the cold guiding base 63 is disposed at one axial end of the cold guiding fin set 61, and a side surface of the cold guiding base 63 away from the cold guiding fin set 61 is attached to the cold end of the semiconductor chilling plate 4, so that the cold guiding base 63 can conduct the cold generated by the cold end of the semiconductor chilling plate 4 to the cold guiding fin set 61.

Specifically, in the present embodiment, the heat conducting base 53 and the cold conducting base 63 are both in the shape of a circular truncated cone. The heat radiating fin group 51 and the semiconductor chilling plate 4 are respectively located at two axial sides of the heat conducting base 53, and on a plane perpendicular to the axial direction of the heat conducting base 53, the projection of the heat conducting base 53 completely shields the projection of the semiconductor chilling plate 4. The cold guide fin group 61 and the semiconductor chilling plates 4 are respectively positioned at two axial sides of the cold guide base 63, and the projection of the cold guide base 63 completely covers the projection of the semiconductor chilling plates 4 on a plane perpendicular to the axial direction of the cold guide base 63. In this way, the heat and cold generated by the semiconductor chilling plates 4 can be conducted and utilized to the maximum.

Furthermore, each fin extends straightly from the inner end to the outer end, so that the circulation path of heat or cold between adjacent fins is shortened, and the heat exchange efficiency is improved.

Further, each of the fins of the cooling fin group 51 extends straight along the axial direction of the cooling fin group 51, so that the centrifugal cooling fan 52 can blow the heat on the fin to the hot air duct 32, and the cooling efficiency is improved; each of the fins of the cooling guide fin group 61 extends straightly along the axial direction of the cooling guide fin group 61, so that the cooling capacity on the fins is blown to the cold air duct 34 by the cooling guide centrifugal fan 62, and the refrigeration efficiency is improved.

Furthermore, the heat dissipation fin group 51 and the heat conduction base 53 are integrally arranged, and the cold guide fin group 61 and the cold guide base 63 are also integrally arranged, so that the assembling procedures are reduced, and the connection firmness of the heat dissipation fin group 51 and the heat conduction base 53 and the connection firmness of the cold guide fin group 61 and the cold guide base 63 are improved.

Preferably, the heat conducting base 53 and the cold conducting base 63 are made of metal plates or alloy plates with good heat conducting performance, so that the conductivity and the heat exchange efficiency of heat and cold generated by the semiconductor refrigerating sheet 4 can be improved. In the present embodiment, the heat conducting base 53 and the cold conducting base 63 are both made of aluminum plates.

Further, in this example, the heat dissipating fin set 51 and the cold guiding fin set 61 are both circular, on one hand, the number of the air outlet channels is increased, 360-degree air outlet can be realized, and the heat exchange efficiency is improved, on the other hand, the heat dissipating fin set and the cold guiding fin set can be adapted to the hot air duct 32 and the cold air duct 34 in the heat preservation door body 3, so that the occupied space of the hot air duct 32 and the cold air duct 34 is reduced while the air outlet efficiency is ensured.

Referring to fig. 2 to 5, further, the horizontal refrigeration cabinet 100 includes two semiconductor refrigeration systems and two air duct systems respectively matched with the two semiconductor refrigeration systems, two hot air ducts 32 in the two air duct systems are arranged at left and right intervals, and two cold air ducts 34 in the two air duct systems are arranged at front and back intervals, so that the refrigeration efficiency of the horizontal refrigeration cabinet 100 is increased, and the distribution uniformity of the cold energy in the storage compartment 2 is improved.

Specifically, in this embodiment, two hot air ducts 32 parallel arrangement, two cold air ducts 34 are parallel arrangement also, and two hot air ducts 32 all extend around to shorten the length of hot air duct 32, accelerate the heat dissipation, two cold air ducts 34 all extend about, in order to increase the flow path of cold volume in storing room 2, make the cold volume in storing room 2 distribute evenly.

In this embodiment, two of the semiconductor refrigeration systems are configured as follows: the distance between the heat dissipation assembly 5 and the front side edge 37 of the heat preservation door body 3 is smaller than the distance between the heat dissipation assembly and the rear side edge 38 of the heat preservation door body 3, and the distance between the cold guide assembly 6 of the heat dissipation assembly and the left side edge 39 of the heat preservation door body 3 is larger than the distance between the cold guide assembly and the right side edge 30 of the heat preservation door body 3; in the two semiconductor refrigeration systems, the distance between the heat dissipation assembly 5 of the other semiconductor refrigeration system and the front side 37 of the insulated door body 3 is greater than the distance between the heat dissipation assembly and the rear side 38 of the insulated door body 3, and the distance between the cold conduction assembly 6 of the other semiconductor refrigeration system and the left side plate of the insulated door body 3 is less than the distance between the cold conduction assembly and the right side 30 of the insulated door body 3.

In other embodiments, it can also be arranged that: in the two semiconductor refrigeration systems, the distance between the heat radiation component 5 of one of the two semiconductor refrigeration systems and the front side edge 37 of the heat preservation door body 3 is greater than the distance between the heat radiation component 5 of the other semiconductor refrigeration system and the rear side edge 38 of the heat preservation door body 3, and the distance between the cold conduction component 6 of the other semiconductor refrigeration system and the left side edge 39 of the heat preservation door body 3 is greater than the distance between the cold conduction component 6 of the other semiconductor refrigeration system and the right side edge 30 of the heat preservation door body 3; in the two semiconductor refrigeration systems, the distance between the heat dissipation assembly 5 of the other semiconductor refrigeration system and the front side edge 37 of the insulated door body 3 is smaller than the distance between the heat dissipation assembly 5 of the other semiconductor refrigeration system and the rear side edge 38 of the insulated door body 3, and the distance between the cold conduction assembly 6 of the other semiconductor refrigeration system and the left side plate of the insulated door body 3 is smaller than the distance between the cold conduction assembly 6 of the other semiconductor refrigeration system and the right side edge 30 of the insulated door body 3.

Like this, two semiconductor refrigeration system all misplaces the setting in front and back direction and left and right sides, has not only rationally utilized the interior space of the heat preservation door body 3, has avoided two the heat preservation door body 3 thickness that the range upon range of setting of semiconductor refrigeration system caused increases, the local attenuation of heat preservation 31, and the heat-proof quality is poor, has reduced the cold and hot exchange between two hot-blast ducts 32 and two cold wind channels 34 moreover, has still improved cold volume supply, refrigeration efficiency and the temperature homogeneity in the storing room 2.

Further, the horizontal refrigeration cabinet 100 further comprises a controller and a sensor, the sensor is arranged on at least one of the heat preservation door body 3 and the cabinet body 1, the sensor detects position information of the heat preservation door body 3 and the cabinet body 1, and the controller is connected with the sensor and is used for controlling the semiconductor refrigeration system to be powered on and powered off according to the position information, so that the semiconductor refrigeration system provides cold energy for the storage compartment 2. Therefore, whether the heat preservation door body 3 is in an opening state or a closing state can be judged according to the position information of the heat preservation door body 3 and the cabinet body 1, and when the sensor detects that the heat preservation door body 3 is in the closing state, the controller controls the semiconductor refrigeration system to be powered on and started so as to refrigerate in the storage compartment 2; when the sensor detects that the heat preservation door body 3 is in an open state, the controller controls the semiconductor refrigeration system to power off and stop refrigeration, and the intelligent level of the horizontal refrigeration cabinet 100 is improved.

Compared with the prior art, the horizontal refrigeration cabinet 100 provided by the invention has the beneficial effects that the semiconductor refrigeration system is arranged in the heat preservation door body 3, so that the influence on the volume ratio of the storage compartment 2 caused by the fact that the refrigeration system is arranged in the cabinet body 1 can be avoided, the occupied space of the semiconductor refrigeration system is smaller, the volume and the occupied space of the horizontal refrigeration cabinet 100 are reduced on the whole, and the storage and the transportation are convenient; on the other hand, the heat preservation layer 31 of the heat preservation door body 3 can isolate the cold energy generated by the cold supply mechanism from being dissipated to the external environment of the horizontal refrigeration cabinet 100 through the heat preservation door body 3, and can avoid the heat dissipation of the heat supply mechanism to the storage chamber 2, thereby greatly improving the refrigeration efficiency.

In the description of the present invention, it is to be understood that the words "upper", "lower", "inner", "outer", "left", "right", "front", "rear", etc. indicating the orientation or positional relationship are all referred to the directions defined herein, and these words indicating the orientation or positional relationship are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.

The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.

Claims (14)

1. The utility model provides a horizontal refrigeration cabinet, is including enclosing the cabinet body of storing room and locating cabinet body top is with the switching the top open-ended heat preservation door body of storing room, a serial communication port, horizontal refrigeration cabinet still includes semiconductor refrigerating system, semiconductor refrigerating system locates in the heat preservation door body, semiconductor refrigerating system's cooling mechanism passes through the heat preservation of the heat preservation door body with the external environment adiabatic isolation of horizontal refrigeration cabinet and to the room supply cold volume between the storing room, semiconductor refrigerating system's heat supply mechanism passes through the heat preservation of the heat preservation door body with the room adiabatic isolation between the storing and to the external environment of horizontal refrigeration cabinet gives off the heat.

2. The horizontal refrigerator according to claim 1, wherein the heat-insulating door body is provided with an air duct system, the air duct system comprises a hot air duct, an installation cavity and a cold air duct which are sequentially arranged from top to bottom, the extension directions of the hot air duct and the cold air duct are crossed with each other and are not parallel to each other, the installation cavity is arranged at the crossing position of the hot air duct and the cold air duct, and the installation cavity is respectively communicated with the hot air duct and the cold air duct;

the cold supply mechanism comprises a cold end of a semiconductor refrigeration piece and a cold guide assembly, the heat supply mechanism comprises a hot end of the semiconductor refrigeration piece and a heat dissipation assembly, the semiconductor refrigeration piece is accommodated in the installation cavity, the hot air duct and the cold air duct are isolated from the installation cavity, the cold guide assembly is in heat conduction connection with the cold end and extends into the cold air duct from the cold end, and the heat dissipation assembly is in heat conduction connection with the hot end and extends into the hot air duct from the hot end.

3. The horizontal refrigeration cabinet as claimed in claim 2, wherein the hot air duct and the cold air duct extend in directions perpendicular to each other.

4. The horizontal refrigerator according to claim 2, wherein the heat insulating layer comprises heat insulating sheets formed at the intersections of the hot air ducts and the cold air ducts, the installation cavity is provided with a channel which vertically penetrates through the heat insulating sheets, the semiconductor refrigerator is horizontally arranged in the channel, and the periphery of the semiconductor refrigerator is attached to the inner wall of the installation cavity.

5. The horizontal refrigeration cabinet according to claim 2, wherein a first groove is formed in the upper surface of the heat-insulating layer, and the hot air duct is enclosed between a groove wall of the first groove and an upper cover plate of the heat-insulating door body; and a second groove is formed in the lower surface of the heat insulation layer, and the cold air duct is enclosed between the groove wall of the second groove and the lower cover plate of the heat insulation door body.

6. The horizontal refrigeration cabinet according to claim 5, wherein a first air outlet and a second air outlet are arranged at the side part of the heat preservation door body, and the hot air duct comprises a first air duct communicating the installation cavity with the first air outlet and a second air duct communicating the installation cavity with the second air outlet; the lower cover plate of the heat-insulating door body is provided with a first air supply outlet and a second air supply outlet, and the cold air duct comprises a third air duct communicated with the mounting cavity and the first air supply outlet and a fourth air duct communicated with the mounting cavity and the second air supply outlet.

7. The horizontal refrigeration cabinet according to claim 6, wherein the first air outlet and the second air outlet are oppositely arranged on the front side and the rear side of the heat-preservation door body, the first air supply outlet and the second air supply outlet are respectively arranged at the left end and the right end of the heat-preservation door body, and the length of the heat-preservation door body in the left-right direction is greater than the length of the heat-preservation door body in the front-back direction.

8. The horizontal refrigeration cabinet as claimed in claim 7, wherein the cabinet body is provided with two air supply ducts, the two air supply ducts are respectively arranged in two opposite side walls of the cabinet body in an up-and-down extending manner, the upper end of one of the two air supply ducts is communicated with the first air supply opening, the upper end of the other of the two air supply ducts is communicated with the second air supply opening, the inner wall surfaces of the two opposite side walls of the cabinet body are respectively provided with a third air supply opening, and the third air supply opening is communicated with the storage compartment and the air supply ducts.

9. The horizontal refrigeration cabinet as claimed in claim 8, wherein the third air supply outlet on each side wall is arranged in a plurality at intervals in parallel from top to bottom, and the area of the plurality of third air supply outlets is gradually increased from top to bottom.

10. The horizontal refrigeration cabinet according to claim 5, wherein the heat dissipation assembly comprises a heat dissipation fan, the upper cover plate is provided with an air inlet, and the air inlet is communicated with an air suction opening of the heat dissipation fan and the external environment of the horizontal refrigeration cabinet; the cold guide assembly comprises a cold guide fan, the lower cover plate is provided with an air return opening, and the air return opening is communicated with the storage compartment and an air suction opening of the cold guide fan.

11. The horizontal refrigerator according to claim 2, wherein the heat dissipation assembly comprises a heat dissipation fin set, a heat dissipation centrifugal fan, and a heat conduction base for heat conduction connection between the heat dissipation fin set and the hot end, the heat dissipation fin set is annular, and a heat dissipation cavity is defined by an inner annular surface of the heat dissipation fin set, the heat dissipation centrifugal fan is arranged in the heat dissipation cavity, the heat dissipation fin set comprises a plurality of heat dissipation fins, and air blown out by the heat dissipation centrifugal fan is sent to the hot air duct through a gap between adjacent heat dissipation fins;

the cold guide assembly comprises a cold guide fin group, a cold guide centrifugal fan and a cold guide base which is in heat conduction connection with the cold guide fin group and the cold guide base of the cold end, the cold guide fin group is annular, the inner ring surface of the cold guide fin group is closed to form a cold guide cavity, the cold guide centrifugal fan is arranged in the cold guide cavity, the cold guide fin group comprises a plurality of cold guide fins, and air blown out by the cold guide centrifugal fan is conveyed to the cold air duct through the adjacent gaps between the cold guide fins.

12. The horizontal refrigeration cabinet according to claim 2, comprising two semiconductor refrigeration systems and two air duct systems respectively matched with the two semiconductor refrigeration systems, wherein two hot air ducts in the two air duct systems are arranged at left and right intervals, and two cold air ducts in the two air duct systems are arranged at front and back intervals.

13. The horizontal refrigeration cabinet according to claim 12, wherein both of the hot air ducts extend back and forth, and both of the cold air ducts extend left and right; in the two semiconductor refrigeration systems, the distance between the heat radiation component of one of the two semiconductor refrigeration systems and the front side edge of the heat preservation door body is smaller than the distance between the heat radiation component of the other semiconductor refrigeration system and the rear side edge of the heat preservation door body, and the distance between the cold conduction component of the other semiconductor refrigeration system and the left side edge of the heat preservation door body is larger than the distance between the cold conduction component of the other semiconductor refrigeration system and the right side edge of the heat preservation door body; in the two semiconductor refrigeration systems, the distance between the heat dissipation assembly of the other semiconductor refrigeration system and the front side edge of the heat preservation door body is greater than the distance between the heat dissipation assembly of the other semiconductor refrigeration system and the rear side edge of the heat preservation door body, and the distance between the cold conduction assembly of the other semiconductor refrigeration system and the left side plate of the heat preservation door body is less than the distance between the cold conduction assembly of the other semiconductor refrigeration system and the right side edge of the heat preservation door body;

or, in the two semiconductor refrigeration systems, the distance between the heat dissipation assembly of one of the two semiconductor refrigeration systems and the front side edge of the heat preservation door body is greater than the distance between the heat dissipation assembly of the other semiconductor refrigeration system and the rear side edge of the heat preservation door body, and the distance between the cold conduction assembly of the other semiconductor refrigeration system and the left side edge of the heat preservation door body is greater than the distance between the cold conduction assembly of the other semiconductor refrigeration system and the right side edge of the heat preservation door body; in the two semiconductor refrigeration systems, the distance between the heat radiation component of the other semiconductor refrigeration system and the front side edge of the heat preservation door body is smaller than the distance between the heat radiation component of the other semiconductor refrigeration system and the rear side edge of the heat preservation door body, and the distance between the cold guide component of the other semiconductor refrigeration system and the left side plate of the heat preservation door body is smaller than the distance between the cold guide component of the other semiconductor refrigeration system and the right side edge of the heat preservation door body.

14. The horizontal refrigeration cabinet according to claim 2, further comprising a controller and a sensor, wherein the sensor is arranged on at least one of the heat preservation door body and the cabinet body, the sensor detects position information of the heat preservation door body and the cabinet body, and the controller is connected with the sensor and is used for controlling the semiconductor refrigeration system to be powered on and powered off according to the position information, so that the semiconductor refrigeration system provides cold energy to the storage compartment.

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